CN103105084B - Composition structure of heat pipe and its capillary structure - Google Patents

Abstract

The invention relates to a heat pipe and a composition structure of a capillary structure thereof, wherein the heat pipe comprises a heat pipe body, the capillary structure and a working fluid, the heat pipe body is provided with an inner wall surface, the capillary structure is combined on the inner wall surface, the capillary structure comprises 30 weight percent of first capillary powder and 70 weight percent of second capillary powder, the particle size of the first capillary powder is smaller than that of the second capillary powder, and the working fluid is filled in the heat pipe body, wherein the first capillary powder and the second capillary powder are uniformly mixed and sintered on the inner wall surface of the heat pipe, so that the heat pipe can achieve the maximum working efficiency to quickly remove heat energy generated by an electronic element.

Description

Composition structure of heat pipe and its capillary structure

technical field

The present invention relates to heat pipe structure, in particular to a capillary structure of heat pipe.

Background technique

A general heat pipe is composed of a copper tube, a capillary wick, and a working fluid sealed in the tube. Its use method is to attach the heated end of the heat pipe to the surface of the heating electronic component. When the working fluid inside the heated end absorbs heat and vaporizes, the vapor pressure will gradually increase and flow toward the cooling end with low pressure to form a steam flow; On the other hand, when the steam releases heat at the cooling end, it will recondense into a liquid form, and then flow back to the heating end through the capillary tissue, and the heat energy generated by the electronic components will be rapidly dissipated through the repeated action of the working fluid inside the heat pipe. remove.

However, since today's electronic devices are required to be thinner and lighter for portability, the heat pipes used for heat dissipation also need to be thinner and lighter. research motivation.

As mentioned above, since the working performance of the heat pipe will be affected by the two factors of capillary pressure difference and reflux resistance, these two factors change with the pore size of the capillary structure. When the pores are small, the capillary pressure difference is large, which can drive the condensed liquid However, when the capillary pores are small, the frictional force and viscous force of the working liquid backflow increase, that is, the working liquid backflow resistance increases, resulting in a slow backflow of the working liquid, which is easy to cause the heat pipe to Dry burning phenomenon occurs at the evaporating end; similarly, when the capillary pores are large, although the working liquid is subject to small backflow resistance, the capillary pressure difference of the condensed liquid sucked into the capillary structure is reduced, reducing the return flow of the working liquid, and also making the The heat pipe is dry-burned at the evaporation end.

Contents of the invention

An object of the present invention is to provide a capillary structure of the heat pipe, which can maximize the working efficiency of the heat pipe and quickly remove the heat energy generated by the electronic components.

In order to achieve the above-mentioned purpose, the present invention is a composition structure of heat pipe capillary structure, including a first capillary powder and a second capillary powder, the particle size of the first capillary powder is below 100 mesh, and the first capillary powder accounts for about 100 meshes. 30% by weight of the tissue, the particle size of the second capillary powder is between 80 mesh and 100 mesh, and the second capillary powder accounts for about 70% by weight of the capillary tissue, wherein the first capillary powder and the second capillary powder are uniformly mixed, And sintered on the inner wall of the heat pipe.

In order to achieve the above object, the present invention is a heat pipe capillary structure, comprising 30% by weight of the first capillary powder and 70% by weight of the second capillary powder, the particle size of the first capillary powder is smaller than that of the second capillary powder The first capillary powder and the second capillary powder are uniformly mixed and sintered on the inner wall of the heat pipe.

In order to achieve the above object, the present invention is a heat pipe, including a heat pipe body, capillary tissue and working fluid, the heat pipe body has an inner wall surface, the capillary structure is combined with the inner wall surface, and the capillary structure contains 30% by weight of the first capillary powder and 70% by weight of the second capillary powder, the particle size of the first capillary powder is smaller than that of the second capillary powder, and the first capillary powder and the second capillary powder are evenly mixed and sintered on the inner wall of the heat pipe, and the working fluid is filled Inside the heat pipe body and penetrates between the capillaries.

Another object of the present invention is to provide a composition structure of the heat pipe capillary structure, the first capillary powder accounts for about 30 weight percent of the capillary structure, and the second capillary powder particle size is about 70 weight percent, according to this ratio, can Under the most economical cost consideration, the heat pipe can achieve the best working performance.

Compared with the known technology, the capillary structure of the present invention comprises the first capillary powder (fine powder) and the second capillary powder (coarse powder), according to a certain particle size and weight percentage (the first capillary powder and the first capillary powder of 30 weight percent 70% by weight of the second capillary powder) uniformly mixed, under this ratio, an appropriate pore size can be formed between the first capillary powder and the second capillary powder to obtain under the two factors of capillary pressure and reflux resistance A better balance makes the working fluid (heat pipe) reach the best work performance; moreover, because the work performance of the heat pipe is not proportional to the weight percentage of the second capillary powder, when the weight percentage of the second capillary powder is higher than 70 When the weight percentage is increased, the working efficiency of the heat pipe does not increase with the increase of the weight percentage of the second capillary powder, but instead increases the cost of the heat pipe. Therefore, the present invention can make the heat pipe achieve the best work under the most economical cost considerations. efficacy.

Description of drawings

Fig. 1 is the sectional view of heat pipe of the present invention;

Fig. 2 is the enlarged schematic diagram of capillary structure of the present invention;

FIG. 3 is a comparison diagram of the heat dissipation effect of the heat pipe of the present invention and other heat pipes.

Description of main component symbols:

1 heat pipe

10 Heat pipe body 11 Inner wall surface 20 Capillary structure 21 First capillary powder

22 Second capillary powder 30 Working fluid.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.

Please refer to FIG. 1 and FIG. 2 , which are respectively a cross-sectional view of the heat pipe of the present invention and an enlarged schematic view of the capillary structure; The capillary tissue 20 is combined on the inner wall surface 11 of the heat pipe body 10 , and the working fluid 30 is filled in the heat pipe body 10 .

The heat pipe body 10 is made of a material with good thermal conductivity, such as aluminum, copper, etc., and the inner wall of the heat pipe body 10 is attached with capillary tissue 20, and the working fluid 30 is injected into the heat pipe body 10 and penetrates into the heat pipe body 10. between 20 capillaries.

In this embodiment, the unit of the capillary structure 20 is "mesh" (mesh, sieve mesh, screen mesh), that is, the number of sieve holes per unit area of the sieve, which can also be referred to as "mesh", and the standard sieve is often used in the industry. The mesh indicates the particle size of the powder passing through the standard sieve, and the smaller the mesh, the larger the particle size.

The capillary structure 20 includes a first capillary powder 21 and a second capillary powder 22 . The particle size of the first capillary powder 21 is smaller than that of the second capillary powder 22 . The first capillary powder 21 and the second capillary powder 22 are uniformly mixed and sintered on the inner wall surface 11 of the heat pipe body 10 . Preferably, the capillary structure 20 includes 30% by weight of the first capillary powder 21 and 70% by weight of the second capillary powder 22 .

The compositional structure of the capillary structure 20 will be described in more detail. The particle size of the first capillary powder 10 is below 100 meshes (fine powder), and the first capillary powder 21 accounts for about 30% by weight of the capillary structure 20. In addition, the particle size of the second capillary powder 22 is at 80 Mesh to 100 mesh (coarse powder), the second capillary powder 22 accounts for about 70% by weight of the capillary structure 20 .

The first capillary powder 21 and the second capillary powder 22 are made of the same material. In this embodiment, both the first capillary powder 21 and the second capillary powder 22 are copper powder.

Please continue to refer to Figure 3, which is a comparison diagram of the heat dissipation effect of the heat pipe of the present invention and other heat pipes; in the figure, straight lines A, B, and C represent heat pipe A, heat pipe B, and heat pipe C respectively after heat dissipation for lamps with different wattages. The temperature values obtained, wherein, the heat pipe A, the heat pipe B and the heat pipe C are heat pipes composed of the first capillary powder 21 and the second capillary powder 22 with different weight percentages. The straight line A is the heat pipe A of the present invention, the heat pipe A comprises the first capillary powder 21 and the second capillary powder 22 of 70 weight percent of 30 weight percent; moreover, the heat pipe B comprises the first capillary powder 21 and 45 weight percent 55% by weight of the second capillary powder 22 ; the heat pipe C includes 55% by weight of the first capillary powder 21 and 45% by weight of the second capillary powder 22 .

As can be seen from Fig. 3, the lower lamp temperature measured by the straight line A under the lamps of different wattages shows that the use of the heat pipe A of the present invention can obviously have a better heat dissipation effect, that is, other heat pipes in the same Under certain conditions, the composition structure of the capillary structure 20 of the heat pipe A can achieve the maximum working efficiency.

The above-mentioned embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention. The protection scope of the present invention shall be determined by the claims.

Claims (6)

1. a composition structure of heat pipe capillary structure, is characterized in that, comprises: A first capillary powder, the particle size of which is below 100 meshes, the first capillary powder accounts for about 30% by weight of the capillary structure; and A second capillary powder, the particle size of which is between 80 mesh and 100 mesh, and the second capillary powder accounts for about 70% by weight of the capillary structure; Wherein, the first capillary powder and the second capillary powder are uniformly mixed and sintered on the inner wall of the heat pipe. 2 . The capillary structure of the heat pipe according to claim 1 , wherein the first capillary powder and the second capillary powder are made of the same material. 3 . The capillary structure of the heat pipe according to claim 2 , wherein the first capillary powder and the second capillary powder are copper powder. 4 . 4. A heat pipe, characterized in that, comprising: A heat pipe body having an inner wall surface; A capillary structure combined on the inner wall surface, the capillary structure comprising 30 weight percent of the first capillary powder and 70 weight percent of the second capillary powder, the particle size of the first capillary powder is smaller than the particle size of the second capillary powder, The particle size of the first capillary powder is below 100 mesh, the particle size of the second capillary powder is between 80 mesh and 100 mesh, and the first capillary powder and the second capillary powder are uniformly mixed and sintered on the inner wall; and A working fluid is filled in the heat pipe body and penetrates between the capillaries. 5. The heat pipe according to claim 4, wherein the first capillary powder and the second capillary powder are made of the same material. 6. The heat pipe according to claim 5, wherein the first capillary powder and the second capillary powder are copper powder.