CN103139694B - Microphone package technology and package structure according to technology - Google Patents
Microphone package technology and package structure according to technology Download PDFInfo
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- CN103139694B CN103139694B CN201210557327.XA CN201210557327A CN103139694B CN 103139694 B CN103139694 B CN 103139694B CN 201210557327 A CN201210557327 A CN 201210557327A CN 103139694 B CN103139694 B CN 103139694B
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- 238000005516 engineering process Methods 0.000 title abstract description 14
- 239000002313 adhesive film Substances 0.000 claims abstract description 60
- 238000000034 method Methods 0.000 claims abstract description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 80
- 239000011889 copper foil Substances 0.000 claims description 80
- 238000009413 insulation Methods 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 19
- 241000218202 Coptis Species 0.000 claims description 16
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 15
- 239000011810 insulating material Substances 0.000 claims description 12
- 239000012528 membrane Substances 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 4
- 208000002925 dental caries Diseases 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
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- 238000005507 spraying Methods 0.000 claims 2
- 230000008569 process Effects 0.000 abstract description 27
- 239000003292 glue Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000004080 punching Methods 0.000 abstract 1
- 238000012536 packaging technology Methods 0.000 description 17
- 239000007787 solid Substances 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000006071 cream Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
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- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
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- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 238000004806 packaging method and process Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention relates to microphone package technology and a package structure according to the technology. The technology comprises the following steps: step one, conductive adhesive films are carried out on punching, a plurality of openings are formed in the conductive adhesive films; step two, an intermediate plate is provided, the intermediate plate is drilled to form an intermediate plate through-hole and the inner wall of the intermediate plate through-hole is metalized; step three, two surfaces of the intermediate plate are respectively bonded with the conductive adhesive film; step four, a release liner of a conductive adhesive film on one of the surfaces of the intermediate plate is removed and a baseboard is bonded on the surface; step five, microphone functional components are respectively arranged in a plurality of cavities formed in step four; step six, a release liner of a conductive adhesive film on the other surface of the intermediate plate is removed and a cover plate is pressed on the surface; step seven, a connection plate is divided into a plurality of microphone units. The microphone package technology and the package structure according to the technology have the advantages that the technological process is simple, bonding glue quantity and the shape of an adhesive surface are easy to control, the package structure is installed stably, and the sealing effect and the electromagnetic shielding effect are good.
Description
Technical field
The present invention relates to the production technology of microphone and the encapsulating structure field of microphone, specifically a kind of utilize solid conduction adhesive film to carry out packaging shell microphone package technique and the encapsulating structure that obtains of this technique.
Background technology
Microphone is a kind of collected sound signal and is converted into the energy transducer of the accessible signal of telecommunication, also claims microphone or microphone.Common microphone has electret capcitor microphone and MEMS microphone, for electret capcitor microphone, its operation principle is: utilize vibrating diaphragm and back pole plate to form two pole plates of electric capacity, acoustic pressure drives diaphragm oscillations that the distance between two-plate is changed, thus cause electric capacity to change, and then make change in voltage, the size of change in voltage, reflect the power of extraneous acoustic pressure, namely this change in voltage frequency reflects the frequency of external sound, and the circuit structures such as the built-in PCB of microphone or wiring board can receive above-mentioned voltage signal and export after treatment.Aforesaid each parts can be referred to as the functional unit of microphone, and for MEMS microphone, its functional unit comprises MEMS chip, MEMS vibrating diaphragm and connects gold thread etc.In the encapsulation of microphone, need the functional unit of microphone to be encapsulated in a box body, wherein requisitely need technique for sticking.In view of the development trend of the demand of the large production of modernization and the miniaturization microminiaturization in microphone field, higher requirement be it is also proposed to the packaging technology of microphone.
Technique for sticking common in microphone package technique has:
1) liquid conduction rubber seal dress
Liquid conduction rubber seal packing technique is that a kind of liquid glue of mixed metal powder that uses carries out the bonding encapsulation technology with conducting between plate;
2) tin cream encapsulation
Tin cream encapsulation technology is that a kind of bonding reflux technique of tin cream that uses is bonding and realize the encapsulation technology of conducting function by two-ply;
3) non-conducting solid rubber seal dress
Non-conducting solid rubber seal packing technique realizes the bonding encapsulation technology of plate with solid film.
In above-mentioned technique: 1) liquid conduction rubber seal packing technique due to its bonding agent used be liquid glue, concrete consumption for glue cannot effectively control, can not control the shape of glue, easily occur glue amount uneven and cause the situation of adhesive failure to occur, meanwhile, glue is easy to enter the inside of microphone and causes inner functional unit performance bad; 2) tin cream encapsulation technology due to its bonding agent used be tin cream, tin cream can again melt in reflux course, if during the flexible parts of enclosed inside, have the hidden danger of adhesive failure; 3) solid non-conductive glue bonding only can realize between plate bonding, and cannot realize the electrical connection between plate, must increase technique to be electrically connected, in miniaturized microminiaturized process, due to limitations, complex process is difficult to realize.
Have a kind of conductive adhesive film of solid at present, its entirety is film-form, and has mixed the metal dust for conducting electricity in it.If the whole shell structure of the conductive adhesive film of this kind of solid to microphone can be utilized to carry out bonding, then the shortcoming existed in existing various bonding packaging technology be can overcome, and the demand of large-scale production and the development trend of miniaturization microminiaturization more can be met.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of microphone package technique; this packaging technology utilizes the conductive adhesive film of solid to carry out bonding encapsulation to the shell structure of microphone; technological process is simple; the shape of the conducting resinl in bonding process and thickness all can conveniently control; not only be conducive to the miniaturization of microphone and miniaturization but also be convenient to large-scale production, meanwhile, this technique can ensure sealing and bonding fastness; do not need again additional process to be electrically connected, save bonding space.
Another technical problem that the present invention will solve is to provide a kind of microphone package, this encapsulating structure is by the cavity body structure of sheet material successively bonding formation microphone, the bonding conductive adhesive film by solid of each plate completes, the thickness of bonding plane is even and electrical connection is reliable, encapsulating structure is simple, can realize good shield effectiveness, and the functional unit of encapsulating structure inside is installed solid and reliable.
For solving first technical problem of the present invention, microphone package technique of the present invention comprises the following steps:
Step one, chooses conductive adhesive film, and conductive adhesive film sets out multiple perforate with needing the cavity geometry of the microphone encapsulated to match;
Step 2, chooses intermediate plate, and intermediate plate comprises intermediate plate base material and overlays on the intermediate plate copper foil layer on intermediate plate base material two sides; On intermediate plate, boring is formed and also the inwall of intermediate plate through hole is made metalized with the intermediate plate through hole needing the cavity geometry of microphone encapsulated to match, and the inwall of intermediate plate through hole is formed after metalized can the metallic inner wall of the above-mentioned two-layer intermediate plate copper foil layer of conducting;
Step 3, conductive adhesive film of fitting respectively in two faces of intermediate plate; The perforate of conductive adhesive film is corresponding with the position of intermediate plate through hole;
Step 4, base plate that the wherein one side of intermediate plate is fitted, forms multiple open-topped cavity body structure; Base plate has can and the base plate copper foil layer that be electrically connected bonding with intermediate plate and base plate has the base plate sound hole corresponding with above-mentioned each cavity;
Step 5, is respectively charged into microphone functional unit in the multiple cavitys formed in step 4;
Step 6, pressing cover plate on intermediate plate another side; Cover plate has can and the cover plate copper foil layer that be electrically connected bonding with intermediate plate;
Step 7, is divided into multiple microphone unit by the disjunctor plate with multiple microphone construction unit completed in step one to step 6.
In above-mentioned technical process, utilize sheet material mutually bonding and offer through hole to construct the cavity body structure of microphone at intermediate plate, conveniently can be controlled the height of the inner chamber of microphone by the thickness controlling intermediate plate, facilitate and encapsulated moulding is carried out to the microphone of various function, the conductive adhesive film of solid is used to carry out bonding to each sheet material, the partial die cut mated with inner chamber first falls by the shape according to cavity inner chamber, namely remaining conductive adhesive film is the adhesive glue needing to retain, this kind of mode can carry out the glue consumption of bonding plane between control board by the thickness controlling conductive adhesive film, and the mode by being hot bonding, make bonding firmly and ensure that the reliability of conduction, the inwall of intermediate plate makes metalized, can copper foil layer on conducting intermediate plate two sides, be convenient to be electrically connected between the base plate in the microphone of some function and the circuit on cover plate, such as, for electret microphone, if offer sound hole on base plate, then circuit structure established by cover plate, one of them of two pole plates of the electric capacity of electret microphone can directly be electrically connected with the circuit on cover plate, another then needs to be connected with the circuit on cover plate by bottom-up conductive mechanism, namely the metallic inner wall of intermediate plate serves the effect of electrical connection base plate and cover plate, meanwhile, metallic inner wall yet forms both ringle and parts in cavity can be protected from electromagnetic interference.
Laminating in the step 3 and step 4 of packaging technology of the present invention and the pressing in step 6 complete by Heat sealer, the temperature of fitting in step 3 and step 4 is 120-170 DEG C, pressure is 0.4-9.0Mpa, the time is 1-10Min, and the temperature of pressing in step 6 is 150-210 DEG C, pressure is 1-14Mpa, the time is 20-60Min.
Segmentation in the step 7 of packaging technology of the present invention uses Water Cutting or dry type cutting machine.
Also be included in the step 2 of packaging technology of the present invention on metallic inner wall and spray one deck insulating material formation insulation ring wall; Microphone functional unit in step 5 comprises the elastic metallic gasket ring, electret back plate, insulation spacer, electret vibrating membrane and the polar ring that load successively; Cover plate also has the circuit board that can be electrically connected with polar ring.This process is the encapsulation process of the present invention to electret capcitor microphone, wherein, the process of adding insulation ring wall is the function of the dielectric chamber ring in order to achieve microphone in prior art, by the inner wall insulation of the functional unit in microphone inner chamber and cavity, avoid two short circuit of polars of electret capacitor.Because the functional part of electret microphone is more, almost take whole cavity space, therefore, need the insulating wrapped effect of insulation ring wall.In addition, first load elastic metallic gasket ring, reinstall other each parts, hold out against on polar ring finally by cover plate, make use of the elastic force of elastic metallic gasket ring, make the press fit of each parts firm, can not produce loosening, and the contact of electrical connection is tightr, ensure that the reliability of electrical connection.
Microphone functional unit in the step 5 of packaging technology of the present invention comprises MEMS vibrating diaphragm and MEMS chip, each function element and function element is electrically connected with base plate copper foil layer by gold thread.This process is the encapsulation process of the present invention to MEMS microphone.Because the functional part of MEMS microphone is less, therefore, when package of MEMS microphone, first, the thickness of intermediate plate can be reduced, can also need not process insulation ring wall in addition.But, if technical process allows, also can process insulation ring wall simultaneously.That is: be also included in step 2 on metallic inner wall and spray one deck insulating material formation insulation ring wall; Microphone functional unit in step 5 comprises MEMS vibrating diaphragm and MEMS chip, each function element and function element is electrically connected with base plate copper foil layer by gold thread.
For solving second technical problem of the present invention, the design feature of microphone package of the present invention comprises supreme base plate bonding successively, intermediate plate and the cover plate end of from, intermediate plate is the hollow structure offering intermediate plate through hole, in intermediate plate through hole, microphone functional unit is installed, intermediate plate comprises intermediate plate base material and overlays on the intermediate plate copper foil layer on intermediate plate base material two faces, and the inwall of intermediate plate through hole is provided with the metallic inner wall that one deck can be electrically connected above-mentioned two intermediate plate copper foil layers; The end face of base plate is provided with base plate copper foil layer, base plate offers base plate sound hole; The bottom surface of cover plate is provided with cover plate copper foil layer; Between base plate copper foil layer and the intermediate plate copper foil layer on intermediate plate bottom surface, cover plate copper foil layer is all bonding by conductive adhesive film pressing with the intermediate plate copper foil layer on intermediate plate end face, conductive adhesive film offers the perforate corresponding with described intermediate plate through hole.
Adopt this kind of encapsulating structure, utilize mutually bonding between sheet material and offer at intermediate plate the inner-cavity structure that through hole forms microphone, and realize bonding and electrical connection by the conductive adhesive film of solid between each plate, make the shape of bonding plane between plate and thickness controlled, thus can ensure bonding firm, what can ensure again to be electrically connected is reliable; The setting of metallic inner wall, achieves electromagnetic shielding, ensure that the reliability of the signal of microphone.
Described metallic inner wall be also coated with insulating material and form insulation ring wall; Described microphone functional unit comprises supreme elastic metallic gasket ring, electret back plate, insulation spacer, electret vibrating membrane and the polar ring the set gradually end of from, electret back plate is electrically connected by elastic metallic gasket ring with base plate copper foil layer, the bottom surface of described cover plate is provided with circuit board, and the bottom of polar ring is electrically connected with electret vibrating membrane, top is electrically connected with circuit board.Said structure is the microphone construction of electret capacitor type; Wherein, for encapsulating structure of the present invention, elastic metallic gasket ring is set and can be electrically connected base plate copper foil layer and electret back plate, meanwhile, utilize the elastic force of elastic metallic gasket ring, can each parts are pressed against fastening, the reliable of electrical connection can be ensured, parts can be avoided again to loosen.
Described microphone functional unit comprises MEMS vibrating diaphragm and MEMS chip, and MEMS vibrating diaphragm is arranged on base plate sound hole place, and MEMS vibrating diaphragm is all electrically connected by gold thread with between MEMS chip, between MEMS chip with base plate copper foil layer.Said structure is the structure of MEMS microphone.Functional unit in this structure is less, does not therefore arrange insulation ring wall.Meanwhile, if conditions permit, also insulation ring wall can be set, the effect avoiding gold thread to touch cavity inner wall can be played.Namely following structure is adopted: metallic inner wall is also coated with the insulation ring wall formed by insulating material; Described microphone functional unit comprises MEMS vibrating diaphragm and MEMS chip, and MEMS vibrating diaphragm is arranged on base plate sound hole place, and MEMS vibrating diaphragm is all electrically connected by gold thread with between MEMS chip, between MEMS chip with base plate copper foil layer.
In sum, microphone package technique of the present invention have that technological process is simple, bonded adhesives amount and bonding plane shape easily controls, bonding firmly advantage; The advantage that the encapsulating structure of microphone of the present invention has that structure is simple, electrical connection is reliable, inner components installs firm, sealing and effectiveness is good.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Fig. 1 is the structural representation of a kind of execution mode of the electret-type microphone of encapsulated moulding in the present invention;
Fig. 2 is the structural representation of a kind of execution mode of the MEMS microphone of encapsulated moulding in the present invention;
Fig. 3 be the conductive adhesive film matched with the microphone of square cavity used in packaging technology of the present invention die-cut after structural representation;
Fig. 4 be the conductive adhesive film matched with the microphone of circular cavity used in packaging technology of the present invention die-cut after structural representation;
Fig. 5 is the structural representation after intermediate plate in packaging technology of the present invention and conductive adhesive film are fitted;
Fig. 6 is the structural representation after intermediate plate in packaging technology of the present invention and base plate are fitted;
Fig. 7 is the structural representation after the microphone functional unit in packaging technology of the present invention is installed;
Fig. 8 is the cover plate in packaging technology of the present invention and the structural representation after intermediate plate pressing.
Embodiment
With reference to accompanying drawing, a kind of execution mode of the packaging technology of microphone of the present invention is for comprising the following steps:
Step one, provides conductive adhesive film 1, carries out die-cut to conductive adhesive film 1, and conductive adhesive film 1 sets out multiple perforate 10 with needing the cavity geometry of the microphone encapsulated to match.Wherein, the wherein one side of conductive adhesive film 1 is covered with one deck release film layer 1-1, when using conductive adhesive film 1, first will the one side of release film layer 1-1 do not had to use as bonding plane, when needs use another side, release film layer 1-1 is removed, then will the face of release film layer 1-1 be eliminated as follow-up bonding plane.Release film layer 1-1 is equivalent to the packaging protecting film of conductive adhesive film 1, and when die-cut, conductive adhesive film 1 is cooperatively processed together with release film layer 1-1.The Main Function of release film layer 1-1 is the follow-up bonding plane of protection conductive adhesive film 1, to avoid when die-cut and in follow-up bonding process impurity etc. to fall the conductivity and the cementability that conductive adhesive film 1 have influence on conductive adhesive film 1.The cavity geometry of microphone is according to the difference of its function and installation site, can be circular or square etc., illustrated in Fig. 3 and Fig. 4 conductive adhesive film 1 that the microphone cavity geometry different from two kinds matches die-cut after schematic diagram, in the conductive adhesive film 1, figure used in the packaging technology of Fig. 3 to be cavity be square microphone, the shape of perforate 10 is square.Shown in Fig. 4 for cavity is perforate 10 in the conductive adhesive film 1, figure used in the packaging technology of circular microphone, shape be circle.In addition, the opening of Fig. 3 and Fig. 4 edge is location hole 101, for entering shape location with following intermediate plate 2.
Step 2, provides intermediate plate 2, and on intermediate plate 2, boring is formed with the intermediate plate through hole 20 needing the cavity geometry of the microphone encapsulated to match and the inwall of intermediate plate through hole 20 is made metalized.Wherein, intermediate plate 2 comprises intermediate plate base material 2-1 and overlays on intermediate plate copper foil layer 2-2 on intermediate plate base material 2-1 two sides, and the inwall of intermediate plate through hole 20 is formed after metalized can the metallic inner wall 21 of the above-mentioned two-layer intermediate plate copper foil layer 2-2 of conducting.Because intermediate plate through hole 20 forms the cavity cavity of microphone, therefore, the thickness of intermediate plate 2 determines the height of microphone cavity, in this step, the intermediate plate 2 of different-thickness is selected namely to determine the type of the microphone will processed in the future, such as, for the microphone of electret capacitor type, the thickness of its intermediate plate 2 used is thicker than the thickness of MEMS microphone.The inwall of intermediate plate through hole 20 makes metalized, namely plates layer of metal layer at the inner surface of intermediate plate through hole 20 or directly does the process of metal pad pasting, as aluminium coated, doing the process such as Copper Foil pad pasting, be prior art, do not repeat them here.
Step 3, conductive adhesive film 1 of fitting respectively in two faces of intermediate plate 2; The perforate 10 of conductive adhesive film 1 is corresponding with the position of intermediate plate through hole 20, and conductive adhesive film 1 is bonding with intermediate plate copper foil layer 2-2.This step embodies in Figure 5, the upper end face of intermediate plate 2 and bottom surface all cover intermediate plate copper foil layer 2-2, intermediate plate copper foil layer 2-2 cooperation bonding with conductive adhesive film 1 also realizes conducting electricity and connects, release film layer 1-1 in conductive adhesive film 1 can not be peeled off in this step, avoid the impurity such as dust in laminating process to adhere in conductive adhesive film 1.
Step 4, removes the release film layer 1-1 in the conductive adhesive film 1 in the wherein one side of intermediate plate 2 and base plate 3 of fitting on this face, forms multiple open-topped cavity body structure; Base plate 3 has and can carry out with the conductive adhesive film 1 having eliminated release film layer 1-1 in this step coordinating bonding base plate copper foil layer 3-2 and base plate 3 having the base plate sound hole 30 corresponding with above-mentioned each cavity.This step embodies in figure 6, as shown in the figure, is adhered on the bottom surface of intermediate plate 2 by base plate copper foil layer 3-2.Wherein, for base plate copper foil layer 3-2, it can be the structure of multilayer copper foil plate, also can be made into Copper Foil is the base plate wiring board of binding post, only on the position corresponding with intermediate plate copper foil layer 2-2 of base plate 3, establish base plate copper foil layer 3-2, be electrically connected with the bottom surface of intermediate plate 2 by base plate copper foil layer 3-2, as the MEMS microphone embodied in fig. 2, the functional unit of MEMS microphone is unified to be arranged on base plate 3, its base plate 3 has base plate wiring board 3-3, base plate copper foil layer 3-2 is only as the binding post of base plate wiring board 3-3, for being electrically connected with intermediate plate copper foil layer.。Pick out terminal for base plate wiring board 3-3, it can be electrically connected with intermediate plate 2 by conductive adhesive film 1, and then to be electrically connected on cover plate 4 and to draw from cover plate 4 and pick out terminal, also directly can be formed through base plate 3 and in the bottom surface of base plate 3 and pick out terminal.
Step 5, is respectively charged into microphone functional unit in the multiple cavitys formed in step 4.This step embodies in the figure 7, and in multiple cavitys of top end opening, load the functional part of microphone respectively successively, each parts realize its function separately according to the structure with the cavity of electrical connection formed.
Step 6, by the release film layer 1-1 of the conductive adhesive film 1 on intermediate plate 2 another side remove and on this face pressing cover plate 4; Cover plate 4 has and can coordinate bonding cover plate copper foil layer 4-2 with the conductive adhesive film 1 having eliminated release film layer 1-1 in this step.This step embodies in fig. 8, wherein, for cover plate copper foil layer 4-2, the same with base plate copper foil layer 3-2, it can be the structure of multilayer copper foil plate, also can be made into Copper Foil is the cover plate circuit board of binding post, and this kind of cover plate circuit board can by only establishing copper foil layer to be electrically connected with intermediate plate 2 on the position that cover plate 3 is corresponding with intermediate plate copper foil layer 2-2.For electret microphone in Fig. 8, as shown in the figure, each functional part of microphone tightly suppresses by cover plate 4, for electret microphone, circuit board 4-3 is established in the bottom surface of the cover plate 4 in this step.Also be included in step 2 on metallic inner wall 21 and spray one deck insulating material formation insulation ring wall 22.The process of adding insulation ring wall 22 is the functions of the dielectric chamber ring in order to achieve microphone in prior art, by the inner wall insulation of the functional unit in microphone inner chamber and cavity, avoids two short circuit of polars of electret capacitor.Because the functional part of electret microphone is more, almost take whole cavity space, therefore, need the insulating wrapped effect of insulation ring wall 22.Microphone functional unit in step 5 comprises the elastic metallic gasket ring 5, electret back plate 6, insulation spacer 7, electret vibrating membrane 8 and the polar ring 9 that load successively.Wherein, polar ring 9 bottom is electrically connected with electret film 8, polar ring 9 top is electrically connected with the circuit board 4-3 of cover plate 4 bottom surface, cover plate copper foil layer 4-2 is as a binding post of circuit board 4-3, it is electrically connected with electret back plate 6 by intermediate plate copper foil layer 2-2 and base plate copper foil layer 3-2, and electret back plate 6 and electret vibrating membrane 8 form two pole plates of electret capacitor.In addition, first load elastic metallic gasket ring 5, reinstall other each parts, compress encapsulation finally by cover plate 4, utilize the elastic force of elastic metallic gasket ring 5, make the press fit of each parts firm, can not produce loosening.
Step 7, is divided into multiple microphone unit by the disjunctor plate with multiple microphone construction unit completed in step one to step 6.This step is cutting procedure, and the dotted line shown in Fig. 8 is line of cut.Water Cutting or dry type cutting machine etc. can be adopted to cut.
In above-mentioned technical process, utilize sheet material mutually bonding and on intermediate plate 2, offer intermediate plate through hole 20 to construct the cavity body structure of microphone, conveniently can be controlled the height of the inner chamber of microphone by the thickness controlling intermediate plate 2.The conductive adhesive film 1 of solid is used to carry out bonding to each sheet material, the partial die cut mated with inner chamber first falls by the shape according to cavity inner chamber, namely remaining conductive adhesive film 1 is used as bonding plane, this kind of mode can carry out the glue consumption of bonding plane between control board by the thickness controlling conductive adhesive film 1, and by the bonding mode of hot pressing, make bonding firmly and ensure that the reliability of conduction.Intermediate plate through hole 20 inwall makes metalized, can copper foil layer on conducting intermediate plate two sides, be convenient to be electrically connected between base plate 3 in some function microphone and cover plate 4, such as, for electret microphone, as shown in Figure 1, if offer base plate sound hole 30 on base plate 3, then circuit structure established by cover plate 4, two pole plates of the electric capacity of electret microphone one of them can directly be connected with the circuit structure on cover plate 4, another then needs to be connected with the circuit on cover plate 4 by bottom-up conductive mechanism, namely the metallic inner wall 21 of intermediate plate 2 serves the effect of electrical connection base plate 3 and cover plate 4, meanwhile, metallic inner wall 21 yet forms both the version around microphone inner chamber, it can protect parts in cavity from electromagnetic interference.
Refer to laminating and pressing in technical process of the present invention, for laminating and pressing, it is all completed by Heat sealer, and the pressure of laminating arranges the pressure being less than pressing and arranges.Namely the laminating in step 3 and step 4 and the pressing in step 6 complete by Heat sealer, wherein, preferred optimum configurations is: the temperature of fitting in step 3 and step 4 is 120-170 DEG C, pressure is 0.4-9.0Mpa, the time is 1-10Min, and the temperature of pressing in step 6 is 150-210 DEG C, pressure is 1-14Mpa, the time is 20-60Min.
For MEMS microphone, the microphone functional unit in the step 5 of packaging technology of the present invention comprises MEMS vibrating diaphragm 11 and MEMS chip 12, each function element and function element is electrically connected with base plate copper foil layer 3-2 by gold thread 13.Because the functional part of MEMS microphone is less, therefore, when package of MEMS microphone, first, the thickness of intermediate plate 2 can be reduced, can also need not process insulation ring wall 22 in addition.But, if technical process allow, also can process simultaneously insulation ring wall 22, insulation ring wall 22 can play avoid gold thread 13 to touch microphone internal chamber wall and affect circuit connect phenomenon.The step of processing insulation ring wall 22 is: be also included in step 2 on metallic inner wall 21 and spray one deck insulating material formation insulation ring wall 22; Microphone functional unit in step 5 comprises MEMS vibrating diaphragm 11 and MEMS chip 12, each function element and function element is electrically connected with base plate copper foil layer 3-2 by gold thread 13.
With reference to accompanying drawing, a kind of execution mode of microphone package of the present invention is comprise supreme base plate 3 bonding successively, intermediate plate 2 and cover plate 4 end of from, intermediate plate 2 is for offering the hollow structure of intermediate plate through hole 20, in intermediate plate through hole 20, microphone functional unit is installed, intermediate plate 2 comprises intermediate plate base material 2-1 and overlays on the intermediate plate copper foil layer 2-2 on intermediate plate base material 2-1 two faces, and the inwall of intermediate plate through hole 20 is provided with the metallic inner wall 21 that one deck can be electrically connected above-mentioned two intermediate plate copper foil layer 2-2; The end face of base plate 3 is provided with base plate copper foil layer 3-2, base plate 3 offers base plate sound hole 30; The bottom surface of cover plate 4 is provided with cover plate copper foil layer 4-2; Be respectively equipped with conductive adhesive film 1 between intermediate plate copper foil layer 2-2 between intermediate plate copper foil layer 2-2 on base plate copper foil layer 3-2 and intermediate plate 2 bottom surface, on cover plate copper foil layer 4-2 and intermediate plate end face, conductive adhesive film 1 offer the perforate 10 corresponding with intermediate plate through hole 20.Utilize mutually bonding between sheet material and offer at intermediate plate 2 inner-cavity structure that intermediate plate through hole 20 forms microphone, and realizing bonding and electrical connection by the conductive adhesive film 1 of solid between each plate, make the shape of bonding plane between plate and thickness controlled.The setting of metallic inner wall 21, for electromagnetic shielding, avoids the parts of microphone inside from electromagnetic interference.
With reference to accompanying drawing, metallic inner wall 21 be also coated with insulating material and form insulation ring wall 22, microphone functional unit comprises supreme elastic metallic gasket ring 5, electret back plate 6, insulation spacer 7, electret vibrating membrane 8 and the polar ring 9 the set gradually end of from, electret back plate 6 is electrically connected by elastic metallic gasket ring 5 with base plate copper foil layer 3-2, the bottom surface of cover plate 4 is provided with circuit board 4-3, and the bottom of polar ring 9 is electrically connected with electret vibrating membrane 8, top is electrically connected with circuit board 4-3.This kind of structure is the structure of electret-type microphone, with reference to Fig. 1, for electret microphone, because its functional part is more, almost takes whole cavity space, and insulation ring wall 22 is for isolating microphone functional unit and cavity inner wall.Elastic metallic gasket ring 5 is set and can be electrically connected base plate copper foil layer 3-2 and electret back plate 6, meanwhile, utilize the elastic force of elastic metallic gasket ring 5, can each parts are pressed against fastening, the reliable of electrical connection can be ensured, parts can be avoided again to loosen.Elastic metallic gasket ring 5 is the pad with the annular of the mating shapes of cavity, and the internal ring wall of this annular gasket upwarps to be formed has heaving of certain elastic deformation amount.
With reference to accompanying drawing, microphone functional unit comprises MEMS vibrating diaphragm 11 and MEMS chip 12, MEMS vibrating diaphragm 11 is arranged on base plate sound hole 30 place, is all electrically connected by gold thread 13 between MEMS vibrating diaphragm 11 with MEMS chip 12, between MEMS chip 12 with base plate copper foil layer 3-2.This kind of structure is the structure of MEMS microphone, the functional part of MEMS microphone is installed on base plate 3, base plate 3 establishes base plate wiring board 3-3, base plate copper foil layer 3-2 is as the binding post of base plate wiring board 3-3, the picking out terminal and can be guided on cover plate 4 by base plate copper foil layer 3-2 and pick out of microphone, also directly can be passed base plate 3 and be formed and pick out terminal.In addition, for MEMS microphone, as shown in Figure 2, cover plate copper foil layer 4-2 can for overlaying on the structure on whole cover plate 2 bottom surface, and it surrounds the protective cover with electromagnetism interference jointly with metallic inner wall 21 and conductive adhesive film 1, can carry out effective electromagnetic shielding.
In addition, for MEMS microphone, if process conditions allow, it also can establish insulation ring wall 22, that is: metallic inner wall 21 is also coated with the insulation ring wall 22 formed by insulating material; Microphone functional unit comprises MEMS vibrating diaphragm 11 and MEMS chip 12, MEMS vibrating diaphragm 11 is arranged on base plate sound hole 30 place, is all electrically connected by gold thread 13 between MEMS vibrating diaphragm 11 with MEMS chip 12, between MEMS chip 12 with base plate copper foil layer 3-2.Under this kind of structure, insulation ring wall 22 can be avoided gold thread 13 to touch metallic inner wall 21 and affect electrical connection, ensures the reliability of electrical connection.
In sum, the invention is not restricted to above-mentioned embodiment.Those skilled in the art, under the premise without departing from the spirit and scope of the present invention, can do some changes and modification.Protection scope of the present invention should be as the criterion with claim of the present invention.
Claims (10)
1. a microphone package technique, is characterized in that comprising the following steps:
Step one, chooses conductive adhesive film (1), and conductive adhesive film (1) sets out multiple perforate (10) with needing the cavity geometry of the microphone encapsulated to match;
Step 2, chooses intermediate plate (2), and intermediate plate (2) comprises intermediate plate base material (2-1) and overlays on the intermediate plate copper foil layer (2-2) on intermediate plate base material (2-1) two sides; Formed with the intermediate plate through hole (20) needing the cavity geometry of the microphone encapsulated to match in the upper boring of intermediate plate (2) and the inwall of intermediate plate through hole (20) is made metalized, the inwall of intermediate plate through hole (20) is formed after metalized can the metallic inner wall (21) of the above-mentioned two-layer intermediate plate copper foil layer (2-2) of conducting;
Step 3, conductive adhesive film (1) of fitting respectively in two faces of intermediate plate (2); The perforate (10) of conductive adhesive film (1) is corresponding with the position of intermediate plate through hole (20);
Step 4, base plate (3) that the wherein one side of intermediate plate (2) is fitted, forms multiple open-topped cavity body structure; Base plate (3) has can and the base plate copper foil layer (3-2) that be electrically connected bonding with intermediate plate (2) and base plate (3) has the base plate sound hole (30) corresponding with above-mentioned each cavity;
Step 5, is respectively charged into microphone functional unit in the multiple cavitys formed in step 4;
Step 6, pressing cover plate (4) on intermediate plate (2) another side; Cover plate (4) has can and the cover plate copper foil layer (4-2) that be electrically connected bonding with intermediate plate;
Step 7, is divided into multiple microphone unit by the disjunctor plate with multiple microphone construction unit completed in step one to step 6.
2. microphone package technique as claimed in claim 1, it is characterized in that the laminating in step 3 and step 4 and the pressing in step 6 complete by Heat sealer, the temperature of fitting in step 3 and step 4 is 120-170 DEG C, pressure is 0.4-9.0Mpa, the time is 1-10Min, and the temperature of pressing in step 6 is 150-210 DEG C, pressure is 1-14Mpa, the time is 20-60Min.
3. microphone package technique as claimed in claim 1, is characterized in that the segmentation in step 7 uses Water Cutting or dry type cutting machine.
4. the microphone package technique as described in claim 1 or 2 or 3, is characterized in that being also included in metallic inner wall (21) upper spraying one deck insulating material in step 2 forms insulation ring wall (22); Microphone functional unit in step 5 comprises the elastic metallic gasket ring (5), electret back plate (6), insulation spacer (7), electret vibrating membrane (8) and the polar ring (9) that load successively, cover plate (4) has the circuit board (4-3) that can be electrically connected with polar ring.
5. the microphone package technique as described in claim 1 or 2 or 3, it is characterized in that the microphone functional unit in step 5 comprises MEMS vibrating diaphragm (11) and MEMS chip (12), by gold thread (13), each function element and function element are electrically connected with base plate copper foil layer (3-2).
6. the microphone package technique as described in claim 1 or 2 or 3, is characterized in that being also included in metallic inner wall (21) upper spraying one deck insulating material in step 2 forms insulation ring wall (22); Microphone functional unit in step 5 comprises MEMS vibrating diaphragm (11) and MEMS chip (12), each function element and function element is electrically connected with base plate copper foil layer (3-2) by gold thread (13).
7. a microphone package, it is characterized in that comprising supreme base plate bonding successively (3), intermediate plate (2) and cover plate (4) end of from, intermediate plate (2), for offering the hollow structure of intermediate plate through hole (20), installs microphone functional unit in intermediate plate through hole (20); Intermediate plate (2) comprises intermediate plate base material (2-1) and overlays on the intermediate plate copper foil layer (2-2) on intermediate plate base material (2-1) two faces, and the inwall of described intermediate plate through hole (20) is provided with the metallic inner wall (21) that one deck can be electrically connected above-mentioned two intermediate plate copper foil layers (2-2); The end face of base plate (3) is provided with base plate copper foil layer (3-2), base plate (3) offers base plate sound hole (30); The bottom surface of cover plate (4) is provided with cover plate copper foil layer (4-2); Between base plate copper foil layer (3-2) and the intermediate plate copper foil layer (2-2) on intermediate plate (2) bottom surface, that cover plate copper foil layer (4-2) and the intermediate plate copper foil layer (2-2) on intermediate plate end face all carry out pressing by conductive adhesive film (1) is bonding, conductive adhesive film (1) offers the perforate (10) corresponding with described intermediate plate through hole (20).
8. microphone package as claimed in claim 7, is characterized in that described metallic inner wall (21) being also coated with insulating material and forms insulation ring wall (22); Described microphone functional unit comprises supreme elastic metallic gasket ring (5), electret back plate (6), insulation spacer (7), electret vibrating membrane (8) and the polar ring (9) the set gradually end of from, electret back plate (6) is electrically connected by elastic metallic gasket ring (5) with base plate copper foil layer (3-2), the bottom surface of described cover plate (4) is provided with circuit board (4-3), and the bottom of polar ring (9) is electrically connected with electret vibrating membrane (8), top is electrically connected with circuit board (4-3).
9. microphone package as claimed in claim 7, it is characterized in that described microphone functional unit comprises MEMS vibrating diaphragm (11) and MEMS chip (12), MEMS vibrating diaphragm (11) is arranged on base plate sound hole (30) place, is all electrically connected by gold thread (13) between MEMS vibrating diaphragm (11) with MEMS chip (12), between MEMS chip (12) with base plate copper foil layer (3-2).
10. microphone package as claimed in claim 7, is characterized in that described metallic inner wall (21) being also coated with the insulation ring wall (22) formed by insulating material; Described microphone functional unit comprises MEMS vibrating diaphragm (11) and MEMS chip (12), MEMS vibrating diaphragm (11) is arranged on base plate sound hole (30) place, is all electrically connected by gold thread (13) between MEMS vibrating diaphragm (11) with MEMS chip (12), between MEMS chip (12) with base plate copper foil layer (3-2).
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| CN201210557327.XA CN103139694B (en) | 2012-12-20 | 2012-12-20 | Microphone package technology and package structure according to technology |
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| CN201210557327.XA CN103139694B (en) | 2012-12-20 | 2012-12-20 | Microphone package technology and package structure according to technology |
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| CN103139694B true CN103139694B (en) | 2015-07-08 |
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| DE102013014526B4 (en) * | 2013-09-03 | 2021-08-05 | Peiker Acustic Gmbh & Co. Kg | Electronics unit for a microphone unit, microphone unit and method for producing a microphone unit |
| CN104219612B (en) * | 2014-09-29 | 2019-06-28 | 山东共达电声股份有限公司 | A kind of advance sound MEMS microphone |
| JP6597053B2 (en) * | 2015-08-24 | 2019-10-30 | ヤマハ株式会社 | Sound emission and collection device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360352A (en) * | 2008-08-27 | 2009-02-04 | 歌尔声学股份有限公司 | Miniature microphone having shielding construction and manufacturing method for circuit board frame |
| WO2010047056A1 (en) * | 2008-10-23 | 2010-04-29 | スター精密株式会社 | Method of manufacturing microphone and microphone |
| CN202979275U (en) * | 2012-12-20 | 2013-06-05 | 山东共达电声股份有限公司 | Encapsulation structure of microphone |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360352A (en) * | 2008-08-27 | 2009-02-04 | 歌尔声学股份有限公司 | Miniature microphone having shielding construction and manufacturing method for circuit board frame |
| WO2010047056A1 (en) * | 2008-10-23 | 2010-04-29 | スター精密株式会社 | Method of manufacturing microphone and microphone |
| CN202979275U (en) * | 2012-12-20 | 2013-06-05 | 山东共达电声股份有限公司 | Encapsulation structure of microphone |
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Address after: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee after: Gongda Electroacoustics Co., Ltd. Address before: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee before: Shandong Gettop Acoustic Co.,Ltd. |