A kind of compound semiconductor solar cell
Technical field
The invention belongs to the compound semiconductor area of solar cell, be specifically related to a kind of compound semiconductor solar cell.
Background technology
In the last few years, along with the further aggravation of energy crisis and ecological degeneration, developing novel renewable and clean energy resource had become people's production, life, kept the active demand of social sustainable development.Develop in recent years solar energy, photovoltaic power generation technology has attracted people's common concern, wherein the compound semiconductor solar cell reduces the space with its higher conversion efficiency and larger cost of electricity-generating, is acknowledged as the Ground Application generation technology of tool potentiality.Yet the solar cell power generation technology has too high cost of electricity-generating, hampers the quick commercialization process of this technology always.
Generally, at p-type Ge or GaAs Grown battery epitaxial loayer, the battery surface ohmic contact layer will be N-shaped GaAs layer, therefore in solar battery chip manufacturing process, usually need to use the noble metals such as AuGe, Au, Pt as metal electrode, obtaining preferably ohmic contact characteristic and lower series resistance, and then be conducive to improve the conversion efficiency of battery.For example, N-shaped GaAs and AuGeNi(are greater than 150nm)/the about 20nm of Au() can form preferably ohmic contact through after the short annealing.
Summary of the invention
The object of the present invention is to provide a kind of compound semiconductor solar cell, under the prerequisite that guarantees battery performance, can use comparatively cheap metal as the metal electrode of battery chip, thereby reduce the battery production cost.
According to a first aspect of the invention, a kind of compound semiconductor solar cell comprises a substrate, the battery active layer, the ohmic contact lamination is characterized in that: insert a tunnel junctions in the described ohmic contact lamination, thereby change the conduction type of ohmic contact stack surface.
Further, described ohmic contact lamination is comprised of the first ohmic contact layer, the second ohmic contact layer, the 3rd ohmic contact layer and the 4th ohmic contact layer, wherein the second ohmic contact layer and the 3rd ohmic contact layer consist of tunnel junctions jointly, the first ohmic contact layer is consistent with the second ohmic contact layer conduction type, and the 3rd ohmic contact layer is consistent with the 4th ohmic contact layer conduction type.
Among the present invention, in the battery of common p-type Ge or GaAs Grown, by in ohmic contact layer, inserting a tunnel junctions, thereby change the conduction type on ohmic contact layer surface, be that the ohmic contact layer surface is p-type electric-conducting, the metal of P type semiconductor electric conducting material and lower cost is processed through short annealing can obtain better ohmic contact, such as p-type GaAs and Ti(<20nm)/about 20nm of Au() can obtain preferably ohmic contact and lower contact resistance through after the short annealing, thereby solved in the conventional solar cell chip manufacturing process and needed to use AuGe, Au, the noble metals such as Pt have reduced the battery electrode cost as metal electrode.
According to a second aspect of the invention, the present invention also provides a kind of solar energy luminous system, and it is equipped with the aforesaid compound semiconductor solar cell.
Other features and advantages of the present invention will be set forth in the following description, and, partly from specification, become apparent, perhaps understand by implementing the present invention.Purpose of the present invention and other advantages can realize and obtain by specifically noted structure in specification, claims and accompanying drawing.
Description of drawings
Fig. 1 is the full structure of GaInP/GaAs/Ge three junction batteries on the conventional p-type Ge substrate.
Fig. 2 is the full structure of GaInP/GaAs/Ge three junction batteries on the p-type Ge substrate provided by the present invention.
Each label represents among the figure:
The full structure of GaInP/GaAs/Ge three junction batteries on the 100:p type Ge substrate
101:n type GaAs ohmic contact layer
The 102:AuGeNi/Au metal electrode
201:n type GaAs the first ohmic contact layer
202:n+ type GaAs the second ohmic contact layer
203:p+ type GaAs the 3rd ohmic contact layer
204:p type GaAs the 4th ohmic contact layer
The 205:Ti/Au metal electrode.
Embodiment
The invention will be further described below in conjunction with embodiment.
In existing chemical combination half semiconductor solar cell, usually with the p-type material as growth substrates, such as p-type Ge substrate, p-type GaAs substrate or p-type InP substrate.Take the GaInP/GaAs/Ge three-joint solar cell as example, be generally the full structure 100 of extension formation GaInP/GaAs/Ge three junction batteries on p-type Ge substrate such as it, continue afterwards extension and form N-shaped GaAs ohmic contact layer 101, its doping content is 5 * 10
18/ cm
3, GaInP/GaAs/Ge three junction battery epitaxial structures on the p-type Ge substrate of final acquisition routine.In battery chip manufacturing process on N-shaped GaAs ohmic contact layer 101 evaporation AuGeNi/Au metal electrode 102, through 380 ℃, battery obtains good ohmic contact behind 3 minutes the rapid thermal annealing, its resistivity is 2.2 * 10
-5, the battery fill factor, curve factor is about 85%, and its side sectional view is as shown in Figure 1.
In aforementioned existing chemical combination half semiconductor solar cell epitaxial structure, its ohmic contact layer 101 is N-shaped GaAs, and in the chip processing procedure, need to adopt and use expensive metal A uGeNi/Au as the contacting metal electrode, the thickness of getting AuGeNi is 180nm, the 20nm of gold, and then solar cell is stated in evaporation one stokehold in process of production, AuGeNi, Au(20nm) metal consumption be respectively 5.1g, 1g, its cost is higher.
In aforesaid compound semiconductor solar cell epitaxial structure, the cost of metal electrode is high in the chip processing procedure, the below proposes a kind of new solar battery structure, it is under the prerequisite that guarantees battery performance, can use comparatively cheap metal as the metal electrode of battery chip, thereby reduce the battery production cost.
As shown in Figure 2, extension forms the full structure 100 of GaInP/GaAs/Ge three junction batteries on p-type Ge substrate, continue afterwards extension and form successively N-shaped GaAs the first ohmic contact layer 201, n+ type GaAs the second ohmic contact layer 202, p+ type GaAs the 3rd ohmic contact layer 203, with p-type GaAs the 4th ohmic contact layer 204, finally obtain the full structure of GaInP/GaAs/Ge three junction batteries on the p-type Ge substrate provided by the present invention.Wherein, n+ type GaAs the second ohmic contact layer 202 and p+ type GaAs the 3rd ohmic contact layer 203 common formation GaAs tunnel junctions have 150A/cm
2Peak value tunnelling current density.Particularly, the doping content of the first ohmic contact layer 201 is 2 * 10
18/ cm
3, the doping content of the second ohmic contact layer 202 is 8 * 10
18/ cm
3, the doping content of the 3rd ohmic contact layer 203 is 3 * 10
19/ cm
3, the doping content of the 4th ohmic contact layer 204 is 1.5 * 10
19/ cm
3By inserted tunnel junctions in ohmic contact layer, the top layer that makes its ohmic contact layer is P-type conduction.In battery chip manufacturing process, evaporation Ti/Au metal electrode 205 on p-type GaAs the 4th ohmic contact layer 204 through 360 ℃, obtains good ohmic contact behind 1 minute the rapid thermal annealing, and its resistivity is 1.2 * 10
-5, the battery fill factor, curve factor is about 85.3%.The thickness of getting Ti is that the thickness of 10nm, Au is 20nm, and then solar cell is stated in evaporation one stokehold in process of production, and the metal consumption of noble metal Au (20nm) electrode is 1g.
Find by contrast, the conventional full structure of GaInP/GaAs/Ge three junction batteries and the full structure of GaInP/GaAs/Ge three junction batteries provided by the present invention corresponding battery chip have similar series resistance and fill factor, curve factor, namely have similar battery performance.Required noble metal lacked a lot when yet required noble metal was than the conventional full structure fabrication metal electrode of GaInP/GaAs/Ge three junction batteries during GaInP/GaAs/Ge three junction battery structure fabrication metal electrode provided by the present invention, each stove consumes the AuGe of 5.1g less, and therefore compound semiconductor solar cell epitaxial structure provided by the present invention has preferably cost advantage.
Aforementioned solar cell, combining optical element can form the high concentration solar battery system.