CN103000728B - Solar cell backboard assembly and solar module - Google Patents
Solar cell backboard assembly and solar module Download PDFInfo
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- CN103000728B CN103000728B CN201210509095.0A CN201210509095A CN103000728B CN 103000728 B CN103000728 B CN 103000728B CN 201210509095 A CN201210509095 A CN 201210509095A CN 103000728 B CN103000728 B CN 103000728B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
The invention provides a kind of solar cell backboard assembly, it comprises thermoconductive adhesive layer, with the battery back-sheet of radiator form, wherein the first surface of thermoconductive adhesive layer contacts with the battery back-sheet of radiator form, when being assembled in solar module by this back board module, the second surface of thermoconductive adhesive layer can directly and solar cell electrical contact being bonded together.The present invention also provides a kind of solar module comprising this solar cell backboard assembly.
Description
Technical field
The present invention relates to a kind of solar cell backboard assembly and solar module, particularly a kind of back board module of solar cell radiating efficiency and comprise the solar module of this back board module of can improving.
Background technology
Along with the increase day by day paid close attention to environmental problem, finding new forms of energy becomes a urgent problem.Solar cell does not discharge carbon dioxide and the electricity generation system little to carrying capacity of environment as a kind of when generating electricity, and obtains universal fast in recent years.
The solar cell of current use comprises header board, solar cell circuit, backboard and encapsulant.Usually, solar cell has so a kind of structure, wherein solar cell circuit is sandwiched between header board and backboard, and the gap between header board and solar cell circuit and the gap between solar cell circuit and backboard are respectively by encapsulant such as EVA (vinyl-vinyl acetate copolymer) resin seal.By adopting vacuum laminator etc. to add thermo-compressed above-mentioned header board/encapsulant/solar cell circuit/encapsulant/backboard, make solar cell.
Because solar cell is positioned in outdoor, under being exposed to the environment such as sunlight and sleet, therefore require that each layer of composition solar cell has good weather resisteant as moisture resistance, thermal endurance and uviolresistance.Backboard also need to have in the environment of relatively high humility and temperature with encapsulant lastingly and the performance bonded securely.In addition, header board, backboard and encapsulant also play the effect providing electric insulation.
Solar cell absorb energy some convert heat energy to, cause the temperature of inside solar energy battery to raise, and the temperature of solar cell affects the efficiency of solar cell.Such as, for the typical solar cell using crystalline silicon, photoelectric conversion efficiency is generally about 10-17%, and when the temperature of solar cell often rises 1 DEG C, its power just loses about 0.4-0.5%.Therefore, in order to improve the efficiency of solar cell, it is very important for preventing the temperature of solar cell from use raising.
The EVA and the back veneer material that are typically used as encapsulating material for solar cell have low heat conductivity, and usual conductive coefficient, lower than 0.2W/mk, makes the radiating efficiency of solar cell poor, cause the temperature of solar cell to raise.
Therefore, be starved of and a kind of solar cell backboard with good thermal conductivity, caking property, insulating properties and weatherability is provided, and a kind of solar cell improving energy conversion efficiency by improving heat radiation.
Summary of the invention
The invention provides a kind of solar cell backboard assembly and the solar module comprising this back board module, by the encapsulant adopting heat conductive adhesive material to replace current normally used heat-conducting effect difference, and back plate design is become heat radiating type backboard, effectively promote the radiating efficiency of battery, thus photoelectric conversion efficiency is significantly improved, at least improve 0.5%, the photoelectric conversion efficiency of optimal technical scheme improves close to 1%.
On the one hand, a kind of solar cell backboard assembly is provided, comprises:
Thermoconductive adhesive layer, it has first surface and second surface; With
The battery back-sheet of radiator form,
Wherein the first surface of thermoconductive adhesive layer contacts with the battery back-sheet of radiator form.
On the other hand, a kind of solar module is provided, comprises:
Header board;
Sealing material layer;
Solar cell circuit; With
Foregoing solar cell backboard assembly,
The second surface of the thermoconductive adhesive layer of wherein said solar cell backboard assembly and described solar cell electrical contact are also bonded together.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of conventional solar battery structure in prior art.
Fig. 2 is the schematic diagram of solar module structure in one embodiment of the invention.
Fig. 3 is the schematic diagram of solar module structure in another embodiment of the present invention.
Fig. 4 shows the structure of fin in one embodiment of the invention.
Fig. 5 shows the temperature of solar cell and the figure of efficiency and operating time relation in embodiment and comparative example.
Fig. 6 shows the temperature of solar cell and the figure of efficiency recovery rate and operating time relation in embodiment and comparative example.
Embodiment
The invention provides a kind of solar cell backboard assembly and the solar module comprising this back board module, described back board module is made up of the sealing/jointing material and heat sinking back-plate with high thermal conductivity, it makes the heat in solar cell more effectively conduct, and can obtain the photoelectric conversion efficiency of higher power output and improvement by preventing inside solar energy battery temperature from raising.
Below in conjunction with accompanying drawing, solar cell backboard assembly and solar module are described in detail.
Back board module
In the present invention, replace the conventional encapsulant used if EVA is as the binder course between backboard and solar cell circuit by thermoconductive adhesive layer, and with being called that the thermally-conductive sheet of " battery back-sheet of radiator form " replaces the conventional backboard used herein, thus reach the object of improving heat radiation efficiency.In this article, term " battery back-sheet of radiator form " refers to the backboard be made up of the material with heat dispersion, and preferably, it is the backboard of the fin form with larger area of dissipation.
In one embodiment, solar cell backboard assembly comprises thermoconductive adhesive layer, and the battery back-sheet of radiator form.
The first surface of thermoconductive adhesive layer contacts with the battery back-sheet of radiator form, and when being assembled in solar module by this back board module, the second surface of thermoconductive adhesive layer can directly and solar cell electrical contact being bonded together.
Thermoconductive adhesive layer is formed by heat conductive adhesive material, and operable heat conductive adhesive material meets following requirements:
Thermal conductivity is greater than 0.3W/mK, is preferably greater than 0.5W/mk, more preferably greater than 0.8W/mk;
Dielectric strength is greater than 3000V, is preferably greater than 5000V, more preferably greater than 6000V;
Specific insulation is greater than 10
10Ω m, is preferably greater than 10
11Ω m, and be more preferably greater than 10
12Ω m.
40N/cm is greater than with the bonding strength of the battery back-sheet of radiator form in backboard such as market mainstream backboard (as DupontTedlar and ArkemaKynar) or the present invention;
For meeting the requirement of hot pressing technique, good thermal endurance (at least more than 150 DEG C) must be had;
And meet resistance to ag(e)ing standard IEC 61215.
Heat conductive adhesive material can comprise any thermal conductive polymer material, as heat-conductive bonding agent (such as has the epoxy resin of high-fire resistance and high thermal conductivity, silicone adhesive, ethylene-vinyl acetate copolymer or acrylic adhesives), heat-conducting silicone grease, heat conductive adhesive adhesive tape (wherein thermoconductive adhesive layer can comprise above-mentioned heat-conductive bonding agent or be made up of it), conduction heat sealable material comprises heat conduction EVA, with heat-conductive thermosetting material, as 3M heat conduction TBF material (TBF:thermalbondingfilm, hot melting cohesion adhesive tape).
" high-fire resistance " herein refers to the temperature that can tolerate more than at least 150 DEG C for a long time." high thermal conductivity " herein refers to that thermal conductivity is greater than 0.3W/mK, is preferably greater than 0.5W/mk, more preferably greater than 0.8W/mk.
The thickness of thermoconductive adhesive layer, for being greater than 0.4mm, is preferably greater than 0.5mm, more preferably greater than 0.6mm, and is less than 5mm, is preferably less than 3mm, be more preferably less than 1mm.Can select according to specific needs, if thickness is less than 0.4mm, then cell piece breakage or cell piece localized contact can cause the unfavorable conditions such as short circuit to backboard, if thickness is greater than 5mm in hot pressing, battery component then may be caused to dispel the heat thermal resistance too greatly, and weight re-mount difficulty very much.
Thermoconductive adhesive layer can pass through Screw Extrusion, and the method for coating or curtain coating is formed.Such as, can be formed on the surface by battery back-sheet heat conductive adhesive composition being coated in radiator form.Also can use heat conductive adhesive adhesive tape, it directly be put on the battery back-sheet surface of radiator form.
In some embodiments, the heat conductive adhesive material of use is heat conductive adhesive adhesive tape, and commercially available heat conductive adhesive adhesive tape can be used as thermoconductive adhesive layer, and the example includes but not limited to the MFI Heat Conduction Material available from 3M China, 5516,5569 etc.Compared with other materials, heat conductive adhesive adhesive tape has more excellent insulation and lamination fills anti-puncture function, is that in the battery component of electric conducting material, these character are extremely important, is conducive to effectively avoiding battery short circuit to lose efficacy at backboard.
In some embodiments, use the MFI adhesive tape available from 3M China, i.e. multifunction insulating heat conduction adhesive tape, be made up of with the insulating heat-conductive adhesive layer coating this insulation tape base two sides insulation tape base, in some embodiments, the thermal conductivity of this adhesive tape is 0.70W/mK, and dielectric strength is 5000V, and fracture adhesion strength is 350N/in
2, ATS (180 degree of peeling forces to steel plate) for 0.4N/mm, RTI (relative temperature index) be 150 DEG C, by 42 days burn-in tests of 230 DEG C, its specific insulation is 10
11Ω m.
In some embodiments, the conductive adhesive composition for forming the insulating heat-conductive adhesive layer in MFI adhesive tape being directly coated on the surface of heat sinking back-plate, forming thermoconductive adhesive layer.That is, thermoconductive adhesive layer can be made up of conductive adhesive composition as described below.
In some embodiments, the composition of the insulating heat-conductive adhesive layer formed in MFI adhesive tape has bonding strength, the thermal conductivity higher than 0.60W/m.k and the dielectric property higher than 0.30kv/mil higher than 0.28MPa.
In other embodiments, the composition of the insulating heat-conductive adhesive layer formed in MFI adhesive tape has bonding strength, the thermal conductivity higher than 0.65W/m.k and the dielectric property higher than 0.40kv/mil higher than 0.40MPa.
In some embodiments, the conductive adhesive composition forming the insulating heat-conductive adhesive layer of MFI adhesive tape is acrylic adhesives, comprise: based on the composition total weight meter of 100wt%, (A) acrylic acid based polymer of 15 ~ 60wt%, and the heat filling of (B) 20 ~ 90wt%.
In some embodiments, described acrylic acid based polymer comprises at least one polymer, it is for being selected from (methyl) acrylic acid, (methyl) acrylate as (methyl) acrylic acid (C1-C12) Arrcostab or (methyl) acrylic acid (C5-C12) aryl ester, the polymer of such as, one or more monomers in (methyl) methyl acrylate, ethyl ester, propyl ester, butyl ester, own ester, 2-Octyl Nitrite.In this article, term " (methyl) acrylic acid " represents methacrylic acid and/or acrylic acid.
In some embodiments, described acrylic acid based polymer comprises at least one polymer, it is for being selected from (methyl) butyl acrylate, (methyl) Hexyl 2-propenoate, and the polymer of one or more monomers in (methyl) 2-EHA.
In some embodiments, the intrinsic viscosity > 0.8 of the acrylate copolymer of use is also preferably greater than > 1.0, and glass transition temperature is lower than-30 DEG C.
In some embodiments, based on the composition total weight meter of 100wt%, the amount of described heat filling is 20 ~ 80wt%, is preferably 20 ~ 70wt%, is more preferably 20-60wt%.
In some embodiments, described heat filling for being selected from pottery, metal oxide, hydrated metal compound, metal nitride, and one or more in moisture metallic compound.
In some embodiments, described heat filling is for being selected from Al (OH)
3, BN, SiC, AlN, Al
2o
3, mica, barite, carborundum, TiO
2, SiO
2, wollastonite, marble, iron oxide red, zirconia and Si
3n
4in one or more.
In some embodiments, described conductive adhesive composition also comprises tackifier.
More preferably, the conductive adhesive composition of MFI adhesive tape comprises fire retardant, to provide insulation and anti-flammability, thus can apply or be laminated on solar cell backboard, form the black box meeting UL94HB standard.
The flame-retarded heat-conducting adhesive composition of MFI adhesive tape comprises: based on the composition total weight meter of 100wt%, (A) acrylic acid based polymer of 15 ~ 60wt%, (B) heat filling of 10 ~ 50wt%, and the halogen-free flame retardants of (C) 20 ~ 50wt%.In some embodiments, the component (C) in said composition comprises: subfraction (C1), and it comprises at least one organophosphor based flameproofing; With subfraction (C2), it comprises at least one fire retardant, is selected from nitrogen-containing compound based flameproofing, graphite material based flameproofing, melamine cyanurate based flameproofing, metal hydroxides based flameproofing, metal oxide based flameproofing, metal tripolyphosphate salt based flame retardants, metal perborate salt based flame retardants, with the organophosphor based flameproofing of organophosphor based flameproofing being different from (C1), and based on the composition total weight meter of 100wt%, the P content of composition is not less than 4.0wt%.The example of suitable fire retardant includes but not limited to melamine polyphosphate (MPP), Mg (OH)
2, Al (OH)
3firebrake ZB, APP (APP), dimethyl methyl phosphonate (DMMP), triphenyl phosphate (TPP), trbasic zinc phosphate, melamine cyanurate (MCA), melamine phosphate (MP), 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) etc.
The example of organophosphor based flameproofing includes but not limited to organophosphorus ester and organic phosphate.Such as can use solid packing type organic phosphate OP935, commercially available from Clariant chemical company (ClariantChemicalsCompany), China, its phosphorus content is high, is 23-24wt%.In some embodiments, use organophosphate ester flame retardant, as can available from the P30 of Chinese Shanghai Cheng Zaicheng Chemical Co., Ltd., a kind of liquid flame retardant, for triphenyl phosphate (CAS:115-86-6) and the mixture of aromatic phosphate acid ester, phosphorus content is 8-9wt%, can improve the viscosity of adhesive composition when not causing anti-flammability to reduce.
In some embodiments, by metal hydroxides based flameproofing such as Mg (OH)
2or Al (OH)
3combinationally use to provide and the synergy of phosphorus compound and good thermal conductivity with phosphate.
In some embodiments, the multifunction insulating heat conduction adhesive tape (MFI) available from 3M China is used, marque MFI-5E.The wherein acrylic acid based polymer consisting of (A) 35 ~ 45wt% of conductive adhesive composition used, the heat filling of (B) 30 ~ 40wt%, and the halogen-free flame retardants of (C) 15 ~ 25wt%.Wherein acrylic acid based polymer can be one or more in the polymer of one or more monomers be selected from (methyl) methyl acrylate, ethyl ester, propyl ester, butyl ester, own ester, 2-Octyl Nitrite, and heat filling can be selected from Al (OH)
3, BN, SiC, AlN, Al
2o
3, carborundum, TiO
2, SiO
2, zirconia and Si
3n
4in one or more, halogen-free flame retardants can be selected from melamine polyphosphate (MPP), Mg (OH)
2, Al (OH)
3, Firebrake ZB, APP (APP), triphenyl phosphate (TPP), 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), one or more in organophosphorus ester and organic phosphate.
MFI adhesive tape can be obtained by any method in this area.Such as, it can be obtained by the mixing and coating processes using solvent, or by not using the compound of solvent and coating processes such as UV or electron beam (E-beam) polymerization technique to obtain.
Insulation tape base in MFI adhesive tape can be base material conventional in this area.In some embodiments, described insulation tape base is weaving or the non-woven material of plastic film or insulation.
In some embodiments, the thickness of the insulating heat-conductive adhesive layer of described MFI adhesive tape is at least 10 μm.
In some embodiments, thermoconductive adhesive layer is the heat conductive adhesive material of single layer structure.
In other embodiments, thermoconductive adhesive layer can be heat conductive adhesive material that is double-deck or sandwich construction, and wherein each layer can be made up of identical heat conductive adhesive material, or is made up of different heat conductive adhesive material, and their thickness can be identical or different.Such as can pass through the two-layer or multilayer selecting thermal conductivity different with caking property, and the combination by regulating the thickness of each layer to obtain better insulation property and bond properties.In some embodiments, thermoconductive adhesive layer also can be the heat conduction adhesive tape of three-decker, and the two sides that two-layer bonding colloidal materials coats one deck back of the body sill respectively forms the first thermoconductive adhesive layer and the second thermoconductive adhesive layer, forms two-sided tape.First thermoconductive adhesive layer of two-sided tape and solar cell electrical contact, the second thermoconductive adhesive layer contacts with backboard.
In preferred embodiments, the back board module invented is by independently double-deck thermoconductive adhesive layer and backboard are formed.Wherein the heat conductivility of the first thermoconductive adhesive layer and insulation property higher, will with solar cell electrical contact, as the adhesion-layer materials needing in assembling components to lay separately; Second thermoconductive adhesive layer is aid adhesion layer, its composition is substantially identical with the first thermoconductive adhesive layer, its heat conductivility and insulation property lower than the first Heat Conduction Material, thickness is less but caking property is higher, before battery assembling, in advance the second thermoconductive adhesive layer and backboard are integrated by lamination or coating.In battery assembling, backboard by the second thermoconductive adhesive layer and the first adhesive layer hot pressing compound, will form sealing and adhesive property with thermoconductive adhesive layer hot pressing compound more excellent battery component more direct than backboard.
The battery back-sheet of radiator form
The battery back-sheet of radiator form can be constructed by one or more Heat Conduction Materials independently, and the heat conduction back veneer material being applicable to the battery back-sheet forming radiator form in the present invention meets following condition:
1) thermal conductivity is greater than 0.2W/mk, is preferably greater than 0.4W/mk, more preferably greater than 0.7W/mk; With
2) with the bonding force > 40N/cm of thermoconductive adhesive layer used.
Preferably, heat conduction back veneer material also meets following condition:
3) fire resistance meets UL94HB standard.
More preferably, the back board module that this heat conduction back veneer material and thermoconductive adhesive layer are formed jointly, also meets the following conditions:
4) partial discharge > 1000v, partial discharge adopts standard method IEC61730 test, and DBV (dielectric breakdown voltage) > 15KV, DBV adopt the method in testing standard ASTMD-4325 to measure; With
5) ageing-resistant performance, meets IEC61215 testing standard.
Heat conduction back veneer material can be selected from metal, the polymeric material of heat conduction, thermal conductive ceramic and other heat conduction inorganic material, instantiation can be that metal is if aluminium, copper, iron and alloy thereof are as aluminium alloy, graphite, heat-conducting elastomer is as heat-conducting silicon rubber, heat conductive elastomeric plastics (being generally the plastics that with the addition of heat filling), thermal conductive ceramic as thermal conductivity A 1 N pottery, heat conduction BeO pottery, heat conduction CBN pottery, heat conduction SiC ceramic, or more the heat conduction multilayer materials etc. that forms of heat-conducting plastic film or colloid and fluorine material.
The battery back-sheet of radiator form can be configured to any shape, this depends on the requirement to weight and battery efficiency, such as, can be configured to film, paper tinsel, flat board, fin or on the outer surface contrary with connecing sensitive side, have multiple auxiliary-radiating structure as the plate of projection or louvre blade etc.When forming multiple projection or louvre blade, owing to adding the surface area of radiator, radiating efficiency can be improved further.
The thickness of the battery back-sheet of radiator form at more than 0.1mm, preferably at more than 0.3mm, and at below 5mm, preferred below 3mm, more preferably below 1mm.Can select according to specific needs, if thickness is less than 0.1mm, then insulation property and mechanical strength can not meet the basic requirement used, if thickness is greater than 5mm, then causes backboard too thick and heavy, bring difficulty to installation, and thermal resistance of dispelling the heat is very large.
Use outer surface have in the embodiment of the plate of multiple projection, projection can be the combination of various shape or various shape, shape is not specifically limited, and can be cube shaped, cuboid, cylindrical, hemisphere, semi-cylindrical, taper shape, truncated cone-shaped etc.Projection can arrange regularly or randomly arrange.The height of projection for being greater than 0.001mm, can be preferably greater than 0.1mm, more preferably greater than 10mm, and is less than 5cm, is preferably less than 4cm, be more preferably less than 3.5cm.Distance between projection for being greater than 0.01mm, can be preferably greater than 0.1mm, more preferably greater than 1mm, and is less than 100mm, is preferably less than 50mm, be more preferably less than 30mm.Distance between projection, namely the arranging density of projection will affect radiating effect, can select as the case may be.
An example of fin has the structure shown in Fig. 4, wherein jut arranges with same intervals on horizontal and vertical, form the square of arranged adjacent, the distance at interval can in the scope of < 100mm, preferably in the scope of < 30mm.In some embodiments, the spacing distance of jut is 1 to 20mm.
The heat conduction back board module with Structure of radiating fin can, by the conventional method preparation in this area, such as, by extruding, casting or injection-molded preparation, maybe can use the combination of these methods to prepare.
In some embodiments, use aluminium foil, aluminium sheet and have the aluminium sheet of multiple projection on the outer surface as the battery back-sheet of radiator form.
Header board
Header board in solar module should have enough mechanical strengths to protect solar cell circuit; and in order to make full use of sunlight; (such as must be less than within the scope of 1100nm, as within the scope of 300-1100nm) within the specific limits and there is high transmission rate.Material usually used in this field can be used, such as glass or polymeric material.
In one embodiment, the material for header board is the material with high-transmittance, and its transmissivity for the light of wavelength within the scope of 300-1100nm is greater than 80%, is preferably greater than 85%, more preferably greater than 90%.
In some embodiments, use glass as header board, the example of glass includes but not limited to toughened glass, fluoride glass.
In some embodiments, use transparent polymeric material as header board, the example of polymeric material includes but not limited to fluoropolymer, as ethylene-tetrafluoroethylene copolymer, fluorinated ethylene propylene copolymer, hexafluoropropylene (HFP)/tetrafluoroethylene (TFE)-vinylidene fluoride copolymer, Kynoar, ethylene-chlorotrifluoro-ethylene copolymer or polytrifluorochloroethylene, liquid crystal polymer, polyester is as PETG, PEN, polymethyl methacrylate, Merlon, polyurethane, ethylene-vinyl alcohol copolymer, or the two or more mixture in them.
The thickness of header board is not particularly limited, if can make sunlight fully through, and there is enough mechanical strengths protection solar cell circuit.Such as, the thickness of header board, for being greater than 0.1mm, is preferably greater than 1mm, more preferably greater than 2mm, and is less than 20mm, is preferably less than 10mm, be more preferably less than 5mm.Can select according to specific needs, if thickness is less than 0.1mm, then mechanical strength is not enough to protection cell piece assembly, if thickness is greater than 20mm, then too thick and heavy, and cause heat radiation bad difficult with installation, installation cost increases.
In order to improve the light rate of header board, anti-reflection film can be set on the surface of the sensitive side of header board, increase incident sunlight.Anti-reflection film can be the high transmission rate material lower than the refractive index of front plate material.Anti-reflection film can by the manufacture technics of such as evaporation, thermal spraying or sputter coating.
In order to improve the light capture rate of solar cell to improve its power output, can process to improve light reflectivity to the surface of header board near solar cell circuit side, to reduce the amount of the light from solar module outgoing.Such as, header board can be carried out embossed near the surface of solar cell circuit side, make it form the structure of convex-concave, thus the light reflectivity improving this surface is escaped from solar module inside to prevent photon.
In some embodiments, use the toughened glass that thickness is 3.2mm as header board.
Solar cell circuit
Operable solar cell circuit is not particularly limited, such as, crystalline silicon can be used as monocrystalline silicon or polysilicon, nano-silicon, etc.
Encapsulant
In solar module, between header board and solar cell circuit, conventional encapsulant is used to encapsulate.Operable encapsulant comprises polymer as organosilicon, polyolefin, the copolymer of alkene and polar monomer, such as vinyl-vinyl acetate copolymer (EVA), or PVB (polyvinyl butyral resin) etc.
Can use commercially available encapsulant, the example includes but not limited to the 806EVA of Foster (First) company, or the S11EVA of Bridgestone (Bridgestone), and available from the EVA9000 of 3M China Co., Ltd..
The thickness of the sealant using encapsulant to be formed, for being greater than 0.4mm, being preferably greater than 0.5mm, and being less than 5mm, be preferably less than 3mm, be more preferably less than 1mm.Can select according to specific needs, if thickness is less than 0.4mm, then cell piece to be easy in hot pressing damaged or cell piece localized contact causes the unfavorable conditions such as short circuit to backboard, if thickness is greater than 5mm, battery component then may be caused to dispel the heat thermal resistance too greatly, and weight re-mount difficulty very much.
Solar module
Fig. 1 is the structural representation of solar module in prior art, Fig. 2 and Fig. 3 is the structural representation of the solar module adopted in embodiment of the present invention respectively.
What Fig. 1 showed is a kind of traditional silicon wafer battery structure.As shown in fig. 1, the solar module structure adopted in prior art is header board 1/ sealing material layer 2/ solar cell circuit 3/ sealing material layer 4/ backboard 5.Normally used encapsulant is such as EVA, and back veneer material comprises the stacked film formed by polymeric material, the stacked film be such as made up of as polyethylene terephthalate and vinyl-vinyl acetate copolymer as polyvinyl fluoride and polyester fluoropolymer.In one more specifically example, 1 is glass, and 2 is EVA tack coat, and 3 is silicon wafer cell piece, and 4 is EVA tack coat, and 5 is that fluorine-containing MULTILAYER COMPOSITE back veneer material is as commercially available product TPT.These sealants and back veneer material have low heat conductivity, make the radiating efficiency of solar cell poor, cause the temperature of solar cell to raise and efficiency reduction.
Solar module provided by the invention comprises the header board/sealing material layer/solar cell circuit/solar cell backboard assembly set gradually, it can contact each other, wherein solar cell backboard assembly is any one in foregoing embodiment, and the second surface of the thermoconductive adhesive layer of solar cell backboard assembly and described solar cell electrical contact be bonded together.
In some embodiments of the present invention, the structure of solar module as shown in Figure 2, comprise the battery back-sheet 15 of header board 11/ sealing material layer 12/ solar cell circuit 13/ thermoconductive adhesive layer 14/ radiator form successively, wherein the battery back-sheet 15 of thermoconductive adhesive layer 14 and radiator form forms back board module.Wherein each assembly as previously mentioned.
In some embodiments, the structure of solar module as shown in Figure 3, comprise header board 21/ sealing material layer 22/ solar cell circuit 23/ thermoconductive adhesive layer 24/ fin 25 successively, wherein thermoconductive adhesive layer 24 and fin 25 form back board module, and fin 25 has multiple projection on the outer surface contrary with connecing sensitive side.Wherein each assembly as previously mentioned.
Back board module of the present invention is not limited to be used in be had in the solar module of said structure, is equally also applicable to the solar module with other structures.
Solar cell backboard assembly of the present invention and solar module can be prepared through lamination by conventional method.
Such as, the preparation method of solar module comprises the following steps:
Cell slice test, front is welded, back serial connection, laminated laying, component lamination, and deburring frames up, and installs terminal box, Hi-pot test, module testing, and packaging.
In some embodiments, by the battery back-sheet lamination of header board, encapsulant, solar cell circuit, thermoconductive adhesive layer and radiator form, solar module is prepared.
In other embodiments, first by thermoconductive adhesive layer as heat conductive adhesive adhesive tape puts on a surface of the battery back-sheet of radiator form, obtain back board module, afterwards by header board, encapsulant, solar cell circuit and back board module lamination, prepare solar module.
The present invention is further illustrated below by embodiment.
The raw material used in embodiment and comparative example is summarized as follows.
The toughened glass that 3.2mm is thick, available from good faith Glass Co., Ltd., China, ultra-white photovoltaic glass.
EVA, EVA9000, available from 3M China Co., Ltd..
Crystal silicon solar energy battery circuit Monocrystalline silicon cell piece, is of a size of 125mm × 125mm × 0.25mm, marque JACM5SL2BB, available from Jing'ao Solar Energy Co., Ltd., and China.
Multifunction insulating heat conduction adhesive tape (MFI), marque MFI-5E, available from 3M, China.
Aluminium foil, 50 μm thick, and 1200 roll, annealed Al-alloy, the rolling aluminum foil of decontamination process, available from Co., Ltd in magnalium.
Aluminium sheet, 1.5mm is thick, available from Co., Ltd in magnalium.
Fin, cast aluminium material, is of a size of 250mm × 250mm × 5mm, is distributed with the cuboid projection of 8mm × 8mm × 10mm on a surface, and the spacing between projection is 8mm (see Fig. 4), available from Yu Chun Electronic Science and Technology Co., Ltd., China.
Fluoropolymer composite plate, containing the laminated sheet of EVA/PET/THV film, model SF17T, available from 3M, China.
Method of testing
1. solar battery efficiency
Solar battery efficiency is by using ORIEL sunlight simulator (model: AAsolarsimulator94062) and solar panel test macro (model: Redsolarcellsun-simulatorANIVtesterSP1000-4960, purchased from NewportCorporation, the U.S.) measure.Standard method GB/T6495.1 is used to measure.
2. solar cell temperature
Thermocouple is embedded in solar module, between the adhesive layer being placed in one piece of nearest cell piece central part of isolated edge and backboard, and be connected with MiniLOGGERGL220 instrument (available from GraphtechCorporation, the U.S.).By GL220 instrument monitoring and the variations in temperature of record solar energy battery.
Embodiment 1
Llowing group of materials is used to form the thick toughened glass of solar module: 3.2mm as header board in embodiment 1, EVA is as encapsulant, crystal silicon solar energy battery circuit (125mm × 125mm × 0.3mm, 4 series connection), multifunction insulating heat conduction adhesive tape (MFI) is as thermoconductive adhesive layer, with the battery back-sheet of aluminium foil (50 μm thick, and 1200 roll, annealed Al-alloy) as radiator form.Each assembly is become solar module by hot pressing.
The preparation method of cell piece carries out according to following program.
Step 1: welding is soldered in the main gate line in cell piece front with electric iron (300 ~ 400 DEG C);
Step 2: cell piece back side series welding step 1 made is connected into cell piece string;
Step 3: lay ultra-clear glasses and one deck EVA film, then will go here and there by a graded cell piece string laying obtained according to step 2 more; Above EVA, be connected into cell piece group, lay thermoconductive adhesive layer afterwards, finally lay the backboard of radiator form;
Step 4: by component lamination, technological parameter is as follows: temperature is 135 ~ 155 DEG C; Process is for vacuumizing (-100kPa), and 3 ~ 7min, then pressurizes (rising to 100kPa by-100kPa), 0 ~ 2min, pressurize afterwards (80 ~ 100kPa), 8 ~ 15min;
Step 5: follow-uply to frame up and dependence test, packaging.
Comparative example 1
Prepare solar module in the same manner as in example 1, difference is to use EVA replace multifunction insulating heat conduction adhesive tape and use fluoropolymer composite plate (EVA/PET/THV laminated sheet) to replace aluminium foil, obtains the solar module of traditional structure.
Embodiment 2
Prepare solar module in the same manner as in example 1, difference is to use aluminium sheet (1.5mm is thick) to replace aluminium foil, thinks the machinery support that solar module provides stronger.
Embodiment 3
Prepare solar module in the same manner as in example 1, difference is to use fin to replace aluminium foil.The structure of fin as shown in Figure 4.
Test result
The solar module prepared in testing example and comparative example is at the temperature and light photoelectric transformation efficiency of different operating time.As shown in Figure 5, wherein in (A), display battery efficiency is with the change of operating time, and the result that in (B), display battery efficiency conservation rate changed with the operating time, data display in Table 1 for the data of embodiment 1 and comparative example 1.
Table 1. solar module is in the photoelectric conversion efficiency of different operating time
Can see from Fig. 5 and table 1, in embodiment 1 and comparative example 1, the temperature of solar cell is all along with the operating time raises rapidly, causes the efficiency of solar cell to decline thereupon.But the decrease in efficiency speed of the solar cell of embodiment 1 is comparatively slow, and loss in efficiency is less.After work 12.33min, the solar module efficiency of comparative example 1 reduces by 0.82%, namely have lost it in 7.0% of 25 DEG C of standard values, and the solar module efficiency of embodiment 1 reduces by 0.609%, and namely it is 5.2% of 25 DEG C of standard values.This proves that the solar module of embodiment 1 has better radiating efficiency, prevents temperature to raise, thus reduces power loss.
In another group test, the solar module prepared in embodiment and comparative example is put into baking oven, makes it reach 88.1 DEG C, afterwards battery component is taken out from baking oven and put at ambient temperature, make its Temperature fall, measure and record the change that its conversion efficiency declines with temperature.As shown in Figure 6, data display in table 2 for the result of embodiment 1 and comparative example 1.
Table 2. solar module is in the photoelectric conversion efficiency of different time
Can see from Fig. 6 and table 2, along with temperature declines, the efficiency of the solar module of embodiment 1 and comparative example 1 all raises.But the efficiency of the solar module of embodiment 1 raises faster, this is because it has better heat dispersion.When temperature near room temperature, difference is more obvious.Within the time of 32.1min, the solar battery efficiency of embodiment 1 has recovered 3.78%, namely recovered it in 32.4% of 25 DEG C of standard values, and the solar battery efficiency of comparative example 1 has only recovered 2.71%, has namely recovered it in 23.0% of 25 DEG C of standard values.In general, in the whole operating temperature range of 48 to 88 DEG C, compared with the solar module of comparative example 1, the photoelectric conversion efficiency of the solar module of embodiment 1 is high by 1%.
The solar module of embodiment 3, owing to employing the fin of band projection, obtains radiating effect more better than embodiment 1 and 2.
Can see, compared with the solar module in comparative example, the solar module in embodiment, owing to having better heat dispersion, achieves higher photoelectric conversion efficiency.
Burn-in test
The battery component of embodiment 1 and comparative example 1 is placed in temperature 85 DEG C, after toasting 42 days in the baking oven of humidity 85%, tests its photoelectric conversion efficiency.Data are in table 3.
The ageing test result of table 3. solar module
| Numbering | Comparative example 1 | Embodiment 1 |
| Start efficiency value | 10.247 | 10.120 |
| Efficiency value after aging 42 days | 10.168 | 9.995 |
| Conservation rate | 99.2％ | 98.8％ |
Can clearly be seen that from table 3, the efficiency conservation rate of battery component under aging condition of embodiment 1 is the same with the conventional solar cell assembly of comparative example 1, maintain higher level, meet the application standard of solar cell, namely the back board module that in the application of the invention, radiating efficiency is higher, obtains the solar module that ageing resistance is excellent.
Claims (28)
1. a solar cell backboard assembly, comprising:
Thermoconductive adhesive layer, it has first surface and second surface; With
The battery back-sheet of radiator form,
Wherein the first surface of thermoconductive adhesive layer contacts with the battery back-sheet of radiator form,
Described thermoconductive adhesive layer by being selected from epoxy resin, silicone adhesive, the heat-conductive bonding agent of ethylene-vinyl acetate copolymer and acrylic adhesives or the heat conductive adhesive adhesive tape comprising described heat-conductive bonding agent are formed,
The thickness of described thermoconductive adhesive layer for being greater than 0.4mm, and is less than 5mm, and
Wherein said acrylic adhesives comprises: based on the total weight of 100wt%, the acrylic acid based polymer of 35 ~ 45wt%, the heat filling of 30 ~ 40wt%, and the halogen-free flame retardants of 15 ~ 25wt%,
Wherein said halogen-free flame retardants comprises: subfraction C1, and it comprises at least one organophosphor based flameproofing; With subfraction C2, it comprises at least one fire retardant, is selected from nitrogen-containing compound based flameproofing, graphite material based flameproofing, melamine cyanurate based flameproofing, metal hydroxides based flameproofing, metal oxide based flameproofing, metal tripolyphosphate salt based flame retardants, metal perborate salt based flame retardants, with the organophosphor based flameproofing being different from C1, and based on the adhesive total weight of 100wt%, P content is not less than 4.0wt%.
2. solar cell backboard assembly according to claim 1, the thermal conductivity of wherein said thermoconductive adhesive layer is greater than 0.3W/mK.
3. solar cell backboard assembly according to claim 1, the thermal conductivity of wherein said thermoconductive adhesive layer is greater than 0.5W/mk.
4. solar cell backboard assembly according to claim 1, the thermal conductivity of wherein said thermoconductive adhesive layer is greater than 0.8W/mk.
5. the solar cell backboard assembly according to any one of Claims 1-4, the dielectric strength of wherein said thermoconductive adhesive layer is greater than 3000V.
6. the solar cell backboard assembly according to any one of Claims 1-4, the dielectric strength of wherein said thermoconductive adhesive layer is greater than 5000V.
7. the solar cell backboard assembly according to any one of Claims 1-4, the dielectric strength of wherein said thermoconductive adhesive layer is greater than 6000V.
8. the solar cell backboard assembly according to any one of Claims 1-4, the specific insulation of wherein said thermoconductive adhesive layer is greater than 10
10Ω m.
9. the solar cell backboard assembly according to any one of Claims 1-4, the specific insulation of wherein said thermoconductive adhesive layer is greater than 10
11Ω m.
10. solar cell backboard assembly according to claim 1, wherein said acrylic acid based polymer comprises the polymer that at least one is made up of one or more monomers be selected from (methyl) acrylic acid and (methyl) acrylate.
Solar cell backboard assembly according to any one of 11. Claims 1-4 and 10, wherein said heat filling for being selected from pottery, metal oxide, hydrated metal compound, metal nitride, mica, barite, one or more in carborundum and moisture metallic compound.
12. solar cell backboard assemblies according to claim 1, wherein acrylic acid based polymer comprises the polymer of one or more monomers be selected from (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) Hexyl 2-propenoate and (methyl) 2-EHA, and heat filling is selected from Al (OH)
3, BN, SiC, AlN, Al
2o
3, carborundum, TiO
2, SiO
2, zirconia and Si
3n
4in one or more, halogen-free flame retardants is selected from melamine polyphosphate, Mg (OH)
2, Al (OH)
3, Firebrake ZB, APP, triphenyl phosphate, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, one or more in organophosphorus ester and organic phosphate.
13. Claims 1-4, solar cell backboard assembly according to any one of 10 and 12, wherein said thermoconductive adhesive layer has single or multiple lift structure.
14. Claims 1-4, solar cell backboard assembly according to any one of 10 and 12, the Heat Conduction Material that the battery back-sheet of wherein said radiator form meets following condition by one or more is formed:
Thermal conductivity is greater than 0.2W/mk; With
With the bonding force >40N/cm of described thermoconductive adhesive layer.
15. Claims 1-4, solar cell backboard assembly according to any one of 10 and 12, the Heat Conduction Material that the battery back-sheet of wherein said radiator form meets following condition by one or more is formed:
Thermal conductivity is greater than 0.4W/mk; With
With the bonding force >40N/cm of described thermoconductive adhesive layer.
16. Claims 1-4, solar cell backboard assembly according to any one of 10 and 12, the Heat Conduction Material that the battery back-sheet of wherein said radiator form meets following condition by one or more is formed:
Thermal conductivity is greater than 0.7W/mk; With
With the bonding force >40N/cm of described thermoconductive adhesive layer.
17. solar cell backboard assemblies according to claim 14, one or more Heat Conduction Materials wherein forming the battery back-sheet of described radiator form also meet the following conditions:
Fire resistance meets UL94HB standard.
18. solar cell backboard assemblies according to claim 14, one or more Heat Conduction Materials wherein forming the battery back-sheet of described radiator form be selected from the following one or more: metal, thermal conductive polymer material, thermal conductive ceramic and heat conduction inorganic material.
19. solar cell backboard assemblies according to claim 17, one or more Heat Conduction Materials wherein forming the battery back-sheet of described radiator form be selected from the following one or more: metal, thermal conductive polymer material, thermal conductive ceramic and heat conduction inorganic material.
20. solar cell backboard assemblies according to claim 14, one or more Heat Conduction Materials wherein forming the battery back-sheet of described radiator form be selected from the following one or more: aluminium, copper, iron and their alloy, graphite, heat-conducting elastomer, heat-conducting silicon rubber, heat conductive elastomeric plastics, thermal conductivity A 1 N pottery, heat conduction BeO pottery, heat conduction CBN pottery and heat conduction SiC ceramic.
21. solar cell backboard assemblies according to claim 17, one or more Heat Conduction Materials wherein forming the battery back-sheet of described radiator form be selected from the following one or more: aluminium, copper, iron and their alloy, graphite, heat-conducting elastomer, heat-conducting silicon rubber, heat conductive elastomeric plastics, thermal conductivity A 1 N pottery, heat conduction BeO pottery, heat conduction CBN pottery and heat conduction SiC ceramic.
22. solar cell backboard assemblies according to claim 18, one or more Heat Conduction Materials wherein forming the battery back-sheet of described radiator form be selected from the following one or more: aluminium, copper, iron and their alloy, graphite, heat-conducting elastomer, heat-conducting silicon rubber, heat conductive elastomeric plastics, thermal conductivity A 1 N pottery, heat conduction BeO pottery, heat conduction CBN pottery and heat conduction SiC ceramic.
23. solar cell backboard assemblies according to claim 19, one or more Heat Conduction Materials wherein forming the battery back-sheet of described radiator form be selected from the following one or more: aluminium, copper, iron and their alloy, graphite, heat-conducting elastomer, heat-conducting silicon rubber, heat conductive elastomeric plastics, thermal conductivity A 1 N pottery, heat conduction BeO pottery, heat conduction CBN pottery and heat conduction SiC ceramic.
24. Claims 1-4, solar cell backboard assembly according to any one of 10 and 12, wherein solar cell backboard assembly also meets the following conditions:
Dielectric breakdown voltage >15KV; With
Ageing-resistant performance, meets IEC61215 testing standard.
25. Claims 1-4, solar cell backboard assembly according to any one of 10 and 12, the battery back-sheet of wherein said radiator form is film, paper tinsel, flat board, fin or on the outer surface contrary with connecing sensitive side, have the form of the plate of multiple auxiliary-radiating structure.
26. solar cell backboard assemblies according to claim 25, wherein said auxiliary-radiating structure is one or more the projection in cube shaped, cuboid, cylindrical, hemisphere, semi-cylindrical, taper shape or truncated cone-shaped; And the height of projection is for being greater than 0.001mm and being less than 5cm.
27. Claims 1-4, solar cell backboard assembly according to any one of 10 and 12, the battery back-sheet thickness of wherein said radiator form is more than 0.1mm, and below 5mm.
28. 1 kinds of solar modules, comprising:
Header board;
Sealing material layer;
Solar cell circuit; With
Solar cell backboard assembly according to any one of claim 1-27,
The second surface of the thermoconductive adhesive layer of wherein said solar cell backboard assembly and described solar cell electrical contact are also bonded together.
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| CN103545391A (en) * | 2013-11-07 | 2014-01-29 | 中利腾晖光伏科技有限公司 | Anti-crack double glass components |
| CN104659128B (en) * | 2013-11-21 | 2017-09-29 | 台虹科技股份有限公司 | Solar module comprising a thermally conductive sealing composite layer |
| CN104377265A (en) * | 2014-11-20 | 2015-02-25 | 通威太阳能（合肥）有限公司 | Cooling type solar battery assembly and manufacturing technology thereof |
| TWI603496B (en) * | 2016-03-16 | 2017-10-21 | 台虹科技股份有限公司 | Photovoltaic module backplane and photovoltaic module |
| CN106784095A (en) * | 2017-01-10 | 2017-05-31 | 成都聚立汇信科技有限公司 | A kind of rimless film photovoltaic cell component |
| CN108642447A (en) * | 2018-05-08 | 2018-10-12 | 北京汉能光伏投资有限公司 | A kind of curved surface film-coated plate and preparation method thereof and include its solar components |
| CN108706889A (en) * | 2018-05-08 | 2018-10-26 | 北京汉能光伏投资有限公司 | A kind of film-coated plate and preparation method thereof and a kind of solar components |
| CN108630775B (en) * | 2018-05-29 | 2021-03-16 | 浙江巨化技术中心有限公司 | Thin-film solar cell packaged by coating and forming method thereof |
| CN111326593A (en) * | 2018-12-14 | 2020-06-23 | 汉能移动能源控股集团有限公司 | Coating film front plate and photovoltaic module |
| CN111334046A (en) * | 2018-12-18 | 2020-06-26 | 汉能移动能源控股集团有限公司 | Thermally conductive silicone, photovoltaic module and encapsulation method of photovoltaic module |
| CN110993863B (en) * | 2019-11-11 | 2021-09-21 | 江苏厚生新能源科技有限公司 | High-cohesiveness water-based PVDF slurry, preparation method and application thereof |
| US20240084139A1 (en) * | 2020-12-23 | 2024-03-14 | 3M Innovative Properties Company | Composition including polysiloxanes, hydrosilylation catalyst, and phosphorous-containing flame retardant encapsulated in crosslinked, nitrogen-containing polymer and related article |
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