CN103456727B - Multi-chip packaging structure - Google Patents

Abstract

A multi-chip packaging structure includes: a substrate unit, a light-emitting unit, a frame unit, a packaging unit and a lens unit. The base unit includes a base body. The light-emitting unit includes two first light-emitting elements arranged diagonally on the substrate body and two second light-emitting elements arranged diagonally on the substrate body. The frame unit includes two first conductive frames arranged diagonally on the substrate body and surrounding two first light-emitting elements respectively, and two first conductive frames arranged diagonally on the substrate body and surrounding two second light-emitting elements respectively. The second conductive frame of the component. The packaging unit includes two first light-transmitting encapsulation bodies that cover two first light-emitting elements and are respectively surrounded by two first conductive frames and two second light-emitting elements that are respectively covered and surrounded by two second conductive frames. The second light-transmitting encapsulation body is surrounded by the frame.

Description

Multi-chip package structure

technical field

The invention relates to a multi-chip packaging structure, in particular to a multi-chip packaging structure for producing symmetrical and uniform mixed light sources.

Background technique

Regarding the comparison between light-emitting diodes (LEDs) and traditional light sources, light-emitting diodes have the advantages of small size, power saving, good luminous efficiency, long life, fast operation response speed, and no pollution from thermal radiation and mercury and other toxic substances. Therefore, in recent years, light-emitting diodes have been widely used. In the past, the brightness of light-emitting diodes could not replace traditional lighting sources. However, with the continuous improvement of the technical field, high-power light-emitting diodes with high lighting brightness have been developed, which are sufficient to replace traditional lighting sources. However, the conventional light-emitting structure using multiple light-emitting diodes still cannot effectively provide a symmetrical and uniformly mixed light source. Therefore, how to effectively provide a symmetrical and evenly mixed light source through the improvement of structural design has become an important issue to be solved by people in this field.

Contents of the invention

An embodiment of the present invention provides a multi-chip packaging structure for producing a symmetrical and uniform light mixing light source.

One embodiment of the present invention provides a multi-chip packaging structure for producing a symmetrical and uniform light mixing light source, which includes: a substrate unit, a light emitting unit and a packaging unit. The substrate unit includes a substrate body and at least one bridging conductive layer disposed on the upper surface of the substrate body. The light-emitting unit includes at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body, and at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected The second light-emitting element on the substrate body. The packaging unit includes at least two first light-transmitting packages respectively covering the at least two first light-emitting elements and at least two second light-transmitting packages covering the at least two second light-emitting elements respectively.

Another embodiment of the present invention provides a multi-chip packaging structure for producing a symmetrical and uniform light mixing light source, which includes: a substrate unit, a light emitting unit and a packaging unit. The substrate unit includes a substrate body, at least two bridged conductive layers arranged on the upper surface of the substrate body and electrically connected to each other, and at least one layer arranged on the upper surface of the substrate body and connected to the at least two Connecting conductive layers insulated from each other across conductive layers. The light-emitting unit includes at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body, and at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected In the second light-emitting element of the substrate body, the at least two bridged conductive layers are electrically connected between the at least two first light-emitting elements, and the at least one connected conductive layer is electrically connected to the at least one between the two second light-emitting elements. The packaging unit includes at least two first light-transmitting packages respectively covering the at least two first light-emitting elements and at least two second light-transmitting packages covering the at least two second light-emitting elements respectively.

Yet another embodiment of the present invention provides a multi-chip packaging structure for producing a symmetrical and uniform light mixing light source, which includes: a substrate unit, a light emitting unit and a packaging unit. The substrate unit includes a substrate body. The light-emitting unit includes at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body, and at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected In the second light-emitting element of the substrate body, the above-mentioned at least two first light-emitting elements are electrically connected together in series, and the above-mentioned at least two second light-emitting elements are electrically connected together in series. The packaging unit includes at least two first light-transmitting packages respectively covering the at least two first light-emitting elements and at least two second light-transmitting packages covering the at least two second light-emitting elements respectively.

The beneficial effect of the present invention may lie in that the multi-chip packaging structure provided by the embodiment of the present invention can be achieved through "the above-mentioned at least two first diagonally arranged on the substrate body and electrically connected to the substrate body." The design of the "light-emitting element" and "the above-mentioned at least two second light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body", so that the multi-chip packaging structure of the present invention can be used to produce symmetrical Sexual uniform mixed light source.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.

Description of drawings

FIG. 1A is a three-dimensional schematic diagram of one viewing angle of the substrate unit according to the first embodiment of the present invention.

FIG. 1B is a perspective view of another viewing angle of the substrate unit according to the first embodiment of the present invention.

FIG. 2 is a schematic perspective view of disposing the light emitting unit and the frame unit on the substrate unit according to the first embodiment of the present invention.

3 is a three-dimensional schematic diagram of electrically connecting the light emitting unit to the substrate unit and the frame unit according to the first embodiment of the present invention.

FIG. 4 is a three-dimensional schematic view of disposing the encapsulation unit on the substrate unit to cover the light emitting unit according to the first embodiment of the present invention.

FIG. 5 is a schematic perspective view of disposing the lens unit on the substrate unit to cover the packaging unit according to the first embodiment of the present invention.

FIG. 6A is a schematic perspective view of one viewing angle of the substrate unit according to the second embodiment of the present invention.

FIG. 6B is a perspective view of another viewing angle of the substrate unit according to the second embodiment of the present invention.

FIG. 7 is a schematic perspective view of disposing the light emitting unit on the substrate unit according to the second embodiment of the present invention.

8 is a schematic perspective view of a second embodiment of the present invention in which a frame unit is disposed on a substrate unit to surround a light emitting unit.

FIG. 9 is a three-dimensional schematic diagram of disposing the packaging unit on the substrate unit to cover the light emitting unit according to the second embodiment of the present invention.

FIG. 10A is a schematic perspective view of one viewing angle of the substrate unit according to the third embodiment of the present invention.

10B is a schematic perspective view of another viewing angle of the substrate unit according to the third embodiment of the present invention.

FIG. 11 is a schematic perspective view of disposing the light emitting unit on the substrate unit according to the third embodiment of the present invention.

FIG. 12 is a schematic perspective view of a frame unit arranged on a substrate unit to surround a light emitting unit according to a third embodiment of the present invention.

FIG. 13 is a three-dimensional schematic diagram of disposing the packaging unit on the substrate unit to cover the light emitting unit according to the third embodiment of the present invention.

FIG. 14 is a schematic perspective view of disposing the lens unit on the substrate unit to cover the packaging unit according to the third embodiment of the present invention.

FIG. 15 is a schematic perspective view of disposing the light emitting unit on the substrate unit according to the fourth embodiment of the present invention.

FIG. 16 is an enlarged schematic view of part A of FIG. 15 .

[Description of main component symbols]

Multi-chip package structure Z

Substrate unit 1

Substrate body 10

The first crystal placement area A1

The second crystal placement area A2

Jumper conductive layer 11

Jump-connected conductive layers 11A, 11B

Connected conductive layer 11C

First top conductive pad 12A

First bottom conductive pad 12B

Second top conductive pad 13A

The second bottom conductive pad 13B

heat dissipation layer 14

first conductor 15

Second conductor 16

light unit 2

first light emitting element 21

first electrode 210

second light emitting element 22

second electrode 220

frame unit 3

The first conductive frame 31a

The second conductive frame 32a

first insulating frame 31b

The first accommodation space 310b

Second insulating frame 32b

The second accommodation space 320b

Package Unit 4

The first light-transmitting package body 41

The second light-transmitting package body 42

Lens unit 5

Lens colloid 50

First outer wire W11

First inner wire W12

Jumper wire W20

Second outer wire W21

Second inner wire W22

detailed description

[first embodiment]

Please refer to FIG. 1A to FIG. 5 , one embodiment of the present invention can provide a multi-chip packaging structure Z for producing a symmetrical and uniform mixed light source, which includes: a substrate unit 1, a light emitting unit 2, A frame unit 3 , a packaging unit 4 and a lens unit 5 .

Firstly, as shown in FIG. 1A and FIG. 1B , the substrate unit 1 includes a substrate body 10 and at least one bridging conductive layer 11 disposed on the upper surface of the substrate body 10 . For example, the upper surface of the substrate body 10 has at least two first die placement regions A1 arranged in diagonal positions and at least two second die placement regions A2 arranged in diagonal positions. The substrate unit 1 includes at least two first top conductive pads 12A arranged diagonally on the upper surface of the substrate body 10 and at least two second conductive pads 12A arranged diagonally on the upper surface of the substrate body 10. The top conductive pad 13A.

For another example, the substrate unit 1 includes at least one heat dissipation layer 14 disposed on the lower surface of the substrate body 10 and corresponding to the light emitting unit 2, at least two disposed on the lower surface of the substrate body 10 and electrically connected respectively The first bottom conductive pads 12B of the at least two first top conductive pads 12A, and at least two are provided on the lower surface of the substrate body 10 and are electrically connected to the at least two second tops respectively. The second bottom conductive pad 13B of the conductive pad 13A.

For another example, the substrate unit 1 includes at least two first conductors 15 that can penetrate the substrate body 10 and at least two second conductors 16 that can penetrate the substrate body 10, wherein each first conductor 15 can be electrically is electrically connected between each corresponding first conductive pad 12A and each corresponding first bottom conductive pad 12B, and each second conductor 16 is electrically connected to each corresponding Between the second top conductive pad 13A and each corresponding second bottom conductive pad 13B. In other words, each corresponding first top conductive pad 12A and each corresponding first bottom conductive pad 12B can be electrically connected to each other through each corresponding first conductive body 15 , and each A corresponding second top conductive pad 13A and each corresponding second bottom conductive pad 13B can be electrically connected to each other through each corresponding second conductive body 16 . However, the substrate unit 1 used in the present invention is not limited to the examples mentioned above.

Furthermore, as shown in FIG. 1A , FIG. 2 and FIG. 3 , the light emitting unit 2 includes at least two first light emitting elements 21 arranged diagonally on the substrate body 10 and electrically connected to the substrate body 10 and at least two A second light-emitting element 22 arranged diagonally on the substrate body 10 and electrically connected to the substrate body 10, wherein the at least two first light-emitting elements 21 can be electrically connected to the at least two first top ends Between the conductive pads 12A, and the at least two second light emitting elements 22 can be electrically connected between the at least two second top conductive pads 13A. In addition, the frame unit 3 includes at least two first conductive frames 31a arranged diagonally on the substrate body 10 and respectively surrounding the at least two first light-emitting elements 21 and at least two diagonally arranged on the substrate. The second conductive frame 32a on the body 10 and surrounding the at least two second light-emitting elements 22 respectively, wherein the at least two first conductive frames 31a can be electrically connected to each other through a bridged conductive layer 11 (as shown in FIG. 2 ), and the above-mentioned at least two second conductive frames 32a can be electrically connected to each other through at least one jumper wire W20 (as shown in FIG. 3 ). Of course, the first conductive frame 31a and the second conductive frame 32a are not necessarily continuous frames, and discontinuous frames can also be applied in the present invention.

For example, the above-mentioned at least two first light-emitting elements 21 and the above-mentioned at least two second light-emitting elements 22 can be symmetrically arranged in a matrix shape, and the above-mentioned at least two first conductive frames 31a and the above-mentioned at least two second conductive The frames 32a may be arranged symmetrically to each other in a matrix shape. In addition, the above-mentioned at least two first light-emitting elements 21 are respectively arranged on at least two first crystal placement regions A1 of the substrate body 10, and the above-mentioned at least two second light-emitting elements 22 are respectively arranged on at least two first crystal placement regions A1 of the substrate body 10. Two crystals are placed on the area A2. In addition, the upper surface of each first light-emitting element 21 has at least two first electrodes 210 respectively electrically connected to each corresponding first top conductive pad 12A and each corresponding first conductive frame 31a, And the upper surface of each second light emitting element 22 has at least two second electrodes 220 respectively electrically connected to each corresponding second top conductive pad 13A and each corresponding second conductive frame 32a. Furthermore, the jumper wire W20 may correspond to the jumper-type conductive layer 11 and extend across the jumper-type conductive layer 11 .

Therefore, when the above-mentioned at least two first light-emitting elements 21 are respectively electrically connected to the above-mentioned at least two first top conductive pads 12A through at least two first outer wires W11, and the above-mentioned at least two first light-emitting elements 21 When the at least two first electrodes 210 of each first light-emitting element 21 can be respectively electrically connected to the above-mentioned at least two first conductive frames 31a through at least two first inner wires W12, they can respectively pass through each phase The corresponding first outer wire W11 and each corresponding first inner wire W12 are respectively electrically connected to each corresponding first top conductive pad 12A and each corresponding first conductive frame 31 a. Furthermore, when the at least two second light-emitting elements 22 are respectively electrically connected to the at least two second top conductive pads 13A through at least two second outer wires W21, and the at least two second light-emitting elements 22 are respectively electrically connected to the above-mentioned at least two second conductive frames 32a through at least two second inner wires W22, at least two second electrodes 220 of each second light-emitting element 22 can pass through each phase The corresponding second outer wire W21 and each corresponding second inner wire W22 are respectively electrically connected to each corresponding second top conductive pad 13A and each corresponding second conductive frame 32a. However, the light emitting unit 2 and the frame unit 3 used in the present invention are not limited to the examples mentioned above.

In addition, as shown in FIG. 3 and FIG. 4 , the packaging unit 4 includes at least two first light-transmitting packages that respectively cover the at least two first light-emitting elements 21 and are surrounded by the at least two first conductive frames 31a. 41 and at least two second light-transmitting packages 42 respectively covering the above-mentioned at least two second light-emitting elements 22 and respectively surrounded by the above-mentioned at least two second conductive frames 32a, wherein the above-mentioned at least two first light-transmitting packages The body 41 can be one of fluorescent colloid and transparent colloid, and the above-mentioned at least two second transparent encapsulation bodies 42 can be one of fluorescent colloid and transparent colloid. For example, when each first light-emitting element 21 is a blue light-emitting diode, and the first light-transmitting package 41 is a fluorescent colloid used to cover each corresponding first light-emitting element 21 (blue light-emitting diode) At this time, the blue light beam generated by each first light-emitting element 21 can pass through each corresponding first light-transmitting package body 41 to be converted into a white light beam. When each second light-emitting element 22 is a blue light-emitting diode, and the second light-transmitting package body 42 is a transparent colloid used to cover each corresponding second light-emitting element 22 (blue light-emitting diode), each The blue light beam generated by the second light-emitting element 22 can be directly projected from each corresponding second light-transmitting package body 42 without wavelength conversion.

Finally, as shown in FIG. 4 and FIG. 5 , the lens unit 5 includes a lens glue 50 disposed on the substrate body 10 to cover the frame unit 3 and the packaging unit 4 . For example, the lens colloid 50 can be a transparent colloid with a light-gathering function, but the lens unit 5 used in the present invention is not limited to the above examples. Furthermore, the present invention has at least three lighting modes as follows: Assuming that only the above-mentioned two first light-emitting elements 21 are energized to emit light, the light beams generated by the above-mentioned two first light-emitting elements 21 can pass through the first The light-transmitting encapsulation body 41 and the lens colloid 50 are used to produce a first symmetrical light source with uniform light mixing. Assuming that only the above-mentioned two second light-emitting elements 22 are energized to emit light, the light beams generated by the above-mentioned two second light-emitting elements 22 can pass through the second light-transmitting package 42 and the lens colloid 50 in order to generate a second A symmetrical uniform mixed light source. Assuming that the above-mentioned two first light-emitting elements 21 and the above-mentioned two second light-emitting elements 22 are energized to emit light at the same time, the light beams generated by the above-mentioned two first light-emitting elements 21 can pass through the first light-transmitting package body 41 sequentially. and the lens colloid 50 , and the light beams generated by the above two second light-emitting elements 22 can pass through the second light-transmitting package 42 and the lens colloid 50 in sequence to generate a third symmetrical uniform light mixing light source.

[Second embodiment]

Please refer to FIG. 6A to FIG. 9 , one embodiment of the present invention can provide a multi-chip packaging structure Z for producing a symmetrical and uniform mixed light source, which includes: a substrate unit 1, a light emitting unit 2, A frame unit 3 and a packaging unit 4 .

First, as shown in FIG. 6A and FIG. 6B , the substrate unit 1 includes a substrate body 10, at least two bridged conductive layers (11A, 11B) disposed on the upper surface of the substrate body 10 and electrically connected to each other, and At least one connecting conductive layer 11C is disposed on the upper surface of the substrate body 10 and insulated from the at least two bridging conductive layers ( 11A, 11B). For example, the upper surface of the substrate body 10 has at least two first die placement regions A1 arranged in diagonal positions and at least two second die placement regions A2 arranged in diagonal positions. The substrate unit 1 includes at least two first top conductive pads 12A arranged diagonally on the upper surface of the substrate body 10 and at least two second conductive pads 12A arranged diagonally on the upper surface of the substrate body 10. The top conductive pad 13A.

For another example, the substrate unit 1 includes at least one heat dissipation layer 14 disposed on the lower surface of the substrate body 10 and corresponding to the light emitting unit 2, at least two diagonally disposed on the lower surface of the substrate body 10 and respectively Correspondingly electrically connected to the first bottom conductive pad 12B of the above-mentioned at least two first top conductive pads 12A, and at least two diagonally arranged on the lower surface of the substrate body 10 and correspondingly electrically The second bottom conductive pad 13B is electrically connected to the above-mentioned at least two second top conductive pads 13A.

For another example, the substrate unit 1 includes at least two first conductors 15 that can penetrate the substrate body 10 and at least two second conductors 16 that can penetrate the substrate body 10, wherein each first conductor 15 can be electrically is electrically connected between each corresponding first conductive pad 12A and each corresponding first bottom conductive pad 12B, and each second conductor 16 is electrically connected to each corresponding Between the second top conductive pad 13A and each corresponding second bottom conductive pad 13B. In other words, each corresponding first top conductive pad 12A and each corresponding first bottom conductive pad 12B can be electrically connected to each other through each corresponding first conductive body 15 , and each A corresponding second top conductive pad 13A and each corresponding second bottom conductive pad 13B can be electrically connected to each other through each corresponding second conductive body 16 . However, the substrate unit 1 used in the present invention is not limited to the examples mentioned above.

Furthermore, as shown in FIG. 6A and FIG. 7 , the light emitting unit 2 includes at least two first light emitting elements 21 arranged diagonally on the substrate body 10 and electrically connected to the substrate body 10 and at least two paired The second light-emitting element 22 is arranged on the substrate body 10 at a corner and electrically connected to the substrate body 10 . Wherein, the above-mentioned at least two bridged conductive layers (11A, 11B) are electrically connected between the above-mentioned at least two first light-emitting elements 21, and the connecting-type conductive layer 11C is electrically connected to the above-mentioned at least two second light-emitting elements. Between 22. In addition, the at least two first light emitting elements 21 can be electrically connected between the at least two first top conductive pads 12A, and the at least two second light emitting elements 22 can be electrically connected to the at least two second light emitting elements. between the two top conductive pads 13A.

For example, the above-mentioned at least two first light-emitting elements 21 and the above-mentioned at least two second light-emitting elements 22 may be symmetrically arranged in a matrix shape (as shown in FIG. 7 ). In addition, the above-mentioned at least two first light-emitting elements 21 are respectively arranged on at least two first crystal placement regions A1 of the substrate body 10, and the above-mentioned at least two second light-emitting elements 22 are respectively arranged on at least two first crystal placement regions A1 of the substrate body 10. Two crystals are placed on the area A2. In addition, the upper surface of each first light-emitting element 21 has at least two first electrodes 210 electrically connected to each corresponding first top conductive pad 12A and each corresponding jumper conductive layer 11A, respectively. , and the upper surface of each second light-emitting element 22 has at least two second electrodes 220 electrically connected to each corresponding second top conductive pad 13A and the connecting conductive layer 11C.

For another example, when the above-mentioned at least two first light-emitting elements 21 are respectively electrically connected to the above-mentioned at least two first top conductive pads 12A through at least two first outer wires W11, and the above-mentioned at least two first When the light-emitting elements 21 are respectively electrically connected to the above-mentioned at least two jumper-type conductive layers (11A, 11B) through at least two first inner wires W12, at least two first electrodes of each first light-emitting element 21 210 respectively through each corresponding first outer wire W11 and each corresponding first inner wire W12, so as to be electrically connected to each corresponding first top conductive pad 12A corresponding to each The jumper conductive layer (11A or 11B). Furthermore, when the at least two second light-emitting elements 22 are respectively electrically connected to the at least two second top conductive pads 13A through at least two second outer wires W21, and the at least two second light-emitting elements 22 respectively through at least two second inner wires W22 to be electrically connected to the two opposite ends of the connecting conductive layer 11C, at least two second electrodes 220 of each second light emitting element 22 can respectively pass through each The corresponding second outer wire W21 and each corresponding second inner wire W22 are respectively electrically connected to each corresponding second top conductive pad 13A and the connecting conductive layer 11C. In addition, the at least two jumper-type conductive layers ( 11A, 11B) can be electrically connected to each other through at least one jumper wire W20 . However, the light emitting unit 2 and the frame unit 3 used in the present invention are not limited to the examples mentioned above.

In addition, the frame unit 3 includes at least two first insulating frames 31b arranged diagonally on the substrate body 10 and respectively surrounding the at least two first light-emitting elements 21 and at least two diagonally arranged on the substrate. The second insulating frames 32b on the body 10 and respectively surrounding the at least two second light-emitting elements 22, wherein the at least two first insulating frames 31b and the at least two second insulating frames 32b can be integrated into a single frame member. For example, the above-mentioned at least two first insulating frames 31b and the above-mentioned at least two second insulating frames 32b may be symmetrically arranged in a matrix shape. Furthermore, each first insulating frame 31b has a frame for accommodating each corresponding first outer wire W11, each corresponding first inner wire W12 and each corresponding first light-transmitting package body 41. Each second insulating frame 32b has a first accommodating space 310b for accommodating each corresponding second outer wire W21, each corresponding second inner wire W22 and each corresponding second The second accommodating space 320b of the light-transmitting package body 42, and the jumper wire W20 is accommodated in the first accommodating space 310b of one of the first insulating frames 31b. Of course, the first insulating frame 31b and the second insulating frame 32b are not necessarily continuous frames, and discontinuous frames can also be applied in the present invention.

In addition, as shown in FIG. 8 and FIG. 9 , the packaging unit 4 includes at least two first light-transmitting packages that respectively cover the above-mentioned at least two first light-emitting elements 21 and are respectively surrounded by the above-mentioned at least two first insulating frames 31b. 41 and at least two second light-transmitting packages 42 respectively covering the above-mentioned at least two second light-emitting elements 22 and respectively surrounded by the above-mentioned at least two second insulating frames 32b, wherein the above-mentioned at least two first light-transmitting packages The body 41 can be one of fluorescent colloid and transparent colloid, and the above-mentioned at least two second transparent encapsulation bodies 42 can be one of fluorescent colloid and transparent colloid. For example, when each first light-emitting element 21 is a blue light-emitting diode, and the first light-transmitting package 41 is a fluorescent colloid used to cover each corresponding first light-emitting element 21 (blue light-emitting diode) At this time, the blue light beam generated by each first light-emitting element 21 can pass through each corresponding first light-transmitting package body 41 to be converted into a white light beam. When each second light-emitting element 22 is a blue light-emitting diode, and the second light-transmitting package body 42 is a transparent colloid used to cover each corresponding second light-emitting element 22 (blue light-emitting diode), each The blue light beam generated by the second light-emitting element 22 can be directly projected from each corresponding second light-transmitting package body 42 without wavelength conversion.

[Third embodiment]

Please refer to FIG. 10A to FIG. 14 , the third embodiment of the present invention can provide a multi-chip packaging structure Z for producing a symmetrical and uniform mixed light source, which includes: a substrate unit 1, a light emitting unit 2, A frame unit 3 and a packaging unit 4 .

Firstly, the substrate unit 1 includes a substrate body 10 . The light emitting unit 2 includes at least two first light emitting elements 21 arranged diagonally along a first diagonal line (not shown) on the substrate body 10 and electrically connected to the substrate body 10 and at least two Along a second diagonal line (not shown in the figure), the second light-emitting element 22 is arranged on the substrate body 10 diagonally and electrically connected to the substrate body 10, and the first diagonal line and the second pair The corner lines are cross-shaped, wherein the at least two first light emitting elements 21 can be electrically connected in series, and the at least two second light emitting elements 22 can be electrically connected in series. In addition, the packaging unit 4 includes at least two first light-transmitting packages 41 covering the at least two first light-emitting elements 21 and at least two second light-transmitting packages covering the at least two second light-emitting elements 22 respectively. 42.

As shown in FIG. 10A and FIG. 10B , the substrate unit 1 includes at least two first outer conductive pads 11 ′ arranged diagonally on the upper surface of the substrate body 10 , at least one outer conductive pad 11 ′ arranged on the at least two first The first inner conductive pad 12' between the outer conductive pads 11', at least two second outer conductive pads 13' arranged diagonally on the upper surface of the substrate body 10, at least two second outer conductive pads 13' arranged on The second inner conductive pad 14' between the at least two second outer conductive pads 13'. Furthermore, the substrate unit 1 includes at least two first bottoms arranged diagonally on the lower surface of the substrate body 10 and correspondingly electrically connected to the at least two first outer conductive pads 11 ′. The end conductive pads 12B, at least two are arranged diagonally on the lower surface of the substrate body 10 and are respectively electrically connected to the second bottom conductive pads of the at least two second outer conductive pads 13'. Pad 13B, and at least one third bottom disposed on the lower surface of the substrate body 10 and located between the at least two first bottom conductive pads 12B and the at least two second bottom conductive pads 13B. terminal conductive pad 14B.

Moreover, the substrate unit 1 includes at least two first conductive bodies 15 penetrating through the substrate body 10 and electrically contacting the at least two first outer conductive pads 11' and the at least two first bottom conductive pads 12B, At least two second conductive bodies 16 that penetrate the substrate body 10 and electrically contact the at least two second outer conductive pads 13' and the at least two second bottom conductive pads 13B, and at least two through the substrate body 10 and electrically contact the third conductive body 17 of the at least two second inner conductive pads 14 ′ and the at least one third bottom conductive pad 14B. Furthermore, each first conductor 15 can be electrically connected between the corresponding first outer conductive pad 11 ′ and the corresponding first bottom conductive pad 12B, and each first The two conductors 16 can be electrically connected between the corresponding second outer conductive pad 13' and the corresponding second bottom conductive pad 13B, and each third conductor 17 can be electrically connected. It is connected between the corresponding second inner conductive pad 14 ′ and the at least one third bottom conductive pad 14B.

As shown in FIG. 10A and FIG. 11 , one of the first light-emitting elements 21 can be electrically connected to one of the first outer conductive pads by wire bonding (the same wire bonding method as the first and second embodiments above). 11' and the above-mentioned at least one first inner conductive pad 12', and another first light-emitting element 21 can be electrically connected to the other first outer conductive pad 11' and the above-mentioned at least one between the first inner conductive pads 12'. In addition, one of the second light-emitting elements 22 can be electrically connected between one of the second outer conductive pads 13' and one of the second inner conductive pads 14' by wire bonding, and the other second light-emitting element 22 The element 22 can be electrically connected between another second outer conductive pad 13 ′ and another second inner conductive pad 14 by wire bonding. Thereby, the above-mentioned at least two first light-emitting elements 21 can be electrically connected together in series through the above-mentioned at least one shared first inner conductive pad 12 ′, and the above-mentioned at least two second light-emitting elements 22 can be connected together through the above-mentioned At least one shared third bottom conductive pad 14B is electrically connected together in series.

As shown in FIG. 11 and FIG. 13 , the frame unit 3 includes at least two first insulating frames 31 b arranged diagonally on the substrate body 10 and respectively surrounding the at least two first light-emitting elements 21 and at least two forming The second insulating frames 32b arranged diagonally on the substrate body 10 and surrounding the at least two second light-emitting elements 22 respectively, wherein the at least two first light-transmitting packages 41 can be covered by the at least two second light-emitting elements 22 respectively. Surrounded by an insulating frame 31b, and the at least two second transparent packages 42 may be surrounded by the at least two second insulating frames 32b respectively. Furthermore, each first insulating frame 31b has a first accommodating space 310b for accommodating the corresponding first light-emitting element 21 and the first light-transmitting package 41, and each second insulating frame 32b There is a second accommodating space 320b for accommodating the corresponding second light-emitting element 22 and the second light-transmitting package body 42 .

As shown in FIG. 13 and FIG. 14 , the lens unit 5 includes a lens glue 50 disposed on the substrate body 10 to cover the frame unit 3 and the packaging unit 4 . For example, the lens colloid 50 can be a transparent colloid with a light-gathering function, but the lens unit 5 used in the present invention is not limited to the above examples. Furthermore, the present invention has at least three lighting modes as follows: Assuming that only the above-mentioned two first light-emitting elements 21 are energized to emit light, the light beams generated by the above-mentioned two first light-emitting elements 21 can pass through the first The light-transmitting encapsulation body 41 and the lens colloid 50 are used to produce a first symmetrical light source with uniform light mixing. Assuming that only the above-mentioned two second light-emitting elements 22 are energized to emit light, the light beams generated by the above-mentioned two second light-emitting elements 22 can pass through the second light-transmitting package 42 and the lens colloid 50 in order to generate a second A symmetrical uniform mixed light source. Assuming that the above-mentioned two first light-emitting elements 21 and the above-mentioned two second light-emitting elements 22 are energized to emit light at the same time, the light beams generated by the above-mentioned two first light-emitting elements 21 can pass through the first light-transmitting package body 41 sequentially. and the lens colloid 50 , and the light beams generated by the above two second light-emitting elements 22 can pass through the second light-transmitting package 42 and the lens colloid 50 in sequence to generate a third symmetrical uniform light mixing light source.

[Fourth Embodiment]

Please refer to FIG. 15 and FIG. 16, the fourth embodiment of the present invention can provide a multi-chip packaging structure Z for producing a symmetrical and uniform mixed light source, which includes: a substrate unit 1, a light emitting unit 2, A frame unit 3 and a packaging unit 4 . It can be seen from the comparison between FIG. 15 and FIG. 11 that the biggest difference between the fourth embodiment of the present invention and the third embodiment is that: in the fourth embodiment, the substrate unit 1 includes a first inner conductive pad 12' covering the above-mentioned at least one A bridging part 120' is provided on the bridging insulating layer 121' between the at least two second inner conductive pads 14' and a covering bridging insulating layer 121' is electrically connected to the at least two The bridging conductive layer 122' between the two second inner conductive pads 14'. Thereby, the above-mentioned at least two first light-emitting elements 21 can be electrically connected together in series through the above-mentioned at least one common first inner conductive pad 12 ′, and the above-mentioned at least two second light-emitting elements 22 can be connected together through a common The jumper-type conductive layers 122 ′ (but do not need to pass through or use the at least one third bottom conductive pad 14B) are electrically connected together in series.

[Possible effects of the embodiment]

To sum up, the multi-chip packaging structure provided by the embodiment of the present invention can be achieved through "the above-mentioned at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body" and " The design of the above-mentioned at least two second light-emitting elements" disposed diagonally on the substrate body and electrically connected to the substrate body enables the multi-chip packaging structure of the present invention to be used to generate a symmetrical uniform light mixing light source.

Further speaking, the multi-chip packaging structure provided by the embodiment of the present invention can be electrically connected to each other through "the above-mentioned at least two first conductive frames are connected to each other through the above-mentioned at least one bridging conductive layer, and the above-mentioned at least two The second conductive frame is designed to be electrically connected to each other through at least one jumper wire, so that the at least two first light-emitting elements and the at least two first light-emitting elements that are arranged diagonally on the substrate body and electrically connected to the substrate body Two second light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body can cooperate with each other to produce a symmetrical and uniformly mixed light source.

Furthermore, the multi-chip packaging structure provided by the embodiment of the present invention can be electrically connected between the at least two first light-emitting elements through "the at least two bridging conductive layers, and the at least one The connection-type conductive layer is electrically connected between the at least two second light-emitting elements", so that the at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body And the above-mentioned at least two second light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body can cooperate with each other to generate a symmetrical uniform light mixing light source.

The above descriptions are only preferred feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the scope of the present invention.

Claims (26)

1. A multi-chip packaging structure, characterized in that, the multi-chip packaging structure comprises: A substrate unit, including a substrate body and at least one bridging conductive layer disposed on the upper surface of the substrate body; A light-emitting unit, including at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body along the first diagonal, and arranged diagonally on the At least two second light-emitting elements on the substrate body and electrically connected to the substrate body along the second diagonal, wherein the at least two first light-emitting elements are electrically connected together in series , and the at least two second light-emitting elements are electrically connected together in series; and A packaging unit, including at least two first light-transmitting packages covering the at least two first light-emitting elements and at least two second light-transmitting packages covering the at least two second light-emitting elements respectively; Wherein, the first diagonal line and the second diagonal line intersect each other. 2. The multi-chip packaging structure according to claim 1, characterized in that, the multi-chip packaging structure further comprises: a frame unit, the frame unit is arranged diagonally on the substrate body and At least two first conductive frames respectively surrounding the at least two first light-emitting elements are arranged diagonally on the substrate body and respectively surround at least two second light-emitting elements of the at least two second light-emitting elements. The conductive frame, wherein the at least two first conductive frames are electrically connected to each other through the at least one jumper conductive layer, and the at least two second conductive frames are electrically connected to each other through at least one jumper wire , the at least two first light-transmitting packages are respectively surrounded by the at least two first conductive frames, and the at least two second light-transmissive packages are respectively surrounded by the at least two second conductive frames around. 3. The multi-chip package structure according to claim 2, wherein the substrate unit comprises at least two first top conductive pads arranged diagonally on the upper surface of the substrate body, and The at least two first light-emitting elements are electrically connected between the at least two first top conductive pads, wherein the substrate unit includes diagonally arranged on the upper surface of the substrate body There are at least two second top conductive pads, and the at least two second light-emitting elements are electrically connected between the at least two second top conductive pads. 4. The multi-chip package structure according to claim 3, wherein the substrate unit includes at least one heat dissipation layer disposed on the lower surface of the substrate body and corresponding to the light emitting unit, disposed on the At least two first bottom conductive pads on the lower surface of the substrate body and respectively correspondingly electrically connected to the at least two first top conductive pads, and disposed on the lower surface of the substrate body and respectively The at least two second bottom conductive pads are correspondingly electrically connected to the at least two second top conductive pads. 5. The multi-chip package structure according to claim 4, wherein the substrate unit comprises at least two first conductors penetrating through the substrate body and at least two second conductors penetrating the substrate body , each of the first conductors is electrically connected between each of the corresponding first top conductive pads and each of the corresponding first bottom conductive pads, and each of the first conductive pads The two conductors are electrically connected between each corresponding second top conductive pad and each corresponding second bottom conductive pad. 6. The multi-chip package structure according to claim 3, wherein the at least two first light-emitting elements are respectively electrically connected to the at least two first top ends through at least two first outer wires Conductive pads, and the at least two first light-emitting elements are respectively electrically connected to the at least two first conductive frames through at least two first inner wires, wherein the at least two second light-emitting elements The at least two second light-emitting elements are respectively electrically connected to the at least two second top conductive pads through at least two second outer wires, and the at least two second light-emitting elements are respectively electrically connected to each other through at least two second inner wires. connected to the at least two second conductive frames. 7. The multi-chip package structure according to claim 3, wherein the upper surface of each of the first light-emitting elements is electrically connected to each corresponding first top conductive pad and each A corresponding at least two first electrodes of the first conductive frame, and the upper surface of each of the second light-emitting elements are respectively electrically connected to each of the corresponding second top conductive pads and Each corresponds to at least two second electrodes of the second conductive frame. 8. The multi-chip package structure according to claim 3, wherein the at least two first light-emitting elements and the at least two second light-emitting elements are symmetrically arranged in a matrix shape, and the at least two The first conductive frame and the at least two second conductive frames are symmetrically arranged in a matrix shape. 9. The multi-chip packaging structure according to claim 1, wherein the at least two first light-transmitting packages are one of fluorescent colloid and transparent colloid, and the at least two The second light-transmitting package is one of fluorescent colloid and transparent colloid. 10. The multi-chip package structure according to claim 2, characterized in that, the multi-chip package structure further comprises: a lens unit, the lens unit includes a lens set on the substrate body to cover the frame unit with the lens colloid of the encapsulation unit. 11. A multi-chip packaging structure, characterized in that the multi-chip packaging structure comprises: A substrate unit, comprising a substrate body, at least two bridging conductive layers arranged on the upper surface of the substrate body and electrically connected to each other, and arranged on the upper surface of the substrate body and connected to the at least at least one connecting conductive layer with two bridging conductive layers insulated from each other; A light-emitting unit, including at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body and diagonally arranged on the substrate body and electrically connected to the substrate body At least two second light-emitting elements connected to the substrate body, wherein the at least two bridging conductive layers are electrically connected between the at least two first light-emitting elements, and the at least one connection type The conductive layer is electrically connected between the at least two second light emitting elements; and A packaging unit includes at least two first light-transmitting packages covering the at least two first light-emitting elements and at least two second light-transmitting packages covering the at least two second light-emitting elements respectively. 12. The multi-chip packaging structure according to claim 11, characterized in that, the multi-chip packaging structure further comprises: a frame unit, the frame unit is arranged on the substrate body diagonally and At least two first insulating frames respectively surrounding the at least two first light-emitting elements are arranged diagonally on the substrate body and respectively surround at least two second light-emitting elements of the at least two second light-emitting elements. The insulating frame, wherein the at least two first insulating frames and the at least two second insulating frames are integrally combined to form a single frame member, and the at least two first light-transmitting packages are covered by the at least two surrounded by a first insulating frame, and the at least two second light-transmitting packages are respectively surrounded by the at least two second insulating frames. 13. The multi-chip package structure according to claim 12, wherein the substrate unit comprises at least two first top conductive pads arranged diagonally on the upper surface of the substrate body, and The at least two first light-emitting elements are electrically connected between the at least two first top conductive pads, wherein the substrate unit includes diagonally arranged on the upper surface of the substrate body There are at least two second top conductive pads, and the at least two second light-emitting elements are electrically connected between the at least two second top conductive pads. 14. The multi-chip package structure according to claim 13, wherein the substrate unit includes at least one heat dissipation layer disposed on the lower surface of the substrate body and corresponding to the light emitting unit, diagonally are disposed on the lower surface of the substrate body and are respectively correspondingly electrically connected to at least two first bottom conductive pads of the at least two first top conductive pads, and are arranged diagonally on the The at least two second bottom conductive pads on the lower surface of the substrate body are respectively correspondingly and electrically connected to the at least two second top conductive pads. 15. The multi-chip package structure according to claim 14, wherein the substrate unit comprises at least two first conductors penetrating the substrate body and at least two second conductors penetrating the substrate body , each of the first conductors is electrically connected between each of the corresponding first top conductive pads and each of the corresponding first bottom conductive pads, and each of the first conductive pads The two conductors are electrically connected between each corresponding second top conductive pad and each corresponding second bottom conductive pad. 16. The multi-chip package structure according to claim 13, wherein the at least two first light-emitting elements are respectively electrically connected to the at least two first top ends through at least two first outer wires Conductive pads, and the at least two first light-emitting elements are respectively electrically connected to the at least two bridging conductive layers through at least two first inner wires, wherein the at least two second light-emitting elements The elements are respectively electrically connected to the at least two second top conductive pads through at least two second outer wires, and the at least two second light-emitting elements are respectively electrically connected to the at least two second inner wires through at least two second inner wires. The two opposite ends of the at least one connecting conductive layer are electrically connected to each other, wherein the at least two jumping conductive layers are electrically connected to each other through at least one jumper wire. 17. The multi-chip packaging structure according to claim 16, wherein each of the first insulating frames has a set for accommodating each of the corresponding first outer wires, and each of the corresponding The first inner wires and each corresponding first accommodating space of the first light-transmitting package body, each of the second insulating frames has a set for accommodating each corresponding second outer wires, each corresponding second inner wire and each corresponding second accommodation space of the second light-transmitting package, and the at least one jumper wire is accommodated in one of the In the first accommodating space of the first insulating frame. 18. The multi-chip package structure according to claim 13, characterized in that, the upper surface of each of the first light-emitting elements is respectively electrically connected to each corresponding first top conductive pad and each A corresponding at least two first electrodes of the bridging conductive layer, and the upper surface of each of the second light-emitting elements are respectively electrically connected to each of the corresponding second top conductive pads At least two second electrodes connected to the at least one conductive layer. 19. The multi-chip package structure according to claim 12, wherein the at least two first light-emitting elements and the at least two second light-emitting elements are symmetrically arranged in a matrix shape, and the at least two The first insulating frame and the at least two second insulating frames are symmetrically arranged in a matrix shape. 20. The multi-chip packaging structure according to claim 11, characterized in that, the at least two first light-transmitting packages are one of fluorescent colloid and transparent colloid, and the at least two The second light-transmitting package is one of fluorescent colloid and transparent colloid. 21. A multi-chip packaging structure, characterized in that the multi-chip packaging structure comprises: A substrate unit, including a substrate body; A light-emitting unit, including at least two first light-emitting elements arranged diagonally on the substrate body and electrically connected to the substrate body along the first diagonal, and arranged diagonally on the At least two second light-emitting elements on the substrate body and electrically connected to the substrate body along the second diagonal, wherein the at least two first light-emitting elements are electrically connected in series together, and the at least two second light emitting elements are electrically connected together in series; and A packaging unit, including at least two first light-transmitting packages covering the at least two first light-emitting elements and at least two second light-transmitting packages covering the at least two second light-emitting elements respectively; Wherein, the first diagonal line and the second diagonal line intersect each other. 22. The multi-chip packaging structure according to claim 21, characterized in that, the multi-chip packaging structure further comprises: a frame unit, the frame unit is arranged diagonally on the substrate body and At least two first insulating frames respectively surrounding the at least two first light-emitting elements are arranged diagonally on the substrate body and respectively surround at least two second light-emitting elements of the at least two second light-emitting elements. An insulating frame, wherein the at least two first light-transmitting packages are respectively surrounded by the at least two first insulating frames, and the at least two second light-transmitting packages are respectively surrounded by the at least two first Surrounded by two insulating frames. 23. The multi-chip package structure according to claim 21, wherein the substrate unit comprises at least two first outer conductive pads arranged diagonally on the upper surface of the substrate body, at least one first inner conductive pad between the at least two first outer conductive pads, at least two second outer conductive pads arranged diagonally on the upper surface of the substrate body, At least two second inner conductive pads disposed between the at least two second outer conductive pads, one of the first light-emitting elements is electrically connected to one of the first light-emitting elements by wire bonding. Between the outer conductive pad and the at least one first inner conductive pad, the other first light-emitting element is electrically connected to the other first outer conductive pad and the at least one first light-emitting element by wire bonding. Between a first inner conductive pad, one of the second light-emitting elements is electrically connected to one of the second outer conductive pads and one of the second inner conductive pads by wire bonding and the other second light-emitting element is electrically connected between the other second outer conductive pad and the other second inner conductive pad by wire bonding. 24. The multi-chip package structure according to claim 23, wherein the substrate unit includes diagonally arranged on the lower surface of the substrate body and electrically connected to the at least two substrates correspondingly and respectively. At least two first bottom conductive pads of the first outer conductive pads are arranged diagonally on the lower surface of the substrate body and electrically connected to the at least two second outer conductive pads respectively and correspondingly. At least two second bottom conductive pads of the conductive pads, and the at least two second bottom conductive pads disposed on the lower surface of the substrate body and between the at least two first bottom conductive pads and the at least two second bottom conductive pads At least one third bottom conductive pad between the bottom conductive pads. 25. The multi-chip package structure according to claim 24, wherein the substrate unit includes a substrate penetrating through the substrate body and electrically contacting the at least two first outer conductive pads and the at least two second outer conductive pads. At least two first conductors of a bottom conductive pad penetrate through the substrate body and electrically contact the at least two second outer conductive pads and at least one of the at least two second bottom conductive pads Two second conductors, and at least two third conductors penetrating through the substrate body and electrically contacting the at least two second inner conductive pads and the at least one third bottom conductive pad, wherein , each of the first conductors is electrically connected between the corresponding first outer conductive pad and the corresponding first bottom conductive pad, and each of the second conductors is electrically connected Connected between the corresponding second outer conductive pad and the corresponding second bottom conductive pad, each of the third conductors is electrically connected to the corresponding second inner conductive pad Between the electrical pad and the at least one third bottom conductive pad, and the at least two second light emitting elements are electrically connected in series through the at least one third bottom conductive pad. 26. The multi-chip package structure according to claim 23, wherein the substrate unit comprises a bridging portion covering the at least one first inner conductive pad and is disposed on the at least two second a bridging insulating layer between the inner conductive pads and a bridging conductive layer covering the bridging insulating layer and electrically connected between the at least two second inner conductive pads, and the At least two second light-emitting elements are electrically connected together in series through the bridging conductive layer.