CN103268056A - Flexible mask plate and preparation method thereof - Google Patents

Abstract

The invention discloses a flexible mask plate, which comprises a flexible substrate, and an adhesive layer, a metal pattern structure layer and a flexible packaging layer are sequentially arranged on the top of the flexible substrate; the flexible substrate is made of a transparent flexible material; the material of the flexible substrate is polycarbonate ester or polydimethylsiloxane; the bonding layer is made of epoxy resin adhesive; the metal graphic structure layer is made of aluminum or copper; the flexible packaging layer is made of polydimethylsiloxane. The invention provides a flexible mask and a preparation method thereof. The flexible mask can be photolithographically processed on a curved substrate, and can be naturally adsorbed onto the substrate to achieve close contact without traditional vacuum treatment. This makes the flexible mask plate of the present invention suitable for photolithographic processing of large-area substrates.

Description

Flexible mask plate and preparation method thereof

【Technical field】

The invention belongs to the technical field of electronic products and micro-nano manufacturing thereof, and in particular relates to a flexible mask plate and a preparation method thereof.

【Background technique】

At present, optical lithography technology has been widely used in the field of microelectronics manufacturing. The mask plate used in optical lithography is usually composed of a glass substrate and a metal chrome coating. Due to the high hardness and lack of flexibility of the glass substrate, optical lithography technology can only be applied to the lithography process of flat substrates, and cannot be used for curved surfaces. The substrate is photolithographically processed. In addition, in order to ensure the close contact between the hard mask plate and the planar substrate, it is necessary to vacuumize the hard mask plate and the planar substrate, so photolithography technology is not suitable for photolithography processing of large-area substrates.

【Content of invention】

The purpose of the present invention is to provide a flexible mask and its preparation method to solve the above technical problems; the substrate is made of a transparent flexible material, and then the patterned metal structure layer is fixed to the flexible substrate by bonding or transfer process , thus forming a flexible mask.

In order to achieve the above object, the present invention takes the following technical solutions:

A flexible mask plate includes a flexible substrate, and an adhesive layer, a metal pattern structure layer and a flexible packaging layer are sequentially arranged on the flexible substrate.

The further improvement of the present invention is that: a medium layer is provided between the metal pattern structure layer and the flexible packaging layer.

The further improvement of the present invention lies in that: the flexible substrate is made of transparent flexible material.

The further improvement of the present invention is that: the material of the flexible substrate is polycarbonate or polydimethylsiloxane; the material of the adhesive layer is epoxy resin adhesive; the material of the metal graphic structure layer is aluminum or copper; the material of the flexible packaging layer The material is polydimethylsiloxane.

The further improvement of the present invention lies in that: the medium layer is made of polymethyl methacrylate.

The preparation method of flexible mask plate comprises the following steps:

(1) Apply the liquid photoresist material to the surface of the silicon dioxide insulating layer on the silicon wafer substrate by centrifugal glue laying, glue spraying or screen printing, and evenly distribute it on the surface of the silicon dioxide insulating layer;

(2) Patterning the photoresist on the silicon wafer substrate by photolithography or embossing to form a photoresist pattern structure;

(3) Deposit a layer of metal material on the photoresist pattern structure by physical vapor deposition method, then use the stripping method to strip the photoresist pattern structure, and form a metal pattern on the surface of the silicon dioxide insulating layer on the silicon wafer base structural layer;

(4) Applying the bonding layer material evenly to the metal pattern structure layer by centrifugal glue laying, glue spraying or screen printing method, forming a bond layer on the metal pattern structure layer;

(5) covering the flexible substrate on the adhesive layer, and then removing the silicon dioxide layer, thereby obtaining a flexible substrate with a metal graphic structure layer;

(6) Covering the flexible encapsulation layer on the metal pattern structure layer to complete the fabrication of the flexible mask.

The further improvement of the present invention lies in that in the step, the silicon dioxide insulating layer is removed by wet etching.

The preparation method of flexible mask plate comprises the following steps:

(1) Apply the liquid photoresist material to the surface of the silicon dioxide insulating layer on the silicon wafer substrate by centrifugal glue laying, glue spraying or screen printing, and evenly distribute it on the surface of the silicon dioxide insulating layer;

(2) Patterning the photoresist on the silicon wafer substrate by photolithography or embossing to form a photoresist pattern structure;

(3) Adopt physical vapor deposition method to deposit a layer of metal material on the photoresist pattern structure, then use the stripping method to strip the photoresist pattern structure, and form a metal pattern structure layer on the silicon dioxide surface of the silicon wafer base ;

(4) Apply the medium layer material evenly to the surface of the metal pattern structure layer on the silicon chip substrate by centrifugal glue laying, glue spraying or screen printing to form a medium layer covering the metal structure;

(5) Uniformly apply the bonding layer material to the flexible substrate by centrifugal glue laying, glue spraying or screen printing, and form a bonding layer on the flexible substrate;

(6) removing the silicon dioxide insulating layer on the silicon chip substrate, thereby obtaining the medium layer covering the metal pattern structure layer;

(7) Transfer the media layer to the flexible substrate with the bonding layer, so that the metal graphic structure layer is bonded on the bonding layer;

(8) Finally, cover the flexible encapsulation layer on the medium layer to complete the fabrication of the flexible mask.

The further improvement of the present invention lies in that: in step (6), the silicon dioxide insulating layer is removed by wet etching.

Compared with the prior art, the present invention has the following beneficial effects: the present invention provides a flexible mask and its preparation method, the flexible mask can be used for photolithographic processing of curved substrates, and it can be naturally adsorbed onto the substrate to achieve The close contact does not require traditional vacuum treatment, which makes the flexible mask plate of the present invention suitable for photolithography processing of large-area substrates.

【Description of drawings】

Fig. 1 is a schematic diagram of the layered structure of the flexible mask (four-layer structure) shown in Example 1;

FIG. 2 is a schematic diagram of the layered structure of the flexible mask (five-layer structure) shown in Embodiment 2;

Among them, 1 is a flexible substrate (such as commercially available polycarbonate, PC or polydimethylsiloxane, PDMS), 2 is an adhesive layer (such as a commercially available epoxy resin adhesive), and 3 is a metal structure layer ( Such as aluminum or copper, Al, Cu), 4 is a flexible packaging layer (such as commercially available polydimethylsiloxane, PDMS), and 5 is a media layer (such as commercially available polymethyl methacrylate, PMMA).

【Detailed ways】

Example 1

Please refer to FIG. 1 , the flexible mask plate of the present invention includes a flexible substrate 1 , and an adhesive layer 2 , a metal pattern structure layer 3 and a flexible packaging layer 4 are sequentially provided on the flexible substrate 1 . The flexible substrate 1 is made of a transparent flexible material, which can be polycarbonate (PC) or polydimethylsiloxane (PDMS); the adhesive layer 2 is made of epoxy resin adhesive; the metal pattern structure layer 3 is made of aluminum or copper; The flexible encapsulation layer 4 is polydimethylsiloxane.

The preparation method of the flexible mask plate of this four-layer structure comprises the following steps:

(1) Apply a liquid photoresist material (such as commercially available AZ1500) to the surface of the silicon dioxide insulating layer on the silicon wafer substrate by centrifugal coating, glue spraying or screen printing, and apply it on the silicon dioxide insulating layer. Evenly distributed on the surface of the layer;

(2) Patterning the photoresist on the substrate by photolithography or embossing to form a photoresist pattern structure;

(3) Deposit a layer of metal material (such as aluminum or copper, Al, Cu) on the photoresist pattern structure by using physical vapor deposition PVD equipment and technology, and then use the lift-off method to peel off the photoresist pattern structure. A metal pattern structure layer 3 is formed on the surface of the silicon dioxide insulating layer of the silicon wafer base;

(4) Apply the adhesive layer material (such as commercially available epoxy resin adhesive) evenly to the metal graphic structure layer 3 by centrifugal glue laying, glue spraying or screen printing, and form an adhesive layer on the metal graphic structure layer 3. junction2;

(5) Cover the flexible substrate 1 (such as commercially available polycarbonate, PC or polydimethylsiloxane, PDMS) on the adhesive layer 2, and then remove the silicon dioxide insulating layer by wet etching, thereby obtaining A flexible substrate 1 with a metal pattern structure layer 3;

(6) Cover the flexible encapsulation layer 4 (such as commercially available polydimethylsiloxane, PDMS) on the metal pattern structure layer 3 to complete the fabrication of the flexible mask.

Example 2

Please refer to FIG. 1 , the flexible mask plate of the present invention includes a flexible substrate 1 on which an adhesive layer 2 , a metal structure layer 3 , a medium layer 5 and a flexible encapsulation layer 4 are sequentially arranged. The flexible substrate 1 is made of a transparent flexible material, which can be polycarbonate (PC) or polydimethylsiloxane (PDMS); the adhesive layer 2 is made of epoxy resin adhesive; the metal pattern structure layer 3 is made of aluminum or copper; The flexible packaging layer 4 is made of polydimethylsiloxane; the medium layer 5 is made of polymethyl methacrylate.

The preparation method of the flexible mask plate of this five-layer structure comprises the following steps:

(1) Apply a liquid photoresist material (such as commercially available AZ1500) to the surface of the silicon dioxide insulating layer on the silicon wafer substrate by centrifugal coating, glue spraying or screen printing, and apply it on the silicon dioxide insulating layer. Evenly distributed on the surface of the layer;

(2) Patterning the photoresist on the substrate by photolithography or embossing to form a photoresist pattern structure;

(3) Deposit a layer of metal material (such as aluminum or copper, Al, Cu) on the photoresist pattern structure by using physical vapor deposition PVD equipment and technology, and then use the lift-off method to peel off the photoresist pattern structure. A metal pattern structure layer 3 is formed on the surface of the silicon dioxide insulating layer of the silicon wafer base;

(4) Apply the medium layer material (such as commercially available polymethyl methacrylate, PMMA) evenly to the surface of the metal pattern structure layer 3 on the substrate by centrifugal glue laying, glue spraying or screen printing to form a coating The medium layer 5 of the metal structure layer 3;

(5) Uniformly apply the bonding layer material (such as commercially available epoxy resin adhesive) to the flexible substrate 1 (such as commercially available polycarbonate, PC or polycarbonate) by centrifugal glue laying, glue spraying or screen printing. Methylsiloxane, PDMS), forming an adhesive layer 2 on the flexible substrate 1;

(6) use wet etching to remove the silicon dioxide insulating layer on the silicon wafer substrate, thereby obtaining the intermediary layer 5 covering the metal pattern structure layer 3;

(7) transfer the medium layer 5 to the flexible substrate 1 with the adhesive layer 2, so that the metal graphic structure layer 3 is bonded on the adhesive layer 2;

(8) Finally, the medium layer 5 is covered with a flexible encapsulation layer 4 (such as commercially available polydimethylsiloxane, PDMS), and the fabrication of the flexible mask is completed.

Claims (9)

1. A flexible mask plate, characterized in that it includes a flexible substrate (1), and an adhesive layer (2), a metal pattern structure layer (3) and a flexible packaging layer (4) are sequentially arranged above the flexible substrate (1) . 2. The flexible mask according to claim 1, characterized in that, a medium layer (5) is provided between the metal pattern structure layer (3) and the flexible packaging layer (4). 3. The flexible mask according to claim 1 or 2, characterized in that the flexible substrate (1) is made of transparent flexible material. 4. The flexible mask according to claim 3, wherein the material of the flexible substrate (1) is polycarbonate or polydimethylsiloxane; the material of the bonding layer (2) is epoxy resin Adhesive; the material of the metal pattern structure layer (3) is aluminum or copper; the material of the flexible packaging layer (4) is polydimethylsiloxane. 5. The flexible mask according to claim 2, characterized in that the medium layer (5) is made of polymethyl methacrylate. 6. The preparation method of the flexible mask plate described in claim 1, 3 or 4, is characterized in that, comprises the following steps: (1) Apply the liquid photoresist material to the surface of the silicon dioxide insulating layer on the silicon wafer substrate by centrifugal glue laying, glue spraying or screen printing, and evenly distribute it on the surface of the silicon dioxide insulating layer; (2) Patterning the photoresist on the silicon wafer substrate by photolithography or embossing to form a photoresist pattern structure; (3) Deposit a layer of metal material on the photoresist pattern structure by physical vapor deposition method, then use the stripping method to strip the photoresist pattern structure, and form a metal pattern on the surface of the silicon dioxide insulating layer on the silicon wafer base structure layer(3); (4) Uniformly apply the adhesive layer material to the metal pattern structure layer (3) by centrifugal glue laying, spray glue or screen printing method, and form the bond layer (2) on the metal pattern structure layer (3); (5) covering the flexible substrate (1) on the adhesive layer (2), and then removing the silicon dioxide layer, thereby obtaining a flexible substrate (1) with a metal graphic structure layer (3); (6) Covering the flexible encapsulation layer (4) on the metal graphic structure layer (3) to complete the fabrication of the flexible mask. 7. The preparation method according to claim 6, characterized in that in step (5), the silicon dioxide insulating layer is removed by wet etching. 8. The preparation method of the flexible mask plate described in claim 2 or 5, is characterized in that, comprises the following steps: (1) Apply the liquid photoresist material to the surface of the silicon dioxide insulating layer on the silicon wafer substrate by centrifugal glue laying, glue spraying or screen printing, and evenly distribute it on the surface of the silicon dioxide insulating layer; (2) Patterning the photoresist on the silicon wafer substrate by photolithography or embossing to form a photoresist pattern structure; (3) Adopt physical vapor deposition method to deposit a layer of metal material on the photoresist pattern structure, then use the stripping method to strip the photoresist pattern structure, and form a metal pattern structure layer on the silicon dioxide surface of the silicon wafer base (3); (4) Uniformly apply the medium layer material to the surface of the metal pattern structure layer (3) on the silicon chip substrate by centrifugal glue laying, glue spraying or screen printing to form a medium layer (5) covering the metal structure; (5) Uniformly apply the bonding layer material to the flexible substrate (1) by using centrifugal glue laying, glue spraying or screen printing methods to form the bonding layer (2) on the flexible substrate (1); (6) removing the silicon dioxide insulating layer on the silicon wafer substrate, thereby obtaining the medium layer (5) covering the metal pattern structure layer (3); (7) transferring the medium layer (5) to the flexible substrate (1) with the adhesive layer (2), so that the metal graphic structure layer (3) is bonded to the adhesive layer (2); (8) Finally, cover the flexible encapsulation layer (4) on the medium layer (5) to complete the fabrication of the flexible mask. 9 . The preparation method according to claim 8 , characterized in that, in step (6), the silicon dioxide insulating layer is removed by wet etching.

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