KR101251659B1 - Printed circuit board, pcb card using the printed circuit board, method for manufacturing the printed circuit board and the pcb card - Google Patents

Abstract

The present invention relates to a printed circuit board manufactured by a method of manufacturing a printed circuit board and a method of manufacturing a printed circuit board, the printed circuit board according to an embodiment of the present invention includes a printed circuit board base member; At least one contact portion formed to expose one surface of the printed circuit board base member; It may be configured to include a circuit pattern formed to be electrically connected to the contact portion and a portion on one surface of the printed circuit board base member.

Through this configuration, the present invention can reduce the thickness, reduce the cost and process cost of the product, and also simplify the manufacturing process, and requires a separate plating lead wire for the formation of a circuit pattern. Instead, the high density circuit pattern can be realized.

Memory chip, semiconductor, printed circuit board, circuit pattern, memory card

Description

PCB card using printed circuit board and printed circuit board, and manufacturing method of printed circuit board and manufacturing method of PCB card {PRINTED CIRCUIT BOARD

1 is a schematic cross-sectional view showing the internal structure of a PCB card manufactured using a printed circuit board according to an embodiment of the present invention.

2A is a diagram illustrating an example of mounting a semiconductor device on the printed circuit board of FIG. 1.

FIG. 2B is a diagram illustrating another example in which a semiconductor device is mounted on the printed circuit board of FIG. 1.

FIG. 2C is a diagram illustrating another example in which a semiconductor device is mounted on the printed circuit board of FIG. 1.

3 is a view showing a state in which the base member of the printed circuit board is laminated on the base member during the manufacturing process according to an embodiment of the present invention.

FIG. 4 is a view illustrating a state in which a mask is formed to form contact portion forming grooves in a manufacturing process subsequent to FIG. 3.

FIG. 5 is a view illustrating a state in which a contact portion forming groove is formed using a mask in a manufacturing process subsequent to FIG. 4.

FIG. 6 is a view illustrating a state in which a mask is formed to form a contact part in a manufacturing process subsequent to FIG. 5.

FIG. 7 is a view illustrating a state in which a contact portion is formed using a mask in a manufacturing process subsequent to FIG. 6.

FIG. 8 is a view illustrating a state in which a mask for forming a contact portion is removed in a manufacturing process subsequent to FIG. 7.

FIG. 9 is a view illustrating a state in which a mask is formed to form a circuit pattern in a manufacturing process subsequent to FIG. 8.

FIG. 10 is a view illustrating a state in which a circuit pattern base member is formed using a mask in a manufacturing process subsequent to FIG. 9.

FIG. 11 is a view illustrating a state in which a circuit pattern first member and a second member are formed on a circuit pattern base member by using a mask in a manufacturing process subsequent to FIG. 10.

FIG. 12 is a view illustrating a state in which a mask for forming a circuit pattern is removed in a manufacturing process subsequent to FIG. 11.

FIG. 13 is a view illustrating a structure of a printed circuit board manufactured by removing a conduction member constituting a printed circuit board base member in order to form an insulation state between circuit patterns in a continuation of FIG. 12.

FIG. 14 is a view illustrating a state in which a semiconductor device is mounted and connected to a circuit pattern for electric current by mounting a semiconductor device in a manufacturing process subsequent to FIG. 13 for manufacturing a PCB card using a printed circuit board manufactured according to an embodiment of the present invention. It is a figure which shows.

FIG. 15 is a view illustrating a state in which a semiconductor device and a circuit pattern are packaged (molding) so that the semiconductor device and the circuit pattern are not exposed to the outside in the manufacturing process subsequent to FIG. 14.

16 is a view showing a state in which a plurality of PCB cards are configured on a printed circuit board by a manufacturing method according to an embodiment of the present invention.

FIG. 17 is a view showing a state before being cut into individual units of a PCB card by removing the base member shown in FIG.

* Description of the main parts of the drawings *

100 ... printed circuit board 110 ... base member

120 ... printed circuit board base member 121 ... insulation member

122 ... energizing member 123 ... contact forming groove

130 ... contact portion 131 ... first contact member

132 ... second contact member 140 ... circuit pattern

141 ... circuit pattern base member 142 ... second circuit pattern member

143 ... first circuit pattern member 210, 220, 230 ... mask

310 ... semiconductor element 311 ... connection line

400 ... sealing member 500 ... PCB card

The present invention relates to a printed circuit board, a PCB card using a printed circuit board, a method of manufacturing a printed circuit board and a method of manufacturing a PCB card.

A printed circuit board, generally called a printed circuit board (PCB), is a component that is configured to allow various devices to be mounted or to make an electrical connection between devices due to integrated wiring. BACKGROUND ART With the development of technology, printed circuit boards having various shapes and functions have been manufactured. Among these types of printed circuit boards, printed circuit boards such as RAM, main board, LAN card, etc. have been produced.

Such conventional printed circuit boards have a multi-layered structure or a plurality of layers, and are applied to various electronic products. However, recently, printed circuit boards have a disadvantage in that they are difficult to be configured for the miniaturization, thinness, and low cost of electronic products.

In other words, the conventional printed circuit board is a series of processes for mounting a semiconductor device by forming a circuit pattern is very complicated, because the product is produced through a number of processes, the productivity of the product is lowered, and the price of the product is also very disadvantageous in terms of the price .

In addition, the conventional printed circuit board is difficult to reduce the thickness of the printed circuit board because it has a configuration according to the existing process even in a product consisting of a simple circuit pattern such as a memory card, and thus the number of memory chips (semiconductor elements) mounted on the printed circuit board There was a limit to the memory card capacity was limited.

In addition, the raw materials constituting the conventional printed circuit board is difficult to replace with other materials in order to maintain various conditions according to the hardness and strength of the product and the manufacturing process, while the raw materials used in the past are mostly expensive These materials are the main factors that can not reduce the manufacturing cost. Therefore, there is a need for other low-cost materials that can satisfy the process conditions that can correspond to the existing process while maintaining durability, such as hardness and strength of the product.

The present invention is to solve the problems as described above is to reduce the thickness of the printed circuit board and the PCB card manufactured using the printed circuit board.

Another object of the present invention is to configure a printed circuit board and a PCB card manufactured by using the other low-cost materials to reduce the price and process cost of the product.

Yet another object of the present invention is to ensure that durability, such as hardness and strength, can be maintained at least equal to that of a conventional printed circuit board even when the printed circuit board is formed of other materials.

Another object of the present invention is to more simply configure the manufacturing process.

Another object of the present invention is to reduce the limit of the memory chip mounted on the printed circuit board.

The present invention solves the above problems, and provides a printed circuit board, a PC card using the printed circuit board, and a method of manufacturing a printed circuit board and a method of manufacturing a PCB card to achieve the objects according to the present invention.

Here, the PCB card (PCB Card) is defined as including all boards manufactured using a printed circuit board, such as a memory card, a sound card, a video card. Components of the embodiment of the PC card described below will be described based on the components constituting the memory card, but is not limited thereto.

A method of manufacturing a printed circuit board according to an embodiment of the present invention includes the steps of laminating a printed circuit board base member on a base; Forming at least one contact portion on one side of the printed circuit board base member in contact with the base; And forming a circuit pattern on one end of the printed circuit board base member connected to the contact portion. The manufacturing method may further include removing the base member on which the PCB base member is stacked.

In addition, a method of manufacturing a PCB card using a printed circuit board according to another embodiment of the present invention includes the steps of laminating a printed circuit base member on a base; Forming at least one contact portion on the printed circuit board base member; Forming a circuit pattern at one end of the printed circuit board base member connected to the contact portion; Mounting at least one semiconductor element to enable electrical current with the circuit pattern; Sealing the circuit pattern and the semiconductor device to be blocked from the outside; Removing the base.

In addition, a printed circuit board according to another embodiment of the present invention is a printed circuit board base member; At least one contact portion formed to expose one surface of the printed circuit board base member; It may be configured to include a circuit pattern formed on one surface of the printed circuit board base member to be electrically connected with the contact portion. Here, the printed circuit board may further include a base member at a lower position of the printed circuit board base member.

In addition, a PCB card using a printed circuit board according to another embodiment of the present invention is a printed circuit board base member formed so that at least one contact portion is exposed; A circuit pattern formed on the surface of the printed circuit board base member such that the contact portion and a portion thereof are electrically connected to each other; At least one semiconductor element mounted to be electrically connected to the circuit pattern; It may be configured to include a sealing member formed to block the circuit pattern and the semiconductor element from the outside.

Here, the printed circuit board base member may further include a base member at a lower position.

In addition, the printed circuit board base member may be formed of an insulating member and an energizing member. The conducting member may be used as a plating lead wire when the plating process is performed to form a circuit pattern. In addition, the printed circuit board base member may be formed of a thermosetting resin to be laminated on the base by a heat fusion method. The printed circuit board base member may be made of Resin Coated Copper (RCC).

The contact part may be configured of the first contact member and the second contact member, and the circuit pattern may be configured of the circuit pattern base member, the first circuit pattern member, and the second circuit pattern member.

Here, the first contact member may be formed of gold, and the second contact member may be formed of nickel. The circuit pattern base member may be formed of the same material as the conductive member of the printed circuit base member, the first circuit pattern member may be formed of gold, and the second circuit pattern member may be formed of nickel.

Such a contact portion may be formed by chemical vapor deposition or plating.

The semiconductor device may include a memory device and a device constituting the controller. The semiconductor device may be mounted so as to be grounded with the circuit pattern, or may be mounted in the insulating member region of the printed circuit board base member on which the circuit pattern is not formed. On the other hand, the semiconductor device may be mounted on the circuit pattern by an insulating member, or may be mounted on the circuit pattern to enable heat dissipation through the circuit pattern.

In order to help the understanding of the features of the present invention as described above through the embodiments of the present invention, the PCB and the PCB using the printed circuit board and the printed circuit board according to the present invention, the manufacturing method of the printed circuit board and the manufacture of the PCB card The method is explained.

It is to be understood that the present invention is not limited by the embodiments described below but that the present invention can be practiced as embodiments described below. In other words, the present invention is capable of various modifications within the scope of the present invention through the embodiments described below, and such modified embodiments are within the scope of the present invention.

In addition, the embodiments described below will be described based on embodiments best suited for understanding the technical characteristics of the present invention. In addition, in the embodiments described below, a process of manufacturing a circuit board composed of a plurality of layers is described based on a printed circuit board composed of one layer, which will be fully understood through the embodiments described below.

Referring to Figure 1, there is shown a cross-sectional view schematically showing the internal structure of a PCB card 500 manufactured using a printed circuit board 100 according to an embodiment of the present invention.

In the printed circuit board 100, an insulating member 121 is disposed at a bottom of the printed circuit board 100 to protect the circuit pattern 140 and to be blocked from the outside. The insulating member 121 is a component constituting the printed circuit board base member 120 as can be seen in the manufacturing method described below.

The conducting member 122 is disposed on the insulating member 121, the conducting member 122 is configured to be integrated with the circuit pattern by the manufacturing process described below. On the other hand, the conducting member 122 serves as a medium through which the circuit pattern 140 can be formed in the manufacturing process.

The printed circuit board base member 120 configured as described above may be applied to a material called so-called Resin Coated Copper (RCC). In addition, the insulating member 121 may be applied using a thermosetting resin as in the manufacturing method described below.

The printed circuit board base member 120 may include at least one contact portion 130 at any one position. The contact unit 130 is configured such that one surface is exposed to the outside (exposed to the lower position in the drawing), which is the printed circuit board 100 is another printed circuit board (not shown) or a connector for power supply ( It is to be connected to the (not shown).

The contact portion 130 may be composed of a first contact member 131 and a second contact member 132, the first contact member 131 is made of gold, the second contact member 132 May be composed of nickel. As such, when the contact unit 130 is formed of two or more materials, the conductivity may be improved as in a general printed circuit board, and durability such as hardness and strength of the terminal unit may be improved. Therefore, the material constituting the contact unit 130 is not limited to the above-described materials, and various materials may be applied to improve conductivity and durability.

A circuit pattern 140 having various patterns according to design specifications is disposed on the printed circuit board base member 120. A portion of the circuit pattern 140 is integrally formed on the contact portion 130 to enable electrical contact with the contact portion 130. The circuit pattern 140 may include a circuit pattern base member 141, a second circuit pattern member 142, and a first circuit pattern base member 143. As such, the circuit pattern 140 is formed of various materials for the same reason as that of the contact portion 130.

Therefore, as an example of applying the circuit pattern 140, the circuit pattern base member 141 may be formed of copper, and the second circuit pattern member 142 may be formed of nickel. The first circuit pattern member 143 may be formed of gold.

The PCB card 500 may be configured using the printed circuit board 100 configured as described above. Here, the PCB card 500 is defined as a name for a board, such as various types of memory card, sound card, video card, as mentioned above.

Referring to the configuration of the PCB card 500, the semiconductor device 310 is electrically connected to the circuit pattern 140 constituting the printed circuit board 100. In this case, the semiconductor device 310 may be mounted in various forms as shown in FIGS. 2A to 2C.

2A illustrates a state in which the semiconductor device 310 is mounted on the insulating member 121 constituting the printed circuit board base member 120 and electrically connected to the circuit pattern 140 by the connection line 311. That is, when the circuit pattern 140 is not very complicated, the semiconductor device 310 may be directly coupled to the insulating member 121 as shown in FIG. 2A.

2B illustrates a state in which the semiconductor device 310 is mounted on an upper region of the circuit pattern 140 and electrically connected to the circuit pattern 140 by the connection line 311. In this case, the semiconductor device 310 may be bonded with a conductive resin to form a ground structure between the semiconductor device 310 and the circuit pattern 140. Alternatively, the semiconductor device 310 may be bonded to the circuit pattern 140 by using a non-conductive resin. In the above two cases, since the circuit pattern 140 is made of a metal material, the effect of dissipating heat generated by the semiconductor device 310 can be enhanced.

2C illustrates a state in which the semiconductor device 310 is mounted on an upper region of some circuit patterns 140 and electrically connected to the circuit patterns 140 by a connection line 311. In this case, the semiconductor device 310 may be bonded with a non-conductive resin to be spaced apart from the circuit pattern 140 positioned below the semiconductor device 310 to prevent a short circuit between the circuit patterns 140. . Such a configuration is advantageous when the circuit pattern 140 is formed in a complicated manner.

Here, in the semiconductor device 310 mounted to be electrically connected to the circuit pattern 140, various devices such as a memory device or a device configured as a controller may be selectively mounted according to design specifications.

The sealing member 400 may be configured to block the semiconductor device 310 mounted in various forms and the circuit pattern 140 formed on the insulating member 121 from the outside. The sealing member 400 may be composed of an epoxy molding generally referred to as an epoxy molding compound (EMC), or may be formed using a ceramic material used in a packaging process of an integrated circuit.

By the sealing member 400, the PCB card 500 may be protected from external impact, and may be protected from external force causing bending or distortion, and protects the electric circuit configuration from the surrounding environment (atmosphere). You can do it.

In the above configuration, the semiconductor device 310 may be arranged in a plurality of stacked forms to improve its performance, and a multilayer structure by sequentially stacking the printed circuit base member 120 and the circuit pattern 140. You can also implement

On the other hand, since the printed circuit board 100 according to the present invention is configured using a new material such as RCC, the overall thickness is less than 50μm and can be implemented.

Hereinafter, a method for manufacturing the printed circuit board 100 having the structure as described above and a method of manufacturing the PCB card 500 using the printed circuit board will be described. Since the manufacturing process for the PCB card 500 can be performed continuously in the manufacturing process of the printed circuit board 100 will be described as a serial process.

3 to 17 illustrate a manufacturing process of a printed circuit board and a manufacturing process of a PCB card using the same according to an embodiment of the present invention. The manufacturing process of the printed circuit board will be described with reference to the drawings. First, as shown in FIG. 3, the printed circuit board base member 120 is laminated on the base member 110.

At this time, the printed circuit board base member 120 may be composed of an insulating member 121 and a conductive member 122, as described above, the insulating member 121 may be configured using a thermosetting resin. have. In this case, the printed circuit board base member 120 is configured by disposing an insulating member 121 made of a semi-solid thermosetting resin on the base member 110 and then applying heat to the base member 110 to fuse the insulating member 121.

Here, the base member 110 may be made of an insulating material or a material capable of conducting electricity. Such a configuration is related to the method of forming the contact portion 130 described below, and when the contact portion 130 is to be formed by electroplating, it must be plated based on the base member 110. The base member 110 should be made of a material capable of conducting electricity, such as a metal material.

The printed circuit board base member 120 coupled to the base member 110 may be configured using Resin Coated Copper (RCC) as described above.

As described above, after the printed circuit board base member 120 is formed on the base member 110, a mask 210 for forming the contact portion forming groove 123 is formed as shown in FIG. 4. The mask may also be configured using a photoresist or a photosensitive dry film that is generally used.

A contact portion forming groove 123 is formed using the mask 210 as shown in FIG. 5. In this case, the contact portion forming groove 123 is formed by sequentially etching the energizing member 122 and the insulating member 121 of the printed circuit board base member 120 through an etching process.

After the contact portion forming grooves 123 are formed in a portion of the printed circuit board base member 120 as described above, the contact portion 130 is formed again after removing the mask 210 as shown in FIGS. 5 and 6. Another mask 220 may be formed.

In contrast, the mask 210 for forming the contact portion groove 123 is formed thick, so that the mask 210 maintains a sufficient thickness in the process of forming the contact portion forming groove 123 to form another mask. It is also possible to prevent the formation of the 220 again.

In any case, the contact portion 130 is formed through the mask 210 or 220 as shown in FIG. 7. Here, the contact unit 130 may be formed to be composed of the first contact member 131 and the second contact member 132 as described above, the first contact member 131 is electrically It may be formed of gold to increase the current carrying performance, and the second contact member 132 may be formed of nickel to increase durability.

On the other hand, the contact portion 130 may be formed through a plating method, as mentioned previously, or may be formed through chemical vapor deposition.

After the contact portion 130 is formed as described above, the mask 220 is removed as shown in FIG. 8, and then another mask 230 for forming the circuit pattern 140 is formed as shown in FIG. 9. The mask 230 may have various patterns according to the design specifications of the circuit.

The circuit pattern base member 141 is formed as shown in FIG. 10 through the mask 230 for forming the circuit pattern 140. In this case, the circuit pattern base member 141 may be formed of the same material as the conductive member 122 of the printed circuit board base member 120 in consideration of the bonding force. Here, the circuit pattern base member 141 may be formed by an electroplating method, and the conductive member 122 constituting the printed circuit base member 120 is used as a plating lead wire. Therefore, there is no need to configure a lead wire for separate plating.

After the circuit pattern base member 141 is formed as described above, the second circuit pattern member 142 and the first circuit pattern member 143 are sequentially formed based on the circuit pattern base member 141 as shown in FIG. 11. Let's do it. The second circuit pattern member 142 may be formed of nickel, and the first circuit pattern member 143 may be formed of gold. Forming the circuit pattern 140 with the above materials is to increase the electrical conduction performance and durability is not limited to the above materials.

After the circuit pattern 140 is formed as described above, as shown in FIG. 12, the mask 230 is removed, and as shown in FIG. 13, the conductive member 122 connected between the circuit patterns 140 is removed. . Chemical etching may be used at this time. By such etching, only the conducting member 122 positioned below the circuit pattern base member 141 remains, and the conducting member 122 is the circuit pattern base member 141 and the second circuit pattern member 142. And a circuit pattern 140 together with the first circuit pattern member 143.

The printed circuit board 100 is manufactured through the series of processes. Here, when used in the state of the printed circuit board 100 may further include the step of removing the base member (110).

The series of fixings described below following the series of processes relates to a method of manufacturing the PCB card 500.

As shown in FIG. 14, the semiconductor device 310 is mounted on the circuit pattern 140 before the base member 110 is removed in the state in which the circuit pattern 140 is formed on the printed circuit board base member 120 as described above. do. In this case, the base member 110 serves as a reinforcing member to prevent the printed circuit board 100 from being deformed or damaged by the force applied when the semiconductor device 310 is mounted.

The semiconductor device 310 may be mounted in various structures according to the shape of the circuit pattern 140 formed as described with reference to FIGS. 2A to 2C.

That is, the semiconductor device 310 may be mounted on the insulating member 121 constituting the printed circuit board base member 120 and electrically connected to the circuit pattern 140 by the connection line 311. On the other hand, the semiconductor device 310 may be mounted on any one upper region of the circuit pattern 140 and electrically connected to the circuit pattern 140 by the connection line 311. In this case, the semiconductor device 310 may be bonded with a conductive resin to form a ground structure between the semiconductor device 310 and the circuit pattern 140. Alternatively, the semiconductor device 310 may be bonded to the circuit pattern 140 by using a non-conductive resin. In the above two cases, since the circuit pattern 140 is made of a metal material, the effect of dissipating heat generated by the semiconductor device 310 can be enhanced.

On the other hand, the semiconductor device 310 may be mounted on an upper region of some circuit patterns 140 and electrically connected to the circuit patterns 140 by the connection line 311. In this case, the semiconductor device 310 may be bonded with a non-conductive resin to be spaced apart from the circuit pattern 140 positioned below the semiconductor device 310 to prevent a short circuit between the circuit patterns 140. .

In this case, the semiconductor device 310 mounted to be electrically connected to the circuit pattern 140 may be selectively mounted according to a design specification as a memory device, a controller, or other devices according to the specification of the PCB card 500. have.

As described above, in the state in which the semiconductor device 310 is mounted on the printed circuit board 100, the circuit pattern 140 formed on the semiconductor device 310 and the insulating member 121 is formed from the outside. The sealing member 400 is formed to be blocked.

As already mentioned, the sealing member 400 may be composed of an epoxy molding generally referred to as an epoxy molding compound (EMC), or may be formed using a ceramic material used in a packaging process of an integrated circuit. By the sealing member 400, the PCB card 500 may be protected from external impact, and may be protected from external force causing bending or distortion, and protects the electric circuit configuration from the surrounding environment (atmosphere). You can do it.

In the above configuration, the semiconductor device 310 may be arranged in a plurality of stacked forms to improve its performance, and the multilayer structure may be formed by sequentially stacking the printed circuit base member 120 and the circuit pattern 140. It can also be implemented.

In this configuration, the base member 110 disposed below may be removed to expose the contact portion 130.

Meanwhile, the PCB card 500 as shown in FIG. 15 may allow a plurality of PCB cards 500 to be configured at the same time as shown in FIG. 16. In this case, as shown in FIG. 17, the base member 110 may be removed to cut each unit. Each PCB card 500 configured as described above may be cut into units and may be manufactured as the PCB card 500 shown in FIG. 1.

The printed circuit board, the PCB card using the printed circuit board, the manufacturing method of the printed circuit board, and the manufacturing method of the PCB card described above are not necessarily manufactured by sequentially performing each of the above-described steps, but according to design specifications. Each of the above definition steps may be optionally mixed to perform various modifications within the scope of the technical idea of the present invention.

According to the present invention as described above, it is possible to reduce the thickness of the printed circuit board, it is also possible to reduce the thickness of the PCB card manufactured using the printed circuit board.

In addition, according to the present invention, it is possible to manufacture a printed circuit board and a PCB card manufactured by using the low-cost parts and other parts of the key parts can reduce the price and process cost of the product.

In addition, according to the present invention, even when the printed circuit board is configured using components different from the existing materials, durability such as hardness and strength can be maintained.

In addition, according to the present invention, the manufacturing process of the printed circuit board and the PCB card using the same can be further simplified.

In addition, according to the present invention, the plating lead wire for forming the circuit pattern is not configured separately.

In addition, according to the present invention, it is possible to lower the limit of the memory chip mounted on the printed circuit board.

In addition, according to the present invention, it is possible to implement a high-density circuit pattern.

Claims (26)

Stacking the printed circuit board base member on the base; Forming at least one contact portion on one side of the printed circuit board base member in contact with a base; Forming a circuit pattern at one end of the printed circuit board base member connected to the contact portion; Forming the contact portion Forming a via hole in the printed circuit board base member; Plating the base with a seed to form a first contact member in the via hole; Forming a second contact member on the first contact member in the via hole; The second contact member is a manufacturing method of a printed circuit board, characterized in that formed lower than the height of the via hole. The method of claim 1, further comprising removing the base. The method of claim 1, wherein the printed circuit board base member is formed of an insulating member and an energizing member. The method of claim 3, wherein the printed circuit board base member is formed of a thermosetting resin and laminated on a base by thermal fusion. delete The method of claim 1, wherein the circuit pattern comprises a circuit pattern base member, a first circuit pattern member, and a second circuit pattern member. The method of claim 1, wherein the first contact member is made of gold, and the second contact member is made of nickel. 7. The circuit pattern base member of claim 6, wherein the circuit pattern base member is formed of the same material as the conductive member of the printed circuit base member, the first circuit pattern member is formed of gold, and the second circuit pattern member is formed of nickel. A method of manufacturing a printed circuit board. The method of claim 1, wherein the contact part is formed by chemical vapor deposition or plating. Stacking the printed circuit base member on the base; Forming at least one contact portion on the printed circuit board base member; Forming a circuit pattern at one end of the printed circuit board base member connected to the contact portion; Mounting at least one semiconductor device to enable electrical current with the circuit pattern; Sealing the circuit pattern and the semiconductor device to be blocked from the outside; Removing the base; Forming the contact portion, Forming a via hole in the printed circuit board base member; Plating the base with a seed to form a first contact member in the via hole; Forming a second contact member on the first contact member in the via hole / RTI > And the second contact member is formed lower than the height of the via hole. The method of claim 10, wherein the semiconductor device comprises a memory device and a device constituting a control unit. The method of claim 10, wherein the semiconductor device is mounted to be groundable with a circuit pattern. The method of claim 10, wherein the semiconductor device is mounted on an insulating member region of a printed circuit board base member on which a circuit pattern is not formed. The method of claim 10, wherein the semiconductor device is mounted on the circuit pattern by an insulating member. A printed circuit board base member; At least one contact portion formed in the via hole of the printed circuit board base member and exposed to one surface of the printed circuit board base member; A circuit pattern formed on the other surface of the printed circuit board base member to be electrically connected to a contact portion and a portion thereof; The contact portion A first contact member exposed on one surface of the printed circuit board base member in the via hole, and a second contact member formed on the first contact member in the via hole, The second contact member is formed to be lower than the height of the via hole. delete The printed circuit board of claim 15, wherein the circuit pattern comprises a circuit pattern base member, a first circuit pattern member, and a second circuit pattern member. The printed circuit board of claim 15, wherein the first contact member is made of gold and the second contact member is made of nickel. 18. The method of claim 17, wherein the circuit pattern base member is formed of the same material as the conductive member of the printed circuit base member, the first circuit pattern member is formed of gold, and the second circuit pattern member is formed of nickel. Printed circuit board. 16. The printed circuit board of claim 15, wherein the printed circuit board base member is made of Resin Coated Copper (RCC). A printed circuit board base member; At least one contact portion formed in the via hole of the printed circuit board base member and exposed to one surface of the printed circuit board base member; A circuit pattern formed on the other surface of the printed circuit board base member to be electrically connected to the contact portion; At least one semiconductor device mounted to the circuit pattern so as to be electrically energized; It includes a sealing member formed to block the circuit pattern and the semiconductor element from the outside, The contact portion A first contact member exposed on one surface of the printed circuit board base member in the via hole, and a second contact member formed on the first contact member in the via hole, The second contact member is a PCB card configured using a printed circuit board, characterized in that formed lower than the height of the via hole. 22. The PCB card of claim 21, wherein the semiconductor device comprises a memory device and a device constituting a control unit. 22. The PCB card of claim 21, wherein the semiconductor device is mounted to be groundable with a circuit pattern. 22. The PCB card of claim 21, wherein the semiconductor device is mounted on an insulating member region of a printed circuit board base member on which a circuit pattern is not formed. 22. The PCB card according to claim 21, wherein the semiconductor element is mounted by an insulating member constituting a printed circuit board base member on the circuit pattern. 22. The PCB card according to claim 21, wherein the semiconductor device is mounted on the circuit pattern and configured to enable heat dissipation through the circuit pattern.

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