CN103474440A - Image module and manufacturing method thereof - Google Patents

Abstract

The invention discloses an image module and a manufacturing method thereof. The circuit board has a first board surface and a second board surface. The image sensing element is arranged on the second board surface, and the lens component is arranged on the first board surface. The anisotropic conductive adhesive is arranged between the second plate surface of the circuit board and the image sensing element, so that the image sensing element is electrically connected with the circuit board. The method for manufacturing the image module comprises the steps of coating anisotropic conductive adhesive on the second plate surface, carrying out hot pressing treatment on the image sensing element and the anisotropic conductive adhesive so as to fixedly connect the image sensing element and the second plate surface, installing a lens component on the first plate surface and packaging the image sensing element.

Description

Image module and manufacturing method thereof

technical field

The invention relates to a module and its manufacturing method, in particular to an image module and its manufacturing method.

Background technique

The development of modern electronic products is becoming more and more thin and miniaturized. At present, most of the image-related products are still produced in the traditional SMT (Surface-mount Technology) method, but the SMT process is limited by the sensing element ( Sensor Die) needs to be packaged with COB (Chip on Board) first before SMT can be carried out, so that the total height and cost of the image module cannot be reduced, which is not conducive to the demand for thinning, while the higher-level COB/FLIP CHIP process can be Reduce the height of the image module, but its construction and maintenance costs are too high, if it does not reach a certain scale of production, there will be no economic benefits.

For this reason, please refer to FIG. 5 , an image device 1 (its application number is No. 099200919) has been developed by a person in the industry, and the image sensor 20 "is installed in the opening of the circuit board 30 ", and the wiring 50 " The purpose of realizing the electrical connection between the circuit board 30 ″ and the image sensor 20 is to reduce the height and facilitate the miniaturization of electronic products. However, there are still defects: the image sensor 20 "and the lens module 10" are arranged on the same board surface, resulting in a high stacking height. Die Bond and Wire bond will produce a height of 50" for wiring and 60" for sealing.

Therefore, the inventor felt that the above-mentioned defects could be improved, so Naite devoted himself to research and combined with the application of theories, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects.

Contents of the invention

The main purpose of the present invention is to provide an image module and its manufacturing method, which can effectively reduce the total height of the image module and reduce the bad loss caused by the extra packaging process. In order to achieve the above object, the present invention discloses an image module, the image module includes: a lens assembly; an image sensing element; a circuit board, the circuit board has an opening, a first board surface, and a second On the board surface, the image sensing element is arranged on the second board surface and corresponds to the opening, the lens assembly is installed on the first board surface and corresponds to the opening; and an anisotropic conductive adhesive is arranged on the second board surface Between the two boards and the image sensing element, the image sensing element is electrically connected to the circuit board.

In order to achieve the above object, the present invention discloses a method for manufacturing an image module, which includes the following steps: providing a circuit board, the circuit board has an opening, a first board surface, and a second board surface; coating an anisotropic conductive adhesive on the second board; align an image sensing element and the circuit board, and attach the image sensing element to the second board, and make the image sensing element correspond to the the opening; thermocompression bonding the image sensing element and the anisotropic conductive adhesive, so that the image sensing element is fixed on the second board; installing a lens assembly on the first board, and making the a lens assembly corresponding to the opening; and packaging the image sensing element.

Compared with the existing technology, anisotropic conductive adhesive is used to press the image sensing element and the circuit board to make the metal pads conduct with each other, and achieve a module height comparable to or lower than that of the COB/FLIP CHIP process. And the image sensing element is fixed on the second board surface of the circuit board, and the lens assembly is installed on the first board surface of the circuit board, instead of the traditional image module technology, the image sensing element and the lens assembly are arranged on the The same deck, resulting in stack heights. Therefore, the present invention can effectively reduce the total height of the module to meet the requirement of thinning, and directly press-bond the image sensing element as a raw material on the circuit board, and then package it after the test is completed, reducing the defects caused by the additional packaging process wear and tear.

Description of drawings

Fig. 1 is a perspective view of the present invention.

FIG. 2A is an exploded perspective view of the present invention.

FIG. 2B is another perspective exploded view of the present invention.

Fig. 3A is a cross-sectional view of the present invention.

FIG. 3B is a partially enlarged cross-sectional view of area A in FIG. 3A of the present invention.

Fig. 4 is a flowchart of the manufacturing method of the present invention.

Fig. 5 is a sectional view of the prior art.

[Description of main component symbols]

〔current technology〕

Image installation 1"

Lens Module 10"

Image sensor 20"

Circuit Board 30"

Sheet Metal 40"

Wiring 50"

Sealant 60"

[Invention] Lens assembly 1

Infrared board 11

Image sensing element 2

Sensing area 21

Second metal pad 22

circuit board 3

opening 31

First deck 32

Second panel 33

first metal pad 331

Encapsulation 4

passive element 5

control element 6

Anisotropic conductive adhesive 7

Insulating Thermosetting Adhesive 71

Conductive Particles 72

Detailed ways

In order to have a further understanding of the purpose of the present invention, structure, feature, and function thereof, now cooperate embodiment to describe in detail as follows:

Please refer to FIG. 1, and please refer to FIGS. 2A and 2B. The image module of the present invention includes a lens assembly 1 , an image sensing element 2 , a circuit board 3 , a packaging case 4 , a passive element 5 , and a control element 6 .

The circuit board 3 has an opening 31 , a first board surface 32 , and a second board surface 33 . The image sensing element 2 is disposed on the second plate surface 33 and corresponds to the opening 31. Specifically, the image sensing element 2 is an unpackaged sensing chip (Sensor Die) with a sensing region 21, the sensing region 21 corresponds to the opening 31 of the circuit board 3 .

The lens assembly 1 is mounted on the first board surface 32 and corresponds to the opening 31 . The lens assembly 1 further includes an infrared board 11 disposed on the inner edge of the opening 31 and corresponding to the sensing area 21 .

The second board surface 33 has a plurality of first metal pads 331 , and the image sensing element 2 has a plurality of second metal pads 22 . Please refer to FIG. 3A and FIG. 3B , the second metal pad 22 and the first metal pad 331 are arranged correspondingly, and the first metal pad 331 and the second metal pad 22 are coated on the second plate surface 33 and the image sensing element 2 The anisotropic conductive glue 7 in between makes the first metal pad 331 and the second metal pad 22 form an electrical connection. In detail, the anisotropic conductive adhesive 7 includes an insulating thermosetting adhesive material 71 and a plurality of conductive particles 72 distributed in the insulating thermosetting adhesive material. Through these conductive particles 72, the first metal pad 331 and the second metal pad 331 Pad 22 forms an electrical connection. Finally, the encapsulation shell 4 is used to encapsulate and cover the image sensing element 2 .

It is worth mentioning that the anisotropic conductive adhesive is used to replace the height of the bonding wire and sealant produced by die bond (Die Bond) and wire bond (Wire bond) in the traditional COB (Chip on Board) process. The invention can reduce the height of the image module, and due to the characteristics of the anisotropic conductive adhesive, the connection point between the metal pad and the metal pad can withstand stress better than tin bonding, and the reliability is better.

Please refer to FIG. 4 , which is a manufacturing method of an image module according to the present invention, and the manufacturing method includes the following steps.

Step 1: providing a circuit board, the circuit board has an opening, a first board surface, and a second board surface.

As shown in FIGS. 2A and 2B , the circuit board 3 has an opening 31 , a first board surface 32 , and a second board surface 33 . The circuit board 3 can be a rigid-flex board.

Step 2: Coating an anisotropic conductive adhesive on the second board surface.

As shown in Figures 2B and 3A, the anisotropic conductive adhesive 7 is applied to the second board surface 33 of the circuit board 3 by using a dispensing machine (figure omitted) or a laminating machine (figure omitted), the second board surface 33 There are a plurality of first metal pads 331 , and the anisotropic conductive adhesive 7 is coated on the metal pads 331 of the second board surface 33 .

Step 3: Align an image sensing element and the circuit board, and attach the image sensing element to the second board surface.

As shown in FIGS. 2A and 2B , use a positioning machine (not shown) to align the image sensing element 21 to be joined with the circuit board 3, and attach the image sensing element 21 to the second board. Surface 33. The image sensing element 2 has a plurality of second metal pads 22 , and the alignment machine aligns the second metal pads 22 with the first metal pads 331 .

Step 4: heat-compressing the image sensing element and the anisotropic conductive adhesive, so that the image sensing element is fixed on the second board surface.

As shown in FIGS. 3A and 3B , the image sensing element 2 and the anisotropic conductive adhesive 7 are thermally bonded by using a heat press machine (not shown) through a thermocompression bonding process, so that the image sensing element 2 is affixed to the first Two boards 33. The conductive particles 72 of the cured anisotropic conductive adhesive 7 form an electrical connection between the first metal pad 331 and the second metal pad 22 .

Step 5: Install the lens assembly on the first board.

As shown in Figures 2A, 2B and 3A, the lens assembly 1 is installed on the first plate surface 32, and corresponds to the opening 31. The lens assembly also includes an infrared board 11, and the infrared board 11 is arranged on the inner edge of the opening 31 and corresponds to the opening 31. in the sensing region 21.

Step 6: Encapsulating the image sensing element.

As shown in FIG. 3A , a test machine (not shown) is used to test the image sensing element 2 , and the image sensing element 2 is packaged, and a packaging shell 4 is wrapped on the sensing element 2 .

To sum up, according to an image module and its manufacturing method of the present invention, anisotropic conductive adhesive is used to replace the process of die adhesion and wire bonding in the traditional COB process, and it is applied on the second surface of the circuit board and on the second surface of the circuit board. The anisotropic conductive adhesive is arranged between the image sensing elements, instead of stacking the image sensing elements and lens components on the same surface of the circuit board in the traditional way. Therefore, the present invention can effectively reduce the height of the image module, and due to the characteristics of the anisotropic conductive adhesive, the bonding between the metal pad and the metal pad is better than that of tin bonding, the reliability is better, and the stability of the overall structure is improved. In addition, the image sensing element is directly fixed on the circuit board through the anisotropic conductive adhesive in the form of raw materials, and finally the packaging process is performed, without the need for secondary packaging, which can reduce the undesirable loss caused by the additional packaging process.

To sum up, the present invention actually meets the requirements of an invention patent, and an application is filed according to law. However, the above disclosures are only preferred embodiments of the present invention, and cannot limit the scope of the claims of the present invention. Therefore, equivalent changes or modifications made according to the scope of the application of the present invention still fall within the scope of the present invention. .

Claims (16)

1. an image module, is characterized in that, comprising:

One lens assembly;

One image sensing element;

One circuit board, described circuit board has an opening, one first plate face and one second plate face, described image sensing element is arranged on described the second plate face and is corresponding with described opening, and described lens assembly is installed on described the first plate face and is corresponding with described opening; And

One anisotropic conductive, described anisotropic conductive is arranged between described the second plate face and described image sensing element, makes described image sensing element be electrically connected at described circuit board.

2. image module according to claim 1, is characterized in that, described circuit board is a Rigid Flex.

3. image module according to claim 1, it is characterized in that, described the second plate mask has a plurality of the first metal gaskets, described image sensing element has a plurality of the second metal gaskets, described the second metal gasket and the corresponding setting of described the first metal gasket, and described the first metal gasket and described the second metal gasket are electrically connected described the first metal gasket and described the second metal gasket by described anisotropic conductive.

4. image module according to claim 1, is characterized in that, described image sensing element has a sensing area, and described sensing area is corresponding with described opening.

5. image module according to claim 4, is characterized in that, described lens assembly includes an infrared board, and described infrared board is arranged on the inner edge of described opening and corresponding with described sensing area.

6. image module according to claim 1, is characterized in that, described image module also comprises an encapsulating shell, and described encapsulating shell is coated on described image sensing element.

7. image module according to claim 1, is characterized in that, described anisotropic conductive includes an insulation thermosetting cement material and is distributed in a plurality of conducting particless in described insulation thermosetting cement material.

8. the manufacture method of an image module, is characterized in that, comprises the following steps:

One circuit board is provided, and described circuit board has an opening, one first plate face and one second plate face;

Coating one anisotropic conductive on described the second plate face;

Image sensing element and described circuit board are carried out to contraposition, and described image sensing element is fitted in to described the second plate face, and make image sensing element corresponding with described opening;

Described image sensing element and described anisotropic conductive are carried out to the hot pressing processing, so that described image sensing element is fixed in described the second plate face;

Installing one lens assembly on described the first plate face, and make described lens assembly corresponding to described opening; And

Encapsulate described image sensing element.

9. the manufacture method of image module according to claim 8, is characterized in that, described circuit board is a Rigid Flex.

10. the manufacture method of image module according to claim 8, is characterized in that, described image sensing element has a sensing area, and described sensing area is corresponding with described opening.

11. the manufacture method of image module according to claim 10, is characterized in that, described lens assembly also includes an infrared board, and described infrared board is arranged on the inner edge of described opening and corresponding with described sensing area.

12. the manufacture method of image module according to claim 8, is characterized in that, described anisotropic conductive includes an insulation thermosetting cement material and is distributed in a plurality of conducting particless in described insulation thermosetting cement material.

13. the manufacture method of image module according to claim 8, is characterized in that, described anisotropic conductive is to coat on described the second plate face by mode of printing.

14. the manufacture method of image module according to claim 8, is characterized in that, described the second plate mask has a plurality of the first metal gaskets, the described anisotropic conductive of coating on described the first metal gasket.

15. the manufacture method of image module according to claim 14, is characterized in that, described image sensing element has a plurality of the second metal gaskets, and described the second metal gasket is corresponding with described the first metal gasket.

16. the manufacture method of image module according to claim 15, is characterized in that, described anisotropic conductive makes described image sensing element be fixed in described the second plate face after solidifying, and described the first metal gasket and described the second metal gasket formation electric connection.

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