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CN103252804A - Groove processing tool and groove processing apparatus for substrate - Google Patents

Groove processing tool and groove processing apparatus for substrate Download PDF

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Publication number
CN103252804A
CN103252804A CN2013100103713A CN201310010371A CN103252804A CN 103252804 A CN103252804 A CN 103252804A CN 2013100103713 A CN2013100103713 A CN 2013100103713A CN 201310010371 A CN201310010371 A CN 201310010371A CN 103252804 A CN103252804 A CN 103252804A
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substrate
tool
blade
groove processing
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CN103252804B (en
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曾山正信
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Mitsuboshi Diamond Industrial Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

本发明所提供的基板的沟槽加工工具及沟槽加工装置,即使在更换工具的情形,亦无需调整加工位置而可精度佳地进行沟槽加工。本发明的沟槽加工工具(2),是保持于保持具(17),且与保持具(17)一同在作为加工对象的基板上相对移动,而用以在基板形成沟槽的工具,具备有工具本体(36)与刃尖部(37)。工具本体(36),具有抵接于保持具(17)的抵接面(36a),且保持于保持具(17)。刃尖部(37),形成于工具本体(36)的前端部,且具有从抵接面(36a)连续而形成为与抵接面(36a)同一面的基准面(37a),并且从基准面(37a)起具有既定的宽度。

The substrate groove processing tool and groove processing device provided by the present invention can perform groove processing with high precision without adjusting the processing position even when the tool is replaced. The groove machining tool (2) of the present invention is held by the holder (17), and is relatively moved together with the holder (17) on the substrate as the processing object to form a groove on the substrate. A tool body (36) and a blade tip (37) are arranged. The tool body (36) has a contact surface (36a) that contacts the holder (17), and is held by the holder (17). The cutting edge portion (37) is formed on the front end portion of the tool body (36), and has a reference surface (37a) which is continuous from the contact surface (36a) and formed on the same plane as the contact surface (36a), and The surface (37a) has a predetermined width.

Description

基板的沟槽加工工具及沟槽加工装置Grooving tool and groove processing device for substrate

技术领域technical field

本发明是关于一种沟槽加工工具,尤其是关于一种保持于保持具,且与保持具一同在作为加工对象的基板上相对移动而用以在基板形成沟槽的基板的沟槽加工工具。此外,本发明是关于一种具备以上的沟槽加工工具的沟槽加工装置。The present invention relates to a grooving tool, and more particularly to a grooving tool for a substrate that is held by a holder and relatively moves together with the holder on a substrate to be processed to form a groove on the substrate. . Furthermore, the present invention relates to a groove processing device including the above groove processing tool.

背景技术Background technique

薄膜太阳电池例如借由如下所示的方法制造。亦即,首先在玻璃等的基板上形成由Mo膜所构成的下部电极膜,之后,在下部电极膜形成沟槽,借此分割成短矩形状。接着,在下部电极膜上形成包含CIGS(Copper IndiumGallium Selenide,铜铟镓硒)膜等的黄铜矿构造化合物半导体膜的化合物半导体膜。而且,上述半导体膜的一部分借由沟槽加工被呈带(strip)状地去除而分割成短矩形状,且以覆盖上述的方式形成上部电极膜。最后,上部电极膜的一部分借由沟槽加工而被呈带状地剥离而分割成短矩形状。A thin film solar cell is manufactured by the method shown below, for example. That is, first, a lower electrode film made of a Mo film is formed on a substrate such as glass, and then the lower electrode film is divided into short rectangular shapes by forming grooves in the lower electrode film. Next, a compound semiconductor film including a chalcopyrite structure compound semiconductor film such as a CIGS (Copper Indium Gallium Selenide) film is formed on the lower electrode film. Then, a part of the above-mentioned semiconductor film is removed in a strip shape by trench processing to be divided into short rectangular shapes, and an upper electrode film is formed so as to cover the above-mentioned. Finally, a part of the upper electrode film was stripped off in a strip shape by grooving and divided into short rectangular shapes.

在如以上的方法中使用的沟槽加工工具,揭示于专利文献1中。在该专利文献1所揭示的沟槽加工工具,具有保持于保持具工具本体、以及形成于工具本体的前端部且具有沟槽加工用的刀刃的刃尖部。A grooving tool used in the above method is disclosed in Patent Document 1. The grooving tool disclosed in this patent document 1 has a tool body held by a holder, and a cutting edge portion formed on a front end portion of the tool body and having a cutting edge for grooving.

专利文献1:日本专利特开2011-142235号公报Patent Document 1: Japanese Patent Laid-Open No. 2011-142235

如自专利文献1的图3等得知,在现有习知的沟槽加工装置所使用的工具,仅在与工具的移动方向正交的宽度方向的中央部形成有刀刃。亦即,在工具的往保持具的安装面与刀刃之间存在间隔。该间隔根据工具本身的加工误差而变化。As is known from FIG. 3 of Patent Document 1, a tool used in a conventionally known groove processing device has a cutting edge formed only at the central portion in the width direction perpendicular to the moving direction of the tool. That is, there is a space between the mounting surface of the tool to the holder and the cutting edge. This interval varies according to the machining error of the tool itself.

在此种状况下,在因工具的磨损等而更换工具的情形时,存在如下情形:因上述的加工误差而导致从保持具的工具安装面至工具的刀刃的距离变化。一旦该距离变化,则无法精度佳地加工沟槽。因此,每当在更换工具时,均需要调整加工位置。In such a situation, when the tool is replaced due to wear of the tool or the like, the distance from the tool mounting surface of the holder to the cutting edge of the tool may change due to the aforementioned machining error. If this distance changes, the groove cannot be machined with high precision. Therefore, it is necessary to adjust the machining position whenever the tool is changed.

发明内容Contents of the invention

本发明的目的在于,克服现有的沟槽加工装置存在的问题,而提供一种新型结构的基板的沟槽加工工具及沟槽加工装置,所要解决的技术问题包括,即使是更换工具的情形时,亦无需调整加工位置,而可精度佳地进行沟槽加工。The object of the present invention is to overcome the problems existing in the existing groove processing device, and provide a substrate groove processing tool and groove processing device with a new structure. The technical problems to be solved include, even if the tool is replaced When it is used, there is no need to adjust the processing position, and the groove processing can be performed with high precision.

第1发明的基板的沟槽加工工具,是保持于保持具,与保持具一同在作为加工对象的基板上相对地移动而用以在基板形成沟槽的工具,具备有工具本体与刃尖部。工具本体具有抵接于保持具的抵接面,且保持于保持具。刃尖部,形成于工具本体的前端部,且具有从抵接面连续而形成为与抵接面同一面的基准面,并且从基准面起具有既定的宽度。The groove machining tool for a substrate according to the first invention is held by a holder, moves relatively together with the holder on a substrate to be processed to form a groove on the substrate, and includes a tool body and a cutting edge portion. . The tool body has an abutting surface that abuts against the holder, and is held by the holder. The cutting edge portion is formed at the front end portion of the tool body, has a reference plane that is continuous from the contact surface and is formed on the same plane as the contact surface, and has a predetermined width from the reference surface.

在此处,刃尖部具有与工具本体的安装于保持具的抵接面为同一面的基准面,且从该基准面起以既定的宽度形成。因此,不存在如下情形:工具本体的抵接面与刀刃之间的距离因加工误差而于每个工具有所不同。因此,在更换工具时,无需加工位置的调整即可精度佳地加工沟槽。Here, the cutting edge portion has a reference plane that is flush with the contact surface of the tool body attached to the holder, and is formed with a predetermined width from the reference plane. Therefore, there is no situation where the distance between the abutting surface of the tool body and the cutting edge differs from tool to tool due to machining errors. Therefore, when the tool is changed, the groove can be machined with high precision without adjusting the machining position.

第2发明的基板的沟槽加工工具,在第1发明的沟槽加工工具,在刃尖部的前端形成有刀刃,且自移动方向观察时,包含刀刃的刃尖部的前端部为方形。In the substrate grooving tool of the second invention, in the groove machining tool of the first invention, a blade is formed at the tip of the blade edge, and the tip of the blade edge including the blade is square when viewed from the moving direction.

在此处,由于包含刀刃的刃尖部为方形,因此即使工具的刀刃磨损,加工的沟槽宽度亦为固定。Here, since the cutting edge including the cutting edge is square, the groove width to be machined is constant even if the cutting edge of the tool is worn.

第3发明的基板的沟槽加工工具,在第2发明的沟槽加工工具,在形成有刃尖部的刀刃的侧部,形成有随着远离刀刃而往移动方向上游侧倾斜的斜面。In the groove machining tool for a substrate according to the third invention, in the groove machining tool according to the second invention, an inclined surface inclined toward the upstream side in the moving direction as the distance from the blade is formed is formed on the side of the blade on which the edge portion is formed.

在此处,由于在形成有刀刃的工具的侧部形成有斜面,因此所去除的基板的一部分的排出性变得良好。因此,可抑制沟槽周边的膜等剥离的情形。Here, since the inclined surface is formed on the side of the tool on which the cutting edge is formed, the ejectability of a part of the removed substrate becomes good. Therefore, it is possible to suppress the peeling of the film and the like around the trench.

第4发明的基板的沟槽加工工具,在第1或第2发明的沟槽加工工具,保持具往返移动。此外,刃尖部具有形成于移动方向的往动侧的前端的第1刀刃、以及形成于返动侧的前端的第2刀刃。而且,在形成有第1刀刃的刃尖部的第1侧部与形成有第2刀刃的刃尖部的第2侧部,形成有随着远离各刀刃而往移动方向上游侧倾斜的斜面。In the substrate groove machining tool of the fourth invention, in the groove machining tool of the first or second invention, the holder moves back and forth. Moreover, the blade edge part has the 1st blade formed in the front-end|tip on the forward side of a moving direction, and the 2nd blade formed in the front-end|tip on the reverse side. In addition, slopes inclined toward the upstream side in the moving direction are formed on the first side portion where the edge portion of the first blade is formed and the second side portion where the edge portion of the second blade is formed.

在此处,借由使保持具往返移动而可实现如下情形:在往动时以工具的第1刀刃进行沟槽加工,而在返动时以工具的第2刀刃进行沟槽加工。此外,与第3发明相同地,在形成有各刀刃的工具的两侧部,形成有斜面,因此所去除的基板的一部分的排出性变得良好。因此,可抑制沟槽周边的膜等剥离的情形。Here, by reciprocating the holder, it is possible to perform groove processing with the first cutting edge of the tool during the forward movement, and to perform groove processing with the second cutting edge of the tool during the backward movement. In addition, as in the third invention, since slopes are formed on both side portions of the tool on which the cutting edges are formed, the ejectability of a part of the removed substrate becomes good. Therefore, it is possible to suppress the peeling of the film and the like around the trench.

第5发明的基板的沟槽加工装置,沿基板的图案线形成沟槽的装置,具备有载置基板的平台、安装第1至第4发明中的任一沟槽加工工具的头部、以及用以使平台与头部在水平面内相对移动的移动机构。而且,头部具有可上下移动的保持具、以及使保持于保持具的沟槽加工工具以既定的按压力对基板进行按压的按压构件。A substrate groove processing apparatus according to a fifth invention is an apparatus for forming a groove along a pattern line of a substrate, comprising a stage on which the substrate is placed, a head for mounting any one of the groove processing tools of the first to fourth inventions, and A moving mechanism used to move the platform relative to the head in the horizontal plane. Furthermore, the head has a vertically movable holder, and a pressing member for pressing the grooving tool held by the holder against the substrate with a predetermined pressing force.

在该装置,沟槽加工工具借由按压构件而以既定的按压力按压基板并往返移动。而且,在往动时与返动时,在基板上形成沟槽。In this device, the groove machining tool presses the substrate with a predetermined pressing force by a pressing member and moves back and forth. Furthermore, grooves are formed on the substrate during the forward movement and the backward movement.

第6发明的基板的沟槽加工装置,在第5发明的装置中,保持具是保持沟槽加工工具,且具有以与移动方向正交的摆动轴为支点而摆动、取得往动位置与返动位置的摆动构件。According to the sixth invention, in the apparatus of the fifth invention, the holder holds a groove processing tool, and has a swing axis perpendicular to the movement direction as a fulcrum for swinging, obtaining a forward position, and a return position. Swing member in swing position.

如以上的本发明,至少具有下列优点以及有益效果:即使在更换工具的情形,亦无需调整加工位置而可精度佳地进行沟槽加工。As above, the present invention has at least the following advantages and beneficial effects: Even in the case of changing tools, groove machining can be performed with high precision without adjusting the machining position.

综上所述,本发明在技术上有显著的进步,并具有明显的积极技术效果,诚为一新颖、进步、实用的新设计。To sum up, the present invention has significant technical progress, and has obvious positive technical effects. It is a novel, progressive and practical new design.

上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其他目的、特征和优点能够更明显易懂,以下特举较佳实施例,并配合说明书附图,详细说明如下。The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are cited in detail, and in conjunction with the accompanying drawings, the detailed description is as follows.

附图说明Description of drawings

图1,是安装有本发明的一实施形态的沟槽加工工具的沟槽加工装置的外观立体图。FIG. 1 is an external perspective view of a groove machining device equipped with a groove machining tool according to an embodiment of the present invention.

图2,是沟槽加工装置的头部的主视图。Fig. 2 is a front view of the head of the groove machining device.

图3(a)和图3(b),是表示沟槽加工工具的侧面、正面的图式。FIG. 3( a ) and FIG. 3( b ) are diagrams showing the side surface and the front surface of the groove processing tool.

图4(a)、图4(b)和图4(c),是用以说明沟槽加工时的动作的示意图。FIG. 4( a ), FIG. 4( b ) and FIG. 4( c ) are schematic diagrams for explaining operations during grooving.

【主要元件符号说明】[Description of main component symbols]

1    平台               2    工具1 Platform 2 Tools

3    头部               6    移动支持机构3 head 6 mobile support mechanism

17   保持具             18   摆动构件17 Holder 18 Swing member

19   气缸               22   保持具本体19 Cylinder 22 Holder body

36   工具本体           37   刃尖部36 Tool body 37 Blade tip

38a、38b    刀刃        40a、40b    斜面38a, 38b blade 40a, 40b bevel

具体实施方式Detailed ways

为进一步阐述本发明为达成预定发明目的所采取的技术手段以及其功效,以下结合附图及较佳实施例,对依据本发明提出的基板的沟槽加工工具及沟槽加工装置的具体实施方式、结构、特征及其功效,详细说明如后。In order to further explain the technical means adopted by the present invention to achieve the intended purpose of the invention and its effects, the specific implementation of the substrate groove processing tool and groove processing device according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , structure, feature and effect thereof, detailed description is as follows.

图1表示安装有本发明的一实施形态的沟槽加工工具的沟槽加工装置的外观立体图。FIG. 1 shows an external perspective view of a groove machining device to which a groove machining tool according to an embodiment of the present invention is attached.

[沟槽加工装置的整体构成][Overall configuration of groove processing device]

该装置具备有载置基板W的平台1、安装有沟槽加工工具(以下,简记工具)2的头部3、以及各为两台的摄像机4及显示器5。This device includes a stage 1 on which a substrate W is placed, a head 3 on which a groove machining tool (hereinafter, simply referred to as tool) 2 is mounted, and two cameras 4 and monitors 5 each.

平台1可在水平面内在图1的Y方向移动。此外,平台1可在水平面内旋转任意的角度。另外,在图1表示有头部3的概略的外观,而头部3的细节将在下文叙述。The platform 1 is movable in the Y direction of FIG. 1 within the horizontal plane. In addition, the platform 1 can rotate at any angle in the horizontal plane. 1 shows a schematic appearance of the head 3, but the details of the head 3 will be described below.

头部3可借由移动支持机构6而在平台1的上方在X、Y方向移动。另外,如图1所示,X方向是在水平面内正交于Y方向的方向。移动支持机构6具有1对支持柱7a、7b、横跨1对支持柱7a、7b间而设置的导杆8、以及驱动形成于导杆8的导件9的马达10。头部3可沿导件9而如上所述般于X方向移动。The head 3 can move in X and Y directions above the platform 1 by means of the moving supporting mechanism 6 . In addition, as shown in FIG. 1 , the X direction is a direction perpendicular to the Y direction within the horizontal plane. The movement support mechanism 6 has a pair of support columns 7a, 7b, a guide rod 8 provided across the pair of support columns 7a, 7b, and a motor 10 that drives a guide 9 formed on the guide rod 8. The head 3 can move in the X direction along the guide 9 as described above.

两台摄像机4分别固定于基座12。各基座12可沿设置于支持台13的往X方向延伸的导件14而移动。两台摄像机4可上下动作,且以各摄像机4拍摄的图像显示于对应的显示器5。The two cameras 4 are respectively fixed on the base 12 . Each base 12 can move along a guide 14 extending in the X direction provided on the support table 13 . The two cameras 4 can move up and down, and the images captured by each camera 4 are displayed on the corresponding monitor 5 .

[头部][head]

在图2中,抽出头部3而表示。头部3具有板状的底座16、保持具17以及气缸19。In FIG. 2 , the head 3 is extracted and shown. The head 3 has a plate-shaped base 16 , a holder 17 and an air cylinder 19 .

保持具17经由未图示的轨条而相对于底座16在上下方向滑动自如地被支持。保持具17具有保持具本体22、固定于保持具本体22的表面的支持构件23、以及摆动构件18。The holder 17 is slidably supported in the vertical direction with respect to the base 16 via rails not shown. The holder 17 has a holder body 22 , a support member 23 fixed to the surface of the holder body 22 , and a swing member 18 .

保持具本体22形成为板状,且在上部具有开口22a。支持构件23是在横向方向为较长的矩形状的构件,且形成有摆动构件18插通于内部的贯通孔23a。The holder body 22 is formed in a plate shape, and has an opening 22a at an upper portion. The support member 23 is a long rectangular member in the lateral direction, and has a through-hole 23a through which the swing member 18 is inserted.

摆动构件18是摆动自如地被支持于保持具本体22及支持构件23。摆动构件18具有下部的工具安装部24、以及从工具安装部24往上方延伸而形成的延长部25。The swing member 18 is swingably supported by the holder main body 22 and the support member 23 . The swing member 18 has a lower tool attachment portion 24 and an extension portion 25 formed to extend upward from the tool attachment portion 24 .

在工具安装部24形成有沟槽,且在该沟槽插入工具2,进一步地,借由固定板24a而将工具2固定于沟槽内。A groove is formed in the tool mounting portion 24, and the tool 2 is inserted into the groove, and the tool 2 is fixed in the groove by the fixing plate 24a.

在延长部25的下部,形成有在水平方向且往与沟槽形成方向正交的方向贯通的孔25a。而且,摆动构件18是以贯通该孔25a的销26为中心摆动自如。销26借由保持具本体22与支持构件23而支持。In the lower portion of the extension portion 25, a hole 25a penetrating in the horizontal direction and in a direction perpendicular to the groove forming direction is formed. And the swing member 18 is swingable centering on the pin 26 which penetrates this hole 25a. The pin 26 is supported by the holder body 22 and the supporting member 23 .

在延长部25的上端部25b的左右两侧,设置有1对限制构件27a、27b。如图4所示,各限制构件27a、27b具有固定于保持具本体22的筒状构件28a、28b以及插入于筒状构件28a、28b的内部的弹簧29a、29b。而且,各弹簧29a、29b的前端抵接于延长部25的上端部25b,借此摆动构件18维持于如图2及图4(b)所示的中立位置。此外,摆动构件18摆动而按压任一弹簧29a、29b,且延长部25的上端部25b抵接于筒状构件28a、28b,借此限制摆动角度。On the left and right sides of the upper end portion 25b of the extension portion 25, a pair of restricting members 27a and 27b are provided. As shown in FIG. 4, each restricting member 27a, 27b has the cylindrical member 28a, 28b fixed to the holder main body 22, and the spring 29a, 29b inserted in the cylindrical member 28a, 28b. And, the front end of each spring 29a, 29b abuts against the upper end portion 25b of the extension portion 25, whereby the swing member 18 is maintained at the neutral position as shown in FIG. 2 and FIG. 4(b). Further, the swing member 18 swings to press one of the springs 29a, 29b, and the upper end portion 25b of the extension part 25 abuts against the cylindrical members 28a, 28b, thereby restricting the swing angle.

气缸19固定于气缸支持构件30的上面。气缸支持构件30配置于保持具17的上部,且固定于底座16。在气缸支持构件30形成有在上下方向贯通的孔,而气缸19的活塞杆(未图示)贯通该贯通孔且使杆的前端连结于保持具17。The air cylinder 19 is fixed on the upper surface of the air cylinder supporting member 30 . The cylinder supporting member 30 is disposed on the upper portion of the holder 17 and fixed to the base 16 . A hole penetrating in the vertical direction is formed in the cylinder supporting member 30 , and a piston rod (not shown) of the air cylinder 19 penetrates the through hole, and the end of the rod is connected to the holder 17 .

此外,在底座16的上部设置有弹簧支持构件31。在弹簧支持构件31与保持具17之间设置有弹簧32,而借由弹簧32,保持具17往上方弹压。借由该弹簧32而可大致抵消保持具17的本身重。Furthermore, a spring supporting member 31 is provided on the upper portion of the base 16 . A spring 32 is provided between the spring supporting member 31 and the holder 17 , and the holder 17 is biased upward by the spring 32 . The weight of the holder 17 can be substantially offset by the spring 32 .

在保持具17的左右两侧,设置有1对气体供给部34a、34b。1对气体供给部34a、34b,均为相同的构成,且分别具有接头35与空气喷嘴36。On both left and right sides of the holder 17, a pair of gas supply parts 34a, 34b are provided. A pair of gas supply parts 34a, 34b has the same structure, and has the joint 35 and the air nozzle 36, respectively.

[工具][tool]

在图3表示工具2的细节。图3(a)是从移动方向观察工具2的侧视图,且该图(b)是该主视图。在图3(b)表示工具2的移动方向M。Details of the tool 2 are shown in FIG. 3 . FIG. 3( a ) is a side view of the tool 2 viewed from the moving direction, and the figure ( b ) is the front view. The moving direction M of the tool 2 is shown in FIG. 3( b ).

工具2具有保持于保持具17的工具本体、以及形成于工具本体36的前端部的刃尖部37。在图3(a)中,工具本体36的一面36a,成为抵接于工具安装部24的抵接面。The tool 2 has a tool body held by the holder 17 , and a blade edge portion 37 formed at the front end portion of the tool body 36 . In FIG. 3( a ), one surface 36 a of the tool body 36 is a contact surface that contacts the tool mounting portion 24 .

刃尖部37在工具本体36的前端部,形成于高度h(参照图3(b))的范围内。根据图3(a)得知,刃尖部37的一面37a,与工具本体36的抵接面36a连续,且成为形成为同一面的基准面。刃尖部37从该基准面37a形成为既定的宽度,且从移动方向观察时形成为方形。The cutting edge portion 37 is formed within the range of the height h (see FIG. 3( b )) at the front end portion of the tool body 36 . As can be seen from FIG. 3( a ), one surface 37 a of the blade edge portion 37 is continuous with the contact surface 36 a of the tool body 36 and serves as a reference surface formed on the same surface. The blade edge portion 37 is formed to have a predetermined width from the reference plane 37a, and is formed in a square shape when viewed from the moving direction.

在刃尖部37的前端,在移动方向的两侧形成有第1刀刃38a及第2刀刃38b。此处,第1刀刃38a是用以在往动时进行沟槽加工的刀刃,第2刀刃38b是用以在返动时进行沟槽加工的刀刃。A first blade 38 a and a second blade 38 b are formed on both sides in the moving direction at the tip of the blade edge portion 37 . Here, the first blade 38a is a blade for performing grooving during forward movement, and the second blade 38b is a blade for performing grooving during backward movement.

此外,如图3(a)所示,在刃尖部37中,与移动方向正交的方向的宽度W,形成为较工具本体36的相同方向的宽度为窄。如上所述,刃尖部37形成于移动方向,因此该方向的刃尖部37的宽度是遍及全长为相同的宽度W。进一步地,根据图3(a)得知,工具本体36的刃尖部37侧的部分,是以与移动方向正交的方向的宽度随着接近刃尖部37而变窄的方式以角度D倾斜。In addition, as shown in FIG. 3( a ), in the blade edge portion 37 , the width W in the direction perpendicular to the moving direction is formed to be narrower than the width W in the same direction of the tool body 36 . As described above, since the blade edge portion 37 is formed in the moving direction, the width of the blade edge portion 37 in this direction is the same width W over the entire length. Furthermore, as can be seen from FIG. 3( a ), the portion of the tool body 36 on the blade edge portion 37 side is formed at an angle D such that the width in the direction perpendicular to the moving direction becomes narrower as it approaches the blade edge portion 37 . tilt.

工具2,在包含刃尖部37的下端部的侧面形成有斜面。更详细而言,如图3(b)所示,从正面(与移动方向正交的方向)观察工具2时,在包含形成有第1刀刃38a的刃尖部37的第1侧部与包含形成有第2刀刃38b的刃尖部37的第2侧部,形成有随着从各刀刃38a、38b往上方行进而往内部侧(在各刀刃为移动方向上游侧)倾斜的斜面40a、40b。In the tool 2 , a slope is formed on the side surface including the lower end portion of the cutting edge portion 37 . More specifically, as shown in FIG. 3( b ), when the tool 2 is viewed from the front (direction perpendicular to the moving direction), the first side portion including the cutting edge portion 37 formed with the first blade 38a and the On the second side portion of the blade edge portion 37 on which the second blade 38b is formed, slopes 40a, 40b are formed that incline toward the inner side (upstream side in the moving direction of each blade) as the blades 38a, 38b go upward. .

[沟槽加工动作][Groove processing action]

在使用如以上的装置而对薄膜太阳电池基板进行沟槽加工的情形时,借由移动支持机构6而使头部3移动,并且使平台1移动,且利用摄像机4及显示器5使工具2位于形成沟槽的预定线上。When using the above device to perform groove processing on a thin-film solar cell substrate, the head 3 is moved by moving the support mechanism 6, and the platform 1 is moved, and the tool 2 is positioned at the position using the camera 4 and the display 5. Form the trench on the predetermined line.

在进行如以上的定位后,驱动气缸19而使保持具17及摆动构件18下降,而使工具2的前端接触薄膜。此时的工具2的对薄膜的加压力,借由供给至气缸19的气压而调整。After performing the above positioning, the air cylinder 19 is driven to lower the holder 17 and the swing member 18 so that the tip of the tool 2 comes into contact with the film. The pressure applied to the film by the tool 2 at this time is adjusted by the air pressure supplied to the air cylinder 19 .

接着,驱动马达10而使头部3沿沟槽加工预定线扫描。在图4中,示意性地表示此时的摆动构件18及工具2的姿势。Next, the motor 10 is driven to scan the head 3 along the line to be grooved. In FIG. 4 , the postures of the swing member 18 and the tool 2 at this time are schematically shown.

如图4(a)所示,在往动时(在图4中为往右侧的移动时),借由第1刀刃38a与基板上的薄膜的接触阻力,而使摆动构件18以销26为中心往顺时针方向摆动。该摆动借由摆动构件18的上端部25b抵接于右侧的筒状构件28a而被限制。因此,工具2维持如图4(a)所示的倾斜姿势,并以第1刀刃38a抵接于基板上的薄膜且第2刀刃38b不抵接于基板的表面的状态,往+M方向移动而形成沟槽。As shown in Figure 4 (a), when moving forward (when moving to the right in Figure 4), the swing member 18 is driven by the pin 26 by the contact resistance of the first blade 38a and the film on the substrate. Swing clockwise from the center. This swing is restricted by the upper end portion 25b of the swing member 18 abutting against the right cylindrical member 28a. Therefore, the tool 2 maintains the inclined posture as shown in FIG. 4( a ), and moves in the +M direction with the first blade 38 a in contact with the thin film on the substrate and the second blade 38 b not in contact with the surface of the substrate. to form grooves.

之后,使头部3相对于基板而相对性地移动,而使工具2移动至接下来应下降的沟槽加工预定线上。然后,与上述相同地,将工具2按压至基板上的薄膜而使头部3往与上述相反的方向移动。Thereafter, the head 3 is relatively moved with respect to the substrate, and the tool 2 is moved to the line on which the groove processing is planned to be lowered next. Then, in the same manner as above, the tool 2 is pressed against the thin film on the substrate to move the head 3 in the opposite direction to the above.

如图4(c)所示,在该返动时(在图4中为往左侧的移动时),借由第2刀刃38b与基板上的薄膜的接触阻力,摆动构件18以销26为中心往逆时针方向摆动。该摆动借由摆动构件18的上端部25b抵接于左侧的筒状构件28b而被限制。因此,工具2维持如图4(c)所示的倾斜姿势,并以第2刀刃38b抵接于基板上的薄膜且第1刀刃38a不抵接于基板的表面的状态,往-M方向移动,而形成沟槽。As shown in Figure 4(c), during this return movement (when moving to the left in Figure 4), the swinging member 18 uses the pin 26 as a function of the contact resistance between the second blade 38b and the film on the substrate. The center swings counterclockwise. This swing is restricted by the upper end portion 25b of the swing member 18 abutting against the left cylindrical member 28b. Therefore, the tool 2 maintains the inclined posture as shown in FIG. 4( c ), and moves in the −M direction in a state where the second blade 38 b is in contact with the thin film on the substrate and the first blade 38 a is not in contact with the surface of the substrate. , forming grooves.

在如以上的沟槽加工中,在包含工具2的刃尖部37的前端部分,形成有斜面40a、40b,因此借由各刀刃38a、38b而能够将去除的膜顺利地往基板上方排离。因此,可抑制沟槽周边部的膜剥离。In the grooving process as described above, the inclined surfaces 40a, 40b are formed on the front end portion including the cutting edge portion 37 of the tool 2, so the removed film can be smoothly discharged to the upper side of the substrate by the cutting edges 38a, 38b. . Therefore, film peeling at the peripheral portion of the trench can be suppressed.

另外,在沟槽加工或沟槽加工结束时,从各气体供给部34a、34b的空气喷嘴36喷出空气而去除从基板剥离的膜。In addition, when the groove processing or the groove processing is completed, air is blown from the air nozzles 36 of the respective gas supply parts 34a and 34b to remove the film peeled off from the substrate.

在工具2的刃尖部37已磨耗的情形,需要更换工具2。在该工具2的更换时,只需将工具本体36的抵接面36a抵接于保持具本体22的表面而安装即可。刃尖部37是从与抵接面36a为同一面的基准面,以既定的宽度形成,因此各刀刃38a、38b的位置不会于每个工具而有所改变。因此,在工具2的更换时,刀刃38a、38b的位置不会在更换前后有所改变,使得在更换工具时,无需工具的安装位置的调整。When the cutting edge portion 37 of the tool 2 is worn, the tool 2 needs to be replaced. When replacing the tool 2 , it is only necessary to attach the contact surface 36 a of the tool body 36 to the surface of the holder body 22 . Since the cutting edge portion 37 is formed with a predetermined width from the same reference plane as the contact surface 36a, the positions of the cutting edges 38a, 38b do not change for each tool. Therefore, when the tool 2 is replaced, the positions of the blades 38a, 38b do not change before and after the replacement, so that no adjustment of the mounting position of the tool is required when the tool is replaced.

[特征][feature]

(1)刃尖部37从与工具本体36的安装于保持具17的抵接面36a为同一面的基准面37a以既定的宽度形成。因此,相对于保持具17的各刀刃38a、38b的位置不会于每个工具而有所不同,且在更换工具时无需进行加工位置的调整。(1) The blade edge portion 37 is formed with a predetermined width from the reference surface 37 a that is flush with the contact surface 36 a of the tool body 36 attached to the holder 17 . Therefore, the position of each cutting edge 38a, 38b with respect to the holder 17 does not differ from tool to tool, and adjustment of the machining position is not required when the tool is replaced.

(2)刃尖部37从移动方向观察时是为方形,因此即使刀刃38a、38b磨耗,加工的沟槽宽度亦为固定。(2) Since the cutting edge portion 37 has a square shape when viewed from the moving direction, even if the cutting edges 38a and 38b are worn, the groove width to be machined is constant.

(3)在包含刃尖部37的工具2的侧部,形成有斜面40a、40b,因此能够使被去除的膜的排出性变得良好,且能够抑制沟槽周边的膜剥离。(3) Since the slopes 40 a and 40 b are formed on the side of the tool 2 including the cutting edge portion 37 , the removal of the removed film can be improved, and film peeling around the groove can be suppressed.

[其他实施形态][Other Embodiments]

刃尖部的形状可进行各种变更。例如,可使图3(a)所示的宽度W为与工具本体36的宽度相同,此外亦可大于工具本体36的宽度。此外,亦能够以任意的角度形成刀刃的侧部。The shape of the blade tip can be changed in various ways. For example, the width W shown in FIG. 3( a ) may be the same as the width of the tool body 36 or may be larger than the width of the tool body 36 . Moreover, the side part of a blade can also be formed in arbitrary angles.

以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭示如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的方法及技术内容作出些许的更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。The above is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the method and technical content disclosed above to make some changes or modifications to equivalent embodiments with equivalent changes, but if they do not depart from the technical solution of the present invention, Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims (6)

1. the groove processing instrument of a substrate remains in the maintenance tool, and coexisting with above-mentioned maintenance tool one relatively moves on the substrate as processing object, and in order to form groove at substrate, it is characterized in that possessing:
Tool body has the bearing surface that is connected to above-mentioned maintenance tool, and remains in above-mentioned maintenance tool; And
Blade tip portion is formed at the leading section of above-mentioned tool body, and have from above-mentioned bearing surface form continuously and above-mentioned bearing surface with the datum level of one side, and have set width from the said reference face.
2. the groove processing instrument of substrate as claimed in claim 1 is characterized in that wherein, is formed with blade at the front end of above-mentioned blade tip portion, and the leading section that comprises the above-mentioned blade tip portion of above-mentioned blade is square when moving direction is observed.
3. the groove processing instrument of substrate as claimed in claim 2 is characterized in that wherein, at the sidepiece of the blade that is formed with above-mentioned blade tip portion, be formed with along with away from above-mentioned blade toward the inclined-plane that the moving direction upstream side tilts.
4. the groove processing instrument of substrate as claimed in claim 1 or 2 is characterized in that wherein, and above-mentioned maintenance tool comes and goes mobile;
Above-mentioned blade tip portion, have be formed at moving direction toward the 1st blade of the front end of moving side and the 2nd blade that is formed at the front end that returns side;
The 1st sidepiece of the above-mentioned blade tip portion that is formed with above-mentioned the 1st blade, with the 2nd sidepiece of the above-mentioned blade tip portion that is formed with above-mentioned the 2nd blade, be formed with along with away from above-mentioned each blade toward the inclined-plane that the moving direction upstream side tilts.
5. the groove processing apparatus of a substrate forms groove along the pattern lines of substrate, it is characterized in that possessing:
Platform, the mounting substrate;
Head is installed the described groove processing instrument of arbitrary claim in the claim 1 to 4; And
Travel mechanism uses so that above-mentioned platform and above-mentioned head relativity ground in horizontal plane is mobile; And
Above-mentioned head has:
Keep tool, can move up and down; And
Pressing member makes the groove processing instrument that remains in above-mentioned maintenance tool press substrate with set pressing force.
6. the groove processing apparatus of substrate as claimed in claim 5, it is characterized in that wherein, above-mentioned maintenance tool keeps above-mentioned groove processing instrument, and have with the swinging axle of above-mentioned moving direction quadrature for a spot wobble and obtain toward moving position and the oscillating structural member that returns the position.
CN201310010371.3A 2012-02-17 2013-01-10 The groove processing instrument of substrate and groove processing apparatus Expired - Fee Related CN103252804B (en)

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JP2012032895A JP5826665B2 (en) 2012-02-17 2012-02-17 Substrate groove processing tool and groove processing apparatus

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