CN102387456A - Midget microphone and manufacturing method thereof - Google Patents
Midget microphone and manufacturing method thereof Download PDFInfo
- Publication number
- CN102387456A CN102387456A CN2011103417516A CN201110341751A CN102387456A CN 102387456 A CN102387456 A CN 102387456A CN 2011103417516 A CN2011103417516 A CN 2011103417516A CN 201110341751 A CN201110341751 A CN 201110341751A CN 102387456 A CN102387456 A CN 102387456A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- thin film
- piezo
- electret thin
- electric electret
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 241000519996 Teucrium chamaedrys Species 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000010409 thin film Substances 0.000 claims abstract description 58
- 229920006254 polymer film Polymers 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000003032 molecular docking Methods 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000010923 batch production Methods 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Landscapes
- Piezo-Electric Transducers For Audible Bands (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a midget microphone, which comprises a circuit board, a piezoelectric electret thin film, an electronic component, output soldering-pans and a covering shell, wherein the electronic component and the output soldering-pans are arranged on and connected to the circuit board; the piezoelectric electret thin film is attached to the circuit board; the covering shell is covered outside the circuit board; and at least one side of the piezoelectric electret thin film is provided with a sound inlet, so that the relatively thinner piezoelectric midget microphone is formed. The invention also provides a manufacturing method for the midget microphone. The midget microphone is simple in manufacture and suitable for batch production.
Description
[technical field]
The present invention relates to the microphone field, particularly a kind of midget microphone and manufacturing approach thereof.
[background technology]
Midget microphone has broad application prospects in civilian and national defence (intercept like active control, battlefield investigation net, the safety of mobile phone, audition equipment, robot language identification, noise and vibration etc.) field.Midget microphone adopts capacitance type structure mostly, like electret capcitor microphone and mems microphone.This kind capacitance type structure needs a very big back operatic tunes, thereby dwindling of overall dimensions is restricted, and under the microminiaturized trend of portable set, its size has reached a limit, has been difficult to satisfy application requirements.
[summary of the invention]
Based on this, be necessary to provide a kind of piezoelectric type midget microphone and manufacturing approach thereof of thinner thickness.
A kind of midget microphone; Said midget microphone comprises wiring board, piezo-electric electret thin film, electronic devices and components, o pads and shielding casing; Said electronic devices and components and o pads setting are connected on the wiring board; Said piezo-electric electret thin film is mounted on the wiring board, and said shielding casing is covered in the outside of wiring board, and at least one side of said piezo-electric electret thin film is provided with the entering tone mouth.
Preferably, said piezo-electric electret thin film is a multilayer, and its size is identical and range upon range of bonding and be together in series, and each lamination electroelectret film comprises porous polymer film and the metal electrode that is plated on the porous polymer film two sides.
Preferably; Said entering tone mouth comprises first entering tone mouth of the corresponding piezo-electric electret thin film setting of said shielding casing and/or the second entering tone mouth that the corresponding piezo-electric electret thin film of said wiring board is provided with, and said piezo-electric electret thin film is exposed to the external world through the first entering tone mouth and/or the second entering tone mouth.
Preferably, said wiring board is printed circuit board (PCB), flexible PCB or printed circuit board (PCB) and the combining of flexible PCB, and it is outer and form the docking section that an end of said wiring board extends shielding casing, and said o pads is arranged on the docking section.
Preferably, said wiring board comprises positive reaching and the positive back side that is oppositely arranged, and said piezo-electric electret thin film and electronic devices and components are arranged at the front, and the said back side is bonded with double faced adhesive tape.
Preferably, said wiring board is that multilayer board is range upon range of or for the thicker printed circuit board (PCB) of one deck, and groove is set, and said electronic devices and components are arranged in the groove.
Preferably, said shielding casing adopts the compression joint type encapsulation technology to be packaged in the outside of wiring board.
The manufacturing approach of midget microphone is provided in addition:
A kind of manufacturing approach of midget microphone, it comprises the steps:
Wiring board is provided, it comprise the front and with positive opposing backside surface, said front is provided with electric connection point, said front/back is provided with o pads;
Electronic devices and components are provided, are arranged at the front of wiring board, and electrically connect with electric connection point on the front;
Piezo-electric electret thin film is provided, is mounted on the front of wiring board, and electrically connect with electric connection point on the front;
Shielding casing is provided, the wiring board that assembles is packed in the shielding casing;
Shielding casing is encapsulated through modes such as roll extrusion, punching press or flangings, and at least one side of said piezo-electric electret thin film is provided with the entering tone mouth.
Preferably, said piezo-electric electret thin film is a multilayer, and its size is identical and range upon range of bonding and be together in series, and said wiring board is printed circuit board (PCB), flexible PCB or printed circuit board (PCB) and the combining of flexible PCB.
Preferably, said wiring board is a printed circuit board (PCB), and the front of said wiring board is provided with groove, and said electronic devices and components are arranged in the groove.
The beneficial effect of above-mentioned midget microphone and manufacturing approach thereof is: said piezo-electric electret thin film is mounted on the wiring board; Said shielding casing is covered in the outside of wiring board; At least one side of said piezo-electric electret thin film is provided with the entering tone mouth; Thereby form the piezoelectric type midget microphone of thinner thickness, and it makes simply suitable production in enormous quantities the in enormous quantities.
[description of drawings]
Fig. 1 is the structural representation of midget microphone first execution mode;
Fig. 2 is the structural representation of midget microphone piezo-electric electret thin film first embodiment;
Fig. 3 is the structural representation of midget microphone piezo-electric electret thin film second embodiment;
Fig. 4 is the structural representation of midget microphone piezo-electric electret thin film the 3rd embodiment;
Fig. 5 is the structural representation of second embodiment of midget microphone entering tone mouth;
Fig. 6 is the structural representation of the 3rd embodiment of midget microphone entering tone mouth;
Fig. 7 is the structural representation of another embodiment of midget microphone o pads;
Fig. 8 is the structural representation of second embodiment of midget microphone electronic devices and components;
Fig. 9 is the structural representation of the 3rd embodiment of midget microphone electronic devices and components;
Figure 10 A to Figure 10 E is the structural representation of midget microphone manufacturing process.
[embodiment]
Please join Fig. 1, this execution mode discloses a kind of midget microphone 100.Said midget microphone 100 comprises wiring board 110, piezo-electric electret thin film 120, electronic devices and components 130, o pads 140 and shielding casing 150.Said electronic devices and components 130 and o pads 140 are provided with and are connected on the wiring board 110; Said piezo-electric electret thin film is mounted on the wiring board 110; Said shielding casing 150 is covered in the outside of wiring board 110, and at least one side of said piezo-electric electret thin film 120 is provided with the entering tone mouth.
Said piezo-electric electret thin film 120 comprises porous polymer film 121 and the metal electrode 122 that is plated on porous polymer film 121 two sides.Said piezo-electric electret thin film 120 is as the piezoelectricity converting unit; Be used to realize the acoustic-electric conversion; Concrete operation principle is: through the high voltage polarization to porous polymer film 121; Make the hole upper and lower surfaces of porous polymer film 121 deposit positive and negative charge respectively, form electric dipole, show certain eelctric dipole distance; On the metal electrode 122 of porous polymer film 121 both sides, produce compensation charge afterwards; Internal electric field with balance porous polymer film 121; The quantity of compensation charge is relevant with the size of unit volume eelctric dipole distance in the porous polymer film 121, forms piezo-electric electret thin film 120 with this; When the pressure of sound wave is under the acoustic pressure effect; Hole in the piezo-electric electret thin film 120 changes, and the size of electric dipole changes in the hole, and the eelctric dipole in the unit volume is apart from changing; Accordingly; Compensation charge in the metal electrode 122 also changes thereupon, thereby changes interelectrode voltage, thereby realizes the acoustic-electric conversion.
Please join Fig. 2, said piezo-electric electret thin film 120 is an individual layer.Please join Fig. 3 and Fig. 4, said piezo-electric electret thin film is a multilayer, and its size is identical and range upon range of bonding and be together in series, and each lamination electroelectret film comprises porous polymer film and the metal electrode that is plated on the porous polymer film two sides.Wherein shown in Figure 3 is that two-layer piezo-electric electret thin film is stacked together; Shown in Figure 4 is that three lamination electroelectret films 120 are stacked together.Form electrical connection in the multi-layer piezoelectric electret film 120 between the aspectant metal electrode 122, thereby form the series connection of the signal of telecommunication, can improve the intensity of output signal, promote the sensitivity of midget microphone 100.Certainly, said piezo-electric electret thin film 120 is not limited to above-mentioned three kinds of execution modes, can be any number of plies, mainly selects according to requirements such as structure, sensitivity and technologies.
Please join Fig. 1, Fig. 5 and Fig. 6; Said entering tone mouth comprises that the first entering tone mouth 151 and/or said wiring board 110 corresponding piezo-electric electret thin films 120 that said shielding casing 150 corresponding piezo-electric electret thin films 120 are provided with are provided with the second entering tone mouth 111, and said piezo-electric electret thin film 120 is exposed to the external world through the first entering tone mouth 151 and/or the second entering tone mouth 111.Specifically; Said entering tone mouth has following several kinds of set-up modes: first kind of mode is as shown in Figure 1; Said entering tone mouth is the first entering tone mouth 151 that is distributed in piezo-electric electret thin film 120 1 sides, and sound wave acts on the piezo-electric electret thin film 120 to realize the acoustic-electric conversion through the first entering tone mouth 151; The second way is as shown in Figure 5, and said entering tone mouth is the second entering tone mouth 111 that is distributed in piezo-electric electret thin film 120 opposite sides, and sound wave acts on the piezo-electric electret thin film 120 to realize the acoustic-electric conversion through the second entering tone mouth 111; The third mode is as shown in Figure 6, and the entering tone mouth comprises the first entering tone mouth 151 and the second entering tone mouth 111 that is distributed in piezo-electric electret thin film 120 both sides.Certainly; The position of said entering tone mouth is mainly according to the rear end of midget microphone 100 (other electronic components that electrically connect with midget microphone 100; Not shown) should be used for fixed; So that the rear end structure Design can be adjusted the frequency response curve that midget microphone 100 is exported according to the size that changes the entering tone mouth and the degree of depth simultaneously.
As shown in Figure 1, said wiring board 110 is printed circuit board (PCB), flexible PCB or printed circuit board (PCB) and the combining of flexible PCB.Said wiring board 110 comprise positive 112 and with positive opposing backside surface 113.Said piezo-electric electret thin film 120 all is arranged at positive 112 with electronic devices and components 130.Said o pads 140 is distributed in the back side 113, to realize the electric connection of midget microphone 100 and its rear end.Certainly; The distribution of o pads 140 can also be other modes, and is as shown in Figure 7, and an end of said wiring board 110 extends outside the shielding casing 150 and formation docking section 114; Said o pads 140 is arranged on the docking section 114; The public head that this moment, said docking section 114 was a midget microphone 100 can directly plug with the rear end, thereby makes things convenient for the application of rear end.At this moment, a double faced adhesive tape 160 can be set, with fixing of convenient and rear end at the back side of wiring board 110.
When wiring board 110 is printed circuit board (PCB); Said electronic devices and components 130 can also be provided with like Fig. 8 and mode shown in Figure 9; Wherein said wiring board 110 is that multilayer board is range upon range of or for the thicker printed circuit board (PCB) of one deck; And groove 115 is set, said electronic devices and components 130 are arranged in the groove 115.So, can partly get out of the way the height of electronic devices and components 130 at least, realize the further slimming of midget microphone 100.Wherein among Fig. 9, the width that equals wiring board 110 basically that the width of piezo-electric electret thin film 120 can be provided with.
Said shielding casing 150 adopts the compression joint type encapsulation technology to be packaged in the outside of wiring board 110, also promptly encapsulates through modes such as roll extrusion, punching press or flangings.This kind packaged type need not high temperature, thereby reduces the influence of high temperature to piezo-electric electret thin film 120 Charge Storage Stability.Said electronic devices and components 130 are integrated circuit and capacitance resistance etc.
Please join Figure 10 A to Figure 10 E, be the manufacturing step of midget microphone 100, concrete steps are following:
Please join Figure 10 A, wiring board 110 is provided, it comprise positive 112 and with positive 112 opposing backside surface 113, said positive 112 are provided with electric connection point, said positive 112/ back side 113 is provided with o pads;
Please join Figure 10 B, electronic devices and components 130 are provided, be arranged at the front 112 of wiring board 110, and electrically connect with electric connection point on positive 112;
Please join Figure 10 C, piezo-electric electret thin film 120 is provided, be mounted on the front 112 of wiring board 110, and electrically connect with electric connection point on positive 112, said piezo-electric electret thin film 120 is as the piezoelectricity converting unit of midget microphone;
Please join Figure 10 D, shielding casing 150 is provided, the wiring board that assembles 110 is packed in the shielding casing 150.Said shielding casing 150 can be copper alloy, aluminium alloy or stainless steel etc., can form shielding and prevents external electromagnetic interference.In addition, for the ease of follow-up edge sealing, shielding casing 150 can be provided with breach (not shown) at four angles.
Please join Figure 10 E, shielding casing 150 is encapsulated through modes such as roll extrusion, punching press or flangings, and at least one side of said piezo-electric electret thin film 120 be provided with the entering tone mouth.
Said piezo-electric electret thin film 120 is a multilayer; Its size is identical and range upon range of bonding and be together in series; Said wiring board 110 is printed circuit board (PCB), flexible PCB or printed circuit board (PCB) and the combining of flexible PCB, and said electronic devices and components 130 are integrated circuit and capacitance resistance etc.
Said wiring board 110 is a printed circuit board (PCB), and the front of said wiring board is provided with groove 115, and said electronic devices and components 130 are arranged in the groove 115.
The thickness of individual layer porous polymer film 121 is generally tens microns; The metal electrode 122 of its surface plating can not surpass the hundreds of nanometer usually; Therefore the thickness of individual piezo-electric electret thin film 120 parts is tens between the hundreds of micron, the thickness of the chip (not shown) that often connects less than the rear end.The design need not the back operatic tunes, and the thickness of midget microphone 100 final packaging depends on the thickness of Chip Packaging like this, and therefore, can accomplishing of midget microphone 100 is ultra-thin, can accomplish 0.6 millimeter like the thickness after the overall package, far is thinner than traditional microphone.Simultaneously, the weight of midget microphone 100 is generally tens milligrams, and is very light.
The design's midget microphone 100 utilizes piezo-electric electret thin film 120 to form the piezoelectric type midget microphone of thinner thickness for the acoustic-electric converting unit; Its simple in structure, convenient production in enormous quantities and packaging cost are cheap; And aspect material property, have ultra-thin and ultra-light, advantage such as nontoxic, with low cost, can produce the midget microphone that has than minimal thickness, break through the dimension limit of conventional condenser microphone; Satisfy the requirement further microminiaturized of present portable product to size; And manufacturing approach is simple, and is with low cost, is fit to large batch of production application.
The above embodiment has only expressed several kinds of execution modes of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the present invention's design, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with accompanying claims.
Claims (10)
1. midget microphone; It is characterized in that: said midget microphone comprises wiring board, piezo-electric electret thin film, electronic devices and components, o pads and shielding casing; Said electronic devices and components and o pads setting are connected on the wiring board; Said piezo-electric electret thin film is mounted on the wiring board, and said shielding casing is covered in the outside of wiring board, and at least one side of said piezo-electric electret thin film is provided with the entering tone mouth.
2. midget microphone according to claim 1; It is characterized in that: said piezo-electric electret thin film is a multilayer; Its size is identical and range upon range of bonding and be together in series, and each lamination electroelectret film comprises porous polymer film and the metal electrode that is plated on the porous polymer film two sides.
3. midget microphone according to claim 1 and 2; It is characterized in that: said entering tone mouth comprises first entering tone mouth of the corresponding piezo-electric electret thin film setting of said shielding casing and/or the second entering tone mouth that the corresponding piezo-electric electret thin film of said wiring board is provided with, and said piezo-electric electret thin film is exposed to the external world through the first entering tone mouth and/or the second entering tone mouth.
4. midget microphone according to claim 1 and 2; It is characterized in that: said wiring board is printed circuit board (PCB), flexible PCB or printed circuit board (PCB) and the combining of flexible PCB; One end of said wiring board extends outside the shielding casing and formation docking section, and said o pads is arranged on the docking section.
5. midget microphone according to claim 4 is characterized in that: said wiring board comprises positive reaching and the positive back side that is oppositely arranged, and said piezo-electric electret thin film and electronic devices and components are arranged at the front, and the said back side is bonded with double faced adhesive tape.
6. midget microphone according to claim 1 and 2 is characterized in that: said wiring board is that multilayer board is range upon range of or for the thicker printed circuit board (PCB) of one deck, and groove is set, and said electronic devices and components are arranged in the groove.
7. midget microphone according to claim 1 and 2 is characterized in that: said shielding casing adopts the compression joint type encapsulation technology to be packaged in the outside of wiring board.
8. the manufacturing approach of a midget microphone is characterized in that, comprises the steps:
Wiring board is provided, it comprise the front and with positive opposing backside surface, said front is provided with electric connection point, said front/back is provided with o pads;
Electronic devices and components are provided, are arranged at the front of wiring board, and electrically connect with electric connection point on the front;
Piezo-electric electret thin film is provided, is mounted on the front of wiring board, and electrically connect with electric connection point on the front;
Shielding casing is provided, the wiring board that assembles is packed in the shielding casing;
Shielding casing is encapsulated through modes such as roll extrusion, punching press or flangings, and at least one side of said piezo-electric electret thin film is provided with the entering tone mouth.
9. midget microphone according to claim 8; It is characterized in that: said piezo-electric electret thin film is a multilayer; Its size is identical and range upon range of bonding and be together in series, and said wiring board is printed circuit board (PCB), flexible PCB or printed circuit board (PCB) and the combining of flexible PCB.
10. according to Claim 8 or 9 described midget microphones, it is characterized in that: said wiring board is a printed circuit board (PCB), and the front of said wiring board is provided with groove, and said electronic devices and components are arranged in the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103417516A CN102387456A (en) | 2011-11-02 | 2011-11-02 | Midget microphone and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103417516A CN102387456A (en) | 2011-11-02 | 2011-11-02 | Midget microphone and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102387456A true CN102387456A (en) | 2012-03-21 |
Family
ID=45826315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103417516A Pending CN102387456A (en) | 2011-11-02 | 2011-11-02 | Midget microphone and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102387456A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938871A (en) * | 2012-10-31 | 2013-02-20 | 深圳市豪恩声学股份有限公司 | Piezoelectric electret microphone and piezoelectric electret film thereof |
| CN107275473A (en) * | 2012-11-29 | 2017-10-20 | 罗伯特·博世有限公司 | The electrode and the converter of at least one ferroelectret of electrode, Second Type with least one first kind |
| CN110100451A (en) * | 2017-02-08 | 2019-08-06 | 日本航空电子工业株式会社 | Film surface sound receiving type sound sensor module |
| CN110719557A (en) * | 2019-11-04 | 2020-01-21 | 中国人民解放军军事科学院防化研究院 | Nonlinear correction microphone |
| CN113853804A (en) * | 2019-06-13 | 2021-12-28 | 悠声股份有限公司 | Microelectromechanical acoustic transducer with polymer coating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201114759Y (en) * | 2007-09-17 | 2008-09-10 | 深圳市豪恩电声科技有限公司 | A voltage electrical microphone and sound-electrical converter |
| CN201197186Y (en) * | 2008-04-30 | 2009-02-18 | 深圳市豪恩电声科技有限公司 | Ultra-thin piezoelectric microphone |
| CN102026084A (en) * | 2010-12-15 | 2011-04-20 | 深圳市豪恩声学股份有限公司 | Manufacturing method of electret condenser microphone |
-
2011
- 2011-11-02 CN CN2011103417516A patent/CN102387456A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201114759Y (en) * | 2007-09-17 | 2008-09-10 | 深圳市豪恩电声科技有限公司 | A voltage electrical microphone and sound-electrical converter |
| CN201197186Y (en) * | 2008-04-30 | 2009-02-18 | 深圳市豪恩电声科技有限公司 | Ultra-thin piezoelectric microphone |
| CN102026084A (en) * | 2010-12-15 | 2011-04-20 | 深圳市豪恩声学股份有限公司 | Manufacturing method of electret condenser microphone |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938871A (en) * | 2012-10-31 | 2013-02-20 | 深圳市豪恩声学股份有限公司 | Piezoelectric electret microphone and piezoelectric electret film thereof |
| CN107275473A (en) * | 2012-11-29 | 2017-10-20 | 罗伯特·博世有限公司 | The electrode and the converter of at least one ferroelectret of electrode, Second Type with least one first kind |
| CN107275473B (en) * | 2012-11-29 | 2019-12-31 | 罗伯特·博世有限公司 | Transducer having at least one electrode of a first type, an electrode of a second type and at least one ferroelectret |
| CN110100451A (en) * | 2017-02-08 | 2019-08-06 | 日本航空电子工业株式会社 | Film surface sound receiving type sound sensor module |
| CN110100451B (en) * | 2017-02-08 | 2020-09-01 | 日本航空电子工业株式会社 | Membrane sound receiving sound sensor module |
| US11044563B2 (en) | 2017-02-08 | 2021-06-22 | Japan Aviation Electronics Industry, Limited | Film surface sound receiving type sound sensor module |
| CN113853804A (en) * | 2019-06-13 | 2021-12-28 | 悠声股份有限公司 | Microelectromechanical acoustic transducer with polymer coating |
| CN110719557A (en) * | 2019-11-04 | 2020-01-21 | 中国人民解放军军事科学院防化研究院 | Nonlinear correction microphone |
| CN110719557B (en) * | 2019-11-04 | 2021-03-05 | 中国人民解放军军事科学院防化研究院 | Nonlinear correction microphone |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20170064458A1 (en) | Mems microphone package structure having a non-planar substrate | |
| US9002040B2 (en) | Packages and methods for packaging MEMS microphone devices | |
| US20180146302A1 (en) | Mems microphone package structure and method for manufacturing the mems microphone package structures | |
| US8995694B2 (en) | Embedded circuit in a MEMS device | |
| CN102318365B (en) | Microphone unit | |
| CN206100450U (en) | A package structure of MEMS microphone | |
| CN201114761Y (en) | Dustproof silicon microphone | |
| ITTO20091036A1 (en) | MICROELETTROMECHANICAL TRANSDUCER AND RELATIVE ASSEMBLY PROCEDURE | |
| CN101588528B (en) | Novel acoustical-electrical converter and microphone | |
| US9120668B2 (en) | Microphone package and mounting structure thereof | |
| CN101237719A (en) | A silicon capacitance microphone and its making method | |
| CN102387456A (en) | Midget microphone and manufacturing method thereof | |
| US20150146888A1 (en) | Mems microphone package and method of manufacturing the same | |
| CN104219609A (en) | Piezoelectric sound production structure and mobile terminal | |
| CN201138866Y (en) | Silicon microphone with improved structure | |
| JP2007043327A (en) | Condenser microphone | |
| CN110856090A (en) | Novel anti-radio frequency interference micro-electro-mechanical system microphone structure | |
| KR20150058467A (en) | The circuit embedded in the MEMS device | |
| CN102118674B (en) | A kind of MEMS microphone and method for packing thereof | |
| CN104394496A (en) | Small-size, high-sensitivity and high signal-to-noise ratio MEMS (Micro-electromechanical Systems) silicon microphone | |
| CN205622875U (en) | MEMS microphone | |
| CN101150886A (en) | Packaging structure and packaging method of micro-electromechanical microphone | |
| CN201682615U (en) | Capacitive microphone | |
| US20080025532A1 (en) | Microphone case and condenser microphone | |
| CN201114759Y (en) | A voltage electrical microphone and sound-electrical converter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120321 |