[go: up one dir, main page]

CN102701146B - Device for testing thickness of phosphorosilicate glass and polycrystalline silicon synchronously on line - Google Patents

Device for testing thickness of phosphorosilicate glass and polycrystalline silicon synchronously on line Download PDF

Info

Publication number
CN102701146B
CN102701146B CN201210177975.2A CN201210177975A CN102701146B CN 102701146 B CN102701146 B CN 102701146B CN 201210177975 A CN201210177975 A CN 201210177975A CN 102701146 B CN102701146 B CN 102701146B
Authority
CN
China
Prior art keywords
test
polysilicon resistance
polysilicon
test electrode
phosphorosilicate glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210177975.2A
Other languages
Chinese (zh)
Other versions
CN102701146A (en
Inventor
刘海韵
黄庆安
周再发
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Southeast University
Original Assignee
Southeast University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Southeast University filed Critical Southeast University
Priority to CN201210177975.2A priority Critical patent/CN102701146B/en
Publication of CN102701146A publication Critical patent/CN102701146A/en
Application granted granted Critical
Publication of CN102701146B publication Critical patent/CN102701146B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Measurement Of Resistance Or Impedance (AREA)

Abstract

The invention relates to a device for testing the thickness of phosphorosilicate glass and polycrystalline silicon synchronously on line. The device comprises an insulating substrate and three test units, wherein each test unit comprises a phosphorosilicate glass layer and four-probe polycrystalline silicon resistor test bridges; the phosphorosilicate glass layer is fixed to the top surface of the insulating substrate and is etched to form grooves which are parallel to each other, and steps are formed between the grooves; polycrystalline silicon resistor stripes ascend the steps on the phosphorosilicate glass layer; in a first test unit, the polycrystalline silicon resistor stripe is parallel to the X-axis direction of a cartesian coordinate system; and a second test unit and a third test unit are provided with two four-probe polycrystalline silicon resistor test bridges respectively, and included angles beta 1 and beta 2 are formed between the polycrystalline silicon resistor stripes and an X axis of the cartesian coordinate system respectively. According to the device, the polycrystalline silicon ascends a plurality of steps formed by the phosphorosilicate glass, and the thickness of the phosphorosilicate glass and the polycrystalline silicon is tested by testing five polycrystalline silicon resistors in three groups.

Description

一种磷硅玻璃和多晶硅厚度的在线同步测试装置An online synchronous testing device for the thickness of phosphosilicate glass and polysilicon

技术领域 technical field

本发明提供了一种微机电器件几何学参数的测试装置,具体来说,涉及一种磷硅玻璃和多晶硅厚度的在线同步测试装置。The invention provides a testing device for the geometrical parameters of a micro-electromechanical device, in particular to an online synchronous testing device for the thickness of phosphosilicate glass and polysilicon.

背景技术 Background technique

微机电器件的几何学参数是器件最基础的参数,通过在线测量几何学参数,可以获得器件的形貌尺寸,并实时监测制作工艺的工艺误差。多晶硅是制造微机电器件结构重要的和基本的材料,通常通过化学气相淀积(CVD)方法制造得到,并由光刻工艺形成需要的图形。磷硅玻璃(PSG)是重要的牺牲层材料,在制作可动结构时,PSG层的厚度用于定义可动结构的纵向移动范围。因此,在制造过程中结构材料和牺牲层材料往往是直接相叠,这些材料的厚度参数对于微机电器件结构非常重要。微机电产品的制造厂商希望能够在工艺线内通过通用的测量仪器进行在线测试,及时地反映工艺对几何参数的影响,因此,不离开加工环境并采用通用设备进行的在线测试成为工艺监控的必要手段。The geometric parameters of MEMS devices are the most basic parameters of the device. By measuring the geometric parameters online, the shape and size of the device can be obtained, and the process error of the manufacturing process can be monitored in real time. Polysilicon is an important and basic material for manufacturing microelectromechanical device structures. It is usually produced by chemical vapor deposition (CVD), and the required pattern is formed by photolithography. Phosphosilicate glass (PSG) is an important sacrificial layer material. When making a movable structure, the thickness of the PSG layer is used to define the longitudinal movement range of the movable structure. Therefore, structural materials and sacrificial layer materials are often directly stacked in the manufacturing process, and the thickness parameters of these materials are very important for the structure of MEMS devices. Manufacturers of micro-electromechanical products hope to be able to conduct online testing through general-purpose measuring instruments in the process line to reflect the influence of the process on geometric parameters in a timely manner. Therefore, online testing without leaving the processing environment and using general-purpose equipment has become a necessity for process monitoring means.

发明内容 Contents of the invention

技术问题:本发明提供了一种磷硅玻璃和多晶硅厚度的在线同步测试装置,该在线同步测试装置利用多晶硅爬越由磷硅玻璃制造的多个台阶,通过对三组五个多晶硅电阻的测试,进而实现磷硅玻璃和多晶硅厚度的测试。Technical problem: The present invention provides an online synchronous testing device for the thickness of phosphosilicate glass and polysilicon. The online synchronous testing device uses polysilicon to climb multiple steps made of phosphosilicate glass, and passes three groups of five polysilicon resistance tests. , and then realize the test of the thickness of phosphosilicate glass and polysilicon.

技术方案:为解决上述技术问题,本发明采用的技术方案是:Technical scheme: in order to solve the above technical problems, the technical scheme adopted in the present invention is:

一种磷硅玻璃和多晶硅厚度的在线同步测试装置,该测试装置包括绝缘衬底、以及固定于绝缘衬底顶面的第一测试单元、第二测试单元和第三测试单元三个测试单元,其中,An online synchronous testing device for the thickness of phosphosilicate glass and polysilicon, the testing device includes an insulating substrate, and three testing units, a first testing unit, a second testing unit and a third testing unit fixed on the top surface of the insulating substrate, in,

每个测试单元包括磷硅玻璃层和四探针多晶硅电阻测试桥,四探针多晶硅电阻测试桥包括一根多晶硅电阻条和连接在多晶硅电阻条上的四个测试电极;每个测试电极中固定一金属块;磷硅玻璃层固定于绝缘衬底顶面;磷硅玻璃层被刻蚀成相互平行的凹槽,在凹槽间形成台阶;多晶硅电阻条覆盖在磷硅玻璃层上,且多晶硅电阻条爬越磷硅玻璃层上的台阶;Each test unit includes a phosphosilicate glass layer and a four-probe polysilicon resistance test bridge. The four-probe polysilicon resistance test bridge includes a polysilicon resistance bar and four test electrodes connected to the polysilicon resistance bar; A metal block; the phosphosilicate glass layer is fixed on the top surface of the insulating substrate; the phosphosilicate glass layer is etched into grooves parallel to each other, and steps are formed between the grooves; the polysilicon resistance strip is covered on the phosphosilicate glass layer, and the polysilicon The resistance strip climbs the steps on the phosphosilicate glass layer;

所述的第一测试单元中,四探针多晶硅电阻测试桥的数量为一个,多晶硅电阻条与笛卡尔坐标系的X轴方向平行,且四探针多晶硅电阻测试桥中的测试电极位于磷硅玻璃层上的台阶的两侧;In the first test unit, the number of the four-probe polysilicon resistance test bridge is one, the polysilicon resistance strip is parallel to the X-axis direction of the Cartesian coordinate system, and the test electrodes in the four-probe polysilicon resistance test bridge are located in the phosphorus silicon the sides of the steps on the glass floor;

所述的第二测试单元中,四探针多晶硅电阻测试桥的数量为两个,两个四探针多晶硅电阻测试桥共用两个测试电极,其中,一个四探针多晶硅电阻测试桥中的多晶硅电阻条爬越磷硅玻璃层上的台阶,另一个四探针多晶硅电阻测试桥中的多晶硅电阻条为平面;多晶硅电阻条呈倾斜布置,且与笛卡尔坐标系的X轴之间形成β1夹角,β1大于0度小于90度;In the second test unit, the number of four-probe polysilicon resistance test bridges is two, and two four-probe polysilicon resistance test bridges share two test electrodes, wherein the polysilicon in one four-probe polysilicon resistance test bridge The resistance strip climbs over the steps on the phosphosilicate glass layer, and the polysilicon resistance strip in the other four-probe polysilicon resistance test bridge is a plane; the polysilicon resistance strip is arranged obliquely, and forms a β 1 with the X-axis of the Cartesian coordinate system Angle, β 1 is greater than 0 degrees and less than 90 degrees;

所述的第三测试单元中,四探针多晶硅电阻测试桥的数量为两个,两个四探针多晶硅电阻测试桥共用两个测试电极,其中,一个四探针多晶硅电阻测试桥中的多晶硅电阻条爬越磷硅玻璃层上的台阶,另一个四探针多晶硅电阻测试桥中的多晶硅电阻条为平面;多晶硅电阻条呈倾斜布置,且与笛卡尔坐标系的X轴之间形成β2夹角,β2大于0度小于90度,且β2与β1不相等。In the third test unit, the number of four-probe polysilicon resistance test bridges is two, and two four-probe polysilicon resistance test bridges share two test electrodes, wherein the polysilicon in one four-probe polysilicon resistance test bridge The resistance strip climbs over the steps on the phosphosilicate glass layer, and the polysilicon resistance strip in the other four-probe polysilicon resistance test bridge is a plane; the polysilicon resistance strip is arranged obliquely, and forms a β 2 with the X-axis of the Cartesian coordinate system The included angle, β 2 is greater than 0 degrees and less than 90 degrees, and β 2 and β 1 are not equal.

有益效果:与现有技术相比,本发明具有的有益效果是可以实现对磷硅玻璃和多晶硅厚度的在线同步测试。本技术方案中,在绝缘衬底的顶面固定的第一测试单元、第二测试单元和第三测试单元三个测试单元。每个测试单元包括磷硅玻璃层和四探针多晶硅电阻测试桥,磷硅玻璃层被刻蚀成相互平行的凹槽,在凹槽间形成台阶;且多晶硅电阻条爬越磷硅玻璃层上的台阶。第一测试单元中,多晶硅电阻条与笛卡尔坐标系的X轴方向平行。第二测试单元和第三测试单元中,分别有两个四探针多晶硅电阻测试桥重叠设置,其中,一个四探针多晶硅电阻测试桥中的多晶硅电阻条爬越磷硅玻璃层上的台阶,另一个四探针多晶硅电阻测试桥中的多晶硅电阻条为平面。第二测试单元中的多晶硅电阻条与笛卡尔坐标系的X轴之间形成β1夹角。第三测试单元中的多晶硅电阻条与笛卡尔坐标系的X轴之间形成β2夹角,且β2与β1不相等。采用四探针法,通过对三组五个四探针多晶硅电阻测试桥的测试,结合多晶硅电阻条与笛卡尔坐标系中的x轴的夹角,可得到磷硅玻璃和多晶硅厚度。测试设备要求低,普通的电流源和数字电压表就可完成测试,测试过程及测试参数值稳定。加工过程与微机电器件同步,没有特殊加工要求。由电学激励和电学测量来提取参数,完全符合在线测试的要求。Beneficial effect: Compared with the prior art, the present invention has the beneficial effect that the online synchronous testing of the thickness of phosphosilicate glass and polysilicon can be realized. In the technical solution, three test units, the first test unit, the second test unit and the third test unit, are fixed on the top surface of the insulating substrate. Each test unit includes a phosphosilicate glass layer and a four-probe polysilicon resistance test bridge. The phosphosilicate glass layer is etched into grooves parallel to each other, and steps are formed between the grooves; and the polysilicon resistance strip climbs over the phosphosilicate glass layer. steps. In the first test unit, the polysilicon resistance strip is parallel to the X-axis direction of the Cartesian coordinate system. In the second test unit and the third test unit, two four-probe polysilicon resistance test bridges are overlapped respectively, wherein the polysilicon resistance strip in one four-probe polysilicon resistance test bridge climbs over the steps on the phosphosilicate glass layer, The polysilicon resistance strip in another four-probe polysilicon resistance test bridge is a plane. An angle β1 is formed between the polysilicon resistance strip in the second test unit and the X-axis of the Cartesian coordinate system. An angle β2 is formed between the polysilicon resistance strip in the third test unit and the X-axis of the Cartesian coordinate system, and β2 is not equal to β1 . Using the four-probe method, by testing three groups of five four-probe polysilicon resistance test bridges, and combining the angle between the polysilicon resistance strip and the x-axis in the Cartesian coordinate system, the thickness of phosphosilicate glass and polysilicon can be obtained. The test equipment has low requirements, and the test can be completed by ordinary current sources and digital voltmeters, and the test process and test parameter values are stable. The processing is synchronized with the MEMS device, and there is no special processing requirement. The parameters are extracted by electrical excitation and electrical measurement, which fully meets the requirements of online testing.

附图说明 Description of drawings

图1是本发明中第一测试单元的结构示意图。Fig. 1 is a schematic structural diagram of the first test unit in the present invention.

图2是图1中的A-A剖面图。Fig. 2 is an A-A sectional view in Fig. 1 .

图3是本发明中单个台阶放大后的剖面图。Fig. 3 is an enlarged cross-sectional view of a single step in the present invention.

图4是本发明中的一个四探针多晶硅电阻测试桥的结构示意图。Fig. 4 is a schematic structural diagram of a four-probe polysilicon resistance testing bridge in the present invention.

图5是本发明中第二测试单元的结构示意图。Fig. 5 is a schematic structural diagram of the second testing unit in the present invention.

图6是本发明中第三测试单元的结构示意图。Fig. 6 is a schematic structural diagram of the third testing unit in the present invention.

图中有:第一测试单元1、第二测试单元2、第三测试单元3、磷硅玻璃层4、四探针多晶硅电阻测试桥5、绝缘衬底6、第一测试电极101、第二测试电极102、第三测试电极103、第四测试电极104、第五测试电极201、第六测试电极202、第七测试电极203、第八测试电极204、第九测试电极205、第十测试电极206、第十一测试电极301、第十二测试电极302、第十三测试电极303、第十四测试电极304、第十五测试电极305、第十六测试电极306、凹槽401、台阶402、多晶硅电阻条501、测试电极502、金属块503。In the figure there are: first test unit 1, second test unit 2, third test unit 3, phosphosilicate glass layer 4, four-probe polysilicon resistance test bridge 5, insulating substrate 6, first test electrode 101, second Test electrode 102, third test electrode 103, fourth test electrode 104, fifth test electrode 201, sixth test electrode 202, seventh test electrode 203, eighth test electrode 204, ninth test electrode 205, tenth test electrode 206, the eleventh test electrode 301, the twelfth test electrode 302, the thirteenth test electrode 303, the fourteenth test electrode 304, the fifteenth test electrode 305, the sixteenth test electrode 306, the groove 401, the step 402 , a polysilicon resistance strip 501, a test electrode 502, and a metal block 503.

具体实施方式 Detailed ways

下面对本发明的实施例作详细说明,本实施例在以本发明技术方案为前提下进行实施,给出了详细的实施方式和具体的操作过程,但本发明的保护范围不限于下述的实施例。The following is a detailed description of the embodiments of the present invention. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.

如图1至图6所示,本发明的一种磷硅玻璃和多晶硅厚度的在线同步测试装置,该测试装置包括绝缘衬底6、以及固定于绝缘衬底6顶面的第一测试单元1、第二测试单元2和第三测试单元3三个测试单元。每个测试单元包括磷硅玻璃层4和四探针多晶硅电阻测试桥5,四探针多晶硅电阻测试桥5包括一根多晶硅电阻条501和连接在多晶硅电阻条501上的四个测试电极502;每个测试电极502中固定一金属块503;磷硅玻璃层4固定于绝缘衬底顶面;磷硅玻璃层4被刻蚀成相互平行的凹槽401,在凹槽401间形成台阶402;多晶硅电阻条501覆盖在磷硅玻璃层4上,且多晶硅电阻条501爬越磷硅玻璃层4上的台阶402。第一测试单元1中,四探针多晶硅电阻测试桥5的数量为一个,多晶硅电阻条501与笛卡尔坐标系的X轴方向平行,且四探针多晶硅电阻测试桥5中的测试电极502位于磷硅玻璃层4上的台阶402的两侧。第二测试单元2中,四探针多晶硅电阻测试桥5的数量为两个,两个四探针多晶硅电阻测试桥共用两个测试电极,其中,一个四探针多晶硅电阻测试桥中的多晶硅电阻条爬越磷硅玻璃层4上的台阶402,另一个四探针多晶硅电阻测试桥中的多晶硅电阻条为平面;多晶硅电阻条501呈倾斜布置,且与笛卡尔坐标系的X轴之间形成β1夹角,β1大于0度小于90度。第三测试单元3中,四探针多晶硅电阻测试桥5的数量为两个,两个四探针多晶硅电阻测试桥共用两个测试电极,其中,一个四探针多晶硅电阻测试桥中的多晶硅电阻条爬越磷硅玻璃层4上的台阶402,另一个四探针多晶硅电阻测试桥中的多晶硅电阻条为平面;多晶硅电阻条501呈倾斜布置,且与笛卡尔坐标系的X轴之间形成β2夹角,β2大于0度小于90度,且β2与β1不相等。As shown in Fig. 1 to Fig. 6, a kind of online synchronous test device of the thickness of phosphosilicate glass and polysilicon of the present invention, this test device comprises insulating substrate 6, and the first test unit 1 that is fixed on the top surface of insulating substrate 6 , the second test unit 2 and the third test unit 3 three test units. Each test unit includes a phosphosilicate glass layer 4 and a four-probe polysilicon resistance test bridge 5, and the four-probe polysilicon resistance test bridge 5 includes a polysilicon resistance strip 501 and four test electrodes 502 connected to the polysilicon resistance strip 501; A metal block 503 is fixed in each test electrode 502; the phosphosilicate glass layer 4 is fixed on the top surface of the insulating substrate; the phosphosilicate glass layer 4 is etched into grooves 401 parallel to each other, and steps 402 are formed between the grooves 401; The polysilicon resistance strip 501 covers the phosphosilicate glass layer 4 , and the polysilicon resistance strip 501 climbs over the step 402 on the phosphosilicate glass layer 4 . In the first test unit 1, the quantity of the four-probe polysilicon resistance test bridge 5 is one, the polysilicon resistance bar 501 is parallel to the X-axis direction of the Cartesian coordinate system, and the test electrode 502 in the four-probe polysilicon resistance test bridge 5 is located at Two sides of the step 402 on the phosphosilicate glass layer 4 . In the second test unit 2, the quantity of the four-probe polysilicon resistance test bridge 5 is two, and the two four-probe polysilicon resistance test bridges share two test electrodes, wherein the polysilicon resistance in one four-probe polysilicon resistance test bridge The strip climbs over the step 402 on the phosphosilicate glass layer 4, and the polysilicon resistance strip in the other four-probe polysilicon resistance test bridge is a plane; the polysilicon resistance strip 501 is arranged obliquely, and is formed between the X-axis of the Cartesian coordinate system. β 1 included angle, β 1 is greater than 0 degrees and less than 90 degrees. In the third test unit 3, the quantity of the four-probe polysilicon resistance test bridge 5 is two, and the two four-probe polysilicon resistance test bridges share two test electrodes, wherein the polysilicon resistance in one four-probe polysilicon resistance test bridge The strip climbs over the step 402 on the phosphosilicate glass layer 4, and the polysilicon resistance strip in the other four-probe polysilicon resistance test bridge is a plane; the polysilicon resistance strip 501 is arranged obliquely, and is formed between the X-axis of the Cartesian coordinate system. β 2 angle, β 2 is greater than 0 degrees and less than 90 degrees, and β 2 and β 1 are not equal.

在第一测试单元中,四个测试电极分别为第一测试电极101、第二测试电极102、第三测试电极103、第四测试电极104,每个测试电极中设有一个金属块503,第一测试电极101和第二测试电极102位于多晶硅电阻条501的一侧,第三测试电极103和第四测试电极104位于多晶硅电阻条501的另一侧,凹槽401位于第一测试电极101和第二测试电极102之间,第一测试电极101和第二测试电极102沿多晶硅电阻条501的中心线相互对称,且第一测试电极101与多晶硅电阻条501的连接点和第二测试电极102与多晶硅电阻条501的连接点位于第三测试电极103与多晶硅电阻条501的连接点和第四测试电极104与多晶硅电阻条501的连接点之间;第一测试电极101与多晶硅电阻条501的连接点到凹槽401的最小距离,以及第二测试电极102与多晶硅电阻条501的连接点到凹槽401的最小距离分别等于凹槽401间距的一半。In the first test unit, the four test electrodes are respectively the first test electrode 101, the second test electrode 102, the third test electrode 103, and the fourth test electrode 104, and each test electrode is provided with a metal block 503, the second test electrode A test electrode 101 and the second test electrode 102 are located on one side of the polysilicon resistance strip 501, the third test electrode 103 and the fourth test electrode 104 are located on the other side of the polysilicon resistance strip 501, and the groove 401 is located between the first test electrode 101 and the polysilicon resistance strip 501. Between the second test electrodes 102, the first test electrode 101 and the second test electrode 102 are symmetrical to each other along the center line of the polysilicon resistance strip 501, and the connection point between the first test electrode 101 and the polysilicon resistance strip 501 and the second test electrode 102 The connection point with the polysilicon resistance strip 501 is between the connection point between the third test electrode 103 and the polysilicon resistance strip 501 and the connection point between the fourth test electrode 104 and the polysilicon resistance strip 501; the first test electrode 101 and the polysilicon resistance strip 501 The minimum distance from the connection point to the groove 401 and the minimum distance from the connection point of the second test electrode 102 to the polysilicon resistance strip 501 to the groove 401 are respectively equal to half of the pitch of the groove 401 .

在第二测试单元中,六个测试电极分别为第五测试电极201、第六测试电极202、第七测试电极203、第八测试电极204、第九测试电极205和第十测试电极206,每个测试电极中设有一个金属块503,第五测试电极201、第六测试电极202和第七测试电极203位于多晶硅电阻条501的一侧,第八测试电极204、第九测试电极205和第十测试电极206位于多晶硅电阻条501的另一侧。凹槽401位于第五测试电极201和第六测试电极202之间,第六测试电极202和第七测试电极203之间的多晶硅电阻条501为光滑的平面。第五测试电极201与多晶硅电阻条501的连接点和第六测试电极202与多晶硅电阻条501的连接点,位于第八测试电极204与多晶硅电阻条501的连接点和第九测试电极205与多晶硅电阻条501的连接点之间。第九测试电极205与多晶硅电阻条501的连接点和第十测试电极206与多晶硅电阻条501的连接点,位于第六测试电极202与多晶硅电阻条501的连接点和第七测试电极203与多晶硅电阻条501的连接点之间。第五测试电极201与多晶硅电阻条501的连接点到凹槽401的最小距离,以及第六测试电极202与多晶硅电阻条501的连接点到凹槽401的最小距离分别等于凹槽401间距的一半。In the second test unit, the six test electrodes are respectively the fifth test electrode 201, the sixth test electrode 202, the seventh test electrode 203, the eighth test electrode 204, the ninth test electrode 205 and the tenth test electrode 206, each One test electrode is provided with a metal block 503, the fifth test electrode 201, the sixth test electrode 202 and the seventh test electrode 203 are located on one side of the polysilicon resistance bar 501, the eighth test electrode 204, the ninth test electrode 205 and the first test electrode Ten test electrodes 206 are located on the other side of the polysilicon resistor strip 501 . The groove 401 is located between the fifth test electrode 201 and the sixth test electrode 202 , and the polysilicon resistance strip 501 between the sixth test electrode 202 and the seventh test electrode 203 is a smooth plane. The connection point between the fifth test electrode 201 and the polysilicon resistance strip 501 and the connection point between the sixth test electrode 202 and the polysilicon resistance strip 501 are located at the connection point between the eighth test electrode 204 and the polysilicon resistance strip 501 and the connection point between the ninth test electrode 205 and the polysilicon resistance strip 501. Between the connection points of the resistive strip 501. The connection point between the ninth test electrode 205 and the polysilicon resistance strip 501 and the connection point between the tenth test electrode 206 and the polysilicon resistance strip 501 are located at the connection point between the sixth test electrode 202 and the polysilicon resistance strip 501 and the connection point between the seventh test electrode 203 and the polysilicon resistance strip 501. Between the connection points of the resistive strip 501. The minimum distance from the connection point of the fifth test electrode 201 and the polysilicon resistance strip 501 to the groove 401, and the minimum distance from the connection point of the sixth test electrode 202 and the polysilicon resistance strip 501 to the groove 401 are respectively equal to half of the pitch of the groove 401 .

在第三测试单元中,六个测试电极分别为第十一测试电极301、第十二测试电极302、第十三测试电极303、第十四测试电极304、第十五测试电极305和第十六测试电极306,每个测试电极中设有一个金属块503,第十一测试电极301、第十二测试电极302和第十三测试电极303位于多晶硅电阻条501的一侧,第十四测试电极304、第十五测试电极305和第十六测试电极306位于多晶硅电阻条501的另一侧。凹槽401位于第十一测试电极301和第十二测试电极302之间,第十二测试电极302和第十三测试电极303之间的多晶硅电阻条501为光滑的平面。第十一测试电极301与多晶硅电阻条501的连接点和第十二测试电极302与多晶硅电阻条501的连接点,位于第十四测试电极304与多晶硅电阻条501的连接点和第十五测试电极305与多晶硅电阻条501的连接点之间。第十五测试电极305与多晶硅电阻条501的连接点和第十六测试电极306与多晶硅电阻条501的连接点,位于第十二测试电极302与多晶硅电阻条501的连接点和第十三测试电极303与多晶硅电阻条501的连接点之间。第十一测试电极301与多晶硅电阻条501的连接点到凹槽401的最小距离,以及第十二测试电极302与多晶硅电阻条501的连接点到凹槽401的最小距离分别等于凹槽401间距的一半。In the third test unit, the six test electrodes are the eleventh test electrode 301, the twelfth test electrode 302, the thirteenth test electrode 303, the fourteenth test electrode 304, the fifteenth test electrode 305 and the tenth test electrode. Six test electrodes 306, each test electrode is provided with a metal block 503, the eleventh test electrode 301, the twelfth test electrode 302 and the thirteenth test electrode 303 are located on one side of the polysilicon resistance strip 501, the fourteenth test electrode The electrode 304 , the fifteenth test electrode 305 and the sixteenth test electrode 306 are located on the other side of the polysilicon resistance strip 501 . The groove 401 is located between the eleventh test electrode 301 and the twelfth test electrode 302 , and the polysilicon resistance strip 501 between the twelfth test electrode 302 and the thirteenth test electrode 303 is a smooth plane. The connection point of the eleventh test electrode 301 and the polysilicon resistance bar 501 and the connection point of the twelfth test electrode 302 and the polysilicon resistance bar 501 are located at the connection point of the fourteenth test electrode 304 and the polysilicon resistance bar 501 and the fifteenth test Between the connection point of the electrode 305 and the polysilicon resistance strip 501 . The junction of the fifteenth test electrode 305 and the polysilicon resistance strip 501 and the junction of the sixteenth test electrode 306 and the polysilicon resistance strip 501 are located at the junction of the twelfth test electrode 302 and the polysilicon resistance strip 501 and the thirteenth test Between the connection point of the electrode 303 and the polysilicon resistance strip 501 . The minimum distance from the connection point of the eleventh test electrode 301 and the polysilicon resistance strip 501 to the groove 401, and the minimum distance from the connection point of the twelfth test electrode 302 and the polysilicon resistance strip 501 to the groove 401 are respectively equal to the groove 401 pitch half of.

该装置可采用基本的微机电加工工艺完成制作。下面以典型的两层多晶硅微机电表面加工工艺说明该测试结构的制作过程。The device can be manufactured using basic micro-electromechanical processing technology. The fabrication process of the test structure is described below with a typical two-layer polysilicon MEMS surface processing technology.

选择N型半导体硅片,热生长100纳米厚度的二氧化硅层,通过低压化学气相沉积工艺淀积一层500纳米厚度的氮化硅,形成绝缘衬底6。采用低压化学气相沉积工艺沉积一层300纳米的多晶硅并进行N型重掺杂使该层多晶硅成为导体,通过光刻工艺刻蚀形成测试电极的一部分。使用低压化学气相沉积工艺沉积2000纳米厚度的磷硅玻璃层4,通过光刻工艺形成测试电极的一部分以及凹槽401。利用低压化学气相沉积工艺淀积一层1500纳米厚度的多晶硅,对多晶硅进行N型重掺杂,光刻工艺形成多晶硅电阻条501和测试电极,即第一测试电极101至第十六测试电极306。采用剥离工艺在测试电极上形成金属块503。最后通过腐蚀磷硅玻璃层4释放结构。Select an N-type semiconductor silicon wafer, thermally grow a silicon dioxide layer with a thickness of 100 nanometers, and deposit a layer of silicon nitride with a thickness of 500 nanometers through a low-pressure chemical vapor deposition process to form an insulating substrate 6 . A low-pressure chemical vapor deposition process is used to deposit a layer of 300nm polysilicon and N-type heavy doping to make the layer of polysilicon a conductor, and a part of the test electrode is formed by etching through a photolithography process. A phosphosilicate glass layer 4 with a thickness of 2000 nanometers was deposited by using a low pressure chemical vapor deposition process, and a part of the test electrode and the groove 401 were formed by a photolithography process. Deposit a layer of polysilicon with a thickness of 1500 nanometers by using a low-pressure chemical vapor deposition process, carry out N-type heavy doping on the polysilicon, and form polysilicon resistance strips 501 and test electrodes by photolithography, that is, the first test electrode 101 to the sixteenth test electrode 306 . A metal block 503 is formed on the test electrode using a lift-off process. Finally, the structure is released by etching the phosphosilicate glass layer 4 .

利用上述结构的在线同步测试装置,测量采用四探针法,通过对三组五个四探针多晶硅电阻测试桥的测试,结合多晶硅电阻条501与笛卡尔坐标系中的x轴的夹角,可得到磷硅玻璃和多晶硅厚度。磷硅玻璃的厚度是指磷硅玻璃层4的厚度。多晶硅厚度是指多晶硅电阻条501的厚度。具体测试过程是:Using the online synchronous testing device with the above structure, the measurement adopts the four-probe method, through the testing of three groups of five four-probe polysilicon resistance test bridges, combined with the included angle between the polysilicon resistance strip 501 and the x-axis in the Cartesian coordinate system, Phosphosilicate glass and polysilicon thicknesses are available. The thickness of the phosphosilicate glass refers to the thickness of the phosphosilicate glass layer 4 . The polysilicon thickness refers to the thickness of the polysilicon resistance strip 501 . The specific test process is:

第一步:用本领域公知的四探针法,测量第一测试单元中的第一测试电极101和第二测试电极102之间的电阻,记为R1。具体过程是:在第三测试电极103和第四测试电极104之间施加恒定电流,测量第一测试电极101和第二测试电极102之间的电压,电压与电流的比值即为电阻R1Step 1: Measure the resistance between the first test electrode 101 and the second test electrode 102 in the first test unit by using the four-probe method known in the art, denoted as R 1 . The specific process is: apply a constant current between the third test electrode 103 and the fourth test electrode 104, measure the voltage between the first test electrode 101 and the second test electrode 102, and the ratio of the voltage to the current is the resistance R 1 .

第二步:用本领域公知的四探针法,测量第二测试单元中的第五测试电极201和第六测试电极202之间的电阻,记为R2。具体过程是:在第八测试电极204和第九测试电极205之间施加恒定电流,测量第五测试电极201和第六测试电极202之间的电压,电压与电流的比值即为电阻R2Step 2: Measure the resistance between the fifth test electrode 201 and the sixth test electrode 202 in the second test unit by using the four-probe method known in the art, denoted as R 2 . The specific process is: apply a constant current between the eighth test electrode 204 and the ninth test electrode 205, measure the voltage between the fifth test electrode 201 and the sixth test electrode 202, and the ratio of the voltage to the current is the resistance R 2 .

第三步:用本领域公知的四探针法,测量第二测试单元中的第九测试电极205和第十测试电极206之间的电阻,记为RA。具体过程是:在第六测试电极202和第七测试电极203之间施加恒定电流,测量第九测试电极205和第十测试电极206之间的电压,电压与电流的比值即为电阻RAStep 3: Measure the resistance between the ninth test electrode 205 and the tenth test electrode 206 in the second test unit by using the four-probe method known in the art, denoted as RA . The specific process is: apply a constant current between the sixth test electrode 202 and the seventh test electrode 203, measure the voltage between the ninth test electrode 205 and the tenth test electrode 206, and the ratio of the voltage to the current is the resistance RA .

第四步:用本领域公知的四探针法,测量第三测试单元中的第十一测试电极301和第十二测试电极302之间的电阻,记为R3。具体过程是:在第十四测试电极304和第十五测试电极305之间施加恒定电流,测量第十一测试电极301和第十二测试电极302之间的电压,电压与电流的比值即为电阻R3Step 4: Measure the resistance between the eleventh test electrode 301 and the twelfth test electrode 302 in the third test unit by using the four-probe method known in the art, which is denoted as R 3 . The specific process is: apply a constant current between the fourteenth test electrode 304 and the fifteenth test electrode 305, measure the voltage between the eleventh test electrode 301 and the twelfth test electrode 302, and the ratio of the voltage to the current is Resistor R3 .

第五步:用本领域公知的四探针法,测量第三测试单元中的第十五测试电极305和第十六测试电极306之间的电阻,记为RB。具体过程是:在第十二测试电极302和第十三测试电极303之间施加恒定电流,测量第十五测试电极305和第十六测试电极306之间的电压,电压与电流的比值即为电阻RBStep 5: Measure the resistance between the fifteenth test electrode 305 and the sixteenth test electrode 306 in the third test unit by using the four-probe method known in the art, denoted as RB . The specific process is: apply a constant current between the twelfth test electrode 302 and the thirteenth test electrode 303, measure the voltage between the fifteenth test electrode 305 and the sixteenth test electrode 306, and the ratio of the voltage to the current is Resistor R B .

第六步:利用方程组(1)可得磷硅玻璃和多晶硅厚度:Step 6: Using the equation group (1), the thickness of phosphosilicate glass and polysilicon can be obtained:

sinsin αα == tt 22 -- tt 11 SS 33 xx == SS 33 ·&Center Dot; coscos αα ++ tt 11 sinsin αα RR 11 == nno ·&Center Dot; (( RR SS ·&Center Dot; 22 SS 22 WW ++ RR SS ·· SS 11 -- 22 xx WW ++ RR SS ·&Center Dot; 22 sthe s 33 WW ++ 44 λλ ·· RR SS ·&Center Dot; tt 11 WW )) RR 22 == nno ·&Center Dot; (( RR SS LL 11 ·&Center Dot; 22 SS 22 coscos ββ 11 ++ RR AA LL 11 (( SS 11 coscos ββ 11 -- 22 xx )) ++ RR AA LL 11 ·· 22 SS 33 coscos ββ 11 ++ 44 λλ ·&Center Dot; RR SS ·&Center Dot; tt 11 WW )) RR 33 == nno ·· (( RR BB LL 22 ·· 22 SS 22 coscos ββ 22 ++ RR BB LL 22 ·· (( SS 11 coscos ββ 22 -- 22 xx )) ++ RR BB LL 22 ·&Center Dot; 22 SS 33 coscos ββ 22 ++ 44 λλ ·&Center Dot; RR SS ·· tt 11 WW ))

方程组(1)中,t1表示多晶硅电阻条501的厚度。t2表示磷硅玻璃层4的厚度。α表示凹槽401的侧壁倾斜角度。S3表示凹槽401的侧壁长度。x表示凹槽401的顶端距凹槽401底端的水平距离。n为每个测试单元的台阶数,在本测试装置中,三个测试单元的台阶数相同。R1表示第一测试单元中的第一测试电极101和第二测试电极102之间的电阻。RS表示多晶硅电阻条501的方块电阻。S2表示测试电极与凹槽401的距离。W表示多晶硅电阻条501沿笛卡尔坐标系y轴方向的长度。S1表示凹槽401顶部沿笛卡尔坐标系x轴方向的长度。β1表示第二测试单元中多晶硅电阻条与笛卡尔坐标系的X轴之间的夹角。λ为拐角电阻的修正因子,取值是0.5。R2表示第二测试单元中的第五测试电极201和第六测试电极202之间的电阻。RA表示第二测试单元中的第九测试电极205和第十测试电极206之间的电阻。L1表示第九测试电极205和第十测试电极206之间的多晶硅电阻条沿与笛卡尔坐标系x轴成角度为β1方向的长度。β2表示第三测试单元中的多晶硅电阻条与笛卡尔坐标系的X轴之间形成的夹角。R3表示第三测试单元中的第十一测试电极301和第十二测试电极302之间的电阻。RB表示第三测试单元中的第十五测试电极305和第十六测试电极306之间的电阻。L2表示第十五测试电极305和第十六测试电极306之间的多晶硅电阻条沿与笛卡尔坐标系x轴成角度为β2方向的长度。In the equation group (1), t 1 represents the thickness of the polysilicon resistance strip 501 . t 2 represents the thickness of the phosphosilicate glass layer 4 . α represents the inclination angle of the sidewall of the groove 401 . S 3 represents the length of the sidewall of the groove 401 . x represents the horizontal distance from the top of the groove 401 to the bottom of the groove 401 . n is the number of steps of each test unit, and in this test device, the number of steps of the three test units is the same. R 1 represents the resistance between the first test electrode 101 and the second test electrode 102 in the first test unit. R S represents the sheet resistance of the polysilicon resistor strip 501 . S 2 represents the distance between the test electrode and the groove 401 . W represents the length of the polysilicon resistance strip 501 along the y-axis direction of the Cartesian coordinate system. S 1 represents the length of the top of the groove 401 along the x-axis direction of the Cartesian coordinate system. β1 represents the angle between the polysilicon resistance strip in the second test unit and the X-axis of the Cartesian coordinate system. λ is the correction factor of the corner resistance, and its value is 0.5. R 2 represents the resistance between the fifth test electrode 201 and the sixth test electrode 202 in the second test unit. RA represents the resistance between the ninth test electrode 205 and the tenth test electrode 206 in the second test unit. L 1 represents the length of the polysilicon resistance strip between the ninth test electrode 205 and the tenth test electrode 206 along the direction that makes an angle β 1 with the x-axis of the Cartesian coordinate system. β2 represents the angle formed between the polysilicon resistance strip in the third test unit and the X-axis of the Cartesian coordinate system. R 3 represents the resistance between the eleventh test electrode 301 and the twelfth test electrode 302 in the third test unit. RB represents the resistance between the fifteenth test electrode 305 and the sixteenth test electrode 306 in the third test unit. L 2 represents the length of the polysilicon resistance strip between the fifteenth test electrode 305 and the sixteenth test electrode 306 along the direction that makes an angle β 2 with the x-axis of the Cartesian coordinate system.

方程组(1)中有五个未知数:t1、t2、x、S3和α。因此,可以将所有未知参数都求出来。令There are five unknowns in equation (1): t 1 , t 2 , x, S 3 and α. Therefore, all unknown parameters can be found. make

AA == RR AA LL 11 ·&Center Dot; RR BB LL 22 ·&Center Dot; WW ·&Center Dot; (( coscos ββ 11 -- coscos ββ 22 ))

BB == RR BB LL 22 ·&Center Dot; RR SS ·&Center Dot; coscos ββ 11 ·· (( coscos ββ 22 -- 11 ))

CC == RR AA LL 11 ·&Center Dot; RR SS ·&Center Dot; coscos ββ 22 ·&Center Dot; (( 11 -- coscos ββ 11 ))

最终得到:and end up with:

tt 11 == WW 44 nλnλ RR SS ·&Center Dot; RR 11 ·· AA ++ RR 22 ·&Center Dot; BB ++ RR 33 ·&Center Dot; CC AA ++ BB ++ CC

t2=S3·sinα+t1 t 2 =S 3 ·sinα+t 1

本发明基于四探针原理以及多晶硅覆盖沟槽引起电阻变化的原理,采用四探针测试方法,同时得到磷硅玻璃层厚度和多晶硅层厚度。该测试装置采用简单的直流电流源作为激励源,采用普通的电压测试设备,完成所有的激励与测试过程。The invention is based on the principle of four probes and the principle of resistance change caused by polysilicon covering grooves, and adopts a four-probe test method to simultaneously obtain the thickness of the phosphorosilicate glass layer and the thickness of the polysilicon layer. The test device uses a simple DC current source as the excitation source, and uses ordinary voltage test equipment to complete all the excitation and test processes.

Claims (1)

1. the on-line synchronous testing arrangement of a phosphorosilicate glass and polysilicon thickness, it is characterized in that, this testing arrangement comprises dielectric substrate (6) and is fixed on first test cell (1) of dielectric substrate (6) end face, the second test cell (2) and (3) three test cells of the 3rd test cell, wherein
Each test cell comprises phosphorosilicate glass layer (4) and four point probe polysilicon resistance test bridge (5), and four point probe polysilicon resistance test bridge (5) comprises a polysilicon resistance bar (501) and is connected to four test electrodes (502) on polysilicon resistance bar (501); In each test electrode (502), fix a metal derby (503), phosphorosilicate glass layer (4) is fixed on dielectric substrate end face; Phosphorosilicate glass layer (4) is etched to the groove (401) being parallel to each other, and forms step (402) between groove (401); It is upper that polysilicon resistance bar (501) covers phosphorosilicate glass layer (4), and the step (402) ascended on phosphorosilicate glass layer (4) of polysilicon resistance bar (501);
In described the first test cell (1), the quantity of four point probe polysilicon resistance test bridge (5) is one, polysilicon resistance bar (501) is parallel with the X-direction of cartesian coordinate system, and test electrode (502) in four point probe polysilicon resistance test bridge (5) is positioned at the both sides of the step (402) on phosphorosilicate glass layer (4);
In described the second test cell (2), the quantity of four point probe polysilicon resistance test bridge (5) is two, two four point probe polysilicon resistance test bridges share two test electrodes, wherein, the step (402) that polysilicon resistance bar in a four point probe polysilicon resistance test bridge is ascended on phosphorosilicate glass layer (4), the polysilicon resistance bar in another four point probe polysilicon resistance test bridge is plane; Polysilicon resistance bar (501) is and is in tilted layout, and and the X-axis of cartesian coordinate system between form β 1angle, β 1be greater than 0 degree and be less than 90 degree;
In the 3rd described test cell (3), the quantity of four point probe polysilicon resistance test bridge (5) is two, two four point probe polysilicon resistance test bridges share two test electrodes, wherein, the step (402) that polysilicon resistance bar in a four point probe polysilicon resistance test bridge is ascended on phosphorosilicate glass layer (4), the polysilicon resistance bar in another four point probe polysilicon resistance test bridge is plane; Polysilicon resistance bar (501) is and is in tilted layout, and and the X-axis of cartesian coordinate system between form β 2angle, β 2be greater than 0 degree and be less than 90 degree, and β 2with β 1unequal.
CN201210177975.2A 2012-05-31 2012-05-31 Device for testing thickness of phosphorosilicate glass and polycrystalline silicon synchronously on line Expired - Fee Related CN102701146B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210177975.2A CN102701146B (en) 2012-05-31 2012-05-31 Device for testing thickness of phosphorosilicate glass and polycrystalline silicon synchronously on line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210177975.2A CN102701146B (en) 2012-05-31 2012-05-31 Device for testing thickness of phosphorosilicate glass and polycrystalline silicon synchronously on line

Publications (2)

Publication Number Publication Date
CN102701146A CN102701146A (en) 2012-10-03
CN102701146B true CN102701146B (en) 2014-11-12

Family

ID=46894287

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210177975.2A Expired - Fee Related CN102701146B (en) 2012-05-31 2012-05-31 Device for testing thickness of phosphorosilicate glass and polycrystalline silicon synchronously on line

Country Status (1)

Country Link
CN (1) CN102701146B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113267118B (en) * 2021-06-23 2022-05-17 东南大学 A kind of semiconductor conductive film thickness on-line test structure and test method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3228665A (en) * 1963-10-04 1966-01-11 Melvin C Dolan Water purification device
CN101158568A (en) * 2007-11-13 2008-04-09 东南大学 Electrical Measuring Structure of Insulating Layer Thickness in MEMS Device Structure
CN202609923U (en) * 2012-05-31 2012-12-19 东南大学 Online synchronous testing device of thickness of phosphorosilicate glass and polycrystalline silicon

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003075124A (en) * 2001-09-06 2003-03-12 Okamoto Machine Tool Works Ltd Thickness measuring device of wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3228665A (en) * 1963-10-04 1966-01-11 Melvin C Dolan Water purification device
CN101158568A (en) * 2007-11-13 2008-04-09 东南大学 Electrical Measuring Structure of Insulating Layer Thickness in MEMS Device Structure
CN202609923U (en) * 2012-05-31 2012-12-19 东南大学 Online synchronous testing device of thickness of phosphorosilicate glass and polycrystalline silicon

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2003-75124A 2003.03.12 *

Also Published As

Publication number Publication date
CN102701146A (en) 2012-10-03

Similar Documents

Publication Publication Date Title
CN112320754B (en) Online testing structure and method for line width of semiconductor conductive film
CN102608153B (en) On-line Measuring Structure of Seebeck Coefficient of Polysilicon-Metal Thermocouple
CN102099694A (en) A multi-point probe for testing electrical properties and a method of producing a multi-point probe
CN101620192A (en) Test structure for measuring thermal conductivity of film
CN106248280A (en) The On-line Measuring Method of a kind of conductive film material residual stress and measurement apparatus
CN104089642B (en) Piezoresistive acceleration and pressure integrated sensor and manufacturing method thereof
CN109696185A (en) A kind of bionical micro cantilever structure, its manufacturing method and piezoresistance sensor
CN102589965B (en) A Polysilicon Poisson's Ratio Online Test Structure
US9638589B2 (en) Method for determining a three-dimensional stress field of an object, an integrated structure in particular, and corresponding system
CN102701146B (en) Device for testing thickness of phosphorosilicate glass and polycrystalline silicon synchronously on line
CN202609923U (en) Online synchronous testing device of thickness of phosphorosilicate glass and polycrystalline silicon
CN102608149B (en) Polycrystalline silicon CTE (Coefficient of Thermal Expansion) online test structure
CN106996893A (en) The mechanics parameter measuring method and device of a kind of double-layer double-end clamped beam
CN103995022B (en) Test structure and test method of Young's modulus and residual stress of silicon material top layer silicon
CN202403836U (en) Structure for testing seebeck coefficient of polycrystalline silicon-metal thermocouple on line
CN202502063U (en) On-line Testing Structure of Residual Stress of Polysilicon Material
CN113267118B (en) A kind of semiconductor conductive film thickness on-line test structure and test method
CN202404055U (en) Polycrystalline silicon fracture strength on-line testing structure
CN102590282B (en) On-line test structure and test method for breaking strength of polycrystalline silicon
CN105870035B (en) Chamfering detection method
CN100368795C (en) Measuring Structure and Measuring Method for Measuring Thermal Expansion Coefficient of Polysilicon Thin Film
CN103424064B (en) High-resolution micrometer vernier scale for micro electro mechanical system
CN100489444C (en) Insulation layer thickness electric test structure in micro electro-mechanical systems device structure
US9983231B2 (en) Deep-etched multipoint probe
CN109856198A (en) A kind of continuous response hydrogen array gas-sensitive sensor and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141112

Termination date: 20170531

CF01 Termination of patent right due to non-payment of annual fee