CN103533780A - Rigid-flex composite board manufacturing method - Google Patents

Abstract

The invention discloses a method for manufacturing a soft and hard composite board. A hard insulating layer is provided, the hard insulating layer having an opening. And attaching a supporting layer to one side of the hard insulating layer and closing one end of the opening. And filling the liquid material into the opening from the other side of the hard insulating layer. The liquid material in the opening is heated to form a soft insulating layer in the opening. The supporting layer is removed from the hard insulating layer and the soft insulating layer.

Description

Rigid-flex composite board manufacturing method

technical field

The invention relates to a circuit board, and in particular to a method for manufacturing a rigid-flex composite board.

Background technique

According to the flexibility of the insulating layer, circuit boards can be divided into rigid circuit boards and flexible circuit boards. However, when the electronic components are to be soldered to the flexible circuit board, the flexible circuit board cannot provide sufficient structural strength. In the same situation where electronic parts need to be soldered, although the rigid circuit board provides structural strength, the flexibility of the rigid circuit board is not good, thus limiting the application of the rigid circuit board.

Contents of the invention

The purpose of the present invention is to provide a method for manufacturing a rigid-flex composite board, which is used to manufacture a circuit board with a rigid region and a flexible region.

To achieve the above purpose, the present invention proposes a method for manufacturing a rigid-flex composite board. A rigid insulating layer is provided, and the rigid insulating layer has an opening. A support layer is attached to one side of the rigid insulating layer and closes one end of the opening. The liquid material is filled into the opening from the other side of the rigid insulating layer. The liquid material in the opening is heated to form a soft insulating layer in the opening. The support layer is removed from the hard insulating layer and the soft insulating layer.

Based on the above, the present invention forms a flexible insulating layer in the opening of the rigid insulating layer by means of liquid material filling and heating, so that the formed soft-rigid composite board has both structural strength and flexibility.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

FIG. 1A to FIG. 1F are a manufacturing method of a rigid-flex composite board according to an embodiment of the present invention.

Description of main component symbols

102: Hard insulating layer

102a: opening

104: support layer

106: Liquid material

108: Soft insulating layer

110: soft and hard composite board

110a: soft and hard composite board

112: conductive layer

Detailed ways

1A to 1F illustrate a method for manufacturing a rigid-flex composite board according to an embodiment of the present invention. Referring to FIG. 1A , a rigid insulating layer 102 is provided, wherein FIG. 1A shows a top view side of the rigid insulating layer. The rigid insulating layer 102 has one or more openings 102a according to the number and positions of the required soft regions. In this embodiment, the rigid insulating layer 102 is a prepreg. The step of providing the hard insulating layer 102 may include removing a part of the hard insulating layer 102 by punching, scooping or laser cutting to form the openings 102a.

Please refer to FIG. 1B . FIG. 1B is a cross-section along line I-I in FIG. 1A , where the support layer 104 is attached to one side of the rigid insulating layer 102 and closes one end of each opening 102a. In this embodiment, the supporting layer 104 is polyester film (PET film), aluminum sheet or Teflon sheet.

Referring to FIG. 1C , the liquid material 106 is filled into the openings 102 a from the other side of the rigid insulating layer 102 . In this embodiment, the step of filling the liquid material 106 may include filling the liquid material 106 in the openings 102a by printing. In addition, the liquid material 106 may include polyimide (Polyimide, PI) or polyester (Polyester, PET), but the present invention is not limited thereto, and other polymer materials may also be used as the liquid material 106 .

Referring to FIG. 1D , the liquid material 106 in the openings 102 a is heated to form a plurality of flexible insulating layers 108 in each opening 102 a. The flexible insulating layer 108 is in a semi-cured state after being formed, which is the so-called B-stage state. In this embodiment, the step of heating the liquid material may include heating the liquid material 106 in a baking manner.

Referring to FIG. 1E , the support layer 104 is removed from the hard insulating layer 102 and the soft insulating layers 108 . So far, the rigid insulating layer 102 and these flexible insulating layers 108 can constitute a rigid-flex composite board 110, wherein a rigid region of the rigid-flex composite board 110 is formed by the rigid insulating layer 102, and a plurality of flexible and rigid composite boards 110 The active area is formed by the soft insulating layer 108.

Please refer to FIG. 1F , in this embodiment, a conductive layer 112 is pasted on both sides of the rigid insulating layer 102 and the soft insulating layer 108 . In this embodiment, the conductive layer 112 can be copper foil. So far, the rigid insulating layer 102 , the flexible insulating layers 108 and the conductive layers 112 can constitute a rigid-flex composite board 110 a , wherein the conductive layers 112 of the rigid-flex composite board 110 a can be used to make planar circuits.

To sum up, the present invention forms a soft insulating layer in the opening of the hard insulating layer by filling and heating liquid materials, so that the formed soft-hard composite board has both structural strength and flexibility.

Although the present invention has been disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the appended claims.

Claims (10)

1. a soft-hard composite board manufacture method, comprising:

One rigid insulation layer is provided, and this rigid insulation layer has an opening;

One supporting layer is conformed to a side of this rigid insulation layer and seal one end of this opening;

From the opposite side of this rigid insulation layer, liquid material is filled in this opening;

Add thermal potential this liquid material in this opening to form a flexible insulating layer in this opening; And

From this rigid insulation layer and this flexible insulating layer, remove this supporting layer.

2. soft-hard composite board manufacture method as claimed in claim 1, wherein this rigid insulation layer is a prepreg.

3. soft-hard composite board manufacture method as claimed in claim 1, wherein comprises by punch die in the step that this rigid insulation layer is provided, drags for part that type or laser cutting remove this rigid insulation layer to form this opening.

4. soft-hard composite board manufacture method as claimed in claim 1, wherein this supporting layer is polyester film, aluminium flake or ferric piece.

5. soft-hard composite board manufacture method as claimed in claim 1, the step of wherein filling this liquid material comprises with mode of printing fills this liquid material in this opening.

6. soft-hard composite board manufacture method as claimed in claim 1, wherein this liquid material comprises polyimides or polyester.

7. soft-hard composite board manufacture method as claimed in claim 1, wherein this flexible insulating layer presents semi-cured state after forming.

8. soft-hard composite board manufacture method as claimed in claim 1, the step that wherein heats this liquid material comprises with roasting mode and heats this liquid material.

9. soft-hard composite board manufacture method as claimed in claim 1, also comprises:

The conductive layer of fitting respectively in the both sides of this rigid insulation layer and this flexible insulating layer.

10. soft-hard composite board manufacture method as claimed in claim 1, wherein this conductive layer is Copper Foil.

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