CN103513831A - Monolithic projected capacitive touch panel structure and manufacturing method thereof - Google Patents

Abstract

A single-chip sheet projection type capacitive touch panel structure and a manufacturing method thereof are provided, the touch panel structure comprises: the device comprises a substrate unit, a conductive unit, an insulating unit and a signal transmission unit. The substrate unit comprises a transparent substrate and a surrounding light-tight layer formed on the bottom surface of the transparent substrate in a surrounding manner. The conductive unit comprises a transparent conductive layer formed on the bottom surface of the transparent substrate and covering the surrounding light-tight layer and a surrounding electrode layer formed on the bottom surface of the transparent conductive layer in a surrounding manner, wherein the measured end point impedance between two opposite side ends of the surrounding electrode layer is between 2000 omega and 2500 omega. The insulating unit comprises an insulating layer which is formed on the bottom surface of the transparent conducting layer and covers the surrounding electrode layer. The signal transmission unit comprises at least one signal transmission line which is arranged between the surrounding electrode layer and the insulating layer and is electrically connected with the surrounding electrode layer. The invention can increase the durability by arranging the transparent substrate on the uppermost layer.

Description

Monolithic projected capacitive touch panel structure and manufacturing method thereof

technical field

The invention relates to a structure of a touch panel and a manufacturing method thereof, in particular to a structure of a monolithic projected capacitive touch panel and a manufacturing method thereof.

Background technique

Today's touch technology has been widely used in various electronic devices as an input method because it does not require additional configuration of a mouse, buttons or arrow keys, so as to achieve the trend of thinner and thinner products. In other words, with the rise of information appliances, touch panels gradually replace the old way of communicating with information products through keyboards and mice. Touch panel technology provides a set of user-friendly interfaces that allow ordinary users to operate computers or electronic products, it can become more direct, simple, vivid and interesting. And the touch panel has a wide range of applications, including portable communication and information products (such as personal digital assistant PDA, etc.), financial/commercial systems, medical registration systems, monitoring systems, information navigation systems, and auxiliary teaching systems, etc. , due to its simple operation, thus increasing the convenience of consumers.

Generally speaking, touch panels can be roughly classified into resistive, capacitive, piezoelectric, infrared and ultrasonic based on sensing principles. Among them, the capacitive touch panel is coated with a transparent conductive material film on the glass surface as the in-plane wire, and then cooperates with the metal wire around the glass to transmit the signal to the integrated circuit (IC) on the external soft board or hard board. The above structure is called For the touch sensor (touch sensor). If the external circuit board and the top protective cover are further attached, the finished product is called a touch panel. When in use, a uniform electric field will be formed on the glass surface. When the user touches the glass surface with a fingertip, the capacitance between the finger and the electric field will change due to electrostatic reaction. According to this change, the coordinates of the input point can be located.

Although a traditional capacitive touch panel is coated with a wear-resistant layer on the upper surface of the ITO layer, the durability of the wear-resistant layer cannot be effectively improved due to limitations in material and thickness. Furthermore, even if the thickness of the wear-resistant layer is increased to more than 50 μm, there will be a problem that the capacitive touch panel cannot touch accurately. Furthermore, all conventional projected capacitive touch panels can only provide a terminal impedance of about 200Ω, but cannot provide a higher terminal impedance.

Contents of the invention

The object of the present invention is to provide a monolithic projected capacitive touch panel structure and a manufacturing method thereof.

A monolithic projected capacitive touch panel structure provided by one embodiment of the present invention includes: a substrate unit, a conductive unit, an insulating unit and a signal transmission unit. The substrate unit includes a transparent substrate and a surrounding opaque layer formed on the bottom surface of the transparent substrate. The conductive unit includes a transparent conductive layer formed on the bottom surface of the transparent substrate and covering the surrounding opaque layer and a surrounding electrode layer formed on the bottom surface of the transparent conductive layer, wherein in the surrounding shape The terminal impedance measured between two opposite side ends of the electrode layer is between 2000Ω and 2500Ω. The insulating unit includes an insulating layer formed on the bottom surface of the transparent conductive layer and covering the surrounding electrode layer. The signal transmission unit includes at least one signal transmission line disposed between the surrounding electrode layer and the insulating layer and electrically connected to the surrounding electrode layer.

In an embodiment of the monolithic projected capacitive touch panel structure of the present invention, the thickness of the transparent substrate is between 0.7mm and 1.5mm, and the transparent substrate is one of a glass substrate and a plastic substrate One, wherein a hardened coating is formed on the top surface of the plastic substrate, and the material of the plastic substrate is polymethyl methacrylate, polyvinyl chloride, polyethylene terephthalate, cycloolefin copolymer, polycarbonate , polyethylene, polypropylene, polystyrene, and polyimide, and the material of the hardened coating is silicon dioxide.

In one embodiment of the monolithic projected capacitive touch panel structure of the present invention, the transparent conductive layer is an indium tin oxide conductive layer, a carbon nanotube conductive layer, a polymer conductive layer, a graphene conductive layer, And one of the nano-silver conductive layers.

In one embodiment of the monolithic projected capacitive touch panel structure of the present invention, the transparent conductive layer is a first composite conductive layer composed of a conductive polymer material and a graphene material and a conductive high The second composite conductive layer composed of molecular materials and carbon nanotube materials

In one embodiment of the monolithic projected capacitive touch panel structure of the present invention, the surrounding electrode layer includes a base layer, a plurality of first conductive segments disposed on the base layer and arranged in a surrounding shape, A plurality of second conductive segments disposed on the base layer and surrounding the plurality of first conductive segments, a plurality of third conductive segments disposed on the base layer and surrounding the plurality of first conductive segments, A plurality of fourth conductive segments disposed on the base layer and surrounding the plurality of second conductive segments and the plurality of third conductive segments, and a plurality of fourth conductive segments disposed on the base layer and surrounding the plurality of fourth conductive segments The fifth conductive section of the conductive section, and each of the second conductive sections has a first conductive part located between every two corresponding third conductive sections and a second conductive part from the first conductive section. The second conductive portion extends inward and is located between two corresponding first conductive segments.

In one embodiment of the monolithic projected capacitive touch panel structure of the present invention, the transparent substrate, the transparent conductive layer and the insulating layer all have an outer peripheral surface, wherein the bottom surface of the transparent substrate has a transparent The outer surrounding surface of the substrate corresponds to the bottom surrounding area of the surrounding opaque layer, and the top surface of the transparent conductive layer has an outer surrounding surface adjacent to the transparent conductive layer corresponding to the surrounding opaque layer. The top surrounding area of the optical layer, and the surrounding opaque layer is formed between the bottom surrounding area of the transparent substrate and the top surrounding area of the transparent conductive layer, wherein the bottom surface of the transparent conductive layer has an adjacent The outer surrounding surface of the transparent conductive layer corresponds to the bottom surrounding area of the surrounding electrode layer, and the top surface of the insulating layer has an outer surrounding surface adjacent to the insulating layer corresponding to the top end of the surrounding electrode layer. surrounding area, and the surrounding electrode layer is formed between the bottom surrounding area of the transparent conductive layer and the top surrounding area of the insulating layer.

In an embodiment of the monolithic projected capacitive touch panel structure of the present invention, it further includes: an auxiliary unit, which includes at least two transparent substrates respectively formed on the top surface and the bottom surface of the insulating layer. Auxiliary coatings, wherein each of the auxiliary coatings can be one of an optical film and an explosion-proof film.

In an embodiment of the monolithic projected capacitive touch panel structure of the present invention, it further includes: an auxiliary unit, which includes at least two transparent substrates respectively formed on the top surface and the bottom surface of the insulating layer. Auxiliary coatings, wherein each auxiliary coating includes an optical film and an explosion-proof film, and the optical film and the explosion-proof film are stacked together.

Another embodiment of the present invention provides a method for manufacturing a monolithic projected capacitive touch panel structure, which includes the following steps: firstly, providing a transparent substrate; then, forming a surrounding opaque layer on the on the bottom surface of the transparent substrate; then, form a transparent conductive layer on the bottom surface of the transparent substrate, wherein the surrounding opaque layer is covered by the transparent conductive layer; then, form a surrounding electrode layer on the transparent conductive layer layer, wherein the terminal impedance measured between two opposite side ends of the surrounding electrode layer is between 2000Ω and 2500Ω; next, an insulating layer is formed on the bottom surface of the transparent conductive layer, The surrounding electrode layer is covered by the insulating layer; finally, at least one signal transmission line is arranged between the surrounding electrode layer and the insulating layer, wherein the at least one signal transmission line is electrically connected to the surrounding electrode layer.

Furthermore, the step of forming the surrounding opaque layer on the bottom surface of the transparent substrate further includes: forming an opaque material layer on the bottom surface of the transparent substrate, and then removing the opaque material The middle area of the layer to form the surrounding opaque layer. In addition, the step of forming the surrounding electrode layer on the bottom surface of the transparent conductive layer further includes: forming an electrode material layer on the bottom surface of the transparent conductive layer, and then removing the middle region of the electrode material layer to form the around the electrode layer.

In an embodiment of the manufacturing method of the monolithic projected capacitive touch panel structure of the present invention, the transparent substrate is one of a glass substrate and a plastic substrate, wherein a hardened surface is formed on the top surface of the plastic substrate. Coating, the material of the plastic substrate is polymethyl methacrylate, polyvinyl chloride, polyethylene terephthalate, cycloolefin copolymer, polycarbonate, polyethylene, polypropylene, polystyrene, and polystyrene One of imides, and the material of the hardened coating is silicon dioxide.

In an embodiment of the manufacturing method of the monolithic projected capacitive touch panel structure of the present invention, the transparent conductive layer is an indium tin oxide conductive layer, a carbon nanotube conductive layer, a polymer conductive layer, and a graphene conductive layer. layer, and nano-silver conductive layer, and the thickness of the transparent conductive layer is between 0.7mm and 1.5mm.

In one embodiment of the manufacturing method of the monolithic projected capacitive touch panel structure of the present invention, the transparent conductive layer is a first composite conductive layer composed of a conductive polymer material and a graphene material and a composite conductive layer composed of a conductive polymer material and a graphene material. One of the second composite conductive layer composed of conductive polymer material and carbon nanotube material.

In an embodiment of the manufacturing method of the monolithic projected capacitive touch panel structure of the present invention, the surrounding electrode layer includes a base layer, a plurality of first conductive regions arranged on the base layer and arranged in a surrounding shape segment, a plurality of second conductive segments disposed on the base layer and surrounding the plurality of first conductive segments, a plurality of third conductive regions disposed on the base layer and surrounding the plurality of first conductive segments segments, a plurality of fourth conductive segments disposed on the base layer and surrounding the plurality of second conductive segments and the plurality of third conductive segments, and a plurality of fourth conductive segments disposed on the base layer and surrounding the plurality of The fifth conductive section of the fourth conductive section, and each of the second conductive sections has a first conductive part located between every two corresponding third conductive sections and a first conductive part from the second conductive section. A conductive portion extends inward and is located at the second conductive portion between two corresponding first conductive segments.

In an embodiment of the manufacturing method of the monolithic projected capacitive touch panel structure of the present invention, the transparent substrate, the transparent conductive layer and the insulating layer all have an outer surrounding surface, wherein the bottom surface of the transparent substrate has an adjacent The outer surrounding surface of the transparent substrate corresponds to the bottom surrounding area of the surrounding opaque layer, and the top surface of the transparent conductive layer has an outer surrounding surface adjacent to the transparent conductive layer corresponding to the surrounding shape. The top surrounding area of the opaque layer, and the surrounding opaque layer is formed between the bottom surrounding area of the transparent substrate and the top surrounding area of the transparent conductive layer, wherein the bottom surface of the transparent conductive layer has a bottom surrounding area adjacent to the outer surrounding surface of the transparent conductive layer and corresponding to the surrounding electrode layer; the top surface of the insulating layer has an outer surrounding surface adjacent to the insulating layer corresponding to the surrounding electrode layer and the surrounding electrode layer is formed between the bottom surrounding area of the transparent conductive layer and the top surrounding area of the insulating layer.

In an embodiment of the manufacturing method of the monolithic projected capacitive touch panel structure of the present invention, it further includes: respectively forming two auxiliary coatings on the top surface of the transparent substrate and the bottom surface of the insulating layer, wherein each An auxiliary coating can be one of an optical film and an explosion-proof film.

In an embodiment of the manufacturing method of the monolithic projected capacitive touch panel structure of the present invention, it further includes: respectively forming two auxiliary coatings on the top surface of the transparent substrate and the bottom surface of the insulating layer, wherein each An auxiliary coating includes an optical film and an explosion-proof film, and the optical film and the explosion-proof film are stacked together.

The beneficial effects of the present invention may lie in that the monolithic projected capacitive touch panel structure and its manufacturing method provided by the embodiments of the present invention can increase the strength of the present invention through the design of "setting the transparent substrate on the uppermost layer". of durability.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the drawings are provided for reference and illustration only, and are not intended to limit the present invention.

Description of drawings

FIG. 1 is a three-dimensional exploded schematic diagram of a single-piece projected capacitive touch panel structure according to a first embodiment of the present invention.

FIG. 2 is a three-dimensional combined schematic view of the single-piece projected capacitive touch panel structure according to the first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional side view of the single-piece projected capacitive touch panel structure according to the first embodiment of the present invention.

4 is a schematic top view of the surrounding electrode layer of the monolithic projected capacitive touch panel structure according to the first embodiment of the present invention.

FIG. 5 is a flow chart of a method for fabricating a monolithic projected capacitive touch panel structure according to a first embodiment of the present invention.

6A is a schematic cross-sectional view of steps S100 and S102 of the manufacturing method of the monolithic projected capacitive touch panel structure according to the first embodiment of the present invention.

6B is a schematic cross-sectional view of step S104 of the manufacturing method of the monolithic projected capacitive touch panel structure according to the first embodiment of the present invention.

6C is a schematic cross-sectional view of step S106 of the manufacturing method of the monolithic projected capacitive touch panel structure according to the first embodiment of the present invention.

6D is a schematic cross-sectional view of step S108 of the manufacturing method of the monolithic projected capacitive touch panel structure according to the first embodiment of the present invention.

6E is a schematic cross-sectional view of step S110 of the manufacturing method of the monolithic projected capacitive touch panel structure according to the first embodiment of the present invention.

6F is a schematic cross-sectional view of step S112 of the manufacturing method of the monolithic projected capacitive touch panel structure according to the first embodiment of the present invention.

FIG. 7 is a schematic side view cross-sectional view of a monolithic projected capacitive touch panel structure according to a second embodiment of the present invention.

FIG. 8 is a schematic cross-sectional side view of a monolithic projected capacitive touch panel structure according to a second embodiment of the present invention.

Explanation of main component symbols

Substrate unit 1 transparent substrate 10

touch surface 100

Surrounding surface 101

Bottom surround area 102

Surrounding opaque layer 11

Opaque material layer 11’

Middle area 110’

Thickness H

Conductive unit 2 Transparent conductive layer 20

Surrounding surface 201

Top Surrounding Area 202

Bottom surround area 203

Surrounding electrode layer 21

Basal layer 210

The first conductive section 211

The second conductive section 212

First Conducting Department 2121

The second conductive part 2122

The third conductive section 213

The fourth conductive section 214

The fifth conductive section 215

Electrode material layer 21’

Middle area 210’

Side end S

Terminal Impedance R

Insulation unit 3 insulation layer 30

Surrounding surface 301

Top Surrounding Area 302

Signal transmission unit 4 Signal transmission line 40

Auxiliary Unit 5 Auxiliary Coating 50

Optical film 50A

Explosion-proof film 50B

Detailed ways

[First embodiment]

1 to 4, the first embodiment of the present invention provides a monolithic projected capacitive touch panel structure, which includes: a substrate unit 1, a conductive unit 2, an insulating unit 3 and an Signal transmission unit 4.

Firstly, as shown in FIG. 1 to FIG. 3 , the substrate unit 1 includes a transparent substrate 10 and a surrounding opaque layer 11 (such as a black frame) formed on the bottom surface of the transparent substrate 10 . For example, the thickness H of the transparent substrate 10 may be approximately between 0.7 mm and 1.5 mm. The transparent substrate 10 can be one of a glass substrate and a plastic substrate. When the transparent substrate 10 is a glass substrate, the top surface of the transparent substrate 10 has a touch surface 100 for a user to touch. In addition, when the transparent substrate 10 is a plastic substrate, the plastic substrate has a hardened coating (not shown) formed on the top surface of the plastic substrate, and the above-mentioned touch surface 100 for the user to touch is Formed on the top surface of a hardened coating (not shown), wherein the plastic substrate can be polymethylmethacrylate (Polymethylmethacrylate, PMMA), polyvinyl chloride (Poly Vinyl Chloride, PVC), polyethylene terephthalate Ester (polyethylene Terephthalate, PET), cycloolefin copolymer (CyclicOlefin Copolymer, COC), polycarbonate (Poly Carbonate, PC), polyethylene (polyethylene, PE), polypropylene (Poly Propylene, PP), polystyrene ( One of Poly Styrene, PS) and polyimide (Polyimide, PI), and the hardened coating (not shown) can be silicon dioxide. Therefore, according to different usage requirements, the designer can selectively use a glass substrate or a plastic substrate with a hardened coating formed on the surface as the transparent substrate 10 . However, the transparent substrate 10 used in the present invention is not limited to the example mentioned in the first embodiment above.

Moreover, as shown in FIG. 1 to FIG. 3 , the conductive unit 2 includes a transparent conductive layer 20 formed on the bottom surface of the transparent substrate 10 and covering the surrounding opaque layer 11 and a surrounding ground formed on the transparent conductive layer 20 The surrounding electrode layer 21 on the bottom surface, in which the conductive unit 2 can form a surface capacitance on the touch surface 100 after being energized, by detecting the change in surface capacitance when the user's finger touches the surface 100, to determine the touch of the user's finger Location. In addition, the terminal impedance R measured between the two opposite side ends S of the surrounding electrode layer 21 can be between 2000Ω and 2500Ω, and the optimal terminal impedance R is above 2300Ω. Furthermore, when the user directly looks at the transparent substrate 10, since the area of the surrounding-shaped opaque layer 11 can be larger than the area of the surrounding-shaped electrode layer 21, the surrounding-shaped opaque layer 11 can completely cover the surrounding-shaped electrode layer 21. , so the present invention does not need to use additional mechanism design to cover the surrounding electrode layer 21 . For example, the transparent conductive layer 20 can be an indium tin oxide (ITO) conductive layer, a carbon nanotube (carbon nanotube, CNT) conductive layer, a polymer conductive layer, a graphene (Graphene) conductive layer, and nano silver One of the conductive layers. In addition, according to different application requirements, the transparent conductive layer 20 can also be a composite conductive layer composed of two or more conductive materials. For example, the transparent conductive layer 20 can be a conductive polymer material and a graphene material. One of the first composite conductive layer and the second composite conductive layer composed of conductive polymer material and carbon nanotube material. Furthermore, the surrounding electrode layer 21 can be made of materials with good conductivity such as silver paste or thin metal wires. However, the transparent conductive layer 20 and the surrounding electrode layer 21 used in the present invention are not limited to the examples mentioned above in the first embodiment.

In addition, the insulating unit 3 includes an insulating layer 30 formed on the bottom surface of the transparent conductive layer 20 and covering the surrounding electrode layer 21 . For example, the insulating layer 30 can be a protective layer, a hard coating, polyethylene terephthalate (polyethylene Terephthalate, PET) or any kind of film, but the insulating layer 30 used in the present invention does not use the above-mentioned first The examples given in the examples are limited.

Furthermore, the signal transmission unit 4 includes at least one signal transmission line 40 disposed between the surrounding electrode layer 21 and the insulating layer 30 and electrically connected to the surrounding electrode layer 21 . For example, the signal transmission line 40 can be a flexible flat cable or any transmission line for signal transmission, but the signal transmission line 40 used in the present invention is not limited to the examples mentioned in the first embodiment above.

Furthermore, as shown in FIG. 1 to FIG. 3, the transparent substrate 10, the transparent conductive layer 20 and the insulating layer 30 all have an outer surrounding surface (101, 201, 301), wherein the bottom surface of the transparent substrate 10 has an adjacent transparent The outer surrounding surface 101 of the substrate 10 corresponds to the surrounding area 102 of the bottom end of the surrounding opaque layer 11, and the top surface of the transparent conductive layer 20 has an outer surrounding surface 201 adjacent to the transparent conducting layer 20 and corresponds to the surrounding surrounding area 102. The top surrounding region 202 of the transparent layer 11 , and the surrounding opaque layer 11 is formed between the bottom surrounding region 102 of the transparent substrate 10 and the top surrounding region 202 of the transparent conductive layer 20 . In addition, the bottom surface of the transparent conductive layer 20 has an outer surrounding surface 201 adjacent to the transparent conductive layer 20 and corresponds to the bottom surrounding area 203 of the surrounding electrode layer 21, and the top surface of the insulating layer 30 has an outer surrounding surface 201 adjacent to the insulating layer 30. The surface 301 corresponds to the top surrounding area 302 of the surrounding electrode layer 21 , and the surrounding electrode layer 21 is formed between the bottom surrounding area 203 of the transparent conductive layer 20 and the top surrounding area 302 of the insulating layer 30 . However, the arrangement positions of the surrounding opaque layer 11 and the surrounding electrode layer 21 of the present invention are not limited to the examples mentioned in the above-mentioned first embodiment.

Furthermore, as shown in FIG. 1 and FIG. 4 , in which FIG. 4 only shows half of the circuit surrounding the electrode layer 21 , there are mainly six resistors that can be connected in series. The surrounding electrode layer 21 includes a base layer 210, a plurality of first conductive segments 211 disposed on the base layer 210 and arranged in a surrounding shape, a plurality of first conductive segments disposed on the base layer 210 and surrounding the plurality of first conductive segments 211 of the second conductive segment 212, a plurality of third conductive segments 213 disposed on the base layer 210 and surrounding the plurality of first conductive segments 211, a plurality of third conductive segments 213 disposed on the base layer 210 and surrounding the plurality of first conductive segments The second conductive section 212, the fourth conductive section 214 of the plurality of third conductive sections 213, and the plurality of fifth conductive sections 215 disposed on the base layer 210 and surrounding the plurality of fourth conductive sections 214 . In addition, each second conductive segment 212 has a first conductive portion 2121 located between every two corresponding third conductive segments 213 and a first conductive portion 2121 extending inward from the first conductive portion 2121 and located between two corresponding The second conductive portion 2122 between the first conductive segments 211 of the . However, the surrounding electrode layer 21 used in the present invention is not limited to the example mentioned in the first embodiment above.

Please refer to FIG. 5 , and to FIG. 6A to FIG. 6F , the first embodiment of the present invention provides a method for manufacturing a monolithic projected capacitive touch panel structure, which includes the following steps:

First, as shown in FIG. 5 and FIG. 6A , a transparent substrate 10 is provided (S100), and then an opaque material layer 11' is formed on the bottom surface of the transparent substrate 10 (S102). For example, the opaque material layer 11' can be formed on the bottom surface of the transparent substrate 10 by printing, coating, sputtering, vapor deposition or any other forming method, but the opaque material layer 11' of the present invention The forming method used is not limited to the example mentioned in the above-mentioned first embodiment.

Next, as shown in FIG. 5 and FIGS. 6A to 6B , the middle region 110' of the opaque material layer 11' is removed to form a surrounding opaque layer 11 on the bottom surface of the transparent substrate 10 (S104 ). For example, the middle region 110' of the light-opaque material layer 11' can be removed by etching or any cleaning method, but the middle region 110' of the light-proof material layer 11' of the present invention is removed The method is not limited to the example mentioned in the first embodiment above.

Then, as shown in FIG. 5 and FIG. 6C , a transparent conductive layer 20 is formed on the bottom surface of the transparent substrate 10 ( S106 ), wherein the surrounding opaque layer 11 is covered by the transparent conductive layer 20 . For example, the transparent conductive layer 20 can be formed on the bottom surface of the transparent substrate 10 by printing, coating, sputtering, evaporation or any other forming method, but the forming method used by the transparent conductive layer 20 of the present invention is not The example given in the above-mentioned first embodiment is limited.

Next, as shown in FIG. 5 and FIG. 6D , an electrode material layer 21' is formed on the bottom surface of the transparent conductive layer 20 (S108). For example, the electrode material layer 21' can be formed on the bottom surface of the transparent substrate 10 by printing, coating, sputtering, vapor deposition or any other shaping method. The method is not limited to the example mentioned in the first embodiment above.

Next, as shown in FIG. 5 and FIG. 6D to FIG. 6E , the middle region 210' of the electrode material layer 21' is removed to form a surrounding electrode layer 21 on the bottom surface of the transparent conductive layer 20 (S110). For example, the middle region 210' of the electrode material layer 21' can be removed by etching or any cleaning method, but the removal method used for the middle region 210' of the electrode material layer 21' of the present invention is not the above-mentioned method. The examples given in the first embodiment are limited. In addition, the terminal impedance R measured between two opposite side ends S of the surrounding electrode layer 21 is between 2000Ω and 2500Ω (as shown in FIG. 1 ).

Then, as shown in FIG. 5 and FIG. 6F , an insulating layer 30 is formed on the bottom surface of the transparent conductive layer 20 ( S112 ), wherein the surrounding electrode layer 21 is covered by the insulating layer 30 . For example, the insulating layer 30 can be formed on the bottom surface of the transparent substrate 10 by printing, coating, sputtering, vapor deposition or any other forming method, but the forming method used by the insulating layer 30 of the present invention is not the same as the above-mentioned The examples given in the first embodiment are limited.

Finally, as shown in FIG. 5 and FIG. 3 , at least one signal transmission line 40 is disposed between the surrounding electrode layer 21 and the insulating layer 30 , wherein the signal transmission line 40 is electrically connected to the surrounding electrode layer 21 ( S114 ). For example, the present invention may reserve an insertion hole (not shown) between the transparent conductive layer 20 and the insulating layer 30, so after step S112 is completed, the signal transmission line 40 can be inserted into the insertion hole to The signal transmission line 40 can be placed between the surrounding electrode layer 21 and the insulating layer 30 and electrically connected to the surrounding electrode layer 21 .

[Second Embodiment]

Please refer to FIG. 7, the second embodiment of the present invention provides a monolithic projected capacitive touch panel structure, which includes: a substrate unit 1, a conductive unit 2, an insulating unit 3 and a signal transmission unit 4. From the comparison of Fig. 7 and Fig. 3, it can be seen that the biggest difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the structure of the monolithic projected capacitive touch panel further includes: an auxiliary Unit 5, which includes at least two auxiliary coatings 50 respectively formed on the top surface of the transparent substrate 10 and the bottom surface of the insulating layer 30, wherein each auxiliary coating 50 can be an optical film for improving light transmittance 50A and an explosion-proof film 50B for enhancing safety, and both the optical film 50A and the explosion-proof film 50B can be made of PET. Furthermore, according to different application requirements, only one of the optical film 50A and the explosion-proof film 50B can be formed on the top surface of the transparent substrate 10, and only one of the optical film 50A and the explosion-proof film 50B can be formed. An insulating layer 30 may be formed on the bottom surface. However, the auxiliary coating 50 used in the present invention is not limited to the example mentioned in the second embodiment above.

[Third Embodiment]

Please refer to FIG. 8, the third embodiment of the present invention provides a monolithic projected capacitive touch panel structure, which includes: a substrate unit 1, a conductive unit 2, an insulating unit 3 and a signal transmission unit 4. From the comparison of FIG. 8 and FIG. 3, it can be known that the biggest difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the structure of the monolithic projected capacitive touch panel further includes: an auxiliary Unit 5, which includes at least two auxiliary coating layers 50 respectively formed on the top surface of the transparent substrate 10 and the bottom surface of the insulating layer 30, wherein each auxiliary coating layer 50 includes an optical film 50A for enhancing light transmittance and an explosion-proof film 50B for enhancing safety, and the optical film 50A and the explosion-proof film 50B are stacked together. Furthermore, according to different usage requirements, one of the optical film 50A and the explosion-proof film 50B can be formed on the top surface of the transparent substrate 10 first, and one of the optical film 50A and the explosion-proof film 50B can be formed first. An insulating layer 30 is formed on the bottom surface. However, the auxiliary coating 50 used in the present invention is not limited to the example mentioned in the third embodiment above.

The above descriptions are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the claims of the present invention. Therefore, all equivalent technical changes made by using the accompanying drawings in the description of the present invention are included in the scope of the present invention. .

Claims (17)

1. a monolithic sheet Projected capacitive touch panel structure, is characterized in that, comprising:

One base board unit, it comprise a transparency carrier and around ground, be formed on the bottom surface of this transparency carrier around shape light non-transmittable layers;

One conductive unit, it comprise one be formed on the bottom surface of this transparency carrier and cover this transparency conducting layer around shape light non-transmittable layers and one around ground, be formed on the bottom surface of this transparency conducting layer around shape electrode layer, wherein this around the end points impedance being measured between two opposition side ends of shape electrode layer between 2000 Ω to 2500 Ω;

One insulation unit, it comprises that one is formed on the bottom surface of this transparency conducting layer and covers this around the insulation course of shape electrode layer; And

One signal transmission unit, it comprises and is at least onely arranged at this around between shape electrode layer and this insulation course and be electrically connected at this around the signal transmssion line of shape electrode layer.

2. monolithic sheet Projected capacitive touch panel structure as claimed in claim 1, it is characterized in that, the thickness of this transparency carrier is between between 0.7mm to 1.5mm, this transparency carrier be a glass substrate and a plastic base one of them, wherein on the end face of this plastic base, be formed with a hardening coat, the material of this plastic base is polymethylmethacrylate, Polyvinylchloride, polyethylene terephthalate, cyclenes copolymer, polycarbonate, tygon, polypropylene, polystyrene, and wherein a kind of among pi, and the material of this hardening coat is silicon dioxide.

3. monolithic sheet Projected capacitive touch panel structure as claimed in claim 1, it is characterized in that, this transparency conducting layer is wherein a kind of among a conductive indium-tin oxide layer, a CNT conductive layer, a conductive polymer layer, graphene conductive layer and nano-silver conductive layer.

4. monolithic sheet Projected capacitive touch panel structure as claimed in claim 1, it is characterized in that, this transparency conducting layer be the second combined type conducting layer of being formed by conducting polymer composite and nano carbon tube material of a first combined type conducting layer being formed by conducting polymer composite and grapheme material and one of them.

5. monolithic sheet Projected capacitive touch panel structure as claimed in claim 1, it is characterized in that, should comprise a basalis around shape electrode layer, a plurality ofly be arranged on this basalis and be arranged in the first conductive section around shape, a plurality of be arranged on this basalis and around the second conductive section of above-mentioned a plurality of the first conductive sections, a plurality of be arranged on this basalis and around the 3rd conductive section of above-mentioned a plurality of the first conductive sections, a plurality of be arranged on this basalis and around the 4th conductive section of above-mentioned a plurality of the second conductive sections and above-mentioned a plurality of the 3rd conductive sections, and a plurality of be arranged on this basalis and around the 5th conductive section of above-mentioned a plurality of the 4th conductive sections, and described in each, the second conductive section has first conductive part and between every two corresponding described the 3rd conductive sections and from this first conductive part, extends internally and the second conductive part between two corresponding described the first conductive sections.

6. monolithic sheet Projected capacitive touch panel structure as claimed in claim 1, it is characterized in that, this transparency carrier, this transparency conducting layer and this insulation course all have outside one around surface, wherein the bottom surface of this transparency carrier have this of contiguous this transparency carrier outer around surface and corresponding to this bottom around shape light non-transmittable layers around shape region, the end face of this transparency conducting layer have this of contiguous this transparency conducting layer outer around surface and corresponding to this top around shape light non-transmittable layers around region, and this bottom that should be formed at this transparency carrier around shape light non-transmittable layers is around this top of shape region and this transparency conducting layer around between region, wherein the bottom surface of this transparency conducting layer have this of contiguous this transparency conducting layer outer around surface and corresponding to this bottom around shape electrode layer around region, the end face of this insulation course have this of contiguous this insulation course outer around surface and corresponding to this top around shape electrode layer around region, and this bottom that should be formed at this transparency conducting layer around shape electrode layer is around this top of region and this insulation course around between region.

7. monolithic sheet Projected capacitive touch panel structure as claimed in claim 1, it is characterized in that, also comprise: an auxiliary unit, it comprises the assistant coating at least two end faces that are respectively formed at this transparency carrier and on the bottom surface of this insulation course, and wherein described in each, assistant coating can be a blooming and a blow-out disc both one of them.

8. monolithic sheet Projected capacitive touch panel structure as claimed in claim 1, it is characterized in that, also comprise: an auxiliary unit, it comprises the assistant coating at least two end faces that are respectively formed at this transparency carrier and on the bottom surface of this insulation course, wherein each assistant coating comprises a blooming and a blow-out disc, and together with this blooming is stacked each other on this blow-out disc.

9. a method for making for monolithic sheet Projected capacitive touch panel structure, is characterized in that, comprises the following steps:

One transparency carrier is provided;

On the bottom surface of formation one around shape light non-transmittable layers in this transparency carrier;

Form a transparency conducting layer on the bottom surface of this transparency carrier, wherein should by this transparency conducting layer, be covered around shape light non-transmittable layers;

Form on a bottom surface around shape electrode layer in this transparency conducting layer, wherein this around the end points impedance being measured between two opposition side ends of shape electrode layer between 2000 Ω to 2500 Ω;

Form an insulation course on the bottom surface of this transparency conducting layer, wherein should by this insulation course, be covered around shape electrode layer; And

At least one signal transmssion line is set in this around shape electrode layer and between this insulation course, wherein above-mentioned at least one signal transmssion line is electrically connected at this around shape electrode layer.

10. the method for making of monolithic sheet Projected capacitive touch panel structure as claimed in claim 9, it is characterized in that, step on this bottom surface around shape light non-transmittable layers in this transparency carrier of above-mentioned formation also comprises: form a light-proof material layer on the bottom surface of this transparency carrier, then the zone line that removes this light-proof material layer should be around shape light non-transmittable layers to form, wherein the step on this bottom surface around shape electrode layer in this transparency conducting layer of above-mentioned formation also comprises: form an electrode material layer on the bottom surface of this transparency conducting layer, then the zone line that removes this electrode material layer should be around shape electrode layer to form.

The method for making of 11. monolithic sheet Projected capacitive touch panel structures as claimed in claim 9, it is characterized in that, this transparency carrier be a glass substrate and a plastic base one of them, wherein on the end face of this plastic base, be formed with a hardening coat, the material of this plastic base is wherein a kind of among polymethylmethacrylate, Polyvinylchloride, polyethylene terephthalate, cyclenes copolymer, polycarbonate, tygon, polypropylene, polystyrene and pi, and the material of this hardening coat is silicon dioxide.

The method for making of 12. monolithic sheet Projected capacitive touch panel structures as claimed in claim 9, it is characterized in that, this transparency conducting layer is wherein a kind of among a conductive indium-tin oxide layer, a CNT conductive layer, a conductive polymer layer, graphene conductive layer and nano-silver conductive layer, and the thickness of this transparency conducting layer is between between 0.7mm to 1.5mm.

The method for making of 13. monolithic sheet Projected capacitive touch panel structures as claimed in claim 9, it is characterized in that, this transparency conducting layer be the second combined type conducting layer of being formed by conducting polymer composite and nano carbon tube material of a first combined type conducting layer being formed by conducting polymer composite and grapheme material and one of them.

The method for making of 14. monolithic sheet Projected capacitive touch panel structures as claimed in claim 9, it is characterized in that, should comprise a basalis around shape electrode layer, a plurality ofly be arranged on this basalis and be arranged in the first conductive section around shape, a plurality of be arranged on this basalis and around the second conductive section of above-mentioned a plurality of the first conductive sections, a plurality of be arranged on this basalis and around the 3rd conductive section of above-mentioned a plurality of the first conductive sections, a plurality of be arranged on this basalis and around the 4th conductive section of above-mentioned a plurality of the second conductive sections and above-mentioned a plurality of the 3rd conductive sections, and a plurality of be arranged on this basalis and around the 5th conductive section of above-mentioned a plurality of the 4th conductive sections, and described in each, the second conductive section has first conductive part and between every two corresponding described the 3rd conductive sections and from this first conductive part, extends internally and the second conductive part between two corresponding described the first conductive sections.

The method for making of 15. monolithic sheet Projected capacitive touch panel structures as claimed in claim 9, it is characterized in that, this transparency carrier, this transparency conducting layer and this insulation course all have outside one around surface, wherein the bottom surface of this transparency carrier have this of contiguous this transparency carrier outer around surface and corresponding to this bottom around shape light non-transmittable layers around shape region, the end face of this transparency conducting layer have this of contiguous this transparency conducting layer outer around surface and corresponding to this top around shape light non-transmittable layers around region, and this bottom that should be formed at this transparency carrier around shape light non-transmittable layers is around this top of shape region and this transparency conducting layer around between region, wherein the bottom surface of this transparency conducting layer have this of contiguous this transparency conducting layer outer around surface and corresponding to this bottom around shape electrode layer around region, the end face of this insulation course have this of contiguous this insulation course outer around surface and corresponding to this top around shape electrode layer around region, and this bottom that should be formed at this transparency conducting layer around shape electrode layer is around this top of region and this insulation course around between region.

The method for making of 16. monolithic sheet Projected capacitive touch panel structures as claimed in claim 9, it is characterized in that, also comprise: form respectively two assistant coatings on the end face of this transparency carrier and on the bottom surface of this insulation course, wherein each assistant coating can be a blooming and a blow-out disc both one of them.

The method for making of 17. monolithic sheet Projected capacitive touch panel structures as claimed in claim 9, it is characterized in that, also comprise: form respectively two assistant coatings on the end face of this transparency carrier and on the bottom surface of this insulation course, wherein each assistant coating comprises a blooming and a blow-out disc, and together with this blooming is stacked each other on this blow-out disc.

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