CN103378259A - Electronic module and lighting device including electronic module - Google Patents
Electronic module and lighting device including electronic module Download PDFInfo
- Publication number
- CN103378259A CN103378259A CN 201210120960 CN201210120960A CN103378259A CN 103378259 A CN103378259 A CN 103378259A CN 201210120960 CN201210120960 CN 201210120960 CN 201210120960 A CN201210120960 A CN 201210120960A CN 103378259 A CN103378259 A CN 103378259A
- Authority
- CN
- China
- Prior art keywords
- electronic module
- circuit board
- electronic device
- cover body
- isolated part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention relates to an electronic module (100). The electronic module comprises a circuit board (1), an electronic device (2) arranged on the circuit board (1) and a packaging material (3). The electronic module is characterized by further comprising an isolating part. The isolating part at least encircles the electronic device (2) and isolates the electronic device (2) from the packaging material (3). The invention further relates to a lighting device including the electronic module.
Description
Technical field
The present invention relates to a kind of electronic module and a kind of lighting device that comprises this electronic module.
Background technology
The led module that is widely used in the lighting technology generally includes the devices such as led chip, circuit board, optics and electronic device.The led module of function admirable need to have water-proof function and dust reduction capability, for example needs to satisfy the relevant regulations of IP degree of protection.In order to satisfy such regulation, in the prior art, usually realize in the following ways, each device package of led module in a housing, and is utilized and makes led module such as conventional process such as inlaying injection moulding, low pressure molding or embedding.According to above-mentioned technique, be used for the material of packaging LED module such as being TPU, PVC, PA, PU or silica gel etc.These materials directly cover or seal all devices in the led module when making led module, satisfied well thus the IP degree of protection, for example IP dustproof and waterproof grade.
But the shortcoming that exists in the prior art also can not be ignored, and the variation of " expanding with heat and contract with cold " for example can appear in the material that namely covers or seal electronic device when temperature influence, and this will cause electronic device to damage.Particularly when utilizing surface installation technique (SMT) to be fixed on electronic device on the circuit board, the electronic device utilization links together for its default pad and welding circuit board in a large number.At encapsulating material, be the case material temperature influence of led module and when being out of shape, can produce larger internal pressure.These pressure will damage electronic device and/or its pad thus at inside modules extruding or stretching electronic device and/or its pad, and and then cause led module to damage.
The shortcoming of aforesaid way is but the fail safe of the electronic device in the led module and/or pad to have been consisted of threat in the situation that satisfies the IP degree of protection.Therefore, problems of the prior art in the urgent need to address.
Summary of the invention
Therefore one object of the present invention is, a kind of electronic module is proposed, this electronic module both can reach corresponding IP degree of protection, and the electronic device that can prevent again self is subjected to the stress that the stress of inside modules, particularly encapsulating material produce inside modules and damages when expanding with heat and contract with cold.
Electronic module according to the present invention comprises circuit board, is arranged on electronic device and encapsulating material on the described circuit board, it is characterized in that, also comprise isolated part, described isolated part surrounds described electronic device at least, and described electronic device and described encapsulating material are kept apart.Isolated part can surround in the mode that is fit to, coating or overlay electronic device, is formed for thus protecting a kind of protective barrier of electronic device.Only be applied on the outer surface of isolated part from the active force of electronic module inside, the pressure or the tension force that are for example produced when expanding with heat and contract with cold by encapsulating material, can not act on the electronic device of the section of setting within it.Even therefore in the larger situation of variation of ambient temperature, electronic device can work under the protection of isolated part, and can be not damaged because of the encapsulating material generation deformation of electronic module.
Propose in according to a preferred embodiment of the invention at one, isolated part is isolation member.Isolated part is used for according to the present invention producing isolation effect in terms of mechanics, namely utilizes the outer surface of self to bear the stress of electronic module inside, and these power is not passed to electronic device, to guarantee to be enclosed in electronic device not affected by force wherein.Preferably, described isolated part is made by rigid material.Rigid material does not produce deformation in the situation of extruding or stretching, the isolated part of therefore selecting rigid material to make can be kept apart electronic device and encapsulating material safely and reliably.
Propose in according to a preferred embodiment of the invention at one, described isolated part is placed on the described circuit board.Because electronic device can preferably utilize surface installation technique (SMT) to be installed on the circuit board, therefore can directly isolated part correspondingly be placed on the circuit board, in order to surround targetedly the electronic device that needs protection.
Propose in according to a preferred embodiment of the invention at one, described isolated part is designed to cover body, and described cover body comprises the cavity that holds described electronic device.Cavity has certain degree of depth, can be for example covers on the corresponding region of circuit board with the form of lid, is contained in the space that cover body and circuit board limit in order to will be arranged on electronic device in this zone.
Propose in according to a preferred embodiment of the invention at one, have the gap between described cover body and the described electronic device.The gap forms the buffer area at this, does not contact each other with electronic device to guarantee cover body, further prevents from being passed on the electronic device from the stress of encapsulating material.Particularly when selecting metal to make cover body, electric insulation between cover body and the electronic device can also be guaranteed in the gap.
Propose in according to a preferred embodiment of the invention at one, described cover body comprises the roof that limits described cavity and from the extended perisporium in the edge of described roof, and described cover body utilizes described perisporium and is connected circuit board and connects.The roof of cover body contacts with encapsulating material with the outer surface of perisporium, can bear encapsulating material at the inner stress that produces of electronic module.Because perisporium has predetermined height, the perisporium that therefore is supported between roof and the circuit board can pass to circuit board with the power that is applied on the roof.Can apply viscose at the end face that perisporium contacts with circuit board or utilize welding or other techniques that are fit at this, isolated part and the circuit board that is designed to cover body is fixed together.
Propose in according to a preferred embodiment of the invention at one, be provided with against a plurality of projections of the lateral surface of described perisporium the described perisporium of described protruding clamping on the described circuit board.Utilize a plurality of projections on the circuit board cover body can be limited in the respective regions corresponding to electronic device, in installation process, can realize simply and easily thus the location between cover body and the circuit board.
Propose in according to a preferred embodiment of the invention at another, be formed with at least one plug on the described perisporium, offer at least one jack on the described circuit board.The mode of utilize pegging graft can be limited to cover body on the predetermined installation site on the circuit board equally simply.
Propose in according to a preferred embodiment of the invention at one, electronic module also comprises the pad of being combined with described circuit board for described electronic device, and described pad is arranged in the described cavity.Because the safety and reliability of pad directly affects the connection effect between electronic device and the circuit board, therefore need to protect pad equally, prevent that it is subjected to the stress of electronic module inside and damages.
Propose in according to a preferred embodiment of the invention at one, described encapsulating material covers described isolated part fully.At this, isolated part is advantageously disposed on encapsulating material inside fully, therefore can guarantee that electronic module reaches in the situation of industrial IP degree of protection, guarantee that electronic device can not be subjected to the encapsulating material distortion and the stress influence that produces.
Another object of the present invention realizes by a kind of lighting device of the electronic module of the above-mentioned type that comprises, this lighting device comprises photo engine and the optics that is designed to described electronic module, wherein photo engine also comprises the light source that is arranged on the described circuit board, and described optics is set to surround described light source.Optics for example is mounted in lens or the analog on the circuit board.Can utilize encapsulating material to seal or cover other devices except lens at circuit board, obtain thus lighting device complete, favorable sealing property.
Propose in according to a preferred embodiment of the invention at one, light source is led chip.
According to electronic module of the present invention and comprise that the advantage that the lighting device of this electronic module has is: electronic module not only has the encapsulating housing that reaches the IP degree of protection, and owing to being provided with especially isolation member for the electronic device of inside modules, even when therefore variations in temperature is remarkable in external environment, the distortion that the encapsulating housing temperature influence produces can not exert an influence to the electronic device of inside modules yet.This electronic module can be widely used in the abominable application scenario in open air, particularly environment.
Description of drawings
Accompanying drawing consists of the part of this specification, is used for helping further to understand the present invention.These accompanying drawings illustrate embodiments of the invention, and are used for illustrating principle of the present invention with specification.Identical parts represent with identical label in the accompanying drawings.Shown in the figure:
Fig. 1 shows the longitudinal sectional drawing according to the first embodiment of electronic module of the present invention;
Fig. 2 shows the longitudinal sectional drawing according to the second embodiment of electronic module of the present invention;
Fig. 3 shows the schematic diagram according to lighting device of the present invention.
Embodiment
In being discussed in more detail below, with reference to the accompanying drawing of a part that forms this specification, wherein, showing in the mode of illustration and can implement specific embodiments of the invention.About figure, such as " interior ", " outward ", " on ", the D score directional terms is with reference to the use of the direction of described accompanying drawing.Because the assembly of embodiment in the present invention can be placed at many different directions, so the direction term only is used for explanation, and without any the meaning that limits.It should be understood that and to use other embodiment, and under the prerequisite that does not deviate from scope of the present invention, can carry out structure or logical changes.So the below describes in detail should not be understood to the restrictive meaning, and the present invention is defined by the appended claims.
It should be understood that if there is not other dated especially the feature of different exemplary embodiment described herein can be bonded to each other.
Figure 1 illustrates the longitudinal sectional drawing according to the first embodiment of electronic module 100 of the present invention.Electronic module 100 comprises circuit board 1, is arranged on electronic device 2 and encapsulating material 3 on the circuit board 1.Encapsulating material 3 is the upper surface that illustrates in the drawings of covering board 1 partly, in order to electronic device 2 fully is encapsulated in the encapsulating material 3, thereby makes electronic module 100 reach the IP degree of protection of dustproof and waterproof.Electronic device 2 can be resistance, electric capacity or analog.
Because encapsulating material 3 made by nonrigid material, these materials are such as being TPU, PVC, PA, PU or silica gel etc., and therefore in the environment at electronic module 100 places during the temperature marked change, deformation can occur encapsulating material 3, the variation of expanding with heat and contract with cold namely occurs.This deformation meeting is in electronic module 100 inner tension stress or the compression of producing.These stress in a single day act on the electronic device 2 or the link position of electronic device 2 and circuit board 1 on, be on the pad 10, electronic device 2 or pad 10 are damaged, thereby cause electronic module 100 to break down.Therefore between electronic device 2 and encapsulating material 3, isolated part is set especially, in order to stress and the electronic device 2 of electronic module 100 inside are isolated.Isolated part is preferably made by the rigid material of for example duroplasts or metal, can also can not be out of shape in the situation of pressure-bearing thus.
As shown in Figure 1, isolated part can be designed as cover body 4.Cover body 4 comprise roof 5 and from the edge of roof 5 extended perisporium 6, can limit cavity R thus.In order to utilize cover body 4 to protect electronic device 2, cover body 4 covers on the zone that carries electronic device 2 of circuit board 1, thus so that electronic device 3 and the pad 10 that is used for electronic device 3 is fixed on the circuit board 1 are positioned at cavity R.Encapsulating material 3 covers cover body 4 fully, and encapsulating material 3 is owing to compression or the tension stress that self-deformation produces as shown by arrows in FIG. is applied directly on the outer surface of roof 5 and perisporium 6.There is the gap and be contained between the inner surface of electronic device 2 among the cavity R and pad 10 and roof 5 and perisporium 6, therefore guarantees that compression or tension stress can not be passed on the electronic device 2.Cover body 4 is the protective barrier that electronic device 3 forms opposing compression or tension stress in electronic module 100.
Can be fixedly mounted on the circuit board 1 position in order to ensure cover body 4, especially perisporium 6, be used for being connected with circuit board the end face that connects two plugs 8 be set, on circuit board 1, correspondingly be designed with two jacks 9.Utilize the mode of pegging graft to be convenient between cover body 4 and circuit board 1, position, and utilize the mode that is fit to such as welding, bonding etc. that plug 8 place end faces and circuit board 1 are fixed together.
Fig. 2 shows the longitudinal sectional drawing according to the second embodiment of electronic module 100 of the present invention.The difference part of the second embodiment and the first embodiment is, can be fixedly mounted on the circuit board 1 position in order to ensure cover body 4, also can arrange a plurality of protruding 7 at circuit board 1.These projections 7 utilize its peripheral side to be resisted against respectively on the outer surface of perisporium 6, can realize in the mode of clamping thus the location between cover body 4 and the circuit board 1.
In unshowned the 3rd embodiment, the quantity of the plug 8 that being used for as shown in fig. 1 positions cover body 4 and circuit board 1 in the mode of pegging graft and the jack 9 corresponding with it can be respectively one or more.
In unshowned preferred embodiment, isolated part can have other profiles that be fit to cover or surround electronic device 2, and can be mechanically coupled together with other connected modes that are fit to or structure and circuit board 1.
Fig. 3 shows the schematic diagram according to lighting device 200 of the present invention.Lighting device 200 has the optics 201 that is designed to lens and as the electronic module 100 of photo engine.Wherein in order to be clearly shown that cover body 4, the not shown encapsulating material 3 that is encapsulated on circuit board 1 and the electronic device in Fig. 3.At circuit board 1 light source that for example is designed to led chip is installed, optics 201 is arranged on the light source.The cover body 4 that is arranged on the circuit board 1 is used for covering electronic device 3 (not shown) that photo engine needs protection, with prevent electronic device 3 be subjected to lighting device 200, the particularly tension stress of electronic module 100 inside or compression and damage.
In addition, although only with respect to a kind of special characteristic or the aspect that discloses embodiments of the invention in the numerous embodiments, but as any given or application-specific is desired, combination can be carried out with one or more further features or the aspect of other execution mode in these features or aspect.
Be the preferred embodiments of the present invention only below, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.All any modifications of doing within the spirit and principles in the present invention, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Reference number
1 circuit board
2 electronic devices
3 encapsulating materials
4 cover bodies
5 roofs
6 perisporiums
7 projections
8 plugs
9 jacks
10 pads
100 electronic modules
200 lighting devices
201 optics
Claims (13)
1. an electronic module (100), comprise circuit board (1), be arranged on electronic device (2) and encapsulating material (3) on the described circuit board (1), it is characterized in that, also comprise isolated part, described isolated part surrounds described electronic device (2) at least, and described electronic device (2) and described encapsulating material (3) are kept apart.
2. electronic module according to claim 1 (100) is characterized in that, described isolated part is isolation member.
3. electronic module according to claim 1 (100) is characterized in that, described isolated part is placed on the described circuit board (1).
4. each described electronic module (100) is characterized in that according to claim 1-3, and described isolated part is designed to cover body (4), and described cover body (4) comprises the cavity (R) that holds described electronic device (2).
5. electronic module according to claim 4 (100) is characterized in that, has the gap between described cover body (4) and the described electronic device (2).
6. electronic module according to claim 4 (100), it is characterized in that, described cover body (4) comprises the roof (5) that limits described cavity and from the extended perisporium in edge (6) of described roof (5), and described cover body (4) utilizes described perisporium (6) and is connected circuit board (1) and connects.
7. electronic module according to claim 6 (100), it is characterized in that, be provided with on the described circuit board (1) against a plurality of projections (7) of the lateral surface of described perisporium (6), the described perisporium of described projection (7) clamping (6).
8. electronic module according to claim 6 (100) is characterized in that, is formed with at least one plug (8) on the described perisporium (6), offers at least one jack (9) on the described circuit board (1).
9. electronic module according to claim 4 (100), it is characterized in that, comprise that also described pad (10) is arranged in the described cavity (R) for the pad (10) with described electronic device (2) and described circuit board (1) combination.
10. each described electronic module (100) is characterized in that described isolated part is made by rigid material according to claim 1-3.
11. each described electronic module (100) is characterized in that according to claim 1-3, described encapsulating material (3) covers described isolated part fully.
A 12. lighting device (200), comprise photo engine and optics (201), it is characterized in that, described light engine design is each described electronic module (100) in according to claim 1-11, described photo engine also comprises the light source that is arranged on the described circuit board (1), and described optics (201) is set to surround described light source.
13. lighting device according to claim 12 (200) is characterized in that, described light source is led chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210120960 CN103378259A (en) | 2012-04-23 | 2012-04-23 | Electronic module and lighting device including electronic module |
| PCT/EP2013/058291 WO2013160246A1 (en) | 2012-04-23 | 2013-04-22 | Electronic module and illuminating device comprising the electronic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210120960 CN103378259A (en) | 2012-04-23 | 2012-04-23 | Electronic module and lighting device including electronic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103378259A true CN103378259A (en) | 2013-10-30 |
Family
ID=48142805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210120960 Pending CN103378259A (en) | 2012-04-23 | 2012-04-23 | Electronic module and lighting device including electronic module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103378259A (en) |
| WO (1) | WO2013160246A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112970338A (en) * | 2018-11-05 | 2021-06-15 | 采埃孚股份公司 | Electronic unit with electronic device and means for protecting it from the effects of pressure |
| CN117678838A (en) * | 2023-06-16 | 2024-03-12 | 荣耀终端有限公司 | Wearable device belt body and manufacturing method thereof and wearable device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017031418A1 (en) * | 2015-08-19 | 2017-02-23 | Diebold, Incorporated | Enclosure for an optical device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6413645B1 (en) * | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
| US7224000B2 (en) * | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
| CN101577301B (en) * | 2008-09-05 | 2011-12-21 | 佛山市国星光电股份有限公司 | Package method for white light LED and LED device manufactured by package method for white light LED |
| DE102010000128B4 (en) * | 2009-01-21 | 2019-04-04 | Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg | LED array |
| DE102009002519A1 (en) * | 2009-04-21 | 2010-10-28 | Robert Bosch Gmbh | Encapsulated circuit device for substrates with absorption layer and method for producing the same |
| GB2470350A (en) * | 2009-05-12 | 2010-11-24 | Vml Technologies Bv | Waterproof Electrical Item |
| EP2447595B1 (en) * | 2010-10-27 | 2017-08-02 | LG Innotek Co., Ltd. | Light emitting module |
-
2012
- 2012-04-23 CN CN 201210120960 patent/CN103378259A/en active Pending
-
2013
- 2013-04-22 WO PCT/EP2013/058291 patent/WO2013160246A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112970338A (en) * | 2018-11-05 | 2021-06-15 | 采埃孚股份公司 | Electronic unit with electronic device and means for protecting it from the effects of pressure |
| CN117678838A (en) * | 2023-06-16 | 2024-03-12 | 荣耀终端有限公司 | Wearable device belt body and manufacturing method thereof and wearable device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013160246A1 (en) | 2013-10-31 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131030 |