CN103286405B - Method for separating elements and solder from waste printed circuit board - Google Patents
Method for separating elements and solder from waste printed circuit board Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000002699 waste material Substances 0.000 title claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 109
- 229910052593 corundum Inorganic materials 0.000 claims abstract description 49
- 239000010431 corundum Substances 0.000 claims abstract description 49
- 238000005476 soldering Methods 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims description 13
- 238000000926 separation method Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 238000011084 recovery Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 4
- 231100000331 toxic Toxicity 0.000 description 4
- 230000002588 toxic effect Effects 0.000 description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000003546 flue gas Substances 0.000 description 3
- 239000003517 fume Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004093 laser heating Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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Abstract
本发明公开了一种从废弃印刷电路板上分离元件和焊料的方法，其特征在于：采用棕刚玉颗粒作为加热介质，首先利用平底电炉将棕刚玉颗粒进行加热；然后将印刷电路板的焊接面朝下，平放在已经被加热的棕刚玉颗粒上，并在印刷电路板的元件面垂直向下施力，使得焊接面与加热的棕刚玉颗粒充分接触，待焊料完全融化后，将印刷电路板取出，焊接面朝上，元件面朝下，对焊接面施加垂向冲击力，使焊料和元件得以从印刷电路板上分离。本发明方法能耗低、成本低、分离效率高、分离效果好。The invention discloses a method for separating components and solder from a waste printed circuit board, which is characterized in that brown corundum particles are used as a heating medium, and the brown corundum particles are first heated by a flat-bottomed electric furnace; then the soldering surface of the printed circuit board is heated Facing down, put it flat on the heated brown fused alumina particles, and apply force vertically downward on the component surface of the printed circuit board, so that the soldering surface is in full contact with the heated brown fused alumina particles. After the solder is completely melted, the printed circuit board The board is taken out with the soldering side up and the components down, and a vertical impact is applied to the soldering side to separate the solder and components from the printed circuit board. The method of the invention has low energy consumption, low cost, high separation efficiency and good separation effect.
Description
技术领域 technical field
本发明涉及一种从废弃印刷电路板上分离元件和焊料的方法。The present invention relates to a method of separating components and solder from waste printed circuit boards.
背景技术 Background technique
印刷电路板简称PCB，是电子电器产品不可或缺的组成部分。随着电子工业的飞速发展和高新技术的不断应用，淘汰的电子电器数量激增，由此产生了大量的废弃印刷电路板，若不加以合适的回收处理，将会给环保带来严重的威胁。实验检测表明，废弃印刷电路板上的元件大多数功能完好，尚可继续使用；同时，由于电子元件中含有各种有毒、有害物质和贵重金属，在进行电路板回收处理之前，若将其上的元件进行拆除，可以大大简化后续的回收工艺，尤其是降低后续处理中环保设备的投资成本。因此，针对废弃的印刷电路板进行元件和焊料的分离，一是获得可以重用的元件，二是简化后续的回收工艺。Printed circuit board, referred to as PCB, is an indispensable part of electronic and electrical products. With the rapid development of the electronics industry and the continuous application of high-tech, the number of eliminated electronic appliances has increased sharply, resulting in a large number of waste printed circuit boards, which will pose a serious threat to environmental protection if they are not properly recycled. Experimental testing shows that most of the components on the discarded printed circuit boards are functional and can still be used; at the same time, because electronic components contain various toxic and harmful substances and precious metals, before recycling the circuit boards, if they are The removal of the components can greatly simplify the subsequent recycling process, especially to reduce the investment cost of environmental protection equipment in the subsequent processing. Therefore, the separation of components and solder for waste printed circuit boards is to obtain reusable components and to simplify the subsequent recycling process.
国内外现有的从废弃印刷电路板上分离元件和焊料的方法主要有：The existing methods of separating components and solder from waste printed circuit boards at home and abroad mainly include:
1、空气加热法：中国专利CN101417358A和CN1600458A,通过加热设备将空气加热，使热空气与印刷电路板相接触，利用热空气与印刷电路板之间的温度差，引起热量的传递从而使焊料达到融化的温度。但空气导热率低，加热时间长，热量损失多；加热过程中元件因高温而产生有毒有害物质，污染环境。1. Air heating method: Chinese patents CN101417358A and CN1600458A, the air is heated by heating equipment, so that the hot air is in contact with the printed circuit board, and the temperature difference between the hot air and the printed circuit board is used to cause heat transfer so that the solder reaches melting temperature. However, the thermal conductivity of the air is low, the heating time is long, and the heat loss is large; during the heating process, the components produce toxic and harmful substances due to high temperature, which pollutes the environment.
2、红外加热法：美国专利US4270260和US6301436B1，利用红外加热器向印刷电路板辐射出一定波长的红外线，电路板因吸收红外射线从而引发自身分子结构发生激烈的振荡而产生热能，实现焊料的融化。该方法工艺复杂，加热设备及配套设施要求较高，且加热过程中往往由于色敏效应和屏蔽现象引起不同元件间的温度差异；另外，元件内部容易产生较高的热应力，从而降低回收元件的使用寿命。2. Infrared heating method: U.S. patents US4270260 and US6301436B1 use infrared heaters to radiate infrared rays of a certain wavelength to the printed circuit board, and the circuit board absorbs infrared rays to cause intense oscillation of its own molecular structure to generate heat energy to realize the melting of solder . This method is complicated in process, requires high heating equipment and supporting facilities, and the temperature difference between different components is often caused by color sensitivity effect and shielding phenomenon during the heating process; in addition, high thermal stress is easily generated inside the components, thereby reducing the recovery of components. service life.
3、激光加热法：欧洲专利EP13345-A，以激光作为加热源，利用激光束良好的方向性和功率密度高的特点，通过光学系统将激光束聚集并直接照射在元件的焊点上，使得焊料瞬时融化。该方法需要成套设备，成本高，工艺复杂，且是点对点的加热方式，拆卸效率低。此法只适合于分离个别高价值的元件。3. Laser heating method: European patent EP13345-A, using laser as a heating source, using the characteristics of good directionality and high power density of the laser beam, the laser beam is gathered and directly irradiated on the solder joint of the component through the optical system, so that The solder melts instantaneously. This method requires a complete set of equipment, high cost, complex process, point-to-point heating, and low disassembly efficiency. This method is only suitable for separating individual high-value components.
4、硅油加热法：中国专利CN1832663A，将印刷电路板浸没在高温的液体硅油中，使焊接面的焊料产生融化。该方法会产生大量有毒、有害气体，包括液体硅油挥发产生的气体以及印刷电路板基材和元件产生的气体。另外，分离后的元件和焊料上附着有大量的硅油，给后续的清洗带来很多麻烦。4. Silicone oil heating method: Chinese patent CN1832663A, immersing the printed circuit board in high-temperature liquid silicone oil to melt the solder on the welding surface. This method will produce a large amount of toxic and harmful gases, including the gases produced by the volatilization of liquid silicone oil and the gases produced by printed circuit board substrates and components. In addition, a large amount of silicone oil adheres to the separated components and solder, which brings a lot of trouble to subsequent cleaning.
5、焊料加热法：中国专利CN101695706A，先用锡炉将固体焊料融化，然后将印刷电路板不含元件的一面与液态焊料充分接触，最后将印刷电路板焊接面朝上，采用振动拍打的方式将元件分离。这种方法有两个缺点，一是液态焊料在加热过程会产生大量的有毒、有害烟气（包括焊料中的重金属铅、电路板基材和元件挥发的烟气等），二是从液态焊料表面取走电路板的时候，焊接面会带走锡炉中价格昂贵的焊料，随着时间的推移，锡炉中的焊料会越来越少。5. Solder heating method: Chinese patent CN101695706A, first melt the solid solder with a tin furnace, then fully contact the side of the printed circuit board that does not contain components with the liquid solder, and finally place the soldered side of the printed circuit board upwards, using the method of vibrating and beating Separate the components. This method has two disadvantages. One is that the liquid solder will produce a large amount of toxic and harmful fumes during the heating process (including heavy metal lead in the solder, fumes volatilized from the circuit board substrate and components, etc.), and the other is that the fumes from the liquid solder When the surface removes the circuit board, the soldering surface will take away the expensive solder in the tin pot, and over time, the solder in the tin pot will become less and less.
发明内容 Contents of the invention
本发明是为避免上述现有技术所存在的不足之处，提供一种能耗低、成本低、分离效率高、分离效果好的从废弃印刷电路板上分离元件和焊料的方法。The present invention aims to avoid the disadvantages of the above-mentioned prior art, and provides a method for separating components and solder from waste printed circuit boards with low energy consumption, low cost, high separation efficiency and good separation effect.
本发明为解决技术问题采用如下技术方案：The present invention adopts following technical scheme for solving technical problems:
本发明从废弃印刷电路板上分离元件和焊料的方法的特点是：采用棕刚玉颗粒作为加热介质，首先利用平底电炉将棕刚玉颗粒进行加热；然后将印刷电路板的焊接面朝下，平放在已经被加热的棕刚玉颗粒上，并在印刷电路板的元件面垂直向下施力，使得焊接面与加热的棕刚玉颗粒充分接触，待焊料完全融化后，将印刷电路板取出，焊接面朝上，元件面朝下，对焊接面施加垂向冲击力，使焊料和元件得以从印刷电路板上分离。The characteristics of the method for separating components and solder from waste printed circuit boards in the present invention are as follows: brown corundum particles are used as heating medium, and the brown corundum particles are firstly heated by a flat-bottomed electric furnace; On the heated brown fused alumina particles, and apply force vertically downward on the component surface of the printed circuit board, so that the soldering surface is in full contact with the heated brown fused alumina particles. After the solder is completely melted, take out the printed circuit board, and the soldering surface Upward, component side down, applies a vertical impact force to the soldering surface to separate the solder and component from the PCB.
本发明从废弃印刷电路板上分离元件和焊料的方法的特点也在于按如下步骤进行：The feature of the method for separating component and solder of the present invention from waste printed circuit board also is to carry out as follows:
a、将混合均匀的不同粒径的棕刚玉颗粒放入可控温的平底电炉中，并使其表面平整；a. Put evenly mixed brown corundum particles of different particle sizes into a temperature-controllable flat-bottomed electric furnace, and make the surface smooth;
b、利用可控温的平底电炉将棕刚玉颗粒加热到350-390℃，并保持在350-390℃；b. Use a temperature-controllable flat-bottomed electric furnace to heat the brown corundum particles to 350-390°C and keep them at 350-390°C;
c、将印刷电路板的焊接面朝下，平放在棕刚玉颗粒上，并在印刷电路板的元件面垂直向下施力，使得焊接面与棕刚玉颗粒充分接触，加热3-4分钟使焊接面的焊料完全融化；c. Place the soldering surface of the printed circuit board down on the brown fused alumina particles, and apply force vertically downwards on the component surface of the printed circuit board, so that the soldering surface is in full contact with the brown fused alumina particles, and heat for 3-4 minutes. The solder on the soldering surface is completely melted;
d、取出印刷电路板，使其焊接面朝上、元件面朝下，对焊接面施加垂向冲击力使其震动，使焊料和元件得以从印刷电路板上分离。d. Take out the printed circuit board, make its soldering surface face up and the component face down, and apply vertical impact force to the soldering surface to vibrate, so that the solder and components can be separated from the printed circuit board.
本发明从废弃印刷电路板上分离元件和焊料的方法的特点还在于：The method of the present invention for separating components and solder from waste printed circuit boards is also characterized by:
所述不同粒径的棕刚玉颗粒按质量百分比的组成是：粒径2-3mm的为10-30%、粒径1-2mm的为40-60%，粒径不大于1mm的为10-40%。The composition of the brown corundum particles with different particle sizes by mass percentage is: 10-30% for particles with a particle size of 2-3mm, 40-60% for particles with a particle size of 1-2mm, and 10-40% for particles with a particle size not greater than 1mm. %.
所述对焊接面施加垂向冲击力是指：采用往复式气动冲击装置对焊接面施加频率为每秒钟5次的垂向冲击力。The said applying vertical impact force to the welding surface means: using a reciprocating pneumatic impact device to apply vertical impact force to the welding surface with a frequency of 5 times per second.
与现有技术相比，本发明具有以下优点：Compared with the prior art, the present invention has the following advantages:
1、本发明方法能耗低，热量损失小。棕刚玉主要化学成份是Al2O3，热传导系数比空气和液体高很多。对棕刚玉颗粒进行加热，温度上升快，热量损失小；1. The method of the present invention has low energy consumption and small heat loss. The main chemical composition of brown fused alumina is Al 2 O 3 , and its thermal conductivity is much higher than that of air and liquid. Heating brown corundum particles, the temperature rises quickly and the heat loss is small;
2、本发明方法成本低廉。采用棕刚玉颗粒作为传热介质，价格非常低廉，且可反复使用，性质和质量均不会改变，电炉加热成本也很低；2. The method of the present invention has low cost. Brown corundum particles are used as the heat transfer medium, the price is very low, and can be used repeatedly, the properties and quality will not change, and the heating cost of the electric furnace is also very low;
3、本发明方法产生烟气少。棕刚玉的热传导系数高，对电路板上焊料的加热速度快，适当控制加热温度和加热时间，电路板不会被烧焦，元件也不容易被损坏，相对于液体加热和空气加热，产生的烟气要少很多，后续的烟气治理费用相对来说也要低一些；3. The method of the present invention produces less flue gas. Brown fused alumina has a high thermal conductivity and can heat the solder on the circuit board quickly. If the heating temperature and heating time are properly controlled, the circuit board will not be burned and the components will not be easily damaged. Compared with liquid heating and air heating, the resulting The flue gas is much less, and the cost of subsequent flue gas treatment is relatively lower;
4、本发明方法分离效率高。由于是印刷电路板的整个焊接面与棕刚玉颗粒充分接触，所以加热速度快，分离效率比空气加热、红外加热以及激光加热都要高；4. The method of the present invention has high separation efficiency. Since the entire welding surface of the printed circuit board is in full contact with the brown fused alumina particles, the heating speed is fast and the separation efficiency is higher than that of air heating, infrared heating and laser heating;
5、本发明方法分离效果好。印刷电路板的焊接面与棕刚玉颗粒充分接触，温度上升快，焊接面呈熔融态的焊点表面张力小，当施以高频的垂向冲击力时，元件和焊料快速地从电路板上脱落，分离效果好；5. The method of the present invention has a good separation effect. The welding surface of the printed circuit board is in full contact with the brown corundum particles, the temperature rises rapidly, and the surface tension of the solder joints in the molten state is small. When a high-frequency vertical impact is applied, the components and solder are quickly removed from the circuit board. Shedding, good separation effect;
6、本发明方法操作安全。采用固态的颗粒状的棕刚玉进行热传导，在分离过程中不会产生液态加热介质的溅射现象，操作者的安全得到了保证。6. The method of the present invention is safe to operate. The solid granular brown corundum is used for heat conduction, and there will be no sputtering of the liquid heating medium during the separation process, and the safety of the operator is guaranteed.
具体实施方式 Detailed ways
具体实施中，从废弃印刷电路板上分离元件和焊料的方法是按如下步骤进行：In specific implementation, the method for separating components and solder from the waste printed circuit board is carried out as follows:
1、将混合均匀的不同粒径的棕刚玉颗粒放入可控温的平底电炉中，并使其表面平整；1. Put evenly mixed brown corundum particles of different particle sizes into a temperature-controllable flat-bottomed electric furnace, and make the surface smooth;
2、利用可控温的平底电炉将棕刚玉颗粒加热到350-390℃，并保持在350-390℃；2. Use a temperature-controllable flat-bottomed electric furnace to heat the brown corundum particles to 350-390°C and keep them at 350-390°C;
3、将印刷电路板的焊接面朝下，平放在棕刚玉颗粒上，并在印刷电路板的元件面垂直向下施力，使得焊接面与棕刚玉颗粒充分接触，加热3-4分钟使焊接面的焊料完全融化；3. Place the soldering side of the printed circuit board down on the brown fused alumina particles, and apply force vertically downwards on the component surface of the printed circuit board, so that the soldering surface is fully in contact with the brown fused alumina particles, and heat for 3-4 minutes. The solder on the soldering surface is completely melted;
4、取出印刷电路板，使其焊接面朝上、元件面朝下，对焊接面施加垂向冲击力使其震动，使焊料和元件得以从印刷电路板上分离。4. Take out the printed circuit board so that the soldering surface faces up and the components face down, and apply a vertical impact force to the soldering surface to make it vibrate, so that the solder and components can be separated from the printed circuit board.
具体实施中，不同粒径的棕刚玉颗粒按质量百分比的组成是：粒径2-3mm的为10-30%、粒径1-2mm的为40-60%，粒径不大于1mm的为10-40%。In specific implementation, the composition of brown corundum particles with different particle sizes by mass percentage is: 10-30% for particles with a particle size of 2-3mm, 40-60% for particles with a particle size of 1-2mm, and 10% for particles with a particle size not greater than 1mm. -40%.
对焊接面施加垂向冲击力是指：采用往复式气动冲击装置对焊接面施加频率为每秒钟5次的垂向冲击力。Applying vertical impact force to the welding surface refers to applying a vertical impact force with a frequency of 5 times per second to the welding surface by using a reciprocating pneumatic impact device.
实施例1：Example 1:
本实施例从废弃印刷电路板上分离元件和焊料的方法是：The method for separating components and solder from waste printed circuit boards in this embodiment is:
按质量百分比，将10%粒径2-3mm的棕刚玉颗粒、50%粒径1-2mm的棕刚玉颗粒以及40%粒径不大于1mm的棕刚玉颗粒均匀地混合在一起放入电炉中，并使其表面平整，利用电炉将棕刚玉颗粒加热至350℃，并保持该温度不变。将印刷电路板的焊接面朝下平放在加热的棕刚玉颗粒上，并施加垂向力使其与棕刚玉颗粒充分接触。加热4分钟后，印刷电路板上焊料完全融化，取出印刷电路板，使其焊接面朝上，元件面朝下，采用往复式气动冲击装置对焊接面施加频率为每秒钟5次的垂向冲击力，即可将焊料和元件从印刷电路板上分离。本实施例中，粒径为2-3mm的大颗粒棕刚玉所占质量百分比较小，为10%；粒径为2mm以下小颗粒棕刚玉所占质量百分比达到90%，所以，棕刚玉颗粒之间的间隔较小，印刷电路板的焊接面与棕刚玉颗粒可以充分接触，焊料的融化效果好，元器件回收率可达96%，焊料回收率达95%。According to the mass percentage, 10% of the brown corundum particles with a particle size of 2-3mm, 50% of the brown corundum particles with a particle size of 1-2mm, and 40% of the brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 350°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 4 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that the welding surface is facing upwards and the component surface is facing downwards, and a reciprocating pneumatic impact device is used to apply a vertical shock at a frequency of 5 times per second to the welding surface. The impact force can separate the solder and components from the printed circuit board. In this embodiment, the mass percentage of large particles of brown corundum with a particle size of 2-3mm is relatively small, 10%; the mass percentage of small particles of brown corundum with a particle size of 2 mm or less reaches 90%. Therefore, the mass percentage of brown corundum particles The distance between them is small, the welding surface of the printed circuit board can fully contact with the brown corundum particles, the melting effect of the solder is good, the recovery rate of components can reach 96%, and the recovery rate of solder can reach 95%.
实施例2：Example 2:
本实施例从废弃印刷电路板上分离元件和焊料的方法是：The method for separating components and solder from waste printed circuit boards in this embodiment is:
按质量百分比，将30%粒径2-3mm的棕刚玉颗粒、50%粒径1-2mm的棕刚玉颗粒和20%粒径不大于1mm的棕刚玉颗粒均匀地混合在一起放入电炉中，并使其表面平整，利用电炉将棕刚玉颗粒加热至370℃，并保持该温度不变。将印刷电路板的焊接面朝下平放在加热的棕刚玉颗粒上，并施加垂向力使其与棕刚玉颗粒充分接触。加热3分钟后，印刷电路板上焊料完全融化，取出印刷电路板，使其焊接面朝上，元件面朝下，对焊接面施加如实施例1中的高频垂向冲击力，即可将焊料和元件从印刷电路板上分离。与实施例1相比，本实施例中，粒径2-3mm的大颗粒棕刚玉所占质量百分比增大到30%，导致棕刚玉颗粒之间的间隔增大，印刷电路板焊接面与棕刚玉颗粒的接触不太充分，焊料的融化效果相对就会变差，元器件回收率92%，焊料回收率91%。According to the mass percentage, 30% of the brown corundum particles with a particle size of 2-3mm, 50% of the brown corundum particles with a particle size of 1-2mm and 20% of the brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 370°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 3 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that its soldering surface faces upwards and the component faces downwards, and the high-frequency vertical impact force as in Example 1 is applied to the soldering surface, and the Solder and components are separated from the printed circuit board. Compared with Example 1, in this example, the mass percentage of large particles of brown corundum particles with a particle size of 2-3mm is increased to 30%, resulting in an increase in the interval between brown corundum particles, and the welding surface of the printed circuit board and the brown corundum particles If the contact of corundum particles is not sufficient, the melting effect of the solder will be relatively poor. The recovery rate of components is 92%, and the recovery rate of solder is 91%.
实施例3：Example 3:
本实施例中从废弃印刷电路板上分离元件和焊料的方法是：The method for separating the components and solder from the waste printed circuit board in this example is:
按质量百分比，将10%粒径2-3mm的棕刚玉颗粒、60%粒径1-2mm的棕刚玉颗粒和30%粒径不大于1mm的棕刚玉颗粒均匀地混合在一起放入电炉中，并使其表面平整，利用电炉将棕刚玉颗粒加热至380℃，并保持该温度不变。将印刷电路板的焊接面朝下平放在加热的棕刚玉颗粒上，并施加垂向力使其与棕刚玉颗粒充分接触。加热3.5分钟后，印刷电路板上焊料完全融化，取出印刷电路板，使其焊接面朝上，元件面朝下，对焊接面施加如实施例1中的高频垂向冲击力，即可将焊料和元件从印刷电路板上分离。与实施例1相比，本实施例中，粒径1-2mm的棕刚玉颗粒所占质量百分比增大到60%，棕刚玉颗粒之间的间隔略微增加，印刷电路板焊接面与棕刚玉颗粒的接触充分性相对有所减小，焊料融化效果随之也有所降低，元器件回收率95%，焊料回收率94%。According to the mass percentage, 10% of the brown corundum particles with a particle size of 2-3mm, 60% of the brown corundum particles with a particle size of 1-2mm and 30% of the brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 380°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 3.5 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that its soldering surface faces upwards and the component faces downwards, and the high-frequency vertical impact force as in Example 1 is applied to the soldering surface, and the Solder and components are separated from the printed circuit board. Compared with Example 1, in this example, the mass percentage of brown corundum particles with a particle size of 1-2mm is increased to 60%, the interval between brown corundum particles is slightly increased, and the soldering surface of the printed circuit board and the brown corundum particles The contact sufficiency is relatively reduced, and the solder melting effect is also reduced. The recovery rate of components is 95%, and the recovery rate of solder is 94%.
实施例4：Example 4:
本实施例从废弃印刷电路板上分离元件和焊料的方法是：The method for separating components and solder from waste printed circuit boards in this embodiment is:
按质量百分比，将20%粒径2-3mm的棕刚玉颗粒、60%粒径1-2mm的棕刚玉颗粒、20%粒径不大于1mm的棕刚玉颗粒均匀地混合在一起放入电炉中，并使其表面平整，利用电炉将棕刚玉颗粒加热至390℃，并保持该温度不变。将印刷电路板的焊接面朝下平放在加热的棕刚玉颗粒上，并施加垂向力使其与棕刚玉颗粒充分接触。加热3分钟后，印刷电路板上焊料完全融化，取出印刷电路板，使其焊接面朝上，元件面朝下，对焊接面施加如实施例1中的高频的垂向冲击力，即可将焊料和元件从印刷电路板上分离。与实施例3相比，本实施例中，粒径2-3mm的棕刚玉颗粒所占质量百分比增大到20%，棕刚玉颗粒之间的间隔略微增加，印刷电路板焊接面与棕刚玉颗粒的接触充分性相对有所减小，焊料融化效果也有所降低，元器件回收率94%，焊料回收率93%。According to the mass percentage, 20% of brown corundum particles with a particle size of 2-3mm, 60% of brown corundum particles with a particle size of 1-2mm, and 20% of brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 390°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 3 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that the soldering surface faces upwards and the component faces downwards, and a high-frequency vertical impact force as in Example 1 is applied to the soldering surface. Separates the solder and components from the PCB. Compared with Example 3, in this example, the mass percentage of brown corundum particles with a particle size of 2-3 mm is increased to 20%, the interval between brown corundum particles is slightly increased, and the soldering surface of the printed circuit board and the brown corundum particles The contact sufficiency is relatively reduced, and the solder melting effect is also reduced. The recovery rate of components is 94%, and the recovery rate of solder is 93%.
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| US4270260A (en) * | 1978-10-10 | 1981-06-02 | Krueger Ellison F | Method for the salvage and restoration of integrated circuits from a substrate |
| US4769083A (en) * | 1986-01-27 | 1988-09-06 | Gould Inc. | Method for removing excess solder from printed circuit boards |
| US6301436B1 (en) * | 2000-10-12 | 2001-10-09 | Yu-Ju Hsiao | Photothermic desoldering unit |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device for desoldering and separating devices in liquid heat-conducting medium of printed circuit board |
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