CN102371412A - Device and method for removing electronic devices/components and soldered tin from waste circuit boards - Google Patents
Device and method for removing electronic devices/components and soldered tin from waste circuit boards Download PDFInfo
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- CN102371412A CN102371412A CN2011103627779A CN201110362777A CN102371412A CN 102371412 A CN102371412 A CN 102371412A CN 2011103627779 A CN2011103627779 A CN 2011103627779A CN 201110362777 A CN201110362777 A CN 201110362777A CN 102371412 A CN102371412 A CN 102371412A
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Abstract
The invention discloses a device for removing electronic devices/components and soldered tin from waste circuit boards, which comprises a devices/components collecting box, a circuit board collecting box and a devices/components dismantling platform. The device further comprises a tin-melting furnace, wherein soldering tin is placed in the tin-melting furnace. The invention further discloses a method for removing the electronic devices/components and the soldered tin from the waste circuit boards by using the device. With the adoption of the device and the method for removing the electronic devices/components and the soldered tin from the waste circuit boards, the problems that the energy consumption is large, the heat utilization is low, and harmful elements in the circuit boards can volatilize or be oxidized when the electronic devices/components and the soldered tin are removed in the prior art are solved; through using molten soldering tin in the tin-melting furnace for heat transfer, the efficiency is increased, the energy consumption is lowered, and the manually operating intensity is lowered; meanwhile, peculiar smells and harmful gases and the like generated in a processing process are subjected to an adsorption treatment by using a negative-pressure absorption manner, and then, are discharged outdoors, the air circulation is accelerated, and the air quality of an operating environment is ensured.
Description
Technical field
What the present invention relates to a kind of useless circuit board electronic devices and components and scolding tin removes device and removal methods thereof, belongs to environmental technology field.
Background technology
Along with the quickening of social progress and development in science and technology, the popularity rate of electric equipment products is increasingly high, and the speed of update is also more and more faster, causes a large amount of electric equipment products to go out of use.And printed circuit board (PCB) is widely used in the electric equipment products, so the learies of printed circuit board (PCB) is also very big.
Owing to contain various heavy in the printed circuit board (PCB), if be discarded in occurring in nature, meeting contaminated soil and underground water cause economy and the environmental loss that can't retrieve.In addition, printed circuit board (PCB) also contains multiple compound, in case burning will produce a large amount of poisonous and harmful substances, makes that discarded object is difficult to handle more.Therefore recycling waste and old circuit board has become current urgent problem.
The printed circuit board base board material is generally glass fiber-reinforced phenolic resins or epoxy resin, is connected with multiple components and parts with modes such as welding, stickups on it, and type is complicated, kind is various.
Discover, remove the scolding tin on the circuit board preferably during processing method earlier, thereby disassemble the components and parts on the circuit board, so not only remove the components and parts on the circuit board effectively, and little, the no toxic and harmful of energy consumption, components and parts spoilage are little.
Relatively find through research, adopt automatic or semi-automatic element dismounting device abroad, price general charged is relatively more expensive, is not suitable for the national conditions of China; Domestic employing hot blast sealing-off technology, though components and parts can disassemble, because energy consumption is big, heat utilization efficiency is low, and in air, heats, and can make poisonous element volatilization or oxidation in the circuit board.Because the air heat transfer coefficient is low, make scolding tin reach fusion temperature, must improve temperature, cause components and parts to cross cause thermal damage easily like this, reduced the rate of recovery of components and parts.
Summary of the invention
What technical problem to be solved by this invention provided a kind of useless circuit board electronic devices and components and scolding tin removes device and removal methods thereof; Can handle different size, reclaim dissimilar components and parts by high-efficient automatic; Significantly raise the efficiency; Reduce hand labor intensity, and can be with discharging again behind the cleaning harmful gas.
In order to solve the problems of the technologies described above; The technical scheme that the present invention adopted is: a kind of useless circuit board electronic devices and components and scolding tin remove device; Comprise components and parts collecting box, circuit board collecting box and components and parts dismounting platform, also comprise a tin melting furnace, be placed with scolding tin in the said tin melting furnace.
Aforesaid useless circuit board electronic devices and components and scolding tin remove device, it is characterized in that: also comprise an air extractor and a gas absorption purifier that is connected with said air extractor that is positioned at tin melting furnace, components and parts dismounting platform top.
Aforesaid useless circuit board electronic devices and components and scolding tin remove device, it is characterized in that: but said components and parts dismounting platform is a shaking platform.
Aforesaid useless circuit board electronic devices and components and scolding tin remove device, it is characterized in that: described components and parts dismounting platform is provided with a screen cloth, and said components and parts collecting box is positioned at the below of screen cloth.
Aforesaid useless circuit board electronic devices and components and scolding tin remove device, it is characterized in that: between said components and parts dismounting platform and the circuit board gatherer conveyer belt is installed.
The removal methods of a kind of useless circuit board electronic devices and components and scolding tin is characterized in that: comprise following steps:
(1) temperature of setting tin melting furnace is 240 ℃-260 ℃, makes scolding tin wherein melt into liquid;
(2) will put into the tin melting furnace 30s-60s that contains liquid scolding tin with the useless circuit board of components and parts;
(3) circuit board after will heating takes out from tin melting furnace, is put on the components and parts dismounting platform, and the mode through platform vibration and artificial gripping removes components and parts, and makes the vigour part fall into the components and parts collecting box through screen cloth;
The useless circuit board that (4) will remove behind components and parts and the scolding tin is put conveyer belt, makes it fall into the circuit board collecting box.
The removal methods of aforesaid useless circuit board electronic devices and components and scolding tin is characterized in that: when carrying out step (2) and step (3), open air extractor, make circuit board receive thermogenetic pernicious gas to purify the back discharging through the gas absorption purifier.
The invention has the beneficial effects as follows: the present invention can realize the wiring board of dissimilar different size sizes and separating of all kinds of electronic devices and components and scolding tin; Utilize the liquid scolding tin in the tin melting furnace to conduct heat, improved efficient, reduced energy consumption; Reduce hand labor intensity; Discharge outdoorly after the mode adsorption treatment that adopts negative pressure to absorb to the peculiar smell that produces in the processing procedure and pernicious gas etc. simultaneously, quickened circulation of air, guaranteed the air quality of operating environment.
Description of drawings
Fig. 1 be useless circuit board electronic devices and components and scolding tin remove the apparatus structure sketch map.
The specific embodiment
To combine Figure of description below, the present invention will be described further.
As shown in Figure 1; A kind of useless circuit board electronic devices and components and scolding tin remove device, comprise components and parts collecting box 5, circuit board collecting box 7 and a vibratile components and parts dismounting platform 3, also comprise a tin melting furnace 1; Said tin melting furnace 1 comprises a temperature control platform 2, is placed with scolding tin 8 at tin melting furnace 1.Above being positioned at tin melting furnace 1, components and parts dismounting platform 3, an air extractor 9 and a gas absorption purifier 10 that is connected with said air extractor 9 are installed.On components and parts dismounting platform 3, be provided with a screen cloth 4, said components and parts collecting box 5 is positioned at the below of screen cloth 4, between components and parts dismounting platform 3 and the circuit board gatherer 7 conveyer belt 6 is installed.
Utilize said apparatus to carry out the method that removes of useless circuit board electronic devices and components and scolding tin is comprised the steps:
(1) before the beginning sealing-off, after the temperature range of utilizing the temperature control platform 2 on the tin melting furnace 1 to set tin melting furnace 1 is 240 ℃-260 ℃, starts tin melting furnace 1 and begin scolding tin 8 is heated, make it become liquid scolding tin;
(2) after the liquid scolding tin 8 in the tin melting furnace 1 reaches the temperature of appointment, the useless circuit board solder side that needs are disassembled lies in a horizontal plane in the molten tin 1 down, and useless circuit board floats over tin liquor 8 surfaces immediately, continues heating 30 s-60s;
(3) treat scolding tin melted by heat on the circuit board solder side after, the circuit board that will give up picks up and throws to platform 3, the broken tin that sealing-off produces mixes with liquid scolding tin to be stayed in the tin melting furnace;
(4) under the dual power effect through artificial gripping and platform 3 percussion vibrations components and parts are removed, realize that electronic devices and components remove on the circuit board, the mesh of the screen cloth 4 on platform 3 drops down onto in the components and parts collecting box 5;
(5) the useless circuit board after the sealing-off is put on the conveyer belt 6, gets in the other circuit board collecting box 7.
In step (2) and step (3); Because circuit board is heated, vibrates and beats; Can produce pernicious gases such as flue dust; Air extractor 9 through tin melting furnace 1 and platform 3 tops and 10 pairs of sealing-offs of gas adsorptive purifier with remove the toxic and harmful that produces in the components and parts process and filter and adsorb, dust granules is caught, the clean gas after the processing is clapped to outdoor again.
In sum; A kind of useless circuit board electronic devices and components provided by the invention and scolding tin remove device and removal methods thereof; Can handle different size, reclaim dissimilar components and parts by high-efficient automatic; Significantly raise the efficiency, reduce hand labor intensity, and can be with discharging again behind the cleaning harmful gas.
More than show and described basic principle of the present invention, principal character and advantage.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection domain by appending claims and equivalent circle thereof.
Claims (7)
- Useless circuit board electronic devices and components and scolding tin remove device, comprise components and parts collecting box, circuit board collecting box and components and parts dismounting platform, it is characterized in that: also comprise a tin melting furnace, be placed with scolding tin in the said tin melting furnace.
- 2. useless circuit board electronic devices and components according to claim 1 and scolding tin remove device, it is characterized in that: also comprise an air extractor and a gas absorption purifier that is connected with said air extractor that is positioned at tin melting furnace, components and parts dismounting platform top.
- 3. useless circuit board electronic devices and components according to claim 1 and 2 and scolding tin remove device, it is characterized in that: but said components and parts dismounting platform is a shaking platform.
- 4. useless circuit board electronic devices and components according to claim 3 and scolding tin remove device, it is characterized in that: described components and parts dismounting platform is provided with a screen cloth, and said components and parts collecting box is positioned at the below of screen cloth.
- 5. useless circuit board electronic devices and components according to claim 4 and scolding tin remove device, it is characterized in that: between said components and parts dismounting platform and the circuit board gatherer conveyer belt is installed.
- 6. the removal methods of useless circuit board electronic devices and components and scolding tin is characterized in that: comprise following steps:(1) temperature of setting tin melting furnace is 240 ℃-260 ℃, makes scolding tin wherein melt into liquid;(2) will put into the tin melting furnace 30s-60s that contains liquid scolding tin with the useless circuit board of components and parts;(3) circuit board after will heating takes out from tin melting furnace, is put on the components and parts dismounting platform, and the mode through platform vibration and artificial gripping removes components and parts, and makes the vigour part fall into the components and parts collecting box through screen cloth;The useless circuit board that (4) will remove behind components and parts and the scolding tin is put conveyer belt, makes it fall into the circuit board collecting box.
- 7. the removal methods of useless circuit board electronic devices and components according to claim 6 and scolding tin; It is characterized in that: when carrying out step (2) and step (3), open air extractor, make circuit board receive thermogenetic pernicious gas to purify the back discharging through the gas absorption purifier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103627779A CN102371412A (en) | 2011-11-16 | 2011-11-16 | Device and method for removing electronic devices/components and soldered tin from waste circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103627779A CN102371412A (en) | 2011-11-16 | 2011-11-16 | Device and method for removing electronic devices/components and soldered tin from waste circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102371412A true CN102371412A (en) | 2012-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103627779A Pending CN102371412A (en) | 2011-11-16 | 2011-11-16 | Device and method for removing electronic devices/components and soldered tin from waste circuit boards |
Country Status (1)
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|---|---|
| CN (1) | CN102371412A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103442524A (en) * | 2013-08-23 | 2013-12-11 | 深圳市创荣发电子有限公司 | Patch module disassembling and assembling method |
| CN105813395A (en) * | 2014-12-29 | 2016-07-27 | 鸿富锦精密电子(郑州)有限公司 | Material removing equipment |
| CN103442524B (en) * | 2013-08-23 | 2016-11-30 | 深圳市创荣发电子有限公司 | Patch module assembly and disassembly methods |
| CN106825821A (en) * | 2017-01-24 | 2017-06-13 | 安徽锐能科技有限公司 | PCB electronic components remove device |
| CN109570198A (en) * | 2018-11-27 | 2019-04-05 | 西安华运天成通讯科技有限公司 | A kind of component recycling machine people of the old circuit board of communications industry |
| CN112620854A (en) * | 2020-12-10 | 2021-04-09 | 华中科技大学 | Soldering tin recovery and automatic disassembling device for waste circuit board |
| CN114346350A (en) * | 2022-01-13 | 2022-04-15 | 常州大学 | Method and device for stripping soldering tin of waste circuit board components |
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| CN101362143A (en) * | 2008-09-19 | 2009-02-11 | 中南大学 | A process and device for efficiently recycling waste printed circuit board solder |
| CN101386016A (en) * | 2008-10-24 | 2009-03-18 | 北京航空航天大学 | A processing device and method for non-destructive dismantling of waste circuit boards |
| CN101537522A (en) * | 2009-03-20 | 2009-09-23 | 湖南万容科技有限公司 | Method and device for disassembling electronic components from waste printed circuit boards and recovering soldering tin |
| CN202317353U (en) * | 2011-11-16 | 2012-07-11 | 苏州伟翔电子废弃物处理技术有限公司 | Removing device of electronic components and soldering tin of waste circuit board |
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2011
- 2011-11-16 CN CN2011103627779A patent/CN102371412A/en active Pending
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| JPH09307224A (en) * | 1996-05-15 | 1997-11-28 | Matsushita Electric Ind Co Ltd | Reflow type soldering apparatus |
| CN101327541A (en) * | 2008-08-01 | 2008-12-24 | 湖南万容科技有限公司 | Method and apparatus for separating component pins and soldering tin of circuit board |
| CN101362143A (en) * | 2008-09-19 | 2009-02-11 | 中南大学 | A process and device for efficiently recycling waste printed circuit board solder |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103442524A (en) * | 2013-08-23 | 2013-12-11 | 深圳市创荣发电子有限公司 | Patch module disassembling and assembling method |
| CN103442524B (en) * | 2013-08-23 | 2016-11-30 | 深圳市创荣发电子有限公司 | Patch module assembly and disassembly methods |
| CN105813395A (en) * | 2014-12-29 | 2016-07-27 | 鸿富锦精密电子(郑州)有限公司 | Material removing equipment |
| CN105813395B (en) * | 2014-12-29 | 2019-11-01 | 鸿富锦精密电子(郑州)有限公司 | Tear material equipment open |
| CN106825821A (en) * | 2017-01-24 | 2017-06-13 | 安徽锐能科技有限公司 | PCB electronic components remove device |
| CN106825821B (en) * | 2017-01-24 | 2019-07-12 | 安徽锐能科技有限公司 | PCB electronic component removes device |
| CN109570198A (en) * | 2018-11-27 | 2019-04-05 | 西安华运天成通讯科技有限公司 | A kind of component recycling machine people of the old circuit board of communications industry |
| CN109570198B (en) * | 2018-11-27 | 2024-05-03 | 深圳玥鑫科技有限公司 | Component recycling robot for old circuit board in communication industry |
| CN112620854A (en) * | 2020-12-10 | 2021-04-09 | 华中科技大学 | Soldering tin recovery and automatic disassembling device for waste circuit board |
| CN112620854B (en) * | 2020-12-10 | 2022-03-18 | 华中科技大学 | Solder recycling and automatic dismantling device for waste circuit boards |
| CN114346350A (en) * | 2022-01-13 | 2022-04-15 | 常州大学 | Method and device for stripping soldering tin of waste circuit board components |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20120314 |