CN102898786B - Epoxy molding compound for packaging tantalum capacitor and manufacturing method for epoxy molding compound - Google Patents
Epoxy molding compound for packaging tantalum capacitor and manufacturing method for epoxy molding compound Download PDFInfo
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- CN102898786B CN102898786B CN201210433306.7A CN201210433306A CN102898786B CN 102898786 B CN102898786 B CN 102898786B CN 201210433306 A CN201210433306 A CN 201210433306A CN 102898786 B CN102898786 B CN 102898786B
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Abstract
The invention relates to an epoxy molding compound for packaging a tantalum capacitor and a manufacturing method for the epoxy molding compound, and belongs to the technical field of epoxy molding compounds. The epoxy molding compound for packaging the tantalum capacitor is characterized by comprising the following components in percentage by mass: 3 to 10 percent of multifunctional epoxy resin, 1 to 5 percent of multifunctional phenolic resin, 0.5 to 3 percent of reactive diluent, 0.5 to 2 percent of stress-releasing agent, 0.1 to 1 percent of accelerant and 70 to 90 percent of mineral filler. The manufacturing method comprises the following steps of: adding the components of the epoxy molding compound into a mixer, mixing the components uniformly, extruding the mixture by using a twin-screw extruder at the temperature of between 100 and 150 DEG C, cooling, crushing and performing pre-press molding to obtain the epoxy molding compound for packaging the tantalum capacitor. The epoxy molding compound for packaging the tantalum capacitor is halogen-free and antimony-free, can package tantalum capacitors at low temperature and under low pressure, and is low in stress, and high in moldability, relux resistance, wet resistance and reliability; the manufacturing method is convenient to operate, high in production efficiency, safe and reliable, and product quality is stable; and the epoxy molding compound is particularly suitable for packaging a polymer solid chip tantalum capacitor.
Description
Technical field
The invention belongs to epoxy plastic cement technical field, particularly relate to a kind of tantalum electric capacity encapsulation epoxy plastic cement and preparation method thereof.
Background technology
At present, epoxy plastic cement is mainly made up of epoxy resin, crosslinking and curing agent, curing catalyst and additive etc.Because it has many outstanding characteristics, as good thermostability, insulativity, adhesivity, good mechanical property, good building-up properties and lower cost etc., be widely used in the encapsulation of tantalum capacitor part.Compare alminium electrolytic condenser, the feature of tantalum electric capacity is that the life-span is long, high temperature resistant, accuracy is high, filter high-frequency harmonic performance is fabulous, the traditional common tantalum electric capacity of replacement just gradually.Different from common tantalum electric capacity, polymer tantalum electric capacity cathode layer be fragile macromolecule membrane, intensity is very low, this just to encapsulation plastic cement very high requirement has been proposed.
While using traditional epoxy plastic cement encapsulation polymer tantalum electric capacity, can cause very large destruction by anticathode layer, have a strong impact on electrical property, the reliability of tantalum electric capacity.And due to the vulnerability of polymer tantalum capacitance cathode layer, the manufacturer of tantalum electric capacity generally adopts lower injection pressure, lower package temperature, the destruction of reducing to greatest extent anticathode layer in packaging process.But under this processing condition, there are a lot of shortcomings in common epoxy plastic cement, for example, in the time of low injection pressure encapsulation, there will be problems such as leaking envelope, pore, in the time that low temperature encapsulates, there will be the problems such as long, disconnected muscle set time, sticking to mould.
Summary of the invention
The present invention provides a kind of tantalum electric capacity encapsulation epoxy plastic cement and preparation method thereof for solving the technical problem existing in known technology.
One of object of the present invention is to provide a kind of halogen-free stibium-free, can meet low temperature and low pressure encapsulation, possesses the tantalum electric capacity encapsulation epoxy plastic cement of the features such as outstanding low-stress, formability, resistance to backflow, wet fastness and reliability simultaneously; Can in the time of lower injection pressure and low temperature injection moulding, have good formability.
Technological innovation of the present invention is that arrange in pairs or groups reactive thinner and stress relief agent can be prepared the epoxy plastic cement of reaching above-mentioned purpose simultaneously by using polyfunctional epoxy resin and multifunctional phenolic resin.
Tantalum electric capacity of the present invention encapsulates the technical scheme of taking with epoxy plastic cement:
A kind of tantalum electric capacity encapsulation epoxy plastic cement, be characterized in: epoxy plastic cement contains following component, the mass percent of each component is polyfunctional epoxy resin 3-10%, multifunctional phenolic resin 1-5%, reactive thinner 0.5-3%, stress relief agent 0.5-2%, promotor 0.1-1%, mineral filler 70-90%;
Polyfunctional epoxy resin is one or more in trifunctional or four-functional group epoxy resin, and structure is as shown in the formula shown in (1), (2), (3), (4):
Formula (1) formula (2)
Formula (3) formula (4)
Wherein n represents 1-10;
Multifunctional phenolic resin is in each molecule, at least to contain one or more in the resol of 2 hydroxyls, and its structure is suc as formula shown in (5) and (6):
Wherein n represents 1-10;
Reactive thinner is one or more in simple function group or multi-functional epoxy resin, and structural formula is as shown in the formula (7), shown in (8):
Stress relief agent is one or more in organic silicone oil, silicone rubber powder, silicone powders.
Tantalum electric capacity encapsulation of the present invention can also adopt following technical scheme with epoxy plastic cement:
Described tantalum electric capacity encapsulation epoxy plastic cement, is characterized in: promotor is one or more in glyoxal ethyline, 2-phenyl-4 Methylimidazole, triphenyl phosphorus, diazabicylo.
Described tantalum electric capacity encapsulation epoxy plastic cement, is characterized in: mineral filler is preparing spherical SiO 2, and it is 5%-30% that meta particle diameter is less than the mass percent of 5 microns.
Described tantalum electric capacity encapsulation epoxy plastic cement, is characterized in: epoxy plastic cement contains the pigment that mass percent is 0.1%-4%.Pigment can be selected carbon black.
Described tantalum electric capacity encapsulation epoxy plastic cement, is characterized in: the coupling agent that epoxy plastic cement contains mass percent 0.1%-1%.Coupling agent can be selected KH560.
Described tantalum electric capacity encapsulation epoxy plastic cement, is characterized in: epoxy plastic cement contains the releasing agent that mass percent is 0.1%-1%.Releasing agent can be selected carnauba wax.
Two of object of the present invention is to provide one and is applicable to encapsulate polymer solid sheet type tantalum electric capacity, easy to operate, safe and reliable, steady quality, the preparation method of epoxy plastic cement for the tantalum electric capacity encapsulation of production efficiency high.
Tantalum electric capacity encapsulation of the present invention by the technical scheme that the preparation method of epoxy plastic cement takes is:
The preparation method of epoxy plastic cement for a kind of tantalum electric capacity encapsulation, be characterized in: will contain following component, the mass percent of each component is polyfunctional epoxy resin 3-10%, multifunctional phenolic resin 1-5%, reactive thinner 0.5-3%, stress relief agent 0.5-2%, promotor 0.1-1%, the epoxy plastic cement of mineral filler 70-90%, join in mixing machine and mix, extrude at 100-150 ℃ through twin screw extruder, pre-molding after cooling crush, obtains tantalum electric capacity encapsulation epoxy plastic cement.
Advantage and positively effect that the present invention has are:
The polyfunctional epoxy resin that epoxy plastic cement of the present invention is used and resol are due to its rapidly-curable, can be that plastic cement can reach higher cross-linking density at lower temperature, meet normal encapsulation requirement, simultaneously by the use of spherical silicon powder and the interpolation of reactive thinner, can reduce significantly the melt viscosity of epoxy plastic cement, guarantee that plastic cement has good mobility under lower pressure, meet the seal pressure requirement of product.Due to the vulnerability of polymer tantalum capacitance cathode layer, use global-type silicon-dioxide and stress relief agent, greatly reduce the internal stress of epoxy plastic cement, improve the reliability of tantalum electric capacity.
Tantalum electric capacity encapsulates with epoxy plastic cement and preparation method thereof owing to having adopted the brand-new technical scheme of the present invention, compared with prior art, the present invention has halogen-free stibium-free, can meet low temperature and low pressure encapsulation, possess outstanding low-stress, formability, resistance to backflow, wet fastness and reliability simultaneously, and easy to operate, safe and reliable, steady quality, production efficiency advantages of higher; Can in the time of lower injection pressure and low temperature injection moulding, have good formability, be specially adapted to encapsulate polymer solid sheet type tantalum electric capacity.
Embodiment
For further understanding summary of the invention of the present invention, Characteristic, hereby exemplify following examples, and be described in detail as follows:
Embodiment 1
Tantalum electric capacity encapsulation epoxy plastic cement, by each component according to table 1 ratio weigh, mix, by the material mixing at twin screw extruder with 100 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Embodiment 2
By each component according to table 1 ratio weigh, mix, by the material mixing at twin screw extruder with 120 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Embodiment 3
By each component according to table 1 ratio weigh, mix, by the material mixing at twin screw extruder with 150 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Embodiment 4
By each component according to table 1 ratio weigh, mix, by the material mixing at twin screw extruder with 120 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Embodiment 5
By each component according to table 1 ratio weigh, mix, by the material mixing at twin screw extruder with 120 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Embodiment 6
By each component according to table 1 ratio weigh, mix, by the material mixing at twin screw extruder with 120 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Embodiment 7
By each component according to table 1 ratio weigh, mix, by the material mixing at twin screw extruder with 120 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Comparative example 1
Except epoxy resin and solidifying agent use is common o-cresol epoxy resin and common resol, other each components are identical with ratio in table 1, mix, by the material mixing at twin screw extruder with 120 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Comparative example 2
Except not adding reactive thinner, other each components are identical with ratio in table 1, mix, by the material mixing at twin screw extruder with 120 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Comparative example 3
Except not adding stress relief agent, other each components are identical with ratio in table 1, mix, by the material mixing at twin screw extruder with 120 degree melting mixings, the cooling rear pulverizing of compressing tablet, pancake making machine pre-molding, test products performance index.
Use following mineral filler:
Mineral filler 1: median particle diameter is the spherical silica of 2 μ m
Mineral filler 2: median particle diameter is the spherical silica of 20 μ m
Use following epoxy resin
Epoxy resin 1: formula (1) structural epoxy resins
Epoxy resin 2: formula (2) structural epoxy resins
Epoxy resin 3: formula (3) structural epoxy resins
Epoxy resin 4: formula (4) structural epoxy resins
Use following solidifying agent:
Solidifying agent 1: formula (5) structure phenolic aldehyde resin
Solidifying agent 2: formula (6) structure phenolic aldehyde resin
Use following epoxide diluent:
Reactive thinner 1: the reactive thinner of formula (7) structure
Reactive thinner 2: the reactive thinner of formula (8) structure
Use following curing catalyst
Curing catalyst 1:2-Methylimidazole
Curing catalyst 2: triphenyl phosphorus
Curing catalyst 3: diazabicylo
Use following stress relief agent
Stress relief agent 1:PMX200
Stress relief agent 2:DY33
Table 1
Product performance:
1. helix length
In low temperature (150 ℃) and low pressure (5MPa) situation, the length of flow of test plastic cement in mould, the mobility of the longer explanation plastic cement of helix length is better, and encapsulation performance is better.
2. set time
Use gel instrument to measure plastic cement gel time in 150 ℃ of situations, set time, the curing performance of shorter explanation plastic cement was better.
3. hot hardness
Hardness when hot while using Shore durometer to measure 150 ℃ of plastic cements to solidify 45 seconds, the curing of the higher explanation plastic cement of hardness is better.
4. linear expansivity
Use TMA to measure linear expansivity α 1 and the α 2 of plastic cement before and after Tg point, the coefficient of expansion is less, illustrates that stress when plastic cement solidifies is lower, and the reliability of encapsulating products is higher.
5. thermal shock experiment
Use the plastic cement encapsulation polymer tantalum electric capacity in embodiment, the thermal shock that then product is carried out to 5 circulations, the leakage current of test products after taking out, the qualification rate of test products.Qualification rate is higher, illustrates that the stress of plastic cement is less, and the reliability of product is higher.
The result of testing each embodiment and comparative example is as shown in table 2
The each embodiment product performance of table 2
Claims (6)
1. a tantalum electric capacity encapsulation epoxy plastic cement, it is characterized in that: epoxy plastic cement contains following component, the mass percent of each component is polyfunctional epoxy resin 3-10%, multifunctional phenolic resin 1-5%, reactive thinner 0.5-3%, stress relief agent 0.5-2%, promotor 0.1-1%, mineral filler 70-90%;
Polyfunctional epoxy resin structure is as shown in the formula shown in (1), (2), (3), (4):
Wherein n represents 1-10;
Multifunctional phenolic resin is in each molecule, at least to contain one or more in the resol of 2 hydroxyls, and its structure is suc as formula shown in (5) and (6):
Wherein n represents 1-10;
Reactive thinner is one or more in simple function group or multi-functional epoxy resin, and structural formula is as shown in the formula (7), shown in (8):
Stress relief agent is one or more in organic silicone oil, silicone rubber powder, silicone powders.
2. tantalum electric capacity encapsulation epoxy plastic cement according to claim 1, is characterized in that: promotor is one or more in glyoxal ethyline, 2-phenyl-4 Methylimidazole, triphenyl phosphorus, diazabicylo.
3. tantalum electric capacity encapsulation epoxy plastic cement according to claim 1 and 2, is characterized in that: epoxy plastic cement contains the pigment that mass percent is 0.1%-4%.
4. tantalum electric capacity encapsulation epoxy plastic cement according to claim 1 and 2, is characterized in that: the coupling agent that epoxy plastic cement contains mass percent 0.1%-1%.
5. tantalum electric capacity encapsulation epoxy plastic cement according to claim 1 and 2, is characterized in that: epoxy plastic cement contains the releasing agent that mass percent is 0.1%-1%.
6. the preparation method of epoxy plastic cement for tantalum electric capacity encapsulation according to claim 1, it is characterized in that: will contain following component, the mass percent of each component is polyfunctional epoxy resin 3-10%, multifunctional phenolic resin 1-5%, reactive thinner 0.5-3%, stress relief agent 0.5-2%, promotor 0.1-1%, the epoxy plastic cement of mineral filler 70-90%, join in mixing machine and mix, extrude at 100-150 ℃ through twin screw extruder, pre-molding after cooling crush, obtains tantalum electric capacity encapsulation epoxy plastic cement.
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| CN104017332B (en) * | 2014-06-09 | 2016-05-25 | 浙江恒耀电子材料有限公司 | The preparation method of environment-friendly epoxy modulus composite material for the encapsulation of tantalum electric capacity |
| JP2016108561A (en) * | 2014-12-04 | 2016-06-20 | 日東電工株式会社 | Soft magnetic resin composition and soft magnetic film |
| CN105385101B (en) * | 2015-12-14 | 2017-12-05 | 南安市威速电子科技有限公司 | The encapsulating material of Large Copacity thin-film capacitor |
| CN112980139A (en) * | 2019-12-17 | 2021-06-18 | 衡所华威电子有限公司 | Epoxy resin composition for tantalum capacitor packaging and preparation method thereof |
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Effective date of registration: 20230412 Address after: No.27, Yijing Road, Dongli District, Tianjin Patentee after: TIANJIN KAIHUA INSULATING MATERIALS Co.,Ltd. Address before: No. 27 Yijing Road, Dongli Development Zone, Dongli District, Tianjin, 300300 Patentee before: TIANJIN SHENGYUANDA TECH CO.,LTD. |