CN103489818B - A kind of silicon wafer pre-alignment device - Google Patents
A kind of silicon wafer pre-alignment device Download PDFInfo
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- CN103489818B CN103489818B CN201310479044.2A CN201310479044A CN103489818B CN 103489818 B CN103489818 B CN 103489818B CN 201310479044 A CN201310479044 A CN 201310479044A CN 103489818 B CN103489818 B CN 103489818B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 49
- 239000010703 silicon Substances 0.000 title claims abstract description 49
- 210000000078 claw Anatomy 0.000 claims abstract description 23
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
本发明涉及一种硅片预对准装置，它包括水平顶板，垂直设置在水平顶板一端的转轴，卡装在转轴顶端的吸盘，转动连接于转轴另一端的转轴电机，卡装在转轴上且位于吸盘下方的下托架，设置在下托架边缘的伸出爪，转动连接在伸出爪末端的定位轮以及通过连接件固定在水平顶板一端的一对射式传感器。转轴电机转动连接转轴，定位轮是由位于定位轮顶部的圆锥体、位于圆锥体下表面的倒圆锥体、位于倒圆锥体下表面的圆柱体以及位于圆柱体下表面的凸台组成，倒圆锥体、圆柱体和凸台形成一环形凹槽，圆锥体下表面与倒圆锥体上表面的直径相等，倒圆锥体下表面直径等于圆柱体的直径，凸台直径大于圆柱体直径。本发明具有对硅片损害、污染小，预对准精度高等优点。
The invention relates to a silicon chip pre-alignment device, which comprises a horizontal top plate, a rotating shaft vertically arranged at one end of the horizontal top plate, a suction cup clamped on the top of the rotating shaft, a rotating shaft motor connected to the other end of the rotating shaft in rotation, clamped on the rotating shaft and The lower bracket located under the suction cup, the protruding claws arranged on the edge of the lower bracket, the positioning wheel connected to the end of the protruding claws and a pair of shooting sensors fixed at one end of the horizontal top plate through connecting pieces. The rotating shaft motor rotates and connects the rotating shaft. The positioning wheel is composed of a cone on the top of the positioning wheel, an inverted cone on the lower surface of the cone, a cylinder on the lower surface of the inverted cone, and a boss on the lower surface of the cylinder. The inverted cone The body, the cylinder and the boss form an annular groove, the diameter of the lower surface of the cone is equal to the upper surface of the inverted cone, the diameter of the lower surface of the inverted cone is equal to the diameter of the cylinder, and the diameter of the boss is larger than the diameter of the cylinder. The invention has the advantages of less damage and pollution to the silicon chip, high pre-alignment precision and the like.
Description
技术领域technical field
本发明涉及一种预对准装置，特别是关于一种硅片预对准装置。The invention relates to a pre-alignment device, in particular to a silicon wafer pre-alignment device.
背景技术Background technique
目前在半导体硅片制造行业中，通常在圆形硅片的边缘设置一用以标明硅片方向的定位槽，以方便在硅片上集成所需信息，同时，为了方便硅片上的集成电路在多次加工过程中的重复定位和信息读取，相对于定位槽的固定位置还刻有硅片的相应信息，信息可以是数字符号、一维条码或者是二维码中的其中一种。硅片预对准装置是根据硅片的定位槽对其进行定位，硅片预对准装置的定位精度直接影响硅片上相应信息的读取及后续的加工精度。At present, in the semiconductor silicon wafer manufacturing industry, a positioning groove for marking the direction of the silicon wafer is usually provided on the edge of the circular silicon wafer to facilitate the integration of required information on the silicon wafer. For repeated positioning and information reading in multiple processing processes, the corresponding information of the silicon wafer is also engraved relative to the fixed position of the positioning groove. The information can be one of digital symbols, one-dimensional barcodes or two-dimensional codes. The silicon wafer pre-alignment device positions it according to the positioning groove of the silicon wafer, and the positioning accuracy of the silicon wafer pre-alignment device directly affects the reading of corresponding information on the silicon wafer and subsequent processing accuracy.
专利名为“一种硅片传送装置”公开了这样一种硅片预对准装置，如图1～4所示，它包括一顶板53，顶板53的前部通过轴承连接垂直于顶板53的一中空的转轴54；顶板53上方的转轴54上端密封连接有一吸盘55，吸盘55上的气吸孔和转轴54内部连通，顶板53上方的转轴54下部连接一带轮56。顶板53底面固定设置有一气槽57，转轴54的下端穿出带轮56与气槽57连通，且其连接处通过O型密封圈密封，气槽57的另一端通过气管和真空电磁阀与一真空泵连通。气槽57后端的顶板53底面固定连接有一转轴电机58，转轴电机58的输出端通过带传动机构连接转轴54下部的带轮56。顶板53顶面固定连接套设在转轴54外的一下托架59，下托架59边缘间隔设置有四个向外的伸出爪60，每一伸出爪60的末端均高于下托架59顶面，且每一伸出爪60末端的顶面转动连接一定位轮61，四个定位轮61的中心共同位于吸盘55的一同心圆的圆周上。每一定位轮61的上部呈圆锥形61-0，中部呈圆柱形61-1，且圆柱形61-1的顶端略高于吸盘55的顶面。顶板53前端设置有电连接控制系统的一对竖直光电传感器63。两竖直光电传感器63通过设置在顶板53底面的一连接件64固定连接在顶板53前方。The patent titled "A Silicon Wafer Transfer Device" discloses such a silicon wafer pre-alignment device. As shown in FIGS. A hollow rotating shaft 54; the upper end of the rotating shaft 54 above the top plate 53 is sealed with a sucker 55, the air suction hole on the sucker 55 communicates with the rotating shaft 54 inside, and the rotating shaft 54 bottom above the top plate 53 is connected with a pulley 56. An air groove 57 is fixedly arranged on the bottom surface of the top plate 53, and the lower end of the rotating shaft 54 passes through the pulley 56 to communicate with the air groove 57, and its connection is sealed by an O-ring, and the other end of the air groove 57 is connected to a gas pipe and a vacuum solenoid valve. The vacuum pump is connected. The bottom surface of the top plate 53 at the rear end of the air tank 57 is fixedly connected with a rotating shaft motor 58, and the output end of the rotating shaft motor 58 is connected to the belt pulley 56 at the bottom of the rotating shaft 54 through a belt transmission mechanism. The top surface of the top plate 53 is fixedly connected to the lower bracket 59 sleeved outside the rotating shaft 54, and the edge of the lower bracket 59 is provided with four outward protruding claws 60 at intervals, and the end of each protruding claw 60 is higher than the lower bracket 59. top surface, and the top surface of each protruding claw 60 end is rotatably connected with a positioning wheel 61, and the centers of the four positioning wheels 61 are jointly located on the circumference of a concentric circle of the suction cup 55. The upper part of each positioning wheel 61 is conical 61 - 0 , the middle part is cylindrical 61 - 1 , and the top of the cylindrical 61 - 1 is slightly higher than the top surface of the suction cup 55 . The front end of the top plate 53 is provided with a pair of vertical photoelectric sensors 63 electrically connected to the control system. The two vertical photoelectric sensors 63 are fixedly connected in front of the top board 53 through a connecting piece 64 arranged on the bottom surface of the top board 53 .
上述硅片预对准装置中，定位轮61存在在取硅片时，容易损伤硅片而造成对硅片的污染。此外，转轴电机58的输出端带轮56带动硅片旋转，由于带传动误差较大，造成光电传感器63获得的硅片的位置信息精度低，即硅片的预对准精度低。In the above-mentioned silicon wafer pre-alignment device, the presence of the positioning wheel 61 is easy to damage the silicon wafer and cause contamination to the silicon wafer when the silicon wafer is taken. In addition, the pulley 56 at the output end of the rotating shaft motor 58 drives the silicon wafer to rotate. Due to the large transmission error of the belt, the accuracy of the position information of the silicon wafer obtained by the photoelectric sensor 63 is low, that is, the pre-alignment accuracy of the silicon wafer is low.
综上所述，现有的硅片预对准装置不仅会对硅片产生损害及污染，而且硅片的预对准精度低。To sum up, the existing silicon wafer pre-alignment devices not only cause damage and pollution to the silicon wafer, but also have low pre-alignment precision of the silicon wafer.
发明内容Contents of the invention
针对上述问题，本发明的目的是提供一种对硅片污染、损害低且对准精度高的硅片预对准装置。In view of the above problems, the object of the present invention is to provide a silicon wafer pre-alignment device with low pollution and damage to the silicon wafer and high alignment accuracy.
为实现上述目的，本发明采取以下技术方案：一种硅片预对准装置，它包括一水平顶板，一垂直设置在所述水平顶板一端的转轴，一卡装在所述转轴顶端的吸盘，一转动连接于所述转轴另一端的转轴电机，一卡装在所述转轴上且位于所述吸盘下方的下托架，若干设置在所述下托架边缘的伸出爪，若干转动连接在所述伸出爪末端的定位轮，以及一通过一连接件固定在所述水平顶板一端的一对射式传感器；其特征在于，所述转轴电机的输出轴转动连接所述转轴；每一所述定位轮均是由一位于所述定位轮顶部的圆锥体、一位于所述圆锥体下表面的倒圆锥体、一位于所述倒圆锥体下表面的圆柱体以及一位于所述圆柱体下表面的凸台组合而成，所述倒圆锥体、圆柱体和凸台形成一环形凹槽；所述圆锥体下表面的直径等于所述倒圆锥体上表面的直径，所述倒圆锥体下表面直径等于所述圆柱体的直径，所述凸台直径大于所述圆柱体直径；所述倒圆锥体的下表面高出所述吸盘的上表面1～3mm，所述凸台的上表面低于所述吸盘的上表面1～3mm。In order to achieve the above object, the present invention adopts the following technical solutions: a silicon chip pre-alignment device, which includes a horizontal top plate, a rotating shaft vertically arranged at one end of the horizontal top plate, a suction cup mounted on the top of the rotating shaft, A rotating shaft motor that is rotatably connected to the other end of the rotating shaft, a lower bracket that is clamped on the rotating shaft and located below the suction cup, several protruding claws arranged on the edge of the lower bracket, and several rotatably connected The positioning wheel at the end of the protruding claw, and a pair of radio sensors fixed at one end of the horizontal top plate through a connecting piece; it is characterized in that the output shaft of the rotating shaft motor is connected to the rotating shaft in rotation; each of the The positioning wheels are all composed of a cone positioned at the top of the positioning wheel, an inverted cone positioned at the lower surface of the cone, a cylinder positioned at the lower surface of the inverted cone, and a cylinder positioned under the cylinder. The boss on the surface is combined, and the inverted cone, cylinder and boss form an annular groove; the diameter of the lower surface of the cone is equal to the diameter of the upper surface of the inverted cone, and the lower surface of the inverted cone The surface diameter is equal to the diameter of the cylinder, and the diameter of the boss is greater than the diameter of the cylinder; the lower surface of the inverted cone is 1-3mm higher than the upper surface of the suction cup, and the upper surface of the boss is lower 1-3mm on the upper surface of the suction cup.
所述水平顶板一端上表面的中心线处开设一通孔，所述转轴穿设在通孔内并通过轴承固定在所述水平顶板的上表面，所述转轴的上端面沿中心轴线开设一盲孔，所述转轴靠近上端面处还设置一凸缘，所述吸盘密封卡设在所述转轴凸缘的上表面，所述吸盘中心轴线开设一用于吸气的通孔，所述通孔连通所述转轴的盲孔的顶端，所述转轴的下端通过一联轴器连接转轴电机的输出轴。A through hole is opened on the center line of the upper surface of one end of the horizontal top plate, the rotating shaft is passed through the through hole and fixed on the upper surface of the horizontal top plate through bearings, and a blind hole is opened on the upper surface of the rotating shaft along the central axis , the rotating shaft is also provided with a flange near the upper end surface, the suction cup is sealed and clamped on the upper surface of the rotating shaft flange, and the central axis of the suction cup is provided with a through hole for suction, and the through hole communicates with The top end of the blind hole of the rotating shaft, the lower end of the rotating shaft is connected to the output shaft of the rotating shaft motor through a coupling.
所述水平顶板的底部设置一通气槽，所述通气槽的一端连通所述盲孔的底端，且通过一O型密封圈密封，所述通气槽的另一端通过一气管和真空电磁阀与一真空泵连通。The bottom of the horizontal top plate is provided with a ventilation groove, one end of the ventilation groove communicates with the bottom end of the blind hole, and is sealed by an O-ring, and the other end of the ventilation groove is connected with a gas pipe and a vacuum solenoid valve. A vacuum pump is connected.
所述下托架卡设在所述转轴的凸缘下表面，所述下托架的边缘间隔设置四个伸出爪，每一所述伸出爪末端的上表面均转动连接所述定位轮，四个所述定位轮的中心位于一与所述吸盘同心的圆周上。The lower bracket is clamped on the lower surface of the flange of the rotating shaft, and the edge of the lower bracket is provided with four protruding claws at intervals, and the upper surface of each protruding claw end is rotatably connected to the positioning wheel , the centers of the four positioning wheels are located on a circle concentric with the suction cup.
所述连接件包括一水平杆和一U型杆，所述水平杆的一端紧固在所述水平顶板一端下表面的中心线处，另一端紧固连接所述U型杆，所述一对射式传感器设置在所述U型杆敞口端。The connector includes a horizontal bar and a U-shaped bar, one end of the horizontal bar is fastened to the center line of the lower surface of one end of the horizontal top plate, and the other end is fastened to the U-shaped bar. A radiation sensor is arranged at the open end of the U-shaped bar.
所述定位轮底部的中心轴线处开设一阶梯盲孔，每一所述伸出爪的末端均安装一垂直轴承，每一所述定位轮通过所述阶梯盲孔与伸出爪上的垂直轴承相连接。A stepped blind hole is provided at the central axis of the bottom of the positioning wheel, and a vertical bearing is installed at the end of each of the extending claws, and each of the positioning wheels passes through the stepped blind hole and the vertical bearing on the extending claw. connected.
本发明由于采取以上技术方案，其具有以下优点：1、本发明的定位轮由圆锥体、倒圆锥体、圆柱体以及凸台组成，圆锥体保证在放置硅片时硅片与吸盘同心，倒圆锥体保证在取走硅片时硅片不被卡住，倒圆锥体、圆柱体和凸台形成的环形凹槽保证硅片旋转过程中不与定位轮发生摩擦，因此，在提高硅片转动过程中稳定性的同时，还能够降低预对准操作对硅片的损害及污染。2、由于本发明采用转轴电机的输出端直接连接转轴，从而避免了中间传动机构的传动误差，因此能够提高硅片转动过程的稳定性和预对准精度。The present invention has the following advantages due to the adoption of the above technical scheme: 1. The positioning wheel of the present invention is composed of a cone, an inverted cone, a cylinder and a boss, and the cone ensures that the silicon wafer is concentric with the sucker when the silicon wafer is placed, and the inverted The cone ensures that the silicon wafer will not be stuck when the silicon wafer is removed, and the annular groove formed by the inverted cone, cylinder and boss ensures that the silicon wafer does not rub against the positioning wheel during the rotation process. While improving the stability in the process, it can also reduce the damage and pollution of the silicon wafer caused by the pre-alignment operation. 2. Since the output end of the rotating shaft motor is directly connected to the rotating shaft in the present invention, the transmission error of the intermediate transmission mechanism is avoided, so the stability and pre-alignment accuracy of the silicon wafer rotation process can be improved.
附图说明Description of drawings
图1是现有硅片预对准装置的上部结构示意图Figure 1 is a schematic diagram of the upper structure of the existing silicon wafer pre-alignment device
图2是现有硅片预对准装置的下部结构示意图Figure 2 is a schematic diagram of the lower structure of the existing silicon wafer pre-alignment device
图3是现有硅片预对准装置中定位轮的结构示意图Fig. 3 is a structural schematic diagram of the positioning wheel in the existing silicon wafer pre-alignment device
图4是图3的主视示意图Figure 4 is a schematic front view of Figure 3
图5是本发明的结构示意图Fig. 5 is a structural representation of the present invention
图6是图5的纵向剖视示意图Fig. 6 is a longitudinal sectional schematic diagram of Fig. 5
图7是本发明中定位轮的结构示意图Fig. 7 is the structural representation of positioning wheel in the present invention
图8是图7的主视示意图Figure 8 is a schematic front view of Figure 7
具体实施方式detailed description
下面结合附图和实施例对本发明的进行详细的描述。The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
如图5、图6所示，本发明包括一水平顶板201、一转轴202、一吸盘203、一转轴电机204、一通气槽205、一下托架206、四个伸出爪207、四个定位轮208、一连接件209以及一对射式传感器210。其中，水平顶板201一端上表面的中心线处开设一通孔(图中未示出)，转轴202插设在通孔内并通过轴承设置在水平顶板201的上表面，转轴202的上端面沿中心轴线开设一盲孔202-1，转轴202靠近上端面处还设置一凸缘202-2，吸盘203密封卡设在转轴202的凸缘202-2的上表面，吸盘203中心轴线开设一用于吸气的通孔203-1，通孔203-1连通转轴202的盲孔202-1的顶端，转轴202的下端通过一联轴器连接转轴电机204的输出轴。通气槽205设置在水平顶板201的底部，通气槽205的一端连通盲孔202-1的底端，且通过一O型密封圈(图中未示出)密封，通气槽205的另一端通过一气管（图中未示出）和真空电磁阀（图中未示出）与一真空泵连通（图中未示出）。下托架206卡设在转轴202的凸缘202-2下表面，下托架206的边缘间隔设置四个伸出爪207，每一伸出爪207的末端均高于下托架206顶面，每一伸出爪207末端的上表面均转动连接定位轮208，所有定位轮208的中心位于与一吸盘203同心的圆周上。连接件209包括一水平杆209-1和一U型杆209-2，水平杆209-1的一端紧固在水平顶板201一端下表面的中心线处，另一端紧固连接U型杆209-2，一对射式传感器210对称设置在U型杆209-2的敞口端。As shown in Fig. 5 and Fig. 6, the present invention includes a horizontal top plate 201, a rotating shaft 202, a sucker 203, a rotating shaft motor 204, an air slot 205, a lower bracket 206, four protruding claws 207, four positioning Wheel 208 , a connecting piece 209 and a beam sensor 210 . Wherein, a through hole (not shown) is opened at the center line of the upper surface of one end of the horizontal top plate 201, and the rotating shaft 202 is inserted in the through hole and arranged on the upper surface of the horizontal top plate 201 through a bearing. A blind hole 202-1 is opened on the axis, and a flange 202-2 is also provided near the upper end surface of the rotating shaft 202. The suction cup 203 is sealed and clamped on the upper surface of the flange 202-2 of the rotating shaft 202. Inhalation through hole 203-1, the through hole 203-1 communicates with the top of the blind hole 202-1 of the rotating shaft 202, and the lower end of the rotating shaft 202 is connected to the output shaft of the rotating shaft motor 204 through a coupling. The vent groove 205 is arranged on the bottom of the horizontal top plate 201, and one end of the vent groove 205 communicates with the bottom end of the blind hole 202-1, and is sealed by an O-ring (not shown in the figure), and the other end of the vent groove 205 passes through a The gas pipe (not shown in the figure) and the vacuum solenoid valve (not shown in the figure) communicate with a vacuum pump (not shown in the figure). The lower bracket 206 is clamped on the lower surface of the flange 202-2 of the rotating shaft 202. Four protruding claws 207 are arranged at intervals on the edge of the lower bracket 206. The end of each protruding claw 207 is higher than the top surface of the lower bracket 206. The upper surface of each protruding claw 207 end is rotatably connected with positioning wheels 208 , and the centers of all positioning wheels 208 are located on a circumference concentric with a suction cup 203 . The connector 209 includes a horizontal bar 209-1 and a U-shaped bar 209-2. One end of the horizontal bar 209-1 is fastened to the center line of the lower surface of one end of the horizontal top plate 201, and the other end is fastened to the U-shaped bar 209- 2. The one-shot sensor 210 is symmetrically arranged on the open end of the U-shaped bar 209-2.
如图7、图8所示，本发明的定位轮208可视为由一圆锥体208-1、一倒圆锥体208-2、一圆柱体208-3以及一凸台208-4组成，其中圆锥体208-1位于定位轮208的顶部，用于保证在放置硅片时，硅片与吸盘203同心。圆锥体208-1的下表面为与之一体的倒圆锥体208-2，且倒圆锥体208-2的上表面与圆锥体208-1的下表面直径相当，用于保证在取出硅片时，硅片不被卡住。倒圆锥体208-2的下表面为与之一体的圆柱体208-3，圆柱体208-3的下表面为与之一体的凸台208-4，且圆柱体208-3的直径与倒圆锥体208-2的下表面直径相当，而凸台208-4的直径则略大于倒圆锥体208-2的上表面直径，这样在倒圆锥体208-2、圆柱体208-3和凸台208-4形成一环形凹槽，该环形凹槽用于保证在硅片旋转时，硅片不与定位轮208发生摩擦。As shown in Fig. 7 and Fig. 8, the positioning wheel 208 of the present invention can be regarded as consisting of a cone 208-1, an inverted cone 208-2, a cylinder 208-3 and a boss 208-4, wherein The cone 208-1 is located on the top of the positioning wheel 208, and is used to ensure that the silicon wafer is concentric with the suction cup 203 when the silicon wafer is placed. The lower surface of the cone 208-1 is an integrated inverted cone 208-2, and the diameter of the upper surface of the inverted cone 208-2 is equivalent to the diameter of the lower surface of the cone 208-1, which is used to ensure that when the silicon wafer is taken out , the wafer is not stuck. The lower surface of the inverted cone 208-2 is an integral cylinder 208-3, and the lower surface of the cylinder 208-3 is an integrated boss 208-4, and the diameter of the cylindrical body 208-3 is the same as that of the inverted cone. The diameter of the lower surface of the body 208-2 is equivalent, and the diameter of the boss 208-4 is slightly larger than the diameter of the upper surface of the inverted cone 208-2. -4 forms an annular groove, which is used to ensure that the silicon wafer does not rub against the positioning wheel 208 when the silicon wafer is rotating.
如图5、图6所示，倒圆锥体208-2的下表面高出吸盘203的上表面1～3mm。凸台208-4的上表面低于吸盘203的上表面1～3mm。As shown in FIG. 5 and FIG. 6 , the lower surface of the inverted cone 208 - 2 is higher than the upper surface of the suction cup 203 by 1-3 mm. The upper surface of the boss 208 - 4 is lower than the upper surface of the suction cup 203 by 1-3 mm.
在一个优选的实施例中，定位轮208底部的中心轴线处开设一阶梯盲孔208-5，每一伸出爪207的末端均安装一垂直轴承（图中未示出），定位轮208通过阶梯盲孔208-5与伸出爪207上的垂直轴承相连接。In a preferred embodiment, a stepped blind hole 208-5 is provided at the central axis of the bottom of the positioning wheel 208, and a vertical bearing (not shown) is installed at the end of each protruding claw 207, and the positioning wheel 208 passes through the step The blind hole 208-5 is connected with the vertical bearing on the protruding claw 207.
上述各实施例仅用于说明本发明，其中各部件的结构、连接方式和制作工艺等都是可以有所变化的，凡是在本发明技术方案的基础上进行的等同变换和改进，均不应排除在本发明的保护范围之外。The above-mentioned embodiments are only used to illustrate the present invention, wherein the structure, connection mode and manufacturing process of each component can be changed to some extent, and any equivalent transformation and improvement carried out on the basis of the technical solution of the present invention should not excluded from the protection scope of the present invention.
Claims (6)
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| CN106814550B (en) * | 2015-11-30 | 2018-08-24 | 上海微电子装备（集团）股份有限公司 | Work stage substrate delivery/reception device and pre-alignment method |
| CN106449500A (en) * | 2016-09-27 | 2017-02-22 | 天津华海清科机电科技有限公司 | Positioning assembly |
| CN110943021B (en) * | 2018-09-21 | 2022-05-31 | 上海微电子装备（集团）股份有限公司 | Pre-alignment device and method |
| CN115831846B (en) * | 2023-02-15 | 2023-06-27 | 河北博特半导体设备科技有限公司 | Wafer pre-alignment device |
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| CN203644747U (en) * | 2013-10-14 | 2014-06-11 | 北京自动化技术研究院 | Silicon wafer pre-alignment device |
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