CN102835189A - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
- Publication number
- CN102835189A CN102835189A CN2011800183007A CN201180018300A CN102835189A CN 102835189 A CN102835189 A CN 102835189A CN 2011800183007 A CN2011800183007 A CN 2011800183007A CN 201180018300 A CN201180018300 A CN 201180018300A CN 102835189 A CN102835189 A CN 102835189A
- Authority
- CN
- China
- Prior art keywords
- substrate
- processing
- board treatment
- plate shape
- conveyance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 592
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 9
- 238000011282 treatment Methods 0.000 claims description 93
- 230000007246 mechanism Effects 0.000 claims description 54
- 230000001681 protective effect Effects 0.000 claims description 35
- 238000001035 drying Methods 0.000 claims description 27
- 238000011084 recovery Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 9
- 230000007723 transport mechanism Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 description 113
- 238000005755 formation reaction Methods 0.000 description 113
- 238000002360 preparation method Methods 0.000 description 19
- 239000010408 film Substances 0.000 description 8
- 238000005096 rolling process Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 101100149554 Dictyostelium discoideum fpaB-2 gene Proteins 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 101150117307 DRM3 gene Proteins 0.000 description 4
- 101150079344 ACT4 gene Proteins 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 101100056774 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) ARP3 gene Proteins 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011469 building brick Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 102100031102 C-C motif chemokine 4 Human genes 0.000 description 2
- 101000777470 Mus musculus C-C motif chemokine 4 Proteins 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920006163 vinyl copolymer Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 101100171184 Arabidopsis thaliana DRMH1 gene Proteins 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 101000908384 Bos taurus Dipeptidyl peptidase 4 Proteins 0.000 description 1
- 101150053091 DRM2 gene Proteins 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- HEFNNWSXXWATRW-UHFFFAOYSA-N Ibuprofen Chemical compound CC(C)CC1=CC=C(C(C)C(O)=O)C=C1 HEFNNWSXXWATRW-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/32—Arrangements for turning or reversing webs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/517—Drying material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Electroluminescent Light Sources (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
The disclosed substrate processing device is provided with: a substrate supply unit that supplies substrates such that the substrate, formed in a band shape, is in the state of being stood up in the direction of the shorter dimension thereof; a substrate processing unit that has a conveyance unit that conveys the substrate supplied from said substrate supply unit in the standing state, and a plurality of processing units that are disposed along the substrate conveyance route of said conveyance unit and that process the surface to be processed of the standing substrate; and a substrate retrieval unit that retrieves the substrate-processed by said substrate processing units-in the standing state.
Description
Technical field
The invention relates to a kind of substrate board treatment.
The application advocates priority No. 61/322417 according to the U.S. Provisional Application of No. 61/322347, the U.S. Provisional Application of application on April 9th, 2010 and application on April 9th, 2010, and its content is incorporated herein.
Background technology
Display module as display devices such as formation display equipments for example has LCD assembly, organic electroluminescent (organic EL) assembly, is used for the electrophoresis assembly of Electronic Paper etc.At present; These display modules are that the active display module (Active display device) that forms display module separately on it gradually is a main flow with after substrate surface formation is called as the switch module or amplification assembly or current drives assembly etc. of thin-film transistor (Thin Film Transistor:TFT).
In recent years, proposed a kind of substrate (for example film member etc.) and gone up the technology that forms display module in sheet.As this kind technology, a kind of scroll bar that is called as is for example arranged to scroll bar (roll to roll) mode (below, note by abridging be " scroll bar mode ") person be widely known by the people (for example, with reference to patent documentation 1).The scroll bar mode is that the supply that is wound on the supply substrate side is seen off, also the substrate of seeing off reeled the conveyance substrate with the recovery that substrate reclaims side with cylinder on one side with the substrate (for example, the film member of band shape) of cylinder.
Substrate see off to be wound as end during; For example while the gate electrode that uses conveyance substrate such as a plurality of conveyance cylinders, use a plurality of processing unit to form to constitute TFT, gate insulating film, semiconductor film, source electrode-drain electrode etc., in the constitutive requirements that form display module on the face in regular turn that are processed of substrate.For example, when forming the situation of organic el element, be on substrate, to form luminescent layer, anode, negative electrode, circuit etc. in regular turn.
Patent documentation 1: No. 2006/100868 brochure of International Publication
Summary of the invention
Yet, in the said method, owing to must therefore can make the whole maximization of device along the conveyance path configuration process device of substrate according to the for example conveyance form of substrate.
The purpose of form of the present invention is to provide a kind of substrate board treatment of ability save spaceization.
The substrate board treatment of one form; Be to form banded substrate transferring, and handle the face that is processed of this substrate, it is characterized in that in long side direction; Possess: supply substrate portion, this substrate of supply under the state that the short side direction that makes this substrate intersects with respect to horizontal direction; Processing substrate portion; Have conveyance portion and a plurality of handling part; This conveyance portion will be from this substrate conveyance under this crossing condition of this supply substrate portion supply, these a plurality of handling parts; Be conveyance path configurations, the face that is processed of this substrate of this crossing condition is handled along this substrate of this conveyance portion; And the substrate recoverer, will be at this substrate after this processing substrate portion handles in this crossing condition recover.
The substrate board treatment of one form is with forming banded substrate transferring in long side direction, and handles the face that is processed of this substrate that it is characterized in that possessing: supporting device possesses first support and second support; First transport mechanism, with this substrate transferring to this first support; Converter section to this first support, is changed the conveyance direction with the conveyance direction of this substrate towards this second support in the face that the is processed conveyance of this substrate; First handling part is handled being undertaken first by the face that is processed of this first support part supports among this substrate; And second handling part, handle being undertaken second by the face that is processed of this second support part supports among this substrate.
According to form of the present invention, the substrate board treatment of ability save spaceization can be provided.
Description of drawings
Fig. 1 is the stereogram of formation that shows the substrate board treatment of first example.
Fig. 2 is the vertical view of formation that shows the substrate board treatment of this example.
Fig. 3 is the vertical view of formation that shows the substrate board treatment of second example.
Fig. 4 is the vertical view of formation that shows the substrate board treatment of the 3rd example.
Fig. 5 is the stereogram of formation that shows the substrate board treatment of the 4th example.
Fig. 6 is the vertical view of formation that shows the substrate board treatment of this example.
Fig. 7 is the vertical view of formation that shows the substrate board treatment of this example.
Fig. 8 is the vertical view of formation that shows the substrate board treatment of this example.
Fig. 9 is the stereogram of formation that shows the substrate board treatment of the 5th example.
Figure 10 is the vertical view of formation that shows the substrate board treatment of the 6th example.
Figure 11 is the vertical view of formation that shows the substrate board treatment of the 7th example.
Figure 12 is the vertical view of formation that shows the substrate board treatment of another example.
Embodiment
(first example)
The substrate board treatment of first example then, is described.Fig. 1 is the stereogram of formation that shows the substrate board treatment FPA4 of this example.Fig. 2 is the vertical view of the formation of display base plate processing unit FPA4.
Like Fig. 1 and shown in Figure 2; Substrate board treatment FPA has the SU of supply substrate portion of supply plate shape substrates (for example, banded film structural component) FB, the PR of processing substrate portion that surface (the being processed face) Fp of plate shape substrates FB is handled, the cavity C B (omitting diagram among Fig. 1) that accommodates the PR of this processing substrate portion, the substrate recoverer CL that reclaims plate shape substrates FB, and the control part CONT of this each one of control.Substrate board treatment FPA is arranged on for example factory etc.In this example, plate shape substrates FB is supplied, handles, reclaims under upright state.In this example, this upright state comprise make plate shape substrates FB the face that is processed Fp with respect to the horizontal plane (XY plane) with the state of set angular cross, heeling condition or be configured to the state of approximate vertical for example.That is the short side direction that the state that the processing substrate face Fp of this plate shape substrates FB is erect also comprises substrate FB is the state of non-flat-hand position.
In the following explanation, set the XYZ orthogonal coordinate system, with reference to this XYZ orthogonal coordinate system on one side explain the position of each member concern on one side.Particularly, to establish set direction on the horizontal plane be X-direction, the direction with the X-direction quadrature on this horizontal plane is that Y direction, vertical are Z-direction.Rotation (inclination) direction of establishing around X axle, Y axle, Z axle again, is respectively θ X, θ Y, θ Z direction.
In the example, with respect to the horizontal plane be that the state of approximate vertical is that example describes with the processing substrate face Fp of plate shape substrates FB again.
Substrate board treatment FPA; Be after seeing the plate shape substrates FB that is wound into the rolling strip off from the SU of supply substrate portion to substrate recoverer CL plate shape substrates FB is recycled into the rolling strip during various processing are carried out on the surface of plate shape substrates FB scroll bar to the device of scroll bar mode (below, note by abridging be " scroll bar mode ").Substrate board treatment FPA can be used in and on plate shape substrates FB, form the for example situation of display module such as organic el element, LCD assembly (electronic building brick).Certainly, use substrate board treatment FPA also can in the situation that forms the assembly beyond these assemblies.
As the plate shape substrates FB that becomes process object at substrate board treatment FPA, can use the for example paper tinsel of resin molding or stainless steel etc. (foil).Resin molding can use for example materials such as polyvinyl resin, acrylic resin, mylar, ethylene-vinyl copolymer (Ethylene vinyl copolymer) resin, polyvinyl chloride-based resin, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate base resin.
The size of the short side direction of plate shape substrates FB is for example to form that the size of 50cm～2m degree, long side direction then forms for example more than the 10m.Certainly, this size is merely an example, is not limited to this example.For example the short side direction of plate shape substrates FB is of a size of below the 50cm and also can, also can be more than the 2m.Again, the size of the long side direction of plate shape substrates FB also can be below 10m.
Plate shape substrates FB forms for example to have the thickness below the 1mm and have flexible.Here, so-called flexible, for example be meant the character that the pre-determined force that substrate is imposed the degree of conducting oneself with dignity at least also can not rupture or break and can this substrate be bent.In addition, the character that for example bends because of above-mentioned pre-determined force also is contained in the flexible of indication.Again, above-mentioned flexible meeting is along with environment of this substrate material, size, thickness and temperature etc. etc. and change.Moreover plate shape substrates FB can use the banded substrate of a slice, also can use a plurality of unit substrate are connected and form banded formation.
Plate shape substrates FB, preferable with the also unconverted in fact thermal coefficient of expansion smaller of its size of heat who bears 200 ℃ of degree for example.For example can inorganic filler be mixed in resin molding to reduce thermal coefficient of expansion.As inorganic filler, titanium oxide, zinc oxide, aluminium oxide, silica etc. are for example arranged.
The SU of supply substrate portion has supply port 10 (omitting icon among Fig. 1) and the shaft component 11 and the support 12 that are configured in this supply port 10.Shaft component 11 be form for example cylindric, the central shaft arrangement precedent as with Z direction almost parallel.Therefore, at shaft component 11, be wound with plate shape substrates FB with upright state.Shaft component 11 is to be set as support 12 dismounting relatively.Support 12 can be rotated to support on Zhou Fangxiang (for example θ Z direction) with this shaft component 11.The SU of supply substrate portion; See and be supplied to the plate shape substrates FB that is wound into the strip that for example rolls under the state that the short side direction of this plate shape substrates FB is erect that is under the state consistent (that is this plate shape substrates FB is non-flat-hand position) off processing substrate portion PR with the Z direction.
In supply port 10, be provided with the shaft component 13 of the protective substrate PB of the face that the is processed Fp that is wound with protection plate shape substrates FB.In addition, be called protective substrate supply department and also can being located at shaft components 13 in the supply port 10.Protective substrate PB, be at the PR of processing substrate portion the back of finishing dealing with, be pasted on the substrate of plate shape substrates FB before reclaiming by substrate recoverer CL.Protective substrate PB, FB is identical with plate shape substrates, is for example to form banded and have flexible formation.Shaft component 13 be form for example cylindric, the central shaft arrangement precedent as with Z direction almost parallel.Therefore, at shaft component 13, be wound with protective substrate PB with upright state.Shaft component 13 is to can be rotated to support on Zhou Fangxiang (for example θ Z direction) by support 14.Shaft component 13 is to be set as support 14 dismounting relatively.The SU of supply substrate portion sees and is supplied to protective substrate PB off processing substrate portion PR under upright state.
The plate shape substrates FB that substrate recoverer CL will come from the PR of processing substrate portion conveyance under the state that is pasted with protective substrate PB receives in the state last volume wraparound that the short side direction of this plate shape substrates FB and protective substrate PB is erect.The recovery port 20 of substrate recoverer CL (omitting diagram among Fig. 1), with the SU of supply substrate portion likewise, be provided with in order to the shaft component 21 of coiling plate shape substrates FB and protective substrate PB with this shaft component 21 is supported to rotatable support 22.Shaft component 21 is to be set as support 22 dismounting relatively.
The supply port 10 of the SU of supply substrate portion is the outsides that are configured in the cavity C B that for example accommodates the PR of processing substrate portion with the recovery port 20 of substrate recoverer CL.Supply port 10 and recovery port 20 be configured in cavity C B for example-face of Y side, with respect to the PR of processing substrate portion for example in directions X and row arrangement.As above-mentioned,, therefore can supply port 10 and recovery port 20 high efficiency are carried out access to this because supply port 10 is configured in a position jointly with recovery port 20.
The PR of processing substrate portion will conveyance be to substrate recoverer CL under upright state from the plate shape substrates FB of the SU of supply substrate portion supply, and the face that the is processed Fp to the plate shape substrates FB of upright state handles in the conveyance process.The PR of processing substrate portion has for example carrying device 30, processing unit 40 and the alignment device (not icon) etc. of transport mechanism etc.The PR of processing substrate portion is contained in the vacuum chamber CB of air conditioning managing, and it is certain and protect above-mentioned each device not influenced by dust etc. to manage into ambient temperature and ambient humidity.
Like Fig. 1 and shown in Figure 2, carrying device 30 has a plurality of (for example 6) guide roller R101～R106 and 2 processing drum 31 and 32.Guide roller R101～R104 is directed to substrate recoverer CL with plate shape substrates FB from the SU of supply substrate portion.Guide roller R105 and R106 are directed to substrate recoverer CL with protective substrate PB from the SU of supply substrate portion with the path different with plate shape substrates FB.
Guide roller R101～R106 is configured to for example rotating shaft and Z-direction almost parallel.Therefore, at guide roller R101～R104, plate shape substrates FB opens with upright state (as above-mentioned, the non-level in fact posture of the short side direction of substrate FB) to establish.Again, at guide roller R105 and R106, protective substrate PB opens with upright state to establish.Guide roller R101～R106 also can for the formation that for example is provided with driving mechanism.Because guide roller R101～R104 is wound with the face that the is processed Fp of plate shape substrates FB, therefore also can for for example being provided with the formation that the not shown gas blanket that forms gas blanket forms device in the barrel surface of each guide roller R101～R104.By above-mentioned formation, plate shape substrates FB be keep set tension force by conveyance at least between guide roller R101～R104.
As the conveyance direction of plate shape substrates FB in the PR of processing substrate portion, at first, for example from supply opening SUa past+conveyance of Y direction, by guide roller R101 past-directions X (direction of wherein past-45 ° of Y tilt) conversion conveyance direction.Plate shape substrates FB through guide roller R101 turns back by processing drum 31, and the conveyance direction converts to+directions X.From processing drum 31 toward+plate shape substrates FB after directions X is turned back, by guide roller R102 past+Y direction conversion conveyance direction, convert to-the Y direction by a part (preparation processing unit (plant) 44) the conveyance direction of processing unit 40.Through the plate shape substrates FB of preparation processing unit (plant) 44, by guide roller R103 past+directions X conversion conveyance direction, turn back past-directions X (direction of wherein past+45 ° of Y tilt) conversion conveyance direction by processing drum 32.Through the plate shape substrates FB of processing drum 32, by guide roller R104 past-Y direction conversion conveyance direction, conveyance is to reclaiming a mouthful CLa.In the above described manner, carrying device 30 frequently switches conveyance direction and the plate shape substrates of conveyance simultaneously FB in directions X and Y direction in cavity C B.
As the kind of this kind processing unit 40, for example use various devices such as film formation device such as apparatus for coating liquid droplet (for example inkjet type apparatus for coating, screen painting type apparatus for coating etc.), evaporation coating device, sputtering unit or exposure device, developing apparatus, surfaction device, decontaminating apparatus.These each devices are suitably to be located on the conveyance path of plate shape substrates FB for example.
Decontaminating apparatus 41 has the first decontaminating apparatus 41A of clean plate shape substrates FB and the second decontaminating apparatus 41B of clean protective substrate PB.The conveyance path that the first decontaminating apparatus 41A is provided in a side of plate shape substrates FB is for example between supply opening SUa (with reference to Fig. 2) and the processing drum 31.Again, the second decontaminating apparatus 41B conveyance path for example between supply opening SUb and the laminater 46 that is provided in a side of protective substrate PB.Plate shape substrates FB or protective substrate PB cleaningization that decontaminating apparatus 41 will be supplied toward inside from the outside of cavity C B.
It is to form in order to the TFT assembly of driving organic el element or the device of electrode that the TFT layer forms device 42.The TFT layer forms device 42 and has the for example first formation device 42A, the second formation device 42B and the 3rd formation device 42C.First forms device 42A is configured in processing drum 31-Y side.Second forms device 42B is configured in processing drum 31-X side.The 3rd forms device 42C is configured in processing drum 31+Y side.Processing drum 31+the X side is empty state, disposes for example guide roller R101.
These first form device 42A, second form device 42B and the 3rd form device 42C be provided in a side of processing drum 31 for example around.The a succession of step that forms TFT assembly and electrode is to share by the for example first formation device 42A, the second formation device 42B and the 3rd formation device 42C carrying out.
Like Fig. 1 and shown in Figure 2, preparation processing unit (plant) 44 is the devices that carry out the preliminary step (for example, insulating barrier forms step etc.) when plate shape substrates FB forms luminescent layer.Preparation processing unit (plant) 44 is to be configured between the conveyance path processing drum 31 and processing drum 32 of plate shape substrates FB for example with drying device 43.Preparation processing unit (plant) 44 has the for example first processing unit (plant) 44A, the second processing unit (plant) 44B and the 3rd processing unit (plant) 44C, and a succession of preparation procedure of processing is to share carrying out.
It is the devices that form the luminescent layer that constitutes organic el element that luminescent layer forms device 45.Luminescent layer forms device 45 and has the for example first formation device 45A, the second formation device 45B and the 3rd formation device 45C.This first form device 45A, second form device 45B and the 3rd form device 45C be provided in a side of processing drum 32 for example around.The a succession of step that forms luminescent layer is to share by the for example first formation device 45A, the second formation device 45B and the 3rd formation device 45C carrying out.
Among the above-mentioned processing unit 40, for example the TFT layer form first of device 42 form device 42A, the first decontaminating apparatus 41A, the second decontaminating apparatus 41B, luminescent layer form the 3rd of device 45 form device 45C be configured to when directions X is observed overlapping.Again, the TFT layer form second of device 42 form device 42B, processing drum 31, processing drum 32, luminescent layer form second of device 45 form device 45B be configured to when directions X is observed overlapping.Moreover, the TFT layer form the 3rd of device 42 form device 42C, drying device 43, luminescent layer form first of device 45 form device 45A be configured to when directions X is observed overlapping.
Again, for example the TFT layer form first of device 42 form device 42A, processing drum the 31, the 3rd form device 42C be configured to when the Y direction is observed overlapping.Again, for example decontaminating apparatus 41A and 41B and drying device 43 be configured to when the Y direction is observed overlapping.Again, preparation processing unit (plant) 44 and laminater 46 be configured to when the Y direction is observed overlapping.Moreover, luminescent layer form first of device 45 form device 45A, processing drum the 32, the 3rd form device 45C be configured to when the Y direction is observed overlapping.As above-mentioned, carrying device 30 and processing unit 40 are intensively to be configured to that lap becomes many when directions X and Y direction are observed.
The substrate board treatment FPA that constitutes in the above described manner makes display modules (electronic building brick) such as organic el element, LCD assembly by the control of control part CONT with the scroll bar mode.Below, explain that the substrate board treatment FPA that uses above-mentioned formation makes the step of display module.
At first, will be installed on support 12 in the supply port 10 of the SU of supply substrate portion at the plate shape substrates FB that shaft component 11 is wound into the band shape of rolling strip.The protective substrate PB of the band shape that is wound on shaft component 13 is installed on the support 14 in the supply port 10 of the SU of supply substrate portion again.Moreover, the shaft component 21 that reclaims usefulness is installed on the support 22 in the recovery port 20 of substrate recoverer CL.
Control part CONT makes shaft component 11 rotations through support 12 under this state, see this plate shape substrates FB off from the SU of supply substrate portion.From the plate shape substrates FB that the SU of supply substrate portion sees off, be that the supply opening SUa from the PR of processing substrate portion is supplied in the cavity C B.Control part CONT will be supplied to plate shape substrates FB conveyance to the carrying device 30 in the cavity C B and handle by 40 pairs of these plate shape substrates of each processing unit FB simultaneously.In this example, control part CONT is one by one to control each motor with the rotation drive motor of cylinder 31,32 and each cylinder R101～R106 to the mode that plate shape substrates FB gives set tension force by suitably being located at processing.
By this action, the plate shape substrates FB that is supplied to the PR of processing substrate portion cleans by the first decontaminating apparatus 41A, is directed to processing drum 31 by guide roller R101.Plate shape substrates FB is to form first of device 42 towards the TFT layer respectively and form device 42A, second and form the mode that device 42B and the 3rd forms device 42C to be processed face Fp, with upright state coiling lash in processing drum 31.At the be processed face Fp of coiling lash, form device 42 by this TFT layer and form TFT assembly or distribution etc. at the plate shape substrates FB of processing drum 31.
Plate shape substrates FB through processing drum 31 is supplied to drying device 43, for example applies dried such as heat treated.Plate shape substrates FB after the dried is supplied to preparation processing unit (plant) 44 through for example guide roller R102.Preparation processing unit (plant) 44 at the for example first processing unit (plant) 44A～the 3rd processing unit (plant) 44C, forms dielectric film or electric hole implanted layer or electron injecting layer etc. at plate shape substrates FB.
Plate shape substrates FB after the preparation processing is directed to processing drum 32 through for example guide roller R103.Plate shape substrates FB is to form first of device 45 towards luminescent layer respectively and form device 45A, second and form the mode that device 45B and the 3rd forms device 45C to be processed face Fp, with upright state coiling lash in processing drum 32.At the be processed face Fp of coiling lash, form device 45 by this luminescent layer and form luminescent layer etc. at the plate shape substrates FB of processing drum 32.
Plate shape substrates FB through processing drum 32 is supplied to laminater 46, is being processed face Fp stickup protective substrate PB.Plate shape substrates FB behind stickup protective substrate (protection material) PB is recycled to substrate recoverer CL from for example reclaiming a mouthful CLa.The plate shape substrates FB that is recycled to substrate recoverer CL is that the shaft component 21 in recovery port 20 is wound into the rolling strip.After shaft component 21 was wound with both quantitative plate shape substrates FB, FB for example cut off with plate shape substrates, and the shaft component that is wound with plate shape substrates FB 21 is removed from support 22.The new shaft component 21 of the plate shape substrates FB that for example do not reel is installed at this support 22.
Control part CONT is by carrying out above-mentioned processing, to the face that the is processed Fp formation assembly of plate shape substrates FB.
As above-mentioned; According to this example; Since possess with the short side direction that forms banded plate shape substrates FB the SU of supply substrate portion of this plate shape substrates of supply FB under the upright state, have with from the plate shape substrates FB of the SU of this supply substrate portion supply the PR of processing substrate portion of the carrying device 30 of conveyance under the upright state and a plurality of processing unit 40 of handling along the conveyance path configurations of the plate shape substrates FB of this carrying device 30 and to the face that the is processed Fp of the plate shape substrates FB of upright state, will be at the substrate recoverer CL of the plate shape substrates FB after the PR of this processing substrate portion handles in the upright state recover, therefore become and be easy to the conveyance direction of the plate shape substrates FB formation of (directions X and Y direction) conversion in the horizontal direction.
Therefore, can increase the selection width of processing unit 40, for example also can select the layout of configuration process device 40 with the mode of the device area of the substrate board treatment FPA4 that reduces to the minimum in the layout of directions X and Y direction.Thus, can seek the save spaceization of substrate board treatment FPA4.
(second example)
The substrate board treatment of the present invention's second example then, is described.
Fig. 3 is the vertical view of the formation of display base plate processing unit FPA2.At substrate board treatment FPA2, the formation of the PR of processing substrate portion is different with first example.Other formations can be identical formation with for example first example.In this example, be that the center describes with this difference.
As shown in Figure 3, substrate board treatment FPA2 has the SU of supply substrate portion, the PR of processing substrate portion, substrate recoverer CL, cavity C B and control part CONT.The PR of processing substrate portion is housed in the cavity C B.The SU of supply substrate portion has and forms cylindric and central shaft arrangement and become the shaft component 111 parallel with the Z direction and this shaft component 111 is supported to rotatable support 112.At shaft component 111, plate shape substrates FB reels with upright state.In addition, for the purpose of simplifying the description, among Fig. 3, omit the diagram of the formation of supply protective substrate at the SU of supply substrate portion.Substrate recoverer CL has and forms cylindric and central shaft arrangement and become the shaft component 121 parallel with the Z direction and this shaft component 121 is supported to rotatable support 122.
Central portion has the conveyance of processing cylinder 131 when the carrying device 130 of the PR of processing substrate portion, overlooking in cavity C B.Handle conveyance cylinder 131 and be forming for example cylindricly, it is parallel with the Z direction to be configured to central shaft.Handling conveyance cylinder 131 is for example to be set as to rotate in θ Z direction.Plate shape substrates FB opens with upright state to be located at this processing conveyance cylinder 131.As above-mentioned, at the PR of processing substrate portion, plate shape substrates FB is by conveyance with upright state.
Handle conveyance cylinder 131 and for example have the not rotary drive mechanism of icon.This rotary drive mechanism is by for example control part CONT control.The plate shape substrates FB that supplies from supply opening SUa opens to be located at this a processing conveyance cylinder 131 and conveyance to a recovery mouth CLa.Handling conveyance cylinder 131, opening and establish plate shape substrates FB for example to be processed face Fp mode toward the outer side.
The PR of processing substrate portion, handle conveyance cylinder 131 around dispose a plurality of processing unit 140 with mode along the barrel surface of this processing conveyance cylinder 131.As this processing unit 140, be to use the various processing unit of for example explaining at first example.In example shown in Figure 3; As a plurality of processing unit 140, will carry out the TFT layer form step each processing unit, each processing unit of pre-process (preliminary step) that luminescent layer forms step, carry out each processing unit that luminescent layer forms step side by side along the Zhou Fangxiang that handles conveyance cylinder 131 one row.A plurality of processing unit 140 are respectively towards handling conveyance cylinder 131.
At aforesaid substrate processing unit FPA2, supply plate shape substrates FB to the PR of processing substrate portion with upright state from the SU of supply substrate portion.Plate shape substrates FB is to open to be located at upright state at the PR of processing substrate portion to handle conveyance cylinder 131 by conveyance to substrate recoverer CL.By a plurality of processing unit 140, handle in regular turn for example opening the plate shape substrates FB that is located at processing conveyance cylinder 131 with upright state again.
As above-mentioned,, handle conveyance cylinder 131 and have supporting concurrently with the function of the plate shape substrates FB of upright state coiling and with the function of this plate shape substrates FB with the upright state conveyance according to this example.Thus, can seek the save spaceization of substrate board treatment FPA2.Owing to around a processing conveyance cylinder 131, carry out institute in steps, the layout of the device in the PR of processing substrate portion is oversimplified again.
(the 3rd example)
The substrate board treatment of the present invention's the 3rd example then, is described.
Fig. 4 is the vertical view of the formation of display base plate processing unit FPA3.At substrate board treatment FPA3, the formation of the PR of processing substrate portion is different with first example.Other formations can be identical formation with for example first example.In this example, be that the center describes with this difference.
As shown in Figure 4, the formation of substrate board treatment FPA3 is at the PR of processing substrate portion a plurality of processing conveyance cylinders in the explanation of second example to be set.In this example, the carrying device 230 of the PR of processing substrate portion has guide roller R111～R114 and handles conveyance cylinder 231～233.
Guide roller R111～R114 and handle conveyance cylinder 231～233rd forms cylindricly respectively, and it is parallel with the Z direction respectively to be configured to central shaft.Handle conveyance cylinder 231～233rd, form big footpath than guide roller R111～R114.Plate shape substrates FB opens with upright state to be located at this processing conveyance cylinder 231～233 and guide roller R111～R114.As above-mentioned, at the PR of processing substrate portion, plate shape substrates FB is by conveyance with upright state.
As the configuration of carrying device 230, for example guide roller R111～R114 be with in length and breadth each side by side the state configuration of two row in the substantial middle portion of cavity C B.Again, handle conveyance cylinder 231～233rd, be configured to from three directions (directions X ,+the Y direction ,-directions X) around these four guide roller R111～R114.
The PR of processing substrate portion, handle conveyance cylinder 231～233 around dispose a plurality of processing unit 241～243 respectively with mode along the barrel surface of this processing conveyance cylinder 231～233.As this processing unit 241～243, be to use the various processing unit of for example explaining at first example.For example; Be to use each processing unit that carries out TFT layer formation step as processing unit 241; Be to use as processing unit 242 and carry out each processing unit that luminescent layer forms the pre-process (preliminary step) of step, be to use as processing unit 243 and carry out each processing unit that luminescent layer forms step and also can.Each processing unit 241～243rd is towards for example handling conveyance cylinder 231～233.
The PR of processing substrate portion, a plurality of processing conveyance cylinders 231～233rd form for example cylindricly, and it is parallel with the Z direction to be configured to central shaft.Handling conveyance cylinder 231 is to be set as to rotate in for example θ Z direction.
Handle conveyance cylinder 231～233 and for example have the not rotary drive mechanism of icon.This rotary drive mechanism is by for example control part CONT control.The plate shape substrates FB that supplies from supply opening SUa opens to be located at this a processing conveyance cylinder 231～233 and conveyance to a recovery mouth CLa.Handling conveyance cylinder 231～233, opening and establish plate shape substrates FB for example to be processed face Fp mode toward the outer side.On the other hand, at guide roller R111～R114, open towards the mode of inboard and establish plate shape substrates FB to be processed face Fp.
At aforesaid substrate processing unit FPA3, supply plate shape substrates FB to the PR of processing substrate portion with upright state from the SU of supply substrate portion.Plate shape substrates FB is to open to be located at upright state at the PR of processing substrate portion to handle conveyance cylinder 231～233 by conveyance to substrate recoverer CL.By a plurality of processing unit 241～243, handle in regular turn respectively for example opening the plate shape substrates FB that is located at processing conveyance cylinder 231～233 with upright state again.
As above-mentioned,,, can continuous processing sharing be carried out in for example a plurality of zones by using a plurality of processing conveyance cylinders 231～233 according to this example.Thus, can increase the selection width of arranging.Again; According to this example; Owing to concentrate on the for example formation of the central portion of cavity C B for guide roller R111～R114; Therefore be configured in the central portion of this cavity C B by processing unit 244 such as for example making drying device, can make commonization of processing of the dried of managing the plate shape substrates FB after conveyance cylinder 231～233 is handled throughout etc.Thus, can seek save spaceization.
(the 4th example)
Below, with reference to graphic explanation the present invention the 4th example.Below, suitably omit about giving the explanation with the formation article of above-mentioned example same-sign.
Fig. 5 is the stereogram of the formation of display base plate processing unit FPA.Fig. 6 is the vertical view of the formation of display base plate processing unit FPA.
At the 4th example, carrying device 30 has a plurality of (for example 10) guide roller R1～R10, the bucket DRM of mechanism, processing drum 32.Guide roller R1～R8 is directed to substrate recoverer CL with plate shape substrates FB from the SU of supply substrate portion.Guide roller R9 and R10 are directed to substrate recoverer CL with the path different with plate shape substrates FB from the SU of supply substrate portion with protective substrate PB.In addition, establishing barrel DRM of mechanism is that first barrel of mechanism, processing drum 32 are that second barrel of mechanism also can.
Guide roller R1～R3, R6～R10 are configured to for example rotating shaft and Z-direction almost parallel.Therefore, at guide roller R1～R3, R6～R8, plate shape substrates FB open with upright state to establish.Again, at guide roller R9 and R10, protective substrate PB opens with upright state to establish.Guide roller R1～R10 for example is provided with the formation of driving mechanism also can.About being wound with the for example guide roller R1 of the face that the is processed Fp of plate shape substrates FB, R4, R7, R8 also can for be provided with the formation that the not shown gas blanket that forms gas blanket (air bearing) forms device in barrel surface.Anyway, the situation of this example, plate shape substrates FB be keep set tension force by conveyance at least between guide roller R1～R9.
Fig. 7 is near the stereogram of formation of the middle bucket DRM of mechanism of display base plate handling part PR.
As shown in Figure 7, the bucket DRM of mechanism has the cylinder element CYL that is configured to rotary middle spindle and Z direction almost parallel and this cylinder element CYL is supported to can be at rotary drive mechanism (drive division) ACT of circumferencial direction rotation.Cylinder element CYL has first cylindrical portion (the 1st cylinder) CY1, second cylindrical portion (the 2nd cylinder) CY2, reaches guidance part G.
The first cylindrical portion CY1 and the second cylindrical portion CY2 are parts that is respectively the barrel surface of this cylinder element CYL.Because the first cylindrical portion CY1 and the second cylindrical portion CY2 are all the part of a cylinder element CYL, therefore if the then first cylindrical portion CY1 and the rotation of second cylindrical portion CY2 meeting one of cylinder element CYL rotation.
The first cylindrical portion CY1 and the second cylindrical portion CY2 are cut apart in the Z direction by for example guidance part G.That is, the second cylindrical portion CY2, with respect to the first cylindrical portion CY1 in the position of Z direction that is different in the position of the direction of intersecting with respect to horizontal direction.The first cylindrical portion CY1 is configured in guidance part G+Z side (top), and the second cylindrical portion CY2 is configured in guidance part G-Z side (below).The first cylindrical portion CY1 and the second cylindrical portion CY2 form for example to have equal footpath each other.The first cylindrical portion CY1 and the second cylindrical portion CY2 form more for example the big footpath of guide roller R1～R10 (for example more than the diameter 1m).Guidance part G is along guiding with the mode of parallel plane conveyance of XY with the part that is wound in the part of the first cylindrical portion CY1 among the plate shape substrates FB and is wound in the second cylindrical portion CY2.
In the conveyance path of plate shape substrates FB, between the first cylindrical portion CY1 and the second cylindrical portion CY2, dispose guide roller R2～R5.Guide roller R2 turns back-Y direction past by the plate shape substrates FB that the first cylindrical portion CY1 turns back into U word shape and past+directions X conveyance with the half cycle journey.Guide roller R3 with toward-plate shape substrates FB after the Y direction is turned back past-directions X turns back.
Guide roller R4 and R5, be with for example+end of Z side is past+state configuration of X tilt.Guide roller R4 will be directed to through guide roller R3-and the plate shape substrates FB of directions X turns back toward oblique lower direction (direction of+directions X and past-Z tilt).Guide roller R5 is on the oblique lower direction that is configured in guide roller R4 (+directions X and toward the direction of-Z tilt).Guide roller R5 turns back-directions X past from guide roller R4 toward the plate shape substrates FB of tiltedly lower direction conveyance, makes it towards the second cylindrical portion CY2.
Guide roller R4 and R5, in the situation of the formation of Fig. 7, set that its rotation keeps each other almost parallel for and on the XZ plane tilt both quantitative.
Be provided with the actuator that to adjust the for example inclination of rotating shaft (tilt quantity or incline direction) at guide roller R4 and R5 again.By at least one the heeling condition of this rotating shaft of adjustment guide roller R4 and R5, can make from guide roller R5 past-the conveyance direction of the plate shape substrates FB that directions X is seen off becomes level (parallel with the X axle) and is maintained in the position of the Z direction of plate shape substrates roughly certain simultaneously.The adjustment of the heeling condition of the rotating shaft of at least one of guide roller R4 and R5, can by receive from precision monitor from guide roller R5 past-the control part CONT of the measurement signal of the transducer of the posture of the plate shape substrates FB that directions X is seen off or the variation of position drives the actuator that tilt adjustments uses and controls.
As above-mentioned, guide roller R2～R5 is a conveyance direction of changing plate shape substrates FB with the conveyance direction of the plate shape substrates FB behind the outer peripheral face that is wound on the first cylindrical portion CY1 towards the mode of the direction of the second cylindrical portion CY2.Especially, can be by guide roller R4, R5's is right, does not change the conveyance direction (directions X) of plate shape substrates FB and the height and position skew that only makes the Z direction both quantitatively (more than the width extent for the Z direction of plate shape substrates FB in this example).In addition; As this example; Plate shape substrates is turned back toward the situation of Z direction parallel offset, in the XZ face, be tilted conveyance at plate shape substrates FB between guide roller R4 and the R5, but this tilt quantity is width extent, guide roller R4 according to plate shape substrates; The interval of the directions X of R5, guide roller R4, the angle of inclination of the rotary middle spindle of R5 or incline direction etc. determine with the geometry mode.Be with, the situation of this example, if make guide roller R4, R5 with each rotary middle spindle in the XZ face, all tilt 45 degree mode the Z direction up and down and put, the plate shape substrates of between guide roller R4 and R5, advancing vertical (tilt quantity 90 degree) also can.
Again, by guide roller R2～R5, plate shape substrates FB is the space that is directed to the plate shape substrates FB that for example is guided in the position of guide roller R1-Z side (downside).As above-mentioned; In this example, with respect to the coiling direction of plate shape substrates FB toward the first cylindrical portion CY1, plate shape substrates FB is identical toward the coiling direction of the second cylindrical portion CY2; With the nonreversible mode in the surperficial back side of plate shape substrates FB, by guide roller R2～R5 guiding plate shape substrates FB.
Like Fig. 5 and shown in Figure 6, processing drum 32 is to be configured in the for example guide path of the plate shape substrates FB of guide roller R1～R4.Processing drum 32 be form for example cylindric.Processing drum 32 is to be configured to for example central shaft and Z direction almost parallel, and plate shape substrates FB opens with upright state and establishes.Processing drum 32 is to form the more for example big footpath of guide roller R1～R10.The footpath of this processing drum 32 constitutes with the above-mentioned first cylindrical portion CY1 and the second cylindrical portion CY2 is roughly isometrical also can.
The TFT layer formation device 42 on every side that is configured in barrel DRM of mechanism is to form in order to the TFT assembly of driving organic el element or the device of electrode, wiring layer etc.The TFT layer forms device 42 and has the for example first formation device 42A, the second formation device 42B and the 3rd formation device 42C.First forms device 42A is configured in cylinder element CYL-Y side.Second forms device 42B is configured in cylinder element CYL-X side.The 3rd forms device 42C is configured in cylinder element CYL+Y side.
As above-mentioned; First form device 42A, second form device 42B and the 3rd form device 42C be provided in a side of cylinder element CYL around, a succession of step that forms TFT assembly and electrode, wiring layer etc. is by for example first forming device 42A, second and form device 42B and the 3rd and form device 42C and share and carrying out.
Fig. 8 shows that first forms device 42A, second and form the figure that device 42B and the 3rd forms device 42C and the relation of the cylinder element CYL of the bucket DRM of mechanism.
As shown in Figure 8, first forms device 42A, the second formation device 42B and the 3rd formation device 42C has two handling part 42A1 and 42A2, handling part 42B1 and 42B2, handling part 42C1 and 42C2 respectively.Handling part 42A1,42B1,42C1 face with the first cylindrical portion CY1 respectively to be provided with, and can handle opening the plate shape substrates FB that is located at this first cylindrical portion CY1.Handling part 42A2,42B2,42C2 face with the second cylindrical portion CY2 respectively to be provided with, and can handle opening the plate shape substrates FB that is located at this second cylindrical portion CY2.As above-mentioned, first forms device 42A, the second formation device 42B and the 3rd formation device 42C can handle the plate shape substrates FB that reels with upright state.In addition, the first cylindrical portion CY1 and the second cylindrical portion CY2 when carrying out the processing of TFT layer formation device 42, become the support of supporting plate shape substrates FB.
Again, the first cylindrical portion CY1 and the second cylindrical portion CY2 become the situation of the support of supporting plate shape substrates FB, bucket mechanism is called supporting device also can.
Like Fig. 5～shown in Figure 7, drying device 43 is by for example heating plate shape substrates FB so that be formed on the device of the stabilisation such as TFT assembly or electrode of this plate shape substrates FB.Drying device 43-face of X side, as shown in Figure 7ly be provided with two and insert mouthful 43a and 43b.Insert a mouthful 43a and be configured in+the Z side, be inserted with through the plate shape substrates FB behind the first cylindrical portion CY1.Insert a mouthful 43b and be configured in-the Z side, be inserted with through the plate shape substrates FB behind the second cylindrical portion CY2.
Drying device 43+face of X side, be provided with two outlet 43c and 43d.Outlet 43c is configured in+the Z side, supplies from insertion mouthful 43a insertion and the plate shape substrates FB discharge after carrying out dried.Outlet 43d is configured in-the Z side, supplies from insertion mouthful 43b insertion and the plate shape substrates FB discharge after carrying out dried.
Like Fig. 5 and shown in Figure 6, preparation processing unit (plant) 44 is the devices that carry out the preliminary step (for example, insulating barrier forms step etc.) when plate shape substrates FB forms luminescent layer.Preparation processing unit (plant) 44 is to be configured between the cylinder element CYL and processing drum 32 of the DRM of conveyance path bucket mechanism of plate shape substrates FB for example with drying device 43.Preparation processing unit (plant) 44 has the for example first processing unit (plant) 44A, the second processing unit (plant) 44B and the 3rd processing unit (plant) 44C, and a succession of preparation procedure of processing is to share carrying out.
Among the above-mentioned processing unit 40, for example the 3rd formation device 45C of the first formation device 42A of TFT layer formation device 42, the first decontaminating apparatus 41A, the second decontaminating apparatus 41B, luminescent layer formation device 45 disposes along the 1st direction (the 1st direction is a directions X in this example).Again, the second formation device 45B of the second formation device 42B of TFT layer formation device 42, cylinder element CYL, processing drum 32, luminescent layer formation device 45 disposes along directions X.Moreover the first formation device 45A that the 3rd of TFT layer formation device 42 forms device 42C, drying device 43, luminescent layer formation device 45 disposes along directions X.
Again, for example the first formation device 42A of TFT layer formation device 42, cylinder element CYL, the 3rd formation device 42C are along the 2nd direction (being the Y direction of intersecting with directions X in this example) configuration.Again, for example decontaminating apparatus 41A and 41B and drying device 43 are to dispose along the Y direction.Again, preparation processing unit (plant) 44 is to dispose along the Y direction with laminater 46.Moreover the first formation device 45A, processing drum the 32, the 3rd that luminescent layer forms device 45 form device 45C and dispose along the Y direction.As above-mentioned, carrying device 30 and processing unit 40 are along the configuration of directions X and Y direction, and therefore intensive to be configured to when directions X and Y direction are observed the part change that overlaps each other of each device many.
The substrate board treatment FPA that constitutes in the above described manner makes display modules (electronic building brick) such as organic el element, LCD assembly by the control of control part CONT with the scroll bar mode.Below, explain that the substrate board treatment FPA that uses above-mentioned formation makes the step of display module.
At first, will be installed on support 12 in the supply port 10 of the SU of supply substrate portion at the plate shape substrates FB that shaft component 11 is wound into the band shape of rolling strip.The protective substrate PB of the band shape that is wound on shaft component 13 is installed on the support 14 in the supply port 10 of the SU of supply substrate portion again.Moreover, the shaft component 21 that reclaims usefulness is installed on the support 22 in the recovery port 20 of substrate recoverer CL.
Control part CONT makes shaft component 11 rotations through support 12 under this state, see this plate shape substrates FB off from the SU of supply substrate portion.From the plate shape substrates FB that the SU of supply substrate portion sees off, be that the supply opening SUa from the PR of processing substrate portion is supplied in the cavity C B.Control part CONT will be supplied to plate shape substrates FB conveyance to the carrying device 30 in the cavity C B and handle by 40 pairs of these plate shape substrates of each processing unit FB simultaneously.In addition, in advance in the leading section and the terminal part that are wound into the plate shape substrates FB of rolling strip at shaft component 11, paste and use so that plate shape substrates FB also can toward the easy top guide sheet of automatic loading change of processing unit FPA.
By this action, the plate shape substrates FB that is supplied to the PR of processing substrate portion cleans by the first decontaminating apparatus 41A, is directed to the first cylindrical portion CY1 of barrel DRM of mechanism by guide roller R1.Plate shape substrates FB is to form first of device 42 towards the TFT layer respectively and form device 42A, second and form the mode that device 42B and the 3rd forms device 42C to be processed face Fp, with upright state coiling lash at the first cylindrical portion CY1.At the be processed face Fp of coiling lash, form device 42 (for example, handling part A1, B1 and C1) by this TFT layer and form TFT assembly or distribution etc. at the plate shape substrates FB of the first cylindrical portion CY1.
From the inside that the insertion mouth 43a of drying device 43+Z side is supplied to drying device 43, for example apply dried such as heat treated through the plate shape substrates FB of the first cylindrical portion CY1.Plate shape substrates FB after the dried takes out of from the outlet 43c of drying device 43+Z side.The plate shape substrates FB that takes out of be by for example guide roller R2 past-the Y direction guiding, by guide roller R3 past-directions X guiding.Through the plate shape substrates FB of guide roller R3 be by guide roller R4 toward tiltedly lower direction (direction of+directions X and past-Z tilt) guiding, by guide roller R5 past-the directions X guiding.
Plate shape substrates FB through guide roller R5 is with the second cylindrical portion CY2 of upright state coiling lash at the DRM of bucket mechanism.At the be processed face Fp of coiling lash, form TFT assembly or the distribution etc. that device 42 (for example, handling part A2, B2 and C2) overlaps to form necessary layer by this TFT layer at the plate shape substrates FB of the second cylindrical portion CY2.
From the inside that the insertion mouth 43b of drying device 43-Z side is supplied to drying device 43, for example apply dried such as heat treated through the plate shape substrates FB of the second cylindrical portion CY2 once more.Plate shape substrates FB after the dried takes out of from the outlet 43d of drying device 43-Z side.The plate shape substrates FB that takes out of is supplied to preparation processing unit (plant) 44 by for example guide roller R6.Preparation processing unit (plant) 44 at the for example first processing unit (plant) 44A～the 3rd processing unit (plant) 44C, forms dielectric film or electric hole implanted layer or electron injecting layer etc. at plate shape substrates FB.
Plate shape substrates FB after the preparation processing is directed to processing drum 32 through for example guide roller R7.Plate shape substrates FB is to form first of device 45 towards luminescent layer respectively and form device 45A, second and form the mode that device 45B and the 3rd forms device 45C to be processed face Fp, with upright state coiling lash in processing drum 32.At the be processed face Fp of coiling lash, form device 45 by this luminescent layer and form luminescent layer etc. at the plate shape substrates FB of processing drum 32.
Plate shape substrates FB through processing drum 32 is supplied to laminater 46, is being processed face Fp stickup protective substrate PB.Plate shape substrates FB behind the stickup protective substrate PB is recycled to substrate recoverer CL from for example reclaiming a mouthful CLa.The plate shape substrates FB that is recycled to substrate recoverer CL is that the shaft component 21 in recovery port 20 is wound into the rolling strip.After shaft component 21 was wound with both quantitative plate shape substrates FB, FB for example cut off with plate shape substrates, and the shaft component that is wound with plate shape substrates FB 21 is removed from support 22.The new shaft component 21 of the plate shape substrates FB that for example do not reel is installed at this support 22.
Control part CONT is by carrying out above-mentioned processing, to the face that the is processed Fp formation assembly of plate shape substrates FB.
As above-mentioned; According to this example; Be wound on the part of outer peripheral face of the first cylindrical portion CY1 of barrel DRM of mechanism at plate shape substrates FB after; The conveyance direction conversion of this plate shape substrates FB is to the second cylindrical portion CY2; This plate shape substrates FB is wound on the second cylindrical portion CY2, the face that the is processed Fp of the part that is wound on the first cylindrical portion CY1 is carried out first handle and the face that the is processed Fp of the part that is wound on the second cylindrical portion CY2 is carried out second handle, and therefore can handle plate shape substrates FB high density.Thus, can seek the save spaceization of substrate board treatment FPA.
In addition, at Fig. 5 and substrate board treatment FPA shown in Figure 6, in processing drum 32; Plate shape substrates FB only reels once; But with the cylinder element CYL of the DRM of bucket mechanism likewise, constitute with the two cylindrical section portions that possess the 1st cylindrical portion and the 2nd cylindrical portion, also can at each cylindrical portion coiling plate shape substrates FB.Moreover, during this constitutes, luminescent layer formed device 45 is configured in the 1st cylindrical portion and the 2nd cylindrical portion also can.In addition, constitute the situation of processing drum 32 with two cylindrical section portions, guide roller R4 as shown in Figure 7, R5, two guide roller using each rotary middle spindle to tilt turn back plate shape substrates FB also can.
(the 5th example)
Then, the present invention's the 5th example is described.In this example, the formation of bucket mechanism is different with the 4th example, and therefore the center of constituting with bucket mechanism describes.Fig. 9 is the stereogram of formation that shows the bucket DRM2 of mechanism of this example.
In the above-mentioned example; Be to describe with the example that constitutes that the first cylindrical portion CY1 and the second cylindrical portion CY2 form single cylinder element CYL; But in the 5th example; As shown in Figure 9, be to show that the first cylindrical portion CY1 and the second cylindrical portion CY2 form the formation of different cylinder elements (for example, the first cylinder element C1 and the second cylinder element C2).
As shown in Figure 9, the first cylinder element C1 is the state configuration of separating with in the Z direction with the second cylinder element C2.The first cylinder element C1+the end face C1a of Z side and the second cylinder element C2-the end face C2a of Z side faces with each other.The center line of rotating shaft SF is to be set as between the first cylinder element C1 and the second cylinder element C2 common (same position in the XY face).
In the formation shown in Figure 9, between the for example first cylinder element C1 and the second cylinder element C2, the footpath is different.Particularly, the footpath D1 of the first cylinder element C1 is greater than the footpath D2 of the second cylinder element C2.As above-mentioned, have different footpaths by the first cylinder element C1 with the second cylinder element C2, can adjust the path in carrying channel footpath.
Rotary drive mechanism ACT2 also can for making the independent respectively formation of rotating of the first cylinder element C1 and the second cylinder element C2.Again, rotary drive mechanism ACT2 is for only also can the formation of a rotation among the first cylinder element C1 and the second cylinder element C2.
According to formation shown in Figure 9, reeling to open through the plate shape substrates FB of for example guide roller R21 is located at the first cylindrical portion CY1, is directed to the second cylindrical portion CY2 through guide roller (converter section) R22 and R23.Reel opening the plate shape substrates FB that is located at behind the second cylindrical portion CY2 guides through guide roller R24.
The difference of the diameter of the first cylinder element C1 and the second cylinder element C2 can be depending on and is configured in each cylinder element C1, processing form or the processing conditions of the various processing unit around the C2, processing portion (processing head etc.) generation such as size is set.
In this example, because continuous plate shape substrates FB is from first cylinder element C1 conveyance to the second cylinder element C2, so each cylinder element C1, the situation that the diameter of C2 is different must correspondingly with the measures of dispersion of this diameter make rotary speed (rpm) also produce difference.
Again; The first cylinder element C1 and the second cylinder element C2 respectively or any cylinder element the situation that rotation drives the motor of usefulness is set; From the part that contacts with the first cylinder element C1 of plate shape substrates FB to part that the second cylinder element C2 contacts between, can give set tension force.
In addition, in the formation shown in Figure 9, the first cylinder element C1 is configured in-the Z side, and the second cylinder element C2 is configured in+the Z side, but is not limited to this, and the first cylinder element C1 is configured in+the Z side, and the second cylinder element C2 is configured in-and the Z side also can.
(the 6th example)
Then, the present invention's the 6th example is described.In this example, the formation of bucket mechanism is different with above-mentioned example, and therefore the center of constituting with bucket mechanism describes.Figure 10 is the stereogram of formation that shows the bucket DRM3 of mechanism of this example.
Shown in figure 10, the formation of the bucket DRM3 of mechanism of this example is that relative first cylindrical portion (datum level is used in processing) CY1 disposes separative a plurality of second cylindrical portion (datum level is used in processing).Particularly, the formation of the bucket DRM3 of mechanism is that the relative first cylindrical portion CY1 disposes two second cylindrical portion CY21, CY22.In this example, the first cylindrical portion CY1 and the second cylindrical portion CY21, CY22 be form different cylinder elements (for example, the first cylinder element C1 and the second cylinder element C21, C22).
The formation of the bucket DRM3 of mechanism disposes two second cylinder element C21 and C22 in first cylinder element C1+Z side.Two second cylinder element C21 and C22 form for example identical footpath D4 and D5.The footpath D3 of the first cylinder element C1 forms greater than this isometrical D4 and D5.
Shown in figure 10, the first cylinder element C1 is the state configuration of separating with in the Z direction with the second cylinder element C21 and C22.The first cylinder element C1+the end face C1a of Z side and the second cylinder element C21 and C22-the end face C21a and the C22a of Z side face with each other.The first cylinder element C1 and the second cylinder element C21, C22 have other rotating shaft SF1 and SF21, SF22 respectively.Rotating shaft SF1, rotating shaft SF21 and rotating shaft SF22 be configured to parallel.Rotary drive mechanism ACT3 can control the independent respectively rotation of the first cylinder element C1, the second cylinder element C21 and C22.
According to formation shown in Figure 10; Reeling to open through the plate shape substrates FB of for example guide roller R31 is located at the first cylindrical portion CY1, the second cylindrical portion CY2 that is directed to the epimere of Z direction through guide roller R32 and R33 (guide roller of appending is set in case of necessity) as converter section.Reel opening the plate shape substrates FB that is located at behind the second cylindrical portion CY2 and reel to open through guide roller R34 to be located at the second cylindrical portion CY22, afterwards, is to guide through guide roller R35.In the formation shown in Figure 10, the first cylinder element C1 is configured in-the Z side, and the second cylinder element C21 and C22 are configured in+the Z side, but are not limited to this, and the first cylinder element C1 is configured in+the Z side, and the second cylinder element C21 and C22 be configured in-and the Z side also can.
(the 7th example)
Then, the present invention's the 7th example is described.In this example, the formation of bucket mechanism is different with above-mentioned example, and therefore the center of constituting with bucket mechanism describes.Figure 11 is the stereogram of formation that shows the bucket DRM4 of mechanism of this example.
Shown in figure 11, the bucket DRM4 of mechanism of this example is provided with the first cylinder element C1, the second cylinder element C2 and the 3rd cylinder element C3.These first cylinder elements C1, the second cylinder element C2 and the 3rd cylinder element C3 are in three sections configurations of Z direction.In this example; Plate shape substrates FB is a hanger at the outer peripheral face of the first cylinder element C1 i.e. the outer peripheral face i.e. second cylindrical portion CY2, and i.e. the 3rd cylindrical portion CY3 of the outer peripheral face of the 3rd cylinder element C3 of the first cylindrical portion CY1, the second cylinder element C2, is applied in a succession of processed.
The first cylinder element C1, the second cylinder element C2, the 3rd cylinder element C3 are the state configuration of separating with in the Z direction.The adjacent end face of the first cylinder element C1, the second cylinder element C2, the 3rd cylinder element C3 faces with each other.Rotating shaft SF is set as between the first cylinder element C1, the second cylinder element C2, the 3rd cylinder element C3 coaxial (position in the XY face is identical).
The first cylinder element C1, the second cylinder element C2, the 3rd cylinder element C3 for example form directly to equate.The bucket DRM4 of mechanism has rotary drive mechanism ACT4.Rotary drive mechanism ACT4 is for making for example three cylinder element C1, C2, the formation of C3 one rotation or drive make its etc. indivedual rotations formations also can, also can for making the independent respectively formation of rotating of the first cylinder element C1 and the second cylinder element C2.Again, rotary drive mechanism ACT4 is for only making three cylinder element C1 with motor etc., C2, and any among the C3 forces the formation of rotation also can.
According to formation shown in Figure 11, reeling to open through the plate shape substrates FB of for example guide roller R41 is located at the first cylindrical portion CY1, and R42～R45 is directed to the second cylindrical portion CY2 through guide roller (converter section).Reel to open the plate shape substrates FB that is located at behind the second cylindrical portion CY2 and be directed to the 3rd cylindrical portion CY3 through guide roller (converter section) R46～R49.Reel opening the plate shape substrates FB that is located at behind the 3rd cylindrical portion CY3 guides through guide roller R50.As above-mentioned; In this example; Make the plate shape substrates FB between the first cylindrical portion CY1 and the second cylindrical portion CY2 unroll also be formed between the second cylindrical portion CY2 and the 3rd cylindrical portion CY3 and likewise constitute repeatedly, therefore can use the further densification of treatment step (minimizing that floor space is set of processing unit) of barrel DRM4 of mechanism.
Technical scope of the present invention is not limited to above-mentioned example, in the scope that does not break away from interesting purport of the present invention, can apply suitable change.
For example, in the above-mentioned example, suppose that at three cylindrical portion CY1, CY2, CY3 carry out position separately processing, the processing to plate shape substrates, but for example also can not between first cylindrical portion CY1 to the second cylindrical portion CY2 plate shape substrates FB not handled.Also can in the processing of locating to carry out that has as the guide roller of the function of changes direction end to plate shape substrates again.
Shown in figure 12; The plate shape substrates FB that is directed to barrel DRM5 of mechanism by guide roller R51 reel to open and to be located at the first cylindrical portion CY1; After guide roller R52 guiding; To the path of the second cylindrical portion CY2, reel to open and to be located at the guide roller R53 that rotating shaft for example is configured to level (with the XY plane parallel).The heater (bucket that heat drying is used) of this plate shape substrates of heating FB can be set at for example guide roller R53 here.That is, can guide roller R53 be constituted thermotank.This situation, a part that is located at guide roller R53 of reeling among the plate shape substrates FB is heated.Shown in figure 12, guide roller R53 in order to send into guide roller R54 with upright state from the plate shape substrates FB that guide roller R52 sends here with upright state, is to become the configuration of giving distortion.
For example; The situation of processing unit 40 in the conduct bucket DRM5 of mechanism such as use apparatus for coating; Be preferably; Plate shape substrates FB to after the coated carries out dried etc., but in this kind situation, can guide roller (rotary barrel that heat treated is used) R53 around around open establish application step after a moment plate shape substrates and be used in drying steps.Plate shape substrates FB after the dried is to be directed to the second cylindrical portion CY2 through for example guide roller R54, is wound on after the second cylindrical portion CY2, guides by guide roller R55.
Again, in above-mentioned each explanation, with will be for example plate shape substrates FB describe with the example that constitutes of upright state conveyance, but be not limited to this.For example; In at least one of DRM of bucket mechanism and processing drum 32; With the face that the is processed Fp of plate shape substrates FB with the vertical or state conveyance of tilting with respect to the horizontal plane; On at least one conveyance path of conveyance to the bucket DRM of mechanism and processing drum 32, the face that the is processed Fp of plate shape substrates FB is configured to respect to the horizontal plane parallelly in fact also can.Again, in the conveyance path of plate shape substrates FB, combination also can the state of plate shape substrates FB setting and horizontal state.
In addition; With plate shape substrates FB with non-flat-hand position, for example with the face that the is processed Fp of plate shape substrates FB with respect to the horizontal plane (XY plane) tilt the state conveyance of set angle or situation of processing; Make cylinder element CYL, processing drum 32, the guide roller R1 of barrel DRM of mechanism, R2, R6; R7, the rotary middle spindle of R8 etc. tilts to get final product with respect to the Z direction.
Technical scope of the present invention is not limited to above-mentioned example, in the scope that does not break away from interesting purport of the present invention, can apply suitable change.
For example, except the formation of above-mentioned example, Fig. 1, Fig. 2, Fig. 5, carrying device 30 shown in Figure 6, except guide roller R101～R106, processing drum 31 and 32, the stance adjustment cylinder with posture of adjustment plate shape substrates FB also can.
This stance adjustment cylinder, the upstream side of configurable conveyance path processing device 40 at for example plate shape substrates FB.Also can at the place ahead configuration stance adjustment cylinder that for example is close to processing unit 40 again.The stance adjustment cylinder is to be configured to that for example central shaft is parallel with the Z direction, is set as to move in directions X, Y direction and Z direction.Again, the stance adjustment cylinder is for example to be configured to that central shaft tilts with respect to Z-direction.This situation, by making the for example inclination or the change in location of stance adjustment cylinder, but the posture of trimmer shape substrate FB.
Again, the formation of above-mentioned guide roller or processing drum, processing conveyance cylinder dual-purpose stance adjustment cylinder also can.
Again, in the above-mentioned example, forming cylindric with processing drum 31, processing drum 32 is that example describes, but is not limited to cylindric.For example, make be shaped as ellipse or polygonal column or the part of processing drum 31 form curvature surface and also can on the surface of processing drum 31.This situation is preferably, and fixedly processing drum 31, processing drum 32 make plate shape substrates FB slide on the surface of processing drum 31,32 with contact or noncontact mode.
Again, the cylinder element CYL of the bucket DRM of mechanism also likewise is not limited to cylinder element.For example; Substitute cylinder element CYL; When the face that is processed of managing 40 pairs of plate shape substrates of device is throughout handled, use be formed with can with the curvature surface guiding be processed face guiding face guide member or be formed with the guide member that can flatly guide the guiding face of the face of being processed and also can.In addition, use the situation of guide member, be preferably, plate shape substrates FB is slided with contact or noncontact mode.
At the front end of the plate shape substrates FB of the rolling strip that is arranged at the SU of supply substrate portion, paste to have with both measured lengths and also can with the thickness and the rigidity top guide sheet high of plate shape substrates FB same degree than plate shape substrates again.So, when the scroll bar with new plate shape substrates FB is installed on the SU of supply substrate portion, also can plate shape substrates be filled in the processing unit FPA4 automatically.
Again, in above-mentioned each explanation, with will be for example plate shape substrates FB describe with the example that constitutes of upright state conveyance, but be not limited to this.For example; In at least one of processing drum 31 and processing drum 32; With the face that the is processed Fp of plate shape substrates FB with the vertical or state conveyance of tilting with respect to the horizontal plane; On at least one conveyance path of conveyance to processing drum 31 and processing drum 32, the face that the is processed Fp of plate shape substrates FB is configured to respect to the horizontal plane parallelly in fact also can.Again, in the conveyance path of plate shape substrates FB, combination also can the state of plate shape substrates FB setting and horizontal state.
In addition; With plate shape substrates FB with non-flat-hand position, for example with the face that the is processed Fp of plate shape substrates FB with respect to the horizontal plane (XY plane) tilt the state conveyance of set angle or situation of processing; Make processing drum 31, processing drum 32, guide roller R101, R102, R103; R104, the rotary middle spindle of R8 etc. tilts to get final product with respect to the Z direction.
[primary clustering symbol description]
The FB plate shape substrates
SU supply substrate portion
PR processing substrate portion
The CB chamber
CL substrate recoverer
The CONT control part
Fp is processed face
DRM bucket mechanism
The CYL cylinder element
CY1 first cylindrical portion
CY2 second cylindrical portion
The ACT rotary drive mechanism
C1 first cylinder element
C2 second cylinder element
DRM～DRM5 bucket mechanism
42A1,42A2,42B1,42B2,42C1,42C2 handling part
43 drying devices
FPA, FPA4, FPA2, FPA3 substrate board treatment
R101～R106, R111～R114 guide roller
10 supply ports
11,13,21,111,121 shaft components
12,14,22,112,122 supports
20 recovery port
30,130,230 carrying devices
31,32 processing drum
40,140,241～244 processing unit
131,231～233 handle the conveyance cylinder
Claims (49)
1. substrate board treatment, it will form banded substrate transferring in long side direction, and handle the face that is processed of this substrate, it is characterized in that possessing:
Supply substrate portion, it is this substrate of supply under the state that the short side direction that makes this substrate intersects with respect to horizontal direction;
Processing substrate portion; It has conveyance portion and a plurality of handling part; This conveyance portion will be from this substrate conveyance under this crossing condition of this supply substrate portion supply, and these a plurality of handling parts are along the conveyance path configurations of this substrate of this conveyance portion, and the face that is processed of this substrate of this crossing condition is handled; And
The substrate recoverer will be at this substrate after this processing substrate portion handles in this crossing condition recover.
2. substrate board treatment as claimed in claim 1, wherein, this crossing condition comprises the state that the face that is processed of this substrate with respect to the horizontal plane is configured to approximate vertical.
3. according to claim 1 or claim 2 substrate board treatment, wherein, at least one side has shaft component that this substrate reels, and is supported to revolvable support at the Zhou Fangxiang of this shaft component among this supply substrate portion and this substrate recoverer under this crossing condition.
4. like each described substrate board treatment in the claim 1 to 3, wherein, the supply port of this supply substrate portion and the recovery port of this substrate recoverer be this processing substrate portion and row arrangement relatively.
5. substrate board treatment as claimed in claim 4, wherein, this conveyance portion has a plurality of guide roller that this substrate are directed to this substrate recoverer from this supply substrate portion through this processing substrate portion.
6. like each described substrate board treatment in the claim 1 to 5, it further possesses the chamber of accommodating this processing substrate portion;
This supply substrate portion and this substrate recoverer are disposed at the outside of this chamber.
7. like each described substrate board treatment in the claim 1 to 6, wherein, this conveyance portion has this substrate in following processing drum cylindraceous of establishing of this crossing condition;
Among a plurality of these handling parts at least a portion be configured in this processing drum around.
8. substrate board treatment as claimed in claim 7 wherein, disposes this handling part that this substrate is carried out the processing of identical type around this processing drum.
9. like claim 7 or 8 described substrate board treatments, wherein, this processing drum is provided with a plurality of.
10. like each described substrate board treatment in the claim 1 to 6, wherein, this conveyance portion has:
First processing drum disposes a plurality of first handling parts that carry out first processing among a plurality of handling parts around; And
Second processing drum disposes a plurality of second handling parts that carry out second processing different with this first processing among a plurality of these handling parts around.
11. substrate board treatment as claimed in claim 10; Wherein, this first processing drum and this second processing drum are supplied the supply position of this substrate and the position of the recovery position that this substrate is recycled to this substrate recoverer from this supply substrate portion among being configured in and clipping this processing substrate portion.
12. like claim 10 or 11 described substrate board treatments, wherein, this first processing is the processing that the luminescent layer that constitutes display module is formed on this substrate;
This second processing is with switch module that drives this luminescent layer or the processing that transistor component is formed on this substrate.
13. like each described substrate board treatment in the claim 10 to 12, wherein, a plurality of these handling parts have the 3rd handling part;
The 3rd handling part is configured among this conveyance path between this supply position and this first processing drum, between this first processing drum and this second processing drum, between this second processing drum and this recovery position at least one, and this substrate is carried out and this first is handled and this second handles the 3rd different processing.
14. substrate board treatment as claimed in claim 13, wherein, the 3rd handle the clean processing comprise this substrate, this substrate dried, this first handle or this second pre-process of handling among at least one.
15. like each described substrate board treatment in the claim 1 to 14, wherein, this conveyance portion has the upstream side in this conveyance path that is configured at least one this handling part and adjusts the stance adjustment cylinder of the posture of this substrate.
16. like each described substrate board treatment in the claim 1 to 15, it further possesses the protective substrate supply department that supply is pasted on the protective substrate of this substrate that is recycled to this substrate recoverer.
17. substrate board treatment as claimed in claim 16, wherein, this protective substrate supply department and this substrate recoverer and row arrangement.
18. like claim 16 or 17 described substrate board treatments, wherein, this processing substrate portion has the paste section that this protective substrate is pasted on this substrate;
This conveyance portion has second guide roller that this substrate and this protective substrate is directed to this paste section.
19. a substrate board treatment, it will form banded substrate transferring in long side direction, and handle the face that is processed of this substrate, it is characterized in that possessing:
Supporting device, it possesses first support and second support;
First transport mechanism, its with this substrate transferring to this first support;
Converter section, it to this first support, changes the conveyance direction with the conveyance direction of this substrate towards this second support in the face that the is processed conveyance of this substrate;
First handling part, it is handled being undertaken first by the face that is processed of this first support part supports among this substrate; And
Second handling part, it is handled being undertaken second by the face that is processed of this second support part supports among this substrate.
20. substrate board treatment as claimed in claim 19; Wherein, This first support carries out first when handling at this first handling part to the face that is processed of this substrate, the face that is processed of this substrate of state lower support that intersects with respect to horizontal direction at the short side direction of the face that is processed of this substrate;
This second support carries out second when handling at this second handling part to the face that is processed of this substrate, the face that is processed of this substrate of state lower support that intersects in short side direction and this horizontal direction of the face that is processed of this substrate.
21. like claim 19 or 20 described substrate board treatments, wherein, this first transport mechanism under the state that the short side direction of the face that is processed of this substrate and horizontal direction are intersected with this substrate transferring to this first support.
22. like each described substrate board treatment in the claim 19 to 21, wherein, this second support is different with respect to the position of the direction that this first support and this horizontal direction are intersected.
23. like each described substrate board treatment in the claim 19 to 22, wherein, this first support has the part of barrel surface;
This second support has the part of barrel surface.
24. substrate board treatment as claimed in claim 23, wherein, this first support has first cylindrical portion that is formed with this barrel surface, and this second support has second cylindrical portion that is formed with this barrel surface.
25. substrate board treatment as claimed in claim 24, wherein, this first cylindrical portion and this second cylindrical portion form has identical footpath.
26. substrate board treatment as claimed in claim 25, wherein, this first cylindrical portion and this second cylindrical portion form single cylinder element.
27. substrate board treatment as claimed in claim 26, wherein, this supporting device possesses this cylinder element is supported to revolvable rotating mechanism.
28. like claim 24 or 25 described substrate board treatments, wherein, this supporting device possesses first cylinder element that is formed with this first cylindrical portion and second cylinder element that is formed with this second cylindrical portion.
29. substrate board treatment as claimed in claim 28, wherein, this supporting device possesses at least one side among this first cylindrical portion and this second cylindrical portion is supported to revolvable rotating mechanism.
30. substrate board treatment as claimed in claim 28, wherein, this supporting device possesses this first cylindrical portion and this second cylindrical portion is supported to the rotating mechanism that can distinguish independent rotation.
31. like each described substrate board treatment in the claim 28 to 30, wherein, the central shaft of the central shaft of this first cylindrical portion and this second cylindrical portion is parallel.
32. like each described substrate board treatment in the claim 28 to 30, wherein, the end face of the end face of this first cylindrical portion and this second cylindrical portion faces with each other.
33. like each described substrate board treatment in the claim 19 to 32; Wherein, This converter section has guide member, and this guide member conveyance direction of this substrate of this second support is in the past guided this substrate with respect to the mode that the conveyance direction toward this substrate of this first support becomes equidirectional.
34. like each described substrate board treatment in the claim 19 to 33, it further has the 3rd handling part that the face that is processed of the part of the outer peripheral face that is wound in this guide member among this substrate is carried out the 3rd processing.
35. like each described substrate board treatment in the claim 19 to 34, wherein, this first processing and this second processing are the processing that is relative to each other.
36. substrate board treatment as claimed in claim 35, wherein, this first processing is the pre-process of this second processing.
37. substrate board treatment as claimed in claim 35, wherein, this second processing is the subsequent treatment of this first processing.
38. like each described substrate board treatment in the claim 19 to 34, wherein, this first processing and this second processing are the processing of identical type.
39. substrate board treatment as claimed in claim 38, wherein, this first processing and this second processing are the coated that forms coated film at this substrate.
40. substrate board treatment as claimed in claim 39, it further has the drying section that makes this coated film dry, and this drying section is being configured on the guide path of this substrate of this guide member between this first support and this second support.
41. like each described substrate board treatment in the claim 24 to 32, wherein, this first handling part is provided with a plurality of at the Zhou Fangxiang of this first cylindrical portion.
42. like each described substrate board treatment in the claim 24 to 32,41, wherein, this second handling part is provided with a plurality of at the Zhou Fangxiang of this second cylindrical portion.
43. like each described substrate board treatment in the claim 19 to 42, it has the supply substrate portion that the state that intersects with respect to horizontal direction at the short side direction of this substrate is supplied this substrate down;
This first transport mechanism with this substrate under this crossing condition conveyance to this first support;
This first support and second support are disposed by the mode of conveyance with this substrate of this crossing condition.
44. substrate board treatment as claimed in claim 43, wherein, this crossing condition comprises the state that the short side direction of this substrate with respect to the horizontal plane is configured to approximate vertical.
45. like each described substrate board treatment in the claim 19 to 44, it possesses:
Supply department, it supplies this substrate; And
Recoverer, it retrieves this substrate from this second handling part;
The supply port of this supply department and the recovery port and the row arrangement of this recoverer.
46. substrate board treatment as claimed in claim 45, it further possesses the chamber of accommodating this first handling part and this second handling part;
This supply department and this recoverer are configured in outside this chamber.
47. like each described substrate board treatment in the claim 19 to 46, wherein, this first transport mechanism further has the stance adjustment cylinder of the posture of this substrate of adjustment.
48. like each described substrate board treatment in the claim 19 to 47, it further possesses the protection material supply department to this supply substrate protection material.
49. substrate board treatment as claimed in claim 48, it further has the paste section that this protection material is pasted on this substrate;
This first transport mechanism has the cylinder that is directed to this paste section from this protection material of this protection material supply department.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610122229.1A CN105632978B (en) | 2010-04-09 | 2011-04-11 | Substrate board treatment and substrate processing method using same |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US32234710P | 2010-04-09 | 2010-04-09 | |
| US32241710P | 2010-04-09 | 2010-04-09 | |
| US61/322,417 | 2010-04-09 | ||
| US61/322,347 | 2010-04-09 | ||
| PCT/JP2011/058988 WO2011126132A1 (en) | 2010-04-09 | 2011-04-11 | Substrate processing device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610122229.1A Division CN105632978B (en) | 2010-04-09 | 2011-04-11 | Substrate board treatment and substrate processing method using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102835189A true CN102835189A (en) | 2012-12-19 |
| CN102835189B CN102835189B (en) | 2016-06-29 |
Family
ID=44763067
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610122229.1A Active CN105632978B (en) | 2010-04-09 | 2011-04-11 | Substrate board treatment and substrate processing method using same |
| CN201180018300.7A Active CN102835189B (en) | 2010-04-09 | 2011-04-11 | Substrate board treatment |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610122229.1A Active CN105632978B (en) | 2010-04-09 | 2011-04-11 | Substrate board treatment and substrate processing method using same |
Country Status (6)
| Country | Link |
|---|---|
| JP (2) | JP5708642B2 (en) |
| KR (4) | KR101756628B1 (en) |
| CN (2) | CN105632978B (en) |
| HK (2) | HK1219171A1 (en) |
| TW (3) | TWI587433B (en) |
| WO (1) | WO2011126132A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104203785B (en) * | 2012-04-13 | 2016-08-24 | 株式会社尼康 | Box device, base board delivery device, substrate board treatment and substrate processing method using same |
| KR20190141027A (en) * | 2012-05-24 | 2019-12-20 | 가부시키가이샤 니콘 | Device manufacturing method |
| JP6744720B2 (en) | 2016-01-05 | 2020-08-19 | 住友化学株式会社 | Organic device manufacturing method and roll |
| KR102420594B1 (en) | 2018-05-24 | 2022-07-13 | 주식회사 엘지에너지솔루션 | Seperator for lithium sulfur battery and lithium sulfur battery comprising the same |
| JP2024046370A (en) * | 2022-09-22 | 2024-04-03 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004307890A (en) * | 2003-04-03 | 2004-11-04 | Toppan Printing Co Ltd | Vacuum film deposition system |
| CN1751385A (en) * | 2003-02-18 | 2006-03-22 | 柯尼卡美能达控股株式会社 | Organic thin film transistor element and manufacturing method thereof |
| US20080213621A1 (en) * | 2005-03-18 | 2008-09-04 | Nobuhiko Takashima | Method of Forming Organic Compound Layer, Method of Manufacturing Organic El Element and Organic El Element |
| WO2009122836A1 (en) * | 2008-03-31 | 2009-10-08 | 富士電機システムズ株式会社 | Production equipment and method of thin-film laminate |
| KR100926437B1 (en) * | 2008-11-17 | 2009-11-13 | 에스엔유 프리시젼 주식회사 | Evaporation material supply apparatus and substrate processing apparatus having the same |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07294122A (en) * | 1994-04-21 | 1995-11-10 | Murata Mfg Co Ltd | Ceramic green sheet drying apparatus and ceramic green sheet drying method |
| JP2001129460A (en) * | 1999-11-09 | 2001-05-15 | Fuji Photo Film Co Ltd | Liquid coating device |
| JP3995478B2 (en) * | 2000-01-17 | 2007-10-24 | 株式会社荏原製作所 | Substrate transfer control device and substrate transfer method |
| US7367601B2 (en) * | 2000-06-29 | 2008-05-06 | Shibaura Mechatronics Corporation | Substrate transfer apparatus and substrate transfer method |
| JP2002367774A (en) | 2001-06-04 | 2002-12-20 | Sony Corp | Thin-film pattern forming method and thin-film pattern forming device |
| JP5022552B2 (en) * | 2002-09-26 | 2012-09-12 | セイコーエプソン株式会社 | Electro-optical device manufacturing method and electro-optical device |
| JP5157440B2 (en) * | 2005-03-18 | 2013-03-06 | コニカミノルタホールディングス株式会社 | Manufacturing method of organic EL element |
| JP4845746B2 (en) * | 2006-06-20 | 2011-12-28 | 株式会社オーク製作所 | Transport device |
| JP5109301B2 (en) * | 2006-07-27 | 2012-12-26 | 富士電機株式会社 | Film forming apparatus and film forming method |
-
2011
- 2011-04-11 CN CN201610122229.1A patent/CN105632978B/en active Active
- 2011-04-11 CN CN201180018300.7A patent/CN102835189B/en active Active
- 2011-04-11 KR KR1020177011480A patent/KR101756628B1/en active Active
- 2011-04-11 KR KR1020177018381A patent/KR101868304B1/en active Active
- 2011-04-11 JP JP2012509717A patent/JP5708642B2/en active Active
- 2011-04-11 TW TW105103023A patent/TWI587433B/en active
- 2011-04-11 TW TW100112403A patent/TWI557834B/en active
- 2011-04-11 TW TW106114286A patent/TWI611500B/en active
- 2011-04-11 KR KR1020127025863A patent/KR101756496B1/en active Active
- 2011-04-11 WO PCT/JP2011/058988 patent/WO2011126132A1/en active Application Filing
- 2011-04-11 KR KR1020187014419A patent/KR101887856B1/en active Active
-
2013
- 2013-02-20 HK HK16107072.8A patent/HK1219171A1/en not_active IP Right Cessation
- 2013-02-20 HK HK13102160.5A patent/HK1175059A1/en not_active IP Right Cessation
-
2014
- 2014-03-06 JP JP2014043798A patent/JP5858068B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1751385A (en) * | 2003-02-18 | 2006-03-22 | 柯尼卡美能达控股株式会社 | Organic thin film transistor element and manufacturing method thereof |
| JP2004307890A (en) * | 2003-04-03 | 2004-11-04 | Toppan Printing Co Ltd | Vacuum film deposition system |
| US20080213621A1 (en) * | 2005-03-18 | 2008-09-04 | Nobuhiko Takashima | Method of Forming Organic Compound Layer, Method of Manufacturing Organic El Element and Organic El Element |
| WO2009122836A1 (en) * | 2008-03-31 | 2009-10-08 | 富士電機システムズ株式会社 | Production equipment and method of thin-film laminate |
| KR100926437B1 (en) * | 2008-11-17 | 2009-11-13 | 에스엔유 프리시젼 주식회사 | Evaporation material supply apparatus and substrate processing apparatus having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI587433B (en) | 2017-06-11 |
| KR101756628B1 (en) | 2017-07-26 |
| TW201731010A (en) | 2017-09-01 |
| KR20170082652A (en) | 2017-07-14 |
| KR20180058853A (en) | 2018-06-01 |
| JP5858068B2 (en) | 2016-02-10 |
| KR20130041777A (en) | 2013-04-25 |
| KR101887856B1 (en) | 2018-08-10 |
| TW201218305A (en) | 2012-05-01 |
| CN105632978A (en) | 2016-06-01 |
| KR101868304B1 (en) | 2018-06-15 |
| CN105632978B (en) | 2018-10-30 |
| HK1219171A1 (en) | 2017-03-24 |
| JP5708642B2 (en) | 2015-04-30 |
| HK1175059A1 (en) | 2013-06-21 |
| JP2014195070A (en) | 2014-10-09 |
| TWI557834B (en) | 2016-11-11 |
| KR20170049634A (en) | 2017-05-10 |
| TWI611500B (en) | 2018-01-11 |
| KR101756496B1 (en) | 2017-07-10 |
| CN102835189B (en) | 2016-06-29 |
| JPWO2011126132A1 (en) | 2013-07-11 |
| TW201620067A (en) | 2016-06-01 |
| WO2011126132A1 (en) | 2011-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102835189A (en) | Substrate processing device | |
| CN102803109B (en) | Processing device and transfer device for a strip-shaped sheet substrate | |
| CN103384637A (en) | Substrate processing apparatus | |
| CN102844702A (en) | Polarizing film application device and system of manufacturing liquid crystal display device provided with same | |
| JP6249127B2 (en) | Substrate transport method | |
| CN102834340B (en) | Basal plate box, substrate storage device and base plate processing system | |
| CN103262209A (en) | Substrate processing system and method for producing display elements | |
| KR101608565B1 (en) | Device for transporting flexible substrate, and system for manufacturing display device or electrical circuit | |
| CN208035651U (en) | A kind of printing paper drying device | |
| JP4731363B2 (en) | Heater unit | |
| JPH08139160A (en) | Wafer transfer device in semiconductor manufacturing equipment | |
| US20240308898A1 (en) | Glass winding system and system and method for forming glass rolls | |
| TW202110754A (en) | Glass roll manufacturing method and manufacturing device | |
| WO2022197264A2 (en) | A presentation system with a portable roll-up led display | |
| ES2315172B1 (en) | PROCEDURE AND MACHINE FOR THE CONDITIONING OF PRINTED PAPER THROUGH DIGITAL PRINTING SYSTEMS. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1175059 Country of ref document: HK |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1175059 Country of ref document: HK |