CN103443944B - LED illumination radiator - Google Patents

Abstract

The present invention provides a heat sink for LED lighting, which is formed of an aluminum material and includes: an assembly surface on which an LED element is mounted; a first fin portion extending in a direction perpendicular to the assembly surface; A second fin portion extending in a direction perpendicular to the mounting surface and in a direction intersecting the first fin portion.

Description

Radiator for LED lighting

technical field

The invention relates to a heat sink for LED lighting for dissipating heat generated when LED lighting with a light emitting diode (LED) element as a light source emits light to the surrounding space.

Background technique

Illumination using light-emitting diode (LED) elements as a light source has low power consumption and long life, so it has gradually begun to penetrate the market. Among them, in recent years, vehicle-mounted LED lighting such as headlights of automobiles has drawn particular attention. This type of vehicle-mounted LED lighting is also used in embedded lighting in other fields such as buildings, and LED lighting has begun to be replaced.

However, the LED element, which is the light-emitting source of the LED lighting, has very weak resistance to heat, and when the allowable temperature is exceeded, the luminous efficiency is lowered, and there is also a problem that the lifetime thereof is affected. In order to solve this problem, it is necessary to dissipate the heat generated when the LED element emits light to the surrounding space, and therefore a large heat sink is provided in LED lighting.

Most of the heat sinks for LED lighting are heat sinks made of cast aluminum made of aluminum or an aluminum alloy, and patent documents 1 to 4 disclose heat sinks with typical structures among the above heat sinks. The above-mentioned heat sink has a substrate portion on which the LED light source is arranged and fixed on the front side, and a plurality of fins arranged in parallel protruding at intervals from the rear side of the substrate portion. Surface, so that a wide radiation area can be obtained, so it is conceivable that a certain amount of heat dissipation can be obtained.

However, when the heat sink 4 for LED lighting having the substrate portion 2 and the fin portion 3 as shown in FIG. In this case, as shown in FIG. 48 , the heat sink 4 is installed in a state where the substrate portion 2 constitutes the frame of the LED lighting, that is, the back portion of the casing 5, wherein the substrate portion 2 arranges and fixes the LED light source 1 on the front side, The fin portion 3 protrudes at intervals from the back side of the substrate portion 2 and is arranged in parallel. In this way, when the radiator 4 is mounted on the body of a motor vehicle, the wall or ceiling of a building, etc. in the state of being incorporated into the housing 5, the fin portion 3 is closed to the back side of the LED lighting without air convection. prominent in the space.

In this way, when the heat sink 4 is used in a state where the fin portion 3 of the heat sink 4 protrudes into the closed space on the back side, the heat radiation from the heat sink 4 becomes heat radiation into the closed space without air convection. , in the heat sink 4 having a plurality of fin portions 3 arranged in parallel, effective heat dissipation cannot be performed.

That is, in the heat dissipation from the heat sink in a closed space, convection does not play a dominant role, and radiation becomes the center of heat dissipation. Therefore, it is considered that instead of providing a plurality of fins on the heat sink and only increasing the surface area, it is better to increase the projected area of the heat sink in the x-axis direction, y-axis direction, and z-axis direction, that is, all three directions to improve heat dissipation. Sexually effective.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2007-172932

Patent Document 2: Japanese Patent Laid-Open No. 2007-193960

Patent Document 3: Japanese Patent Laid-Open No. 2009-277535

Patent Document 4: Japanese Patent Laid-Open No. 2010-278350

Summary of the invention

The problem to be solved by the invention

Contents of the invention

An object of the present invention is to provide a heat sink for LED lighting that can efficiently radiate heat even in a closed space.

means to solve the problem

In order to solve the above-mentioned problems, the heat sink for LED lighting of the present invention is formed of an aluminum material and includes: a mounting surface on which an LED element is mounted; and a first fin portion in a direction perpendicular to the mounting surface. Extending upward; the second fin portion extends in a direction perpendicular to the fitting surface and in a direction intersecting with the first fin portion.

In the heat sink for LED lighting, the first and second fins extend in a direction perpendicular to the mounting surface on which the LED element is mounted, and the first fins extend in a direction intersecting the second fins, Therefore, it is possible to increase all the projected areas in the three-dimensional directions of the x-axis direction, the y-axis direction, and the z-axis direction. Therefore, even in the case of heat dissipation in a closed space without air convection, the heat dissipation can be effectively performed.

In the heat sink for LED lighting of the present invention, it is preferable that the flat first fin portion and/or the second fin portion are integrally formed with respect to either or both of the front and back of the mounting surface, and the The fins are erected facing outward and formed at intervals from each other, and the number of fins extending in the same direction is 2 or less in any cross section perpendicular to any one of the front and back of the mounting surface. .

In this case, it is preferable that each of the fins is formed at a position sandwiching the LED element.

Moreover, it is preferable that the total number of the said 1st and 2nd fin part is 2-8 sheets.

This can be achieved without complicating the shape and structure of the heat sink, especially the shape and structure of the fins for heat dissipation, and without increasing the number of fins. On the contrary, the shape and structure of the fins can be simplified, and the number of fins can be reduced. In addition, in the present invention, since the base plate and the heat dissipation fins of the heat sink are integrally formed, the mutual surfaces of the base plate and the heat dissipation fins are continuous, and the heat conduction formed by the above-mentioned surfaces or materials Paths are formed continuously. Therefore, there is no obstacle such as a slit that breaks the heat conduction path, and the heat conduction path in the heat sink does not break, so that the heat from the LED element is transferred to each part constituting the heat sink. Therefore, extremely high heat dissipation of the heat sink can be ensured.

In addition, in the heat sink for LED lighting according to the present invention, it is preferable that the mounting surface and the first fin portion are formed in a continuous stepped shape.

In this case, it is preferable that the mounting surface portion, the first fin portion, and the second fin portion are integrally formed by bending an aluminum blank.

In addition, it is preferable that a second fin portion extending in a direction intersecting with the first fin portion is further provided at an end portion of the first fin portion.

Furthermore, it is preferable that the thickness of the mounting surface portion and/or the first fin portion is thicker than that of the second fin portion.

Moreover, it is preferable that the said 2nd fin part overlaps with each other, or the said 2nd fin part and the said mounting surface part or/and the said 1st fin part.

In addition, it is preferable that the wall thickness of the mounting portion of the LED element on the mounting surface is locally thickened.

According to such a heat sink for LED lighting, since it is also a heat sink with a simple structure formed of an aluminum material, it can be produced relatively easily by bending a blank that is rolled by rolling a plate or a coil. It is obtained by punching, cutting, etc., a plate processed by pressing or extrusion, and since this heat sink for LED lighting is lightweight, it is suitable as a heat sink for LED lighting such as for vehicles.

In addition, in the heat sink for LED lighting according to the present invention, it is preferable that the LED element is arranged and fixed on the front side of the mounting surface, and a plurality of LED elements are protrudingly arranged in parallel at intervals from the rear side of the mounting surface. The first fin part, at least one part of the first fin part is the second fin part bent at right angles, and the second fin part has the same shape as the first fin part. The heat dissipation surface of the first fin portion and the heat dissipation surface of the mounting surface are heat dissipation surfaces in a direction perpendicular to each other.

According to such a heat sink for LED lighting, it can be manufactured from an aluminum material by relatively simple processing methods such as cutting and bending without increasing the number of constituent parts.

In addition, in the heat sink for LED lighting according to the present invention, it is preferable that the LED element is arranged and fixed on the front side of the mounting surface, and a plurality of LED elements are protrudingly arranged in parallel at intervals from the rear side of the mounting surface. In the first fin part, the mounting surface is L-shaped bent in a direction perpendicular to the longitudinal direction of the first fin part, and the second fin part is formed by the bending. Therefore, it can be manufactured from an aluminum material using relatively simple processing methods such as cutting and bending, and without increasing the number of constituent parts, it can also be used in narrow parts with space restrictions, parts of complex shapes, etc. It is possible to sufficiently secure heat dissipation from LED lighting even in places where there are such space constraints by installing them.

In this case, it is preferable that the first fin part protrudes outside the fitting surface bent into an L-shape, and reaches the fitting face when the bent part of the first fin part is processed. The linear incision on the outer surface of the outer surface is used to disconnect the first fin part. Thus, it can also be attached to the corner of the narrow part where there is a space restriction, and the bending of the base plate will not be affected by the presence of the fin portion, and there is no need to shorten the fin. The protruding size of the chip can more fully ensure the heat dissipation from the LED lighting.

Alternatively, it is preferable that the first fin part protrudes inwardly of the fitting surface bent into an L shape, and reaches the inner surface of the fitting face when the bent part of the first fin part is processed. The first fin part is cut off by a V-shaped notch with an angle of more than 90 degrees. Thus, it can be mounted even in a narrow place with space constraints, and a sufficient heat dissipation area can be ensured by the surface area of the substrate portion and the fin portion, so that the amount of heat dissipation from LED lighting can be ensured more sufficiently. In addition, it can also be attached to a corner corner of a complicated part where there is a space restriction. Furthermore, the presence of the fins does not affect the bending of the substrate, and there is no need to shorten the protruding dimensions of the fins. Therefore, the amount of heat dissipation from the LED lighting can be ensured more sufficiently.

In addition, in the heat sink for LED lighting of the present invention, it is preferable that the first fin portion and the second fin portion are formed into a continuous corrugated heat radiation fin shape by corrugation, and a part of them is corrugated. The flattening process is used to provide a stepped portion constituting the mounting surface.

In this case, it is preferable to pre-coat the surface with an emissivity ε of 0.7 or more before the corrugation processing.

According to such a heat sink for LED lighting, a plurality of thin-walled fins with relatively narrow intervals can be provided by corrugation processing into a continuous waveform, that is, the overall shape of the heat dissipation fins, and the increase of the heat transfer area and the heat dissipation performance can be realized. improvement.

In addition, by using an aluminum alloy thin plate as a raw material, as a treatment for improving heat dissipation, a precoating treatment may be performed on the raw aluminum alloy thin plate before corrugation. Therefore, it is possible to omit or shorten the polishing of the die-casting surface, cleaning process, degreasing process, surface treatment process for improving the emissivity of the surface, etc. required in the existing radiator made of aluminum alloy die-casting products, and the heat sink can be made The manufacturing cost is greatly reduced.

In addition, according to the wave processing of the raw material plate, it is possible to form the continuous waveform, that is, the overall shape of the heat radiation fin, by continuously forming the step portion such as the component mounting portion for mounting the LED element, the unevenness for reinforcement to improve rigidity, and the entire shape of the heat dissipation fin. It is formed by a series of corrugated processing processes such as flattening processing. At this time, it is also possible to design and shape the above-mentioned step portion to be partially wider than the width of the fin. Therefore, it is possible to integrally manufacture a heat sink that secures the mounting area of the LED element and simultaneously provides a plurality of fins to ensure heat dissipation from the same raw material sheet.

Invention effect

The heat sink for LED lighting of the present invention can increase all the projected areas in the three-dimensional directions of the x-axis direction, the y-axis direction, and the z-axis direction. Heat dissipation is performed efficiently.

Description of drawings

FIG. 1 is a perspective view showing a heat sink for LED lighting according to a first embodiment of the present invention.

Fig. 2 is a perspective view showing a first modified example of the heat sink of the first embodiment.

3 is a perspective view showing a second modified example of the heat sink of the first embodiment.

4 is a perspective view showing a third modified example of the heat sink of the first embodiment.

5 is a perspective view showing a fourth modified example of the heat sink of the first embodiment.

6 is a perspective view showing a fifth modified example of the heat sink of the first embodiment.

7 is a perspective view showing a sixth modified example of the heat sink of the first embodiment.

Fig. 8 is a perspective view showing a heat sink for LED lighting according to a second embodiment of the present invention.

9 is a view explaining a method of manufacturing the heat sink for LED lighting according to the second embodiment, and is a perspective view showing the form of a plate-shaped aluminum material composed of a coil, a blank, and a blank after embossing.

Fig. 10 is a perspective view illustrating the principle and action of heat dissipation of the heat sink for LED lighting according to the second embodiment.

11 is a perspective view showing a form of a blank after embossing for explaining a method of manufacturing a heat sink for LED lighting according to a first modified example of the second embodiment whose overall shape is the same as that of the second embodiment.

12 is a perspective view showing a form of a blank after embossing for explaining a method of manufacturing a heat sink for LED lighting according to a second modified example of the second embodiment whose overall shape is the same as that of the second embodiment.

13 is a perspective view showing a heat sink for LED lighting according to a third modified example of the second embodiment whose overall shape is different from that of the second embodiment.

14 is a diagram illustrating a method of manufacturing a heat sink for LED lighting according to a third modified example of the second embodiment, and is a perspective view showing a form of a plate-shaped aluminum material composed of a coil, a blank, and a stamped blank. .

Fig. 15 is a perspective view showing a heat sink for LED lighting according to a third embodiment of the present invention.

FIG. 16 is a top view of FIG. 15 .

17 is a side cross-sectional view of an aluminum plate showing an example in which the thickness of the aluminum plate (horizontal plane portion) of the LED element mounting portion is partially thickened in the heat sink for LED lighting according to the third embodiment.

Fig. 18 is a perspective view showing an installed state when the heat sink for LED lighting according to the third embodiment is applied to a headlight of an automobile.

Fig. 19 is a sectional view taken along line a-a of Fig. 18 .

Fig. 20 is a sectional view along line b-b of Fig. 18 .

Fig. 21 is a c-c sectional view of Fig. 18 .

Fig. 22 is a perspective view showing a heat sink for LED lighting according to a fourth embodiment of the present invention.

Fig. 23 shows a heat sink for LED lighting according to a fourth embodiment, in which (a) is a plan view, (b) is a front view, and (c) is a side view.

24(a), (b) and (c) are plan views showing modifications of the heat sink for LED lighting according to the fourth embodiment.

Fig. 25 is a transverse cross-sectional view showing a usage state in which the heat sink for LED lighting according to the fourth embodiment is incorporated in LED lighting as a part of the housing.

Fig. 26 is a longitudinal sectional view showing a usage state in which the heat sink for LED lighting according to the fourth embodiment is incorporated in LED lighting as a part of the housing.

Fig. 27 is a perspective view showing a heat sink for LED lighting according to a fifth embodiment of the present invention.

Fig. 28 is a perspective view showing a heat sink for LED lighting according to a first modified example of the fifth embodiment.

Fig. 29 is a perspective view showing a heat sink for LED lighting according to a second modified example of the fifth embodiment.

30 is a perspective view showing a heat sink for LED lighting according to a third modified example of the fifth embodiment.

Fig. 31 is a transverse cross-sectional view showing a state of use in which the heat sink for LED lighting according to the fifth embodiment shown in Fig. 29 is incorporated in LED lighting as a part of the housing.

Fig. 32 is a sectional view taken along line B-B in Fig. 31 .

Fig. 33 is a transverse sectional view showing a state of use in which the heat sink for LED lighting according to the fifth embodiment shown in Fig. 30 is incorporated in LED lighting as a part of the housing.

Fig. 34 is a cross-sectional view taken along line B-B of Fig. 33 .

Fig. 35 is a perspective view showing a heat sink for LED lighting according to a sixth embodiment of the present invention.

FIG. 36 is a top view of FIG. 35 .

Fig. 37 is a perspective view showing a heat sink for LED lighting according to a first modified example of the sixth embodiment.

FIG. 38 is a top view of FIG. 37 .

Fig. 39 is a perspective view showing a heat sink for LED lighting according to a second modified example of the sixth embodiment.

40 is a perspective view showing a heat sink for LED lighting according to a third modified example of the sixth embodiment.

Fig. 41 is a perspective view showing a heat sink for LED lighting according to a fourth modified example of the sixth embodiment.

Fig. 42 shows a heat sink for LED lighting according to a fifth modified example of the sixth embodiment, (a) is a perspective view, and (b) is a cross-sectional view taken along line X-X' of (a).

43 is a perspective view showing a heat sink for LED lighting according to a sixth modified example of the sixth embodiment.

44(a), (b) and (c) are perspective views showing a heat sink for LED lighting according to a seventh modified example of the sixth embodiment.

45( a ) and ( b ) are explanatory diagrams showing a state in which a heat sink according to a sixth embodiment is attached to a vehicle-mounted LED lamp.

Fig. 46 is an explanatory diagram showing the outline of the emissivity measuring device.

Fig. 47 is a perspective view showing a conventional heat sink for LED lighting.

Fig. 48 is a longitudinal sectional view showing a state of use in which a conventional heat sink for LED lighting is incorporated in LED lighting as a part of the housing.

Fig. 49 shows a conventional heat sink for LED lighting, where (a) is a plan view, (b) is a front view, and (c) is a side view.

Fig. 50 is a perspective view showing one form of a heat sink for comparison.

Symbol Description:

100…LED components

101...Heat sink for LED lighting

102... Substrate (Assembly face)

103, 105... Radiating fins (first fin part)

104, 106... Radiation fins (second fin part)

201...Radiators for LED lighting

211, 212...Horizontal plane part (assembly face)

221, 222... Vertical front part (first fin part)

231～236, 2331～2334...Vertical side part (second fin part)

300…LED components

301...Heat sink for LED lighting

311, 312...Horizontal plane part (assembly face)

321, 322... Vertical front part (first fin part)

331～338...Vertical side part (second fin part)

400…LED light source (LED component)

401...Heat sink for LED lighting

402... Substrate part (mounting surface)

403...Fin part (first fin part)

403a...Fin part main body (first fin part)

403b...Fin part bending piece (second fin part)

500…LED light source (LED component)

501...Heat sink for LED lighting

502... Substrate part (mounting surface)

503...fin part

503a...First fin part

503b...Second fin part

601...Radiators for LED lighting

600, 600a, 600b... components

602, 603...waveform (first and second fins)

604a, 604b...step part (assembly surface)

detailed description

Hereinafter, the present invention will be described in more detail based on the embodiments shown in the drawings.

(first embodiment)

FIG. 1 shows a heat sink 101 for LED lighting according to a first embodiment. This heat sink 101 for LED lighting is characterized in that, with respect to the substrate 102 on which the LED element 100 is mounted on either the front and back surfaces 1021, 1022, flat heat dissipation fins 103, 104 are integrally formed on the front surface of the substrate 102. On any one or both of the surfaces 1021, 1022 of the back, the cooling fins 103, 104 are erected outward from either the surface 1021, 1022 of the front and back of the substrate 102, and are formed at intervals from each other. Among the heat dissipation fins 103 , 104 extending in the same direction, the number of fins 103 , 104 extending in the same direction is two or less in any cross section perpendicular to either of the front and back surfaces 1021 , 1022 of the substrate 102 . Among them, the substrate 102 constitutes the mounting surface of the present invention, the heat dissipation fins 103 constitute the first fin portion of the present invention, and the heat dissipation fins 104 constitute the second fin portion of the present invention.

Specifically, the first embodiment of the heat sink 101 for LED lighting of the present invention is shown in a perspective view in FIG. 1, and the first embodiment of the heat sink 101 for LED lighting of the present invention is shown in a perspective view in FIGS. One to Sixth Variations.

The basic structure of the radiator:

First, the same basic structure of the heat sink 101 for LED lighting according to the first embodiment of the present invention in FIGS. 1 to 7 will be described. In the aforementioned FIGS. 1 to 7 , the heat sink 101 for LED lighting according to the present invention also has a plate-shaped substrate 102 on which the LED element 100 is mounted. The substrate 102 has two front and back surfaces 1021 , 1022 on the y-direction (up-down direction) side in each figure, respectively, and these surfaces 1021 , 1022 extend along the x-direction and z-direction in each figure. The plate-shaped substrate 102 mounts and supports the LED element 100 on any one of the front and back surfaces 1021, 1022. In FIGS. On the mounting surface 1021 of the element 100 , the LED element 100 is mounted in the center of the plane of the mounting surface 1021 . Also, for the sake of convenience, the other surface on the lower side in each figure is referred to as the rear surface 1022 .

Furthermore, the front and back surfaces 1021 and 1022 of the substrate 102 have a shape that is perpendicular to either or both surfaces (orthogonal to the extending direction of the surface=x and z directions in each figure) and extends in the y direction (up and down direction) in each figure. Flat heat dissipation fins 103 to 106 extending outwardly and outwardly. The above-mentioned flat heat dissipation fins 103 to 106 are vertically provided on the front and back surfaces 1021 and 1022 of the substrate 102 facing outward, but it is not necessarily necessary to align the flat heat dissipation side surfaces with the substrate 102 as shown in FIGS. 1 to 7 . The front and back surfaces 1021, 1022 are perpendicular to each other at an angle of 90 degrees. For example, the heat-dissipating side surfaces may also be vertically arranged facing outward relative to the front and back surfaces 1021 , 1022 of the substrate 102 at an angle less than 90 degrees or greater than 90 degrees. However, in any case, the aforementioned flat heat dissipation fins 103 to 106 are integrally and continuously formed with the substrate 102 in terms of material. That is, at least the flat front and back surfaces of the above-mentioned flat heat dissipation fins 103 to 106 are formed continuously with the surfaces 1021 and 1022 of the substrate 102 without interruption.

Therefore, the heat from the LED element 100 is continuously transferred to the back surface 1022, the side surfaces around the heat dissipation fins 103 to 106, and the surface in the thickness direction of the substrate 102 via the surface (surface) 1021 on the LED element mounting side of the substrate 102. heat transfer surface. In addition, a continuous heat dissipation surface that continuously radiates heat from the continuous heat transfer surface is also formed.

In addition, regarding the shape of the board|substrate 102, in FIGS. However, the shape of the substrate 102 can be appropriately selected according to the purpose of the heat sink 101 for LED lighting, such as circular, triangular, polygonal, indefinite, etc., or a cylindrical shape, a square cylindrical shape, or a shape with a height difference. 3D shapes etc.

Features of cooling fins:

At first glance, the basic structure of the heat sink 101 for LED lighting according to the present invention described above does not appear to be significantly different from the structure of the conventional heat sink 4 illustrated in FIG. 47 . However, there is a big difference between the method of disposing the flat heat dissipation fins 103-106 and the conventional radiator 4 in the following points: it needs to be installed in the narrow space or closed space of the housing for vehicle lighting. Considered studies that have as a subject heat dissipation by radiation.

First of all, the heat sink 101 for LED lighting of the present invention is based on the basic structure of the heat sink, and it is preferable that a total of 2 to 8 sheets are provided on the two surfaces 1021 and 1022 of the substrate 102 in the form of a flat plate. The heat dissipation fins 103 to 106 are formed continuously and integrally with the surfaces 1021 and 1022 of the substrate 102 with intervals therebetween.

In addition, the above-mentioned radiating fins 103 to 106 include a parallel state, and the number of fins extending in the same direction is two in any cross section perpendicular to the two surfaces 1021 and 1022 of the substrate 102 . the following. That is, there are no more than two sheets in any cross section of the heat sink 101 taken along a cross section in any direction perpendicular to both surfaces 1021 and 1022 of the substrate 102 .

The significance of the regulations on the extension direction of the cooling fins:

Here, "extending toward the same direction" as mentioned in the present invention certainly includes a parallel state, but it does not only mean parallel in the strict sense. slightly different. In the present invention, the object is to eliminate excessive overlapping of heat dissipation fins in any direction in the three-dimensional direction of the heat sink, so as to obtain high heat radiation efficiency without wasting material. Therefore, even if the angles of the extension directions of the flat side surfaces of the heat radiation fins are slightly different, they can be regarded as extending in the same direction as long as the object or effect is not hindered. This is because no matter whether the angles of the extending directions of the flat side surfaces of the fins are slightly different, or the angles are not different if they are strictly parallel, the fins that should be restricted in the present invention face the same direction and do not overlap with each other. Significant difference.

Regarding the standard of the difference in angle, as long as the angle formed by the extending directions of the flat side surfaces of the heat radiation fins is 30 degrees or less, the heat radiation fins are considered to extend in the same direction. Conversely, when the angle formed by the extending directions of the flat side surfaces of the heat radiation fins exceeds 30 degrees, it cannot be considered that the heat radiation fins extend in the same direction as each other.

In FIGS. 1 to 7 to be described later, two heat dissipation fins are formed to extend in the same direction with the LED element 100 sandwiched between them, and are arranged in parallel with each other, so that the LED element 100 has a rectangular shape centered thereon. It surrounds the periphery in a shape, and adjacent cooling fins are arranged to be perpendicular to each other (cross at right angles). However, in the present invention, it is not limited to such an arrangement, and the LED element 100 may be encircled on a circle or an arc with the LED element 100 as a center point, and while changing the angles of the flat side surfaces sequentially, the The heat dissipation fins are arranged at intervals, for example, in a domino shape.

In addition, the number of fins extending in the same direction is specified as "in an arbitrary cross section perpendicular to the two surfaces 1021, 1022 of the substrate 102 (an arbitrary portion of the heat sink cut by the cross section in this direction In cross-section) is two or less" in order to prevent excessive overlapping of fins with respect to a certain direction in three-dimensional space. As will be described later, even if it is a single fin, there is an L-shape or There are a plurality of flat heat dissipation surfaces (radiation side surfaces) extending in different directions such as a Chinese character. Not only flat fins, but also fins having a plurality of heat dissipation surfaces with different extending directions or shapes, for example, the planar shape will be L-shaped or Each straight-line section in the shape of a letter is also regarded as a single fin, and the number of sheets in the same direction (overlapping condition) is observed. From this point of view, in any cross-section perpendicular to any one of the front and back surfaces of the substrate, by setting the number of fins extending in the same direction to two or less, it is possible to avoid the heat radiation fins from colliding with each other. The case where the heat dissipation side surfaces of the heat dissipation fins face each other and overlap each other. That is, this is because the above regulation is that, regardless of whether the heat dissipation surfaces of the fins are the same, the number of heat dissipation surfaces (radiation side surfaces) of the heat dissipation fins is regarded as the number of fins, and regardless of the number of two substrates 102 Regardless of the positions of the surfaces 1021 and 1022 , excessive overlapping is avoided, and the above-mentioned 2 sheets or less are required.

In this regard, when the number of fins extending in the same direction is tentatively defined as "two or less fins on either side 1021, 1022 of the substrate 102" as an expression different from the above-mentioned regulation, Specifies the absolute number of fins. Therefore, do not put the letter L or The heat dissipation surfaces of the font-shaped heat dissipation fins in different directions are regarded as the number of fins, and excessive overlapping may occur due to differences in the positions of the two surfaces 1021 and 1022 of the substrate 102 . Therefore, it is defined as "two or less sheets in any cross-section perpendicular to the two surfaces 1021 and 1022 of the substrate 102 (in any cross-section of the heat sink cut along the cross-section in this direction)".

Regarding the shape of the flat heat dissipation fins 103 to 106, in FIGS. 1 to 7, the overall shape or the shape of the flat side is shown as a rectangle (square), but it is also possible to select a plane shape that is not limited to the rectangle or three-dimensional shape. For example, as a case where a plurality of flat heat dissipation surfaces (radiation side surfaces) are extended in different directions (for example, 90 degrees or more), adjacent heat dissipation fins 103 and 104 or 105 and 106 may be integrated. L-shaped, adjacent cooling fins 103, 104, 103 or 105, 106, 105 integrated word shape. As long as it can be manufactured, it may have not only the above-mentioned flat heat dissipation surface (radiation side surface), but also an arcuate or curved heat dissipation surface (radiation side surface) or the overall shape. In addition, the shape and thickness of the plate thickness cross-section facing outward may be L-shaped or stepwise different in height position. Furthermore, it is also possible to appropriately select the case where the heat dissipation surface is formed in a surface shape such as a circle, a triangle, a polygon, or an indeterminate shape.

Hereinafter, specific embodiments of the present invention shown in FIGS. 1 to 7 will be described, and among them, the meaning of the definition of the number and arrangement of the flat heat dissipation fins 103 to 106 of the present invention will be described. That is, the significance of setting the total number of the flat heat dissipation fins 103 to 106 to preferably 2 to 8 will be described. In addition, among the above-mentioned heat dissipation fins 103 to 106, the number of fins extending in the same direction is also considered when the number of fins extending in the same direction is cut by a cross section in an arbitrary direction perpendicular to any one of the surfaces 1021 and 1022 of the substrate 102. Any cross section of 101 will be described in the sense that there are no more than two sheets.

The first embodiment of Fig. 1:

1, a total of four flat heat dissipation fins 103, 104 are provided on the side of the LED element mounting surface 1021 that supports the LED element 100 of the substrate 102, and each flat side surface of the heat dissipation fins 103, 104 is in contact with the substrate The surface 1021 of 102 is integrally and continuously provided. On the other side of the back surface 1022, no heat dissipation fins are provided, and only the flat back surface 1022 exists.

In addition, the heat dissipation fins 103 and 104 provided on the side of the above-mentioned LED element mounting surface 1021 are provided symmetrically with the LED element 100 sandwiched between them, and the heat dissipation fins 103 and 103 on the left and right sides of the figure and the figure are arranged symmetrically. The upper and lower heat radiation fins 104, 104 extend in the same direction and are arranged in parallel to each other. That is, the flat heat dissipation fins 103 , 103 and 104 , 104 facing each other are formed at positions sandwiching the LED element 100 on the front side of the LED element mounting surface 1021 . In addition, in the heat dissipation fins 103 and 104 described above, the number of fins extending in the same direction is in any cross section perpendicular to the surfaces 1021 and 1022 of the substrate 102 (the heat dissipation area cut by the cross section in this direction). In any cross-section of the device 101), there are 2 pieces.

In addition, adjacent heat dissipation fins 103 and 104 are formed and arranged to be perpendicular to each other (intersect at right angles), so as to enclose a rectangular shape (with the LED element 100 as the center) sandwiching the LED element 100 therebetween. The flat side surfaces of the cooling fins 103 and 104, which are peripheral in shape and have a high heat radiation rate, face the x direction and the z direction, respectively. In addition, the LED element mounting surface 1021 and the other rear surface 1022 of the substrate 102 having a large heat radiation rate face the y direction.

In addition, each surface 1023, 1024, 1025, and 1026 in the plate thickness (thickness) direction around the substrate 102 (1023 is the left side of the figure, 1024 is the lower side of the figure, 1025 is the right side of the figure, and 1026 is the upper side of the figure). The side) is relatively smaller in area than the above-mentioned surfaces 1021 and 1022 , but faces each of the x and z directions, and serves as a radiation surface for heat in the above-mentioned directions. In this regard, each surface (upper surface, both end surfaces) of each heat dissipation fin 103, 104 in the plate thickness (thickness) direction is also smaller in area than the above-mentioned flat side surface. However, the number of surfaces is large, and the upper surface and both end surfaces are 4 surfaces in total, facing each of the x, y, and z directions, and serving as radiation surfaces for heat in the above-mentioned directions.

Therefore, in the planar side surfaces of the heat dissipation fins 103, 104, although the radiating surfaces overlap each other in the pair of two facing surfaces on the side where the LED element 100 is mounted, the above-mentioned x, y, In any direction of the three-dimensional direction of z, the heat dissipation surfaces of the heat dissipation fins are not excessively repeated, and there is no waste of material. Therefore, the heat from the above-mentioned LED element 100 is continuously transferred to the back surface 1022, the side surfaces around the heat dissipation fins 103, 104, and the surface in the plate thickness direction through the mounting surface 1021 of the substrate 102 to form an effect of the continuous heat transfer surface. High heat radiation efficiency can be obtained due to the synergistic effect with the formation effect of the continuous heat dissipation surface that continuously radiates heat from the above-mentioned continuous heat transfer surface.

Number of cooling fins:

When the number of heat radiation fins extending in the same direction is further reduced so that only two fins are provided as a preferable lower limit in any cross section perpendicular to the surfaces 1021 and 1022 of the substrate 102, the Only one or both of the heat dissipation fins 103, 103 on the left and right sides of FIG. The heat sink fins are removed from the form. In this case, the heat dissipation fins 103, 103 on the left and right sides of FIG. keep a side.

On the other hand, when the number of flat heat dissipation fins increases, the heat dissipation surfaces of the heat dissipation fins overlap in one of the three-dimensional directions of x, y, and z, resulting in waste of materials, although space The occupancy rate is high, but the heat radiation efficiency (radiation efficiency) decreases. Therefore, the total number of heat dissipation fins provided on both the front and back surfaces 1021 , 1022 of the substrate 102 is set to be 8 or less, preferably in the range of 2 to 8 fins. However, in FIGS. 1 to 7, when only the same radiating fins 103 to 106 are directly separated and divided into several or finely separated and divided in the extending direction of the heat radiating side surfaces, it is regarded as 1 piece of the same cooling fin.

The problem when the total number of flat heat dissipation fins increases is as shown in the comparative example of FIG. 50 . In any cross-section perpendicular to the surfaces 1021, 1022, there are three or more sheets (in any cross-section of the heat sink 101 cut in a cross-section in an arbitrary direction perpendicular to the front and back surfaces 1021, 1022 of the substrate 102, there are 3 or more) in the case of such an excessive situation also occurs. In the comparative example of FIG. 50 , if the number of fins extending in directions parallel to each other on both front and back surfaces 1021 and 1022 of the substrate 102 is four, it becomes the same as that of the conventional example in FIG. 47 . A plurality of heat dissipation fins arranged in parallel are the same, and in one of the three-dimensional directions of x, y, and z, the heat dissipation surfaces of the heat dissipation fins are repeated, resulting in waste of materials. Although the space occupation rate is high, the heat radiation efficiency is reduced.

A first modified example of the first embodiment in FIG. 2:

The flat heat dissipation fins in FIG. 2 indicate that heat dissipation fins 105 and 106 are provided not only on one side of the LED element mounting surface (surface) 1021 of the substrate 102 as in FIG. 1 but also on the other side of the back surface 1022 of the substrate 102 Shape. Specifically, in addition to providing four flat heat dissipation fins 103 and 104 on one side of the LED element mounting surface 1021 of the substrate 102 in FIG. On the other hand, two heat radiation fins 105 and 106 are provided, totaling four, and a total of eight fins, which is a preferable upper limit of the number of fins, is provided.

The heat dissipation fins 105, 106 provided on the back surface 1022 side are exactly the same as the four plate-shaped heat dissipation fins 103, 104 provided on the LED element mounting surface 1021 side of the substrate 102, and are arranged in the vertical direction of the figure. form a symmetrical configuration. That is, two LED elements 100 are sandwiched between each of them symmetrically, and the heat dissipation fins 105, 105 on the left and right sides of the figure and the heat dissipation fins 106, 106 on the upper and lower sides of the figure are formed to face the same direction. The shape extending in the direction, and arranged in parallel to each other. That is, on the back surface 1022 side, the flat heat dissipation fins 105, 105 and 106, 106 facing each other and the flat heat dissipation fins 103, 103, 104, 104 on the front side of the LED element mounting surface 1021 are Similarly to each other, it is formed at a position sandwiching a position corresponding to the mounting position of the LED element 100 on the back side. In other words, the flat heat dissipation fins are formed on both the front and back surfaces of the substrate 102 at positions sandwiching the LED element 100 . In addition, among the above-mentioned radiating fins 105, 106, the number of fins extending in the same direction is within an arbitrary cross section perpendicular to the surface 1022 of the substrate 102 (in a heat sink cut along a cross section in this direction). 101 in any section) are 2 pieces.

In addition, the heat dissipation fins 105 and 106 surround such a rectangular shape centered on the mounting corresponding position of the LED element 100 on the rear surface 1022 in such a manner that the adjacent heat dissipation fins are perpendicular to each other (crossing at right angles), and the heat is not released. The plate-shaped side surfaces of the cooling fins 105 and 106 with high emissivity face the x direction and the z direction, respectively. In addition, the LED element mounting surface 1021 and the other rear surface 1022 of the substrate 102 having a large heat radiation rate face the y direction.

In addition, not only the surfaces 1023, 1024, 1025, and 1026 in the plate thickness direction around the substrate 102, but also the four flat-plate-shaped heat dissipation fins 103 and 104 are provided on the LED element mounting surface 1021 side of the substrate 102. Each surface in the plate thickness direction (upper surface, both end surfaces) and each surface (lower surface, both end surface) of the heat dissipation fins 105 and 106 on the back surface 1022 side in the plate thickness direction also serve as heat radiation surfaces. . Each surface in the plate thickness direction of each of the above-mentioned radiating fins is relatively small in area, but the number of surfaces on the upper and lower surfaces and both end surfaces is twice that of FIG. Each of the x, y, and z directions serves as a radiation surface for heat in the above-mentioned direction.

Therefore, in the situation of Fig. 2, in any direction of the above-mentioned three-dimensional directions of x, y, z, especially the heat dissipation surfaces of the heat dissipation fins are not repeated, and there is no waste of material. Although the space occupancy rate is low, heat can be obtained. high radiation efficiency.

The second, third and fourth modified examples of the first embodiment of Figs. 3, 4 and 5:

3, 4, and 5, the plate-shaped heat dissipation fins of the modified examples are shown in the following form: from the situation of FIG. Any cooling fin on the back side 1022 is omitted.

In the second modified example of FIG. 3 , with respect to the arrangement of the heat dissipation fins in FIG. 2 , the heat dissipation fin on the LED element mounting surface 1021 side of the substrate 102 is set to one of the two heat dissipation fins 104 on the lower side in the figure. 3 slices after omission. In addition, the heat radiation fins on the other side of the back surface 1022 are also three heat radiation fins 105 omitting one on the left side of the figure, and a total of six heat radiation fins are provided, and formed as shown in the figure. Arrangement of asymmetric cooling fins in the up and down direction.

In the third modified example of FIG. 4 , with respect to the arrangement of the heat dissipation fins in FIG. 2 , only the heat dissipation fins on the side of the LED element mounting surface 1021 of the substrate 102 are used, and the two heat dissipation fins 104 and 104 on the upper and lower sides of the figure are omitted. There are two heat dissipation fins 103, 103 on the left and right sides in the following figure. In addition, the other back surface 1022 side also has only two heat dissipation fins 105, 105 on the left and right sides in the figure, omitting the two heat dissipation fins 106, 106 on the upper and lower sides in the figure, and a total of four heat dissipation fins are provided. sheet, and maintain the configuration of the symmetrical heat dissipation fins in the vertical direction of the figure.

In the fourth modified example of FIG. 5 , only the heat dissipation fins on the side of the LED element mounting surface 1021 of the substrate 102 are used with respect to the arrangement of the heat dissipation fins in FIG. The two heat dissipation fins 103 and 103 on the left and right sides of the following figure are the same as those in FIG. 4 . In addition, the heat radiation fins on the other side of the back surface 1022 are only two heat radiation fins 106, 106 on the upper and lower sides of the figure after omitting the two heat radiation fins 105, 105 on the left and right sides of the figure, and are provided in total. Four heat dissipation fins are formed in an asymmetrical heat dissipation fin arrangement in the vertical direction of the drawing.

Fifth and sixth modified examples of the first embodiment shown in FIGS. 6 and 7:

The heat sink 101 for LED lighting shown in FIGS. 6 and 7 represents an implementation in which the substrate 102 (surfaces 1021 and 1022 ) and flat heat dissipation fins 103 to 105 are integrally formed from a thin metal plate such as aluminum with a fixed thickness. Way.

In this case, the plate-shaped heat dissipation fins 103 to 105 are bent from the end side of the substrate 102 toward the z direction (vertical direction in the figure) which is the direction in which the respective surfaces extend, and are formed integrally with the material. In the fifth modified example of FIG. 6 , the fins 103 , 103 , 104 , and 104 are bent upward in the figure so as to face each other. In the sixth modified example of FIG. 7 , the fins 104 , 104 are bent upward in the figure so as to face each other, and the fins 103 , 103 are bent downward in the figure so as to face each other. 6 is the same as that of FIG. 1, and FIG. 7 is the same as that of FIG. However, since the heat dissipation fins 103 and 104 are formed by bending the end of the substrate 102 , they are arranged differently at the ends of the substrate 102 .

The principle and function of heat dissipation:

The principle (function) of heat dissipation when such a heat sink 101 of the present invention is installed in a space without air convection and LED lighting is performed will be described. When the LED element 100 mounted on the LED element mounting surface 1021 is made to emit light, the heat (heat flux) Q emitted from the LED element 100 is transferred to the substrate through the mounting part (not shown) at the bottom of the LED element 100 accompanying this. The LED component mounting surface 1021 of 102 is conductive. Then, the heat Q conducted to the LED element mounting surface 1021 is directed not only to the heat dissipation fins 103, 104 on the mounting surface 1021 side, but also to the back surface 1022, and the heat dissipation fins 105, 106 on the back surface 1022 side at approximately the same height. Horizontal and continuous and rapid (without hysteresis) transmission (conduction) with the above-mentioned heat dissipation surfaces. Therefore, convection from the heat dissipation surface of the above-mentioned fins, and in particular heat dissipation by radiation is equally performed at a certain level or more, so that heat dissipation efficiency can be improved.

Here, as specified in the present invention, among the heat dissipation fins 103 to 106 , the number of fins extending in the same direction is two in any cross section perpendicular to the surfaces 1021 and 1022 of the substrate 102 . Below, there will be no excessive overlap in the same direction. Therefore, the above-mentioned transferred heat Q is respectively directed to the three-dimensional directions of x, y, and z, and is rapidly transferred from the mounting surface 1021, the back surface 1022 of the substrate 102, the surfaces of the heat dissipation surfaces of the heat dissipation fins 103 to 106, etc. to the surroundings. The enclosed space (heat dissipation space) radiates effectively. Therefore, the heat emitted from the LED element 100 is dissipated in any three-dimensional x, y, and z directions with high radiation efficiency with a heat dissipation amount equal to or greater than a certain level. This is because, although the heat sink 101 of the present invention has a small number of heat dissipation fins 103 to 106, in a closed heat dissipation space in a lighting fixture with little air convection whose heat dissipation efficiency is dominated by radiation, relative to x, Each projected area in each of the y and z directions is large. The heat sink 101 of the present invention has excellent characteristics in that it has a good heat dissipation efficiency per unit area of heat dissipation despite having a simple structure with a small number of heat dissipation fins 103 to 106 .

Here, when it is necessary to dispose in a narrow space or a closed space of a housing for vehicle lighting and to dissipate heat by radiation, the projected areas in the x, y, and z axis directions (three-dimensional directions) shown in each figure The size determines its efficiency, the larger the projected area, the higher the heat radiation efficiency.

Regarding this point, since the heat sink 4 of the conventional example or the comparative example shown in FIG. 47 has a projected area in the y direction equal to the sum of the plane of the substrate 2 and the plane above the fins 3, the fins 3 do not overlap each other. , so there is no waste of material, and the projected area is large. However, the projected area in the z direction is the sum of the side surfaces of the substrate portion 2 and the fin portion 3, which is comb-shaped and has a lot of space, so it does not satisfy the value obtained by multiplying the length of the substrate portion 2 by the height of the fin portion 3. A small area of 50% of the total area. In addition, the projected area in the x direction is the total of the front surface of the substrate part 2 and the front surface of the fin part 3, and although there are, for example, four fin parts 3, they are repeated, so that the projected area is the same as that of one fin part, resulting in a waste of material. More, the radiation efficiency of heat per cooling area is low. That is, in the x direction, a plurality of fins overlap to occupy a space, and although the space occupancy ratio is high, the projected area is small, and the radiation efficiency of heat is low. Furthermore, the number of fins in the x-direction is excessive, and the waste of material due to the excess fins is also large, and there is also a problem that the weight becomes heavy.

In other words, the radiation efficiency of heat in one of the x, y, and z axis directions (three-dimensional directions) of the heat sink 4 of the conventional example or the comparative example shown in FIG. 47 is always low. As a result, the heat radiation efficiency in one of the three-dimensional directions cannot be improved, and therefore the total heat radiation efficiency becomes low. In addition, in the above-mentioned x direction and the like, the number of fins is excessive and waste of material is also large. That is, the above-mentioned prior art is similar in that it cannot be formed in any three-dimensional arbitrary direction of the heat sink without waste of material, and has a high heat radiation efficiency despite a low space occupation.

In addition, regarding this point, Japanese Patent Application Laid-Open No. 2010-146817 is also the same, and in a plurality of arrays In the direction where the heat dissipation part of the word-shaped handle part repeats, the space occupation rate is high, but the heat radiation efficiency is low. From the perspective of the total heat radiation efficiency in three three-dimensional directions, there is a lot of material waste in the x direction. . In addition, the width of the slit-shaped opening has a large restriction for ensuring the size of the heat sink itself or the area on the side of the heat sink, so it must be narrow, so it is suitable for use in closed spaces. When it is inside, the improvement of heat dissipation efficiency through air convection cannot actually be performed as expected.

The heat sink of the present invention is most suitable in a use (installation) state where the surrounding heat dissipation space is closed, the volume is small, and there is almost no air convection, and the use (installation) environment where heat dissipation by air convection is hardly expected. In such a use environment, in order to dissipate heat, it is necessary to focus on dissipating heat through radiation. In the above-mentioned existing heat sink structure that uses convection of air as the main heat dissipation performance by increasing the heat dissipation surface area of fins, etc., by The heat dissipation by this radiation is insufficient, and effective heat dissipation cannot be realized as a whole. On the other hand, in the heat sink of the present invention, heat dissipation by radiation of heat from the heat dissipation surface such as the heat dissipation side surface is the main body, and it can be said that it is most suitable for use where heat dissipation by convection of air can hardly be expected (installation ) ambient heatsink.

In addition, since the heat dissipation surfaces including the LED element mounting surface 1021 and the heat dissipation fins have an integral structure without a bonding surface between them, there is no thermal contact resistance that occurs when the two are bonded separately. Therefore, the heat conduction between the LED element mounting surface 1021 and each heat dissipation surface is easy, and as a result, the heat dissipation performance of the entire heat sink is remarkably improved. Furthermore, since the structure of the heat sink 101 is such that the heat dissipation fins are oriented in each of the three-dimensional x, y, and z directions, the rigidity is high. Therefore, even in an application subject to vibrations such as in-vehicle lighting, the shape can be maintained without using a special reinforcement member, etc., and maintenance-free and long life can be achieved.

The same items as the first embodiment including the modifications:

On the mounting surface 1021, the back surface 1022, and the heat dissipation surfaces of the heat dissipation fins 103-106 of the substrate 102 described above, according to the use or installation position of the heat sink 101, the above-mentioned Surface cutting processing, or three-dimensional forming processing such as unevenness or steps are provided to provide spaces for component mounting, slits, or partial shapes. In addition, part of each side surface may be omitted or the shape may be changed in accordance with needs such as component mounting or the like.

Radiator 101 of the present invention does not complicate the shape and structure of the radiator, especially the shape and structure of the heat dissipation fins, and does not increase the number of heat dissipation fins. On the contrary, it simplifies the structure and reduces the number of heat dissipation fins. Under the circumstances, an excellent heat dissipation effect can be achieved. As a result, various materials, manufacturing methods, and manufacturing steps can be selected, and an inexpensive and easy-to-manufacture heat sink can be provided. Raw materials, materials such as aluminum (pure aluminum) or aluminum alloy, copper (pure copper) or copper alloy, steel plate, resin, ceramics and other raw materials can be selected, or drawing processing, bending processing, die casting or casting using plates as raw materials , forging, extrusion and other manufacturing methods or manufacturing processes.

(aluminum)

Among them, aluminum (pure aluminum) or an aluminum alloy is preferable as a raw material having strength, rigidity, weight reduction, corrosion resistance, heat transferability, heat dissipation, workability, etc., which are essential properties of the heat sink 101 . Aluminum (pure aluminum) or aluminum alloy is preferably 1000-series pure aluminum specified in AA or JIS standards, which has particularly high thermal conductivity and heat dissipation properties required for the radiator.

Considering the weight reduction, necessary strength, rigidity, and drawing workability (formability) of the heat sink, the board thickness (thickness) of the substrate 102 and the fins 103 to 106, or the board thickness (thickness) when the raw material is a thin metal plate Preferably, it is selected from the range of 0.4 mm to 4 mm. When the plate thickness is too thin, the required strength, rigidity, or workability (formability) of the heat sink cannot be ensured. On the other hand, when the plate thickness is too thick, the weight reduction of the heat sink will be sacrificed.

(Surface emissivity of cooling surface)

In the heat sink of the present invention, in order to obtain high heat dissipation, it is preferable that the surface emissivity ε of the thin metal plate is 0.6 or more. Therefore, prior to drawing, the entire surface of the base metal sheet can be precoated with a paint such as black, gray, or white that has a high heat dissipation rate (coating film). Alternatively, post-coating treatment (coating film) of the above-mentioned paint having a high emissivity may be performed after drawing. Accordingly, it is possible to increase the amount of heat transferred by radiation as a heat sink. If this precoating treatment is performed on the raw metal thin plate before drawing, it will also function as a lubricant during drawing.

The emissivity ε is the ratio of the theoretical value of the heat radiation of the actual object (the heat radiation of a black body as an ideal heat radiator), and the actual measurement can be carried out using the method described in Japanese Patent Application Laid-Open No. 2002-234460, It can also be measured with a commercially available portable radiation rate measuring device.

(Assembly to car lights)

It is also an advantage that the heat sink of the present invention can be mounted to the vehicle-mounted LED lamp or the like in the same manner as conventional heat sinks. Generally, an on-vehicle LED lamp (lamp for a vehicle) includes: an LED substrate mounted with an LED element as a light source; a reflector that reflects light from the LED toward the front of the light irradiation direction; a housing that surrounds the above-mentioned LED substrate and reflector; an external lens of transparent material enclosing the open front end of the housing; a heat sink configured in thermal contact with the LED substrate. The reflector is formed of a resin material and has a parabolic reflective surface having a focal point near the LED on the LED substrate. Here, the heat sink of the present invention is used as the above-mentioned LED substrate or a heat sink arranged in thermal contact with the LED substrate. In this case, as a vehicle-mounted LED lamp, the radiator of the present invention does not dissipate heat through convection of the air in which heat is transferred to the air like conventional radiators, but mainly dissipates heat through radiation of heat. It is quite different from existing radiators.

Example

The radiators of various shapes corresponding to the first modified example of FIG. 6 and FIG. 2 of FIG. 1, the conventional example of FIG. 47, and the comparative example of FIG. 50 are actually manufactured, and LED elements are assembled, and current is applied to make the LED elements After emitting light, the temperature of the LED element is measured. The results are shown in Table 1.

The above-mentioned first modified example in FIG. 2 , the conventional example in FIG. 47 , and the comparative example in FIG. 50 are manufactured from extruded rods of JIS 1100 series aluminum as raw materials by machining such as cutting. . The heat sink of the inventive example shown in FIG. 6 of FIG. 1 is manufactured by press forming, and the end portion of a JIS 1100-series aluminum cold-rolled sheet is bent into fins.

In each example, the rectangular shape of the substrate is 100mm (z direction) x 100mm (x direction) x 2mm thickness, and the rectangular shape of the heat dissipation fin is 70mm (the length of the flat side surface in the z direction) x 30mm (Height in the y direction of the flat side surface) x plate thickness 2mm. Among the distances between parallel cooling fins in the example of the invention, the distance between 103 and 103 on the left and right sides, and the distance between 104 and 104 on the upper and lower sides is 80 mm or more (the distance from the center of the LED element is 35 mm or more). The distance between adjacent heat dissipation fins in the conventional example and the comparative example was 10 mm. In addition, in each example, a commercially available black cationic resin film was electrodeposition-coated on the surface. The surface emissivity at this time was 0.85 in each example when measured with a commercially available portable emissivity measuring device developed by JAXA.

As in each example, after mounting a commercially available LED element on a substrate, a current of 3.7 V and 0.85 A was applied from a DC power supply to cause the LED element to emit light. At this time, the temperature of the LED element is monitored by a thermocouple, and the heat sink is sealed and placed in a wooden cylinder of 300 mm × 300 mm × 300 mm that simulates the closed space without air convection of the vehicle-mounted LED lamp. The LED elements emit light in a room atmosphere of 20°C. Then, after a certain period of time, the temperature in a steady state without rising or falling is measured. The measurement was performed five times in each example, and the average temperature was obtained and evaluated.

As shown in Table 1, it can be confirmed that the inventive examples 1 and 2 corresponding to FIG. 6 of the above-mentioned FIG. 1 and the first modified example corresponding to FIG. The temperature of the LED element at the time can also be kept at an extremely low temperature below 100°C and below 42°C, which does not reduce the luminous efficiency of the element. It has excellent heat dissipation performance obtained by heat radiation ( cooling performance). In addition, compared with Invention Example 1 in FIG. 6 in which the number of fins is 4, Invention Example 2 in FIG. 2 in which the number of fins is as large as the upper limit of 8 is of course excellent in heat dissipation performance, but the weight becomes heavier. , there is little difference in the cooling efficiency.

On the other hand, it can be confirmed that in the heat sinks of FIG. 47 and similar conventional examples 1 and 2, and the comparative example of FIG. 50, although the temperature of the LED element at the time of stabilization is below the allowable temperature of 100°C, it can be confirmed that the temperature is higher than that of the inventive example. , In the closed space without air convection of the car LED lamp, the heat dissipation performance (cooling performance) obtained by the radiation of heat is poor. It should be noted that the above series of tests did not take into account the heat input from the engine, heat exchanger, various electrical equipment, heat input from direct sunlight, etc. when it is assumed to be mounted on an actual vehicle. Therefore, it is considered that the temperature of the LED element is lower than that of an actual on-vehicle LED (LED mounted on a real vehicle). However, the series of tests described above have sufficient accuracy and reproducibility for performance comparison of heat sinks.

Based on the above facts, the critical significance of the heat sink of the present invention, especially the number and arrangement of the fins, has been confirmed.

[Table 1]

As mentioned above, the heat sink of the present invention mainly dissipates heat through heat radiation from the heat dissipation surface such as the heat dissipation side surface, and is most suitable for a narrow use space where there is almost no air convection (heat dissipation by air convection can hardly be expected). (use, installation environment) of the radiator. Therefore, it can be used as a heat dissipation member for a vehicle lighting fixture such as an on-vehicle LED lamp.

(Second Embodiment)

FIG. 8 shows a heat sink 201 for LED lighting according to a second embodiment. The radiator 201 for LED lighting is made of a plate-shaped aluminum material. It is characterized in that the radiator 201 for LED lighting is integrally formed by bending the blank 241 of the aluminum material. The horizontal plane part 211 and the vertical front part 221 , 222 are composed of alternately continuous stepped substrate portions 202 , and mounting portions 203 for LED elements are formed on the horizontal planar portion 211 and/or the vertical front portions 221 , 222 of the substrate portion 202 . Among them, the horizontal planar portion 211 constitutes the mounting surface of the present invention, the vertical front portions 221 and 222 constitute the first fin portion of the present invention, and the vertical side portions 231 to 236 described later constitute the second fin portion of the present invention.

Specifically, as shown in FIG. 8 , the heat sink 201 is composed of a substrate portion 202 formed of a plate-shaped aluminum (including its alloy) material having a constant and equal wall thickness, and has a stepped profile as a whole. shape. That is, the base plate portion 202 is formed into a shape (structure) in which, starting from the upper portion of the step, vertical frontal portions 221 , horizontal planar portions 211 , and vertical frontal portions 222 having the same rectangular shape are formed in the order of vertical frontal portions 222 at right angles to each other. The horizontal plane part and the vertical front part are alternately continuous and integrated. A protruding LED element mounting portion 203 is provided at the center of the surface of the horizontal flat portion 211 of the substrate portion 202 .

In addition, side plate portions 204 perpendicular to the base plate portion 202 are integrally provided at the ends of the heat sink 201 on both sides of the base plate portion 202 . That is, on both sides of the vertical front portion 221 on the upper portion of the substrate portion 202, there are vertical side portions 231 and 232 arranged continuously toward the rear at right angles to the front portion 221, respectively. In addition, the end portions on both sides of the horizontal planar portion 211 of the substrate portion 202 respectively have vertical side portions 233 and 234 arranged continuously downward at right angles to the horizontal planar portion 211 . Further, on both sides of the vertical front portion 222 at the lower portion of the base plate portion 202, there are vertical side portions 235 and 236 arranged continuously in front of the front portion 222 at right angles to the front portion 222, respectively.

The above-mentioned thicknesses of the base plate portion 202 and the side plate portion 204 constituting the heat sink 201 depend on the overall size and the like, but are generally preferably 0.5 to 5 mm from the viewpoints of rigidity, heat dissipation, and weight reduction.

The aluminum material is not particularly limited, but JIS1000-series pure aluminum, JIS3000-series aluminum alloys, JIS5000-series aluminum alloys, etc., which are excellent in thermal conductivity and formability, are preferably used.

Hereinafter, a method of manufacturing the heat sink 201 according to the second embodiment will be described based on FIG. 9 .

First, as shown in the upper diagram of FIG. 9 , a plate-shaped aluminum coil 240 produced by rolling is punched to obtain a plane corresponding to a developed view corresponding to the three-dimensional shape of the heat sink 201 in FIG. 8 . 1 blank 241 of the shape. This blank 241 has a rectangular shape as a whole, as shown in the lower view of FIG. 9 , and has cutouts 242 at two places on both sides, a total of four places. The notch 242 is located at a position that divides the length of the blank 241 into thirds, and has a band shape extending in parallel at a predetermined length from the end of the blank 241 on the long side to the center. In addition, instead of the aluminum coil 240, the plate material manufactured by rolling may be used.

Next, a rectangular parallelepiped LED element mounting portion 203 bulging upward is formed at the center of the surface of the blank 241 by imprinting.

Next, each portion of the blank 241 is bent. In the lower diagram of FIG. 9 , the plane of the blank 241 is divided and the same symbols as those corresponding to the names of the parts constituting the three-dimensional shape of the heat sink 201 in FIG. 8 are described. 202 is a base plate part, and 204 is a side plate part. The dotted line portion is the boundary line of each continuous part, and represents the bending line (crease line) at the time of bending processing.

Here, first, the 221 face, the 231 face, and the 232 face of the blank 241 are integrally bent upward at right angles around the bending line 243 that becomes the boundary line between the 221 face and the 211 face, and the 222 face and the 235 face are The 236 face is integrally bent downward at right angles around the bending line 243 that becomes the boundary line of the 222 face and the 211 face, thereby forming the vertical front part 221 at the top and the horizontal plane part 211 at the middle of FIG. 8 and the vertical front portion 222 at the lower portion constitute alternately continuous substrate portions 202 in a stepped shape. Then, the 231 face and the 232 face are bent at right angles to the rear (downward in FIG. 9 ) centered on the bending line 243 that becomes their respective boundary lines with the 221 face, thereby forming the vertical front as shown in FIG. 8 The vertical side part 231 and the vertical side part 232 which are continuous with the vertical front part 221 are the two side ends of the part 221. Next, the 235 and 236 faces are bent forward (downward in FIG. 9 ) at right angles centered on the bending line 243 that is their respective boundary lines with the 222 face, thereby forming the vertical front in FIG. 8 The vertical side portions 235 and 236 are continuous with the vertical front portion 222 at both end portions of the portion 222 . And, the 233 face and the 234 face are bent downward at right angles around the bending line 243 that becomes their respective boundary lines with the 211 face, thereby forming the horizontal plane portion 211 in FIG. The horizontal plane portion 211 is continuous with the vertical side portion 233 and the vertical side portion 234 .

By the above-mentioned bending process of the blank 241, manufacture of the heat sink 201 for LED lighting of embodiment of FIG. 8 is completed. In addition, the order of the processing of each part in the bending process of the blank 241 for manufacturing the heat sink 201 of this embodiment is not specifically limited to the above-mentioned method. The heat sink 201 can be fabricated similarly by appropriately changing the order of processing.

In this way, the heat sink 201 for LED lighting according to the embodiment shown in FIG. In addition, since the structure is composed of thin plates, it is extremely lightweight and maintains sufficient rigidity. In addition, compared with conventional die-cast heat sinks, the production cost can be significantly reduced.

Next, taking the embodiment shown in FIG. 8 as an example, and using FIG. 10 , the principle and function of heat dissipation when the radiator 201 of the present invention is installed in a closed space without air convection for LED lighting will be described. Here, the radiation direction of heat Q from each part is indicated by arrows, and the surrounding closed space is indicated by S.

First, when the LED element mounted on the LED element mounting portion 203 of the horizontal plane portion 211 is made to emit light, the heat emitted from the LED element is conducted to the horizontal plane portion 211 through the LED element mounting portion 203 . Next, the heat conducted to the horizontal plane part 211 is conducted to the vertical front parts 221 , 222 and the vertical side parts 233 , 234 . In addition, the heat Q conducted to the horizontal plane part 211 is radiated from the front and back of the horizontal plane part 211 to the surrounding closed space (radiation space) S in a direction perpendicular to it (up and down in the figure, the arrow of the heat Q from the back side is omitted). Then, the heat Q transmitted to the vertical front parts 221 and 222 is radiated from the space S where the front and back of the vertical front parts 221 and 222 face their right angles (the front and rear directions in the figure, the arrows of the heat Q coming from the back of 222 are omitted). Then, the heat Q conducted to the vertical side portions 233 and 234 is radiated from the surfaces of the vertical side portions 233 and 234 to the spaces S in respective perpendicular directions (right and left directions in the figure, arrows of the heat Q from the back side are omitted).

On the other hand, part of the heat Q conducted to the vertical front part 221 is conducted to the vertical side parts 231, 232, and is directed from the front and back sides of the two side parts to the surrounding space S in a perpendicular direction (right and left directions in the figure). radiation. In addition, part of the heat Q conducted to the vertical front portion 222 is conducted to the vertical side portions 235 and 236 , and is radiated from the front and back sides of the two side portions to the surrounding space S in a perpendicular direction (right and left directions in the figure).

It should be noted that, among the vertical side parts 231-236, 231 and 232, 233 and 234, and 235 and 236 face each other, so compared with the horizontal plane part 211 or the vertical front parts 221 and 222, the heat dissipation by radiation is less. . This is because, for example, in terms of 231 and 232, the heat Q from the surface of 231 (the right surface of the figure) and the surface of 232 (the left surface of the figure) is directly radiated to the surrounding space S in the respective right-angled directions to sufficiently dissipate heat. , while on the other hand, the heat Q radiated from the back of 231 (the left surface of the figure) to the right angle direction and the heat Q radiated from the back of 232 (the right surface of the figure) to the right angle direction intersect and absorb heat from each other , hindering heat dissipation to the surrounding space S.

In this way, it can be seen that the heat sink in FIG. 8 is composed of a stepped substrate portion 202 in which the horizontal planar portion 211 and the vertical front portions 221, 222 are alternately continuous, and there are vertical side portions 231-236 at both end portions of the substrate portion 202. Therefore, even in a closed heat dissipation space where the efficiency of heat dissipation is dominated by radiation and is difficult to generate convection, the projected area relative to the directions of x, y, and z, that is, the three-dimensional direction, is very large, so the radiation efficiency is high, and it has excellent heat dissipation sex.

Next, a first modified example of the second embodiment having the same overall shape as that of the second embodiment shown in FIG. 8 will be described. Although the heat sink itself of the first modified example of the second embodiment is not shown, only the stepped substrate portion 202 (horizontal plane portion 211, vertical front portion 221, and vertical front portion 222) in FIG. The vertical side portions ( 231 , 232 , 233 , 234 , 235 , 236 ) provided at the ends of both sides of the substrate portion 202 have different thicknesses, but have the same shape as the heat sink in FIG. 8 .

A first modified example of the second embodiment will be specifically described based on FIG. 11 showing the form of the blank after imprinting.

The blank 241 has a rectangular shape as a whole, and has notches 242 at two places on both sides, a total of four places, and this blank 241 is composed of a thick substrate part 202 in the center and a thin wall on both sides. The side plate portion 204 is made of blanks with different wall thicknesses in the width direction.

The production method of the blank 241 will be described: two types of plate-shaped aluminum coils having different wall thicknesses produced by rolling are prepared, and the thicknesses obtained by punching or cutting them respectively are 1 The single plate and the two thin plates are welded to integrate them. 244 represents a welded portion. Further, a strip-shaped notch portion 242 extending in parallel with a predetermined length from the end portion to the center side is provided penetratingly at a position that divides the length into thirds.

The heat sink 201 according to the first modified example of the second embodiment can be easily produced by performing the bending process described in the second embodiment on the blank 241 . The heat sink 201 of the first modified example of the second embodiment is characterized in that it has the same three-dimensional shape as the heat sink shown in FIG. The wall thickness of the horizontal planar portion 211 and the vertical front portion 222 is thicker than that of the side plate portion 204 , that is, the vertical side portions 231 , 232 , 233 , 234 , 235 and 236 . Specifically, it is preferable that the thickness of the substrate portion 202 is 0.5 to 5 mm, and the thickness of the side plate portion 204 is 0.25 to 2.5 mm.

According to the first modified example of the second embodiment, compared with the heat sink of the second embodiment shown in FIG. Maintaining a high thermal conductivity can further improve the heat dissipation.

Next, based on FIG. 12 showing the shape of the imprinted blank as above, a second modified example of the second embodiment having the same overall shape as the second embodiment in FIG. 8 will be specifically described. The blank 241 has a rectangular shape as a whole, and has notches 242 at two places on both sides, four places in total. The blank made of the side plate portion 204 has the same shape as the shape described above as the blank. However, this blank 241 is different from a blank obtained by welding and integrating plates obtained from two types of plate-shaped aluminum coils having different thicknesses.

That is, the blank 241 is formed of an aluminum extruded material having a thick base plate portion 202 in the center and thin side plate portions 204 on both sides. In order to manufacture the blank 241 , it is only necessary to perform extrusion using a die corresponding to the cross-sectional shape, and then provide the notch 242 . In addition, the heat sink 201 according to the second modified example of the second embodiment can also be easily produced by performing the bending process described in the second embodiment on the blank 241 .

Compared with the heat sink of the second embodiment shown in FIG. The thermal conductivity can be maintained higher, and the heat dissipation can be further improved. And, in addition, without punching or welding, a homogeneous and integral blank 241 with different wall thicknesses in the width direction can be produced by extrusion, so the manufacturing process of the heat sink is the same as that of the heat sink shown in FIG. 9 . Compared with the production process, it becomes simple.

The heat sink in FIG. 8 shows a basic overall shape, and the second embodiment is not limited thereto. For example, the radiator of FIG. 8 has a stepped stepped shape consisting of three surfaces formed by vertical front portions 221, 222 and the horizontal plane portion 211 between them, but in order to further increase the projected area to the heat dissipation space, It is configured with four or more sides, and the order is two or more. In addition, in FIG. 8 , the horizontal planar portion 211 and the vertical front portions 221 and 222 constituting the step shape are all the same rectangle (rectangular shape) with the same length and width, but it is also possible to change their length and width. A shape in which different rectangles are alternately continuous can be a shape in which the width, depth, and height of the steps (1st step) are different. In addition, the steps may be irregular-shaped steps that are shifted in the width direction (left and right) according to the steps.

In addition, in FIG. 8 , it is shown that vertical side portions 231, 232, vertical side portions 233, 234, and vertical side portions 235, 236 are provided on both sides of the vertical front portion 221, the horizontal plane portion 211, and the vertical front portion 222, respectively. However, all or one side of the vertical side portions 231, 232 and 235, 236 located at both ends of the vertical side portions 221, 222 may be omitted.

Next, a third modified example of the second embodiment whose overall shape is different from the second embodiment shown in FIG. 8 will be described based on FIG. 13 .

Here, the heat sink for LED lighting according to the third modified example of the second embodiment is composed of a substrate portion 202 made of plate-shaped aluminum having a fixed and equal thickness, similarly to the second embodiment in FIG. 8 . (including its alloy) material, and the whole has a stepped shape. The difference with the form of FIG. 8 is that firstly, as the structure of the base plate portion 202, there is also a horizontal plane portion 212, which is arranged continuously toward the rear of the vertical front portion 221 at right angles thereto, so that the base plate The portion 202 has a two-stage staircase shape.

Next, in the heat sink according to the third modified example of the second embodiment, the structure of the side plate portions 204 provided at both end portions of the base plate portion 202 is largely different from FIG. 8 . The end portions on both sides of the horizontal planar portion 212 have vertical side portions 231 and 232 that are arranged at right angles thereto and continuously arranged downward to the lowest end (the lower end position of the vertical front portion 222 ). In addition, vertical side portions 2331 and 2332 are arranged at right angles to both ends of the vertical front portion 221 and are continuously arranged forward to the middle of the entire width of the horizontal planar portion 211 (two-thirds of the width). In addition, vertical side portions 2333 and 2334 are continuously arranged downwardly at right angles to the end portions on both sides of the horizontal planar portion 211 .

In addition, overlapping flange portions 251 and 252 are provided at respective upper and lower positions of the vertical side portions 231 and 232, and the overlapping flange portions 251 and 252 protrude forward to circumscribe and cover the vertical side portions 2331 and 2332 and 2333 and Part of the surface of 2334 (rear side). In addition, an overlapping flange portion 253 is provided at the central portion of each of the vertical side portions 2333 and 2334, and the overlapping flange portion 253 protrudes forward to circumscribe and cover a part of the surface of the vertical side portions 235 and 236 (rear side). ).

Hereinafter, based on FIG. 14, the manufacturing method of the heat sink 201 which concerns on the 3rd modification of the said 2nd Embodiment is demonstrated.

First, as shown in the upper diagram of FIG. 14 , the plate-shaped aluminum coil 240 produced by rolling is punched to obtain a planar shape corresponding to a developed view corresponding to the three-dimensional shape of the radiator 201 in FIG. 13 . 1 piece of blank 241. This blank 241 has a T-shape as a whole as shown in the lower view of FIG. 14 , and six cutouts 2421 to 2423 in total are provided around the periphery. That is, there is one notch 2421 at both lower parts of the head 241a (both sides in front of the figure), and two notches 2422 and 2423 are respectively provided at both sides of the main body 241b. The notch 2421 is formed in a double key shape, the notch 2422 is formed in a belt shape, and the notch 2423 is formed in a single key shape.

Next, a rectangular parallelepiped LED element mounting portion 203 bulging upward is formed at the center of the surface of the blank 241 by imprinting.

Next, each portion of the blank 241 is bent. In the lower diagram of FIG. 14 , the plane of the blank 241 is divided and the same symbols as those corresponding to the names of the parts constituting the three-dimensional shape of the heat sink 201 in FIG. 13 are described. 202 is a base plate part, and 204 is a side plate part. The dotted line portion is the boundary line of each continuous part, and represents the bending line (crease line) at the time of bending processing.

Here, first, the surface 221, the surface 2331, the surface 2332, the surface 212, the surface 231, and the surface 232 of the blank 241 are integrally bent upward at right angles around the bending line 243 which becomes the boundary line between the surface 221 and the surface 211. . Then, the 222 face, the 235 face, and the 236 face are integrally bent downward at right angles around the bending line 243 that is the boundary line between the 222 face and the 211 face. Then, the 212 face, the 231 face, and the 232 face are integrally bent rearward (downward in FIG. 14 ) at a right angle around the bending line 243 that is the boundary line between the 212 face and the 221 face. In this way, from the upper part of FIG. 13 , the substrate parts 202 are alternately and continuously stepped in the order of the horizontal planar part 212 , the vertical front part 221 , the horizontal planar part 211 and the vertical front part 222 .

After the step-shaped substrate portion 202 is formed, the 235 and 236 surfaces are bent forward (upward in FIG. 14 ) at right angles centered on the bending line 243 that is their boundary line with the 221 surface. , thereby forming vertical side portions 235 and vertical side portions 236 continuous with the vertical front portion 222 at both end portions of the vertical front portion 222 in FIG. 13 . Then, the 2333 face and the 2334 face are bent downward at right angles around the bending line 243 that is their respective boundary line with the 211 face, thereby forming the horizontal plane portion 211 in FIG. The horizontal plane portion 211 is continuous with the vertical side portion 2333 and the vertical side portion 2334 .

By this molding, the overlapping flange portion 253 of the 2333 face and the 2334 face overlaps and joins the surfaces of the 235 face and the 236 face, respectively. That is, as shown in FIG. 13 , the overlapping flange portion 253 of the vertical side portion 2333 and the vertical side portion 2334 covers and joins a part (rear side) of the vertical side portion 235 and the vertical side portion 236, and the joint portion becomes a double. layer structure.

Next, the 2331 face and the 2332 face are bent forward (upper in FIG. 14 ) at a right angle centered on the bending line 243 that becomes their respective boundary lines with the 221 face, thereby forming the vertical front portion shown in FIG. 13 The vertical side portions 2331 and 2332 are continuous with the vertical front portion 221 at both end portions of the 221 .

Then, the 231 face and the 232 face are bent downward at right angles around the bending line 243 which is the respective boundary line between them and the 212 face, thereby forming the horizontal plane portion 212 in FIG. The horizontal plane part 212 is continuous with the vertical side part 231 and the vertical side part 232 .

By this molding, the overlapping flange portion 251 of the 231 face and the 232 face overlaps with the surfaces of the 2331 face and the 2332 face respectively, and the overlapping flange portion 252 of the 231 face and the 232 face overlaps with the 2333 face respectively. It coincides with the surface of 2334's face in a state of contact. That is, as shown in FIG. 13 , the overlapping flange portion 251 on the top of the vertical side portion 231 and the vertical side portion 232 covers the vertical side portion 2331 and a part (rear side) of the vertical side portion 2332 and overlaps them. The overlapping flange portion 252 at the bottom of the vertical side portion 231 and the vertical side portion 232 covers a part (rear side) of the vertical side portion 2333 and the vertical side portion 2334 and overlaps with them, and the above-mentioned overlapped portion has a double-layer structure.

By the bending process of the blank 241 mentioned above, manufacture of the heat sink 201 for LED lighting of the 3rd modification of the 2nd embodiment shown in FIG. 13 is completed. The processing sequence of each part in the bending process of the blank 241 used for the production of the heat sink 201 is not particularly limited to the above-mentioned method as in the second embodiment of FIG. 8 . However, since the situation of the third modified example of the second embodiment is more complicated than the structure of FIG. 8 , it is necessary to pay attention to the fact that the bending of the vertical side portion having the overlapping flange portion is performed after the processing of the vertical side portion on the joined side. Carry out a fixed processing sequence to avoid mutual interference between parts during bending.

According to the third modified example of the second embodiment, compared with the heat sink of the second embodiment shown in FIG. By increasing their areas, the projected area relative to the three-dimensional direction is further increased, so the radiator has higher radiation efficiency and better heat dissipation. In addition, since the overlapping flange portions 251 to 253 are respectively formed on the vertical side portions 231 and 232, 2333 and 2334, they are overlapped and joined and connected with other vertical side portions 2331 and 2332, 2333 and 2334, 235 and 236. Therefore, the heat generated from the LED element is rapidly conducted to the ends of the separated vertical side parts (fins) and radiated, thereby exhibiting higher heat dissipation. And, by overlapping the above-mentioned vertical side portions, the overlapped portion becomes a double-layer plate structure, so compared with the one-piece structure in FIG. .

It should be noted that, in the third modified example of the second embodiment, the vertical side parts are overlapped with each other through the overlapping flange part, but it is not limited to this, and the vertical side part and the base plate part 202 may also be A structure in which the horizontal planar portion or/and the vertical frontal portion overlap.

In addition, in the third modified example of the second embodiment, the double-layer structure of the vertical side parts may be further joined by screw fastening, rivet fastening, caulking fastening, welding, brazing, etc., The rigidity of the heat sink can be greatly improved by integrally combining the materials of the two layers.

(third embodiment)

FIG. 15 shows a heat sink 301 for LED lighting according to a third embodiment. The heat sink 301 for LED lighting is formed by an aluminum plate 302, and is characterized in that it has horizontal planar parts 311, 312 and vertical front parts 321, 322 alternately and continuously stepped, and is assembled on the surface of the horizontal planar part or/and the vertical front part. There are LED elements 300 . Among them, the horizontal planar portion 312 constitutes the mounting surface of the present invention, the vertical front portions 321 and 322 constitute the first fin portion of the present invention, and the vertical side portions 331 to 338 described later constitute the second fin portion of the present invention.

Specifically, as shown in FIG. 15 , a heat sink 301 of the third embodiment is formed of an aluminum (including its alloy) plate 302 having a constant wall thickness, and has a stepped shape as a whole. That is, in the case of the drawing, it is a two-stage stepped shape, formed of an aluminum plate 302, and the overall basic shape has a stepped shape. That is, in the case of the figure, it is in the form of a two-step staircase, and from the upper part of the stairs, the horizontal plane part 311, the vertical front part 321, the horizontal plane part 312, and the vertical front part 322 are formed at right angles to each other. The shape (structure) formed by alternating and continuous horizontal planar parts and vertical frontal parts.

The above-mentioned horizontal planar parts 311, 312 and vertical front parts 321, 322 are all rectangles, and the length of the rectangle is the same as the width of the stepped aluminum plate 302 as the long side, and the length of the aluminum plate is divided into four equal widths. for the short side.

300 is an LED element mounted on the central portion of the horizontal plane portion 312 .

Furthermore, in the horizontal planar portion and the vertical front portion, vertical side portions 331 and 332 are provided at both end portions of the horizontal planar portion 312 and the vertical front portion 321 at right angles to them, that is, vertically. The vertical side portions 331 , 332 are squares with the width of the horizontal planar portions 311 , 312 and the vertical front portions 321 , 322 as one side.

Next, the principle and effect of heat dissipation when LED lighting is performed by installing the heat sink 301 having such a stepped shape in a space without air convection will be described. When the LED element 300 mounted on the horizontal plane portion 312 is made to emit light, the heat emitted from the LED element 300 is conducted to the horizontal plane portion 312 through the mounting portion of the LED element 300 . Next, the heat transferred to the horizontal plane part 312 is transferred to the vertical front part 321 , the vertical front part 322 , and the vertical side parts 331 and 332 . In this way, the heat conducted to the horizontal planar portion 312 is conducted to two or more vertical front portions or vertical side portions continuous with the horizontal planar portion 312 . In addition, the heat Q conducted to the horizontal plane part 312 is also radiated from the entire front and back of the horizontal plane part 312 to the closed space (radiation space) S around it in the right angle direction (up and down direction in FIG. 15 ), and is conducted to the vertical front part. The heat Q of 321 is radiated from the entire surface and back of the vertical front part 321 to the space S in the right angle direction (the left and right direction in FIG. The entire surface radiates to the space S in their perpendicular directions (right and left directions in FIG. 16 ). It should be noted that, from the side facing the LED element 300 of the vertical side portion 331 (the left surface of FIG. 15 ), the side of the vertical side portion 332 facing the LED element 300 (the right surface of FIG. 15 ) is also to the left and right of the figure, respectively. The direction of heat dissipation is carried out, but the heat dissipation from 331 to the left is absorbed by the right surface of 332, and the heat dissipation from 332 to the right is absorbed by 331, so there is little heat dissipation by radiation from the above two sides.

In addition, part of the heat Q conducted to the vertical front part 321 is conducted to the horizontal plane part 311, and is radiated from the entire front and rear surfaces of the horizontal plane part 311 to the surrounding space S in a right angle direction (up and down in FIG. 15 ). . It should be noted that the heat transferred to 312 , 321 , 322 , 311 , 331 , and 332 is mutually conducted from a higher heat level to a lower heat level.

In this way, as shown in FIG. 15, it can be seen that the heat sink has a stepped shape, and vertical side portions are also provided on both sides of the horizontal plane portion and the vertical front portion constituting the stepped shape. Even if the heat dissipation efficiency of the heat sink is dominated by radiation In the closed heat dissipation space without air convection, the projected area with respect to the x, y, and z directions, that is, the three-dimensional direction is also very large, so the radiation efficiency is high, and it has excellent heat dissipation. In addition, since the projected areas of the heat sink do not overlap in the radiation direction to the heat dissipation space, the heat dissipation efficiency per heat dissipation unit area is good, and a simple structure can be formed. In addition, by having two or more vertical front portions or vertical side portions continuous from the horizontal flat portion 312 on which the LED element is mounted, the heat emitted by the LED element is conducted in multiple directions from the LED mounting surface, so the heat is rapidly dissipated, Furthermore, since radiation from each surface is promoted, it has excellent heat dissipation.

Next, a method of manufacturing a heat sink having the shape shown in FIG. 15 will be described.

First, using pure aluminum or aluminum alloy as a raw material, a pure aluminum plate or an aluminum alloy plate having a predetermined thickness is produced by processing such as rolling (these are simply referred to as aluminum plates in the present invention). The length L of the manufactured aluminum plate is four times the size of the short side of the rectangle of 311 (312, 321 and 322 are all the same) in Figure 15, and its width W is to add 331 (332 is also the same) Likewise) the dimensions of one side of the square to get the dimensions.

Next, the aluminum plate of the L×W size manufactured by the rolling process is divided into four rectangles in the length direction, except for the first and the second from one end of the four rectangles. , The parts on both sides of the fourth one are targeted, and the length corresponding to the size of one side of the square of 331 (332 ) in FIG. 15 is cut and removed. Through this cutting process, the aluminum plate 302 of FIG. 15 is obtained. This aluminum plate 302 is composed of three short rectangles with widths (long sides) corresponding to 311, 321, and 322 and one side with 331, 332 added to the width of 312. The width (total width) of the long rectangle constitutes.

The short rectangular part of the horizontal plane part 311 of the aluminum plate 302 is bent at right angles to the rectangular part of the vertical front part 321 with their boundary line as the center, and the rectangular part of the horizontal plane part 312 is bent relative to the vertical The rectangular part of the front part 321 is bent at right angles to the side opposite to the horizontal plane part 311 with their boundaries as the center, and the rectangular part of the vertical front part 322 is bent relative to the bent horizontal plane part 312. The rectangular parts are further bent at right angles to opposite sides centering on their boundary lines. Thereby, a stepped shape as a basic shape can be formed.

And, finally, the vertical side portion 331 and the square portion of the vertical side portion 332 located on both sides in the width direction of the rectangular portion of the long horizontal plane portion 312+vertical side portion 331+vertical side portion 332 are arranged relative to the horizontal plane portion 312. The rectangular portions of each are bent at right angles to the face side of the vertical front portion 321 with their boundaries with the horizontal planar portion 312 as centers. In this way, the heat sink 301 of the present invention shown in FIG. 15 can be easily produced by using the aluminum plate 302 as a raw material and adopting relatively simple processing methods such as cutting and bending.

As a method of manufacturing the aluminum plate 302, rolling was mentioned and demonstrated, but it is not limited to this, You may use other processing methods, such as extrusion.

The heat sink 301 in FIG. 15 is an embodiment showing a basic overall shape, and the third embodiment is not limited thereto. For example, the heat sink in FIG. 15 has a two-step stepped shape, but the number of steps may be three or more in order to further increase the projected area to the heat dissipation space. In addition, in FIG. 15 , the horizontal planar portions 311, 312 and the vertical front portions 321, 322 constituting two steps of steps are all the same rectangles with equal length and width, but they may also be adjusted for their length and width. A shape in which different rectangles are changed alternately and continuously can be a shape in which the width, depth, and height of the steps (1 step) are different from each other. In addition, the steps may be irregular-shaped steps that are shifted in the width direction (left and right) according to the steps.

In addition, in FIG. 15 , the case where the vertical side parts 331 and 332 are provided on both sides of the horizontal planar part 312 and the vertical front part 321 is shown, but the vertical side parts do not need to be located on both sides of the stepped shape, and can be located only One side, and not limited to one or both sides of the horizontal plane portion 312 and the vertical front portion 321, may also be on one or both sides of the horizontal plane portion 312 and the vertical front portion 322, the horizontal plane portion 311 and the vertical front portion 321 side has. In addition, the vertical side portion may be arranged perpendicularly to only both sides (or one side) of the above-mentioned horizontal plane portion or the vertical front portion, that is, including two horizontal plane portions 311 as shown in FIG. 15 . A structure protruding vertically above the side ends, a structure protruding vertically in front of both end portions of the vertical front portion 322 , and the like.

In addition, the vertical side portions 331 and 332 of FIG. 15 are obtained by bending the rectangular aluminum plate composed of the horizontal planar portion 312+vertical side portion 331+vertical side portion 332 at right angles to the same direction as described above, and are formed with the horizontal The planar part 312 is integrally continuous and can be easily formed by cutting and bending the plate material, so it is preferable, but it is also possible to prepare separate plates of the vertical side parts 331, 332 in advance, and to form the vertical front part of the stepped main body. Both ends of 321 are vertically arranged and welded to both ends of vertical front portion 321 .

In addition, in FIG. 15, the wall thickness of the aluminum plate 302 forming each of the face parts 311, 321, 312, and 322 is constant, but for the horizontal plane portion 312 where the LED element 300 is mounted, the wall thickness of the mounting portion is partially thickened. It is vaild. FIG. 17 shows this example, and is a side cross-sectional view of the mounting portion of the LED element 300 on the horizontal plane portion 312 .

Here, the thickness of the horizontal plane part 312 is the same as that of the other surface parts 321, 312, and 322 except for the mounting part of the LED element 300, but the mounting part is formed so that the back side of the horizontal plane part 312 faces downward. The bulging thick wall portion 3121 . In this way, by making the wall thickness of the mounting portion of the LED element 300 of the horizontal plane portion 312 thick, a large amount of heat generated on the horizontal plane portion 312 is rapidly transferred to the surrounding thin wall portion 3122 during lighting, and Radiate from the front and back of the horizontal plane part 312 to the upper and lower heat dissipation spaces, and also conduct to and radiate from the adjacent and continuous surfaces 321, 322, 331, 332 adjacent to the horizontal plane part 312, and radiate from these surfaces. The overall heat dissipation efficiency can be further improved, and if it has such a shape, its manufacture is also easy.

Based on FIGS. 18 to 21 , an installation state in a case where the LED lighting radiator 301 described above is applied to a headlight of an automobile will be described. 18 shows a perspective view of the state installed on the headlight, FIG. 19 shows a cross-sectional view of FIG. 18 a-a, FIG. 20 shows a cross-sectional view of b-b of FIG. 18, and FIG. 21 shows a cross-sectional view of c-c of FIG.

Here, the heat sink 301 is formed of an aluminum plate 302, and has a stepped shape (two steps) composed of a vertical front portion 321, a horizontal plane portion 311, a vertical front portion 322, and a horizontal plane portion 312 from above, and the horizontal plane Both end portions of the horizontal plane portion 311 and the vertical front portion 322 , and both end portions of the horizontal planar portion 312 and the vertical front portion 322 have vertical side portions 331 , 332 and 333 , 334 , respectively. In addition, there are vertical side parts 335 and 336 protruding downwards (protruding) on both side ends of the horizontal planar part 312, and there are (protruding) vertical side parts 336 protruding rearward on both ends of the vertical front part 321, respectively. of) vertical side portions 337,338. Here, the vertical side parts 331, 332 are formed by bending the extended parts on both sides of the horizontal planar part 311 downward at right angles, and become the same plane as the side surfaces of the housing 340, and the vertical side parts 333 are formed by bending the parts extended on the vertical front side. The part extending to both sides of the portion 322 is bent forward at a right angle, and is arranged on the outer side of the side surface of the housing 340 in a state of overlapping. The vertical side parts 335 and 336 are formed by bending the parts extended to both sides on the horizontal planar part 312 downward at right angles, and the vertical side parts 337 and 338 are formed by bending the parts Parts are bent backwards at right angles.

300 is an LED element as a light source mounted on the upper surfaces of the upper and lower horizontal planar parts 311 and 312, and 350 is a reflector (omitted in FIG. 18 ) provided on the inner surface side of the upper and lower vertical front parts 321 and 322, Also, 360 is the external lens.

In addition, the radiator 301 is loaded into the casing 340 in a state in which the frame-shaped casing 340 is placed on the stepped radiator. The housing 340 is stepped, and has a curved opening corresponding to the substantially arc shape at the front of the housing 340 . Vertical side portions 335 , 336 and 337 , 338 of the radiator integrated with the case 340 are respectively fixed and supported by attachment portions (not shown) of the vehicle body. An external lens 360 made of transmissive glass having the same shape as the curved opening of the housing 340 is fitted.

The outer surfaces of the vertical front portion 321 , the horizontal plane portion 311 , the vertical front portion 322 , and the horizontal plane portion 312 of the radiator 301 face the closed space S inside the vehicle body. In addition, the inner and outer surfaces of the vertical side portions 331 , 332 , 335 , 336 and 337 , 338 of the heat sink also face the space S. As shown in FIG.

In such an installation state, when the LED element 300 emits light and illuminates as a headlight of a motor vehicle, the heat generated by the light emission of the LED element 300 is radiated from each face portion 311, 312, 321 constituting a stepped shape. , 322 and the inner and outer surfaces of the vertical side portions 331 to 338 at both ends thereof dissipate heat toward the closed space (radiation space) S in the surroundings facing each other. Furthermore, the heat dissipation is performed by a heat sink with high radiation efficiency having a heat dissipation surface with a very large projected area in the three-dimensional directions of the x, y, and z axes, so that heat dissipation can be performed very effectively in a narrow space with little air convection.

(Fourth embodiment)

FIG. 22 shows a heat sink 401 for LED lighting according to a fourth embodiment. The heat sink 401 for LED lighting is formed by extruded aluminum, and is characterized in that it is composed of a substrate portion 402 and a fin portion 403. The back side of the part 402 protrudes at intervals, and a plurality of fin parts 403 are arranged in parallel. At least one part of the fin part 403 of each fin part 403 is a fin part bent piece bent at a right angle from the fin part main body 403a. 403b, the bent fin part 403b has a heat dissipation surface in a direction perpendicular to the heat dissipation surface of the fin part main body 403a and the heat dissipation surface of the substrate part respectively. Wherein, the base plate part 402 constitutes the mounting surface of the present invention, the fin part 403 and the fin part main body 403a constitute the first fin part of the present invention, and the fin part bending piece 403b constitutes the second fin part of the present invention.

Specifically, the heat sink 401 for LED lighting of the fourth embodiment (hereinafter, may be simply referred to as the heat sink 401.) is made of aluminum with excellent thermal conductivity and formability, such as JIS1000-series pure aluminum and JIS6000-series aluminum alloy. Based on extruded aluminum extruded material, it is manufactured by applying relatively simple processing such as cutting and bending. In addition, other aluminum alloy materials such as JIS5000 series aluminum alloy materials may be used for manufacture. In addition, the manufacturing method is mentioned later.

As shown in FIG. 22, the heat sink 401 of the fourth embodiment is composed of, for example, a substrate portion 402 and a fin portion 403. The LED light source 400 is arranged and fixed on the front side (shown on the lower side in FIG. 22 ) of the substrate portion 402. The fin portion 403 protrudes at intervals from the back side of the substrate portion 402 and is arranged in parallel in plural. In the fin portion 403 described above, a part of at least one fin portion 403 is a fin portion bent piece 403b bent at a right angle from the fin portion main body 403a. It should be noted that, the LED light source 400 is formed by mounting, for example, a plurality of light emitting diode (LED) elements on a substrate with an aluminum alloy as a base.

The fin bent piece 403b has a heat dissipation surface in a direction perpendicular to the heat dissipation surface of the fin body 403a and the heat dissipation surface of the substrate portion 402, respectively. That is, the heat dissipation surface of the substrate portion 402, the heat dissipation surface of the fin portion main body 403a, and the heat dissipation surface of the fin portion bent piece 403b are mutually orthogonal to each other in different directions (y-axis direction, x-axis direction, z-axis direction). ) of the cooling surface.

FIG. 23 shows a plan view, a front view, and a side view of a heat sink 401 according to the fourth embodiment, and FIG. 49 shows a plan view, a front view, and a side view of a conventional heat sink 4 . It can be seen that in the heat sink 401 shown in FIG. 23 , it can be confirmed that a sufficient projection area can be ensured in the top view, front view, and side view, but in the heat sink 4 shown in FIG. 49 , only the front view cannot ensure sufficient projection area. area.

In the fourth embodiment shown in FIG. 22 , four fins 403 protrude in parallel at intervals from the back side of the substrate 402 , and among the four fins 403 , two fins on both sides Both ends of 403 are bent at right angles from the fin main body 403 a toward both side edges of the substrate 402 to form fin bent pieces 403 b.

The number and shape of the above-mentioned fin portions 403 do not need to be the same as those in the embodiment shown in FIG. 22 . The number of fins 403 may be multiple, that is, at least two or more. In addition, when there are three or more fins 403, the fins 403 formed with fin bending pieces 403b may be It is not necessary to have two fins 403 on both sides, for example, as shown in FIG. 24( c ), a bent fin 403 b may be formed on the central fin 403 . Modifications of the heat sink 401 formed in various shapes are illustrated in FIG. 24 .

Next, a method of manufacturing the heat sink 401 for LED lighting according to the fourth embodiment will be briefly described. As described above, the heat sink 401 for LED lighting of the present invention is manufactured based on an aluminum extruded material having excellent thermal conductivity and formability by using JIS1000-series pure aluminum or JIS6000-series aluminum alloy. Extruded metal raw materials.

For example, in the case of manufacturing the heat sink 401 shown in FIG. 22 , first, an aluminum extruded material (the same shape as the conventional LED lighting heat sink shown in FIG. 47 ) manufactured by extrusion molding is prepared, and The lower edges of both ends of the fins 403 on both sides of the aluminum extrusion (positions in contact with the base plate 402 ), that is, the lower edges of a total of four locations of the fins 403 on both sides are cut from both sides. Cuts of appropriate depth. Then, the portions where the lower edge of the fin portion 403 is notched are bent at right angles toward both side edge directions (outer directions) of the substrate portion 402 to form the fin portion bent pieces 403b. It should be noted that the lower edge has no notch and is not folded in the middle part to become the fin part main body 403a.

The radiator 401 for LED lighting described above is used as a radiator 401 for automotive lighting such as headlights of automobiles or embedded lighting of buildings, etc., but FIGS. The use state of the heat sink 401 for LED lighting. As shown in FIG. 25 and FIG. 26 , the heat sink 401 is attached in a state where the substrate portion 402 constitutes the rear portion of the housing 410 that is a frame of the LED lighting, that is, constitutes a part of the housing 410 . In this manner, when the heat sink 401 is mounted in a state of being housed in the housing 410 , the fin portion 403 protrudes into a closed space without air convection on the rear side of the LED lighting. It should be noted that 420 is a translucent external lens installed on the front of the LED lighting.

In this way, when the fin portion 403 of the heat sink 401 protrudes into the closed space and is used as the heat sink 401 for LED lighting, the heat generated when the LED light source 400 emits light is transferred from the heat sink 401 to the closed airless space. Heat dissipation in convective space. As shown in the top view, front view, and side view of FIG. 23, the heat sink 401 for LED lighting of the present invention can ensure a sufficient projected area in the x-axis direction, y-axis direction, and z-axis direction, so even in such a closed space The heat dissipation can also make the heat dissipation be carried out effectively.

(fifth embodiment)

FIG. 27 shows a heat sink 501 for LED lighting according to a fifth embodiment. The heat sink 501 for LED lighting is formed by extruded aluminum, and is characterized in that it is composed of a substrate portion 502 and a fin portion 503. The substrate portion 502 is arranged and fixed with an LED light source 500 on the front side. The back side of the portion 502 protrudes at intervals, and a plurality of sheets are arranged in parallel, and the substrate portion 502 has an L-shape bent in a direction perpendicular to the longitudinal direction of the fin portion 503 . Among them, the base plate portion 502 constitutes the mounting surface of the present invention, the side 503a extending in one direction of the fin portion 503 constitutes the first fin portion of the present invention, and the side 503b extending in the other direction of the fin portion 503 constitutes The second fin portion of the present invention.

Specifically, the heat sink 501 for LED lighting of the fifth embodiment (hereinafter, may be simply referred to as the heat sink 501.) is made of aluminum with excellent thermal conductivity and formability, such as JIS1000-series pure aluminum and JIS6000-series aluminum alloy. Based on extruded aluminum extruded material, it is manufactured by applying relatively simple processing such as cutting and bending. In addition, other aluminum alloy materials such as JIS5000 series aluminum alloy materials may be used for manufacture.

As shown in FIG. 27 , the heat sink 501 of the fifth embodiment is composed of a substrate portion 502 and a fin portion 503 , and the substrate portion 502 is disposed on the front side (in FIG. 27 , the surface on the right side of the corner). The LED light source 500 is fixed, and the fin portion 503 protrudes from the back side of the substrate portion 502 at intervals, and a plurality of fin portions 503 are arranged in parallel.

The base plate portion 502 has a so-called L-shaped plate shape bent in a direction perpendicular to the longitudinal direction of the fin portions 503 arranged in parallel. By bending the base plate portion 502, a fin portion 503 having a first fin portion 503a and a second fin portion 503b extending in a direction perpendicular to the base plate portion 502 is formed. The second fin portion 503b extends in a direction perpendicular to the base plate portion 502 and extends in a direction intersecting with the first fin portion 503a. In this embodiment, the fin part 503 is bent outward together with the base part 502, but because the bent part of the fin part 503 is elongated, it may affect the bending process of the base part 502, so it is necessary to The protruding dimension of the fin portion 503 is shortened so as not to hinder the bending process.

It should be noted that the LED light source 500 is formed by mounting, for example, a plurality of light emitting diode (LED) elements on a substrate with an aluminum alloy as the base.

FIG. 28 shows a first modified example of the heat sink 501 of the fifth embodiment. This heat sink 501 is also composed of a base plate portion 502 and a fin portion 503 similarly to the heat sink 501 shown in FIG. ) arranges and fixes the LED light source 500 , and the fin portion 503 protrudes from the back side of the substrate portion 502 at intervals, and a plurality of fins are arranged in parallel.

The base plate portion 502 has a so-called L-shaped plate shape bent in a direction perpendicular to the longitudinal direction of the fin portions 503 arranged in parallel. In this embodiment, the fin part 503 is bent inward together with the base part 502, but since the bent part of the fin part 503 is compressed, it may affect the bending process of the base part 502, so it needs to be shortened. The protruding dimension of the fin portion 503 is to avoid obstacles to the bending process.

FIG. 29 shows a second modified example of the heat sink 501 of the fifth embodiment. This heat sink 501 is also composed of a base plate portion 502 and a fin portion 503 similarly to the heat sink 501 shown in FIG. ) arranges and fixes the LED light source 500 , and the fin portion 503 protrudes from the back side of the substrate portion 502 at intervals, and a plurality of fins are arranged in parallel.

The base plate portion 502 has a so-called L-shaped plate shape bent in a direction perpendicular to the longitudinal direction of the fin portions 503 arranged in parallel. In this embodiment, the fin portion 503 is bent outward together with the base plate portion 502, but direct bending will hinder the bending process of the base plate portion 502, so before performing the bending process of the base plate portion 502, A linear notch 504 reaching the outer surface of the substrate portion 502 is provided at the bent portion of the fin portion 503 . In this way, after forming the slit 504 on the fin portion 503, the bending process of the substrate portion 502 is performed, so it is not necessary to shorten the protruding dimension of the fin portion 503 as in the embodiment shown in FIG. 27 . Compared with LED lighting, heat dissipation from LED lighting can be performed more effectively. Moreover, the fin part 503 is divided into the 1st fin part 503a of one side and the 2nd fin part 503b of the other side by the notch 504. As shown in FIG.

FIG. 30 shows a third modified example of the heat sink 501 of the fifth embodiment. This heat sink 501 is also composed of a substrate portion 502 and a fin portion 503 similarly to the heat sink 501 shown in FIG. ) arranges and fixes the LED light source 500 , and the fin portion 503 protrudes from the back side of the substrate portion 502 at intervals, and a plurality of fins are arranged in parallel.

The base plate portion 502 has a so-called L-shaped plate shape bent in a direction perpendicular to the longitudinal direction of the fin portions 503 arranged in parallel. In this embodiment, the fin portion 503 is bent inward together with the base plate portion 502, but direct bending will hinder the bending process of the base plate portion 502, so before performing the bending process of the base plate portion 502, A V-shaped notch 505 having an angle reaching the outer surface of the substrate portion 502 of 90 degrees or more is provided at the bent portion of the fin portion 503 . In this way, after the V-shaped notch 505 is formed on the fin portion 503, the substrate portion 502 is bent. Therefore, it is not necessary to shorten the protruding dimension of the fin portion 503 as in the embodiment shown in FIG. 28 . Compared with the illustrated embodiment, heat dissipation from LED lighting can be performed more effectively. Moreover, the fin part 503 is divided into the 1st fin part 503a of one side and the 2nd fin part 503b of the other side by the notch 505. As shown in FIG.

The heat sink 501 for LED lighting described above is used as a heat sink 501 for in-vehicle lighting such as headlights of automobiles or embedded lighting of buildings, etc., but FIGS. The radiator 501 is used as the state of use of the radiator 501 for LED lighting of the headlight of a motor vehicle. FIGS. 33 and 34 show that the radiator 501 of the embodiment shown in FIG. The use state of the radiator 501 for lighting.

It should be noted that the use state of the radiator 501 shown in Figure 27 is the same as that of the radiator 501 shown in Figure 29, and the use state of the radiator 501 shown in Figure 28 is the same as that of the radiator 501 shown in Figure 30, so Its description is omitted.

As shown in FIGS. 31 and 32 , the heat sink 501 shown in FIG. 29 is attached to the corner of the LED lighting with the L-shaped substrate portion 502 constituting a part of the housing 510 which is the frame of the LED lighting. In this way, even if it is a narrow place with space constraints where the conventional heat sink 4 having a flat plate-shaped substrate 2 as shown in FIG. 501 (the same applies to the heat sink 501 shown in FIG. 27 ), then it can also be installed.

520 is a translucent external lens mounted on the front of the LED lighting, and 530 is a reflector that reflects light radiated from the LED light source 500 toward the external lens 520 side.

As shown in FIGS. 33 and 34 , the heat sink 501 shown in FIG. 30 is mounted in a state where one of the L-shaped substrate portions 502 constitutes a part of the housing 510 which is the housing of the LED lighting. In this way, even if it is a narrow location with space constraints where the conventional heat sink 4 having a flat plate-shaped substrate 2 as shown in FIG. 501 (the same applies to the heat sink 501 shown in FIG. 28 ), then it can also be installed.

In this way, when one piece of the board part 502 is mounted in a state that constitutes a part of the housing 510 of the LED lighting, the other part of the board part 502 becomes the same as the fin part 503 from the LED lighting to the outside (in the case of a motor vehicle, The internal space in the engine hood) protrudes, and the surface area of the L-shaped base plate portion 502 and the fin portion 503 can ensure a sufficient heat dissipation area, so that a sufficient heat dissipation amount can be ensured.

It should be noted that although the usage state is not particularly shown in the drawings, the heat sink 501 shown in FIGS. 28 and 30 can also be attached to corners of complex shapes with space constraints.

(sixth embodiment)

FIG. 35 shows a heat sink 601 for LED lighting according to a sixth embodiment. The first characteristic of the heat sink 601 for LED lighting is that the aluminum alloy thin plate is formed into a fin shape of continuous waves 602 and 603 by corrugation. In addition, the second feature of the heat sink 601 for LED lighting is that, before the corrugation process, the surface of the aluminum alloy thin plate is pre-coated with an emissivity ε of 0.7 or more. Furthermore, the third feature of the heat sink 601 for LED lighting is that the corrugations 602 and 603 are provided with stepped portions 604 to 607 formed by crushing a part of the corrugations 602 and 603 . Among them, the stepped parts 604-607 constitute the mounting surface of the present invention, and the waves 602 and 603 constitute the first and second fin parts of the present invention.

FIG. 35 is a perspective view showing a heat sink 601 according to a sixth embodiment, and FIG. 36 is a plan view of FIG. 35 . In addition, FIG. 37 is a perspective view showing a heat sink 601 according to a first modified example of the sixth embodiment, and FIG. 38 is a plan view of FIG. 37 .

The aforementioned FIGS. 35 to 38 show a heat sink 601 formed into a fin shape with continuous waves 602 and 603 by corrugating a raw aluminum alloy thin plate 601a which is precoated with black paint. A precoat treatment film 610 is preliminarily applied on the surface. Here, corrugation means corrugation of a flat plate or a smooth tube as is well known. The pre-coating film 610 of black paint is an extremely thin surface coating film, so it is indicated only by the number 610, but this pre-coating film 610 is pre-coated (covered) on the entire surface (both sides) of the aluminum alloy sheet 601a or the necessary surface portion (including one side).

In the heat sink 601 in FIGS. 35 to 38 , the waveforms 602 and 603 are alternately connected. However, in the waveforms 602 and 603 of FIGS. 37 and 41 , a height difference is provided at the central portion of the heat sink 601 in the longitudinal direction (the left-right direction in the figure), and the left and right waveforms have different heights from each other with the central portion as a boundary. Corresponding to the design of the space in the radiator 601 or the arrangement of the space in the vehicle-mounted LED lamp, such a height difference is provided, so that in the corrugation process, not only can the overall shape of the continuous waveforms 602 and 603 be as shown in Fig. 35 and Fig. 36 The whole is a uniform shape of a rectangular shape, and can be formed into a deformed shape as shown in FIGS. 37 and 41 .

Heat sink fin wave shape:

In FIGS. 35 to 38 , heat dissipation fins = waveforms 602 and 603 having the same width and height alternately and continuously repeat at the same pitch. Here, the waveforms 602 and 603 are connected to each other, and the direction of the concavities and convexities is the direction of the convex parts or the concave parts that differ by 180 degrees. More specifically, they are elements of continuous waveforms or units of waveforms. are waveforms 602 and 603 .

Here, the width a of the waveform 602, the width b of the waveform 603, the distance p between the waveforms 602 and 602 or the waveforms 603 and 603, the width w and the height h of the waveforms 602 and 603 (radiator 601), the continuous waveform 602, The length l of 603 (radiator 601 ) is designed to correspond to the specifications of the installed vehicle LED lights, so as to meet the required heat dissipation characteristics of the radiator 601 .

Now, when the usage ranges of the LED lamps on board of general passenger cars are illustrated, the width a of the waveform 602 and the width b of the waveform 603 are in the range of 1 to 20 mm, and the waveforms 602, 602 or the waveforms 603, 603 The distance p between each other is in the range of 4 to 40 mm, the width w of the waveforms 602 and 603 (radiator 601) is in the range of 50 to 250 mm, and the height h is in the range of 10 to 60 mm, and the continuous waveforms 602 and 603 (radiator 601) The length l is in the range of 30-250mm. In addition, the design boundary values (upper and lower limit values) of the above-mentioned waveforms 602 and 603 are also defined in terms of the forming limits of the waveforms of the raw aluminum alloy thin plate 601 a by corrugation. That is, when the design values of the above-mentioned waveforms 602 and 603 are too small, or conversely too large, the corrugation itself cannot be performed.

Pre-coat treatment:

In FIGS. 35 to 38 , a precoating process (coating film) 610 of black paint with a high heat dissipation amount having an emissivity ε of 0.7 or higher is previously applied to the entire surface of the raw aluminum alloy thin plate 601 a. Accordingly, it is possible to increase the heat transfer amount or the radiation heat dissipation amount transferred by radiation as the heat radiation fins=waveforms 602 and 603 (radiator 601 ).

In addition, this precoating also functions as a lubricant in the corrugation of the raw aluminum alloy thin plate 601a, and also has the effect of improving the formability of the fins = corrugations 602, 603. Therefore, in the present invention, corrugation Before processing, the raw material aluminum alloy thin plate 601a is pre-coated with black paint.

In order to increase the thermal emissivity of the fins=corrugations 602, 603, the emissivity ε of the pre-coating treatment (coating film) 610 applied to the surface of the raw aluminum alloy thin plate 601a is 0.7 or more. When the emissivity ε is less than 0.7, although the above-mentioned lubricating effect is obtained, the amount of heat transfer or radiation heat transfer by radiation as heat dissipation fins = waveforms 602, 603 (radiator 601) decreases, and it is different from that of the uncoated bare The aluminum alloy sheet 601a has little difference.

The emissivity ε is the ratio of the theoretical value of the thermal radiation of the actual object (the thermal radiation of the ideal thermal radiation body, that is, the black body), and the actual measurement can be measured by the method described in Japanese Patent Application Laid-Open No. 2002-234460 , can also be measured by a portable radiation rate measuring device developed by the Aerospace Exploration Agency. Hereinafter, the measuring method described in the said gazette is demonstrated. The emissivity ε was measured with the emissivity measuring device shown in FIG. 46 . In FIG. 46, the emissivity measuring device 620 basically consists of an electric heater 621 covered with a black paint layer 622 on the lower surface, a cooling bed 624 arranged at a fixed distance below the electric heater 621, and surrounding the above-mentioned components. The thermal insulation layer 623 constitutes. In addition, the outer surface of the waveform 602 of the measurement object of the radiator 601 is arranged on the upper side on the cooling bed 624, and according to the input power or the temperature rise of the cooling water 625 in the cooling bed 624 (cooling water amount and rising temperature), Measure the temperature and temperature rise of the radiator 601 relative to the fixed heat Q radiated from the electric heater 621 (through the heat Q1), and use the following formula 1 to measure the waveform 602 outer surface of the radiator 601. In the present invention The radiation rate ε2 specified in .

[Formula 1]

---Formula 1

(Where, Q1: passing heat of Al alloy radiator 601, σ: Stefan-Boltzmann constant 5.67×10 ^-8 W/m ² K ⁴ , T1: temperature of black paint layer 610, T2: temperature of radiator 601 temperature, ε1: the emissivity of the black paint layer 622 is 0.9, ε2: the emissivity of the outer surface of the waveform 602 of the radiator 601)

Formation of steps:

In the present invention, as a preferred form, a portion of the heat dissipation fin=corrugations 602 , 603 is crushed to form a step portion (step difference, unevenness). This stepped portion serves as a component mounting portion or component mounting portion (mounting surface) when mounted as a heat sink for an automotive LED lamp. In addition, the stepped portion provides a concavo-convex shape that improves the rigidity of the heat sink against an external force (bending moment) about an axis perpendicular to the paper surface indicated by arrows on the left and right sides of the heat sink shown in FIG. 36 .

In the heat sink 601 according to the second modified example of the sixth embodiment shown in FIG. 39, the basic shape in which the waveforms 602 and 603 are alternately connected is the same as that in FIGS. Adjacent waveforms 603a and furthermore, waveforms 602b separated from waveform 602a by several pitches are shaped into a1, b1, a2 wider than widths a, b of other standard waveforms 602, 603, respectively. Furthermore, these waveforms 602a, 602b, and 603a are crushed to provide step portions (recesses) 604a, 604b. Then, components or elements 600a, 600b serving as heat sinks for vehicle-mounted LED lamps are attached to the stepped portions 604a, 604b, respectively. Such a wide waveform, step portion, or width can be appropriately selected according to the number, size, shape, position, etc. of required parts or elements 600a, 600b to be installed, or the reinforcement degree of rigidity. Here, the components or elements 600a and 600b are specifically an LED chassis for supplying electric power to an LED element, and an LED element mounted on the chassis. It should be noted that, in this modified example, the stepped portions 604a, 604b constitute the mounting surface of the present invention, and the wave 602a of the wide a1, a2 constitutes the first fin portion of the present invention, and the portion where the wave 602a, 603a is continuous It constitutes the second fin portion of the present invention.

In the forming of the above-mentioned step portion, including the step portion described later, after the corrugation forming of the waves 602 and 603 is performed, even if it is not performed in another process such as off-line, the shape of the wave in the wave is also adjusted using a mold. The forming portion of the above-mentioned step portion is performed by flattening or the like, but as processing accompanied by corrugation, the forming may be realized in a series of corrugation steps.

Another aspect of such a reinforced example is shown in FIGS. 40 to 43 in which the heat sink is laid sideways. In addition, in the heat sink 601 in the above-mentioned figure, the basic shape in which the waves 602 and 603 are alternately connected is the same as that in FIGS. 35 and 36 .

In the third modified example of the sixth embodiment shown in FIG. 40 , the halfway position (center position in this case) of each waveform 603 among the waveforms 602 and 603 is set at the same height (horizontal) as the surface of the waveform 602 . The convex portion such as the step portion 605b is provided in a manner to strengthen the wave shape 602, 603 = the rigidity of the heat sink 601 by forming a step portion continuously provided in the transverse direction of the wave pattern. The position, number, and height of such stepped portions 605b are selected as necessary. The forming of the step is performed by forming the waves 602 and 603 by corrugation, and then locally pressing the formed portion of the step 605 b in the wave 603 in the direction of the wave 602 .

In the fourth modified example of the sixth embodiment shown in FIG. 41 , a convex portion such as a step portion 605c is continuously provided at a midway position (in this case, a central position) of each waveform 603 for reinforcement, and each waveform The halfway position (in this case, the center position) of 602 is continuously provided with a concave portion such as a step portion 604c for reinforcement. Furthermore, the surface of the convex portion of the above-mentioned step portion 605c and the surface of the concave portion of the step portion 604c are made to have the same height (horizontal), thereby strengthening the form in which the step portion is continuously provided in the lateral direction of the wave pattern. The positions, numbers, and heights of such stepped portions 605c and 604c are selected as necessary. The forming of the above-mentioned step portion is performed after the corrugation processing of the waves 602 and 603 is performed, and then the formed part of the step portion 605c in the wave 603 is partially pressed in the direction of the wave 602, and on the other hand, the shape of the wave 602 is The forming part of the stepped portion 604c is partially crushed (depressed) in the direction of the wave shape 603 .

In the fifth modified example of the sixth embodiment shown in FIG. 42( a ), flat surfaces such as stepped portions 606 a , 606 b , 606 c , and 606 d are respectively provided on the peripheral portions (surroundings) of the waveforms 602 , 603 (radiator 601 ). flange. The formation of the above-mentioned step portion is performed after forming the waves 602 and 603 by corrugation, as shown in FIG. 42(b) XX' section of FIG. The forming process of flattening (pressing) the wave 602 and partially flattening (pressing) the wave 603 . The aforementioned ribs or flanges are provided to facilitate the installation of the radiator and the housing.

In the sixth modified example of the sixth embodiment shown in FIG. 43 , a concave portion such as a stepped portion 607 is provided that cuts out a halfway position (center position in this case) of the waveform 602 in four directions. However, at this time, the waveform The upper (upper side) portion of 602 is not cut, but is left as a square slice 608a, and this slice 608a is bent at right angles like 608b. The above-mentioned slices 608a and 608b are provided for the purpose of mounting the element 600 or necessary components without providing a difference in height.

FIG. 44 is a seventh modified example of the sixth embodiment, and shows an example in which a reinforcing bracket 630 is pasted with an adhesive on the back surface of the corrugations 602 and 603 (radiator 601 ). In Fig. 44(a), an integrated bracket 630 is pasted on the back of the waveforms 602 and 603 (radiator 601). Bracket 630,630 in two parts. Figure 44(c) shows that there are approximately In the case of the bracket 630 having a square cross section, the bracket 630 is provided with flanges 631 , 631 for attaching other components. In addition, in FIG.44 (a), (b), (c), as a material of the bracket 630,631, aluminum alloy or resin material can be used.

Assembly of radiator to vehicle LED lamp:

Fig. 45 shows a form of mounting a radiator to an on-vehicle LED lamp. Fig. 45(a) shows a longitudinal section of the LED lamp, and Fig. 45(b) is a top view at the section Y-Y' of Fig. 45(a). In FIG. 45 , an on-vehicle LED lamp (lamp for a vehicle) 650 includes: an LED substrate 651 on which an LED 651a as a light source is mounted; a reflector 652 that reflects light from the LED 651a toward the front in the light irradiation direction; The housing 653 of the reflector 652 ; the external lens 654 made of a transparent material closing the open front end of the housing 653 ; and the heat sink 601 arranged in thermal contact with the LED substrate 651 .

Here, the heat sink 601 of the present invention formed in the shape of continuous waves 602 and 603 as the fin shape has step portions 607a and 607b. In addition, the lower surface of the LED substrate 651 is thermally connected to the upper surface of the stepped portion 607a via a plate-shaped heat conduction member 655a. Furthermore, the upper surface of the reflector 652 is connected to the lower surface of the stepped portion 607b.

On the other hand, the LED substrate 651 is arranged at the center of the stepped portion 607 of the heat sink, and the LED 651a is mounted on the upper surface thereof. The reflector 652 is formed of a resin material, and has a parabolic reflective surface having a focal point near the LED 651 a on the LED substrate 651 .

The front surface side (fitting side of the external lens 654 ) of the casing 653 is open. Furthermore, an opening 653 a is provided on the rear side (right side in the drawing), and the heat sink 601 is attached so as to seal the rear opening 653 a.

According to the vehicle-mounted LED lamp 650 having such a structure, the LED 651 a on the LED board 651 is driven to emit light, and the light emitted from the LED 651 a is reflected by the reflector 652 and irradiated forward in the light irradiation direction through the external lens 654 . Here, the heat generated from the LED 651 a is transferred from the LED substrate 651 to the heat sink 601 via the heat conduction member 655 a, and is released from the heat sink 601 to the outside of the casing 653 . Thereby, the temperature rise of LED651a can be suppressed.

Raw aluminum alloy plate:

The raw aluminum alloy plate used in the heat sink of the present invention is a thin plate with a thickness in the range of 2 mm to 0.4 mm, which can be formed into the shape of the heat sink 601 and most importantly, has excellent corrugation properties. In addition, from the viewpoint of the required characteristics of heat sinks such as excellent heat transfer and corrosion resistance, the pure aluminum-based 1000 series specified or included in AA or JIS standards with as few alloy elements as possible is preferable. In addition, in the present invention, the above-mentioned pure aluminum system is also included and expressed as an aluminum alloy plate. However, from the viewpoint of securing the strength such as the rigidity, it is suitable to select an aluminum alloy material selected from the 3000 series or the like specified or included in the AA or JIS standards. The above-mentioned aluminum alloy sheet is produced through various usual production processes such as casting (DC casting method or continuous casting method), homogenization heat treatment, hot rolling, intermediate annealing, cold rolling, solution treatment and quenching treatment.

According to the present invention, a heat sink with high productivity can be provided by using an aluminum alloy thin plate as a raw material, and by corrugating the plate to form a continuous wave, that is, the overall shape of the heat radiation fin. Therefore, it is suitable for a heat sink of an automotive LED lamp.

Claims (4)

1. A heat sink for LED lighting, which is formed by aluminum, is characterized in that it has: Assembly face, which mounts LED elements on the surface; a first fin portion for heat dissipation extending in a direction perpendicular to the mounting surface; The second fin portion for heat dissipation extends in a direction perpendicular to the mounting surface and in a direction intersecting with the first fin portion for heat dissipation, A heat conduction path formed by the first heat dissipation fin portion and the second heat dissipation fin portion and the mounting surface is continuously formed, The mounting surface and the first fin portion for heat dissipation are formed in a continuous step shape, The mounting surface, the first fin portion for heat dissipation, and the second fin portion for heat dissipation are integrally formed by bending an aluminum blank, A second fin portion for heat dissipation extending in a direction intersecting with the first fin portion for heat dissipation is further provided at an end portion of the first fin portion for heat dissipation. 2. The radiator for LED lighting according to claim 1, characterized in that, The mounting surface and/or the first heat dissipation fin portion are thicker than the second heat dissipation fin portion. 3. The radiator for LED lighting according to claim 1 or 2, characterized in that, The second heat dissipation fin portions overlap each other, or the second heat dissipation fin portion overlaps with the mounting surface portion or/and the first heat dissipation fin portion. 4. The radiator for LED lighting according to claim 1 or 2, characterized in that, The wall thickness at the mounting portion of the LED element of the mounting surface is locally thickened.