CN102674363A - Double-layer structure of inner container of energy-saving type polysilicon reduction furnace and implementation method for double-layer structure - Google Patents
Double-layer structure of inner container of energy-saving type polysilicon reduction furnace and implementation method for double-layer structure Download PDFInfo
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 53
- 229920005591 polysilicon Polymers 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 13
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000005052 trichlorosilane Substances 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 37
- 238000006243 chemical reaction Methods 0.000 abstract description 13
- 239000000498 cooling water Substances 0.000 abstract description 11
- 229910052710 silicon Inorganic materials 0.000 abstract description 8
- 239000010703 silicon Substances 0.000 abstract description 8
- 239000011863 silicon-based powder Substances 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000006722 reduction reaction Methods 0.000 description 66
- 239000007789 gas Substances 0.000 description 18
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 4
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- ASQUUIVTXSTILE-UHFFFAOYSA-N chlorosilane trichlorosilane Chemical compound Cl[SiH](Cl)Cl.Cl[SiH3] ASQUUIVTXSTILE-UHFFFAOYSA-N 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明公开一种节能型多晶硅还原炉的内胆双层结构及其实施方法,多晶硅还原炉内胆包括内壁和外壁两层结构,内壁和外壁之间的空隙与内胆顶部底板与顶板之间的区域相连通;内壁与外壁之间空隙的宽度为5mm-50mm。多晶硅还原炉内胆的内壁与外壁之间通入高纯三氯氢硅液体,由于还原炉内的大量热量辐射到内胆的侧面,液态三氯氢硅受热挥发,挥发产生的气体流入内胆顶部底板与顶板之间的区域。内胆双层结构可以大大降低硅棒向钟罩内壁的辐射能量,钟罩内壁由于温度较低不会沉积硅粉,保持了钟罩内壁的抛光效果,还可以减少多晶硅还原炉钟罩冷却水的通入量。利用了硅棒辐射的能量使部分液态三氯氢硅变为气体参与了反应,有利于多晶硅制备过程中整体能耗的降低。
The invention discloses a double-layer structure of an inner tank of an energy-saving polysilicon reduction furnace and an implementation method thereof. The inner tank of a polysilicon reduction furnace includes a two-layer structure of an inner wall and an outer wall, and the gap between the inner wall and the outer wall is between the top bottom plate and the top plate of the inner tank. The area is connected; the width of the gap between the inner wall and the outer wall is 5mm-50mm. The high-purity trichlorosilane liquid is passed between the inner wall and the outer wall of the inner tank of the polysilicon reduction furnace. Because a large amount of heat in the reduction furnace radiates to the side of the inner tank, the liquid trichlorosilane is heated and volatilized, and the gas generated by volatilization flows into the inner tank. The area between the top base plate and the top plate. The double-layer structure of the inner tank can greatly reduce the radiation energy of the silicon rods to the inner wall of the bell jar. The inner wall of the bell jar will not deposit silicon powder due to the lower temperature, which maintains the polishing effect of the inner wall of the bell jar and can also reduce the cooling water of the bell jar of the polysilicon reduction furnace. throughput. The energy radiated by the silicon rod is used to make part of the liquid trichlorosilane into a gas to participate in the reaction, which is beneficial to the reduction of the overall energy consumption in the polysilicon preparation process.
Description
技术领域 technical field
本发明属于多晶硅生产技术领域,特别是西门子法生产多晶硅的一种节能大型多晶硅还原炉;涉及一种节能型多晶硅还原炉的内胆双层结构及其实施方法。The invention belongs to the technical field of polysilicon production, in particular to an energy-saving large-scale polysilicon reduction furnace for producing polysilicon by the Siemens method; it relates to an energy-saving polysilicon reduction furnace with a double-layer inner container structure and an implementation method thereof.
背景介绍background introduction
多晶硅在电子领域及太阳能领域有着广发的应用,目前国内外多晶硅生产企业主要采用“改良西门子法”。该方法的生产流程是利用氯气和氢气合成氯化氢(或外购氯化氢),氯化氢和硅粉在一定温度下反应生成三氯氢硅,然后对三氯氢硅进行精馏分离提纯,提纯后的高纯三氯氢硅与氢气按比例混合后,在一定的温度和压力下通入多晶硅还原炉内,在通电高温硅芯上进行沉积反应生成多晶硅,反应温度控制在1080℃~1150℃,最终生成棒状多晶硅产品,同时生成四氯化硅、二氯二氢硅、氯化氢等副产物。Polysilicon is widely used in the fields of electronics and solar energy. At present, polysilicon manufacturers at home and abroad mainly use the "improved Siemens method". The production process of this method is to use chlorine and hydrogen to synthesize hydrogen chloride (or purchased hydrogen chloride), hydrogen chloride and silicon powder react at a certain temperature to form trichlorosilane, and then carry out rectification separation and purification of trichlorosilane, and the purified high After the pure trichlorosilane and hydrogen are mixed in proportion, they are passed into the polysilicon reduction furnace at a certain temperature and pressure, and the deposition reaction is carried out on the electrified high-temperature silicon core to form polysilicon. The reaction temperature is controlled at 1080 ° C ~ 1150 ° C, and finally produces Rod-shaped polysilicon products produce by-products such as silicon tetrachloride, dichlorodihydrosilane, and hydrogen chloride at the same time.
传统多晶硅还原炉,如专利CN200420060144.8,CN200720306394.9,CN200820105591.9,CN200920230836.5,CN201020215600.7等,其进气口和出气口都分布在底盘上,这种设计的缺点是由于流场,温度场的匹配不合理,容易在还原炉顶部滞留,产生流动死区,造成局部区域的气体温度过高,产生硅粉,而这些硅粉一方面会造成原料的损失,另一方面产生的硅粉容易附着在钟罩内壁上,使得钟罩内壁的光洁度降低,造成因辐射而带走的能量飙升,最终表现为还原电耗升高;另外由于进口流体向上流动,而出口的流体向下流动,这两股逆向流动的流体使得还原炉内的流体均为混流状态,影响反应气的转化率,进一步增加了还原炉的电耗。本课题组通过在某多晶硅生产企业进行的工业实验发现,当钟罩内壁为镜面时,还原电耗会显著降低。因此本课题组提出将还原炉的节能问题转化为在多晶硅还原过程中如何始终将还原炉钟罩内壁保持在镜面状态这样一个可操作的问题。为此本课题组通过深入的理论计算,发现通过使还原炉内的气相实现平推流,可以做到还原炉内胆气相温度低于550℃,另外通过特殊的保温内胆设计,可以使内壁壁面温度低于575℃,最终使还原炉钟罩内壁始终保持在镜面状态。在以上实验和理论研究的基础上,本课题组设计了一种节能型多晶硅还原炉,并提出了该还原炉保温内胆的双层结构及其实施方法。Traditional polysilicon reduction furnaces, such as patents CN200420060144.8, CN200720306394.9, CN200820105591.9, CN200920230836.5, CN201020215600.7, etc., its air inlet and outlet are distributed on the chassis, the disadvantage of this design is due to the flow field , the matching of the temperature field is unreasonable, and it is easy to stay at the top of the reduction furnace, resulting in a flow dead zone, causing the gas temperature in the local area to be too high, and producing silicon powder. Silicon powder is easy to adhere to the inner wall of the bell jar, which reduces the smoothness of the inner wall of the bell jar, causing the energy taken away by radiation to soar, and finally manifested as an increase in reduction power consumption; in addition, because the inlet fluid flows upward, the outlet fluid flows downward. Flow, these two counter-flowing fluids make the fluid in the reduction furnace in a mixed flow state, which affects the conversion rate of the reaction gas and further increases the power consumption of the reduction furnace. Through an industrial experiment conducted in a polysilicon production enterprise, our research group found that when the inner wall of the bell jar is a mirror surface, the reduction power consumption will be significantly reduced. Therefore, this research group proposes to transform the energy-saving problem of the reduction furnace into an operational problem of how to keep the inner wall of the bell jar of the reduction furnace in a mirror state during the polysilicon reduction process. For this reason, through in-depth theoretical calculations, the research group found that by making the gas phase in the reduction furnace realize plug flow, the gas phase temperature of the inner tank of the reduction furnace can be lower than 550°C. The temperature of the wall surface is lower than 575°C, so that the inner wall of the bell jar of the reduction furnace is always kept in a mirror state. On the basis of the above experiments and theoretical research, this research group designed an energy-saving polysilicon reduction furnace, and proposed the double-layer structure and implementation method of the heat preservation inner tank of the reduction furnace.
发明内容 Contents of the invention
本发明提供了一种节能型多晶硅还原炉的内胆双层结构及其实施方法,解决了传统多晶硅还原炉钟罩内壁沉积硅粉的问题The invention provides an energy-saving polysilicon reduction furnace with a double-layer inner tank structure and its implementation method, which solves the problem of silicon powder deposited on the inner wall of the bell jar of the traditional polysilicon reduction furnace
本发明的技术方案如下:Technical scheme of the present invention is as follows:
一种节能型多晶硅还原炉的内胆双层结构,多晶硅还原炉内胆包括内壁20和外壁21两层结构,内壁20和外壁21之间的空隙与内胆顶部底板22与顶板23之间的区域相连通,在内壁20和顶部底板22连接以及外壁21和顶部顶板23连接的位置连通,内壁20与外壁21之间空隙的宽度为5mm-50mm,底板22和顶板23的间距为100mm-300mm;An energy-saving polysilicon reduction furnace with a double-layer inner tank structure. The inner tank of the polysilicon reduction furnace includes a two-layer structure of an
所述多晶硅还原炉内胆顶部的底板22与内胆的内壁20固定连接,内胆顶部的顶板23与内胆21的外壁固定连接,连接方式采用螺栓固定。The
所述多晶硅还原炉内胆的内壁20与外壁21之间通入高纯三氯氢硅液体,由于还原炉内的大量热量辐射到内胆的侧面,液态三氯氢硅受热挥发,挥发产生的气体流入内胆顶部底板22与顶板23之间的区域。The high-purity trichlorosilane liquid is passed between the
如生产中需要可以在内胆的内壁20与外壁21的空隙内安装温度探头。If required in production, a temperature probe can be installed in the gap between the
本发明具有的优点是:The advantage that the present invention has is:
首先与传统多晶硅还原炉相比,内胆双层结构可以大大降低硅棒向钟罩内壁的辐射能量,钟罩内壁由于温度较低不会沉积硅粉,保持了钟罩内壁的抛光效果,还可以减少多晶硅还原炉钟罩冷却水的通入量。First of all, compared with the traditional polysilicon reduction furnace, the double-layer structure of the inner tank can greatly reduce the radiation energy of the silicon rods to the inner wall of the bell jar. The inner wall of the bell jar will not deposit silicon powder due to the lower temperature, and the polishing effect of the inner wall of the bell jar is maintained. It can reduce the intake of cooling water for the bell jar of the polysilicon reduction furnace.
再次与传统多晶硅还原炉相比,在内胆内壁和外壁的区域内通入液态的高纯三氯氢硅,由于三氯氢硅的沸点较低,硅棒辐射到内胆侧壁的热量通过热传导加热了液态的三氯氢硅,从而使得部分液态的三氯氢硅变为气体,由于内胆的侧壁与顶部结构连通,气态的三氯氢硅进入内胆的顶部区域,再经内胆顶部的回气管进入反应区域参与反应,在内胆的侧壁通入液态三氯氢硅一方面保证了内胆的温度也不会过高,从而有利于安全生产,另一方面也利用了硅棒辐射的能量使部分液态三氯氢硅变为气体参与了反应,有利于多晶硅制备过程中整体能耗的降低。Compared with the traditional polysilicon reduction furnace again, liquid high-purity trichlorosilane is introduced into the inner wall and outer wall of the inner tank. Since the boiling point of trichlorosilane is lower, the heat radiated from the silicon rods to the side wall of the inner tank passes through The heat conduction heats the liquid trichlorosilane, so that part of the liquid trichlorosilane becomes gas. Since the side wall of the inner tank is connected with the top structure, the gaseous trichlorosilane enters the top area of the inner tank, and then passes through the inner tank. The air return pipe at the top of the tank enters the reaction area to participate in the reaction. Liquid trichlorosilane is injected into the side wall of the inner tank to ensure that the temperature of the inner tank will not be too high, which is conducive to safe production. The energy radiated by the silicon rods turns part of the liquid trichlorosilane into gas to participate in the reaction, which is beneficial to the reduction of the overall energy consumption in the polysilicon preparation process.
附图说明 Description of drawings
图1为本发明专利一种节能型多晶硅还原炉主视图;Fig. 1 is a front view of an energy-saving polysilicon reduction furnace of the patent of the present invention;
图2为本发明专利一种节能型多晶硅还原炉的内胆双层结构示意图;Figure 2 is a schematic diagram of the double-layer structure of the inner tank of an energy-saving polysilicon reduction furnace of the patent of the present invention;
其中:1-还原炉钟罩,2-保温内胆,3-硅芯,4-底盘,5-底盘进气管,6-底盘出气管,7-电极,8-石墨夹套,9-炉体冷却水进口,10-炉体冷却水出口,11-底盘进气控制装置,12-底盘排液管,13-底盘液态三氯氢硅进口管,14-内胆顶部液态三氯氢硅进口管,15-内胆侧壁液态三氯氢硅进口管,16-底盘冷却气盒,17-内胆顶部出气管,18-内胆顶部回气管,19-底盘排气控制装置,20-内胆的内壁,21-内胆的外壁,22-内胆顶部底板,23-内胆顶部顶板。Among them: 1-reduction furnace bell jar, 2-insulation liner, 3-silicon core, 4-chassis, 5-chassis inlet pipe, 6-chassis outlet pipe, 7-electrode, 8-graphite jacket, 9-furnace body Cooling water inlet, 10-cooling water outlet of the furnace body, 11-chassis air intake control device, 12-chassis drain pipe, 13-chassis liquid trichlorosilane inlet pipe, 14-liquid trichlorosilane inlet pipe at the top of the liner , 15- liquid trichlorosilane inlet pipe on the side wall of the inner tank, 16- chassis cooling air box, 17- air outlet pipe on the top of the inner tank, 18- return air pipe on the top of the inner tank, 19- chassis exhaust control device, 20- inner tank The inner wall of the inner container, the outer wall of the 21-inner container, the top bottom plate of the 22-inner container, and the top top plate of the 23-inner container.
具体实施方式 Detailed ways
下面结合附图和具体实施方式对本发明提供的一种装有底盘冷却装置的多晶硅还原炉作进一步详细说明。A polysilicon reduction furnace equipped with a chassis cooling device provided by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
如图1所示,还原炉钟罩1固定到还原炉底盘4上并密封,硅芯3通过石墨夹套8与底盘电极7相连接并密封,底盘电极7固定到还原炉底盘4且密封,并与供电系统相连接;底盘进气控制装置11与底盘进气管5相连接,底盘排气控制装置19与底盘出气管6相连接。液态三氯氢硅通过底盘液态三氯氢硅进口管13进入多晶硅还原炉底盘冷却气盒16,液态三氯氢硅通过内胆顶部液态三氯氢硅进口管14进入多晶硅还原炉顶部,液态三氯氢硅通过内胆侧壁液态三氯氢硅进口管15进入多晶硅还原炉内胆侧壁,还原炉底盘4、还原炉钟罩1分别通过底盘冷却水进口和炉体冷却水入口通入冷却水,且底盘冷却水出口和炉体冷却水出口分别与需热系统相连接。As shown in Figure 1, the reduction furnace bell jar 1 is fixed on the reduction furnace chassis 4 and sealed, the silicon core 3 is connected and sealed with the chassis electrode 7 through the graphite jacket 8, and the chassis electrode 7 is fixed to the reduction furnace chassis 4 and sealed, And be connected with the power supply system; The liquid trichlorosilane enters the chassis cooling gas box 16 of the polysilicon reduction furnace through the liquid trichlorosilane inlet pipe 13 of the chassis, and the liquid trichlorosilane enters the top of the polysilicon reduction furnace through the liquid trichlorosilane inlet pipe 14 at the top of the liner, and the liquid trichlorosilane Chlorosilane enters the polysilicon reduction furnace liner side wall through the liquid trichlorosilane inlet pipe 15 on the side wall of the inner tank, and the reduction furnace chassis 4 and the reduction furnace bell jar 1 pass through the cooling water inlet of the chassis and the cooling water inlet of the furnace body respectively. Water, and the chassis cooling water outlet and the furnace body cooling water outlet are respectively connected to the heat-requiring system.
实施例1:新型多晶硅还原炉的操作流程1:Embodiment 1: Operation process 1 of the novel polysilicon reduction furnace:
(1)首先开启底盘进气控制装置11以及底盘排气控制装置19;(1) First turn on the chassis air intake control device 11 and the chassis exhaust control device 19;
(2)其次在还原炉的炉体、还原炉底盘同时通入冷却水,将液态三氯氢硅通过内胆侧壁液态三氯氢硅进口管15通入多晶硅还原炉内胆侧壁,内胆内壁和内胆外壁之间的空隙宽度为5mm,底板22和顶板23的间距为100mm;(2) Next, cooling water is introduced into the body of the reduction furnace and the chassis of the reduction furnace at the same time, and the liquid trichlorosilane is passed into the side wall of the inner tank of the polysilicon reduction furnace through the liquid trichlorosilane inlet pipe 15 on the side wall of the inner tank. The gap width between the inner wall of the liner and the outer wall of the liner is 5 mm, and the distance between the
(3)再将提纯的SiHCl3与H2按一定比例混合,然后将混合气从底盘进气管5通入多晶硅还原炉;(3) Mix the purified SiHCl 3 and H 2 in a certain proportion, and then pass the mixed gas into the polysilicon reduction furnace from the chassis intake pipe 5;
(4)启动还原炉的供电系统对硅芯加热,并保持硅芯的温度在1150℃,还原炉内压力为0.8Mpa。当硅芯表面的温度达到SiHCl3与H2反应的条件时,混合气开始发生还原反应,并且反应后的硅将沉积到硅芯上,通过温度探头测温发现多晶硅还原炉钟罩内壁的温度始终低于550℃;(4) Start the power supply system of the reduction furnace to heat the silicon core, and keep the temperature of the silicon core at 1150°C, and the pressure in the reduction furnace is 0.8Mpa. When the temperature of the surface of the silicon core reaches the conditions for the reaction of SiHCl 3 and H 2 , the mixed gas begins to undergo a reduction reaction, and the reacted silicon will be deposited on the silicon core, and the temperature of the inner wall of the bell jar of the polysilicon reduction furnace can be found by measuring the temperature with a temperature probe Always below 550°C;
(5)反应后的尾气经底盘出气管6排出,尾气的温度控制在350℃±20,直到硅芯的直径生长到200mm以上时,停止供电,并等到硅芯冷却后,取出硅芯,通过估算节能15%左右。(5) The exhaust gas after the reaction is discharged through the chassis outlet pipe 6, and the temperature of the exhaust gas is controlled at 350 ° C ± 20. When the diameter of the silicon core grows to more than 200 mm, stop power supply, and wait until the silicon core cools down, take out the silicon core, and pass It is estimated that the energy saving is about 15%.
实施例2:新型多晶硅还原炉的操作流程2:Embodiment 2: Operation process 2 of the novel polysilicon reduction furnace:
(1)首先开启底盘进气控制装置11以及底盘排气控制装置19;(1) First turn on the chassis air intake control device 11 and the chassis exhaust control device 19;
(2)其次在还原炉的炉体、还原炉底盘同时通入冷却水,将液态三氯氢硅通过内胆侧壁液态三氯氢硅进口管15通入多晶硅还原炉内胆侧壁,内胆内壁和内胆外壁之间的空隙宽度为25mm,底板22和顶板23的间距为200mm;(2) Next, cooling water is introduced into the body of the reduction furnace and the chassis of the reduction furnace at the same time, and the liquid trichlorosilane is passed into the side wall of the inner tank of the polysilicon reduction furnace through the liquid trichlorosilane inlet pipe 15 on the side wall of the inner tank. The gap width between the inner wall of the liner and the outer wall of the liner is 25mm, and the distance between the
(3)再将提纯的SiHCl3与H2按一定比例混合,然后将混合气从底盘进气管5通入多晶硅还原炉;(3) Mix the purified SiHCl 3 and H 2 in a certain proportion, and then pass the mixed gas into the polysilicon reduction furnace from the chassis intake pipe 5;
(4)启动还原炉的供电系统对硅芯加热,并保持硅芯的温度在1150℃,还原炉内压力为0.8Mpa。当硅芯表面的温度达到SiHCl3与H2反应的条件时,混合气开始发生还原反应,并且反应后的硅将沉积到硅芯上,通过温度探头测温发现多晶硅还原炉钟罩内壁的温度始终低于475℃;(4) Start the power supply system of the reduction furnace to heat the silicon core, and keep the temperature of the silicon core at 1150°C, and the pressure in the reduction furnace is 0.8Mpa. When the temperature of the surface of the silicon core reaches the conditions for the reaction of SiHCl 3 and H 2 , the mixed gas begins to undergo a reduction reaction, and the reacted silicon will be deposited on the silicon core, and the temperature of the inner wall of the bell jar of the polysilicon reduction furnace can be found by measuring the temperature with a temperature probe Always below 475°C;
(5)反应后的尾气经底盘出气管6排出,尾气的温度控制在330℃±20,直到硅芯的直径生长到200mm以上时,停止供电,并等到硅芯冷却后,取出硅芯,通过估算节能17%左右。(5) The exhaust gas after the reaction is discharged through the chassis outlet pipe 6, and the temperature of the exhaust gas is controlled at 330°C±20°C. When the diameter of the silicon core grows to more than 200mm, stop the power supply, and wait until the silicon core cools down, take out the silicon core, and pass It is estimated that the energy saving is about 17%.
实施例3:新型多晶硅还原炉的操作流程3:Embodiment 3: Operation process 3 of the novel polysilicon reduction furnace:
(1)首先开启底盘进气控制装置11以及底盘排气控制装置19;(1) First turn on the chassis air intake control device 11 and the chassis exhaust control device 19;
(2)其次在还原炉的炉体、还原炉底盘同时通入冷却水,将液态三氯氢硅通过内胆侧壁液态三氯氢硅进口管15通入多晶硅还原炉内胆侧壁,内胆内壁和内胆外壁之间的空隙宽度为50mm,底板22和顶板23的间距为300mm;(2) Next, cooling water is introduced into the body of the reduction furnace and the chassis of the reduction furnace at the same time, and the liquid trichlorosilane is passed into the side wall of the inner tank of the polysilicon reduction furnace through the liquid trichlorosilane inlet pipe 15 on the side wall of the inner tank. The width of the gap between the inner wall of the liner and the outer wall of the liner is 50 mm, and the distance between the
(3)再将提纯的SiHCl3与H2按一定比例混合,然后将混合气从底盘进气管5通入多晶硅还原炉;(3) Mix the purified SiHCl 3 and H 2 in a certain proportion, and then pass the mixed gas into the polysilicon reduction furnace from the chassis intake pipe 5;
(4)启动还原炉的供电系统对硅芯加热,并保持硅芯的温度在1150℃,还原炉内压力为0.8Mpa。当硅芯表面的温度达到SiHCl3与H2反应的条件时,混合气开始发生还原反应,并且反应后的硅将沉积到硅芯上,通过温度探头测温发现多晶硅还原炉钟罩内壁的温度始终低于400℃;(4) Start the power supply system of the reduction furnace to heat the silicon core, and keep the temperature of the silicon core at 1150°C, and the pressure in the reduction furnace is 0.8Mpa. When the temperature of the surface of the silicon core reaches the conditions for the reaction of SiHCl 3 and H 2 , the mixed gas begins to undergo a reduction reaction, and the reacted silicon will be deposited on the silicon core, and the temperature of the inner wall of the bell jar of the polysilicon reduction furnace can be found by measuring the temperature with a temperature probe Always below 400°C;
(5)反应后的尾气经底盘出气管6排出,尾气的温度控制在320℃±20,直到硅芯的直径生长到200mm以上时,停止供电,并等到硅芯冷却后,取出硅芯,通过估算节能18%左右。(5) The exhaust gas after the reaction is discharged through the chassis outlet pipe 6, and the temperature of the exhaust gas is controlled at 320 ° C ± 20. When the diameter of the silicon core grows to more than 200 mm, stop the power supply, and wait until the silicon core cools down, take out the silicon core, and pass It is estimated that the energy saving is about 18%.
以上所述实例仅是充分说明本发明而所举的较佳的实施例,本发明的保护范围不限于此。本技术领域的技术人员在本发明基础上所作的等同替代或变换,均在本发明的保护范围之内。本发明的保护范围以权利要求书为准。The above examples are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention. The protection scope of the present invention shall be determined by the claims.
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CN101633503A (en) * | 2009-09-01 | 2010-01-27 | 上海森松能源设备有限公司 | Double-layer air-guide heat insulation shield of polysilicon hydriding furnace |
CN102145891A (en) * | 2011-04-02 | 2011-08-10 | 天津大学 | Energy-saving furnace body of polycrystalline silicon reduction furnace |
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