CN103050582A

CN103050582A - Packaging method for light emitting diode with glue wall

Info

Publication number: CN103050582A
Application number: CN2011103058956A
Authority: CN
Inventors: 陈烱勋
Original assignee: JIUJIANG ZHENGZHAN OPTOELECTRONICS CO Ltd
Current assignee: JIUJIANG ZHENGZHAN OPTOELECTRONICS CO Ltd
Priority date: 2011-10-11
Filing date: 2011-10-11
Publication date: 2013-04-17
Also published as: WO2013053195A1

Abstract

The invention discloses a LED packaging method with a glue wall, comprising: disposing at least one LED chip as a light source on a ceramic substrate; disposing a glue wall on the ceramic substrate to surround the LED chip, and the glue wall The height is greater than the height of the LED chip; and the glue is dropped on the LED chip to cover the whole LED chip, and the glue is cured to form an encapsulation glue, which provides protection against moisture and environmental pollutants. The top of the encapsulant has a raised surface that provides light gathering. Therefore, the method of the present invention can use the adhesive wall to adjust the emission angle, and use the convex surface of the encapsulant to replace the need for an additional convex lens, thereby simplifying the overall LED packaging structure and improving the reliability and stability of actual operation.

Description

The LED encapsulation method of tool Jiao Qiang

Technical field

The present invention relates to a kind of LED encapsulation method, especially have to regulate the Jiao Qiang of lighting angle.

Background technology

Light-emitting diode (LED) has high-luminous-efficiency and energy-conservation advantage, therefore progressively replaces general incandescent lamp, is the potential lighting source of suitable tool at present.In the existing encapsulation technology of light-emitting diode, need to utilize lead frame to settle led chip, and lead frame further is placed on the substrate with electrical connection circuit, the fluorescent glue that will have simultaneously fluorescence covers led chip, converts white light or other color spectrum in order to the visible spectrum that led chip is launched.In addition, utilize packaging plastic to coat fluorescent glue, so that isolated protective effect to be provided.

Yet, the shortcoming of existing encapsulation technology is, the light that led chip is launched is that point-source of light needs to use extra secondary optics assembly with the suitable lighting angle of further adjusting, and need extra tool to cover the fluorescent glue of led chip with limitation, prevent that fluorescent glue from flowing to outside the required scope, cause complicated integral structure, affect reliability.Therefore, the LED encapsulation method that needs a kind of tool Jiao Qiang, utilize Jiao Qiang with accommodating packaging plastic, and packaging plastic has convex surfaces, form the effect of convex lens, and do not need extra secondary optics assembly, relative tertiary location and the geometrical relationship of especially adjustable led chip and Jiao Qiang, and the optimal luminescent angle on the adjusting light source applications is used the problem that solves above-mentioned prior art.

Summary of the invention

Main purpose of the present invention is to provide light-emitting diode (LED) method for packing of a kind of tool Jiao Qiang, comprise: settle at least one light-emitting diode chip for backlight unit (LED Chip) of being used as light emitting source at ceramic substrate, wherein ceramic substrate can be made of aluminium oxide or other ceramic material; Settle Jiao Qiang at ceramic substrate, and Jiao Qiang has the closed circulation shape surrounding led chip, but do not contact led chip, and the height of Jiao Qiang is greater than the height of led chip; The glue that will have high viscosity and lazy flow drops on the led chip; and the flowability of mat glue itself coats whole led chip; and glue can slaking and form packaging plastic and cover led chip under heating or ambient room temperature; the protective effect of isolated aqueous vapor and environmental contaminants is provided; and the top of packaging plastic has convex surfaces, has the optically focused effect in convex lens border.

Therefore, but the inventive method mat Jiao Qiang sends out angle to adjust, and utilizes the convex surfaces of packaging plastic to need the additional configuration convex lens to replace, and then simplifies whole package structure for LED, improves reliability and the stability of practical operation.

Description of drawings

Fig. 1 shows the operating process schematic diagram of the LED encapsulation method of tool Jiao Qiang of the present invention; And

Fig. 2 shows the schematic diagram of the LED encapsulation method of tool Jiao Qiang of the present invention.

Embodiment

Those skilled in the art below cooperate Figure of description that embodiments of the present invention are done more detailed description, so that can implement after studying this specification carefully according to this.

With reference to figure 1, Fig. 1 is the operating process schematic diagram of the LED encapsulation method of tool Jiao Qiang of the present invention.As shown in Figure 1, the light-emitting diode of tool Jiao Qiang of the present invention (LED) method for packing comprises step S10, S20 and the S30 that sequentially carries out, and is the technical characterictic that further clearly demonstrates the inventive method, please cooperate the schematic diagram with reference to figure 2.

At first, method of the present invention is begun by step S10, settle at least one light-emitting diode chip for backlight unit (LED Chip) 20 of being used as light emitting source at ceramic substrate 10, wherein ceramic substrate 10 can be made of aluminium oxide or other ceramic material, and be provided with the circuit pattern (not shown) on the ceramic substrate 10, produce original transmitted light L1 in order to connect external power source signal (not shown) with driving LED chip 20, but and led chip 20 mat elargol or other conductivity colloid and stick together on ceramic substrate 10, also can utilize scolding tin to be fixed on the ceramic substrate 10 with welding manner, so that led chip 20 is electrically connected to the circuit pattern of ceramic substrate 10.

Then, enter step S20, settle a plurality of glue walls 30 at ceramic substrate 10, and each glue wall 30 has the closed circulation shape to surround but do not contact corresponding led chip 20, and the closed circulation shape can be circle, square, rectangle or polygon.In addition, the glue wall height H W of glue wall 30 is greater than the LED height H LED of led chip 20.

Glue wall 30 can be made of translucent material, such as the silica gel that can comprise light transmission, epoxy resin or any glue material, and can comprise the particulate of tool light reflective, and particulate can comprise metallic particles or glass particle.

In addition, glue wall 30 also can be made of the opaqueness material, and such as can comprising silica gel, epoxy resin or any glue material that comprises atrament, and atrament can be carbon black or black dyes.Glue wall 30 can further comprise the inner surface of tool high light reflectivity, and applies the metal level of plating high light reflectivity on the inner surface, and wherein metal level can comprise silver.

At last in step S30; the glue that utilizes injection device will have high viscosity and lazy flow drops on the led chip 20; and the flowability of mat glue itself coats whole led chip 20; wherein injection device can be point gum machine; glue can be silica gel, epoxy resin or any glue material of light transmission; and can slaking under heating or ambient room temperature, mat forms packaging plastic 40 and also covers led chip, and the protective effect of isolated aqueous vapor and environmental contaminants is provided.Because glue has suitable viscosity before slaking, and the surface tension effect of itself can make the top surface projection, so the packaging plastic after the slaking 40 can form convex surfaces 42 at top surface, and has the effect that is similar to convex lens.Packaging plastic 40 can contact glue wall 30, and the edge of convex surfaces 42 can further arrive the top of glue wall 30, as shown in Figure 2.In addition, packaging plastic 40 also can not contact glue wall 30 (not shown), that is has the space between glue wall 30 and the packaging plastic 40.

In sum, can form according to the invention described above method have ceramic substrate 10, the LED encapsulating structure of led chip 20, glue wall 30 and packaging plastic 40, wherein the original transmitted light L1 of led chip 20 can obliquely penetrate packaging plastic 40, and penetrate the glue wall 30 that is consisted of by translucent material and form side emission light L2, simultaneously, reach the convex surfaces 42 of the penetrable packaging plastic 40 of original transmitted light L1 obliquely towards the top and form emission of light L3, as shown in Figure 2.Glue wall 30 also can further add the particle of tool light reflective, to strengthen the astigmatism effect of side direction light L2.

In addition, when glue wall 30 also can be made of the opaqueness material, be used as the light-shielding thing, so that the LED encapsulating structure does not produce side emission light L2, and only produce towards the top and emission of light L3 obliquely, and between mat led chip 20 and the glue wall 30 poor the and lateral separation of suitable relative altitude to regulate lighting angle.

Characteristics of the present invention are that convex surfaces 42 has the convex lens effect, can make emission of light L3 optically focused, and then can omit in the prior art in order to assemble radiative convex lens, reach and simplify integrally-built purpose.Another characteristics of the present invention are, can utilize Jiao Qiang to produce or not produce side direction light, use optimal luminescent angle and the light emitting region of regulating the LED encapsulating structure.

The above person only is in order to explain preferred embodiment of the present invention; be not that attempt is done any pro forma restriction to the present invention according to this; therefore, all have in that identical invention spirit is lower do relevant any modification of the present invention or change, all must be included in the category that the invention is intended to protect.

Claims

1. A light-emitting diode packaging method with glue wall, characterized in that, comprising:

Installing at least one light emitting diode (LED) chip as a light source on a ceramic substrate, wherein the ceramic substrate is provided with a circuit pattern for connecting an external power supply signal and driving the at least one LED chip to generate original emitted light;

A plurality of glue walls are placed on the ceramic substrate, and each glue wall has a closed loop shape to surround but not contact the corresponding LED chip, and the glue wall height of the glue wall is greater than the LED height of the LED chip, the glue wall the wall is composed of light-transmitting or light-impermeable material; and

Use an injection device to drop the glue on the at least one LED chip, and cover the at least one LED chip, and the glue is cured to form an encapsulation glue, which covers the at least one LED chip, and the encapsulation glue has a light-transmitting property sex.

2 . The LED packaging method with glue wall as claimed in claim 1 , wherein the ceramic substrate is an alumina ceramic substrate, and the packaging glue is silica gel or epoxy resin. 3 .

3. The LED packaging method with glue wall as claimed in claim 1, wherein the glue wall is made of a light-transmitting material, the light-transmitting material includes silica gel or epoxy resin, and the closed loop shape is a circle shape, square, rectangle or polygon.

4 . The LED packaging method with glue wall as claimed in claim 3 , wherein the glue wall further comprises light-reflective particles, and the particles include metal particles or glass particles.

5. The LED packaging method with glue wall as claimed in claim 1, characterized in that, the glue wall is made of opaque material, the light-impermeable material includes silica gel or epoxy resin, and the opaque The optical material further includes a black substance, the black substance is carbon black or black dye, and the closed loop shape is circular, square, rectangular or polygonal.

6. The LED packaging method with glue wall as claimed in claim 5, wherein the glue wall further comprises an inner surface with high light reflectivity, and the inner surface is plated with a metal layer with high light reflectivity, and the metal layer The layer includes silver.

7 . The LED packaging method with glue wall as claimed in claim 1 , wherein the packaging glue is made of transparent silicone or epoxy resin, and the injection device includes a glue dispenser. 8 .

8. The LED packaging method with glue wall as claimed in claim 1, wherein the encapsulation glue fills up the space between the LED chip and the glue wall, and the edge of the raised surface of the encapsulation glue reaches Glue the top of the wall.

9 . The LED packaging method with glue wall as claimed in claim 1 , wherein the encapsulant does not touch the glue wall, and the edge of the raised surface of the encapsulant contacts the ceramic substrate.