CN103149745B - Chock insulator matter manufacture method on substrate - Google Patents

Abstract

The invention discloses a method for manufacturing a spacer on a substrate, comprising: forming a first spacer base material layer and a second spacer base material layer located on the first spacer base material layer on a base substrate layer; the sensitivity of the second spacer base material layer is greater than the sensitivity of the first spacer base material layer; the first spacer base material layer and the second spacer base material layer are exposed and developed to form a spacer Bedding. The sensitivity of the second spacer base material layer is greater than that of the first spacer base material layer, and when the same mask is used for exposure, the critical dimension deviation of the mask plate of the second spacer base material layer is smaller than that of the first spacer base material layer. The critical dimension of the mask plate of the spacer substrate layer deviates. Therefore, when the bottom size of the bottom layer of the spacer formed by the first spacer substrate layer is constant, the upper layer of the spacer formed by the second spacer substrate layer The top size is larger. Therefore, the manufacturing method of the spacer on the substrate provided by the present invention can reduce the influence on the aperture ratio of the liquid crystal panel while increasing the top diameter of the spacer.

Description

Manufacturing method of spacer on substrate

technical field

The invention relates to the technical field of liquid crystal display, in particular to a method for manufacturing a spacer on a substrate.

Background technique

In the field of display technology, liquid crystal panels occupy the display panel market due to their advantages of low power consumption, thinness, and portability. The liquid crystal panel includes a color filter substrate, an array substrate, and a liquid crystal layer located between the color filter substrate and the array substrate. Realize by making spacers on top.

As shown in Figure 1, the color filter substrate includes a black matrix 02 formed on the base substrate, the black matrix 02 has an opening area 01 corresponding to the RGB pixel unit, and the non-opening area of the black matrix 02 has a and the spacer 03 of the array substrate.

As shown in FIG. 2 , the spacer 03 in the prior art has a large size difference between the top 031 and the bottom 032 , and generally the diameter of the bottom 032 is about 10-20 um larger than that of the top 031 .

In the field of liquid crystal display, in order to increase the strength of the support between the color filter substrate and the array substrate, thereby increasing the strength of the liquid crystal panel, it is necessary to increase the diameter of the top 031 of the spacer 03 in the design to increase the supporting area of the spacer 03 But, because the size difference between the diameter of the bottom 032 of spacer 03 and the diameter of top 031 in the prior art is bigger, in order to improve the diameter of spacer 03 top 031, must increase spacer 03 bottom simultaneously 032, while the spacer 03 is designed to avoid the influence of the spacer on the normal arrangement of the liquid crystal in the pixel opening area, the distance between the edge of the spacer 03 bottom 032 and the opening area needs to be greater than 3~5um, increase The diameter of the top 031 of the spacer 03 also limits the aperture ratio of the liquid crystal panel to a certain extent.

Contents of the invention

The invention provides a method for manufacturing a spacer on a substrate. The manufacturing method can increase the diameter of the top of the spacer and at the same time reduce the influence on the aperture ratio of a liquid crystal panel.

To achieve the above object, the present invention provides the following technical solutions:

A method for manufacturing a spacer on a substrate, comprising:

A first spacer base material layer and a second spacer base material layer positioned on the first spacer base material layer are formed on the base substrate; the sensitivity of the second spacer base material layer is greater than the sensitivity of the first spacer substrate layer;

Exposing and developing the first spacer base material layer and the second spacer base material layer to form spacers.

Preferably, after forming the spacer, it also includes:

Post-cure the spacer.

Preferably, before forming the first spacer base material layer and the second spacer base material layer above the first spacer base material layer on the base substrate, the method further includes:

The base substrate is cleaned, and the cleaned base substrate is dried.

Preferably, forming the first spacer base material layer and the second spacer base material layer on the first spacer base material layer on the base substrate comprises:

coating a first spacer substrate layer on the base substrate;

A second spacer substrate layer is coated on the first spacer substrate layer.

Preferably, before exposing and developing the first spacer base material layer and the second spacer base material layer, it also includes:

The first spacer substrate layer and the second spacer substrate layer are pre-cured.

Preferably, forming the first spacer base material layer and the second spacer base material layer on the first spacer base material layer on the base substrate comprises:

forming a first spacer substrate layer on the base substrate;

pre-curing the first spacer substrate layer;

A second spacer substrate layer is formed on the first spacer substrate layer.

Preferably, before exposing and developing the first spacer base material layer and the second spacer base material layer, it also includes:

The second spacer substrate layer is pre-cured.

Preferably, forming the first spacer base material layer and the second spacer base material layer on the first spacer base material layer on the base substrate comprises:

A spacer base material layer having two spacer resin synthetic materials with different sensitivities is coated on the base substrate, and the density of the spacer resin synthetic material with higher sensitivity is greater than that of the spacer with lower sensitivity Density of raw materials for synthetic resin;

The spacer substrate layer is rotated and centrifugally layered, and the spacer resin synthetic raw materials of different densities in the spacer substrate layer are distributed vertically from large to small along the direction from the top of the spacer to the bottom, and the sensitivity is high The synthetic raw material of the spacer resin forms the second spacer base material layer, and the synthetic raw material of the spacer resin with lower sensitivity forms the first spacer base material layer.

Preferably, the spacer resin synthesis raw materials include: a polymer, a crosslinking agent containing a multifunctional group, a photoinitiator and a solvent system.

Preferably, the multipolymer is an acrylic resin, and the proportion of the multipolymer is 10-25%; the crosslinking agent is an acrylic monomer containing functional groups such as multiple amino groups and isocyanate groups, The photoinitiator includes one or more of benzoin, acylphosphine oxide, and thioxanthone, and the proportion of the photoinitiator and crosslinking agent is 10-25%; the solvent system Contains at least one of diethylene glycol dimethyl ether and propylene glycol methyl ether acetate, and the specific gravity of the solvent system is 50-80%.

The method for manufacturing a spacer on a substrate provided by the present invention includes:

A first spacer base material layer and a second spacer base material layer positioned on the first spacer base material layer are formed on the base substrate; the sensitivity of the second spacer base material layer is greater than the sensitivity of the first spacer substrate layer;

Exposing and developing the first spacer base material layer and the second spacer base material layer to form spacers.

In the manufacturing method of the spacer on the substrate provided by the present invention, since the second spacer base material layer on the base substrate is located on the first spacer base material layer, the first spacer base material layer and the first spacer base material layer After the second spacer substrate layer is exposed and developed, the first spacer substrate layer forms the lower layer of the spacer, and the second spacer substrate layer forms the upper layer of the spacer; because the second spacer substrate The sensitivity of the material layer is greater than that of the first spacer substrate layer. Therefore, when the same mask is used for exposure, the mask critical dimension deviation MaskCDBias of the second spacer substrate layer is smaller than that of the first spacer. MaskCDBias of the substrate layer, where

MaskCDBias= mask design size - actual output size

Therefore, when the bottom size of the spacer lower layer formed by the first spacer base material layer is constant, the top size of the spacer upper layer formed by the second spacer base material layer is larger.

Therefore, the manufacturing method of the spacer on the substrate provided by the present invention can reduce the influence on the aperture ratio of the liquid crystal panel while increasing the top diameter of the spacer.

Description of drawings

FIG. 1 is a schematic structural view of a color filter substrate in the prior art;

Fig. 2 is a schematic structural view of a spacer in the prior art;

3 is a schematic flow diagram of a method for manufacturing a spacer on a substrate provided by the present invention;

FIG. 4 is a schematic structural view of a spacer manufactured by the method for manufacturing a spacer on a substrate provided by the present invention.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In the manufacturing process of the liquid crystal display, the spacer can be manufactured on the color filter substrate or the array substrate. In this embodiment, the color filter substrate is taken as an example to illustrate the manufacturing process of the spacer.

Embodiment one

As shown in FIG. 3, the method for manufacturing a spacer on a substrate provided in this embodiment includes:

Step S301: forming a first spacer base material layer and a second spacer base material layer on the base substrate; the sensitivity of the second spacer base material layer greater than the sensitivity of the first spacer substrate layer;

Step S302: exposing and developing the first spacer base material layer and the second spacer base material layer to form spacers.

In the manufacturing method of the spacer on the substrate provided by the present invention, since the second spacer base material layer on the base substrate is located on the first spacer base material layer, the first spacer base material layer and the first spacer base material layer After the exposure and development of the second spacer base material layer, the formed spacer is as shown in Figure 4, the first spacer base material layer forms the spacer lower layer 32, and the second spacer base material layer forms the spacer Object upper layer 31; because the sensitivity of the second spacer base material layer is greater than the sensitivity of the first spacer base material layer, therefore, when using the same mask plate for exposure, the mask of the second spacer base material layer Template critical dimension deviation MaskCDBias is smaller than the MaskCDBias of the first spacer substrate layer, wherein

MaskCDBias= mask design size - actual output size

Therefore, when the size of the bottom 321 of the lower spacer layer 32 formed by the first spacer base material layer is constant, the size of the top 311 of the upper spacer layer 31 formed by the second spacer base material layer is larger.

Therefore, the manufacturing method of the spacer on the substrate provided by the present invention can reduce the influence on the aperture ratio of the liquid crystal panel while increasing the top diameter of the spacer.

In a preferred embodiment, after forming the spacer in the above step S302, it further includes:

The spacers formed in step S302 are post-cured. Post-curing the spacer obtained after development can improve the mechanical strength of the spacer and improve the supporting capacity of the spacer.

In a preferred embodiment, the above step S301 further includes before forming the first spacer base material layer and the second spacer base material layer on the first spacer base material layer on the base substrate:

The base substrate is cleaned, and the cleaned base substrate is dried.

Before forming the first spacer base material layer and the second spacer base material layer positioned on the first spacer base material layer on the base substrate, the base substrate is cleaned and dried, and the base substrate can be removed. The pollutants existing on the surface can further improve the adhesion strength between the formed spacer and the base substrate, thereby improving the support stability of the spacer.

Embodiment two

On the basis of Example 1 and its preferred implementation, in the method for manufacturing a spacer on a substrate provided in this example, step S301 forms a first spacer base material layer on the base substrate and a spacer located on the first spacer The second spacer substrate layer on the substrate layer specifically includes:

coating a first spacer substrate layer on the base substrate;

A second spacer substrate layer is coated on the first spacer substrate layer.

That is, in step S301 in the first embodiment, the first spacer base material layer and the second spacer base material layer located on the first spacer base material layer are formed on the base substrate by coating twice. In this manner, the formation uniformity of the first spacer base material layer and the second spacer base material layer can be improved. Of course, in addition to coating, other forming methods such as deposition and sputtering can also be used.

In a preferred embodiment, before exposing and developing the first spacer base material layer and the second spacer base material layer in step S302, the method further includes:

The first spacer substrate layer and the second spacer substrate layer are pre-cured.

Embodiment three

On the basis of Example 1 and its preferred implementation, in the method for manufacturing a spacer on a substrate provided in this example, step S301 forms a base material layer of a first spacer on the base substrate and The second spacer substrate layer on the substrate layer specifically includes:

forming a first spacer substrate layer on the base substrate;

pre-curing the first spacer substrate layer;

A second spacer substrate layer is formed on the first spacer substrate layer.

After forming the first spacer base material layer on the base substrate, the first spacer base material layer is pre-cured, which can reduce the formation of the second spacer base material layer on the first spacer base material layer. When, the phenomenon that the material of the second spacer base material layer reacts with the material of the first spacer base material layer, and or the phenomenon that the two are mixed occurs.

In a preferred embodiment, before exposing and developing the first spacer base material layer and the second spacer base material layer in step S302, the method further includes:

The second spacer substrate layer is pre-cured.

Embodiment four

On the basis of Example 1 and its preferred implementation, in the method for manufacturing a spacer on a substrate provided in this example, step S301 forms a base material layer of a first spacer on the base substrate and The second spacer substrate layer on the substrate layer specifically includes:

Coating a spacer base material layer having at least two spacer resin synthetic raw materials with different sensitivities on the base substrate, and the spacer resin synthetic raw material with higher sensitivity has a higher density than the spacer with lower sensitivities. Density of synthetic raw materials for pad resin;

The spacer substrate layer is rotated and centrifugally layered, and the spacer resin synthetic raw materials of different densities in the spacer substrate layer are distributed vertically from large to small along the direction from the top of the spacer to the bottom, and the sensitivity is high The synthetic raw material of the spacer resin forms the second spacer base material layer, and the synthetic raw material of the spacer resin with lower sensitivity forms the first spacer base material layer.

The above-mentioned method for forming the first spacer base material layer and the second spacer base material layer can make two kinds of spacer resin synthetic raw materials with different sensitivities change from large to large according to their densities along the direction from the top of the spacer to the bottom. To a small vertical distribution, a natural gradient transition is formed, and the shape of the spacer obtained after step S302 is relatively uniform.

Specifically, the spacer resin synthesis raw materials include: a polymer, a crosslinking agent containing a multifunctional group, a photoinitiator, and a solvent system.

More specifically, the above polymer is an acrylic resin, and the specific gravity of the polymer is 10-25%; the crosslinking agent is an acrylic monomer containing functional groups such as amino groups and isocyanate groups, The photoinitiator includes one or more of benzoin, acylphosphine oxide, and thioxanthone, and the proportion of the photoinitiator and crosslinking agent is 10-25%; the solvent system Contains at least one of diethylene glycol dimethyl ether and propylene glycol methyl ether acetate, and the specific gravity of the solvent system is 50-80%. Preferably, the solvent system comprises diethylene glycol dimethyl ether and propylene glycol methyl ether acetate, and the specific gravity of the solvent system is 50-80%.

Apparently, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims (10)

1. a chock insulator matter manufacture method on substrate, is characterized in that, comprising:

On underlay substrate, form the first chock insulator matter substrate layer and be positioned at the on the first chock insulator matter substrate layerTwo chock insulator matter substrate layers; The speed of described the second chock insulator matter substrate layer is greater than the sense of the first chock insulator matter substrate layerLuminosity, with in the time using same mask plate exposure, the mask plate critical size of the second chock insulator matter substrate layer is inclined to one sidePoor MaskCDBias is less than the mask plate key size deviation of the first chock insulator matter substrate layer; Wherein, maskPlate key size deviation=mask plate design size-actual output size;

Described the first chock insulator matter substrate layer and the second chock insulator matter substrate layer are carried out to exposure imaging, form dottle pinThing.

2. manufacture method according to claim 1, is characterized in that, after described formation chock insulator matterAlso comprise:

Chock insulator matter is carried out to rear solidifying.

3. manufacture method according to claim 1, is characterized in that, described on underlay substrate shapeBefore becoming the first chock insulator matter substrate layer and being positioned at the second chock insulator matter substrate layer on the first chock insulator matter substrate layerAlso comprise:

Clean underlay substrate, and the underlay substrate after cleaning is dried.

4. according to the manufacture method described in claim 1～3 any one, it is characterized in that, described at substrateOn substrate, form the first chock insulator matter substrate layer and be positioned at the second chock insulator matter base on the first chock insulator matter substrate layerMaterial layer comprises:

On underlay substrate, apply the first chock insulator matter substrate layer;

On described the first chock insulator matter substrate layer, apply the second chock insulator matter substrate layer.

5. manufacture method according to claim 4, is characterized in that, to described the first chock insulator matterSubstrate layer and the second chock insulator matter substrate layer carry out also comprising before exposure imaging:

The first chock insulator matter substrate layer and the second chock insulator matter substrate layer are carried out to precuring.

6. according to the manufacture method described in claim 1～3 any one, it is characterized in that, described at substrateOn substrate, form the first chock insulator matter substrate layer and be positioned at the second chock insulator matter base on the first chock insulator matter substrate layerMaterial layer comprises:

On underlay substrate, form the first chock insulator matter substrate layer;

To the first chock insulator matter substrate layer precuring;

On the first chock insulator matter substrate layer, form the second chock insulator matter substrate layer.

7. manufacture method according to claim 6, is characterized in that, to described the first chock insulator matterSubstrate layer and the second chock insulator matter substrate layer carry out also comprising before exposure imaging:

Described the second chock insulator matter substrate layer is carried out to precuring.

8. according to the manufacture method described in claim 1～3 any one, it is characterized in that, described at substrateOn substrate, form the first chock insulator matter substrate layer and be positioned at the second chock insulator matter base on the first chock insulator matter substrate layerMaterial layer comprises:

On underlay substrate, apply the chock insulator matter of the chock insulator matter resin synthesis material with two kinds of different speedSubstrate layer, and the density of the higher chock insulator matter resin synthesis material of speed is greater than the chock insulator matter that speed is lowerThe density of resin synthesis material;

Chock insulator matter substrate layer is rotated to centrifugal layering, the chock insulator matter of the different densities in chock insulator matter substrate layerResin synthesis material points to the descending vertical distribution of direction of bottom along chock insulator matter top, speed is higherChock insulator matter resin synthesis material forms described the second chock insulator matter substrate layer, and the chock insulator matter resin that speed is lower closesBecome raw material to form described the first chock insulator matter substrate layer.

9. manufacture method according to claim 8, is characterized in that, described resin synthesis material bagDraw together: polymer, containing crosslinking agent, light trigger and the dicyandiamide solution of multi-functional group.

10. manufacture method according to claim 9, is characterized in that, described polymer is acrylic acidResin, and the proportion of described polymer is 10～25%; Described crosslinking agent is for containing amino functional group, differentThe acrylic monomers of nitrile perester radical functional group, described light trigger comprise benzoin, acylphosphine oxide,A class or multiclass in thioxanthones three class materials, and the proportion of described light trigger and crosslinking agent is10～25%; Described dicyandiamide solution comprises at least one in diethylene glycol dimethyl ether, 1-Methoxy-2-propyl acetateKind, and the proportion of described dicyandiamide solution is 50～80%.