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CN103246401A - Sensing element structure of touch panel and manufacturing method thereof - Google Patents

Sensing element structure of touch panel and manufacturing method thereof Download PDF

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CN103246401A
CN103246401A CN2013101763180A CN201310176318A CN103246401A CN 103246401 A CN103246401 A CN 103246401A CN 2013101763180 A CN2013101763180 A CN 2013101763180A CN 201310176318 A CN201310176318 A CN 201310176318A CN 103246401 A CN103246401 A CN 103246401A
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sensing
element structure
sensing element
conductive material
substrate
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CN103246401B (en
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李达汉
郭文瑞
郑詠泽
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AUO Corp
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AU Optronics Corp
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Abstract

本发明公开一种触控面板的感测元件结构及其制作方法。触控面板的感测元件结构包括多条第一感测串列,沿着第一方向分别设置于一第一基板的表面。各第一感测串列包括多个第一感测单元与多个第一沟槽,其中该多个第一感测单元皆沿着第一方向相邻并排,且分别包括一第一浮凸结构与设于第一浮凸结构的容置空间内的第一导电材料,而各第一沟槽分别设置于同一感测串列的任二相邻的第一感测单元之间,以使任二相邻的第一浮凸结构的容置空间通过第一沟槽相通,且第一导电材料还设置于第一沟槽中,以使同一第一感测串列的第一感测单元通过第一沟槽内的第一导电材料而互相电连接。

The invention discloses a sensing element structure of a touch panel and a manufacturing method thereof. The sensing element structure of the touch panel includes a plurality of first sensing series, which are respectively arranged on the surface of a first substrate along the first direction. Each first sensing series includes a plurality of first sensing units and a plurality of first trenches, wherein the plurality of first sensing units are adjacent and side by side along the first direction, and each includes a first relief. structure and a first conductive material disposed in the accommodation space of the first relief structure, and each first trench is disposed between any two adjacent first sensing units in the same sensing series, so that The accommodation spaces of any two adjacent first relief structures are connected through the first trench, and the first conductive material is also disposed in the first trench, so that the first sensing units of the same first sensing series They are electrically connected to each other through the first conductive material in the first trench.

Description

触控面板的感测元件结构及其制作方法Sensing element structure and manufacturing method of touch panel

技术领域technical field

本发明涉及一种触控面板的感测元件结构及其制作方法,尤其涉及利用浮凸(embossment)结构与具透明特性的导电材料当作感测单元的一种触控面板的感测元件结构及其制作方法。The present invention relates to a sensing element structure of a touch panel and a manufacturing method thereof, in particular to a sensing element structure of a touch panel using an embossment structure and a transparent conductive material as a sensing unit and its production method.

背景技术Background technique

在现今各类型消费性电子产品中,平板电脑、移动电话(mobile phone)与影音播放器等可携式电子产品已广泛地使用触控面板(touch panel)取代传统的键盘,作为人机数据沟通界面,以节省电子产品的体积。Among various types of consumer electronic products today, portable electronic products such as tablet computers, mobile phones, and audio-visual players have widely used touch panels to replace traditional keyboards as human-machine data communication. interface to save the volume of electronic products.

现有触控面板主要利用透明金属氧化物材料来制作感测元件,其中,目前最普遍使用的为氧化铟锡等材料。然而,透明金属氧化物材料的穿透率(transmittance)、面阻值(sheet resistance)及色偏(hue)问题皆受到其膜层厚度的影响,例如,若为了降低面阻值而增加膜层厚度,那么便会使氧化铟锡的穿透率降低,因此在使用传统透明金属氧化物材料当作感测元件的情况下,很难兼顾触控面板的透明度与电性表现。此外,氧化铟锡为脆性材料,若将其应用在软性触控面板中,则会容易发生脆裂(crack)而导致触控失灵。因此,现有利用透明金属氧化物材料制作感测元件的作法仍有待进一步的改善。Existing touch panels mainly use transparent metal oxide materials to make sensing elements, among which materials such as indium tin oxide are most commonly used at present. However, the transmittance, sheet resistance and hue of transparent metal oxide materials are all affected by the thickness of the film layer. For example, if the film layer is increased to reduce the sheet resistance If the thickness is low, the transmittance of ITO will be reduced. Therefore, it is difficult to balance the transparency and electrical performance of the touch panel when using traditional transparent metal oxide materials as sensing elements. In addition, indium tin oxide is a brittle material, and if it is applied in a soft touch panel, it will easily crack and cause touch failure. Therefore, the current practice of using transparent metal oxide materials to manufacture sensing elements still needs further improvement.

发明内容Contents of the invention

本发明的目的之一在于提供一种利用浮凸结构与具透明特性的导电材料制作的感测元件结构,使其应用在触控面板中能有效改善上述现有因感测元件材料而影响触控面板透明度与电性表现的问题。One of the objectives of the present invention is to provide a sensing element structure made of embossed structure and transparent conductive material, so that its application in a touch panel can effectively improve the above-mentioned existing problems caused by sensing element materials. Control panel transparency and electrical performance issues.

为达上述目的,本发明提供一种触控面板的感测元件结构,该感测元件结构包括多条第一感测串列,分别沿着第一方向设置于第一基板的第一表面。各第一感测串列包括多个第一感测单元与多个第一沟槽,其中该多个第一感测单元沿着第一方向相邻并排,而各第一感测单元分别包括第一浮凸结构与一种第一导电材料,第一导电材料容置于第一浮凸结构的容置空间之中。各第一沟槽分别设置于同一第一感测串列的任二相邻的第一感测单元之间,以使任二相邻的第一浮凸结构的容置空间通过各第一沟槽而相通。并且,第一导电材料更设置于第一沟槽中,以使相同的第一感测串列的第一感测单元互相电连接。To achieve the above purpose, the present invention provides a sensing element structure of a touch panel, the sensing element structure includes a plurality of first sensing series, respectively disposed on the first surface of the first substrate along a first direction. Each first sensing series includes a plurality of first sensing units and a plurality of first trenches, wherein the plurality of first sensing units are adjacent to each other along the first direction, and each first sensing unit includes The first embossed structure and a first conductive material are accommodated in the accommodating space of the first embossed structure. Each first groove is respectively arranged between any two adjacent first sensing units of the same first sensing series, so that the accommodating space of any two adjacent first relief structures passes through each first groove The grooves are connected. Moreover, the first conductive material is further disposed in the first groove, so that the first sensing units of the same first sensing series are electrically connected to each other.

为达上述目的,本发明另提供一种触控面板的感测元件结构的制作方法,包括提供第一基板,其具有相对设置一第一表面,接着于第一表面形成多个第一浮凸结构与多个第一沟槽,其中第一浮凸结构呈阵列排列且具有一容置空间,而各第一沟槽设置于沿着第一方向相邻排列的第一浮凸结构之间,以连通该多个第一浮凸结构。然后于第一浮凸结构的容置空间与第一沟槽中填入第一导电材料。再于第一浮凸结构表面形成密封层,以将第一导电材料密封于容置空间与第一沟槽中。In order to achieve the above purpose, the present invention further provides a method for manufacturing a sensing element structure of a touch panel, which includes providing a first substrate having a first surface opposite to it, and then forming a plurality of first embossments on the first surface structure and a plurality of first grooves, wherein the first embossed structures are arranged in an array and have an accommodating space, and each first groove is arranged between the first embossed structures arranged adjacently along the first direction, to communicate with the plurality of first embossed structures. Then fill the accommodating space of the first embossed structure and the first groove with the first conductive material. A sealing layer is then formed on the surface of the first embossed structure to seal the first conductive material in the accommodating space and the first groove.

由于本发明利用浮凸结构与导电材料制作触控面板的感测元件结构,因此可以同时兼顾透明度与电性表现,且浮凸结构与导电材料皆能适应弯曲或软性的环境,因此本发明的感测元件结构可以应用于软性触控面板中,能大幅改善传统金属氧化物材料因脆性特性而导致感测元件脆裂的问题。Since the present invention uses the embossed structure and conductive material to make the sensing element structure of the touch panel, it can take into account both transparency and electrical performance, and both the embossed structure and the conductive material can adapt to bending or soft environments, so the present invention The sensing element structure can be applied to soft touch panels, which can greatly improve the problem of brittle cracking of sensing elements caused by the brittleness of traditional metal oxide materials.

附图说明Description of drawings

图1为本发明触控面板的感测元件结构的第一实施例的俯视示意图;1 is a schematic top view of a first embodiment of a sensing element structure of a touch panel of the present invention;

图2为图1所示触控面板的感测元件结构沿着切线2-2’的剖面示意图;2 is a schematic cross-sectional view of the sensing element structure of the touch panel shown in FIG. 1 along the tangent line 2-2';

图3为本发明感测元件结构的制作工艺示意图;3 is a schematic diagram of the manufacturing process of the sensing element structure of the present invention;

图4为包含本发明触控面板的感测元件结构的第二实施例的俯视示意图;4 is a schematic top view of a second embodiment of a sensing element structure including a touch panel of the present invention;

图5为图4所示触控面板的感测元件结构沿着切线5-5’的剖面示意图;5 is a schematic cross-sectional view of the sensing element structure of the touch panel shown in FIG. 4 along the tangent line 5-5';

图6为包含本发明触控面板的感测元件结构的第三实施例的俯视示意图;6 is a schematic top view of a third embodiment of a sensing element structure including a touch panel of the present invention;

图7A为图6所示触控面板的感测元件结构沿着切线7-7’的剖面示意图;7A is a schematic cross-sectional view of the sensing element structure of the touch panel shown in FIG. 6 along the tangent line 7-7';

图7B为图7A所示感测元件结构的第一变化实施例的剖面示意图;7B is a schematic cross-sectional view of a first variant embodiment of the sensing element structure shown in FIG. 7A;

图7C为图7A所示感测元件结构的第二变化实施例的剖面示意图;7C is a schematic cross-sectional view of a second variant embodiment of the sensing element structure shown in FIG. 7A;

图7D为图7A所示感测元件结构的第三变化实施例的剖面示意图;7D is a schematic cross-sectional view of a third variant embodiment of the sensing element structure shown in FIG. 7A;

图8为包含本发明触控面板的感测元件结构的第四实施例的俯视示意图;8 is a schematic top view of a fourth embodiment of a sensing element structure including a touch panel of the present invention;

图9为图8所示触控面板的感测元件结构沿着切线9-9’的剖面示意图;9 is a schematic cross-sectional view of the sensing element structure of the touch panel shown in FIG. 8 along the tangent line 9-9';

图10为包含本发明触控面板的感测元件结构的第五实施例的俯视示意图;10 is a schematic top view of a fifth embodiment of the sensing element structure including the touch panel of the present invention;

图11为图10所示触控面板的感测元件结构沿着切线11-11’的剖面示意图;11 is a schematic cross-sectional view of the sensing element structure of the touch panel shown in FIG. 10 along the tangent line 11-11';

图12为本发明感测单元图形的变化实施例的示意图。FIG. 12 is a schematic diagram of a variant embodiment of the sensing unit pattern of the present invention.

符号说明Symbol Description

100感测元件结构基本单元  110感测元件结构100 sensing element structure basic unit 110 sensing element structure

112、112’、112’’、112’’’      第一基板112, 112’, 112’’, 112’’’ The first substrate

112a、112a’、112a’’、112a’’’  第一基板的第一表面112a, 112a', 112a'', 112a''' the first surface of the first substrate

112b、112b’                        第一基板的第二表面112b, 112b' the second surface of the first substrate

114第一感测单元                     116第一浮凸结构114 The first sensing unit 116 The first embossed structure

116a容置空间                        118第一导电材料116a accommodation space 118 first conductive material

120浮凸材料层                       120a凸起部分120 embossed material layer 120a raised part

120b平坦部分                        122第一沟槽120b flat part 122 first groove

124第一密封层                       126凹穴124 first sealing layer 126 cavity

128、128a、128b、128c               第一感测串列128, 128a, 128b, 128c The first sensing series

130第一导线结构                     130a宽导线部分130 first wire structure 130a wide wire part

130b细导线部分                      132轧纹滚轴130b thin wire part 132 crimping roller

136粘着层                           138保护层136 Adhesive layer 138 Protective layer

140、218第二导电材料                142信号感测区140, 218 second conductive material 142 signal sensing area

144周边线路区                       200感测元件结构基本单元144 peripheral line area 200 basic unit of sensing element structure

212第二基板                         212a第二基板的第一表面212 second substrate 212a the first surface of the second substrate

214第二感测单元                     216第二浮凸结构214 The second sensing unit 216 The second embossed structure

216a容置空间                        220浮凸材料层216a accommodation space 220 embossed material layer

222第二沟槽                         224第二密封层222 Second groove 224 Second sealing layer

226凹穴226 pockets

228、228a、228b、228c               第二感测串列228, 228a, 228b, 228c Second sensing series

230第二导线结构     240导电桥接元件230 Second wire structure 240 Conductive bridging element

242贯穿孔242 through holes

600、700、800、900  感测元件结构/触控面板600, 700, 800, 900 Sensing element structure/touch panel

610信号感测区       612周边线路区610 Signal Sensing Area 612 Peripheral Line Area

H浮凸结构深度       Y第一方向H embossed structure depth Y first direction

X第二方向X second direction

具体实施方式Detailed ways

请参考图1与图2,其中图1为本发明触控面板的感测元件结构的第一实施例的俯视示意图,而图2为图1所示触控面板的感测元件结构沿着切线2-2’的剖面示意图。在图1与图2中,感测元件结构110具有单一方向的第一感测串列128,例如包括多个第一感测串列128a、128b、128c,皆沿着第一方向Y延伸排列。各第一感测串列128分别包括多个第一感测单元114,沿着第一方向Y相邻并排成一直行,设置于第一基板112的第一表面112a上,且各第一感测单元114分别包括一第一浮凸结构116与一第一导电材料118。各第一浮凸结构116包括一容置空间116a,而第一导电材料118容置于第一浮凸结构116的容置空间116a之中。第一感测串列128另包括多个第一沟槽122,分别设置于同一第一感测串列128的任二相邻的第一感测单元114之间,使得任二相邻的第一浮凸结构116的容置空间116a可以通过各第一沟槽122而相通;亦即,第一浮凸结构116具有半开放的形状,通过第一沟槽122而彼此串接。第一导电材料118更设置于第一沟槽中122中,因此,在同一第一感测串列128中的各第一感测单元114中的第一导电材料118与第一沟槽122内的第一导电材料118流动相通,而彼此互相电连接或电性导通。值得注意的是,在图1中,虽然仅以三条第一测感串列128a、128b、128c且个别具有三个感测单元114作代表说明,但实际上一感测元件结构110的第一测感串列128的数量以及各第一测感串列128所包含的第一感测单元114与第一沟槽122的数量并不以图1所示者为限。Please refer to FIG. 1 and FIG. 2, wherein FIG. 1 is a schematic top view of a first embodiment of the sensing element structure of the touch panel of the present invention, and FIG. 2 is a schematic view of the sensing element structure of the touch panel shown in FIG. 1 along the tangent line 2-2' Schematic cross-section. In FIG. 1 and FIG. 2, the sensing element structure 110 has a first sensing series 128 in a single direction, for example, includes a plurality of first sensing series 128a, 128b, 128c, all extending along the first direction Y. . Each of the first sensing series 128 includes a plurality of first sensing units 114, which are adjacent and arranged in a straight line along the first direction Y, and are arranged on the first surface 112a of the first substrate 112, and each first The sensing unit 114 respectively includes a first embossed structure 116 and a first conductive material 118 . Each first embossed structure 116 includes an accommodating space 116 a, and the first conductive material 118 is accommodated in the accommodating space 116 a of the first embossed structure 116 . The first sensing series 128 further includes a plurality of first grooves 122, respectively disposed between any two adjacent first sensing units 114 of the same first sensing series 128, so that any two adjacent first sensing units 114 The accommodating space 116a of a relief structure 116 can communicate with each other through the first grooves 122 ; The first conductive material 118 is further disposed in the first trench 122, therefore, the first conductive material 118 and the first trench 122 in each first sensing unit 114 in the same first sensing series 128 The first conductive materials 118 are in fluid communication, and are electrically connected or electrically connected to each other. It is worth noting that in FIG. 1, although only three first sensing series 128a, 128b, 128c and three sensing units 114 are used as a representative illustration, in fact the first sensing element structure 110 The number of sensing series 128 and the number of first sensing units 114 and first grooves 122 included in each first sensing series 128 are not limited to those shown in FIG. 1 .

由图2可知,第一浮凸结构116是由浮凸材料层120所构成,其中浮凸材料层120设置于第一基板112的第一表面112a上,其具有平坦部分120b与凸起部分120a,相邻的凸起部分120a会如同杯壁而环绕部分的平坦部分120b,形成一容置空间116a,容置空间116a仅在与第一沟槽122相接处具有开口,使得容置于其内的第一导电材料118可以经由第一沟槽122而流通于相邻的第一浮凸结构116之中。此外,感测元件结构110另包括第一密封层124设置在浮凸材料层120表面,其覆盖在各第一浮凸结构116与第一沟槽122的表面,将容置空间116a与第一沟槽122内的第一导电材料118密封在各第一感测串列128中。在本实施例中,第一导电材料118可包括任何具透明特性的导电材料的组合,例如为包括具导电性的纳米银丝(silvernanowire)、纳米金属颗粒(nano metal particles)或纳米石墨材料的溶液等,上述具导电性的纳米材料与溶剂的组合在一定比例或条件下,通过人眼视觉会认为第一导电材料118具有透明特性或是具有高透光性。通过散布在第一导电材料118内的纳米银丝、纳米金属颗粒或纳米石墨,可以使位于第一感测串列128中的整个第一导电材料118具有导电性,以让第一感测串列128中的各第一感测单元114互相电连接。举例而言,本实施例的第一浮凸结构116的容置空间116a的深度H为约15至30微米,但不以此为限;各第一浮凸结构116内的第一导电材料118可以完全填充满容置空间116a,也可不完全填充满容置空间116a,例如第一导电材料118在容置空间116a内的填充高度可以小于或等于约1微米,但不以此为限。It can be seen from FIG. 2 that the first embossed structure 116 is composed of an embossed material layer 120, wherein the embossed material layer 120 is disposed on the first surface 112a of the first substrate 112, and has a flat portion 120b and a raised portion 120a. , the adjacent raised portion 120a will surround the flat portion 120b of the portion like a cup wall, forming an accommodating space 116a, and the accommodating space 116a has an opening only at the junction with the first groove 122, so that the The inner first conductive material 118 can flow through the adjacent first relief structure 116 through the first trench 122 . In addition, the sensing element structure 110 further includes a first sealing layer 124 disposed on the surface of the relief material layer 120, which covers the surfaces of the first relief structures 116 and the first grooves 122, and connects the accommodating space 116a to the first groove. The first conductive material 118 in the trench 122 is sealed in each first sensing series 128 . In this embodiment, the first conductive material 118 may include any combination of transparent conductive materials, such as conductive nano-silver wire (silvernanowire), nano-metal particles (nano metal particles) or nano-graphite material. Solution, etc., the combination of the above-mentioned conductive nano-materials and solvents in a certain ratio or condition, the first conductive material 118 will be considered transparent or highly transparent through human vision. The entire first conductive material 118 located in the first sensing series 128 can be made conductive by the nano-silver wire, nano-metal particle or nano-graphite dispersed in the first conductive material 118, so that the first sensing series The first sensing units 114 in the column 128 are electrically connected to each other. For example, the depth H of the accommodating space 116a of the first embossed structure 116 in this embodiment is about 15 to 30 microns, but not limited thereto; the first conductive material 118 in each first embossed structure 116 The accommodating space 116a may or may not be completely filled, for example, the filling height of the first conductive material 118 in the accommodating space 116a may be less than or equal to about 1 micron, but not limited thereto.

本发明触控面板的感测元件结构110另可包括多个第一导线结构130,分别位于各第一感测串列128的一端或二端都具备,例如图1绘示出各第一导线结构130分别对应于一条第一感测串列128中,且设于第一感测串列128的下侧或上侧,亦即一条第一感测串列128的上侧与下侧分别连接一第一导线结构30,其中第一导线结构130与所对应的第一感测串列128的第一导电材料118相接触以电连接于该第一感测串列128。在其他实施例中,一条第一感测串列128可仅有一侧与一第一导线结构30相连接。第一导线结构130较佳包含金属材料或具透明特性的导电材料组合,例如银,其可以网版印刷方式制作于第一基板112的第一表面112a上,但不以此为限,例如也可以利用黄光制作工艺制或油墨印刷(Ink-jet printing)技术来制作第一导线结构130。为了达到使第一导线结构130与其对应的第一感测串列128的第一导电材料118相接触,第一导线结构130的厚度较佳大于第一浮凸结构116的高度,例如可等于或大于第一浮凸结构116的高度与第一密封层124厚度的总和。再者,在与第一感测串列128相接处,第一导线结构130可具有一宽导线部分130a,其宽度约相同于容置空间116a的宽度,宽导线部分130a与浮凸材料层120的凸起部分120a相接并围绕第一导电材料118。各第一导线结构130另包括一细导线部分130b,分别与所对应的宽导线部分130a相接,细导线部分130b可再与外部的其他导线或信号读取元件相电连接,以将第一感测单元114所感测的信号传送出去。因此,在本发明感测元件结构110中,设置有第一感测串列128的部分可以视为信号感测区142,其约略相同于第一密封层124所覆盖的区域,而第一基板112没有被第一密封层124所覆盖的区域可以视为周边线路区144,亦即第一导线结构130所设置的区域。各第一感测串列128所对应的第一导线结构130的数量与形状并不以本实施例为限,例如在其他实施例中,一条第一感测串列128可同时对应两条第一导线结构130,分别位于该第一感测串列128的两端。The sensing element structure 110 of the touch panel of the present invention may further include a plurality of first wire structures 130, which are respectively located at one end or both ends of each first sensing series 128. For example, each first wire structure is shown in FIG. 1 The structures 130 respectively correspond to one of the first sensing series 128, and are arranged on the lower side or the upper side of the first sensing series 128, that is, the upper side and the lower side of a first sensing series 128 are respectively connected. A first wire structure 30 , wherein the first wire structure 130 is in contact with the first conductive material 118 of the corresponding first sensing series 128 to be electrically connected to the first sensing series 128 . In other embodiments, only one side of a first sensing series 128 may be connected to a first wire structure 30 . The first wire structure 130 preferably includes a metal material or a combination of conductive materials with transparent properties, such as silver, which can be fabricated on the first surface 112a of the first substrate 112 by screen printing, but not limited thereto, for example, The first conducting wire structure 130 can be manufactured by using yellow light manufacturing process or ink-jet printing (Ink-jet printing) technology. In order to make the first wire structure 130 contact with the first conductive material 118 of the corresponding first sensing series 128, the thickness of the first wire structure 130 is preferably greater than the height of the first relief structure 116, for example, it may be equal to or greater than the sum of the height of the first relief structure 116 and the thickness of the first sealing layer 124 . Moreover, at the junction with the first sensing series 128, the first conductive line structure 130 may have a wide conductive line portion 130a, the width of which is about the same as the width of the accommodating space 116a, and the wide conductive line portion 130a is connected with the embossed material layer. The raised portion 120a of 120 meets and surrounds the first conductive material 118 . Each first wire structure 130 further includes a thin wire part 130b, respectively connected to the corresponding wide wire part 130a, and the thin wire part 130b can be electrically connected with other external wires or signal reading elements to connect the first The signal sensed by the sensing unit 114 is transmitted out. Therefore, in the sensing element structure 110 of the present invention, the part provided with the first sensing series 128 can be regarded as the signal sensing region 142, which is approximately the same as the region covered by the first sealing layer 124, while the first substrate The area of 112 not covered by the first sealing layer 124 can be regarded as the peripheral circuit area 144 , that is, the area where the first conducting wire structure 130 is disposed. The number and shape of the first wire structures 130 corresponding to each first sensing series 128 are not limited to this embodiment. For example, in other embodiments, one first sensing series 128 can correspond to two second A wire structure 130 is respectively located at two ends of the first sensing series 128 .

请参考图3,图3为本发明感测元件结构以卷对卷(roll-to-roll)方式制作的制作工艺示意图。本发明感测元件结构110的制作方式可以卷对卷方式制作。首先如步骤502,提供第一基板112,然后以例如涂布或其他方式在第一基板112的第一表面112a形成浮凸材料层120,然后在制作工艺步骤504中以轧纹(embossing)加工方式利用轧纹滚轴132在浮凸材料层120表面轧印出呈阵列排列的第一浮凸结构116以及第一沟槽122(未示于图3中),接着如制作工艺步骤506所示,于第一基板112上的第一感测单元114的第一浮凸结构116以及任二相邻第一感测单元114之间的第一沟槽122内填入第一导电材料118,以形成第一感测串列128。然后,如步骤508,以第一密封层124将填入了第一导电材料118的第一浮凸结构116与第一沟槽122密封,便完成了本发明触控基板的感测元件结构110的基本元件的制作。值得注意的是,在填入第一导电材料118时,第一导电材料118可能因含有溶剂而为流体状态,可以在密封之前或之后对第一导电材料118进行烘烤而将溶剂蒸发或固化,例如加热或以紫外光照射第一导电材料118,使第一导电材料118固化。在不同实施例中,第一导电材料118本身也可以为透明流体,在填入第一浮凸结构116之后不对其进行蒸发或固化制作工艺,让第一导电材料118以流体状态存在于浮凸结构116内。之后,依据所需的触控面板大小,可以利用切割等方式将整面的第一基板112切割成多片以形成多个感测元件结构110。此外,第一导线结构130可以在切割第一基板112之前或之后形成于第一基板112的表面,以与对应的第一感测串列128相接。Please refer to FIG. 3 . FIG. 3 is a schematic diagram of the manufacturing process of the sensing element structure of the present invention in a roll-to-roll manner. The sensing element structure 110 of the present invention can be manufactured in a roll-to-roll manner. First, as in step 502, the first substrate 112 is provided, and then the embossed material layer 120 is formed on the first surface 112a of the first substrate 112 by, for example, coating or other methods, and then processed by embossing in the manufacturing process step 504 The first embossed structure 116 and the first groove 122 (not shown in FIG. 3 ) arranged in an array are embossed on the surface of the embossed material layer 120 by using the embossed roller 132, and then as shown in the manufacturing process step 506 Filling the first conductive material 118 in the first relief structure 116 of the first sensing unit 114 on the first substrate 112 and the first groove 122 between any two adjacent first sensing units 114, so as to A first sensing series 128 is formed. Then, as in step 508, the first embossed structure 116 filled with the first conductive material 118 and the first groove 122 are sealed with the first sealing layer 124, and the sensing element structure 110 of the touch substrate of the present invention is completed. The production of basic components. It should be noted that when the first conductive material 118 is filled, the first conductive material 118 may be in a fluid state because it contains a solvent, and the first conductive material 118 can be baked before or after sealing to evaporate or solidify the solvent , such as heating or irradiating the first conductive material 118 with ultraviolet light, so that the first conductive material 118 is cured. In different embodiments, the first conductive material 118 itself can also be a transparent fluid. After filling the first embossed structure 116, it is not evaporated or solidified, so that the first conductive material 118 exists in the embossed structure in a fluid state. Inside Structure 116. Afterwards, according to the required size of the touch panel, the entire first substrate 112 may be cut into multiple pieces by cutting or the like to form multiple sensing element structures 110 . In addition, the first wire structure 130 can be formed on the surface of the first substrate 112 before or after cutting the first substrate 112 to connect with the corresponding first sensing series 128 .

请再同时参阅图1与图2,在制作工艺步骤504中,当利用轧纹滚轴132在浮凸材料层120表面轧印出第一浮凸结构116与第一沟槽122时,会同时在相邻第一感测串列128之间的第一基板112上形成多个封闭凹穴126,其由封闭的凸起部分120a与平坦部分120b所构成,在本实施例中,凹穴126内不需另外填入其他材料,但在制作工艺步骤508的密封制作工艺中,第一密封层124会同时密封住凹穴126。需注意的是,本发明感测元件结构110在第一感测串列128之间的设计并不以上述为限,举例而言,在一其他实施例中,凹穴126内也可以注入导电材料,例如在制作工艺步骤506中将第二导电材料140注入凹穴126中,其中第一导电材料118与第二导电材料140可为相同或不相同的材料。然后在制作工艺步骤508中同时密封凹穴126与容置空间116a的第一导电材料118与第二导电材料140。在另一其他实施例中,凹穴126内可以注入透明不导电流体或其他材料再加以密封,以平衡凸起部分120a两侧的压力。在又另一实施例中,可以利用具有不同于第一实施例的轧纹的轧纹滚轴132在浮凸材料层120表面轧印出仅具有第一浮凸结构116与第一沟槽122但没有凹穴126的图案,亦即在相邻的第一感测串列128之间的浮凸材料层120皆为凸起部分120a。Please refer to FIG. 1 and FIG. 2 at the same time. In the manufacturing process step 504, when the first embossed structure 116 and the first groove 122 are embossed on the surface of the embossed material layer 120 by using the embossing roller 132, the A plurality of closed cavities 126 are formed on the first substrate 112 between adjacent first sensing series 128, which are composed of closed convex portions 120a and flat portions 120b. In this embodiment, the cavities 126 There is no need to fill in other materials, but in the sealing manufacturing process of the manufacturing process step 508 , the first sealing layer 124 will seal the cavity 126 at the same time. It should be noted that the design of the sensing element structure 110 of the present invention between the first sensing series 128 is not limited to the above, for example, in another embodiment, the cavity 126 can also be injected with conductive Materials, for example, the second conductive material 140 is injected into the cavity 126 in the manufacturing process step 506 , wherein the first conductive material 118 and the second conductive material 140 may be the same or different materials. Then in the manufacturing process step 508 , the first conductive material 118 and the second conductive material 140 of the cavity 126 and the accommodating space 116 a are simultaneously sealed. In yet another embodiment, transparent and non-conductive fluid or other materials may be injected into the cavity 126 and then sealed, so as to balance the pressure on both sides of the protruding portion 120a. In yet another embodiment, embossing rollers 132 with embossing patterns different from those of the first embodiment may be used to emboss embossed material layer 120 with only the first embossed structure 116 and the first groove 122. But there is no pattern of recesses 126 , that is, the embossed material layer 120 between adjacent first sensing series 128 is all protruding portions 120 a.

本发明的触控面板的感测元件结构并不以上述实施例为限。下文将依序介绍本发明的其它较佳实施例的触控面板的感测元件结构及其制作方法,且为了便于比较各实施例的相异处并简化说明,在下文的各实施例中使用相同的符号标注相同的元件,且主要针对各实施例的相异处进行说明,而不再对重复部分进行赘述。The sensing element structure of the touch panel of the present invention is not limited to the above-mentioned embodiments. The structure of the sensing element of the touch panel and its manufacturing method in other preferred embodiments of the present invention will be introduced in sequence below, and in order to facilitate the comparison of the differences between the various embodiments and simplify the description, the following embodiments use The same symbols denote the same components, and the description will mainly focus on the differences of the embodiments, and the repeated parts will not be repeated.

请参考图4与图5,图4为包含本发明触控面板的感测元件结构的第二实施例的俯视示意图,而图5为图4所示触控面板的感测元件结构沿着切线5-5’的剖面示意图。若以图1与图2所示的本发明感测元件结构110当作感测元件结构的基本单元,那么在本实施例中,本发明触控面板的感测元件结构600可以包含两个感测元件结构110的基本单元,并且互相以不同方向交叠而构成分别呈Y方向与X方向延伸的感测串列。为便于区别,以下实施例将包含了沿着第一方向Y延伸排列的感测元件结构的基本单元以标号100表示,而包含沿着第二方向X延伸排列的感测元件结构的基本单元则以标号200表示,其中不再赘述感测元件结构基本单元100与第一实施例相同的部分。在本实施例中,感测元件结构基本单元100设置于第一基板112’的第一表面112a’上,而感测元件结构基本单元200的结构类似于感测元件结构基本单元100,设置于第一基板112’的第二表面112b’上,其中第一表面112a’与第二表面112b’平行相对设置。Please refer to FIG. 4 and FIG. 5, FIG. 4 is a schematic top view of a second embodiment of the sensing element structure including the touch panel of the present invention, and FIG. 5 is a schematic view of the sensing element structure of the touch panel shown in FIG. Schematic cross-section of 5-5'. If the sensing element structure 110 of the present invention shown in FIGS. 1 and 2 is taken as the basic unit of the sensing element structure, then in this embodiment, the sensing element structure 600 of the touch panel of the present invention may include The basic units of the sensor structure 110 are overlapped with each other in different directions to form sensing series respectively extending in the Y direction and the X direction. For ease of distinction, in the following embodiments, the basic unit including the sensing element structure extending along the first direction Y is denoted by reference numeral 100, while the basic unit including the sensing element structure extending along the second direction X is Denoted by reference numeral 200 , the same part of the sensing element structure basic unit 100 as that of the first embodiment will not be repeated here. In this embodiment, the sensing element structure basic unit 100 is disposed on the first surface 112a' of the first substrate 112', and the sensing element structure basic unit 200 is similar in structure to the sensing element structure basic unit 100 and is disposed on the first surface 112a' of the first substrate 112'. On the second surface 112b' of the first substrate 112', the first surface 112a' is parallel to and opposite to the second surface 112b'.

感测元件结构基本单元200包括多条沿着第二方向X延伸且彼此平行排列的第二感测串列228,其中第二方向X与第一方向Y相交,例如两者为互相垂直。图4以三条第二感测串列228a、228b、228c做为代表。各第二感测串列228包括多个第二感测单元214,彼此互相电连接且沿着第二方向X相邻并排成一直行。各第二感测单元214分别包括一第二浮凸结构216与第二导电材料218,其中第二浮凸结构216由浮凸材料层220所构成,而第二导电材料218设置于第二浮凸结构216的容置空间216a之内。各第二感测串列228另包括多个第二沟槽222,设置于同一第二感测串列228的相邻二第二感测单元214之间,以使第二浮凸结构216的容置空间216a相通。由图4与图5可知,第一感测单元114与第二感测单元214在垂直于第一基板112’的第一表面112a’的方向上互相错位而不重叠的,但第一沟槽122与第二沟槽222则是在垂直于第一表面112a’的方向部分重叠。The sensing element structure basic unit 200 includes a plurality of second sensing series 228 extending along a second direction X and arranged parallel to each other, wherein the second direction X intersects the first direction Y, for example, the two are perpendicular to each other. FIG. 4 is represented by three second sensing series 228a, 228b, 228c. Each second sensing series 228 includes a plurality of second sensing units 214 electrically connected to each other and adjacent along the second direction X and arranged in a straight line. Each second sensing unit 214 includes a second relief structure 216 and a second conductive material 218, wherein the second relief structure 216 is formed by a relief material layer 220, and the second conductive material 218 is disposed on the second relief structure. Inside the accommodating space 216a of the protruding structure 216 . Each second sensing series 228 further includes a plurality of second grooves 222 disposed between two adjacent second sensing units 214 of the same second sensing series 228 so that the second relief structure 216 The accommodating spaces 216a communicate with each other. It can be seen from FIG. 4 and FIG. 5 that the first sensing unit 114 and the second sensing unit 214 are misaligned in the direction perpendicular to the first surface 112a' of the first substrate 112' without overlapping each other, but the first groove 122 partially overlaps with the second trench 222 in a direction perpendicular to the first surface 112 a ′.

感测元件结构基本单元200另包括第二密封层224覆盖于第二浮凸结构216表面,以将第二导电材料218密封于容置空间216a与第二沟槽222中。再者,感测元件结构基本单元200另可包括多个第二导线结构230,分别设于各第二感测串列228的一端,与所对应的第二感测串列228的第二导电材料218相接触以电连接于该第二感测串列228。此外,第二感测串列228之间的凹穴226可以不填入任何材料,也可以填入透明非导电材料或第二导电材料218,或者在制作第二浮凸结构216时,使第二感测串列228之间不形成任何凹穴226。The sensing element structure basic unit 200 further includes a second sealing layer 224 covering the surface of the second relief structure 216 to seal the second conductive material 218 in the accommodating space 216 a and the second groove 222 . Furthermore, the sensing element structure basic unit 200 may further include a plurality of second wire structures 230, which are respectively provided at one end of each second sensing series 228, and are connected to the second conducting wires of the corresponding second sensing series 228. The material 218 contacts to be electrically connected to the second sensing series 228 . In addition, the cavities 226 between the second sensing series 228 may not be filled with any material, or may be filled with a transparent non-conductive material or the second conductive material 218, or when the second embossed structure 216 is fabricated, the first No cavity 226 is formed between the two sensing series 228 .

由于本实施例的感测元件结构600包含互相垂直相交的第一感测串列128与第二感测串列228以及对应的第一导线结构130与第二导线结构230,因此本发明感测元件结构600也可视为能提供完整触控功能的触控面板,其中,包含第一感测串列128与第二感测串列228的部分当作信号感测区610,而设置第一导线结构130与第二导线结构230的部分当作周边线路区612。通过Y与X方向的第一感测串列128与第二感测串列228可以计算出使用者的触控位置。在不同实施例中,第一感测串列128的两侧分别对应连接二条第一导线结构130,以及第二感测串列228的两侧也可分别对应连接二条第二导线结构230,例如图1所示,但不以此为限。由上述可知,本实施例感测元件结构600是利用在第一基板112的相反表面分别制作走向相垂直的感测元件结构基本单元100、200,以提供X方向与Y方向的感测功能。类似于前一实施例,感测元件结构600可利用卷对卷方式制作,例如先以图3的制作工艺流程在第一基板112’的第一表面112a’制作感测元件结构基本单元100,之后再以类似流程在第一基板112’的第二表面112b’制作感测元件结构基本单元200,然后再依需要切割第一基板112’成所需要的尺寸。Since the sensing element structure 600 of this embodiment includes the first sensing series 128 and the second sensing series 228 perpendicular to each other and the corresponding first wire structure 130 and the second wire structure 230 , the present invention senses The device structure 600 can also be regarded as a touch panel capable of providing a complete touch function, wherein the part including the first sensing series 128 and the second sensing series 228 is used as the signal sensing area 610, and the first sensing area 610 is set. Parts of the conducting wire structure 130 and the second conducting wire structure 230 are regarded as the peripheral circuit area 612 . The user's touch position can be calculated through the first sensing series 128 and the second sensing series 228 in the Y and X directions. In different embodiments, the two sides of the first sensing series 128 are respectively connected to two first wire structures 130, and the two sides of the second sensing series 228 may also be respectively connected to two second wire structures 230, for example As shown in Figure 1, but not limited thereto. It can be known from the above that the sensing element structure 600 of this embodiment utilizes the basic units 100 and 200 of the sensing element structure to be vertically fabricated on opposite surfaces of the first substrate 112 to provide sensing functions in the X direction and the Y direction. Similar to the previous embodiment, the sensing element structure 600 can be manufactured in a roll-to-roll manner. For example, the basic unit 100 of the sensing element structure is fabricated on the first surface 112a' of the first substrate 112' by the manufacturing process shown in FIG. 3 . Afterwards, the basic unit 200 of the sensing element structure is fabricated on the second surface 112b' of the first substrate 112' in a similar process, and then the first substrate 112' is cut into required dimensions as required.

请参考图6与图7A,图6为包含本发明触控面板的感测元件结构的第三实施例的俯视示意图,而图7A为图6所示触控面板的感测元件结构沿着切线7-7’的剖面示意图。本实施例感测元件结构700与前一实施例不同处在于感测元件结构基本单元100与感测元件结构基本单元200分别制作于不同的基板上,例如先将感测元件结构基本单元100制作于第一基板112的第一表面112a上,将感测元件结构基本单元200制作于第二基板212的第一表面212a上,然后再利用一粘着层136将第二基板212固定于第一基板112相反于第一表面112a的第二表面112b上,其中第一感测串列128与第二感测串列228分别沿着垂直相交的第一方向Y与第二方向X延伸排列,而粘着层136为透明材质可包含固态或液态光学胶(optical clear adhesive,OCA)等透明材料。由此,便完成了本发明第三实施例的感测元件结构700所构成的触控面板。Please refer to FIG. 6 and FIG. 7A, FIG. 6 is a schematic top view of a third embodiment of the structure of the sensing element including the touch panel of the present invention, and FIG. 7A is the structure of the sensing element of the touch panel shown in FIG. 6 along the tangent line 7-7' Schematic cross-section. The sensing element structure 700 of this embodiment differs from the previous embodiment in that the sensing element structure basic unit 100 and the sensing element structure basic unit 200 are respectively manufactured on different substrates, for example, the sensing element structure basic unit 100 is fabricated first. On the first surface 112a of the first substrate 112, the sensing element structure basic unit 200 is fabricated on the first surface 212a of the second substrate 212, and then the second substrate 212 is fixed on the first substrate by using an adhesive layer 136 112 is on the second surface 112b opposite to the first surface 112a, wherein the first sensing series 128 and the second sensing series 228 are extended and arranged along the vertically intersecting first direction Y and the second direction X respectively, and are adhered The layer 136 is a transparent material and may include transparent materials such as solid or liquid optical clear adhesive (OCA). Thus, the touch panel formed by the sensing element structure 700 of the third embodiment of the present invention is completed.

值得注意的是,虽然本实施例中的第二感测串列228设置于第二基板212相反于第一基板112的第一表面212a上,但感测元件结构基本单元100、第一基板112和粘着层136的相对位置以及感测元件结构基本单元200、第二基板212和粘着层136的相对位置并不限于第7图所示者,例如在固定感测元件结构基本单元100、200时,可以使感测元件结构基本单元200或100上下颠倒,例如使第二感测串列228位于第二基板212与粘着层136之间,或是使第一感测串列128位于第一基板112与粘着层136之间。请参考图7B、图7C以及图7D,图7B至图7D分别为图7A所示感测元件结构的第一变化实施例、第二变化实施例及第三变化实施例的结构示意图。如图7B所示,此第一变化实施例与图7A所示本发明第三实施例的不同处在于其感测元件结构基本单元200上下颠倒设置,亦即使第二感测串列228的第二浮凸结构216和第二导电材料218设置于第二基板212与粘着层136之间;图7C所示的第二变化实施例与图7A的差异在于感测元件结构基本单元100上下颠倒设置,亦即使第一浮凸结构116和第一导电材料118设置于第一基板112与粘着层136之间;而图7D所示的第三变化实施例与图7A的差异在于感测元件结构基本单元100和200皆为上下颠倒设置。It is worth noting that although the second sensing series 228 in this embodiment is disposed on the first surface 212 a of the second substrate 212 opposite to the first substrate 112 , the sensing element structure basic unit 100 , the first substrate 112 The relative positions of the adhesive layer 136 and the relative positions of the sensing element structural basic unit 200, the second substrate 212 and the adhesive layer 136 are not limited to those shown in FIG. 7, for example, when the sensing element structural basic units 100, 200 are fixed , the sensing element structure basic unit 200 or 100 can be turned upside down, for example, the second sensing series 228 is located between the second substrate 212 and the adhesive layer 136, or the first sensing series 128 is located on the first substrate 112 and the adhesive layer 136. Please refer to FIG. 7B , FIG. 7C and FIG. 7D . FIG. 7B to FIG. 7D are structural schematic diagrams of the first variation embodiment, the second variation embodiment and the third variation embodiment of the sensing element structure shown in FIG. 7A . As shown in FIG. 7B , the difference between this first variant embodiment and the third embodiment of the present invention shown in FIG. 7A is that the basic unit 200 of the sensing element structure is set upside down, that is, the first sensing element of the second sensing series 228 Two embossing structures 216 and a second conductive material 218 are arranged between the second substrate 212 and the adhesive layer 136; the difference between the second variant embodiment shown in FIG. 7C and FIG. 7A is that the basic unit 100 of the sensing element structure is set upside down. , that is, the first relief structure 116 and the first conductive material 118 are disposed between the first substrate 112 and the adhesive layer 136; and the difference between the third variant embodiment shown in FIG. 7D and FIG. 7A is that the structure of the sensing element is basically Both units 100 and 200 are arranged upside down.

请参考图8与图9,图8为包含本发明触控面板的感测元件结构的第四实施例的俯视示意图,图9为图8所示触控面板的感测元件结构沿着切线9-9’的剖面示意图。本实施例感测元件结构800与第三实施例的不同处在于用透明材质的保护层138取代图7A-图7D中的第二基板212与粘着层136。因此,其制作工艺可包括在将感测元件结构基本单元100制作于第一基板112’’的第一表面112a’’后,先于第一密封层124表面形成平坦的保护层138,完整覆盖感测元件结构基本单元100的表面与侧边,然后再将感测元件结构基本单元200以例如卷对卷方式制作在保护层138相反于感测元件结构基本单元100的表面上。因此,本实施例的第一感测串列128与第二感测串列228由下而上依序设置于第一基板112”的第一表面112a”之上。Please refer to FIG. 8 and FIG. 9, FIG. 8 is a schematic top view of a fourth embodiment of a sensing element structure including a touch panel of the present invention, and FIG. 9 is a schematic view of the sensing element structure of the touch panel shown in FIG. -Schematic cross-section of 9'. The difference between the sensing element structure 800 of this embodiment and the third embodiment is that the second substrate 212 and the adhesive layer 136 in FIGS. 7A-7D are replaced by a protective layer 138 made of a transparent material. Therefore, the fabrication process may include forming a flat protective layer 138 on the surface of the first sealing layer 124 after fabricating the basic unit 100 of the sensing element structure on the first surface 112a'' of the first substrate 112'' to completely cover the The surface and side of the sensing element structure basic unit 100 are then fabricated on the surface of the protective layer 138 opposite to the sensing element structure basic unit 100 in a roll-to-roll manner, for example. Therefore, the first sensing series 128 and the second sensing series 228 of this embodiment are sequentially disposed on the first surface 112a" of the first substrate 112" from bottom to top.

请参考图10与图11,图10为包含本发明触控面板的感测元件结构的第五实施例的俯视示意图,图11为图10所示触控面板的感测元件结构沿着切线11-11’的剖面示意图。本发明第五实施例的感测元件结构900的第一感测单元114、第一沟槽122及第二感测单元214皆直接制作于第一基板112’’’的第一表面112a’’’上,且第一感测单元114与第二感测单元214彼此错位并排呈矩阵排列。浮凸材料层120同时构成了第一浮凸结构116、第一沟槽122和第二浮凸结构216,因此第一感测串列128a、128b、128c具有类似于图1的结构,但相邻第二浮凸结构216之间没有设置第二沟槽,因此各第二感测单元214的第二导电材料218被密封在各第二浮凸结构216内。与前述实施例相较,本实施例的感测元件结构900另包括多个导电桥接元件240,分别设于同一第二感测串列228的任二相邻的第二感测单元214之间,导电桥接元件240通过第一密封层124的贯穿孔242而与第二感测单元214的第二导电材料118相接触,用来电连接相邻的第二感测单元214,以使同一第二感测串列228的第二感测单元214彼此相电连接。据此,各第二感测串列228由多个第二感测单元214与多个导电桥接元件240所构成,图10以三条第二感测串列228a、228b、228c示意。值得注意的是,虽然第二感测串列228与第一感测串列128交错设置于第一基板112’’’的第一表面112a’’’上,但由于导电桥接元件240跨设于第一沟槽122上方,因此不会与第一感测串列128相电连接。导电桥接元件240的制作方式举例为在形成第一密封层124之后,进行一激光穿孔或蚀刻制作工艺以在第一密封层124中形成多个贯穿孔242,然后进行一网版印刷制作工艺,于贯穿孔242与第一密封层124表面形成导电桥接元件240。此外,本实施例感测元件结构900另可包括保护层138设置于第一密封层124与导电桥接元件240表面,覆盖第二感测串列228与第一感测串列128,以提供保护。Please refer to FIG. 10 and FIG. 11 , FIG. 10 is a schematic top view of a fifth embodiment of the sensing element structure including the touch panel of the present invention, and FIG. 11 is the sensing element structure of the touch panel shown in FIG. 10 along the tangent 11 -11'Schematic cutaway. The first sensing unit 114, the first groove 122 and the second sensing unit 214 of the sensing element structure 900 of the fifth embodiment of the present invention are all directly fabricated on the first surface 112a" of the first substrate 112'". ′, and the first sensing unit 114 and the second sensing unit 214 are misaligned and arranged side by side in a matrix. The embossed material layer 120 constitutes the first embossed structure 116, the first groove 122 and the second embossed structure 216 at the same time, so the first sensing series 128a, 128b, 128c has a structure similar to that of FIG. There is no second groove disposed between adjacent second embossed structures 216 , so the second conductive material 218 of each second sensing unit 214 is sealed in each second embossed structure 216 . Compared with the previous embodiments, the sensing element structure 900 of this embodiment further includes a plurality of conductive bridge elements 240 respectively disposed between any two adjacent second sensing units 214 of the same second sensing series 228 , the conductive bridging element 240 is in contact with the second conductive material 118 of the second sensing unit 214 through the through hole 242 of the first sealing layer 124, and is used to electrically connect adjacent second sensing units 214, so that the same second The second sensing units 214 of the sensing series 228 are electrically connected to each other. Accordingly, each second sensing series 228 is composed of a plurality of second sensing units 214 and a plurality of conductive bridging elements 240 . FIG. 10 illustrates three second sensing series 228 a , 228 b , 228 c . It is worth noting that although the second sensing series 228 and the first sensing series 128 are arranged alternately on the first surface 112a''' of the first substrate 112''', since the conductive bridging element 240 straddles the Above the first trench 122 , therefore, it will not be electrically connected with the first sensing series 128 . The fabrication method of the conductive bridging element 240 is, for example, after forming the first sealing layer 124, performing a laser perforation or etching process to form a plurality of through holes 242 in the first sealing layer 124, and then performing a screen printing process, The conductive bridging element 240 is formed on the through hole 242 and the surface of the first sealing layer 124 . In addition, the sensing element structure 900 of this embodiment may further include a protective layer 138 disposed on the surface of the first sealing layer 124 and the conductive bridge element 240, covering the second sensing series 228 and the first sensing series 128 to provide protection. .

值得注意的是,本发明各浮凸结构并不限于前述实施例所公开的菱形形状,为了增加侧向电容的敏感度以提高触控面板效能,可以增加各感测单元的侧向投射面积,例如使各感测单元的图形复杂化以增加其周长,进而增加侧向电容的投射面积。请参考图12,图12显示了感测单元图形的变化实施例的示意图。与图1相较,图12所示变化实施例的各第一浮凸结构116具有类似雪花的图形,因形状弯曲而大幅增加了第一感测单元114的侧向投射面积。It should be noted that the embossed structures of the present invention are not limited to the diamond shape disclosed in the foregoing embodiments. In order to increase the sensitivity of the lateral capacitance and improve the performance of the touch panel, the lateral projected area of each sensing unit can be increased. For example, the pattern of each sensing unit is complicated to increase its perimeter, thereby increasing the projected area of the lateral capacitance. Please refer to FIG. 12 , which shows a schematic diagram of a variation embodiment of the sensing unit pattern. Compared with FIG. 1 , each first relief structure 116 in the modified embodiment shown in FIG. 12 has a snowflake-like pattern, and the lateral projected area of the first sensing unit 114 is greatly increased due to the curved shape.

综上所述,本发明触控面板的感测元件结构中的感测串列主要使用包含如纳米银丝、纳米金属颗粒或纳米石墨材料等具透明特性的导电材料当作电性元件,并利用浮凸结构与密封层来定义出各感测串列的形状与位置。由于上述导电材料具有良好的穿透率与低色偏特性,也可以提供良好的电性效果,因此可以兼顾高穿透率、低面阻值与低色偏要求,且含有纳米银丝、纳米金属颗粒或纳米石墨材料等具透明特性的导电材料的成本也较传统金属氧化物材料更低廉,因此本发明可以降低触控面板的制作成本。再者,因为浮凸结构的设计可应用于软性显示面板中,因此本发明结构也可以应用于软性触控面板中,有效避免现有因氧化铟锡脆性高而造成脆裂的问题。此外,本发明结构可利用卷对卷方式制作,可以依需要设计调整浮凸结构的形状与密度,且能大量连续生产感测串列,避免使用传统结构中的黄光制作工艺,因而能够有效提生产能和降低成本。另一方面,周边线路区的导线结构也可以网版印刷制作工艺制作,其具有高弹性调整及客制能力,例如可以在各感测串列的两侧或一侧分别设置导线结构,同样为本发明的优势之一。To sum up, the sensing series in the sensing element structure of the touch panel of the present invention mainly uses transparent conductive materials such as nano-silver wires, nano-metal particles, or nano-graphite materials as electrical elements, and The shape and position of each sensing series are defined by using the embossed structure and the sealing layer. Since the above-mentioned conductive materials have good transmittance and low color shift characteristics, they can also provide good electrical effects, so they can take into account the requirements of high transmittance, low surface resistance and low color shift, and contain nano silver wire, nano The cost of transparent conductive materials such as metal particles or nano-graphite materials is also lower than that of traditional metal oxide materials, so the present invention can reduce the production cost of the touch panel. Moreover, because the design of the embossed structure can be applied to flexible display panels, the structure of the present invention can also be applied to flexible touch panels, effectively avoiding the existing problem of brittle cracks caused by the high brittleness of ITO. In addition, the structure of the present invention can be produced in a roll-to-roll manner, and the shape and density of the embossed structure can be designed and adjusted according to the needs, and the sensing series can be produced continuously in large quantities, avoiding the use of the yellow light manufacturing process in the traditional structure, so that it can effectively Increase productivity and reduce costs. On the other hand, the wire structure in the peripheral circuit area can also be made by screen printing, which has high flexibility adjustment and customization capabilities. One of the advantages of the present invention.

以上所述仅为本发明的较佳实施例,凡依本发明权利要求所做的均等变化与修饰,皆应属本发明的涵盖范围。The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the present invention.

Claims (20)

1. the sensing element structure of a contact panel, this sensing element structure comprises many first sensing serials, is arranged at a first surface of one first substrate respectively along a first direction, respectively this first sensing serials comprises:
A plurality of first sensing cells are side by side adjacent along this first direction, and wherein respectively this first sensing cell comprises respectively:
First relief (embossment) structure has an accommodation space; And
First conductive material is placed in this accommodation space of this first swelling structure: and
A plurality of first grooves, be arranged at respectively between wantonly two adjacent these a plurality of first sensing cells of same this first sensing serials, so that these a plurality of accommodation spaces of wantonly two adjacent these a plurality of first swelling structures communicate by this first groove respectively, and this first conductive material more is arranged in these a plurality of first grooves, so that these a plurality of first sensing cells are electrically connected mutually.
2. sensing element structure as claimed in claim 1, other comprises one first sealant, is covered in the surface of these a plurality of first swelling structures.
3. sensing element structure as claimed in claim 1, wherein this first conductive material comprises nanometer filamentary silver (silver nanowire), nano-metal particle (nano metal particles) or nano-graphite material.
4. sensing element structure as claimed in claim 1, it comprises a plurality of first conductor structures in addition, lays respectively at a respectively end of this first sensing serials, contacts to be electrically connected this first sensing serials with this first conductive material of this first sensing serials.
5. sensing element structure as claimed in claim 1 also comprises:
Many second sensing serials are arranged at a side of this first substrate along a second direction, wherein this second direction and this first direction intersect, respectively this second sensing serials comprises a plurality of second sensing cells of mutual electrical connection, side by side adjacent along this second direction, wherein respectively this second sensing cell comprises respectively:
Second swelling structure has an accommodation space; And
Second conductive material is placed in this accommodation space of this second swelling structure; And
A plurality of second conductor structures lay respectively at a respectively end of this second sensing serials, contact to be electrically connected this second sensing serials with this second conductive material in this second sensing serials.
6. sensing element structure as claimed in claim 5, wherein respectively this second sensing serials comprises a plurality of second grooves in addition, be located between wantonly two adjacent these a plurality of second swelling structures of same this second sensing serials, so that a plurality of accommodation spaces of this of these a plurality of second swelling structures communicate, and be equipped with this second conductive material in addition in these a plurality of second grooves.
7. sensing element structure as claimed in claim 6, wherein these a plurality of second sensing serials are arranged at a second surface of this first substrate, and wherein this second surface of this first substrate and this first surface are oppositely arranged.
8. sensing element structure as claimed in claim 6 also comprises:
Second substrate is arranged at this first substrate in contrast to a second surface of this first surface, and these a plurality of second sensing serials are arranged on this second substrate; And
Adhesive coating is arranged between this first substrate and this second substrate.
9. sensing element structure as claimed in claim 6, wherein these a plurality of first sensing serials from bottom to top are arranged on this first surface of this first substrate in regular turn with these a plurality of second sensing serials.
10. sensing element structure as claimed in claim 9, other comprises that a protective seam is arranged on these a plurality of first sensing serials, and these a plurality of second sensing serials are arranged on the surface of this protective seam.
11. sensing element structure as claimed in claim 5, also comprise a plurality of conductive bridge elements, be located between wantonly two adjacent these a plurality of second sensing cells of same this second sensing serials, be used for being electrically connected these adjacent a plurality of second sensing cells, so that a plurality of second sensing cells of this of same this second sensing serials are electrically connected to each other, wherein respectively this conductive bridge element is not connected with these a plurality of first sensing serials.
12. sensing element structure as claimed in claim 11, wherein these a plurality of second sensing serials are crisscross arranged on this first surface of this first substrate with these a plurality of first sensing serials.
13. sensing element structure as claimed in claim 12 also comprises a protective seam, is covered on these a plurality of second sensing serials and these a plurality of first sensing serials.
14. sensing element structure as claimed in claim 5 also comprises one second sealant, is covered in the surface of these a plurality of second sensing serials.
15. the method for making of the sensing element structure of a contact panel comprises:
One first substrate is provided, has a first surface;
Form a plurality of first swelling structures and a plurality of first groove in this first surface, wherein these a plurality of first swelling structures are arrayed and have an accommodation space respectively, and respectively this first groove is arranged at along between these a plurality of first swelling structures of the adjacent arrangement of a first direction, to be communicated with these a plurality of first swelling structures;
In these a plurality of accommodation spaces of this a plurality of first swelling structures and these a plurality of first grooves, insert one first conductive material; And
Form a sealant in this a plurality of first swelling structures surface, this first conductive material is sealed in these a plurality of accommodation spaces and these a plurality of first grooves.
16. the method for making of sensing element structure as claimed in claim 15, the step that wherein forms these a plurality of first swelling structures, inserts this first conductive material and seal this first conductive material utilizes a volume to volume (roll-to-roll) manufacture craft to finish.
17. the method for making of sensing element structure as claimed in claim 15 also is included in and forms a plurality of first conductor structures on this first surface of this first substrate, to be electrically connected wherein this first conductive material in of these a plurality of first swelling structures respectively.
18. comprising, the method for making of sensing element structure as claimed in claim 17, the mode that wherein forms these a plurality of first conductor structures carry out a screen painting manufacture craft.
19. the method for making of sensing element structure as claimed in claim 15, wherein this first conductive material comprises nanometer filamentary silver, nano-metal particle or nano-graphite material.
20. the method for making of sensing element structure as claimed in claim 15 also comprises:
Form a plurality of second swelling structures in this first surface, wherein these a plurality of second swelling structures are arrayed and have an accommodation space respectively;
These a plurality of accommodation spaces in these a plurality of second swelling structures are inserted one second conductive material;
Form a plurality of through holes in the sealing layer; And
Carry out a screen painting manufacture craft, on the sealing layer, to form a plurality of bridging elements, wherein each bridging element is arranged at along between these a plurality of second swelling structures of the adjacent arrangement of a second direction, and be electrically connected with this second conductive material in these a plurality of second swelling structures by these a plurality of through holes respectively, wherein this second direction and this first direction intersect.
CN201310176318.0A 2013-03-21 2013-05-14 sensing element structure of touch panel and manufacturing method thereof Expired - Fee Related CN103246401B (en)

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