CN102886281A - Micro-fluidic chip bonding device based on PMMA (polymethyl methacrylate) and other polymers - Google Patents
Micro-fluidic chip bonding device based on PMMA (polymethyl methacrylate) and other polymers Download PDFInfo
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- CN102886281A CN102886281A CN2012103959181A CN201210395918A CN102886281A CN 102886281 A CN102886281 A CN 102886281A CN 2012103959181 A CN2012103959181 A CN 2012103959181A CN 201210395918 A CN201210395918 A CN 201210395918A CN 102886281 A CN102886281 A CN 102886281A
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Abstract
一种基于PMMA及其它聚合物材质的微流控芯片的键合装置，涉及一种微流控芯片的键合装置，由电磁波发生装置、功率控制器、定时器、K型测温热电偶与温度显示器、防电磁波泄漏的隔热密闭容器、加热基板组成，隔热密闭容器内部设置有电磁波发生装置和加热基板，加热基板位于隔热密闭容器底部的载物台上，加热基板与位于隔热密闭容器外部的K型测温热电偶与温度显示器连接，电磁波发生装置为容器内置的磁控管微波发生装置，磁控管与位于隔热密闭容器外部的功率控制器和定时器通过导线相连接。本发明的微流控芯片微沟道键合装置工艺成本低，效率高，操作便捷，易于在微流控芯片的键合领域推广应用。
A bonding device for a microfluidic chip based on PMMA and other polymer materials, relates to a bonding device for a microfluidic chip, which consists of an electromagnetic wave generator, a power controller, a timer, a K-type temperature measuring thermocouple and It consists of a temperature display, a heat-insulated airtight container to prevent electromagnetic wave leakage, and a heating substrate. An electromagnetic wave generator and a heating substrate are installed inside the heat-insulating airtight container. The heating substrate is located on the stage at the bottom of the heat-insulating airtight container. The K-type temperature measuring thermocouple outside the airtight container is connected to the temperature display, and the electromagnetic wave generating device is a magnetron microwave generating device built in the container, and the magnetron is connected to the power controller and timer located outside the heat-insulated airtight container through wires . The microfluidic chip microchannel bonding device of the present invention has low process cost, high efficiency, convenient operation, and is easy to be popularized and applied in the bonding field of microfluidic chips.
Description
Technical field
The present invention relates to a kind of bonding apparatus of micro-fluidic chip, be specifically related to a kind ofly based on the PMMA(polymethyl methacrylate, be commonly called as lucite) and the electromagnetic wave bonding apparatus of the micro-fluidic chip of other organic polymer material.
Background technology
Micro-fluidic chip refers to a biological or chemical laboratory micro to a piece to be only had on several square centimeters of large thin slices by micro-processing technology and other processing method.Chemistry that chip piece makes up or biology laboratory can be with sample preparation, reaction related in chemistry and the biological field, separate, detection, the basic operation units such as cell cultivation, sorting, cracking carry out integrated.Finally, above-mentioned operating unit can be integrated on the very little chip, forms network by the microchannel, runs through whole system with controlled fluid, in order to realize the various functions of conventional chemical or biology laboratory.
This technology has the advantages such as the required sample size of detection is few, detection time is short, cost of manufacture is low, and can make effective detection to specific ion, compound, dna fragmentation etc.This technology can be widely used in the fields such as environmental protection, military affairs, medicine, biochemistry.In recent years, increasingly mature along with micro-processing technology, MEMS technology and electronic technology, micro-fluidic chip begins to integrated, microminiaturized future development.
The micro-fluidic chip of present polymerizable material at home and abroad more typical bonding mode mainly contains pressure sintering, supersonic bonding method etc.The precision hot pressing equipment cost of pressure sintering is higher, and the time of preheating and bonding is all long, and needs to apply certain pressure in bonding process, easily causes the change of little raceway groove shape of cross section.After carrying out thermocompression bonding, the organic matter on the micro-fluidic chip can be attached on hot press heat block or the pad, not easy cleaning.The supersonic bonding method need to be made energy-oriented-ridge at chip when in use, and this has increased operation and the complexity of chip manufacturing.When the underpower of supersonic generator itself when melting energy-oriented-ridge, also need the chip preheating that heats up.Simultaneously, the same with pressure sintering, the ultrasonic bond method also need to apply in the upper and lower surface of micro-fluidic chip certain pressure usually, if control improperly, can increase the channel-type variable equally.In addition, also there are some problems in other bonding method, such as gluing method, easily stop up little raceway groove in adhesion process, and the hardening time of glue is also long.In a word, there are various practical problems in the bonding method of above-mentioned polymeric micro-fluidic chip in actual application.This runs counter to micro-fluidic chip and realizes universal aim by integrated, microminiaturized, thereby limits it in the application of every field.
Summary of the invention
The bonding apparatus that the purpose of this invention is to provide a kind of micro-fluidic chip based on PMMA and other polymerizable material, it can reduce the chip bonding equipment cost, shorten the chip bonding time with technological process, guarantee that the basis of chip bonding intensity advances the universal of micro-fluidic chip.
The objective of the invention is to be achieved through the following technical solutions:
The bonding apparatus of the micro-fluidic chip based on PMMA and other polymerizable material of the present invention is by electromagnetic wave generating device (magnetron), power controller, timer, K type temperature thermocouple (being temperature sensor) and temperature indicator (being used for the temperature that demonstration K type thermocouple gathers), the heat insulating and sealing container that anti electromagnetic wave leaks, heated substrates forms, the heat insulating and sealing internal tank is provided with electromagnetic wave generating device and heated substrates, heated substrates is positioned on the objective table of heat insulating and sealing container bottom, heated substrates is connected with temperature indicator with the K type temperature thermocouple that is positioned at the heat insulating and sealing external container, electromagnetic wave generating device is the built-in microwave magnetron generating means of container, and magnetron is connected with timer with the power controller that is positioned at the heat insulating and sealing external container.
Polymeric micro-fluidic chip bonding apparatus of the present invention adopts electromagenetic wave radiation to be attached to two heated substrates of micro-fluidic chip upper and lower surface, heated substrates is subject to electromagenetic wave radiation and produces rapidly large calorimetric, heat is transmitted to the up and down bonded interface of two substrates of micro-fluidic chip from heated substrates, and it is bonded together under molten condition.Whole bonding process is finished in closed container.Bonding apparatus has used output control device and timer, so that the adjusting process parameter, and required temperature and bond strength when guaranteeing bonding.
The selection of chip is lucite and other organic polymer, the area of heated substrates≤200 * 200mm
2, the electromagnetic wave generator that adopts power can regulate and have timing function in the closed container of isolating electromagnetic and heat heats substrate, and power regulating range is 0-2500W, and the time setting range is 0-3600S.Wherein, substrate mixes the quality of absorbing material and can accurately control take 0.1mg as unit, and substrate and chip up and down two surfaces are close to the heat that will discharge and are delivered to thermal bonding at the interface.
The content of the material that can absorb the microwave release heat that mixes in the heated substrates can accurately be controlled, and the heating rate under electromagnetic wave irradiation can effectively be regulated, thereby guarantees that the deformation quantity of little raceway groove when bonding is smaller.K type temperature thermocouple and temperature indicator can detect and be presented at the unusual fluctuations of temperature in the bonding process.According to institute's temp. displaying function correction process conditions, thus the effect of assurance bonding.The repeatability of bonding technology and actual bond effect are all better.Compare other bonding apparatus both at home and abroad, the little raceway groove bonding apparatus of this novel micro-fluidic chip process costs is low, and efficient is high, and simple operation is easy to apply in the bonding field of micro-fluidic chip.
The present invention adopts the mode of electromagnetic wave heating, does not need to apply external pressure in bonding, and it has following advantage:
1, utilizes new process, be subjected to microwave to penetrate living pyrogen reason absorbing material and be used for bonding;
2, shortened the thermal bonding technological process of the micro-fluidic chip of PMMA and other polymerizable material, so that the thermal bonding technique of polymeric micro-fluidic chip is simplified time shorten;
3, microwave power adjustment and time setting are combined, bond strength is stablized controlled, has guaranteed hot key and the intensity of the micro-fluidic chip of PMMA and other polymerizable material;
4, the doping of absorbing material is accurately controlled in the heated substrate, and the little channel shape variable behind the micro-fluidic chip thermal bonding of PMMA and other polymerizable material is little;
5, bonding method is simple, and the bonding apparatus cost is low, is convenient to popularize;
6, the cost relative reduce of device;
The bonding that 7, can be used for large-sized micro-fluidic chip.
Description of drawings
Fig. 1 is the structural representation of electromagnetic wave bonding apparatus of the present invention.
Fig. 2 is for being used for the tube furnace schematic diagram of sintering heated substrates.
Fig. 3 is heated substrates mould schematic diagram of the present invention.
Fig. 4 is substrate sample and the mould pictorial diagram behind the doping absorbing material sintering.
The specific embodiment
Elaborate technical scheme of the present invention below in conjunction with accompanying drawing, but do not limit protection scope of the present invention.
At first, according to the chip size of institute's bonding, make a heated substrates mould with exotic material.
Then, with the low temperature glass slurry with inhale after the ripple exothermic material evenly mixes, insert in the mould (Fig. 3), sintering 3-15min under 200-700 ℃ condition, agglomerating plant is as shown in Figure 2.Demolding after cooling is taken out and is namely made heated substrates.Described absorbing material can be the absorbing materials such as CNT, and the amount of the absorbing material that mixes can accurately control to 0.1mg, and the deformation quantity of little raceway groove behind bonding is less than 2%, and bond strength is greater than 1N/cm
2The heated substrates sintering is made complete, as shown in Figure 4.
As shown in Figure 1, electromagnetic wave bonding apparatus of the present invention is comprised of heat insulating and sealing container 1, the heated substrates 6 that electromagnetic wave generating device 2, power controller 3, timer 4, K type temperature thermocouple and temperature indicator 5, anti electromagnetic wave leak.The heat insulating and sealing container 1 that described anti electromagnetic wave leaks is the shell that utilizes the microwave heating equipment that micro-wave screening material and heat-barrier material be made, and this closed container can effectively completely cut off electromagnetic radiation, prevents the injury to the operator; Simultaneously, container can prevent scattering and disappearing of heat to a certain extent under air-tight state.Heat insulating and sealing container 1 inside is provided with electromagnetic wave generating device 2 and heated substrates 6, temperature sensor (being K type thermocouple) is connected with heated substrate 6, temperature shows that can be as accurate as 0.1 spends, the in real time fluctuation of displays temperature, when unusual fluctuations appear in temperature, can artificial intervention or the termination of para-linkage implementation Process.The built-in trapezoidal objective table 8 in heat insulating and sealing container 1 bottom, objective table 8 is in order to carry heated substrates 6 and heated micro-fluidic chip 7.Wherein, the microwave high temperature resistant objective table 8 that can pass through.Electromagnetic wave generating device 2 is the microwave generating apparatus (Fig. 1) of embedded magnetic controlled pipe, is positioned at the upper right side of container, and magnetron is connected with timer 4 with the power controller 3 that is positioned at the heat insulating and sealing external container, so that intensity and the time of control microwave.Employed all parts of this device are prior art.
The utilization of this device is embedded in the K type thermocouple of inhaling ripple heated substrates 6 and carries out thermometric, and the signal of telecommunication that obtains shows by temperature indicator, obtains thus the technological temperature of microwave bonding.Can reach by the bonding heating rate that shows the optimization of technique in the actual use procedure to microwave irradiation time, radiant power adjustment.
Heated substrates 6 and micro-fluidic chip 7 are adjacent to, lie in a horizontal plane in the heat insulating and sealing container 1, the power adjusting of electromagnetic wave generating device 2 to required numerical value, and is set suitable bonding time, the start key locking device.The heated substrates 6 that mixes absorbing material discharges rapidly a large amount of heats under the radiation of microwave, two substrates that heat is transmitted to micro-fluidic chip 7 are at short notice at the interface molten condition and finish bonding at the interface.In bonding process, do not apply external pressure, note utilizing simultaneously the fluctuation of temperature sensor detected temperatures.After arriving the bonding time of setting, electromagnetic wave generating device 2 quits work.Open heat insulating and sealing container 1, after micro-fluidic chip 7 and heated substrates 6 cool off naturally, in container, take out.At this moment, the bonding of micro-fluidic chip is finished.
Claims (7)
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| CN2012103959181A CN102886281A (en) | 2012-10-18 | 2012-10-18 | Micro-fluidic chip bonding device based on PMMA (polymethyl methacrylate) and other polymers |
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| CN2012103959181A CN102886281A (en) | 2012-10-18 | 2012-10-18 | Micro-fluidic chip bonding device based on PMMA (polymethyl methacrylate) and other polymers |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105413769A (en) * | 2015-12-22 | 2016-03-23 | 苏州汶颢芯片科技有限公司 | Microfluidic chip aligning and bonding apparatus |
| CN106219482A (en) * | 2016-08-08 | 2016-12-14 | 中国科学院光电研究院 | The sealing-in device of a kind of micro-fluidic chip and method for sealing |
| CN106626219A (en) * | 2017-03-03 | 2017-05-10 | 广东工业大学 | Bonding system for polymer micro-fluidic chips |
| CN106984369A (en) * | 2017-04-26 | 2017-07-28 | 广东工业大学 | A kind of micro-fluidic chip bonding apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030020915A1 (en) * | 1998-03-23 | 2003-01-30 | Schueller Olivier J. A. | Optical modulator/detector based on reconfigurable diffraction grating |
| CN1480724A (en) * | 2003-07-18 | 2004-03-10 | 华中科技大学 | Bonding and packaging method and device for plastic biochip |
| CN1588669A (en) * | 2004-08-10 | 2005-03-02 | 浙江大学 | Thermal bonding packaging method for polymer microchips based on Peltier thermal cycle principle |
| US20070125489A1 (en) * | 2005-09-08 | 2007-06-07 | Oregon State University | Microfluidic welded devices or components thereof and method for their manufacture |
| CN102161233A (en) * | 2010-01-08 | 2011-08-24 | 早川橡胶株式会社 | Bonding method using laser |
-
2012
- 2012-10-18 CN CN2012103959181A patent/CN102886281A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030020915A1 (en) * | 1998-03-23 | 2003-01-30 | Schueller Olivier J. A. | Optical modulator/detector based on reconfigurable diffraction grating |
| CN1480724A (en) * | 2003-07-18 | 2004-03-10 | 华中科技大学 | Bonding and packaging method and device for plastic biochip |
| CN1588669A (en) * | 2004-08-10 | 2005-03-02 | 浙江大学 | Thermal bonding packaging method for polymer microchips based on Peltier thermal cycle principle |
| US20070125489A1 (en) * | 2005-09-08 | 2007-06-07 | Oregon State University | Microfluidic welded devices or components thereof and method for their manufacture |
| CN102161233A (en) * | 2010-01-08 | 2011-08-24 | 早川橡胶株式会社 | Bonding method using laser |
Non-Patent Citations (1)
| Title |
|---|
| A A YUSSUF: "Microwave welding of polymeric-microfluidic devices", 《JOURNAL OF MICROMECHANICS AND MICROENGINEERING》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105413769A (en) * | 2015-12-22 | 2016-03-23 | 苏州汶颢芯片科技有限公司 | Microfluidic chip aligning and bonding apparatus |
| CN106219482A (en) * | 2016-08-08 | 2016-12-14 | 中国科学院光电研究院 | The sealing-in device of a kind of micro-fluidic chip and method for sealing |
| CN106626219A (en) * | 2017-03-03 | 2017-05-10 | 广东工业大学 | Bonding system for polymer micro-fluidic chips |
| CN106984369A (en) * | 2017-04-26 | 2017-07-28 | 广东工业大学 | A kind of micro-fluidic chip bonding apparatus |
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Application publication date: 20130123 |