KR101476423B1 - LED package - Google Patents

Abstract

The present invention provides an LED package capable of resolving cracks in a molding member, a process and a handling defect, which can occur as the thickness of the LED package is reduced by changing the structure of the lead frames so that the space for spacing the lead frames is bent As a technical task.

To this end, the LED package according to the present invention includes a light transmitting mold member for sealing the LED chip; And first and second lead frames at least partially supported by the molding member, wherein the first and second lead frames are spaced apart from each other in the molding member region, wherein the first and second lead frames are spaced apart The space to be provided is curved.

Lead frame, LED chip, molding member, support, facing, crack,

Description

LED package {LIGHT EMITTING DIODE PACKAGE}

The present invention relates to an LED package for preventing cracks, and more particularly, to a structure for preventing cracks in a molding member even when the thickness of the LED package is reduced by changing the structure of the lead frames so that the space of the lead frames spaced apart from the molding member area is bent Gt; LED package. ≪ / RTI >

In general, a light emitting diode (LED) is a device in which electrons and holes meet at a PN junction by applying a current, and the LED emits light with a low voltage and a low current It has many advantages over existing light sources such as continuous light emission and low power consumption.

The above-described LED is usually manufactured in a package structure. The conventional LED package includes a lead frame type LED package having a structure in which an LED chip is placed in a cavity of a housing for supporting a lead frame and a cavity of the housing is filled with an encapsulating material, There is known a PCB type LED package in which a LED chip is directly mounted on a PCB and a molding member for covering the LED chip is formed on the PCB.

In the case of the lead frame type LED package, the housing for supporting the lead frame is relatively large in thickness, so that it is difficult to fabricate a slim thin type. Relatively, the PCB type LED package is relatively easy to manufacture by thinning the thickness of the LED package compared to the existing lead frame type LED package due to the omission of the housing.

Referring to FIG. 1, a PCB type LED package 1 having a reduced thickness is described. The LED package 1 includes first and second lead frames 11 and 12 spaced from each other. The first lead frame 11 is mounted on the LED chip 14 and the second lead frame 12 is electrically connected to the LED chip 14 by a bonding wire W. The bonding wire (W) electrically connected to the LED chip (14) is connected to the second lead frame (12).

The first and second lead frames 11 and 12 are supported by a molding member 13. The molding member 13 is formed by molding and covers the LED chip 14 and the bonding wire W as a whole to protect the LED chip 14 and the bonding wire W. [ The translucent molding member 20 may be formed by transfer molding using an epoxy molding compound (EMC) which is a solid epoxy resin material.

However, as the PCB type LED package 1 is made thin, a crack C of the molding member 13 may be generated when external stress is applied. That is, when the external stress is applied to the molding member 13 formed by the molding process because the spaces between the first and second lead frames 11 and 12 are separated by a single straight line space, C) is generated, resulting in a problem of product failure.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to prevent the cracks of the molding member, which may occur as the thickness of the LED package is reduced, by changing the structure of the lead frames so that the space of the lead frames spaced apart from the molding member region is bent And it is an object of the present invention to provide an LED package that can mitigate the impact on external stress.

According to an aspect of the present invention, there is provided an LED package including: a light transmissive molding member sealing an LED chip; And first and second lead frames at least partially supported by the molding member, wherein the first and second lead frames are spaced apart from each other in the molding member region, wherein the first and second lead frames are spaced apart At least the space is curved. Here, the space is linear, but may be folded at least once.

According to the present embodiment, the first and second lead frames each include a projecting piece and a groove for receiving the projecting piece, wherein a space between the projecting piece and the groove can form a part of the curved space have. The first and second lead frames each include an elongated projecting piece extending into the groove and a receiving groove formed to receive the elongated projecting piece, wherein the spacing space between the elongated projecting piece and the receiving groove At least a part of the curved space can be obtained.

On the other hand, in the molding member, one lead frame has a larger area than other lead frames, and the LED chip can be mounted on a lead frame having a large area. As a result, the heat generated in the LED chip can be quickly released.

Further, the first and second lead frames include corresponding surfaces facing each other in the molding member, the extensions of the first and the lead frames are staggered in the longitudinal direction, and the first and second lead frames And the outer leads of the first and second lead frames may be disposed opposite to each other.

According to the embodiment of the present invention, by changing the structure of the lead frame so that the space for separating the lead frames from each other is bent in the molding member region, it is possible not only to prevent cracking of the molding member, And it is possible to solve the problem of work caused by the operation. In particular, it is possible to improve adhesion between the modified lead frames and the molding member, thereby relieving the reliability of the package and the impact on the external stress.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

3 is a plan view of an LED package according to an embodiment of the present invention.

Referring to FIG. 3, an LED package 2 according to an embodiment of the present invention includes a molding member 23 and first and second lead frames 21 and 22. The molding member 23 is formed by molding and covers the LED chip 24 and the bonding wire W as a whole and protects them.

The molding member (23) seals the LED chip (24). The molding member 23 may be formed by transfer molding using an epoxy molding compound (EMC) which is a solid epoxy resin material. For example, transfer molding is a method in which a powder-type EMC material is pressurized to a tablet shape by applying an appropriate pressure, and the tablet-like EMC is injected into a mold for defining the shape of the molding member 23 under high temperature and high pressure conditions . However, the molding member 23 is preferably formed by a transfer molding method. However, the present invention is not limited thereto, and an injection molding method in which a liquid resin is injected into a mold to form a molding member may be used. As the material of the molding member 23, other light transmitting resin such as silicone resin may be used in addition to the epoxy resin.

The first and second lead frames 21 and 22 are supported by the molding member 23 and the first and second lead frames 21 and 22 are separated from each other in the region of the molding member 23 Respectively. A space 25 separating the first and second lead frames 21 and 22 is curved. In addition, the space 25 may be linear, but may be bent at least once more. The space 25 includes a first space 25a in the transverse direction and second and third spaces 25b and 25c extending in the longitudinal direction opposite to each other with respect to the first space 25a. In the present embodiment, the space 25 is bent twice 90 degrees, but the present invention is not limited thereto.

The first and second lead frames 21 and 22 have a curved pattern including corresponding surfaces facing each other in various directions in the molding member 23. [ More specifically, the first and second lead frames 21 and 22 have transversely corresponding surfaces 21a and 22a facing up and down with the first space 25a therebetween. In addition, the first and second lead frames 21 and 22 are spaced from each other in the mutually different directions on the transversely corresponding surfaces 21a and 22a, and the second and third spaces 25b and 25c are interposed therebetween And have first longitudinally facing surfaces 21b, 22b and second longitudinally facing surfaces 21c, 22c facing each other in the lateral direction.

At this time, the first longitudinally facing surface 21b of the first lead frame 21 is located at the end of the extended portion 211a extending in the longitudinal direction from the second longitudinally facing surface 21c. The second longitudinally facing surface 22c of the second lead frame 22 has an extension 221a extending in the longitudinal direction from the first longitudinally facing surface 22b of the second lead frame 22, ). Therefore, the extension portions 211a and 221a of the first and second lead frames 21 and 22 are staggered in the longitudinal direction, and the transverse direction corresponding surface 21a of the first lead frame 21 and the second The transversely corresponding surfaces 22a of the extension portions 221a of the lead frame 22 are opposed to each other in parallel.

The first lead frame 21 is arranged in the molding member 23 in such a manner that the first longitudinal bearing surface 21b, the transverse mating surface 21a and the second longitudinal mating surface 21c, And an outer lead (212) outside the molding member (23), wherein the second lead frame (22) is arranged in the molding member (23) An inner lead 221 having the longitudinally corresponding surface 22b, the transversely corresponding surface 22a and the second longitudinally corresponding surface 22c and an outer lead 222 outside the molding member 23 do. The outer leads 212 and 222 of the first and second lead frames 21 and 22 are arranged to face each other.

The inner leads 211 and 221 of the first and second lead frames 21 and 22 are staggered from each other in the molding member 23 and the inner leads 211 and 221 of the first and second lead frames 21 and 22, The LED package 2 according to the present embodiment is structured such that the first and second lead frames 21a, 21b, 21c, and 22c face each other on the plurality of corresponding surfaces 21a, 22a, 21b, The spaced spaces 25 between the molds 21 and 22 can be formed into a curved space that can prevent cracks of the molding member 23 from occurring. As an example of comparison, in a conventional LED package in which the lead frames are spaced in a single straight line space, the molding member can be easily broken by cracks in the vicinity of the spaced apart spaces.

The LED chip 24 is mounted on the upper surface region of the first lead frame 21 and the second lead frame 22 is electrically connected to the LED chip 24 by the bonding wire W . The bonding wire W is connected to the second lead frame 22 by a wire ball (or a soldering ball) not shown. The upper surface area of the first lead frame 21 on which the LED chip 24 is mounted is formed to have a larger area than the bonding area to which the bonding wire W is connected so that the heat generated from the LED chip 24 Can be smoothly discharged.

Hereinafter, other embodiments of the present invention will be described. In describing such embodiments, the foregoing description is omitted to avoid redundancy, and the same reference numerals as those of the preceding embodiments denote the same or similar components.

4 is a plan view of an LED package according to another embodiment of the present invention.

The LED package 2 according to another embodiment of the present invention has more corresponding surfaces than the previous embodiment, whereby the first and second lead frames 21, 22 are more flexed A true clearance space 25 can be formed.

For this, in the present embodiment, substantially rectangular grooves 211b and 221b and protruding pieces 211c and 221c are adjacent to the extended portions 211a and 221a of the first and second lead frames 21 and 22, respectively Includes a pattern. The protruding piece 211c provided in the extended portion 211a of the first lead frame 21 is positioned in the groove 221b provided in the extended portion 221a of the second lead frame 22, The protruding pieces 221c provided in the extended portion 221a of the lead frame 22 are positioned in the groove 211b provided in the extended portion 211a of the first lead frame 21 and the extended portions 211a , 221a) having more corresponding surfaces than the previous embodiments.

Specifically, between the protruding piece 211c provided in the extended portion 211a of the first lead frame 21 and the groove 221b provided in the extended portion 221a of the second lead frame 22, The first and second spaced apart second spaces 25b extend in the longitudinal direction on both sides of the protruded piece 211c of the first lead frame 21 with respect to the second space 25b. The protrusions 25a and 25b provided in the extended portion 221a of the second lead frame 22 and the groove 211b provided in the extended portion 211a of the first lead frame 21, A fourth space 25d in the transverse direction spaced apart from the second space 221c and a fifth space 25e extending in the longitudinal direction with respect to the fourth space 25d. In the present embodiment, the space 25 is bent at 90 degrees four times, but the present invention is not limited thereto.

The first and second lead frames 21 and 22 include first longitudinally facing surfaces 21a and 22a facing each other with the first space 25a therebetween, Second longitudinally facing surfaces 21c, 22c facing each other with the third space 25c interposed therebetween, first longitudinally facing surfaces 21b, 22b facing each other, The second transverse direction corresponding surfaces 21d and 22d facing each other with the fourth space 25d therebetween and the third longitudinal direction facing surfaces 21e and 21d facing each other with the fifth space 25e therebetween, 22e.

The first lead frame 21 is formed in the molding member 23 so that the first longitudinally facing surface 21a, the first transversely corresponding surface 21b, the second longitudinally corresponding surface 21c, And an outer lead (212) outside the molding member (23), wherein the inner lead (211) has the second transverse mating surface (21d) and the third longitudinal mating surface The two lead frames 22 are arranged in the molding member 23 such that the first longitudinally facing surface 22a, the first transversely corresponding surface 22b, the second longitudinally corresponding surface 22c, An inner lead 221 having a second transverse direction corresponding surface 22d and a third longitudinal direction corresponding surface 22e and an outer lead 222 outside the molding member 23. At this time, the first and second lead frames 21 and 22 are surrounded by the inner leads 211 and 221 and the outer leads 212 and 222 are disposed to face each other.

By the structure in which the internal leads 211 and 221 of the first and second lead frames 21 and 22 are arranged with the bent spaced apart spaces 25 and by the structure in which the plurality of corresponding surfaces Even if an external force is applied by the structure of the first and second lead frames 21 and 22 facing each other in the first and second lead frames 21a, 22a, 21b, 22b, 21c, 22c, Cracks can be prevented.

5 is a plan view of an LED package according to another embodiment of the present invention.

The LED package 2 according to yet another embodiment of the present invention has more corresponding surfaces than the previous embodiments, whereby the first and second lead frames 21, 22 are compared to the previous embodiments A more curved spacing space 25 may be formed.

To this end, in the present embodiment, elongated protruding pieces 211d and 221d, which are substantially rectangular, are formed in the grooves 211b and 221b and the protruding pieces 211c and 221c provided in the extending portions 211a and 221a, , And 221e are included in a neighboring pattern.

The first and second lead frames 21 and 22 are formed to receive elongated projecting pieces 211d and 221d extending respectively into the grooves 211b and 221b provided in the extending portions 211a and 221a, The receiving grooves 211e and 221e formed on the upper surfaces 211c and 221c are located between the extending portions 211a and 22la and have more corresponding surfaces than the previous embodiments. The description of the specific corresponding surfaces is omitted here, but the corresponding protruding pieces 211d and 221d and the receiving grooves 211e and 221e have more corresponding surfaces than the corresponding surfaces shown in Fig. 25b, 25c, 25d, 25e, 25f, and 25g can be formed by the extended protruding pieces 211d, 221d and the receiving grooves 211e, 221e more than the previous embodiments have. The curved spacing space 25 is bent six times 90 degrees in the present embodiment, but the present invention is not limited thereto.

The first and second lead frames 21 and 22 include internal leads 211 and 221 having corresponding surfaces facing each other in various directions in the molding member 23 and internal leads 211 and 221, And outer leads 221 and 222 arranged to correspond to each other.

By the structure in which the internal leads 211 and 221 of the first and second lead frames 21 and 22 are arranged to be opposed to each other while being bent inside the molding member 23 as described above, Even if the forming force is applied, the dispersion of the force is uniformly distributed, and cracking of the molding member 23 can be prevented.

In the molding member 23, the lead frame of any one of the first and second lead frames 21 and 22 has a larger area than that of the other lead frame, The chip 24 may be mounted so that the heat generated from the LED chip 24 can be smoothly emitted.

Fig. 6 is a view showing the dispersion of force in the LED package shown in Fig. 5. As shown in Fig. 6, the dispersion of the external force or the internal forming force is uniformly distributed so that cracking of the molding member 24 can be prevented have.

1 is a plan view of an LED package according to the prior art;

Fig. 2 is a view showing a state where a crack is generated in the LED package shown in Fig. 1. Fig.

3 is a plan view of an LED package according to an embodiment of the present invention.

4 is a plan view of an LED package according to another embodiment of the present invention;

5 is a plan view of an LED package according to another embodiment of the present invention;

Fig. 6 is a diagram showing a dispersion of force in the LED package shown in Fig. 5; Fig.

Description of the Related Art

21: first lead frame 22: second lead frame

23: molding member 24: LED chip

W: bonding wire

Claims (6)

A light transmitting molding member sealing the LED chip; And And a first and a second lead frame, at least a part of which is coupled with the molding member, Wherein the first and second lead frames are spaced apart from each other in the molding member region, wherein a space separating the first and second lead frames is bent, Wherein the first and second lead frames each include a protruding piece and a groove for receiving the protruding piece, wherein the spacing space between the protruding piece and the groove forms at least a part of the curved space. . The method according to claim 1, Wherein the space is linear, and is at least once folded. delete The method according to claim 1, Wherein the first and second lead frames each include an elongated protrusion extending respectively into the groove and a receiving groove formed to receive the elongated protruding piece, And at least a portion of the source / drain regions. The method according to claim 1, And the extensions of the first and second lead frames are staggered in the longitudinal direction. The method according to claim 1, Wherein the inner leads of the first and second lead frames are staggered with each other in the molding member, and the outer leads of the first and second lead frames are disposed opposite to each other.

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