CN102925938A - System for treating laser coating - Google Patents

Abstract

The invention discloses a system for processing laser coatings, comprising a first pulse laser (1) and a second pulse laser (2), a first attenuator (3) and a second attenuator (4), a first electronic Shutter (5) and second electronic shutter (6), first beam expander (7) and second beam expander (8), mirror (9), beam combiner (10), CCD real-time observation system (11 ), optical vibrating mirror (12), focusing objective lens (13), mirror (14), sample substrate to be processed (15), electrolytic cell (16), three-dimensional mobile stage (17) and delay controller (18). The invention realizes sufficient absorption of the heat effect of the laser by the material by using the pulse and wavelength laser beam matched with the absorption characteristic of the material to be processed, and obtains an ideal coating treatment result. The invention is applicable to the treatment processes of laser electroplating, laser chemical plating, laser etching and laser micro-melting.

Description

A system for processing laser coating

technical field

The invention relates to the technical field of laser coating processing, in particular to a system for processing laser coatings, which has a high degree of freedom in controlling the thickness of the coating and the width of the coating line, and can obtain fine coating quality. The invention is applicable to the treatment processes of laser electroplating, laser chemical plating, laser etching and laser micro-melting.

Background technique

Due to the incomparable advantages of laser, such as high energy density, high monochromaticity, good coherence and directionality, etc., its application in surface treatment technology is becoming more and more attractive. Laser-induced coating treatment on metals, semiconductors and polymers has attracted great attention in recent years. This process has broad application prospects in the fabrication and repair of microelectronic circuits.

Ordinary plating treatment occurs on the entire electrode substrate, and the plating treatment speed is slow, making it difficult to form complex and fine patterns. Compared with laser-induced coating treatment, it has obvious advantages. First of all, the control ability of the laser is strong. The laser-induced reaction only occurs in the illuminated area, which can realize the direct local plating of metals on non-metals without masks and at the micron level, and perform unshielded tracing, simplifying the process and saving a lot of precious metals. Secondly, the laser-induced coating treatment can obtain a higher metal deposition rate, and the coating growth rate can be increased by three orders of magnitude. At the same time, the laser coating treatment can also improve the quality of the deposited layer, and the surface of the deposited layer is smoother, and the particle size is uniform and regular. The distribution is dense. Laser irradiation makes the formation speed of metal crystal nuclei much faster than its production speed, so that the formed grains are finer; the high temperature generated by laser irradiation helps the surface diffusion process of metal atoms, so that the coating atoms have a more orderly arrangement.

Laser coating treatment has been more and more widely used for its excellent properties such as high heat resistance, high electrical conductivity and easy welding. Laser-induced plating processes are increasingly playing a role in the design of circuits with complex shapes and adjustable widths, circuit repair and localized deposition on microelectronic connector components.

The process of laser coating treatment is actually the formation process of metal particles. Its growth law and shape depend on various process parameters, such as laser power, scanning rate, irradiation time, spot diameter, composition and concentration of the solution, substrate Process parameters such as surface treatment are related to test conditions. Laser irradiation can increase the speed of nucleation and make the crystal particles fine and dense. The thermal effect generated by the laser also plays a role in partially cleaning the surface of the substrate, so a tightly bonded coating can be obtained on the difficult-to-plate substrate.

The laser coating processing system adopted in the present invention uses different laser pulses, and there is a fixed delay between the two pulses, so that the coating product formed by the main pulse can absorb the energy of the slave pulse, and what is obtained in this way is a corrected laser coating processing The process, which is more efficient than the traditional laser coating process (using continuous laser and single pulse laser), can obtain fine coating quality, and has a high degree of freedom in controlling the thickness of the coating and the width of the coating line. There is a delay between different laser pulses so that the coating treatment material can fully absorb the thermal effect of the laser and improve the controllability and accuracy of the coating treatment. The pulse processing method of the present invention requires laser pulses to have different arrival times, and the time delay between pulses is very important. Further, different pulses may also have different working wavelengths. In addition, the selection and optimization of different pulses must be aimed at the characteristics of the coating material, which determines the final absorption efficiency of the laser pulse by the coating material.

Contents of the invention

(1) Technical problems to be solved

In view of this, the main purpose of the present invention is to provide a system for processing laser coatings, so as to realize fine processing of laser coatings.

(2) Technical solution

To achieve the above object, the present invention provides a system for processing laser coatings, including:

The first pulse laser 1 and the second pulse laser 2 are used to provide the first laser pulse and the second laser pulse for laser plating;

The first attenuator 3 and the second attenuator 4 are used to adjust the output power of the first pulse laser 1 and the second pulse laser 2 to prevent damage to the coating treatment material;

The first electronic shutter 5 and the second electronic shutter 6 are used to control the on-off and irradiation time of the first laser pulse and the second laser pulse respectively;

The first beam expander 7 and the second beam expander 8 are used to respectively expand the laser beam diameters of the first pulse laser 1 and the second pulse laser 2, and reduce the divergence angle of the laser beam;

A reflector 9 and a beam combiner 10, the reflector 9 combines the first laser pulse and the second laser pulse into one laser beam through the beam combiner 10;

CCD real-time observation system 11, for real-time observation of the sample substrate 15 to be processed;

The optical vibrating mirror 12 is used to move the position of the laser beam and control the scanning speed of the laser beam;

Focusing objective lens 13 and reflecting mirror 14, focusing objective lens 13 focuses the laser beam on the surface of the sample substrate 15 to be processed through the reflecting mirror 14;

The electrolytic cell 16 is used to place the electrolyte, and the sample substrate 15 to be processed is placed in the electrolytic cell 16 and connected with the three-dimensional mobile platform 17;

Three-dimensional mobile stage 17, for placing and adjusting the position of the sample base 15 to be processed; and

The delay controller 18 is connected to the first pulsed laser 1 and the second pulsed laser 2 , and controls a time delay between the first laser pulse emitted by the first pulsed laser 1 and the second pulse emitted by the second pulsed laser 2 .

In the above scheme, the first pulse laser 1 and the second pulse laser 2 are connected to the delay controller 18, the pulse width and wavelength of the first laser pulse and the second laser pulse are the same or different, and the first laser pulse It is the same as or has a fixed proportional relationship with the repetition frequency of the second laser pulse. The wavelength range of the first laser pulse and the second laser pulse is from 100 nm to 2 μm, the repetition frequency is from 1 Hz to 100 MHz, and the pulse width is from milliseconds to femtoseconds.

In the above solution, the laser beam formed by the first laser pulse and the second laser pulse passes through the optical vibrating mirror 12 and the focusing objective lens 13 in sequence, and is reflected by the mirror 14 onto the sample substrate 15 to be processed.

In the above solution, the delay controller 18 controls a time delay between the first laser pulse emitted by the first pulsed laser 1 and the second laser pulse emitted by the second pulsed laser 2 through electrical modulation or optical modulation.

In the above solution, the electrical modulation is to use electrical signals to the first pulsed laser 1 and the second pulsed laser 2 to trigger signals without time delay, so that there is a certain time delay between the first laser pulse and the second laser pulse.

In the above solution, the light modulation is achieved by changing the optical path difference between the first laser pulse and the second laser pulse, so that there is a certain time delay between the first laser pulse and the second laser pulse.

In the above solution, the time delay between the first laser pulse and the second laser pulse is less than 1/2 of the pulse interval of the first pulse laser.

In the above solution, the first attenuator 3 and the second attenuator 4 adjust the output power of the first pulsed laser 1 and the second pulsed laser 2, and control the peak power at the focal point from 10 ⁵ W/cm ² to 10 ⁹ W/cm ² .

In the above solution, the optical vibrating mirror 12 controls the scanning speed of the laser beam within the range of 0 to 10 cm/s, and controls the moving range within the range of 10 nm-100 cm.

In the above scheme, the first electronic shutter 5 and the second electronic shutter 6 respectively control the on-off and irradiation time of the first laser pulse and the second laser pulse from 1 μs to 100 s.

In the above solution, the electrolytic cell is used to contain the electrolyte, which contains materials for coating treatment, and is attached to the substrate 15 of the sample to be treated, which is suitable for laser electroplating and laser etching.

In the above scheme, the electrolytic cell is used to hold the chemical plating solution, which contains materials for coating treatment and is attached to the sample substrate 15 to be treated, which is suitable for laser chemical plating.

In the above solution, the electrolytic cell is used to contain electronic slurry, which contains materials for coating treatment, and is attached to the sample substrate 15 to be treated, which is suitable for laser micro-clipping.

In the above scheme, the system also includes: a pulse electroplating power supply, which is used to provide voltage for the positive pole and the negative pole of the electrolytic cell.

In the above solution, the beam splitter 19 is used instead of the second pulsed laser 2 emitting the second laser pulse.

(3) Beneficial effects

As can be seen from the foregoing technical solutions, the present invention has the following beneficial effects:

1. The laser energy irradiated to the target material by traditional laser coating processing technology adopts continuous wave or single pulse. The system for processing laser coating provided by the present invention precisely divides the laser energy into different pulses in time and space , provides a multi-degree-of-freedom control means for precise control of coating growth, with high plating speed and high spatial resolution.

2. The system for processing the laser coating provided by the present invention can better improve the growth efficiency of the coating and the flow of the coating material due to the mutual matching of different laser pulses, and correspondingly reduce the action time of the coating treatment. Makes the thermal energy build up around the coating controllable. Excessive deposition of thermal energy can lead to metallurgical changes such as non-uniform coatings or lines due to particle growth, excessive coating thickness, etc. The present invention can better solve this problem.

3. The system for processing laser coatings provided by the present invention can optimize the heat absorption of laser pulses and coating materials by matching suitable parameter conditions between different laser pulses, such as time delay, wavelength, pulse width and repetition frequency, Realize efficient and fine processing of laser coating treatment.

4. Compared with the continuous laser and single pulse laser adopted in the traditional way, the system for processing the laser coating provided by the present invention, the pulse matching laser coating treatment method adopted can obtain faster processing speed than the traditional method, and has high Processing quality.

Description of drawings

Fig. 1 is the schematic diagram of the system that laser coating is processed according to an embodiment of the present invention;

2 is a schematic diagram of a system for processing laser coatings according to another embodiment of the present invention;

Fig. 3 is a schematic diagram of a time delay controller adopting an optical modulation method according to an embodiment of the present invention.

Figure 4(a) is the time sequence of a single pulse;

Fig. 4 (b) is the time sequence of the first laser pulse and the second laser pulse;

Figure 5(a) is the energy distribution of a single pulse;

Fig. 5(b) is the energy superposition distribution of the first laser pulse and the second laser pulse.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

The present invention will be described below in conjunction with preferred embodiments of the present invention with reference to the accompanying drawings. In the following description, numerous specific details are provided, such as descriptions of optical components, to provide a thorough understanding of embodiments of the invention. However, the invention applies not only to one or more of the specific descriptions, but also to other parameters and materials and the like. The examples set forth below in the specification are illustrative and not restrictive.

The laser beam output by the laser is focused by the lens and projected onto the surface of the cathode, forming a very high optical power density in a small area near the cathode. After the irradiated cathode material absorbs the laser energy, the temperature in the local micro-region near the cathode interface of the electrolyte suddenly rises, resulting in a steep temperature gradient and strong convection in the electrolyte, thereby stirring the solution. The temperature rise and stirring cause the increase of ion mobility in the local area, the enhancement of the cathode reduction reaction and the positive shift of the equilibrium potential, resulting in a greatly enhanced electrochemical reaction in the local area, resulting in a drastic acceleration of the deposition process in the local illuminated area on the cathode surface. This theoretical explanation of the laser-induced coating process enhancement effect is called the thermal model of laser coating process.

There are many factors affecting the deposition quality and rate of laser-induced coating treatment, the main factors are laser power, irradiation time, composition and concentration of solution, pre-treatment and selection of substrate, etc.

Because the present invention has adopted two kinds of different laser pulses of master pulse and slave pulse, there is fixed time delay between master pulse and slave pulse, thereby the coating product that master pulse forms can absorb the energy of slave pulse, what obtains like this is a process The modified laser coating process is more efficient than the traditional laser coating process, and can obtain fine coating quality. It has a high degree of freedom in controlling the thickness of the coating and the width of the coating line. There is a delay between the main pulse and the slave pulse so that the coating treatment material can fully absorb the thermal effect of the laser and improve the controllability and precision of the coating treatment. The pulse processing method of the present invention requires laser pulses to have different arrival times, and the time delay between pulses is very important.

Further, different pulses may also have different working wavelengths. The working mode of the laser pulse including different wavelengths is that the first wavelength of the first pulse causes part of the coating material to be precipitated from the solution, and the second wavelength of the second pulse further improves the thermal effect, and the auxiliary treatment of the first pulse is carried out, so that it can be well Materials that are usually only sensitive to the first pulse can be processed more efficiently, and the input power required for processing is greatly reduced, the processing speed is improved, and the processing quality is better. In addition, the selection and optimization of different pulses must be aimed at the characteristics of the coating material, which determines the final absorption efficiency of the laser pulse by the coating material.

The system for processing laser coating provided by the present invention will be described in detail below in conjunction with the embodiments.

Fig. 1 has provided the schematic diagram of the system that laser coating is processed according to one embodiment of the present invention, and this system comprises first pulse laser 1 and second pulse laser 2, first attenuator 3 and second attenuator 4, the first An electronic shutter 5 and a second electronic shutter 6, a first beam expander 7 and a second beam expander 8, a mirror 9, a beam combiner 10, a CCD real-time observation system 11, an optical vibrating mirror 12, a focusing objective lens 13, a reflector A mirror 14 , a sample substrate to be processed 15 , an electrolytic cell 16 , a three-dimensional moving stage 17 and a delay controller 18 .

The first pulse laser 1 and the second pulse laser 2 are connected to a delay controller 18, and the first pulse laser 1 and the second pulse laser 2 can choose different parameters, such as wavelength, pulse width, output power, etc., and the repetition frequency must be consistent. Or into a fixed proportional relationship. The delay controller 18 controls a time delay between the first pulse emitted by the first pulsed laser 1 and the second pulse emitted by the second pulsed laser 2 by means of electrical modulation, and the time delay is less than the interval between pulses emitted by the first pulsed laser 1 1/2 of. The first attenuator 3 and the second attenuator 4 can further adjust the output power of the first pulse laser 1 and the second pulse laser 2 to prevent damage to the coating material. The first electronic shutter 5 and the second electronic shutter 6 can respectively control the on-off and irradiation time of the first pulse and the second pulse; the first beam expander 7 and the second beam expander 8 expand the first pulse laser 1 and the second pulse respectively The diameter of the laser beam of the second pulse laser 2 reduces the divergence angle of the laser beam. The mirror 9 combines the first pulse and the second pulse into one laser beam through the beam combiner 10 , and the laser beam passes through the optical vibrating mirror 12 and the focusing objective lens 13 in sequence, and is reflected by the mirror 14 onto the sample substrate 15 to be processed. The optical vibrating mirror 12 can move the position of the laser beam under the control of the computer, and control the scanning speed of the laser beam. The focusing objective lens 13 focuses the laser beam on the surface of the sample substrate 15 to be processed through the mirror 14 . The sample substrate 15 to be treated is placed in the electrolytic cell 16 and connected with a three-dimensional mobile platform 17, which is used to place and adjust the position of the substrate for coating treatment. The CCD real-time monitoring system 11 observes the processed coating samples in real time.

Wherein, the delay controller 18 controls a time delay between the first laser pulse emitted by the first pulsed laser 1 and the second laser pulse emitted by the second pulsed laser 2 through electrical modulation or optical modulation. The electrical modulation is to give the first pulse laser 1 and the second pulse laser 2 trigger signals without time delay by using electrical signals, so that there is a certain time delay between the first laser pulse and the second laser pulse. The light modulation is by changing the optical path difference between the first laser pulse and the second laser pulse, so as to realize a certain time delay between the first laser pulse and the second laser pulse. The time delay between the first laser pulse and the second laser pulse is less than 1/2 of the emission pulse interval of the first pulse laser. The repetition frequency of the first laser pulse and the second laser pulse must be consistent, or be in a fixed proportional relationship, so as to maintain a fixed time delay.

The first pulse laser 1 and the second pulse laser 2 are used to provide the first laser pulse and the second laser pulse; the wavelength range is from 100nm-2μm, the repetition frequency is from 1Hz-100MHz, the pulse width is from milliseconds to femtoseconds, and the output average The power is in the range of 1mW-50W. The wavelengths of the first laser pulse and the second laser pulse must be selected in the wavelength band that can be absorbed by the coated substrate but not absorbed by the solution. The first pulse laser 1 and the second pulse laser 2 are all connected to the delay controller 18, the pulse width and wavelength of the first laser pulse and the second laser pulse are the same or different, and the first laser pulse and the second laser pulse The repetition frequency of the pulses is the same or in a fixed proportional relationship. The wavelength range of the first laser pulse and the second laser pulse is from 100 nm to 2 μm, the repetition frequency is from 1 Hz to 100 MHz, and the pulse width is from milliseconds to femtoseconds. The laser beam formed by the first laser pulse and the second laser pulse passes through the optical vibrating mirror 12 and the focusing objective lens 13 in sequence, and is reflected by the reflecting mirror 14 onto the sample substrate 15 to be processed.

The first attenuator 3 and the second attenuator 4 adjust the output power of the first pulse laser 1 and the second pulse laser 2, and control the peak power at the focal point to 10 ⁵ W/cm ² to 10 ⁹ W/cm ² . The optical vibrating mirror 12 controls the scanning speed of the laser beam within the range of 0 to 10 cm/s, and controls the moving range within the range of 10 nm-100 cm. The first electronic shutter 5 and the second electronic shutter 6 respectively control the on-off and irradiation time of the first laser pulse and the second laser pulse from 1 μs to 100 s.

The electrolytic cell is used to contain an electrolyte, which contains materials for coating treatment, and is attached to the substrate 15 of the sample to be treated, and is suitable for laser electroplating and laser etching. The electrolytic cell is used to hold the chemical plating solution, which contains materials for coating treatment, and is attached to the sample base 15 to be treated, and is suitable for laser chemical plating. The electrolytic cell is used to contain electronic slurry, which contains materials for coating treatment and is attached to the sample substrate 15 to be treated, and is suitable for laser micro-clipping.

With regard to the schematic diagram of the system for processing laser coating shown in FIG. 1 , the following describes in detail the process of operating the system for processing laser coating shown in FIG. 1 to achieve processing laser coating.

1) Turn on the power of the first pulse laser 1 and the second pulse laser 2, and the wavelength of the first laser pulse and the second laser pulse must be selected to be a wavelength band that can be absorbed by the substrate 15 of the sample to be treated but not by the solution. The average output power is in the range of 1mW-50W, the wavelength is in the range of 100nm to 2um, the pulse width is from milliseconds to femtoseconds, and the repetition frequency is from 1Hz to 100MHz.

2) Adjusting the time delay between the first laser pulse and the second laser pulse, the time delay is less than 1/2 of the interval between the first laser pulses emitted by the first pulse laser 1 . The repetition frequency of the first laser pulse and the second laser pulse must be consistent, or be in a fixed proportional relationship, so as to maintain a fixed time delay.

3) Adjust the first beam expander 7 and the second beam expander 8, the reflector 9, the beam combiner 10, the CCD real-time observation system 11, the focusing objective lens 13 and the reflector 14, etc., and manipulate the mobile optical vibrating mirror 12 and the three-dimensional movement The stage 17 is used to focus the laser beam formed by the combination of the first pulse and the second pulse on the same place on the surface of the processed substrate to be coated. Due to the superposition of the thermal effects of different laser pulses, the maskless coating treatment is selectively performed directly on the substrate surface, and the material with slightly poor thermal conductivity has an advantage over the material with good thermal conductivity, absorbing the pulses arriving at different times to locally increase the temperature The higher the difference, the faster the response and the more pronounced the effect, but pay attention to the damage threshold of the material.

4) Control the peak power at the focal point to 10 ⁵ W/cm ² to 10 ⁹ W/cm ² through the first attenuator 3 and the second attenuator 4, so that the laser energy is less than the damage threshold of the material and the vaporization threshold of the electrolyte .

5) Control the scanning speed of the laser from 0 to 10cm/s through the optical vibrating mirror 12, and the laser beam moves within the range of 10nm-100cm; the first electronic shutter 5 and the second electronic shutter 6 control the on-off of the laser pulse and the irradiation time from 1 μs to 100s, carry out multi-laser pulse direct writing coating treatment.

Fig. 2 shows a schematic diagram of a system for processing laser coatings according to another embodiment of the present invention. The difference between this system and the system in Fig. 1 is that a beam splitter 19 is used instead of the second pulse laser 2 emitting the second pulse, and the delay controller 18 adopts optical modulation to realize time delay, and its realization principle is shown in the figure 3, while the delay controller 18 in FIG. 1 implements time delay by means of electrical modulation. Other structures in the embodiment shown in FIG. 2 are the same as those in FIG. 1 .

The optical modulation time delay device in Fig. 3 is composed of two pairs of vertically placed mirrors, and the purpose of controlling the time delay can be achieved by adjusting the distance between the two pairs of mirrors. The main control oscillator of the electronically modulated time delay device works in a trigger mode, and outputs main pulses with different delays in two channels to generate electrical signals with adjustable width, amplitude and repetition frequency to control the output of the laser.

Fig. 4 compares (a) the traditional method: the time sequence of single pulse and (b) the multi-pulse processing method of the present invention: the generation sequence of the first laser pulse and the second laser pulse, it can be seen that the processing method of multi-pulse provides The modified laser coating processing process has a high degree of freedom in controlling the thickness of the coating and the width of the coating line. Figure 5 shows (a) the energy distribution of a single pulse in the traditional method, and (b) the energy superposition distribution of the first laser pulse and the second laser pulse in the multi-pulse processing method of the present invention, and it can be seen that the multi-pulse processing The energy distribution in one cycle of the method is more concentrated, which is more efficient than the traditional laser coating process.

The method for processing the laser coating provided by the invention is realized based on the system for processing the laser coating provided by the invention.

Example 1

Embodiment 1 is a detailed description of the laser coating treatment method provided by the present invention with reference to FIG. 1 .

The first pulse laser 1 is a Q-switched YAG frequency-doubled laser. The output laser beam has a wavelength of 532nm, an average power of 350mW, a pulse width of 100ns, a focused spot diameter of 500um, and an operating frequency of 200KHz; the second pulse laser 2 is Q-switched. The wavelength of the laser beam output by the YAG frequency doubled laser is 355nm, the average power is 200mW, the pulse width is 50ns, the spot diameter after focusing is 300um, and the working frequency is 200KHz.

The first pulse laser 1 and the second pulse laser 2 are connected to a delay controller 18, and the delay controller 18 controls the interval between the first pulse emitted by the first pulse laser 1 and the second pulse emitted by the second pulse laser 2 by means of electrical modulation. There is a time delay which is 100ns. The first pulsed laser 1 and the second pulsed laser 2 can choose different parameters, such as wavelength, pulse width, output power and so on. The first attenuator 3 and the second attenuator 4 can further adjust the output power of the first pulse laser 1 and the second pulse laser 2 to prevent damage to the coating material. The first electronic shutter 5 and the second electronic shutter 6 can respectively control the on-off and irradiation time of the first pulse and the second pulse; the first beam expander 7 and the second beam expander 8 expand the first pulse laser 1 and the second pulse respectively The diameter of the laser beam of the second pulse laser 2 reduces the divergence angle of the laser beam. The mirror 9 combines the first pulse and the second pulse into one laser beam through the beam combiner 10 , and the laser beam passes through the optical vibrating mirror 12 and the focusing objective lens 13 in sequence, and is reflected by the mirror 14 onto the sample substrate 15 to be processed. The optical vibrating mirror 12 can move the position of the laser beam under the control of the computer, control the scanning speed of the laser beam, and make the laser beam move within the range of 10nm-100cm.

The focusing objective lens 13 focuses the laser beam on the surface of the sample substrate 15 to be processed through the mirror 14 . The sample substrate 15 to be processed is placed in the electrolytic cell 16 and connected with a three-dimensional mobile stage 17 . The side of the electrolytic cell 16 is a light-through window, and the sample substrate 15 to be processed is fixed on a three-dimensional mobile stage 17 . A DC voltage is applied between the cathode and the anode of the electrolytic cell 16, powered by a DC stabilized power supply. The laser beam is focused and irradiated on the cathode. The cathode is a glass substrate pre-plated with a nickel film, and the anode is a metal platinum sheet. The electrolyte is copper sulfate aqueous solution, which has good transparency to 532nm laser. The three-dimensional mobile stage 17 is used to place or move the substrate for coating treatment, and moves within the range of 10nm-100cm. The CCD real-time monitoring system 11 observes the processed coating samples in real time.

Example 2

Embodiment 2 is a detailed description of the method for processing the laser coating provided by the present invention with reference to FIG. 2 .

The first pulse laser 1 is a Q-switched YAG frequency-doubled laser outputting a laser beam with a wavelength of 532nm, an average power of 350mW, a pulse width of 50ns, a spot diameter of 500um after focusing, and an operating frequency of 200kHz. Use the beam splitter 19 to split the second laser beam, and use the spatial optical time delay device to adjust the relative positions of the two pairs of mirrors in FIG. 3 so that the interval between the first laser pulse and the second laser pulse is 100 ns. Other operation steps are with embodiment 1

The invention provides a system for processing the laser coating, which realizes the fine processing of the laser coating. The laser fine processing method and system can be precisely controlled by laser coating processing. By using the laser beam with pulse and wavelength matching the absorption characteristics of the material to be processed, the material can fully absorb the thermal effect of the laser, and the ideal coating treatment result can be obtained.

Due to the superposition of the thermal effects of different laser pulses, the maskless coating treatment is selectively performed directly on the substrate surface, and the material with slightly poor thermal conductivity has an advantage over the material with good thermal conductivity, absorbing the pulses arriving at different times to locally increase the temperature The higher the difference, the faster the response and the more pronounced the effect, but pay attention to the damage threshold of the material.

The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (16)

1. A system for processing laser coatings, characterized in that it comprises: A first pulse laser (1) and a second pulse laser (2), for providing a first laser pulse and a second laser pulse for laser electroplating; The first attenuator (3) and the second attenuator (4) are used to adjust the output power of the first pulse laser (1) and the second pulse laser (2) to prevent damage to the coating treatment material; The first electronic shutter (5) and the second electronic shutter (6) are used to control the on-off and irradiation time of the first laser pulse and the second laser pulse respectively; The first beam expander (7) and the second beam expander (8) are used to expand the laser beam diameters of the first pulse laser (1) and the second pulse laser (2) respectively, and reduce the divergence angle of the laser beam; A reflector (9) and a beam combiner (10), the reflector (9) merges the first laser pulse and the second laser pulse into one laser beam through the beam combiner (10); CCD real-time observation system (11), used for real-time observation of the sample substrate to be processed (15); Optical vibrating mirror (12), used to move the position of the laser beam, and control the scanning speed of the laser beam; Focusing objective lens (13) and reflecting mirror (14), focusing objective lens (13) focuses the laser beam on the surface of the sample substrate to be processed (15) through reflecting mirror (14); Electrolytic cell (16), for placing electrolyte, and the sample base (15) to be processed is placed in electrolytic cell 16 and is connected with three-dimensional mobile platform (17); A three-dimensional mobile stage (17), used to place and adjust the position of the sample base (15) to be processed; and A delay controller (18), connected to the first pulse laser (1) and the second pulse laser (2), controls the first laser pulse emitted by the first pulse laser (1) and the emission of the second laser pulse laser (2). There is a time delay between the second pulses. 2. The system for processing laser coating according to claim 1, characterized in that, the first pulsed laser (1) and the second pulsed laser (2) are all connected to a delay controller (18), the first The pulse width and wavelength of the laser pulse and the second laser pulse are the same or different, and the repetition frequency of the first laser pulse and the second laser pulse are the same or have a fixed proportional relationship. 3. The system for processing laser coating according to claim 2, characterized in that, the wavelength range of the first laser pulse and the second laser pulse is from 100nm-2μm, the repetition frequency is from 1Hz-100MHz, and the pulse width is from milliseconds to femtoseconds. 4. The system for processing laser coatings according to claim 1, characterized in that the laser beams formed by the first laser pulse and the second laser pulse pass through the optical vibrating mirror (12) and the focusing objective lens (13) successively , and is reflected by the mirror (14) onto the sample substrate (15) to be processed. 5. The system for processing laser coating according to claim 1, characterized in that, the delay controller (18) controls the first laser emitted by the first pulse laser (1) by means of electrical modulation or optical modulation There is a time delay between the pulse and the second laser pulse emitted by the second pulse laser (2). 6. The system for processing laser coating according to claim 5, characterized in that, the electrical modulation is triggered by using electrical signals to the first pulsed laser (1) and the second pulsed laser (2) without time delay signal so that there is a certain time delay between the first laser pulse and the second laser pulse. 7. The system for processing laser coatings according to claim 5, wherein the light modulation is by changing the optical path difference between the first laser pulse and the second laser pulse, thereby realizing the first laser pulse There is a certain time delay between and the second laser pulse. 8 . The system for processing laser coatings according to claim 5 , wherein the time delay between the first laser pulse and the second laser pulse is less than 1/2 of the emission pulse interval of the first pulse laser. 9. The system for processing laser coating according to claim 1, characterized in that, the first attenuator (3) and the second attenuator (4) adjust the first pulse laser (1) and the second pulse The output power of the laser (2) controls the peak power at the focal point to be 10 ⁵ W/cm ² to 10 ⁹ W/cm ² . 10. The system for processing laser coating according to claim 1, characterized in that, the optical vibrating mirror (12) controls the scanning speed of the laser beam within the range of 0 to 10 cm/s, and the moving range is controlled at 10 nm -100cm range. 11. The system for processing laser coating according to claim 1, characterized in that, the first electronic shutter (5) and the second electronic shutter (6) respectively control the first laser pulse and the second laser pulse On-off and irradiation time from 1μs to 100s. 12. The system for processing laser coating according to claim 1, characterized in that, the electrolytic cell is used to hold electrolyte, and the electrolyte contains materials for coating treatment, and it is attached to the Process the sample substrate (15), suitable for laser plating and laser etching. 13. The system for processing laser coating according to claim 1, wherein the electrolytic cell is used to hold the chemical plating solution, and the chemical plating solution contains materials for coating treatment, and it is attached It is suitable for laser chemical plating on the sample substrate (15) to be processed. 14. The system for processing laser coating according to claim 1, wherein the electrolytic cell is used to hold electronic slurry, and the electronic slurry contains materials for coating treatment, and is attached to the On the sample substrate (15) to be processed, it is suitable for laser micro cladding. 15. The system for processing laser coating according to claim 1, characterized in that, the system also comprises: Pulse electroplating power supply for supplying voltage to the positive and negative poles of the electrolytic cell. 16. The system for processing laser coatings according to any one of claims 1 to 15, characterized in that a beam splitter (19) is used instead of the second pulsed laser (2) emitting the second laser pulse.

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