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CN103364434B - The hemisphere of large difference sample is to the measuring method of total emissivity - Google Patents

The hemisphere of large difference sample is to the measuring method of total emissivity Download PDF

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CN103364434B
CN103364434B CN201310146530.2A CN201310146530A CN103364434B CN 103364434 B CN103364434 B CN 103364434B CN 201310146530 A CN201310146530 A CN 201310146530A CN 103364434 B CN103364434 B CN 103364434B
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符泰然
汤龙生
段明皓
王忠波
谈鹏
周金帅
邓兴凯
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Tsinghua University
Beijing Research Institute of Mechanical and Electrical Technology
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Abstract

本发明具体公开了一种大温差样品的半球向全发射率的测量方法,其步骤包括:选取带状导体材料样品,在真空环境下加热样品,用辐射温度场测量设备获得加热稳定状态下的样品表面温度场分布;将所述样品沿其轴向等分为多个微元控制体,建立微元控制体的稳态能量平衡方程;基于样品的表面温度场分布以及样品两端的电压和电流,计算出在加热稳定状态下样品的半球向发射率随温度的数值分布。本发明的这种方法适用于测量具有大温度梯度分布的导体材料样品的半球向全发射率,克服了现有稳态量热法对于样品具有温度均匀测试区要求的技术局限性,极大地减小了对样品尺寸规格的限制,简单可行。The invention specifically discloses a method for measuring the hemispherical total emissivity of a sample with a large temperature difference. The steps include: selecting a strip-shaped conductor material sample, heating the sample in a vacuum environment, and using a radiation temperature field measuring device to obtain the hemispherical total emissivity in a stable heating state. The temperature field distribution on the surface of the sample; the sample is divided into multiple micro-element control bodies along its axial direction, and the steady-state energy balance equation of the micro-element control body is established; based on the surface temperature field distribution of the sample and the voltage and current at both ends of the sample , calculate the numerical distribution of the hemispherical emissivity of the sample with temperature in the heating steady state. This method of the present invention is suitable for measuring the hemispherical total emissivity of a conductor material sample with a large temperature gradient distribution, overcomes the technical limitations of the existing steady-state calorimetry method for the sample to have a uniform temperature test area, and greatly reduces the The restriction on sample size and specifications is small, and it is simple and feasible.

Description

大温差样品的半球向全发射率的测量方法Measurement method of hemispherical total emissivity of samples with large temperature difference

技术领域technical field

本发明涉及导体材料半球向全发射率测量领域,尤其涉及一种大温差导体材料样品的半球向全发射率的测量方法。The invention relates to the field of measuring the hemispherical total emissivity of conductor materials, in particular to a method for measuring the hemispherical total emissivity of a conductor material sample with a large temperature difference.

背景技术Background technique

半球向全发射率是材料的重要热物性参数之一,表征了材料的表面热辐射能力,是研究辐射测量、辐射热传递以及热效率分析的重要基础物性数据。随着新型材料在能源动力和航空航天等高新技术领域的广泛应用,对半球向全发射率的测量提出了更多迫切需求,相比于其他热物性参数而言,半球向全发射率测量方法与技术研究仍不够充分,不同材料的半球向全发射率数据依然缺乏,需要通过精确实验测量获得物体的半球向全发射率。Hemispherical total emissivity is one of the important thermophysical parameters of materials, which characterizes the surface thermal radiation ability of materials, and is an important basic physical property data for the study of radiation measurement, radiation heat transfer and thermal efficiency analysis. With the wide application of new materials in high-tech fields such as energy power and aerospace, more urgent needs have been put forward for the measurement of hemispherical total emissivity. Compared with other thermal physical parameters, the hemispherical total emissivity measurement method The technical research is still insufficient, and the data of the hemispherical full emissivity of different materials is still lacking. It is necessary to obtain the hemispherical full emissivity of the object through precise experimental measurement.

目前,材料半球向全发射率的测量方法主要有辐射光谱法和量热法。量热法因其设备结构简单,操作方便,精确度较高被广泛应用,其又可分为瞬态量热法和稳态量热法。稳态量热法的实验原理是通过测量样品在热平衡状态下的换热量和表面温度,计算出材料表面的半球向全发射率,国内外研究者采用了不同的样品规格和加热方式,形成了多种稳态量热技术应用模式。例如:At present, the methods for measuring the hemispherical total emissivity of materials mainly include radiation spectroscopy and calorimetry. Calorimetry is widely used because of its simple equipment structure, convenient operation, and high accuracy. It can be divided into transient calorimetry and steady-state calorimetry. The experimental principle of steady-state calorimetry is to calculate the hemispherical total emissivity of the material surface by measuring the heat transfer and surface temperature of the sample in thermal equilibrium. Researchers at home and abroad have adopted different sample specifications and heating methods to form A variety of steady-state calorimetry application modes have been developed. For example:

a.在真空室中利用加热片对材料底面进行加热,通过测量电流、电压以及材料上表面温度,计算材料的全波长发射率;a. Use the heating plate to heat the bottom surface of the material in the vacuum chamber, and calculate the full-wavelength emissivity of the material by measuring the current, voltage and temperature of the upper surface of the material;

b.将两片样品薄片紧贴在加热片的两面,利用加热片的导线将其悬挂在真空室中,通以电流加热,通过测量电功率以及材料表面温度,求解半球向全发射率;b. Stick two sample sheets on both sides of the heating sheet, hang them in the vacuum chamber with the wire of the heating sheet, heat them with current, and solve the hemispherical total emissivity by measuring the electric power and the surface temperature of the material;

c.选取细长带状样品在真空环境下通电加热(称之为热丝法),将带状样品的中央温度较均匀的区域视为测试分析区域,进而保证了样品测试分析区域的温度和能量测量的准确性。c. Select the slender strip sample and heat it under vacuum environment (called hot wire method), and regard the area where the central temperature of the strip sample is relatively uniform as the test analysis area, thereby ensuring the temperature and temperature of the sample test analysis area. Accuracy of energy measurements.

目前,现有的基于稳态量热法的半球向全发射率测量方法与系统,大都是适用于具有近似均匀温度分布测试区的样品测试,尽管热丝法通过选择更长尺寸的带状样品能够实现加热样品测试区温度近似均匀性的技术要求,但较长的热丝样品制备对于实验来说难度极大,甚至于对于特定的测试样品,根本无法满足该技术要求。因此,针对于实际导体材料的高温辐射热物性测量应用需求,发展一种适用于具有大温度梯度分布导体材料样品的半球向全发射率的测量方法,是很有意义的工作。At present, most of the existing hemispherical total emissivity measurement methods and systems based on steady-state calorimetry are suitable for testing samples with approximately uniform temperature distribution in the test area, although the hot wire method can be used to select longer strip samples The technical requirement of approximately uniform temperature in the test area of the heated sample can be achieved, but the preparation of a long hot wire sample is extremely difficult for the experiment, and even for a specific test sample, the technical requirement cannot be met at all. Therefore, it is very meaningful to develop a method for measuring the hemispherical total emissivity of conductive material samples with a large temperature gradient distribution in response to the application requirements of high-temperature radiation thermal physical property measurement of actual conductive materials.

发明内容Contents of the invention

(一)要解决的技术问题(1) Technical problems to be solved

本发明的目的是提供一种大温差样品的半球向全发射率的测量方法,以克服现有技术只适用于具有近似均匀温度分布测试区的导体材料样品,而无法对对大温度差样品进行测量的问题。The purpose of the present invention is to provide a method for measuring the hemispherical total emissivity of samples with large temperature difference, so as to overcome that the prior art is only applicable to conductor material samples with approximately uniform temperature distribution test area, and cannot be used for samples with large temperature difference. problem of measurement.

(二)技术方案(2) Technical solution

为了解决上述技术问题,本发明提供了一种大温差样品的半球向全发射率的测量方法,其特征在于,所述方法的步骤包括:In order to solve the above technical problems, the present invention provides a method for measuring the hemispherical total emissivity of a sample with a large temperature difference, characterized in that the steps of the method include:

S1.选取带状导体材料样品,在真空环境下加热所述样品,用辐射温度场测量设备获得加热稳定状态下的样品表面温度场分布;S1. Select a strip-shaped conductor material sample, heat the sample in a vacuum environment, and use a radiation temperature field measuring device to obtain a temperature field distribution on the surface of the sample in a stable heating state;

S2.将所述样品沿其轴向等分为多个微元控制体,建立微元控制体的稳态能量平衡方程;S2. Divide the sample into multiple microelement control volumes along its axial direction, and establish a steady-state energy balance equation for the microelement control volumes;

S3.基于样品的表面温度场分布以及样品两端的电压和电流,计算出在加热稳定状态下样品的半球向发射率随温度的数值分布。S3. Based on the surface temperature field distribution of the sample and the voltage and current at both ends of the sample, calculate the numerical distribution of the hemispherical emissivity of the sample with temperature in the heating steady state.

其中,所述步骤S2中将样品沿其轴向等分为N个微元控制体,每个微元控制体内的温度一致,微元控制体的稳态能量平衡方程为:Wherein, in the step S2, the sample is equally divided into N microelement control bodies along its axial direction, and the temperature in each microelement control body is consistent, and the steady-state energy balance equation of the microelement control body is:

Qjj·Sj·σ·(Tj 4-Te 4)+Aj·λj·(Tj+1+Tj-1-2Tj)/lj=0Q jj ·S j ·σ·(T j 4 -T e 4 )+A j ·λ j ·(T j+1 +T j-1 -2T j )/l j =0

其中,j为微元控制体的编号,j=2,…,N-1,j=1和j=N分别表示样品的边界微元控制体;Qj为样品微元控制体j的加热电功率,通过样品两端的电压和电流推算获得;(T1,T2,…TN)为每个微元控制体的温度,通过辐射温度场测量设备测量获得,为测量已知量;Te是真空水冷壁的温度,为测量已知量;εj是样品微元控制体j的半球向全发射率,即表示温度为Tj时的半球向全发射率,为未知量;σ是史蒂芬-波尔兹曼常数,为已知量;λj是样品微元控制体j的导热系数,即表示温度为Tj时的导热系数,为已知量;样品的长度为L、宽度w、厚度d、样品微元控制体j的长度lj=L/N、微元控制体j的横截面积Aj=w·d、微元控制体j的表面积Sj=2lj·(w+d),均为测量已知量。Among them, j is the number of the micro-element control body, j=2,...,N-1, j=1 and j=N respectively represent the boundary micro-element control body of the sample; Q j is the heating electric power of the sample micro-element control body j , obtained by calculating the voltage and current at both ends of the sample; (T 1 ,T 2 ,…T N ) is the temperature of each micro-element control body, obtained by measuring the radiation temperature field measurement equipment, and is a known quantity; T e is The temperature of the vacuum water wall is a known quantity; ε j is the hemispherical total emissivity of the sample element control body j, which means the hemispherical total emissivity when the temperature is T j , which is an unknown quantity; σ is Stephen- Boltzmann's constant is a known quantity; λ j is the thermal conductivity of the sample microelement control body j, which means the thermal conductivity when the temperature is T j , which is a known quantity; the length of the sample is L, width w, thickness d. The length l j =L/N of the micro-element control body j of the sample, the cross-sectional area A j =w d of the micro-element control body j, and the surface area S j =2l j ·(w+d ), are measured known quantities.

其中,由于样品的电阻率随温度作线性变化,则微元控制体j的加热电功率Qj为:Among them, since the resistivity of the sample changes linearly with the temperature, the heating electric power Q j of the micro-element control body j is:

Qj=I2·Rj,0(1+ρTj)Q j =I 2 ·R j,0 (1+ρT j )

式中,j=1,…,N;I为流过样品的电流,可测得,为测量已知量;ρ是样品电阻率温度系数,为已知量;Rj,0是0℃时的长度为lj的微元控制体的电阻,因为N个微元控制体的长度均相等,微元控制体的电阻Rj,0也都相等,均为R0In the formula, j=1,...,N; I is the current flowing through the sample, which can be measured, which is a known quantity; ρ is the temperature coefficient of the sample resistivity, which is a known quantity; R j,0 is at 0°C The resistance of the micro-element control body whose length is l j , because the lengths of the N micro-element control bodies are all equal, the resistances R j,0 of the micro-element control body are also equal, both are R 0 ;

样品两端的电压U为:The voltage U across the sample is:

Uu == II ·· RR 00 ·&Center Dot; ΣΣ jj == 11 NN (( 11 ++ ρTρT jj ))

根据电压U、电流I、微元控制体的温度Tj以及样品电阻率温度系数ρ计算得到微元控制体的电阻R0,将Qj=I2·Rj,0(1+ρTj)代入稳态能量平衡方程,联立求解微元控制体的能量平衡方程组,就得到了稳定加热状态下的样品半球向全发射率随温度的数值分布。The resistance R 0 of the micro-element control body is calculated according to the voltage U, current I, temperature T j of the micro-element control body and the temperature coefficient of sample resistivity ρ, and Q j = I 2 ·R j,0 (1+ρT j ) Substituting the steady-state energy balance equation and simultaneously solving the energy balance equations of the micro-element control body, the numerical distribution of the hemispherical total emissivity of the sample with temperature under the steady heating state is obtained.

其中,所述辐射温度场测量设备在使用前进行标定校准。Wherein, the radiation temperature field measurement equipment is calibrated and calibrated before use.

其中,所述辐射温度场测量设备标定校准的内容包括:辐射温度场测量设备使用前,设置样品与辐射温度场测量设备间的距离,并调整辐射温度场测量设备的测量光路垂直于样品表面;测试路径中的光学窗口的光谱透射率数值,辐射温度场测量设备通过真空腔壁面的光学窗口能够观测到样品表面;测试样品的光谱发射率数值,光谱范围应与辐射温度场测量设备的测量光谱相对应。Wherein, the content of calibration and calibration of the radiation temperature field measurement equipment includes: before using the radiation temperature field measurement equipment, setting the distance between the sample and the radiation temperature field measurement equipment, and adjusting the measurement optical path of the radiation temperature field measurement equipment to be perpendicular to the sample surface; The spectral transmittance value of the optical window in the test path, the radiation temperature field measuring equipment can observe the sample surface through the optical window on the wall of the vacuum chamber; the spectral emissivity value of the test sample, the spectral range should be the same as the measurement spectrum of the radiation temperature field measuring equipment Corresponding.

其中,所述辐射温度场测量设备为热像仪。Wherein, the radiation temperature field measurement device is a thermal imager.

其中,所述步骤S1中将带状导体样品两端固定在样品夹具上,放置于水冷内壁的真空腔中,带状导体样品两端通电加热到稳定温度状态。Wherein, in the step S1, the two ends of the strip conductor sample are fixed on the sample holder, placed in a vacuum chamber with a water-cooled inner wall, and the two ends of the strip conductor sample are energized and heated to a stable temperature state.

其中,所述样品的温度测试范围为300℃~2000℃。Wherein, the temperature test range of the sample is 300°C to 2000°C.

(三)有益效果(3) Beneficial effects

本发明的大温差材料的半球向全发射率的测量方法用辐射温度场测量设备获得加热稳定状态下的样品表面温度场分布,然后将样品沿其轴向等分为多个微元控制体,建立微元控制体的稳态能量平衡方程,最后基于样品的表面温度场分布以及样品两端的电压和电流,计算出在加热稳定状态下样品的半球向发射率随温度的数值分布,这种方法适用于测量具有大温度梯度分布的导体材料的半球向全发射率,克服了现有稳态量热法对于样品具有温度均匀测试区要求的技术局限性,极大地减小了对样品尺寸规格的限制,简单可行,同时,通过采用辐射温度场测量设备获取加热样品表面温度场分布信息,这种测试方式比接触式热电偶点测温方式更为优越,避免了安装热电偶的复杂操作、热电偶导线导热损失影响以及仅能实现有限点测量等技术缺陷。The method for measuring the hemispherical total emissivity of the large temperature difference material of the present invention uses radiation temperature field measuring equipment to obtain the temperature field distribution on the surface of the sample in a stable heating state, and then divides the sample into multiple microelement control bodies along its axial direction, Establish the steady-state energy balance equation of the micro-element control body, and finally calculate the numerical distribution of the hemispherical emissivity of the sample with temperature under the heating steady state based on the surface temperature field distribution of the sample and the voltage and current at both ends of the sample. It is suitable for measuring the hemispherical total emissivity of conductor materials with a large temperature gradient distribution, overcomes the technical limitations of the existing steady-state calorimetry method for samples with uniform temperature test areas, and greatly reduces the constraints on sample size specifications At the same time, by using the radiation temperature field measurement equipment to obtain the temperature field distribution information on the surface of the heated sample, this test method is superior to the contact thermocouple point temperature measurement method, avoiding the complicated operation of installing thermocouples, thermoelectric Technical defects such as the influence of heat conduction loss of the pair wire and the limited point measurement can only be realized.

具体实施方式detailed description

下面结合附图和实施例对本发明的实施方式作进一步详细描述。以下实施例用于说明本发明,但不能用来限制本发明的范围。Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but should not be used to limit the scope of the present invention.

本实施例的大温差材料的半球向全发射率的测量方法适用于测量具有大温度梯度分布的导体材料的半球向全发射率,所述方法的具体步骤包括:The method for measuring the hemispherical total emissivity of materials with a large temperature difference in this embodiment is suitable for measuring the hemispherical total emissivity of conductor materials with a large temperature gradient distribution, and the specific steps of the method include:

S1.选取带状导体材料样品,将带状导体样品两端固定在样品夹具上,放置于水冷内壁的真空腔中,将真空腔抽真空至1.0×10-3Pa,将带状导体样品两端通电加热到稳定温度状态,温度范围优选为300℃~2000℃。S1. Select a strip conductor material sample, fix both ends of the strip conductor sample on the sample holder, place it in a vacuum chamber with a water-cooled inner wall, evacuate the vacuum chamber to 1.0×10 -3 Pa, and place the strip conductor sample in two The terminal is energized and heated to a stable temperature state, and the temperature range is preferably 300°C to 2000°C.

带状导体材料样品的温度分布均匀性与样品长度尺寸相关,样品长度越长,温度分布越均匀,样品温度均匀性的实现是较为苛刻的技术要求,使样品制备较为困难。本实施例为了易于加工选择长度较小的带状导体材料样品(长度为100mm,宽度为10mm,厚度为0.1mm),但是,由于样品夹具两端冷却效应,在这种较短的样品轴向方向会存在较大的温度梯度,即带状导体材料样品轴向温度分布不均匀。The temperature distribution uniformity of strip conductor material samples is related to the sample length and size. The longer the sample length, the more uniform the temperature distribution. The realization of sample temperature uniformity is a relatively strict technical requirement, which makes sample preparation more difficult. In order to be easy to process, this embodiment selects a strip-shaped conductor material sample (length is 100mm, width is 10mm, and thickness is 0.1mm), but, due to the cooling effect at both ends of the sample holder, in this shorter sample axial direction There will be a large temperature gradient in the direction, that is, the axial temperature distribution of the strip conductor material sample is not uniform.

为了克服上述问题,在加热稳定状态下,本实施例采用非接触方式的辐射温度场测量设备对带状导体材料样品进行温度测量,辐射温度场测量设备经标定校准后,可以测量获得加热样品表面温度场分布信息,样品温度场分布信息的测量为后续求解半球向全发射率提供了重要的数据源。这种温度测量方式比接触式热电偶点测温方式更为优越,避免了安装热电偶的复杂操作、热电偶导线导热损失影响以及仅能实现有限点测量等技术缺陷。In order to overcome the above problems, in the heating steady state, this embodiment uses a non-contact radiation temperature field measurement device to measure the temperature of the strip conductor material sample. After the radiation temperature field measurement device is calibrated, it can measure and obtain the surface of the heated sample. The temperature field distribution information and the measurement of the sample temperature field distribution information provide an important data source for the subsequent calculation of the hemispherical total emissivity. This temperature measurement method is superior to the contact thermocouple point temperature measurement method, and avoids technical defects such as the complicated operation of installing the thermocouple, the influence of the heat conduction loss of the thermocouple wire, and the limited point measurement.

本实施例的辐射温度场测量设备选用热像仪,其标定校准的内容包括:a)热像仪使用前,设置样品与热像仪的距离,并调整热像仪的测量光路垂直于样品表面;b)知晓测试路径中的光学窗口的光谱透射率数值,热像仪通过真空腔壁面的光学窗口能够观测到样品表面;c)知晓测试样品的光谱发射率数值,光谱范围应与热像仪的测量光谱相对应。The radiation temperature field measuring equipment of this embodiment selects a thermal imager, and the content of its calibration and calibration includes: a) Before using the thermal imager, set the distance between the sample and the thermal imager, and adjust the measurement optical path of the thermal imager to be perpendicular to the surface of the sample ; b) knowing the spectral transmittance value of the optical window in the test path, the thermal imager can observe the sample surface through the optical window on the wall of the vacuum chamber; c) knowing the spectral emissivity value of the test sample, the spectral range should be the same as that of the thermal imager corresponding to the measured spectrum.

S2.在稳定加热状态,带状导体材料样品轴向温度分布不均匀,具有较大温度梯度,样品长度尺寸大于其宽度尺寸和厚度尺寸,可将样品看作是沿长度方向(即轴向)上一维稳态导热问题,由于样品沿轴向温度分布不均匀,无法按等温表面处理,因此,将样品沿轴向等分为N个微元控制体,每个微元控制体内的温度一致,微元控制体的稳态能量平衡方程为:S2. In a stable heating state, the axial temperature distribution of the strip-shaped conductor material sample is uneven, with a large temperature gradient, and the length of the sample is greater than its width and thickness. The sample can be regarded as along the length direction (that is, the axial direction) For the one-dimensional steady-state heat conduction problem, since the temperature distribution of the sample along the axial direction is not uniform, it cannot be treated as an isothermal surface. Therefore, the sample is divided into N micro-element control bodies along the axial direction, and the temperature in each micro-element control body is consistent. , the steady-state energy balance equation of the micro-element control volume is:

Qjj·Sj·σ·(Tj 4-Te 4)+Aj·λj·(Tj+1+Tj-1-2Tj)/lj=0Q jj ·S j ·σ·(T j 4 -T e 4 )+A j ·λ j ·(T j+1 +T j-1 -2T j )/l j =0

其中,j为微元控制体的编号,j=2,…,N-1,j=1和j=N分别表示样品的边界微元控制体;Qj为样品微元控制体j的加热电功率,通过样品两端的电压和电流推算获得;(T1,T2,…TN)为每个微元控制体的温度,通过辐射温度场测量设备测量获得,为测量已知量;Te是真空水冷壁的温度,为测量已知量;εj是样品微元控制体j的半球向全发射率,即表示温度为Tj时的半球向全发射率,为未知量;σ是史蒂芬-波尔兹曼常数,为已知量;λj是样品微元控制体j的导热系数,即表示温度为Tj时的导热系数,为已知量;样品的长度为L、宽度w、厚度d、样品微元控制体j的长度lj=L/N、微元控制体j的横截面积Aj=w·d、微元控制体j的表面积Sj=2lj·(w+d),均为测量已知量。Among them, j is the number of the micro-element control body, j=2,...,N-1, j=1 and j=N respectively represent the boundary micro-element control body of the sample; Q j is the heating electric power of the sample micro-element control body j , obtained by calculating the voltage and current at both ends of the sample; (T 1 ,T 2 ,…T N ) is the temperature of each micro-element control body, obtained by measuring the radiation temperature field measurement equipment, and is a known quantity; T e is The temperature of the vacuum water wall is a known quantity; ε j is the hemispherical total emissivity of the sample element control body j, which means the hemispherical total emissivity when the temperature is T j , which is an unknown quantity; σ is Stephen- Boltzmann's constant is a known quantity; λ j is the thermal conductivity of the sample microelement control body j, which means the thermal conductivity when the temperature is T j , which is a known quantity; the length of the sample is L, width w, thickness d. The length l j =L/N of the micro-element control body j of the sample, the cross-sectional area A j =w d of the micro-element control body j, and the surface area S j =2l j ·(w+d ), are measured known quantities.

本实施例中将100mm长的样品沿轴向等分为100个微元控制体,即N=100,微元控制体的稳态能量平衡方程组:In this embodiment, the 100mm-long sample is divided into 100 micro-element control bodies along the axial direction, that is, N=100, the steady-state energy balance equations of the micro-element control volume:

ϵϵ 22 ·· SS ·· σσ ·&Center Dot; (( TT 22 44 -- TT ee 44 )) -- AA ·&Center Dot; λλ 22 ·· (( TT 33 ++ TT 11 -- 22 TT 22 )) // ll == QQ 22 .. .. .. ϵϵ 9999 ·&Center Dot; SS ·&Center Dot; σσ ·&Center Dot; (( TT 9999 44 -- TT ee 44 )) -- AA ·· λλ 9999 .. (( TT 100100 ++ TT 9898 -- 22 TT 9999 )) // ll == QQ 9999

S3.由于样品的电阻率随温度作线性变化,则微元控制体j的加热电功率Qj为:S3. Since the resistivity of the sample changes linearly with the temperature, the heating electric power Q j of the micro-element control body j is:

Qj=I2·Rj,0(1+ρTj)Q j =I 2 ·R j,0 (1+ρT j )

其中,j=1,…,N;I为流过样品的电流,可测得,为测量已知量;ρ是样品电阻率温度系数,为已知量;Rj,0是0℃时的长度为lj的微元控制体的电阻,因为N个微元控制体的长度均相等,微元控制体的电阻Rj,0也都相等,均为R0Among them, j=1,...,N; I is the current flowing through the sample, which can be measured, which is a known quantity; ρ is the temperature coefficient of the sample resistivity, which is a known quantity; R j,0 is the value at 0°C The resistance of the micro-element control body whose length is l j , because the lengths of N micro-element control bodies are all equal, the resistances R j,0 of the micro-element control body are also equal, all of which are R 0 .

样品两端的电压U为:The voltage U across the sample is:

Uu == II ·· RR 00 ·&Center Dot; ΣΣ jj == 11 NN (( 11 ++ ρTρT jj ))

根据电压U、电流I、微元控制体的温度Tj以及样品电阻率温度系数ρ计算得到微元控制体的电阻R0,就得到了加热电功率Qj关于微元控制体j的温度Tj的表达式Qj=I2·Rj,0(1+ρTj),将所述表达式代入稳态能量平衡方程,得到微元控制体j的半球向全发射率εj关于微元控制体j的温度Tj的稳态能量平衡方程,联立求解微元控制体的能量平衡方程组,可以获得不同温度下的样品半球向全发射率数值。Calculate the resistance R 0 of the micro-element control body according to the voltage U, current I, temperature T j of the micro-element control body and the temperature coefficient of sample resistivity ρ, and then obtain the heating electric power Q j with respect to the temperature T j of the micro-element control body j The expression Q j =I 2 ·R j,0 (1+ρT j ), put the expression into the steady-state energy balance equation, and get the hemispherical total emissivity ε j of the micro-element control body j with respect to the micro-element control The steady-state energy balance equation of the temperature T j of the body j, and the simultaneous solution of the energy balance equations of the micro-element control body can obtain the hemispherical total emissivity values of the sample at different temperatures.

把每个微元控制体看做一个温度点,那么这个稳态能量平衡方程也就能反映出了稳定加热状态下的样品半球向全发射率随温度的数值分布。Considering each micro-element control body as a temperature point, then this steady-state energy balance equation can also reflect the numerical distribution of the hemispherical total emissivity of the sample with temperature in a stable heating state.

本发明的实施例是为了示例和描述起见而给出的,而并不是无遗漏的或者将本发明限于所公开的形式。很多修改和变化对于本领域的普通技术人员而言是显而易见的。选择和描述实施例是为了更好说明本发明的原理和实际应用,并且使本领域的普通技术人员能够理解本发明从而设计适于特定用途的带有各种修改的各种实施例。The embodiments of the present invention have been presented for purposes of illustration and description, but are not intended to be exhaustive or to limit the invention to the form disclosed. Many modifications and changes will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to better explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention and design various embodiments with various modifications as are suited to the particular use.

Claims (6)

1. the hemisphere of large difference sample is to a measuring method for total emissivity, it is characterized in that, the step of described method comprises:
S1. tape conductor material sample is chosen, described sample two ends are fixed on sample clamp, be positioned in the vacuum chamber with water-cooled inwall, and by described sample two ends electrified regulation to equilibrium temperature state, obtain the described sample surface temperature field distribution under thermal-stable state with radiant temperature field measuring equipment;
S2. described sample is axially divided into multiple infinitesimal control volume along it, sets up the steady state energy balance equation of infinitesimal control volume;
S3. based on the surface temperature field distribution of described sample and the voltage and current at sample two ends, the hemisphere calculating described sample under thermal-stable state is to the numeric distribution of emissivity with temperature;
In described step S2, sample is axially divided into N number of infinitesimal control volume along it, the temperature in each infinitesimal control volume is consistent, and the steady state energy balance equation of infinitesimal control volume is:
Q jj·S j·σ·(T j 4-T e 4)+A j·λ j·(T j+1+T j-1-2T j)/l j=0
In formula, j is the numbering of infinitesimal control volume, j=2 ..., N-1, j=1 and j=N represent the border infinitesimal control volume of sample respectively; Q jfor the heating electric power of sample infinitesimal control volume j, calculated by the voltage and current at sample two ends and obtain; (T 1, T 2... T n) be the temperature of each infinitesimal control volume, being measured by radiant temperature field measuring equipment and obtain, is measure known quantity; T ethe temperature of the water-cooled inwall of described vacuum chamber, for measuring known quantity; ε jbe the hemisphere of sample infinitesimal control volume j to total emissivity, namely represent temperature be T jtime hemisphere to total emissivity, be unknown quantity; σ is Shi Difen-Boltzmann constant, is known quantity; λ jbe the coefficient of heat conductivity of sample infinitesimal control volume j, namely represent that temperature is T jtime coefficient of heat conductivity, be known quantity; The length of sample is the length l of L, width w, thickness d, sample infinitesimal control volume j jthe cross-sectional area A of=L/N, infinitesimal control volume j jthe surface area S of=wd, infinitesimal control volume j j=2l j(w+d) measurement known quantity, is.
2. the hemisphere of large difference sample according to claim 1 is to the measuring method of total emissivity, it is characterized in that, because the resistivity of sample makes linear change with temperature, then and the heating electric power Q of infinitesimal control volume j jfor:
Q j=I 2·R j,0(1+ρT j)
Wherein, j=1 ..., N; I is the electric current flowing through sample, can record, for measuring known quantity; ρ is sample resistivity temperature coefficient, is known quantity; R j, 0length when being 0 DEG C is l jthe resistance of infinitesimal control volume because the identical length etc. of N number of infinitesimal control volume, the resistance R of infinitesimal control volume j, 0also all equal, be R 0;
The voltage U at sample two ends is:
U = I · R 0 · Σ j = 1 N ( 1 + ρT j )
According to the temperature T of voltage U, electric current I, infinitesimal control volume jand sample resistivity temperature coefficient ρ calculates the resistance R of infinitesimal control volume 0, by Q j=I 2r j, 0(1+ ρ T j) substitute into steady state energy balance equation, the energy equation of simultaneous solution infinitesimal control volume, just obtain sample hemisphere under stable heated condition to the numeric distribution of total emissivity with temperature.
3. the hemisphere of large difference sample according to claim 1 is to the measuring method of total emissivity, it is characterized in that, described radiant temperature field measuring equipment carries out demarcation calibration before use.
4. the hemisphere of large difference sample according to claim 3 is to the measuring method of total emissivity, it is characterized in that, the content that calibration demarcated by described radiant temperature field measuring equipment comprises: before radiant temperature field measuring equipment uses, distance between sample and radiant temperature field measuring equipment is set, and the optical path adjusting radiant temperature field measuring equipment is perpendicular to sample surfaces; The spectral transmission rate score of the optical window in test path, radiant temperature field measuring equipment can observe sample surfaces by the optical window of vacuum chamber wall; The spectral emissions rate score of test sample, spectral range is corresponding with the measure spectrum of radiant temperature field measuring equipment.
5. the hemisphere of large difference sample according to claim 1 is to the measuring method of total emissivity, it is characterized in that, described radiant temperature field measuring equipment is thermal imaging system.
6. according to the hemisphere of the large difference sample in claim 1-5 described in any one to the measuring method of total emissivity, it is characterized in that, the Range of measuring temp of described sample is 300 DEG C ~ 2000 DEG C.
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