CN102682874A - Transparent conductive structure applied to touch panel and manufacturing method thereof - Google Patents

Abstract

A transparent conductive structure applied to a touch panel and a manufacturing method thereof are provided, the transparent conductive structure applied to the touch panel comprises: a substrate unit, a first covering unit, a transparent conductive unit and a second covering unit. The substrate unit is provided with at least one transparent substrate. The first coating unit is provided with at least one first coating layer formed on the upper surface of the at least one transparent substrate. The transparent conductive unit is provided with at least one transparent conductive layer formed on the upper surface of the at least one first coated layer, a plurality of embedded conductive circuits are arranged inside the at least one transparent conductive layer, and the embedded conductive circuits are distributed and arranged to form a specific embedded circuit pattern. The second coating unit is provided with at least one second coating layer which is formed on the upper surface of the at least one transparent conducting layer and covers the embedded conducting wires, and the top end of the at least one second coating layer is provided with a touch surface for providing touch of a foreign object.

Description

Transparent conductive structure applied to touch panel and manufacturing method thereof

technical field

The invention relates to a transparent conductive structure and a manufacturing method thereof, in particular to a transparent conductive structure applied to a touch panel and a manufacturing method thereof.

Background technique

Today's touch technology has been widely used in various electronic devices as an input method because it does not require an additional mouse, buttons or direction keys, so as to achieve the trend of thinner and thinner products. In other words, with the rise of information appliances, touch panels gradually replace the old way of communicating with information products through keyboards and mice. Touch panel technology provides a set of user-friendly interfaces that allow ordinary users to operate When using computers or electronic products, it can become more direct, simple, vivid and interesting. And the touch panel has a wide range of applications, including portable communication and information products (such as personal digital assistant PDA, etc.), financial/commercial systems, medical registration systems, monitoring systems, information navigation systems, and auxiliary teaching systems, etc. , due to its simple operation, thus increasing the convenience of consumers.

Generally speaking, touch panels can be roughly classified into resistive, capacitive, piezoelectric, infrared and ultrasonic based on sensing principles. Among them, the capacitive touch panel is coated with a transparent conductive material film on the glass surface as the in-plane wire, and then cooperates with the metal wire around the glass to transmit the signal to the integrated circuit (IC) on the external soft board or hard board. The above structure is called Touch sensor (touch sensor). If the external circuit board and the uppermost protective cover are further attached, the finished product is called a touch panel. When in use, a uniform electric field will be formed on the glass surface. When the user touches the glass surface with a fingertip, the capacitance between the finger and the electric field will change due to electrostatic reaction. According to this change, the coordinates of the input point can be located.

Please refer to FIG. 1, the known technology discloses a transparent conductive structure applied to touch panels, which includes: a PET substrate 1a, a hard coating 2a formed on the upper surface of the PET substrate 1a, a plurality of formed Conductive lines 3a on the lower surface of the PET substrate 1a, and a protective layer 4a covering the plurality of conductive lines 3a to protect the plurality of conductive lines 3a. However, since the above-mentioned plurality of conductive lines 3a are still too far away from the upper surface 20a of the hard coating 2a (this is the surface that the user needs to touch for operating the touch panel), the above-mentioned plurality of conductive lines 3a must be Use ultra-low conductive materials with conductivity (conductivity range) less than 0.3 ohm/square (Ω/□) (ohm/square meter (Ω/m ² )) to meet the induction requirements.

Contents of the invention

The object of the present invention is to provide a transparent conductive structure and a manufacturing method thereof, which can be applied to a touch panel, and do not need to use ultra-low conductive materials to make conductive lines as in the prior art.

An embodiment of the present invention provides a transparent conductive structure applied to a touch panel, which includes: a substrate unit, a first covering unit, a transparent conducting unit and a second covering unit. Wherein, the substrate unit has at least one transparent substrate. The first covering unit has at least one first covering layer formed on the upper surface of the at least one transparent substrate. The transparent conductive unit has at least one transparent conductive layer formed on the upper surface of the at least one first covering layer, wherein the inside of the at least one transparent conductive layer has a plurality of embedded conductive circuits, and the plurality of embedded conductive circuits are laid out and arranged to form a specific embedded circuit pattern. The second covering unit has at least one second covering layer formed on the upper surface of the at least one transparent conductive layer and covering the plurality of embedded conductive circuits, wherein the top of the at least one second covering layer has a A touch surface that is touched by an object (such as a user's finger or any stylus, etc.).

An embodiment of the present invention provides a method for manufacturing a transparent conductive structure applied to a touch panel, which includes: first, providing a substrate unit having at least one transparent substrate; then, forming at least one transparent substrate on the upper surface of the at least one transparent substrate A first coating layer; then, forming at least one transparent conductive layer with a plurality of embedded conductive circuits on the upper surface of the at least one first coated layer, wherein the plurality of embedded conductive circuits are laid out and arranged to form A specific embedded circuit pattern; finally, at least one second coating layer is formed on the upper surface of the at least one transparent conductive layer to cover the plurality of embedded conductive circuits, wherein the top of the at least one second coating layer There is a touch surface for providing foreign object touch.

To sum up, the transparent conductive structure and its manufacturing method provided by the embodiments of the present invention can be achieved by "bringing the above-mentioned touch surface for providing contact with foreign objects closer to the above-mentioned specific embedded circuit pattern (the embedded circuit pattern) The circuit pattern is embedded in the transparent conductive layer) and the design of the "distance" between the two, so that the transparent conductive structure of the present invention and its manufacturing method can be produced without using ultra-low conductive materials to make the above-mentioned multiple embedded conductive circuits In the case of , an embedded circuit pattern with a conductivity ranging from 0.8 to 3 ohm/square can be obtained to be applied to the touch panel.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are for reference and illustration only, and are not intended to limit the present invention.

Description of drawings

FIG. 1 is a schematic side-view cross-sectional view of a known transparent conductive structure applied to a touch panel;

2 is a flow chart of a method for manufacturing a transparent conductive structure applied to a touch panel according to the present invention;

2A is a schematic side-view cross-sectional view of the manufacturing process of the transparent conductive structure applied to the touch panel of the present invention after steps S100 to S102;

2B is a schematic side view cross-sectional view of the transparent conductive structure applied to the touch panel of the present invention after step S104 of the manufacturing process;

FIG. 2C is a schematic side-view cross-sectional view of the transparent conductive structure applied to the touch panel of the present invention after step S106 of the manufacturing process; and

FIG. 3 is a schematic top view of the layout of multiple embedded conductive circuits according to the present invention.

Wherein, the reference signs are explained as follows:

Detailed ways

Please refer to Fig. 2, Fig. 2A to Fig. 2C, and Fig. 3, wherein Fig. 2 is a flow chart of the production method of the present invention, Fig. 2A to Fig. 2C are respectively a schematic sectional view of the production process of the production method of the present invention, and Fig. 3 is A schematic top view of the layout of multiple embedded conductive lines. As can be seen from the above figures, the present invention provides a method for manufacturing a transparent conductive structure applied to a touch panel, which at least includes the following steps (shown from step S100 to step S106 in FIG. 2 ):

Step S100 is as follows: Firstly, according to FIG. 2 and FIG. 2A , a substrate unit 1 is provided, which has at least one transparent substrate 10 . For example, the above-mentioned at least one transparent substrate 10 can be polyethylene terephthalate (polyethylene Terephthalate, PET), polycarbonate (Poly Carbonate, PC), polyethylene (polyethylene, PE), polyvinyl chloride (Polyvinyl chloride) Vinyl Chloride, PVC), polypropylene (PolyPropylene, PP), polystyrene (Poly Styrene, PS), or one of them in polymethylmethacrylate (Polymethylmethacrylate, PMMA), and the at least one transparent substrate 10 The thickness may generally be between 50 μm and 125 μm. In other words, the designer can use different materials to manufacture the at least one transparent substrate 10 according to different design requirements. However, the materials listed above for making the transparent substrate 10 are only for example, and it is not intended to limit the present invention. Any material (such as plastic, glass, etc.) that can be made into the transparent substrate 10 can be applied to the present invention. inventing.

Step S102 is: please cooperate with FIG. 2 and FIG. 2A to form at least one first covering layer 20 on the upper surface of the at least one transparent substrate 10 . For example, the above-mentioned at least one first coating layer 20 may be a hard coating layer made of hard material. In other words, according to different design requirements, the designer can use different hard materials to make the above-mentioned at least one first coating layer 20. For example, when the hard material used by the designer is an ultraviolet light hardening material, the hard coating layer can be It is a UV hardened coating. However, the materials listed above for making the first coating layer 20 are just examples, and are not intended to limit the present invention. Any material that can be used to form the first coating layer 20 can be applied in the present invention.

Step S104 is: please cooperate with FIG. 2 and FIG. 2B to form at least one transparent conductive layer 30 with multiple embedded conductive circuits 300 on the upper surface of the above-mentioned at least one first coating layer 20, wherein the above-mentioned multiple internal The embedded conductive circuit 300 is laid out to form a specific embedded circuit pattern P. As shown in FIG. For example, the transparent conductive unit 3 can be an indium tin oxide (ITO) conductive layer, and the plurality of embedded conductive lines 300 can selectively penetrate (as shown in FIG. 2B ) or not penetrate the at least one transparent conductive layer. Layer 30. According to different design requirements, each embedded conductive circuit 300 can be a silver circuit made of silver material, an aluminum circuit made of aluminum material, a copper circuit made of copper material, or Any conductive track made of any conductive material. The upper surface of each embedded conductive circuit 300 is exposed and may be flush with the upper surface of the at least one transparent conductive layer 30 . The plurality of embedded conductive circuits 300 can make the conductive range (conductivity) of the specific embedded circuit pattern P roughly between 0.8 and 3 without using ultra-low conductive materials. Ohm/square (Ohm/square meter (Ω/m ² )). In other words, the designer can embed a plurality of embedded conductive lines 300 in the at least one transparent conductive layer 30 according to the embedded circuit pattern P and the required conductive range specifically planned (for example, by rolling the above-mentioned multiple Embedded in the at least one transparent conductive layer 30 by means of an embedded conductive circuit 300).

至

之间，每一个X轴向轨迹线路300X的宽度W1可介于

至

之间，每两个X轴向轨迹线路300X之间的距离D1可介于10μm至20μm之间，每一个Y轴向轨迹线路300Y的宽度W2可介于

至

之间，每两个Y轴向轨迹线路300Y之间的距离D2可介于5μm至15μm之间。然而，上述有关多个内嵌式导电线路300的界定只是用来举例而已，其并非用以限定本发明。Furthermore, please refer to FIG. 2B and FIG. 3 , the above-mentioned plurality of embedded conductive circuits 300 can be divided into a plurality of X-axis trace circuits 300X extending laterally and a plurality of longitudinal traces (this longitudinal direction is approximately the same as the above-mentioned lateral direction). The Y-axis trace lines 300Y extending perpendicular to each other and respectively insulated from the plurality of X-axis trace lines 300X and substantially perpendicular to each other, the thickness H of each embedded conductive line 300 (as shown in FIG. 2B ) can be between

to

Between, the width W1 of each X-axis track line 300X can be between

to

Between, the distance D1 between every two X-axis track lines 300X can be between 10 μm and 20 μm, and the width W2 of each Y-axis track line 300Y can be between

to

Between, the distance D2 between every two Y-axis track lines 300Y may be between 5 μm and 15 μm. However, the above definition of the plurality of embedded conductive circuits 300 is just for example, and is not intended to limit the present invention.

Step S106 is: please cooperate with FIG. 2 and FIG. 2C to form at least one second coating layer 40 on the upper surface of the above-mentioned at least one transparent conductive layer 30 to cover the above-mentioned multiple embedded conductive circuits 300, wherein the above-mentioned at least one The top of the second covering layer 40 has a touch surface 400 for providing external objects (such as a user's finger F or any stylus, etc.) to touch. For example, the above-mentioned at least one second covering layer 40 can be a hard protective layer made of hard material, the hard protective layer can be an oxide protective layer with a thickness between 3 μm and 5 μm, and The oxide protection layer can be a silicon oxide layer made of silicon oxide material (such as a silicon dioxide layer made of silicon dioxide (SiO ₂ )) or an aluminum oxide layer made of aluminum oxide material (for example an aluminum oxide layer made of aluminum oxide (Al ₂ O ₃ )).

Please refer to FIG. 2C and FIG. 3 again. After the manufacturing process of the above steps S100 to S106, the present invention can provide a transparent conductive structure applied to a touch panel, which includes: a substrate unit 1, a first covering unit 2. A transparent conductive unit 3 and a second covering unit 4 . Wherein, the substrate unit 1 has at least one transparent substrate 10 . The first covering unit 2 has at least one first covering layer 20 formed on the upper surface of the at least one transparent substrate 10 . The transparent conductive unit 3 has at least one transparent conductive layer 30 formed on the upper surface of the at least one first covering layer 20, wherein the interior of the at least one transparent conductive layer 30 has a plurality of embedded conductive circuits 300, and the plurality of The embedded conductive circuit 300 is laid out to form a specific embedded circuit pattern P. As shown in FIG. The second covering unit 4 has at least one second covering layer 40 formed on the upper surface of the at least one transparent conductive layer 30 and covering the plurality of embedded conductive circuits 300, wherein the top of the at least one second covering layer 40 has A touch surface 400 for providing external objects (such as a user's finger F or any stylus, etc.) to touch.

For example, the above-mentioned at least one transparent substrate 10 can be one of polyethylene terephthalate, polycarbonate, polyethylene, polyvinyl chloride, polypropylene, polystyrene, or polymethyl methacrylate. One of them, and the thickness of the at least one transparent substrate 10 may be between 50 μm and 125 μm. The above-mentioned at least one first coating layer 20 can be a hard coating layer, and the hard coating layer can be a UV-curable coating layer. Each embedded conductive circuit 300 can be a silver circuit, an aluminum circuit, a copper circuit or any embedded conductive circuit, and the upper surface of each embedded conductive circuit 300 is connected to the at least one transparent conductive layer 30. The upper surface is flush, and the conductive range of the above-mentioned specific embedded circuit pattern P can be between 0.8 and 3 ohms/square.

至

之间，每一个X轴向轨迹线路300X的宽度W1可介于至

之间，每两个X轴向轨迹线路300X之间的距离D1可介于10μm至20μm之间，每一个Y轴向轨迹线路300Y的宽度W2可介于

至之间，每两个Y轴向轨迹线路300Y之间的距离D2可介于5μm至15μm之间。上述至少一第二被覆层40可为一由硬质材料所制成的硬质保护层，该硬质保护层可为一厚度介于3μm至5μm之间的氧化物保护层，且该氧化物保护层可为一氧化硅层或一氧化铝层。Furthermore, the plurality of embedded conductive circuits 300 (as shown in FIG. 3 ) can be divided into a plurality of X-axis trace circuits 300X extending laterally and a plurality of X-axis trace circuits 300X extending longitudinally and respectively connected to the above-mentioned multiple X-axis trace circuits. 300X mutually insulated and mutually perpendicular Y-axis track circuits 300Y, the thickness H of each embedded conductive circuit 300 can be between

to

Between, the width W1 of each X-axis track line 300X can be between to

Between, the distance D1 between every two X-axis track lines 300X can be between 10 μm and 20 μm, and the width W2 of each Y-axis track line 300Y can be between

to Between, the distance D2 between every two Y-axis track lines 300Y may be between 5 μm and 15 μm. The above-mentioned at least one second coating layer 40 can be a hard protective layer made of hard material, the hard protective layer can be an oxide protective layer with a thickness between 3 μm and 5 μm, and the oxide The protection layer can be a silicon oxide layer or an aluminum oxide layer.

To sum up, the transparent conductive structure and its manufacturing method provided by the embodiments of the present invention can be achieved by "bringing the above-mentioned touch surface for providing contact with foreign objects closer to the above-mentioned specific embedded circuit pattern (the embedded circuit pattern) The circuit pattern is embedded in the transparent conductive layer) and the design of the "distance" between the two, so that the transparent conductive structure of the present invention and its manufacturing method can be produced without using ultra-low conductive materials to make the above-mentioned multiple embedded conductive circuits In the case of , an embedded circuit pattern with a conductivity ranging from 0.8 to 3 ohm/square can be obtained to be applied to the touch panel.

However, the above descriptions are only examples of the present invention, and should not limit the scope of the present invention. That is, all equivalent changes and modifications made according to the patent scope of the present invention will still not lose the gist of the present invention, nor depart from the spirit and scope of the present invention, so all should be regarded as further implementation status of the present invention.

Claims (12)

1. a transparent conducting structures that is applied to contact panel is characterized in that, comprising:

One base board unit, it has at least one transparency carrier;

One first lining unit, it has at least one first coating that forms in the upper surface of above-mentioned at least one transparency carrier;

One electrically conducting transparent unit; It has at least one transparency conducting layer that forms in the upper surface of above-mentioned at least one first coating; Wherein the inside of above-mentioned at least one transparency conducting layer has a plurality of embedded conducting wires, and above-mentioned a plurality of embedded conducting wire by layout arrangement to form a specific built-in type circuit pattern; And

One second lining unit; It has at least one second coating that forms in the upper surface of above-mentioned at least one transparency conducting layer and cover above-mentioned a plurality of embedded conducting wires, and the top of wherein above-mentioned at least one second coating has one and is used to provide the touching of foreign object touching surperficial.

2. the transparent conducting structures that is applied to contact panel as claimed in claim 1; It is characterized in that; Above-mentioned at least one transparency carrier is polyethylene terephthalate, Merlon, polyethylene, polyvinyl chloride, polypropylene, polystyrene or polymethyl methacrylate, and the thickness of above-mentioned at least one transparency carrier is between 50 μ m to 125 μ m.

3. the transparent conducting structures that is applied to contact panel as claimed in claim 1 is characterized in that, above-mentioned at least one first coating is a hard coating, and this hard coating is a ultraviolet light photopolymerization coating.

4. the transparent conducting structures that is applied to contact panel as claimed in claim 1; It is characterized in that; Each embedded conducting wire is a silver medal circuit, an aluminum steel road or a copper wire; The upper surface of each embedded conducting wire and the flush of above-mentioned at least one transparency conducting layer, and the conduction scope of above-mentioned specific built-in type circuit pattern is between 0.8 to 3 ohm-sq.

5. the transparent conducting structures that is applied to contact panel as claimed in claim 1; It is characterized in that; Above-mentioned a plurality of embedded conducting wire be divided into a plurality of X axis track circuits toward horizontal expansions and a plurality of past longitudinal extensions and respectively with above-mentioned a plurality of X axis track circuit mutually insulateds and orthogonal Y axial track circuit; The thickness of each embedded conducting wire is between to

; The width of each X axis track circuit is between

to

; Distance between per two X axis track circuits is between 10 μ m to 20 μ m; The width of each Y axial track circuit is between

to

, and the distance between per two Y axial track circuits is between 5 μ m to 15 μ m.

6. the transparent conducting structures that is applied to contact panel as claimed in claim 1; It is characterized in that; Above-mentioned at least one second coating is a hard protective layer; This hard protective layer is the protective oxide film of a thickness between 3 μ m to 5 μ m, and this protective oxide film is an one silica layer or an alumina layer.

7. a manufacture method that is applied to the transparent conducting structures of contact panel is characterized in that, comprising:

One base board unit is provided, and it has at least one transparency carrier;

In the upper surface of above-mentioned at least one transparency carrier at least one first coating that is shaped;

Have the transparency conducting layer of a plurality of embedded conducting wires in the upper surface of above-mentioned at least one first coating at least one inside that is shaped, wherein above-mentioned a plurality of embedded conducting wires by layout arrangement to form a specific built-in type circuit pattern; And

In the upper surface of above-mentioned at least one transparency conducting layer at least one second coating that is shaped, covering above-mentioned a plurality of embedded conducting wire, the top of wherein above-mentioned at least one second coating have one be used to provide the foreign object touching the touching surface.

8. the manufacture method that is applied to the transparent conducting structures of contact panel as claimed in claim 7; It is characterized in that; Above-mentioned at least one transparency carrier be polyethylene terephthalate, Merlon, polyethylene, polyvinyl chloride, polypropylene (, polystyrene or polymethyl methacrylate, and the thickness of above-mentioned at least one transparency carrier is between 50 μ m to 125 μ m.

9. the manufacture method that is applied to the transparent conducting structures of contact panel as claimed in claim 7 is characterized in that, above-mentioned at least one first coating is one by the made hard coating of hard material, and this hard coating is a ultraviolet light photopolymerization coating.

10. the manufacture method that is applied to the transparent conducting structures of contact panel as claimed in claim 7; It is characterized in that; Each embedded conducting wire be one by the made silver-colored circuit of ag material, by the made aluminum steel road or of aluminum by the made copper wire of copper product; The upper surface of each embedded conducting wire and the flush of above-mentioned at least one transparency conducting layer, and the conduction scope of above-mentioned specific built-in type circuit pattern is between 0.8 to 3 ohm-sq.

11. the manufacture method that is applied to the transparent conducting structures of contact panel as claimed in claim 7; It is characterized in that; Above-mentioned a plurality of embedded conducting wire be divided into a plurality of X axis track circuits toward horizontal expansions and a plurality of past longitudinal extensions and respectively with above-mentioned a plurality of X axis track circuit mutually insulateds and orthogonal Y axial track circuit; The thickness of each embedded conducting wire is between

to

; The width of each X axis track circuit is between

to

; Distance between per two X axis track circuits is between 10 μ m to 20 μ m; The width of each Y axial track circuit is between

to

, and the distance between per two Y axial track circuits is between 5 μ m to 15 μ m.

12. the manufacture method that is applied to the transparent conducting structures of contact panel as claimed in claim 7; It is characterized in that; Above-mentioned at least one second coating is one by the made hard protective layer of hard material; This hard protective layer is the protective oxide film of a thickness between 3 μ m to 5 μ m, and this protective oxide film be one by the made silicon oxide layer or of silica material by the made alumina layer of alumina material.

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