CN103152974A - Electronic circuit board using metal circuit sheet and electronic packaging module thereof - Google Patents

Abstract

The present invention discloses an electronic circuit board using metal circuit sheets and an electronic packaging module thereof, which comprises a plurality of metal circuit sheets with geometric shapes; an electrically insulating packaging body, which covers the metal circuit sheets to form an electronic circuit board and isolates the metal circuit sheets to avoid contact with each other to conduct current, and the packaging body has a plurality of openings to expose the metal circuit sheets on a plane; and a plurality of electronic components are arranged on the openings to form an electrical connection with the metal circuit sheets, and the electronic components are connected to each other through the metal circuit sheets to form a circuit.

Description

An electronic circuit board using a metal circuit sheet and an electronic packaging module thereof

technical field

The invention relates to an electronic circuit board, in particular to an electronic circuit board using a metal circuit sheet and an electronic packaging module thereof.

Background technique

Printed Circuit Board (Printed Circuit Board referred to as PCB) is designed according to the circuit, the electrical wiring connecting the circuit parts is drawn into a wiring pattern, and then the electrical conductor is reproduced on the insulator by the mechanical processing and surface treatment specified by the design. In other words, the printed circuit board is the substrate before matching the electronic parts. Its function is to use the electronic circuit formed by the electronic parts with the circuit board to play the functions of the electronic components to achieve signal processing. Purpose.

The main function of the PCB is to provide the mutual current connection of various parts. The base of the board itself is made of a material that is insulated from heat and cannot be bent. The small circuit material that can be seen on the surface is copper foil. Originally, the copper foil covered the entire board, but part of it was etched away during the manufacturing process, and the remaining part became a network of small circuits. . These lines are called wires or wiring, and are used to provide electrical connections to parts on the PCB.

PCB substrate materials include aluminum substrates, iron substrates, etc. Circuits are formed on the substrates, and most of them are used in automobiles. However, when the car is running, the temperature of the engine compartment will be kept at a high temperature for a long time. As a result, the printed circuit board will be damaged due to the high temperature generated by the passive components soldered on it, especially in the When it is loaded with high current for a long time, it is easy to melt at high temperature and damage other equipment around it.

Contents of the invention

In view of the above-mentioned existing problems, the object of the present invention is to provide an electronic circuit board, which uses a metal circuit sheet to form a current path, and then wraps the metal circuit sheet with a package to form a flat metal circuit board, and finally solders the electronic circuit board. The components form a high temperature resistant electromechanical device for use in a transportation vehicle.

The main purpose of the present invention is to provide an electronic circuit board using metal circuit sheets, including several metal circuit sheets, the metal circuit sheets are metal sheets with geometric shapes, and each metal sheet provides electric charge flow; a package body, which is An electrical insulator, covering metal circuit sheets to form an electronic circuit board, and isolating the metal circuit sheets to prevent mutual contact with conduction current, the package body has several openings to expose the metal circuit sheets to the first plane; and several electronic components, the The opening arranged on the first plane is electrically connected with the metal circuit sheet, and the electronic components are connected to each other through the metal circuit sheet to form a circuit.

In a preferred embodiment, the circuit of the electronic circuit board is a network that can form a closed loop.

In a preferred embodiment, the metal circuit sheet of the above-mentioned electronic circuit board is conductive metal or conductive alloy.

In a preferred embodiment, the metal circuit sheet of the above-mentioned electronic circuit board has a power connection end extending out of the package body and exposing the metal part, which can be electrically connected to an external power source or a printed circuit board.

In a preferred embodiment, the electronic components of the electronic circuit board are passive components or driving components.

In a preferred embodiment, the package body of the above-mentioned electronic circuit board has several double openings so that the metal circuit sheet is exposed on the first plane and the second plane, and the electronic component contacts the metal circuit sheet with the double openings exposed on the first plane, The heat generated by the electronic components is dissipated through the double openings in the second plane.

Another object of the present invention is to provide an electronic assembly of an electronic circuit board, comprising: a digital circuit assembly formed by a printed circuit board, and having an analog-to-digital converter and a digital-to-analog converter; and a circuit board, Using a metal sheet as a conductive path, it is an analog circuit component and has a first plane and a second plane, including: several metal circuit sheets, the metal circuit sheet is a metal sheet with a geometric shape, and each metal sheet provides electric charge Circulation; a package, which is an electrical insulator, covers the metal circuit sheet to form a flat metal circuit board, and isolates the metal circuit sheet to avoid contact with each other to conduct current. The package body has several openings to expose the metal circuit sheet to the the first plane; and a plurality of electronic components arranged on the opening to form an electrical connection with the metal circuit sheet, and the electronic components are connected to each other through the metal circuit sheet to form a circuit.

In a preferred embodiment, the metal circuit sheet of the above-mentioned electronic structure is conductive metal or conductive alloy.

In a preferred embodiment, the metal circuit sheet of the above-mentioned electronic package has a power connection terminal extending out of the package body and exposing the metal part, which can be electrically connected to an external power supply.

In a preferred embodiment, the electronic components of the above-mentioned electronic assembly are passive components or driving components.

In a preferred embodiment, the package of the above-mentioned electronic structure has several double openings so that the metal circuit sheets are exposed on the first plane and the second plane, and the electronic components are in contact with the metal circuit sheets with the double openings exposed on the first plane, The heat generated by the drive assembly is dissipated from the other side of the double opening.

Another object of the present invention is to provide an electronic package module of a metal circuit sheet, including: several metal circuit sheets, each metal circuit sheet has a geometric shape and provides electric charge flow, and several electronic components are arranged on the metal circuit sheet to form an electrical circuit. Sexual connection, the electronic components are connected to each other through metal circuit sheets to form an analog circuit component; a printed circuit board is a digital circuit component, and has an analog-to-digital converter and a digital-to-analog converter; and a package, which is a The electrical insulator covers and isolates the metal circuit sheet and the printed circuit board to avoid contact with each other and conduct current. The package body has several openings to expose the metal circuit sheet outside the package body.

In a preferred embodiment, the metal circuit sheet of the electronic packaging module is made of conductive metal or conductive alloy.

In a preferred embodiment, the metal sheet of the above-mentioned electronic packaging module has a power connection end extending out of the packaging body and exposing the metal part, which can be electrically connected to an external power supply.

In a preferred embodiment, the electronic components of the electronic packaging module are passive components or drive components.

In a preferred embodiment, the electronic components of the above-mentioned electronic packaging module are in contact with the metal circuit sheet in the packaging body, so that the heat generated by the electronic components can be dissipated through the opening.

In a preferred embodiment, the metal circuit sheets of the electronic packaging module are arranged in a stacked layer in the packaging body, which is on a different layer from the printed circuit board.

In a preferred embodiment, the metal circuit sheets of the above-mentioned electronic packaging module are in the same layer, and the electronic components are arranged on the layer to form analog circuit components.

Compared with the existing electronic devices composed of printed circuit boards, the metal circuit sheet of the present invention can reduce channel resistance, reduce copper loss, and increase current resistance, which is very suitable for application in high-current electromechanical devices. In addition, the present invention separates the power board (copper substrate) and the control board, that is, separates the high current circuit from the low current circuit, so as to prevent the noise of the power board (high current) from affecting the signal output of the control board (small current) and prevent current interference.

The invention arranges the passive components on the metal circuit sheet to increase the heat dissipation area, reduce the heat accumulation of the passive components, increase the heat dissipation speed, prolong the service life of the passive components, and improve the reliability of the whole module. In addition, the present invention replaces the PCB circuit board with a copper substrate circuit, and the material can be recycled and reused to meet environmental protection requirements.

Description of drawings

Fig. 1 is a structural schematic diagram of a metal circuit sheet in a preferred embodiment of the present invention.

Fig. 2 is a schematic diagram of the package structure of a preferred embodiment of the present invention.

Fig. 3 is a perspective view of the back structure of an electronic circuit board according to a preferred embodiment of the present invention.

Fig. 4 is a schematic diagram of the inner surface of the electronic circuit board and the structure of the electronic components in a preferred embodiment of the present invention.

FIG. 5 is a schematic diagram of the electronic structure of an electronic circuit board according to a preferred embodiment of the present invention.

Fig. 6 is a schematic diagram of the electronic assembly manufacturing steps of the electronic circuit board according to a preferred embodiment of the present invention.

FIG. 7 is a schematic diagram of the structure of an electronic package module of a metal circuit sheet according to a preferred embodiment of the present invention.

【Symbol Description】

10, 21 Metal circuit pieces

12, 22 single opening

13, 23 double opening

15, 25, 53 packages

20, 51 metal circuit board

24 power connector

26, 27, 28 electronic components

30 electronic circuit board

40, 52 printed circuit boards

S01~S07 production steps.

Detailed ways

The present invention will be further described below in combination with illustrations and specific operation examples.

Please refer to FIG. 1 , which shows the metal circuit sheet 10 used in the electronic circuit board of the present invention. There are various metal sheets with different geometric shapes, which together constitute the conduction path of charges. FIG. 2 shows the package body 15 used in the electronic circuit board of the present invention, which has two openings of different sizes: a single opening 12 and a double opening 13 .

3 and 4 show an embodiment of the electronic circuit board of the present invention, FIG. 3 is a perspective view of the back structure of the electronic circuit board, and FIG. 4 is a schematic diagram of the inner surface of the electronic circuit board and the structure of the electronic components. In this embodiment, metal sheets are used to form a current path, including several metal circuit sheets 21 , a package body 25 and several electronic components 26 , 27 , 28 . In this specific embodiment, the metal circuit sheet 21 is a metal sheet with a planar geometric shape, and each metal sheet can allow electric charges to flow. The metal circuit sheet 21 is not a common traditional printed circuit, but a conductive metal sheet or conductive alloy sheet with a wide width, so the "sheet" is used to distinguish the general "line" circuit. The metal circuit sheet 21 of the present invention cannot be produced by the existing method of manufacturing printed circuit boards, and must be formed one by one in a single production method, and then combined into an electronic circuit, which can reduce channel resistance, reduce copper loss, and improve electrical resistance. Flow, very suitable for electromechanical devices used in high current.

In addition, an insulating electrical package 25 completely covers the metal circuit sheet 21 to form a flat metal circuit board 20. The package body 25 isolates the metal circuit sheets 21 to prevent mutual contact with conduction current, and makes all the metal circuit sheets 21 formed The circuit is fixed in the metal circuit board 20, so that some electronic components 26, 27, 28 can be regularly arranged on the surface of the metal circuit board 20. Therefore, some single openings 22 are provided on the surface of the package body 25 to expose the metal circuit sheets 21 on the plane, and the electronic components 26, 27, 28 can be welded together with the metal circuit sheets 21 at the single openings 22 to form a closed circuit. network. The metal circuit board 21 is designed according to various requirements and has various geometric shapes. When combined into an electronic circuit board 20 in this way, the electronic circuit board 20 will appear in a circular or polygonal shape.

Furthermore, the package body 25 also has some double openings 23 so that a part of the metal circuit sheet 21 is exposed on the inner surface and the back surface of the package body 25. The opening area of the double openings 23 is larger than that of the single opening 22, so that the electronic components 26, 27 , 28 are in contact with the metal circuit sheet 21 exposed at the double opening 23, so that the heat generated by it is dissipated from the other side (back side) of the double opening 23, so the present invention can increase the heat dissipation area and reduce the electronic components 26, 27, 28 heat accumulation, improve heat dissipation speed. The electronic components 26, 27, 28 should include various passive components and drive components.

In one embodiment, the network that forms a closed loop must receive external power before it can operate, so some metal circuit chips have a power connection terminal 24, which is extended from the metal circuit chip 21 to the outside of the package body 25 and exposes the metal. formed, and can be electrically connected to an external power source or a printed circuit board (not shown in the figure). In one embodiment, the metal circuit sheet 21 can be directly bent to form the power connection end 24 , which facilitates assembly and simplifies the manufacturing process.

According to the above, the metal circuit sheet 21 is used as a power circuit (bare copper circuit), and its periphery is molded by encapsulation 25 (plastic), which can fix the power circuit and prevent the metal circuit sheets 21 from contacting each other to cause a short circuit. In one embodiment, the bare copper circuit can be made into a unified appearance for different institutions, and the quality control and inspection process is unified, which reduces inspection misjudgments and reduces the defective rate.

Please refer to FIG. 5 which shows an embodiment of the electronic assembly of the electronic circuit board of the present invention, especially the electromechanical device used in the transportation vehicle. As a digital circuit component, a printed circuit board 40 has at least one analog-to-digital converter and at least one digital-to-analog converter (not shown). The printed circuit board 40 also has several control components and several calculation components. Driven by a frequency, the control components control the execution and calculation of the calculation components.

In addition, an electronic circuit board 30 uses several metal circuit sheets as charge conduction paths, and these metal circuit sheets are conductive metal sheets or conductive alloy sheets with a planar geometric shape. There is also an insulator electrical package, covering these metal circuit pieces to form a flat metal circuit board, and isolating the metal circuit pieces to avoid contact with each other to conduct current. The package body has several openings to expose part of the metal circuit pieces on the plane. Then some electronic components are arranged on the opening to form electrical connection with the metal circuit sheet. The electronic components should be passive components or driving components, and these components are connected to each other through metal circuit sheets to form a circuit, so that the electronic circuit board 30 becomes an analog circuit component.

According to the above, the printed circuit board 40 is fixed on one surface of the metal circuit board 30, and is electrically connected with the metal circuit board 30 through several conductive posts (not shown in the figure). The digital converter and the digital-to-analog converter connect the digital circuit components and the analog circuit components to each other to form a mixed-signal circuit. The metal circuit board 30 is soldered to the printed circuit board 40 via conductive posts and fixed on the inner surface of the metal circuit board 30 . The fixed combination of the printed circuit board 40 and the metal circuit board 30 can also be implemented by conventional slots or clips, and such a fixing method has no conductive function.

Furthermore, a power connection end of the metal circuit sheet extends out of the package body and exposes the metal part, which can be electrically connected to an external power supply. The package body has several double openings so that the metal circuit sheets are exposed on the plane, and the electronic components contact the metal circuit sheets with the double openings exposed on the plane, so that the heat generated by these electronic components is dissipated from the other side of the double openings.

Please refer to FIG. 6 for the manufacturing process of the electronic structure of the present invention. The metal circuit sheet adopts a copper substrate, and finally forms a circuit and controller module. The manufacturing process includes:

Step S01, degreasing and derusting treatment on the surface of the copper plate;

Step S02, electroplating the surface of the copper plate, using tin plating;

Step S03, stamping and forming to form a bare copper circuit assembly;

Step S04, circuit arrangement and combination, bare copper circuit substrate;

Step S05, the package is injected and coated, and the plastic is used as the package to inject and cover the bare copper circuit substrate to form a copper substrate circuit module;

Step S06, soldering the electronic component to become an analog circuit component; and

Step S07, the copper substrate circuit (analog circuit component) is combined with the control board circuit (digital circuit component) to form a controller module.

According to the above, the electronic assembly of the electronic circuit board of the present invention has no problem of discharging heavy pollutants compared with the traditional PCB manufacturing process of photo-exposure, etching, and potion washing. In one embodiment, the copper substrate circuit is used to replace the PCB circuit board, and the materials (copper sheet and plastic) can be recycled and reused to meet environmental protection requirements.

Please refer to FIG. 7 which shows an embodiment of the electronic packaging module of the metal circuit sheet of the present invention. Several metal circuit sheets form a metal circuit board 51. Each metal circuit sheet is a conductive metal or a conductive alloy to allow electric charges to flow. The metal circuit board 51 includes several passive components or driving components arranged on the metal circuit sheet to form an electrical connection, and these metal circuit sheets are connected to each other to form an analog circuit component. A printed circuit board 52 of a digital circuit assembly has at least one analog-to-digital converter and at least one digital-to-analog converter. A package 53 is used as an electrical insulator to cover and isolate the metal circuit board 51 and the printed circuit board 52 to avoid contact with each other and conduct current.

According to the above, the printed circuit board 52 is fixed on one surface of the metal circuit board 51, and passes through the interior of the package 53 through several conductive posts to electrically connect with the metal circuit sheet or electronic components. The conductive posts pass through the analog-digital converter, digital The analog converter interconnects the digital circuit components and the analog circuit components to form a mixed signal circuit.

The package also has several openings to expose the metal circuit sheet outside the package body 53 (not shown in the figure), and the electronic component contacts the metal circuit chip with openings in the package body 53, so that the heat generated by the electronic component passes through the metal circuit sheet. The exposed face spread out. the

In one embodiment, the metal circuit sheet has a power connection terminal extending out of the package body and exposing the metal part, which can be electrically connected to an external power supply, thus forming a complete electronic device. In this embodiment, the digital circuit components and the analog circuit components are packaged into a module. The printed circuit board 52 and the metal circuit board 51 are isolated on different layers. The stacked arrangement, which is on a different layer from the printed circuit board 52, separates the analog GND signal from the digital GND signal, reduces noise interference between the two circuits, and improves the accuracy of the action.

According to the above, the present invention separates the metal circuit board 51 (power board-copper substrate) and the printed circuit board 52 (control board), that is, the high current circuit is separated from the small current circuit, so as to avoid the influence of high current noise on the printed circuit board 52 (low current circuit board). ) signal output to prevent current interference.

Furthermore, the metal circuit board 51 replaces the PCB circuit board with the copper substrate as the circuit board, and the metal copper foil (thickness is 0.03mm) on the PCB circuit board is changed to the copper sheet circuit (thickness is 1mm) of this embodiment, which can increase the current flow The area is not easy to accumulate heat, and the heat dissipation area is increased, so it can withstand high temperature operation, and the power board (copper substrate) and the control board are separated to increase the voltage value that the electronic packaging module can withstand.

In another specific embodiment, the metal circuit sheets are designed according to various requirements, and have various geometric shapes. When combined into an electronic circuit board, the appearance of the electronic circuit board will appear in a circular or polygonal shape. Therefore, the printed circuit board will also match the shape of the electronic circuit board, so that the packaging mold structure is complete, the specifications are consistent, and the convenience of inventory management is improved.

To sum up, the present invention uses the metal circuit sheet as the conduction charge of the electronic circuit board, and the metal sheet is enlarged to reduce channel resistance, reduce copper loss, and increase current resistance. Moreover, the passive components are arranged on the metal circuit sheet to increase the heat dissipation area, reduce the heat accumulation of the passive components, improve the heat dissipation speed, prolong the service life of the passive parts, and improve the reliability of the overall module.

The specific embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific embodiments described above, which are only examples. For those skilled in the art, any equivalent modifications and substitutions also fall within the scope of the present invention. Therefore, equivalent changes and modifications made without departing from the spirit and scope of the present invention shall fall within the scope of the present invention.

Claims (18)

1. An electronic circuit board using a metal circuit sheet, having a first plane and a second plane, comprising: A plurality of metal circuit sheets, the metal circuit sheets are metal sheets with geometric shapes, each of which provides electric charge flow; A package, which is an electrical insulator, wraps the metal circuit sheets to form an electronic circuit board, and isolates the metal circuit sheets to prevent mutual contact with conduction current. The package body has a plurality of openings to make the metal circuit sheets exposed on the first plane; and A plurality of electronic components are arranged on the openings of the first plane to form an electrical connection with the metal circuit sheets, and the electronic components are connected to each other through the metal circuit sheets to form a circuit. 2. The electronic circuit board using a metal circuit sheet as claimed in claim 1, wherein the circuit is a network capable of forming a closed loop. 3. The electronic circuit board using metal circuit sheets as claimed in claim 1, wherein the metal circuit sheets are conductive metals or conductive alloys. 4. The electronic circuit board using metal circuit sheets as claimed in claim 1, wherein, the metal circuit sheets have a power connection end extending out of the package body and exposing the metal part, which can be electrically connected to an external power supply or a printed circuit board. circuit board. 5. The electronic circuit board using metal circuit sheets as claimed in claim 1, wherein the electronic components are passive components or driving components. 6. The electronic circuit board using metal circuit sheets as claimed in claim 1 or 5, wherein the package body has a plurality of double openings so that the metal circuit sheets are exposed on the first plane and the second plane, and the The electronic components are in contact with the metal circuit sheets with the double openings exposed on the first plane, so that the heat generated by the electronic components is dissipated through the double openings on the second plane. 7. An electronic assembly of an electronic circuit board, used as an electromechanical device for a transport vehicle, including: at least one digital circuit assembly formed from a printed circuit board and having at least one analog-to-digital converter and at least one digital-to-analog converter; and A circuit board, which uses a metal sheet as a conductive path, is an analog circuit component and has a first plane and a second plane, including: A plurality of metal circuit sheets, the metal circuit sheets are metal sheets with geometric shapes, each of which provides electric charge flow; A package, which is an electrical insulator, wraps the metal circuit sheets to form a flat metal circuit board, and isolates the metal circuit sheets to avoid contact with each other to conduct current. The package has a plurality of openings so that the the metal wiring sheet is exposed on the first plane; and A plurality of electronic components are arranged on the openings to form electrical connections with the metal circuit sheets, and the electronic components are connected to each other through the metal circuit sheets to form a circuit; Wherein, the printed circuit board is fixed on one surface of the metal circuit board, and is electrically connected with the metal circuit sheets through a plurality of conductive columns, and the conductive columns pass through the analog-to-digital converter and the digital-to-analog converter, The digital circuit component and the analog circuit component are interconnected to form a mixed signal circuit. 8. The electronic assembly of an electronic circuit board as claimed in claim 7, wherein the metal circuit sheets are conductive metals or conductive alloys. 9 . The electronic assembly of an electronic circuit board as claimed in claim 7 , wherein the metal circuit sheets have a power connection terminal extending out of the package body and exposing a metal part, which can be electrically connected to an external power supply. 10 . 10. The electronic assembly of an electronic circuit board as claimed in claim 7, wherein the electronic components are passive components or driving components. 11. The electronic assembly of an electronic circuit board as claimed in claim 7 or 10, wherein the package has a plurality of double openings so that the metal circuit sheets are exposed on the first plane and the second plane, and the electronic The components contact the metal circuit sheets with the double openings exposed on the first plane, so that the heat generated by the driving components is dissipated from the other side of the double openings. 12. An electronic packaging module of a metal circuit sheet, used for electromechanical devices of transportation vehicles, including: A plurality of metal circuit sheets, each of which has a geometric shape and provides electric charge flow, a plurality of electronic components are arranged on the metal circuit sheets to form electrical connections, and the electronic components are connected to each other through the metal circuit sheets to form a Analog circuit components; at least one printed circuit board being a digital circuit assembly having at least one analog-to-digital converter and at least one digital-to-analog converter; and A package body, which is an electrical insulator, covers and isolates the metal circuit sheets and the printed circuit board to prevent mutual contact with conduction current, and the package body has a plurality of openings to expose the metal circuit sheets outside the package body; Wherein, the printed circuit board is electrically connected to the metal circuit sheets or electronic components through a plurality of conductive posts through the inside of the package, and the conductive posts pass through the analog-to-digital converter and the digital-to-analog converter to make the The digital circuit component and the analog circuit component are interconnected to form a mixed signal circuit. 13. The electronic packaging module of metal circuit sheets as claimed in claim 12, wherein the metal circuit sheets are conductive metals or conductive alloys. 14 . The electronic packaging module of metal circuit sheets as claimed in claim 12 , wherein the metal sheets have a power connection end extending out of the package body and exposing the metal part, which can be electrically connected to an external power supply. 15 . 15. The electronic packaging module of metal circuit sheets as claimed in claim 12, wherein the electronic components are passive components or driving components. 16 . The electronic packaging module of metal circuit chips as claimed in claim 12 , wherein the electronic components contact the metal circuit chips in the package, so that the heat generated by the electronic components can be dissipated through the openings. 17 . The electronic packaging module of metal wiring chips as claimed in claim 12 , wherein the metal wiring chips are stacked in a layer in the package body, and are on a different layer from the printed circuit board. 18 . 18. The electronic packaging module of metal wiring sheets according to claim 12 or 17, wherein the metal wiring sheets are in the same layer so that the electronic components are arranged on the layer to form the analog circuit component.

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