CN102840474B - LED lamp and production method thereof - Google Patents
LED lamp and production method thereof Download PDFInfo
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- CN102840474B CN102840474B CN201210208318.XA CN201210208318A CN102840474B CN 102840474 B CN102840474 B CN 102840474B CN 201210208318 A CN201210208318 A CN 201210208318A CN 102840474 B CN102840474 B CN 102840474B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000004020 conductor Substances 0.000 claims description 105
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 103
- 238000003466 welding Methods 0.000 claims description 52
- 239000011159 matrix material Substances 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000010023 transfer printing Methods 0.000 claims description 8
- 238000010422 painting Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 5
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003385 sodium Chemical class 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED lamp and a production method thereof. The LED lamp is provided with a base body; a bench seat part (3), which is supported by the base body, and is made of insulation materials; a conductive layer (4), which is directly overlapped on the bench seat part (3); a plurality of LED lamp sources (5). The bench seat part (3) is provided with a first main surface (311) and a second main surface (312), which face different directions. Any one of the plurality of LED lamp sources (5) is disposed the first main surface (311) through the conductive layer (4), and any one of the plurality of LED lamp sources (5) is disposed the first main surface (312) through the conductive layer (4).
Description
Technical field
The present invention relates to the manufacture method of LED and LED.
Background technology
All the time, the LED used as the substitute of incandescent lamp bulb is well-known.The LED lamp recorded in patent document 1 is for base portion, flexible base board and multiple LED module.Base portion has the part of frustum.The part of this frustum is formed by aluminium, has towards multiple of mutually different directions.Flexible base board is configured at above-mentioned multiple of base portion.On above-mentioned multiple of base portion, be configured with LED module respectively across flexible base board.Due to above-mentioned multiple mutually towards different directions, the direction of the light therefore sent from LED module is also different.Therefore, the LED of such prior art can irradiate wider scope.
In the LED of prior art, between base portion and LED module, have flexible base board.Thus, the heat produced by LED module arrival base portion before via flexible base board.That is, the heat produced by LED module is not directly delivered to base portion.In addition, in existing LED, the major part of the heat produced by LED module is discharged into the outside of LED from base portion.Therefore, in existing LED, the heat produced by LED module is difficult to the outside being promptly discharged into LED.
Prior art document
Patent document
Patent document 1: specially permit No. 4642129 publication
Summary of the invention
The problem that invention will solve
The present invention completes in view of above-mentioned problem, and its major subjects is to provide the more excellent LED of thermal diffusivity.
For solving the method for problem
Based on a first aspect of the present invention, provide a kind of LED, it possesses: matrix; The pedestal portion formed by above-mentioned substrate support and by insulating materials; Directly be laminated in the conductor layer in above-mentioned pedestal portion; With multiple LED light source, above-mentioned pedestal portion has the multiple interareas towards mutually different directions, above-mentioned multiple interarea has the first interarea and the second interarea, any one in above-mentioned multiple LED light source is configured at above-mentioned first interarea by above-mentioned conductor layer, and any one in above-mentioned multiple LED light source is configured at above-mentioned second interarea by above-mentioned conductor layer.
Preferably, any one of above-mentioned multiple interarea is all smooth.
Preferably, above-mentioned conductor layer comprises communication wiring part, and above-mentioned communication wiring part is across the face beyond above-mentioned first interarea riding over above-mentioned first interarea and above-mentioned pedestal portion.
Preferably, above-mentioned multiple interarea all tilts relative to above-mentioned axle with the above-mentioned near mode that is coupling to go along with the first direction extended to axle.
Preferably, above-mentioned pedestal portion has towards the end face of above-mentioned first direction, and any one of above-mentioned multiple LED light source is configured at above-mentioned end face by above-mentioned conductor layer.
Preferably, above-mentioned pedestal portion has any one curved surface be connected with above-mentioned end face with above-mentioned multiple interarea, and above-mentioned conductor layer comprises the connection wiring portion of any one covering above-mentioned multiple interarea, above-mentioned end face and above-mentioned curved surface.
Preferably, also possess the wire be connected with any one bonding (bonding) of above-mentioned multiple LED light source, above-mentioned wire, throughout entirety above-mentioned first interarea towards direction observe time overlapping with above-mentioned first interarea.
Preferably, above-mentioned pedestal portion has and is connected and the side parallel with above-mentioned axle with any one of above-mentioned multiple interarea.
Preferably, above-mentioned end face is polygon.
Preferably, above-mentioned conductor layer comprises the pipe core welding disc of any one (die pad) being configured with above-mentioned multiple LED light source, and above-mentioned pipe core welding disc is overlapping with the entirety of any one of above-mentioned multiple LED light source when overlooking.
Preferably, above-mentioned conductor layer comprises multiple pipe core welding disc, each of above-mentioned multiple pipe core welding disc is configured with any one of above-mentioned multiple LED light source, and be all formed at the same interarea be included in above-mentioned multiple interarea, possess: with each above-mentioned LED light source and the wire of above-mentioned pipe core welding disc bonding being configured with this LED light source; And with each above-mentioned LED light source and and be configured with the additional wire of the adjacent above-mentioned pipe core welding disc bonding of the above-mentioned pipe core welding disc of this LED light source.
Preferably, above-mentioned pedestal portion has towards the bottom surface with above-mentioned first direction opposition side, is formed with in above-mentioned pedestal portion the recess caved in above-mentioned first direction from above-mentioned bottom surface.
Preferably, above-mentioned pedestal portion has the inner face specifying above-mentioned recess, and above-mentioned inner face, in the cross sectional shape based on the face orthogonal with above-mentioned first direction, has the different Part I of distance apart from above-mentioned axle and Part II.
Preferably, the distance of above-mentioned first interarea and above-mentioned inner face is 3 ~ 10mm.
Preferably, also possess cable, above-mentioned conductor layer comprises the power pad portion being connected with above-mentioned cable, is formed with in above-mentioned pedestal portion the groove being embedded with above-mentioned cable.
Preferably, above-mentioned power pad portion is configured at any one interarea of above-mentioned multiple interarea.
Preferably, above-mentioned conductor layer covers a part for above-mentioned side.
Preferably, also possess cable, above-mentioned conductor layer comprises and is connected with above-mentioned cable and the power pad portion covering each part of above-mentioned interarea and above-mentioned side.
Preferably, above-mentioned conductor layer makes in above-mentioned side, by exposing with the part of above-mentioned interarea opposite side.
Preferably, above-mentioned conductor layer is formed by the particle of multiple electric conductivity, and thickness is 5 ~ 10 times of the particle diameter of any one of above-mentioned multiple particle.
Preferably, above-mentioned multiple LED light source comprises assisting base plate (submount) respectively and is arranged on the bare chip LED of above-mentioned assisting base plate.
Preferably, above-mentioned multiple LED light source is respectively bare chip LED.
Preferably, also possess existence and the bonding layer between any one and above-mentioned conductor layer of above-mentioned multiple LED light source, above-mentioned bonding layer is formed by conductive material.
Preferably, also possess existence and the bonding layer between any one and above-mentioned conductor layer of above-mentioned multiple LED light source, above-mentioned bonding layer is formed by insulating materials.
Preferably, also possess the resin bed comprising fluorophor, above-mentioned fluorophor, by being energized from the light of multiple above-mentioned LED light source, sends the light of the wavelength different from the wavelength of this light thus.
Preferably, the cover covering multiple above-mentioned LED light source is also possessed.
Preferably, above-mentioned resin bed is formed at above-mentioned cover.
Preferably, above-mentioned cover has: as the top of the end of the first direction side of axle extension; The maximum diameter portion of the largest diameter in the cross section at a right angle with above-mentioned first direction; With expose bottom, it is that be exposed to outside part with end that is above-mentioned first direction rightabout side, and the diameter in cross section at a right angle with above-mentioned first direction compared with above-mentioned maximum diameter portion is little.
Preferably, in the distance in the above-mentioned top of above-mentioned first direction and above-mentioned maximum diameter portion, larger than the distance exposing bottom and above-mentioned maximum diameter portion above-mentioned first direction above-mentioned.
Preferably, above-mentioned cover has in above-mentioned maximum diameter portion and above-mentionedly exposes between bottom, inwardly the reducing diameter part that protrudes of side.
Preferably, also possess and be configured at above-mentioned first interarea and any number of framework of surrounding above-mentioned multiple LED light source, above-mentioned resin bed is filled in the region surrounded by above-mentioned framework.
Preferably, above-mentioned resin bed only covers any one of above-mentioned multiple LED light source.
Preferably, the power supply unit being contained in above-mentioned matrix and above-mentioned multiple LED light source being supplied to electric power is also possessed.
Preferably, above-mentioned pedestal portion is formed by pottery.
Preferably, above-mentioned conductor layer is formed by silver-colored platinum.
Preferably, above-mentioned conductor layer is formed by printing.
Based on a second aspect of the present invention, provide a kind of manufacture method of LED, it comprises: formed be made up of insulating materials and there is towards mutually different directions the operation in the pedestal portion of multiple interarea; Formed the operation of conductor layer by printing in above-mentioned pedestal portion; The operation of multiple LED light source is configured at above-mentioned conductor layer; With the operation above-mentioned pedestal portion is configured on matrix, above-mentioned multiple interarea has the first interarea and the second interarea, configure the operation of above-mentioned multiple LED light source, be that any one of above-mentioned multiple LED light source is configured at above-mentioned first interarea by above-mentioned conductor layer, and any one of above-mentioned multiple LED light source is configured at above-mentioned second interarea by above-mentioned conductor layer.
Preferably, in the operation forming above-mentioned conductor layer, transfer printing is carried out.
Preferably, in the operation forming above-mentioned conductor layer, screen painting is carried out.
Preferably, in the operation forming above-mentioned conductor layer, ink jet printing is carried out.
Preferably, also possesses the operation of preparation first mould and the second mould, in the operation forming above-mentioned pedestal portion, while the state keeping above-mentioned first mould to be separated with above-mentioned second mould, above-mentioned first mould and above-mentioned second mould is utilized to pressurize to powder.
Other features and advantages of the present invention, the following detailed description of carrying out by referring to accompanying drawing can be clear and definite.
accompanying drawing explanation
Fig. 1 is the front elevation of the LED representing embodiments of the present invention.
Fig. 2 is the sectional view of II-II line represented along Fig. 1.
Fig. 3 is the stereogram mainly representing the pedestal portion shown in Fig. 2.
Fig. 4 is the expanded view of the conductor layer formed in pedestal portion mainly representing embodiments of the present invention.
Fig. 5 is the local wide sectional view of LED that represent the part of V-V line be equivalent to along Fig. 4, embodiments of the present invention.
Fig. 6 is the local wide sectional view of LED that represent the part of VI-VI line be equivalent to along Fig. 4, embodiments of the present invention.
Fig. 7 is the upward view in the pedestal portion representing embodiments of the present invention.
Fig. 8 is the sectional view of the LED light source mainly representing embodiments of the present invention.
Fig. 9 is the sectional view of the conductor layer schematically showing embodiments of the present invention.
Figure 10 is the local wide figure of the structure represented on the interarea of Fig. 4.
Figure 11 is the local wide figure of the structure represented on the end face of Fig. 4.
Figure 12 is the figure of an operation of the manufacture method of the LED representing embodiments of the present invention.
Figure 13 is the figure of the operation representing then Figure 12.
Figure 14 is the figure of the operation representing then Figure 13.
Figure 15 is the figure of the operation representing then Figure 14.
Figure 16 is the figure of the operation representing then Figure 15.
Figure 17 is the figure of the operation representing then Figure 16.
Figure 18 is the figure of the operation representing then Figure 17.
Figure 19 is the figure of the operation representing then Figure 18.
Figure 20 is the local wide sectional view of the variation of the LED representing embodiments of the present invention.
Figure 21 is the sectional view of the variation of the LED light source of the LED representing embodiments of the present invention.
Figure 22 is the sectional view of the variation of the LED light source of the LED representing embodiments of the present invention.
Figure 23 is the sectional view of the variation of the LED light source of the LED representing embodiments of the present invention.
Figure 24 is the sectional view of the variation in the pedestal portion of the LED representing embodiments of the present invention.
Figure 25 is the sectional view of the variation of the resin bed of the LED representing embodiments of the present invention.
Figure 26 is the close-up plan view of the resin bed mainly representing the LED shown in Figure 25.
Figure 27 is the close-up plan view of the resin bed mainly representing the LED shown in Figure 25.
Figure 28 is the sectional view of the variation of the resin bed of the LED representing embodiments of the present invention.
Figure 29 is the sectional view of the variation in the power pad portion of the LED representing embodiments of the present invention.
Figure 30 is the front elevation of the LED of the variation of cover for representing LED of the present invention.
Figure 31 is the sectional view of the XXXI-XXXI line along Figure 30.
Detailed description of the invention
Below, embodiments of the present invention are illustrated with reference to accompanying drawing.
LED 100 shown in Fig. 1 ~ Fig. 4 is installed in the ligthing paraphernalia of incandescent lamp bulb as the substitute of incandescent lamp bulb and uses.LED 100 possesses: principal part 2; Pedestal portion 3; Conductor layer 4; Multiple LED light source 5; Line 611,612,613,621,622,623(with reference to Fig. 4, omit in Fig. 2, Fig. 3, Fig. 5 etc.); Bonding layer 71(is with reference to Fig. 8); Cover 72; With resin bed 73(with reference to Fig. 2).
Principal part 2 shown in Fig. 2 comprises: matrix 21; Power supply unit 23; Two cables 25; With lamp socket (lamp holder) 27.
Matrix 21 has main body 211 and distance piece 212.Matrix 21 is formed by the material that thermal conductivity is higher.As such material can examples example as aluminium.
The opposite direction of main body 211 direction x2(direction x1 as shown in Figure 2) be collapsed shape.As shown in Figure 1, main body 211 has multiple fin (fin).These fins extend in the radial direction of the axle Ox extended along direction x1 respectively.Distance piece 212 is discoideus, installs the upper end of main body 211 in fig. 2.
In addition, matrix 21 also can be different from present embodiment, and can be formed in one product.
Power supply unit 23 shown in Fig. 2 is the parts for supplying electric power to LED light source 5 described later.Power supply unit 23 such as will be converted to direct current power from the alternating electromotive force of the interchange 100V power supply of commercialization.Power supply unit 23 is housed in matrix 21.As shown in Figure 2, power supply unit 23 has substrate 231 and multiple electronic unit 232.
The periphery of substrate 231 is clipped between main body 211 and distance piece 212.Substrate 231 is fixed on matrix 21 thus.Substrate 231 is formed by the material that thermal conductivity is higher.Substrate 231 is such as glass synthesis copper opens laminated plates.Substrate 231 is overall rounded.In fig. 2, Wiring pattern (omitting diagram) is formed with respectively at the lower surface of substrate 231 and upper surface.The Wiring pattern formed at the upper surface of substrate 231 and the Wiring pattern that formed at the lower surface of substrate 231 are such as by through hole conducting.
Multiple electronic unit 232 is configured in the lower surface in fig. 2 of substrate 231.Multiple electronic unit 232 is contained in matrix 21.Multiple electronic unit 232 is capacitor, resistance, coil, diode, IC etc.
Each cable 25 shown in Fig. 2, Fig. 5 is the parts for the direct current power generated by power supply unit 23 being sent to LED light source 5 described later.Cable 25 is connected with the Wiring pattern formed on substrate 231.
Lamp socket 27 shown in Fig. 1, Fig. 2 is the parts for being arranged in the ligthing paraphernalia of bulb.Lamp socket 27 is connected with power supply unit 23 by distribution (not shown).When the use of LED 100, electric power is supplied to LED 100 via lamp socket 27.
Pedestal portion 3 shown in Fig. 2 ~ Fig. 7 is supported by matrix 21.Further, pedestal portion 3 is fixed on matrix 21.When being fixed on matrix 21 in pedestal portion 3, such as, can use adhesive or screw.Also the lubricating grease (grease) of heat transmission can be there is between pedestal portion 3 and matrix 21.Pedestal portion 3 is formed by insulating materials.Such insulating materials such as can be illustrated pottery, insulative resin etc.Such as can illustrate as pottery: aluminium oxide, zirconia or aluminium nitride.Resin as insulating properties such as can be illustrated polyphenylene sulfide (PPS), liquid crystal polyester (LCP) or polyether-ether-ketone (PEEK).In the present embodiment, with pedestal portion 3 for pottery is described.
Pedestal portion 3 has: multiple interarea 31; End face 32; Curved surface 33; Multiple side 34; Curved surface 35; Bottom surface 36; With inner face 37.In the present embodiment, pedestal portion 3 is in frustum.In addition, represent with line at Fig. 3, Fig. 4 mean camber 33,35.
As shown in Figure 3, Figure 4, multiple (being 16 in present embodiment) interarea 31 is respectively in trapezoidal.Multiple interarea 31 is respectively towards different directions.That is, the normal direction of multiple interarea 31 is different.In the present embodiment, multiple interarea 31 is smooth.Each interarea 31 more tilts relative to axle Ox close to the mode of axle Ox to go along with the direction x1 more extended to axle Ox.Observe at direction x1, multiple interarea 31 surrounds axle Ox.As shown in Figure 3, two in multiple interarea 31 are interconnected respectively by border 39.Using in multiple interarea 31 as the first interarea 311, using in multiple interarea 31 as the second interarea 312.
The direction x1 that end face 32 as shown in Fig. 2 ~ Fig. 6 extends towards axle Ox.In the present embodiment, end face 32 is smooth, orthogonal with axle Ox.As shown in Figure 4, observe at direction x1, end face 32 is surrounded by multiple interarea 31.End face 32 is polygon (being positive ten hexagons in present embodiment).Also can be different from present embodiment, end face 32 can not be polygon but circular.
Curved surface 33 shown in Fig. 2 ~ Fig. 6 is connected with end face 32 with any one of multiple interarea 31.In the present embodiment, curved surface 33 is connected with the whole and end face 32 of multiple interarea 31.Curved surface 33 is in the ring-type of surrounding end face 32.Curved surface 33 does not necessarily form ring-type.Such as, curved surface 33 also can be the band shape that the region only between the first interarea 311 and end face 32 is formed.Similarly, curved surface 33 also can be the band shape that the region only between the second interarea 312 and end face 32 is formed.In addition, pedestal portion 3 also can not have curved surface 33 originally.
Multiple sides 34 shown in Fig. 2 ~ Fig. 6 are respectively towards the radial direction of axle Ox.As shown in Figure 2, each side 34 is parallel with axle Ox.Multiple side 34 is smooth in the present embodiment.As long as side 34 is parallel with axle Ox also can be curved surface.Each side 34 is connected with any one in multiple interarea 31.
Curved surface 35 shown in Fig. 2 ~ Fig. 6 is connected with side 34 with interarea 31.Curved surface 35 in the form of a ring.Curved surface 35 need not be ring-type.Such as curved surface 35 also can be the band shape that the region only between the first interarea 311 and side 34 is formed.Similarly, curved surface 35 also can be the band shape that the region only between the second interarea 312 and side 34 is formed.In addition, pedestal portion 3 also can not have curved surface 35 originally.
Bottom surface 36 shown in Fig. 2, Fig. 5 ~ Fig. 7 is towards the direction x2 with direction x1 opposite side, and in the present embodiment, bottom surface 36 is the smooth face orthogonal with axle Ox.In pedestal portion 3, be formed with the recess 381 caved in from bottom surface 36 direction x1.Recess 381 is specified by inner face 37.As shown in Figure 7, inner face 37, in the cross sectional shape formed based on the face orthogonal with axle Ox, has the different Part I 371 of distance apart from axle Ox and Part II 372.That is, inner face 37, it has non-circular shape based on the cross sectional shape that the face orthogonal with axle Ox is formed.Such as, in the present embodiment, the cross sectional shape of the inner face 37 formed based on the face orthogonal with axle Ox is key-type.Also can be different from present embodiment, the cross sectional shape of the inner face 37 formed based on the face orthogonal with axle Ox can be triangle or rectangle.
The wall thickness La (separating distance of interarea 31 and inner face 37) in the pedestal portion 3 shown in Fig. 5 is such as 3 ~ 10mm.The wall thickness Lb (separating distance of end face 32 and inner face 37) in the pedestal portion 3 shown in this figure is such as 3 ~ 10mm.
Conductor layer 4 shown in Fig. 2 ~ Fig. 6 is directly laminated in pedestal portion 3.That is, conductor layer 4 directly contacts with pedestal portion 3.Conductor layer 4 is such as formed by silver-colored platinum.The thickness of conductor layer 4 is such as 10 ~ 20 μm.As shown in Figure 3, Figure 4, conductor layer 4 comprises: multiple interarea pad (pad, liner) portion 411,412; Two power pad portions 421; Multiple end face welding disk 431,432; With wiring part 451,452,453,461.
Multiple interarea welding disks 411,412 cover any one of multiple interarea 31 respectively.Multiple interarea welding disk 411,412, its respective entirety is positioned at the outer rim of regulation interarea 31.Therefore, each interarea welding disk 411,412 is all not overlapping with border 39.When overlooking, each interarea welding disk 411 is rectangular.Multiple interarea welding disk 411 arranges along a direction in interarea 31.
Two power pad portions 421 cover any one in multiple interarea 31 respectively.When overlooking, each power pad portion 421 is rectangular.Area during any one overlook of the area ratio interarea welding disk 411 during each overlook in multiple power pad portion 421 is large.Each power pad portion 421 is all not overlapping with border 39.As shown in Figure 5, above-mentioned cable 25 is connected in power pad portion 421.
End face welding disk 431,432 shown in Fig. 2 ~ Fig. 6 covers end face 32 respectively.Multiple end face welding disk 431,432 respective entirety are positioned at the frame of regulation end face 32.Therefore, end face welding disk 431,432 all not covering surfaces 33.It is rectangular when each end face pad 431,432 is overlooked.
Multiple wiring parts 451,452,453 cover any one of multiple interarea 31 respectively.As shown in Figure 4, wiring part 451 is the arc-shaped extended along the circumference (circumferencial direction) of axle Ox.Wiring part 451 is across at least any two of multiple interarea 31.That is, wiring part 451 is overlapping with border 39.Wiring part 451 extends to another interarea 31 continuously from an interarea 31.Especially, the wiring part 451 covering the first interarea 311 is equivalent to an example of communication wiring part, across the face beyond the first interarea 311 taken in the first interarea 311 and pedestal portion 3.In the present embodiment, wiring part 451 covers a part for side 34 and a part for curved surface 35.With power pad portion 421 at least any two of wiring part 451 and interarea welding disk 411,412 are connected.Thus, at least any two of interarea welding disk 411,412 and power pad portion 421 are conducted.
Wiring part 452 shown in Fig. 3, Fig. 4 is for having the shape at the position of multiple band shape.Wiring part 452 is across at least any two that take in multiple interarea 31.That is, wiring part 452 is overlapping with border 39.Wiring part 452 extends to other interarea 31 continuously from certain interarea 31.Especially, the wiring part 452 covering the first interarea 311 is across the face of taking beyond first interarea 311 in the first interarea 311 and pedestal portion 3.Such as, the wiring part 452 of the first interarea 311 is covered across taking in the first interarea 311 and the interarea 31 adjacent with the first interarea 311.At least any two of wiring part 452 and interarea welding disk 411,412 are connected.Thus, at least any two of interarea welding disk 411,412 are conducted.
Wiring part 453 shown in Fig. 3, Fig. 4 is the band shape extended along the radial direction of axle Ox.Wiring part 453 is across taking in interarea 31 and end face 32.In the present embodiment, wiring part 453 covers interarea 31, end face 32 and curved surface 33 further.Wiring part 453 extends to end face 32 from certain interarea 31 transcendental surface 33.Wiring part 453 is connected with power pad portion 421.
Wiring part 461 shown in Fig. 3, Fig. 4 is an example in connection wiring portion, across taking in interarea 31 and end face 32.In the present embodiment, wiring part 461 covers interarea 31, end face 32 and curved surface 33 further.Wiring part 461 extends to end face 32 from interarea 31 transcendental surface 33.
Fig. 9 is the sectional view schematically showing conductor layer 4.
As shown in Figure 9, conductor layer 4 is formed by the particle 491 of multiple electric conductivity.The diameter of particle 491 is such as about 5 μm.The thickness of conductor layer 4 is 10 ~ 20 μm as mentioned above, is about 5 ~ 10 times of the diameter of particle 491.
Multiple LED light sources 5 shown in Fig. 2 ~ Fig. 6 are configured at pedestal portion 3 respectively by conductor layer 4.Multiple LED light source 5 is configured at any one of interarea 31 and end face 32 respectively by conductor layer 4.Especially as shown in Figure 3, any one of multiple LED light source 5 is configured at the first interarea 311 by conductor layer 4, and any one of multiple LED light source 5 is configured at the second interarea 312 by conductor layer 4.
As Fig. 4 represents in detail, multiple LED light source 5 be configured at interarea welding disk 411, end face welding disk 431 any one.In interarea welding disk 411, multiple LED light source 5 arranges along a direction.As shown in Figure 10, when overlooking, the area being configured with this LED light source 5 of area ratio of the interarea welding disk 411 of LED light source 5 is large.Further, when overlooking, the interarea welding disk 411 being configured with LED light source 5 is overlapping with the entirety of this LED light source 5.Similarly, as shown in figure 11, when overlooking, the area being configured with this LED light source 5 of area ratio of the end face welding disk 431 of LED light source 5 is large.Further, when overlooking, the end face welding disk 431 being configured with LED light source 5 is overlapping with the entirety of this LED light source 5.
Fig. 8 is the sectional view mainly representing LED light source 5.
As shown in Figure 8, in the present embodiment, LED light source 5 comprises bare chip LED51 and assisting base plate (sub-mount) 52.
Bare chip LED51 has n-type semiconductor layer, p-type semiconductor layer and active layer.N-type semiconductor layer, p-type semiconductor layer and active layer are such as formed by GaN based semiconductor.Bare chip LED51 such as sends blue light.
Assisting base plate 52 is such as formed by silicon, is provided with bare chip LED51.Wiring pattern is formed at assisting base plate 52.Electrode (omit and the illustrate) conducting of this Wiring pattern and bare chip LED51, and there is the part extending to the region do not covered by bare chip LED51.In the present embodiment, wire 611,612 is bonded with at this Wiring pattern.The LED light source 5 of present embodiment is so-called twin wire.
As shown in Figure 8, bonding layer 71 is present between LED light source 5 and conductor layer 4.LED light source 5 engages with conductor layer 4 by bonding layer 71.Bonding layer 71 can be formed by conductive material and also can be formed by insulating materials.
Multiple wires 611,612,613,621,622,623 are as shown in Figure 4 formed by conductive material.Such as can to illustrate aluminium, gold, silver or copper as such conductive material.Wire 611,612,613 is all configured at interarea 31.Especially the wire of the first interarea 311 be configured in interarea 31 is had in wire 611.Be configured at each wire 611 of the first interarea 311, the first interarea 311 towards direction see, throughout entirety overlapping with the first interarea 311.On the other hand, wire 621,622,623 is all configured at end face 32.Multiple wire 611,612,613,621,622,623 all with border 39 and curved surface 33 not overlapping.Wire 611,612,621,622 is bonded to any one of multiple LED light source 5.On the other hand, wire 613,623 is bonded to any one of multiple Zener diode 59.
As shown in Figure 10, wire 611 be configured at the LED light source 5 of interarea welding disk 411 and be different from interarea welding disk 411 bonding of the interarea welding disk 411 being configured with this LED light source 5.Wire 612 and LED light source 5 and this interarea welding disk 411 bonding of being configured at interarea welding disk 411.As shown in Figure 4, wire 613 be configured at the Zener diode 59 of interarea welding disk 412 and interarea welding disk 411 bonding adjacent with this interarea welding disk 412.
As shown in figure 11, wire 621 be configured in the LED light source 5 of end face welding disk 431 and be configured with this LED light source 5 and be different from end face welding disk 431 bonding of end face welding disk 431.Wire 622 and LED light source 5 and this end face welding disk 431 bonding of being configured at end face welding disk 431.As shown in Figure 4, wire 623 be configured at the Zener diode 59 of end face welding disk 432 and end face welding disk 431 bonding adjacent with this end face welding disk 432.
Cover 72 shown in Fig. 1, Fig. 2 is fixed on matrix 21.Cover 72 is rotational symmetric shape centered by axle Ox.Cover 72 makes the light transmission sent from multiple LED light source 5.Cover 72 is such as formed by polymethyl methacrylate, Merlon.Cover 72 contains pedestal portion 3, conductor layer 4 and multiple LED light source 5.
Resin bed 73 shown in Fig. 2 is formed at the inner face of cover 72.As shown in the partial enlarged drawing of Fig. 2, comprise fluorophor 731 and transparent resin 732.Transparent resin 732 is such as silicones.Fluorophor 731 is mixed in transparent resin 732.Fluorophor 731, by being energized from the blue light of multiple LED light source 5, sends the light different from the wavelength of this light thus.In the present embodiment, fluorophor 731 is energized by the blue light from LED light source 5, sends sodium yellow thus.Mixed with the blue light from LED light source 5 by this sodium yellow, irradiate white light from LED 100.In addition, as fluorophor, also can use the fluorophor being sent red light by the excitation of blue light and be sent the fluorophor of green light by the excitation of blue light.
When the use of LED 100, supply alternating electromotive force via lamp socket 27 to power supply unit 23 from the outside of LED 100.The alternating electromotive force be supplied to is converted to direct current power by power supply unit 23, and changed direct current power is supplied to multiple LED light source 5 via cable 25.Then, direct current power is passed to each LED light source 5, and each LED light source 5 sends light.Heat is produced in each LED light source 5 of luminescence.This heat arrives pedestal portion 3 from LED light source 5 via bonding layer 71, conductor layer 4.The heat trnasfer reaching pedestal portion 3, to matrix 21, is discharged into the outside of LED 100 from matrix 21.
Then, the manufacture method about LED 100 simply illustrates.
First, as shown in Figure 12 and Figure 13, pedestal portion 3 is formed by mould molding.As shown in figure 12, in order to form pedestal portion 3, prepare powder 819.Then, utilize the first mould 811, second mould 812 and wall 813 to sandwich powder 819, pressurize.Sinter etc. after making powder 819 solidification, form the pedestal portion 3 shown in Figure 13.The face that the interarea 31 in pedestal portion 3, end face 32 and curved surface 33 are extruded by the first mould 811.On the other hand, the face that extruded by the second mould of the bottom surface 36 in pedestal portion 3 and inner face 37.In the present embodiment, when pressurizeing to powder 819, the first mould 811 is separated with the second mould 812.Therefore, side 34 is not the face extruded by the first mould 811, second mould 812, but by face that wall 813 extrudes.Keep the state that the first mould 811 is separated with the second mould 812, pressurizeed by the first mould 811 and the second mould 812 pairs of powders 819 simultaneously.Therefore, when pressurizeing to powder 819, the first mould 811 does not contact with the second mould 812.Thus, being contacted by first mould 811 and the second mould 812 when pressurizeing to powder 819, can prevent the first mould 811 and the second mould 812 from wearing and tearing.
Then, as shown in Figure 14 ~ Figure 18, conductor layer 4 is formed in pedestal portion 3.The formation of conductor layer 4 is undertaken by printing.In the present embodiment, following transfer printing (Pad Printing, bat printing) is especially used.In addition, the formation of conductor layer 4 also can not use transfer printing, and uses screen painting or ink jet printing to carry out.
When carrying out transfer printing, as shown in figure 14, pedestal portion 3 is mounted on workbench 821.Workbench 821 is provided with protuberance 822.The recess 381 in pedestal portion 3 is embedded in protuberance 822.As mentioned above, recess 381 is specified by inner face 37.Inner face 37, in the cross sectional shape formed based on the face orthogonal with axle Ox, has the different Part I 371 of distance apart from axle Ox and Part II 372.That is, the cross sectional shape formed based on the face orthogonal with axle Ox of recess 381 is not circular shape.Thus, the recess 381 in protuberance 822 and pedestal portion 3 engages, and prevents pedestal portion 3 from rotating under the state being equipped on workbench 821.
Then, as shown in the right side of Figure 14, at the recess 824 of intaglio plate 823, filling conducting fluid 829.As conducting fluid 829, such as, can use and utilize the high-melting-point solvents such as such as terpineol to carry out diluting conducting fluid normally used in screen painting and the fluid obtained.In addition, shape during the overlooking of recess 824 is the roughly the same shape of the pattern form of the conductor layer 4 that will be formed in pedestal portion 3.
Then, conducting fluid 829 is attached to (operation S 1) on pad 825 as shown in figure 15.Pad 825 is formed by soft material, such as, formed by silicon rubber.Then, as shown in figure 16, make pad 825 and pedestal portion 3 just right.Then as shown in figure 17, by pad 825 by being pressed in pedestal portion 3(operation S2).Conducting fluid 829 is attached to pedestal portion 3 thus, and the pattern of conducting fluid 829 is printed.Next, as shown in figure 18, pad 825 is made to be separated (operation S3) from pedestal portion 3.Like this, the pattern form of recess 824 is transferred to pedestal portion 3.
Then, conducting fluid 829 is sintered (operation S4).The sintering of conducting fluid 829, such as, after carrying out the drying of about about 10 minutes to conducting fluid 829 in the atmosphere of about 150 degree, carries out under the sintering temperature of about 850 degree.Thus, conductor layer 4 ' (with reference to Figure 18) is formed in pedestal portion 3.By through above operation S1 ~ S4, be formed with conductor layer 4 ' in pedestal portion 3.The thickness that have passed through the conductor layer 4 ' after an operation S 1 ~ S4 is such as about 3 ~ 7 μm, compared with forming the situation of conductor layer with use screen painting, thinner.This is because, employ transfer printing transfer printing lower thickness compared with screen painting of pad 825.In addition, above-mentioned high-melting-point solvent is such as utilized to carry out diluting conducting fluid 829 also as a reason.The too thin excessive increase likely causing broken string or resistance value of conductor layer.
Therefore, above-mentioned operation S1 ~ S4 is carried out repeatedly (about 2 ~ 3 times) repeatedly.Thus, formed have thickness to a certain degree, the conductor layer 4 of the pattern form of regulation.
Then, as shown in figure 19, multiple LED light source 5, wire 611(are omitted in the figure) be configured at pedestal portion 3.Then, matrix 21 etc. is fixed in pedestal portion 3, manufactures LED 100 thus.
Next, the action effect of present embodiment is described.
In the present embodiment, pedestal portion 3 is formed by insulating materials.Therefore, it is possible to conductor layer 4 is directly layered in pedestal portion 3.This is because even if conductor layer 4 is directly layered in pedestal portion 3, be separated from each other two positions of conductor layer 4 are not also via pedestal portion 3 conducting.When conductor layer 4 directly can be layered in pedestal portion 3, do not need the flexible base board etc. via LED of the prior art, the heat that LED light source 5 produces can directly be transmitted from conductor layer 4 to pedestal portion 3.Therefore, the heat produced by LED light source 5 can be transmitted from conductor layer 4 to pedestal portion 3 efficiently.Thereby, it is possible to provide the LED of thermal diffusivity excellence.
In the present embodiment, conductor layer 4 is being formed in the operation in pedestal portion 3, is carrying out transfer printing.Utilize such structure, when conductor layer 4 is printed on pedestal portion 3, use pad 825.Because pad 825 is soft, so deform when pressing on pedestal portion 3.Therefore, only pad 825 is pressed once to pedestal portion 3, just pad 825 can be pressed on multiple (interarea 31 and the end faces 32) towards mutually different directions in pedestal portion 3.Thereby, it is possible to conductor layer 4 to be printed on simply the face towards mutually different directions in pedestal portion 3.
In the present embodiment, multiple interarea 31 is smooth.Based on such structure, can make stacked also smooth with the conductor layer 4 of interarea 31.Therefore, it is possible to make posture LED light source 5 is not configured at conductor layer 4 destroyedly.In addition, when by wire 611 grade and LED light source 5 bonding, the posture of LED light source 5 also can be prevented to be destroyed.
Usually, needing high-tech towards during two face bonding leads in mutually different directions.In the present embodiment, conductor layer 4 has wiring part 451,452.Each wiring part 451,452 is across the face beyond the first interarea 311 taken in the first interarea 311 and pedestal portion 3.Based on such structure, the position being formed at the first interarea 311 in conductor layer 4 does not need to be connected by wire with the position in the face beyond the first interarea 311 being formed at pedestal portion 3 in conductor layer 4.Therefore, the first interarea 311 does not need bonding lead with the face towards the direction different from the direction of the first interarea 311.Therefore, based on present embodiment, be formed at the position in the face beyond the first interarea 311 being formed at pedestal portion 3 in the part of the first interarea 311 and conductor layer 4 in conductor layer 4, can wiring part 451,452 conducting be simply passed through.
In the present embodiment, pedestal portion 3 has the end face 32 of direction x1.Any one of multiple LED light source 5 is configured at end face 32 by conductor layer 4.Based on such structure, the intensity of the light of direction x1 can be made to increase.
In the present embodiment, pedestal portion 3 has curved surface 33.Curved surface 33 is connected with end face 32 with any one of multiple interarea 31.Conductor layer 4 has wiring part 461.Wiring part 461 cover in multiple interarea 31 any one, end face 32 and curved surface 33.Based on such structure, have curved surface 33 from interarea 31 to end face 32, be therefore difficult to form pointy part from interarea 31 to end face 32.Therefore, it is possible to prevent wiring part 461 from breaking.
Then, the variation of LED 100 is described.In addition, in the following explanation about variation and accompanying drawing, for the key element identical or similar with above-mentioned embodiment, the symbol identical with above-mentioned embodiment is marked.
The LED that Figure 20 represents also possesses keeper 791, screw 792.
Keeper 791 is fixed on matrix 21.Keeper 791 comprises any one inclined-plane abutted 793 with multiple interarea 31.Screw 792 is fixed on matrix 21.When screw 792 is fastening relative to principal part 2, the masterpiece towards keeper 791 is used for the power towards left in pedestal portion 3(Figure 20).Because the interarea 31 in pedestal portion 3 tilts, therefore about the interarea 31 in pedestal portion 3, towards the power effect of the below of Figure 20, as the reaction force of the power relative to keeper 791 to the left of Figure 20.Thereby, it is possible to by pedestal portion 3 principal part 2(such as matrix 21 relatively) firmly fix.
Then the variation about the LED light source 5 of LED 100 is described.
LED light source 5 shown in Figure 21 is light sources of so-called single line type.Assisting base plate 52 is such as formed by silicon, is supported with bare chip LED51.Wiring pattern is formed with across dielectric film at assisting base plate 52.Electrode (omit and the illustrate) conducting of this Wiring pattern and bare chip LED51, and there is the part extending to the region do not covered by bare chip LED51.In this variation, be bonded with wire 611 at this Wiring pattern.In addition, a part for assisting base plate 52 such as becomes electric conductor by doping treatment.Other electrode (not shown) of bare chip LED51 contacts and conducting with assisting base plate 52.
LED light source 5 shown in Figure 22 is only made up of bare chip LED51, and is the light source of two line styles.LED light source 5 shown in Figure 23 is only made up of bare chip LED51, and is the light source of single line type.Bare chip LED51 shown in Figure 22, Figure 23 is engaged by eutectic relative to conductor layer 4 respectively.
Then, the variation about the pedestal portion 3 of LED 100 is described.
Pedestal portion 3 shown in Figure 24 is formed with groove 382.More specifically, groove 382 is formed by interarea 31, curved surface 35, side 34 and bottom surface 36.Cable 25 is embedded in groove 382.Based on such structure, can make the large multizone of side 34 and cover 72 closer to.Thus, the area of bottom surface 36 also can be made larger, bottom surface 36 also can be made larger with the bonding area of matrix 21.Like this can be easier from pedestal portion 3 to matrix 21 heat conduction.Therefore, it is possible to provide the LED of thermal diffusivity excellence.
Then, the variation about the resin bed 73 of LED 100 is described.
The LED that Figure 25 ~ Figure 27 represents also possesses multiple framework 75.Each framework 75 is formed at interarea 31(and comprises the first interarea 311, second interarea 312) and end face 32.Framework 75 shown in Figure 26 is the ring-type of surrounding multiple LED light source 5.Framework 75 is such as formed by the resin of insulating properties.In this variation, resin bed 73 is not formed at cover 72, as shown in figure 26, is filled with in the region surrounded by framework 75.As shown in Figure 26, Figure 27, resin bed 73 covers multiple LED light source 5, and contacts with multiple LED light source 5.
In the LED that Figure 28 represents, LED light source 5 covers by resin bed 73 singly.In this variation, resin bed 73 is formed by perfusion processing (potting).
In LED shown in Figure 29, power pad portion 421 be formed at from interarea 31 cross over curved surface 35 until side 34 region.Cable 25 is such as bonded to power pad portion 421.Therefore, the bonding part of cable 25 be also present in from interarea 31 cross over curved surface 35 until side 34 region.In addition, the conductor layer 4 comprising power pad portion 421 is formed at upper portion in the figure of side 34, is not formed in the lower portion of side 34.
Such as, according to this variation, when applying tractive force to cable 25, in the bonding part of cable 25, the direction of this power along interarea 31 and the direction along side 34 are disperseed.Thus, by the tractive force to cable 25, cable 25 can be avoided to depart from from power pad portion 421.In addition, do not form conductor layer 4 by the lower portion in side 34, conductor layer 4 and matrix 21 and the improper conducting of substrate 231 can be prevented.
Then, the variation about the cover 72 of LED 100 is described.
In the LED that Figure 30, Figure 31 represent, the shape of cover 72 is different from the LED shown in Fig. 1, Fig. 2.Specifically, cover 72 has top 721, maximum diameter portion 722, reducing diameter part 723, exposes bottom 724 and tubular holding section 725.Top 721 is to the most outstanding position, x1 side, direction.Maximum diameter portion 722 is positions of the largest diameter in cross section at a right angle relative to x1-x2 direction in cover 72.In the present embodiment, the diameter in maximum diameter portion 722 is about 60mm.Expose bottom 724 for be exposed to outside cover 72 position in be positioned at by the position of x2 side, direction.The diameter exposing bottom 724 is about 42mm.Maximum diameter portion 722 is about 30mm with the distance at top 721 in the X direction, and maximum diameter portion 722 is about 26mm with the distance exposing bottom 724.That is, on x1-x2 direction, maximum diameter portion 722 is large apart from the distance exposing bottom 724 apart from the distance ratio at top 721.
Reducing diameter part 723, in maximum diameter portion 722 and the position of exposing between bottom 724, is the part protruded a little to the inner side of cover 72.Tubular holding section 725 is arranged at the x2 side, direction of exposing bottom 724, and profile is the circular cylinder shaped portion that about 38mm, x1-x2 direction is of a size of about 3.5mm.Tubular holding section 725 engages with the recess being arranged at matrix 21, such as, mutually bonded by adhesive and matrix 21.Thus, cover 72 to be fixed relative to principal part 2.
According to this variation, the maximum diameter portion that compares 722 in cover 72 becomes not towards folk prescription to x1 side by the part of x2 side, direction but face towards from folk prescription to x2 side.Therefore, advance in the easier region to x2 side, direction of the light sent from these faces.Thus, can the region of x2 side, direction be shone more highlight by the LED bulb of this variation.
According to this variation, the degree being positioned at the part direction x2 side of x1 side, direction in reducing diameter part 723 is stronger.Therefore, from the light easier direction x2 side that this part sends.
In addition, according to this variation, illustrate the example being formed with resin bed 73 at the inner face of cover 72, but also can not form resin bed 73 at the inner face of cover 72.When the inner face of cover 72 is not formed with resin bed 73, such as, as shown in Figure 25 ~ Figure 28, resin bed 73 also can directly cover LED light source 5.
The cover 72 of this variation also can use together with the structure shown in Figure 20 ~ Figure 29.
The present invention is not limited to above-mentioned embodiment, and the concrete structure in each portion of the present invention freely can carry out various design alteration.
Claims (41)
1. a LED, is characterized in that, possesses:
Matrix;
The pedestal portion formed by described substrate support and by insulating materials;
Directly be laminated in the conductor layer in described pedestal portion; With
Multiple LED light source,
Described pedestal portion has the multiple interareas towards mutually different directions,
Described multiple interarea comprises the first interarea and the second interarea,
Any one in described multiple LED light source is configured on described first interarea by described conductor layer,
Any one in described multiple LED light source is configured on described second interarea by described conductor layer.
2. LED as claimed in claim 1, is characterized in that:
Described multiple interarea is all smooth.
3. LED as claimed in claim 2, is characterized in that:
Described conductor layer comprises communication wiring part,
Described communication wiring part is across the face beyond described first interarea riding over described first interarea and described pedestal portion.
4. LED as claimed in claim 2 or claim 3, is characterized in that:
Described multiple interarea all goes more to tilt relative to the axle of described LED close to the mode of the axle of described LED with the first direction extended along with the axle more to described LED.
5. LED as claimed in claim 4, is characterized in that:
Described pedestal portion has towards the end face of described first direction,
Any one of described multiple LED light source is configured at described end face by described conductor layer.
6. LED as claimed in claim 5, is characterized in that:
Described pedestal portion has any one curved surface be connected with described end face with described multiple interarea,
Described conductor layer comprises the connection wiring portion of any one covering described multiple interarea, described end face and described curved surface.
7. LED as claimed in claim 1, is characterized in that:
Also possess the wire of any one being bonded to described multiple LED light source,
Described wire, throughout entirety described first interarea towards direction observe time overlapping with described first interarea.
8. LED as claimed in claim 4, is characterized in that:
Described pedestal portion has and is connected and the side parallel with the axle of described LED with any one of described multiple interarea.
9. the LED as described in claim 5 or 6, is characterized in that:
Described end face is polygon.
10. LED as claimed in claim 1, is characterized in that:
Described conductor layer comprises the pipe core welding disc of any one being configured with described multiple LED light source,
Described pipe core welding disc is overlapping with the entirety of any one of described multiple LED light source when overlooking.
11. LED as claimed in claim 1, is characterized in that:
Described conductor layer comprises multiple pipe core welding disc, be configured with described multiple LED light source any one, and described multiple pipe core welding disc is all formed at the same interarea be included in described multiple interarea at each of described multiple pipe core welding disc,
Possess: with each described LED light source and the wire of described pipe core welding disc bonding being configured with this LED light source; And with each described LED light source and and be configured with the additional wire of the adjacent described pipe core welding disc bonding of the described pipe core welding disc of this LED light source.
12. LED as claimed in claim 4, is characterized in that:
Described pedestal portion has towards the bottom surface of side opposite to the first direction,
The recess caved in described first direction from described bottom surface is formed in described pedestal portion.
13. LED as claimed in claim 12, is characterized in that:
Described pedestal portion has the inner face specifying described recess,
Described inner face, in the cross sectional shape based on the face orthogonal with described first direction, has from the different Part I of the distance of the axle of described LED and Part II.
14. LED as claimed in claim 13, is characterized in that:
The distance of described first interarea and described inner face is 3 ~ 10mm.
15. LED as claimed in claim 1, is characterized in that:
Also possess cable,
Described conductor layer comprises the power pad portion being connected with described cable,
The groove being embedded with described cable is formed in described pedestal portion.
16. LED as claimed in claim 15, is characterized in that:
Described power pad portion is configured at any one interarea of described multiple interarea.
17. LED as claimed in claim 8, is characterized in that:
Described conductor layer covers a part for described side.
18. LED as claimed in claim 17, is characterized in that:
Also possess cable,
Described conductor layer comprise be connected with described cable, the power pad portion of each part of covering described interarea and described side.
19. LED as described in claim 17 or 18, is characterized in that:
Described conductor layer makes in described side, by exposing with the part of described interarea opposite side.
20. LED as claimed in claim 1, is characterized in that:
Described conductor layer is made up of the particle of multiple electric conductivity, and thickness is 5 ~ 10 times of the particle diameter of any one of described multiple particle.
21. LED as claimed in claim 1, is characterized in that:
Described multiple LED light source comprises assisting base plate respectively and is arranged on the bare chip LED of described assisting base plate.
22. LED as claimed in claim 1, is characterized in that:
Described multiple LED light source is respectively bare chip LED.
23. LED as claimed in claim 1, is characterized in that:
Also possess the bonding layer between any one and described conductor layer of described multiple LED light source,
Described bonding layer is formed by conductive material.
24. LED as claimed in claim 1, is characterized in that:
Also possess the bonding layer between any one and described conductor layer of described multiple LED light source,
Described bonding layer is formed by insulating materials.
25. LED as claimed in claim 1, is characterized in that:
Also possess the resin bed comprising fluorophor,
Described fluorophor, by being energized from the light of multiple described LED light source, sends the light of the wavelength different from the wavelength of described light thus.
26. LED as claimed in claim 25, is characterized in that:
Also possesses the cover covering multiple described LED light source.
27. LED as claimed in claim 26, is characterized in that:
Described resin bed is formed at described cover.
28. LED as described in claim 26 or 27, is characterized in that:
Described cover has: the top of the end of the first direction side that the axle as described LED extends; The maximum diameter portion of the largest diameter in the cross section at a right angle with described first direction; With expose bottom, it is the end of the side, direction opposite to the first direction being exposed to outside part, and the diameter in the cross section at a right angle with described first direction is less than described maximum diameter portion.
29. LED as claimed in claim 28, is characterized in that:
The distance in the described top on described first direction and described maximum diameter portion is larger than the distance exposing bottom and described maximum diameter portion described on described first direction.
30. LED as claimed in claim 28, is characterized in that:
Described cover has at described maximum diameter portion and the described reducing diameter part exposing between bottom and inside side and protrude.
31. LED as claimed in claim 25, is characterized in that:
Also possess and be configured at described first interarea and any number of framework of surrounding described multiple LED light source,
Described resin bed is filled in the region surrounded by described framework.
32. LED as claimed in claim 25, is characterized in that:
Described resin bed only covers any one of described multiple LED light source.
33. LED as claimed in claim 1, is characterized in that:
Also possesses the power supply unit being contained in described matrix and described multiple LED light source being supplied to electric power.
34. LED as claimed in claim 1, is characterized in that:
Described pedestal portion is formed by pottery.
35. LED as claimed in claim 1, is characterized in that:
Described conductor layer is formed by silver-colored platinum.
36. LED as claimed in claim 1, is characterized in that:
Described conductor layer is formed by printing.
The manufacture method of 37. 1 kinds of LED, is characterized in that, comprising:
Formation is made up of insulating materials and has towards the operation in the pedestal portion of multiple interareas in mutually different directions;
Formed the operation of conductor layer by printing in described pedestal portion;
The operation of multiple LED light source is configured at described conductor layer; With
Described pedestal portion is configured in the operation on matrix,
Described multiple interarea has the first interarea and the second interarea,
The operation of the multiple LED light source of described configuration, is configured at described first interarea by any one of described multiple LED light source by described conductor layer, and any one of described multiple LED light source is configured at described second interarea by described conductor layer.
The manufacture method of 38. LED as claimed in claim 37, is characterized in that:
Transfer printing is carried out in the operation of described formation conductor layer.
The manufacture method of 39. LED as claimed in claim 37, is characterized in that:
Screen painting is carried out in the operation of described formation conductor layer.
The manufacture method of 40. LED as claimed in claim 37, is characterized in that:
Ink jet printing is carried out in the operation of described formation conductor layer.
The manufacture method of 41. LED according to any one of claim 37 ~ 40, is characterized in that:
Also possess the operation of preparation first mould and the second mould,
In the operation in described formation pedestal portion, while the state keeping described first mould to be separated with described second mould, described first mould and described second mould is utilized to pressurize to powder.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011136109 | 2011-06-20 | ||
| JP2011-136109 | 2011-06-20 | ||
| JP2012098016A JP2013030459A (en) | 2011-06-20 | 2012-04-23 | Led lamp and method of manufacturing the same |
| JP2012-098016 | 2012-04-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
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| US20150015142A1 (en) * | 2013-07-11 | 2015-01-15 | Huizhou Light Engine Limited | Led light bulb with leds mounted on angled circuit board |
| CN111226072B (en) * | 2018-09-07 | 2021-07-13 | 亮锐控股有限公司 | Support for light emitting elements and lighting devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1770959A (en) * | 2004-10-27 | 2006-05-10 | 精工爱普生株式会社 | Wiring pattern forming method, film pattern forming method, semiconductor device, electro-optical device, and electronic equipment |
| CN2864341Y (en) * | 2005-07-26 | 2007-01-31 | 鑫谷光电股份有限公司 | Semiconductor light source for lighting |
| CN101354112A (en) * | 2007-07-24 | 2009-01-28 | 美国明亮光学电子公司 | Improved led lamp structure and forming method thereof |
| CN101839410A (en) * | 2010-04-15 | 2010-09-22 | 北京朗波尔光电股份有限公司 | Space omnidirectional light-emitting diode (LED) |
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| US9030120B2 (en) * | 2009-10-20 | 2015-05-12 | Cree, Inc. | Heat sinks and lamp incorporating same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770959A (en) * | 2004-10-27 | 2006-05-10 | 精工爱普生株式会社 | Wiring pattern forming method, film pattern forming method, semiconductor device, electro-optical device, and electronic equipment |
| CN2864341Y (en) * | 2005-07-26 | 2007-01-31 | 鑫谷光电股份有限公司 | Semiconductor light source for lighting |
| CN101354112A (en) * | 2007-07-24 | 2009-01-28 | 美国明亮光学电子公司 | Improved led lamp structure and forming method thereof |
| CN101839410A (en) * | 2010-04-15 | 2010-09-22 | 北京朗波尔光电股份有限公司 | Space omnidirectional light-emitting diode (LED) |
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