CN103273705B - Bonding structure - Google Patents

Abstract

The invention relates to an adhesive structure, comprising a carrier film, a buffer layer with an opening, a first adhesive layer and a release film, the carrier film and the first adhesive layer are arranged on two opposite surfaces of the buffer layer, the carrier A first protective film is attached to the surface of the film adjacent to the first adhesive layer, and the first protective film is arranged at the opening of the buffer layer, and the release film is arranged on the surface of the first adhesive layer away from the buffer layer, The adhesive structure also includes a second protective film, which is arranged on the surface of the release film adjacent to the first adhesive layer, and blocks the mutual contact between the release film and the first protective film.

Description

Adhesive structure

technical field

The invention relates to an adhesive structure applied to a touch display device.

Background technique

Existing touch display devices, such as mobile phones and tablet computers with touch functions, need to be connected with an adhesive structure in order to effectively bond the touch module receiving the touch operation and the display module. To achieve fit, sealing and other effects. However, in practical applications, after the touch module and the display module are assembled, it is often found that the viscous substance in the adhesive structure will adhere or transfer to the surface of the touch module or the display module, for example The release agent in the bonding structure will be transferred to the sensing substrate of the touch module, causing defects in the appearance and quality of the touch module.

Contents of the invention

In view of this, an adhesive structure capable of preventing contamination or transfer defects of the device to be attached is provided.

An adhesive structure comprising a carrier film, a buffer layer with openings, a first adhesive layer and a release film, the carrier film and the first adhesive layer are arranged on two opposite surfaces of the buffer layer, the carrier film is adjacent to the A first protective film is attached to the surface of the first adhesive layer, and the first protective film is arranged at the opening of the buffer layer, the release film is arranged on the surface of the first adhesive layer away from the buffer layer, and the bonding The structure also includes a second protective film, the second protective film is arranged on the surface of the release film adjacent to the first adhesive layer to block the mutual contact between the release film and the first protective film.

Compared with the prior art, in the adhesive structure of the present invention, a second protective film is also provided between the release film and the first adhesive layer, thus, during the application process, the second protective film can effectively prevent The substance on the release film is adhered or transferred to one of the modules to be bonded, such as the touch module, to avoid poor appearance and poor quality of the touch module.

Description of drawings

Fig. 1 is an exploded schematic view of the bonding structure of the present invention.

Fig. 2 is a schematic plan view of the combined bonding structure of the present invention.

Fig. 3 is a schematic cross-sectional structure diagram of the adhesive structure in Fig. 2 along line III-IIII.

FIG. 4 is a schematic cross-sectional structure diagram of an adhesive bond of the present invention applied to a touch display device.

Description of main component symbols

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

Please refer to Figs. 1 to 3 together, wherein, Fig. 1 is an exploded schematic view of the bonding structure of the present invention, Fig. 2 is a combined schematic view of the bonding structure of the present invention, and Fig. 3 is a view of the bonding structure along the line III-III in Fig. 2 Schematic diagram of the cross-sectional structure. In this embodiment, the adhesive structure 10 is preferably applied to a touch display device, such as a touch mobile phone or a tablet computer, for connecting the touch module in the touch display device with other modules, such as a display module. Snug connection. It can be understood that the bonding structure 10 can also be applied to other modules to be bonded, and is not limited to touch display devices.

The adhesive structure 10 includes a carrier film 100 , a first protective film 200 , a buffer layer 300 , a first adhesive layer 400 , a second protective film 500 , a second adhesive layer 600 and a release film 700 . Wherein, the carrier film 100, buffer layer 300, first adhesive layer 400 and release film 700 are stacked sequentially, the first protective film 200 is arranged between the carrier film 100 and the buffer layer 300, the second protective film 500 is arranged on the first between the adhesive layer 400 and the release film 700 . The second adhesive layer 600 is disposed between the second protective film 500 and the release film 700 .

The buffer layer 300 has certain elasticity, and in this embodiment, the buffer layer 300 is acrylic foam or foam.

It should be noted that, in order not to affect the normal operation of the touch display module, in the touch display module, the cushioning and viscous buffer layer 300 in the adhesive structure 10 is arranged on the edge of the touch display module, and does not It does not correspond to some settings of the touch display device receiving touch operations and displaying images. Therefore, in this embodiment, both the buffer layer 300 and the first adhesive layer 400 are frame-shaped with a hollow opening.

The carrier film 100 is pasted on the buffer layer 300 and covers the buffer layer 300 and its hollow opening area, so as to prevent the buffer layer 300 from being deformed or polluted. The carrier film 100 can be made of PET and is a transparent film with certain viscosity.

The first protective film 200 is disposed corresponding to the hollow opening of the buffer layer 300 , and the area of the first protective film 200 is slightly smaller than the area of the hollow opening of the buffer layer 300 . After the bonding structure 10 is combined, as shown in FIG. 3 , the first protective film 200 is embedded in the hollow opening of the buffer layer 300 . And the first protective film 200 is attached to the surface of the carrier film 100 adjacent to the buffer layer 300 under the action of the adhesiveness of the carrier film 100 .

Preferably, the distance between the outer edge of the first protective film 200 and the inner edge of the buffer layer 300 is not less than 1 mm.

The first protective film 200 may be a transparent film made of PET. The first protective film 200 can also vary according to the shape of the buffer layer 300 .

The first adhesive layer 400 is disposed on the lower surface of the buffer layer 300 , and is used to provide a bonding force required for bonding a module to be bonded, such as a touch module, with other modules such as a display module.

The release film 700 is arranged on the surface of the first adhesive layer 400 away from the buffer layer 300, and covers the first adhesive layer 400 and its hollow opening area as a whole. The release film 700 can prevent the deformation of the buffer layer 300 and prevent dust etc. are adhered to the first adhesive layer 400 . In this embodiment, the release film 700 is formed by coating a release agent or silicone oil on a PET substrate.

The release film 700 includes a main body 710 and an extension 720 , the main body 710 covers the buffer layer 300 and its hollow opening area. The extension part 720 is a part extending from the edge of the main body part 710 so as to facilitate the user to hold the release film 700 .

The second protective film 500 is arranged on the surface of the release film 700 adjacent to the first adhesive layer 400, and corresponds to the hollow opening of the first adhesive layer 400. It is used to block the first protective film 200 and the release film 700, preventing the release film from 700 is in direct contact with the first protective film 200 , and the area of the second protective film 500 is smaller than the area of the hollow opening of the first adhesive layer 400 .

Preferably, the distance between the outer edge of the second protective film 500 and the inner edge of the hollow opening of the first adhesive layer 400 is not greater than 1 mm.

The second adhesive layer 600 is disposed between the second protective film 500 and the release film 700 , and is used for pasting the second protective film 500 and the release film 700 .

Preferably, the second adhesive layer 600 is adhesive silicone, and the second adhesive layer 600 has a cross-sectional area of 3mm*6mm, and is disposed at a position corresponding to the main body portion 710 adjacent to the extension portion 720 . In other embodiments of the present invention, the second adhesive layer 600 is not limited to one.

Preferably, the adhesive force between the carrier film 100 and the buffer layer 300 is greater than the adhesive force between the release film 700 and the first adhesive layer 400, so that the release film 700 is torn from the first adhesive layer 400 After separating and bonding with the module to be bonded, such as the touch module, the touch module and the rest of the adhesive structure 10 can be transported as a whole, which can effectively prevent the carrier film 100 from detaching from the buffer layer 300 and touch The control module is contaminated or damaged. Wherein, the carrier film 100 and the release film 700 can be thin films with the same property and material.

Alternatively, when the release film 700 has certain viscosity, the adhesive structure 10 can omit the second adhesive layer 600 .

In addition, the second protective film 500 can also extend and cover the entire first adhesive layer 400. At this time, the adhesive force between the second protective film 500 and the release film 700 is greater than that between the second protective film 500 and the first adhesive layer 400. The adhesive force between them, and the surface of the second protective film 500 adjacent to the first adhesive layer 400 is a smooth surface.

Please refer to FIG. 4 , which is a schematic cross-sectional structure diagram when applied to the touch display device 20 .

The touch display device 20 includes a touch module 210 and a display module 220. The touch module 210 is used to receive a user's touch operation and determine the position where the touch operation is received. The touch module 210 includes a touch sensor Substrate (not shown) and other auxiliary structures. The display module 220 is used for displaying images, including a display panel and a backlight module. The adhesive structure 10 is disposed between the touch module 210 and the display module 220 for bonding the two modules 210 , 220 .

When pasting the touch module 210 and the display module 220, first, the second protective film 500, the second adhesive layer 600 and the release film 700 in the adhesive structure 10 are torn off from the first adhesive layer 400 as a whole. ; Then the first adhesive layer 400, the buffer layer 300, the first protective film 200 and the carrier film 100 are fixed on the jig; then, the touch module 210 is aligned with the first adhesive layer 400 and bonded; finally, the carrier The film 100 and the first protective film 200 are torn off from the buffer layer 300 , and the display module 220 is aligned with the buffer layer 300 and combined.

Compared with the prior art, there is also a second protective film 500 between the release film 700 and the first adhesive layer 400, thus, in the application process, it can effectively prevent the substances on the release film 700 from penetrating through the first adhesive layer 400. The protective film 200 is adhered or transferred to the touch module 210, that is to prevent the silicone oil on the release film 700 from being transferred to the touch sensing substrate 211 through the first protective film 200, resulting in the appearance of the touch module 210. Bad, poor quality.

Alternatively, an adhesive layer may be further provided between the first protective film 200 and the buffer layer 300 so as to be better attached to the display module 220 .

Claims (10)

1. An adhesive structure, comprising a carrier film, a buffer layer with openings, a first adhesive layer and a release film, the carrier film and the first adhesive layer are arranged on two opposite surfaces of the buffer layer, the carrier film A first protective film is attached to the surface adjacent to the first adhesive layer, and the first protective film is arranged at the opening of the buffer layer, and the release film is arranged on the surface of the first adhesive layer away from the buffer layer. In that, the adhesive structure further includes a second protective film, and the second protective film is arranged on the surface of the release film adjacent to the first adhesive layer to block the mutual contact between the release film and the first protective film. 2. The adhesive structure according to claim 1, wherein the second protective film is disposed corresponding to the opening of the buffer layer, and the area of the second protective film is smaller than the area of the opening. 3. The adhesive structure according to claim 2, wherein the distance between the outer edge of the second protective film and the inner edge of the opening is not greater than 1 mm. 4. The adhesive structure according to claim 1, wherein the adhesive force between the second protective film and the release film is greater than the adhesive force between the second protective film and the first adhesive layer. 5. The adhesive structure according to claim 4, wherein a surface of the second protective film adjacent to the first adhesive layer is a smooth surface. 6. The bonding structure according to claim 1, characterized in that, at least part of the surface of the release film in contact with the second protective film is also provided with a second adhesive layer, and the second adhesive layer is used for bonding The release film and the second protection film enable the release film and the second protection film to be torn off from the first adhesive layer at the same time. 7. The bonding structure according to claim 6, wherein the release film comprises a main body and an extension, the main body covers the entire second adhesive layer and the opening, and the extension extends from the edge of the main body Extended, the second adhesive layer is arranged at the position of the main body adjacent to the extension. 8 . The adhesive structure according to claim 1 , wherein the distance between the outer edge of the first protective film and the inner edge of the opening is not greater than 1 mm. 9. The bonding structure according to any one of claims 1 to 8, characterized in that, the adhesive force between the carrier film and the buffer layer is greater than the adhesive force between the release film and the first adhesive layer . 10. The bonding structure according to claim 1, wherein the buffer layer is foam.