CN102623801B

CN102623801B - Surface mount multi-frequency antenna module

Info

Publication number: CN102623801B
Application number: CN201110032645.XA
Authority: CN
Inventors: 杨才毅; 吴佳宗
Original assignee: Cirocomm Technology Corp
Current assignee: Cirocomm Technology Corp
Priority date: 2011-01-27
Filing date: 2011-01-27
Publication date: 2014-06-25
Anticipated expiration: 2031-01-27
Also published as: CN102623801A

Abstract

A surface mount multi-band antenna module includes: a substrate and a carrier. The substrate is provided with a first grounding metal surface and a first microstrip line, one side edge of the first grounding metal surface is connected with a second microstrip line, a space is formed between the second microstrip line and the first microstrip line, and a second grounding metal surface is arranged on the other side of the substrate. The carrier is a ceramic material with high dielectric constant, and is provided with a first radiating metal part, a second radiating metal part and a third radiating metal part. When the carrier is electrically connected with the substrate, the joint of the first radiating metal part and the second radiating metal part is electrically connected with the first microstrip line, and the third radiating metal part is electrically connected with the second microstrip line so as to form a multi-frequency antenna module.

Description

The multifrequency antenna module of surface label chip

Technical field

The present invention relates to a kind of antenna, relate in particular to a kind of multifrequency antenna module of high-gain multiband.

Background technology

Along with the development of wireless telecommunications science and technology, the portable electronic devices such as electronic product such as mobile computer, mobile phone, personal digital assistant (PDA) are are all designed and developed towards lightening.In order to receive and dispatch the antenna size relative decrease of electric wave signal, or change antenna structure kenel, can be built in the inner use of electronic product.

The multifrequency antenna of common multiband is inverted-F antenna (Planar Inverted-F Antenna, PIFA) on the market at present.This antenna has adopted simple two-dimensional design, directly process for copper is imprinted on printed circuit board (PCB) by printed circuit board (PCB) (PCB) manufacturing process, to form the multifrequency antenna of a tabular multiband, or utilize stamping technology sheet metal punching press formation one to be there is to the multifrequency antenna of three dimensional design.

Because PIFA antenna structure can change the antenna geometry on printed circuit board (PCB) two dimension or sheet metal, to reach the even above transmitting-receiving effect of three frequencies of double frequency.But in order to meet signal transmitting and receiving quality, and the impact of avoiding surrounding environment causes its frequency coordination misalignment, therefore the antenna of this printed circuit board (PCB) or the drawing of sheet metal institute certainly will have a certain size volume, for install this PIFA antenna structure should and electronic installation inside also must be reserved a suitable space and settles this PIFA antenna structure, certainly will run counter to thus the demand of electronic installation towards compact Miniaturization Design.

Summary of the invention

Therefore, main purpose of the present invention, be to solve traditional disappearance, be located on the ceramic monolith of ceramic material one-tenth of this high-k, to form a multifrequency antenna that can directly carry out the high efficiency multiband of surface mount engineering so provide a kind of metal pattern by the multifrequency antenna of multiband to carry.Also form the built-in multifrequency antenna that can surface label chip of a compact miniaturization simultaneously.

For reaching above-mentioned object, the invention provides a kind of multifrequency antenna module of surface label chip, include:

One substrate, there is a first surface and second surface, on this first surface, there is one first grounding metal plane and one first microstrip line, on this first microstrip line one end, there is a perforation, this first microstrip line with the segment section of perforation extends in this first grounding metal plane, and and this first grounding metal plane between form a gap, one side of this first grounding metal plane is connected with one second microstrip line, it is arranged side by side that this second microstrip line and this first microstrip line other end are parallel relation, between this first microstrip line and this second microstrip line, has a spacing; Separately, on this first surface, there are one group of two corresponding fixed contact, and on this second surface, there is one second grounding metal plane;

One carrier, make a cuboid with the ceramic material of high-k, on it, there is the first radiation metal portion, the second radiation metal portion and the 3rd radiation metal portion, this the first radiation metal portion, the second radiation metal portion and the 3rd radiation metal portion are with not identical rectangular metal pattern and vertical element metal pattern composition, and be located at this carrier at least one or two more than surface, this the first radiation metal portion and this second radiation metal portion are electric connection, and this first radiation metal portion and the second radiation metal portion and the 3rd radiation metal portion are electrically connected;

Wherein, when this carrier is connected with this electrical property of substrate, two fixed contacts on the first surface of this first radiation metal portion and this second radiation metal portion and this substrate are electrically connected, this carrier can be fixed on the first surface of this substrate, this the first radiation metal portion and this second radiation metal portion junction and this first microstrip line are electrically connected, the 3rd radiation metal portion and this second microstrip line are electrically connected, to be combined into a multifrequency antenna module.

The present invention is carried the metal pattern of the multifrequency antenna of multiband on the ceramic monolith of ceramic material one-tenth of being located at this high-k, to form a multifrequency antenna that can directly carry out the high efficiency multiband of surface mount engineering.Also form the built-in multifrequency antenna that can surface label chip of a compact miniaturization simultaneously.

Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.

Accompanying drawing explanation

Fig. 1 multifrequency antenna module decomposing schematic representation of the present invention;

The decomposing schematic representation at another visual angle of Fig. 2 multifrequency antenna module of the present invention;

The decomposing schematic representation at the another visual angle of Fig. 3 multifrequency antenna module of the present invention;

Fig. 4 multifrequency antenna module stereoscopic of the present invention schematic diagram;

The conspectus of Fig. 5 multifrequency antenna module circuit of the present invention;

The use view of Fig. 6 multifrequency antenna module of the present invention;

Fig. 7 is the side cross-sectional schematic of Fig. 6;

Fig. 8 a frequency response curve schematic diagram of the present invention (one);

Fig. 8 b frequency response curve schematic diagram of the present invention (two).

Wherein, Reference numeral

Substrate 1

First surface 11

Second surface 12

The first grounding metal plane 13

The first microstrip line 14

Leading portion 141

Back segment 142

Perforation 143

Gap 15

The second microstrip line 16

Spacing 17

Fixed contact 18

The second grounding metal plane 19

Carrier 2

The first radiation metal portion 21

The second radiation metal portion 22

The 3rd radiation metal portion 23

Signal source 3

Connector 4

Signal feed-in probe 41

Housing 42

Screw thread 43

Coaxial cable line 5

Joint 51

Embodiment

Hereby relevant the technical content and a detailed description, now coordinate accompanying drawing to be described as follows:

Refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4, decomposition and the stereoscopic schematic diagram at multifrequency antenna module decomposition of the present invention, the decomposition at another visual angle, another visual angle.As shown in the figure: the multifrequency antenna module of a kind of surface label chip of the present invention, includes: a substrate 1 and a carrier 2.

This substrate 1, has a first surface 11 and second surface 12.On this first surface 11, there is one first grounding metal plane 13 and one first microstrip line 14, these the first microstrip line 14 tool one leading portion 141 and back segments 142, on this leading portion 141, there is a perforation 143, the leading portion 141 of this first microstrip line 14 extends in this first grounding metal plane 13, and and this first grounding metal plane 13 between form a gap 15.One side of this first grounding metal plane 13 is connected with one second microstrip line 16, it is arranged side by side that the back segment 142 of this second microstrip line 16 and this first microstrip line 14 is parallel relation, and there is a spacing 17 between the back segment 142 of this first microstrip line 14 and this second microstrip line 16, spacing 17 width that form between the back segment 142 of this first microstrip line 14 and the second microstrip line 16, can adjust coupling capacitance, make the first grounding metal plane 13 can form the resonance point of high frequency, use the use that increases frequency range.Separately, have one group of two corresponding fixed contact 18 on this first surface 11, this two fixed contact 18 is in order to affixed this carrier 2.On this second surface 12, have again one second grounding metal plane 19, this second grounding metal plane 19 is that confession is electrically connected with the grounding parts (not shown) of the joint of coaxial cable line.

This carrier 2, is to make a cuboid with the ceramic material of high-k, has the first radiation metal portion 21, the second radiation metal portion 22 and the 3rd radiation metal portion 23 on it.This first radiation metal portion 21, the second radiation metal portion 22 and the 3rd radiation metal portion 23 be located at this carrier 2 with not identical rectangular metal pattern and vertical element metal pattern at least one or two more than surface, make the volume of antenna with microminiaturization.This first radiation metal portion 21 is electric connection with this second radiation metal portion 22, this the first radiation metal portion 21 and the second radiation metal portion 22 are not electrically connected (, this first radiation metal portion 21 and the second radiation metal portion 22 are insulation with the 3rd radiation metal portion 23) with the 3rd radiation metal portion 23.In the time that this carrier 2 is electrically connected with this substrate 1, two fixed contacts 18 on the first surface 11 of this first radiation metal portion 21 and this second radiation metal portion 22 and this substrate 1 are electrically connected, and this carrier 2 can be fixed on the first surface 11 of this substrate 1.And junction and this first microstrip line 14 of this first radiation metal portion 21 and this second radiation metal portion 22 are electrically connected, the 3rd radiation metal portion 23 is electrically connected with this second microstrip line 16, to be combined into a multifrequency antenna module.

Refer to Fig. 4, Fig. 5, the conspectus of multifrequency antenna module stereoscopic of the present invention and circuit.As shown in the figure: after this first radiation metal portion 21 and this second

radiation metal portion

22 and 14 electric connections of this first microstrip line, form the first antenna with this first radiation metal portion 21, this the second radiation metal portion 22 forms the second antenna, and the 3rd radiation metal portion 23 and this second microstrip line 16 form the multifrequency antenna module of the multiband of third antenna.

After signal source 3 is inputted by the first microstrip line 14, flow through this first radiation metal portion 21 and the second radiation metal portion 22 form the structure of low-and high-frequency branch resonance.Spacing 17 width to be formed between this first microstrip line 14 and this second microstrip line 16, can adjust coupling capacitance again, make the first grounding metal plane 13 can form the resonance point of high frequency, use the use that increases frequency range.

Refer to Fig. 6, Fig. 7, the use state of multifrequency antenna module of the present invention and the side cross-sectional schematic of Fig. 6.As shown in the figure: in the time that the present invention uses, the perforation 143 by the signal feed-in probe 41 of the connector 4 of connection coaxial cable line 5 through this first microstrip line 14, is electrically connected with this first microstrip line 14.Housing 42 and this second grounding metal plane 19 of this connector 4 are electrically connected.

In the time that multifrequency antenna module uses, by the joint of coaxial cable line 5 51 interlockings on the screw thread 43 of the housing 42 of this connector 4, and accept the signal of different frequency range by the first radiation metal portion 21, the second radiation metal portion 22 and the 3rd radiation metal portion 23, to reach the multifrequency antenna module can multiband using.

Refer to Fig. 8 a～Fig. 8 b, frequency response curve schematic diagram of the present invention (), (two) and refer to the frequency response table that table one is Fig. 8 a and Fig. 8 b.As shown in Fig. 8 a, Fig. 8 b and table one: when multifrequency antenna module of the present invention is during at 700MHZ, the reflection loss (Return Loss) of this antenna is-3.98, and standing-wave ratio (SWR) is 4.20.

When multifrequency antenna module of the present invention is during at 824MHZ, the reflection loss of this antenna is-11.66, and standing-wave ratio is 1.73.

When multifrequency antenna module of the present invention is during at 960MHZ, the reflection loss of this antenna is-5.57, and standing-wave ratio is 3.02.

When multifrequency antenna module of the present invention is during at 1710MHZ, the reflection loss of this antenna is-10.39, and standing-wave ratio is 1.76.

When multifrequency antenna module of the present invention is during at 2170MHZ, the reflection loss of this antenna is-6.38, and standing-wave ratio is 2.88.

Table one

?	700MHz	824MHz	960MHz	1710MHz	2170MHz
						Reflection loss (Reture Loss)	-3.98	-11.66	-5.57	-10.39	-6.38
Standing-wave ratio (SWR)	4.20	1.73	3.02	1.76	2.88

Table two

Refer to table two, the peak gain parameter declaration (LTE ANTENNA Peak Gain Parameter Summary) of long-term evolution antenna of the present invention.As shown in Table 2: therefore, multifrequency antenna module of the present invention can provide the antenna module structure of current long-term evolution antenna (LONG TERM EVOLUTION ANTENNA, LTE ANTENNA) technology and the required compact small multi-frequency section high efficiency built-in SMD (SMT) of the 4th generation communication system.And this multiband has been contained 700～960MHZ and 1710～2170MHZ etc., for LTE, global system for mobile communications (Global System for Mobile Communications, GSM), digital communication system (Digital Communications System, DCS), person communication system (Personal Communication System, PCS), the system frequency range such as broadband code division multiple access (Wideband Code Division Multiple Access, WCDMA) is required.

Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.

Claims

1. A multi-frequency antenna module of surface mount type, is characterized in that, comprises:

A substrate having a first surface and a second surface on it, a set of two corresponding fixed contacts on the first surface, a first ground metal plane and a first microstrip line on the first surface, The first microstrip line has a front section and a rear section, the front section has a through hole, the front section extends in the first ground metal plane and forms a gap with the first ground metal plane, the first ground metal plane One side of the metal surface is connected with a second microstrip line, the second microstrip line and the first microstrip line are parallel and arranged in parallel, and there is a gap between the first microstrip line and the second microstrip line Spacing, the formed spacing width is used to adjust the coupling capacitance value, so that the first grounding metal surface can form a high-frequency resonance point;

A carrier with a first radiating metal part, a second radiating metal part and a third radiating metal part, the first radiating metal part is electrically connected to the second radiating metal part, the first radiating metal part and the second radiating metal part The second radiating metal part is insulated from the third radiating metal part, and the first radiating metal part and the second radiating metal part of the carrier are fixedly connected to the two fixed contacts;

Wherein, when the carrier is electrically connected to the substrate, the joint where the first radiating metal part and the second radiating metal part are electrically connected is electrically connected to the first microstrip line, and the third radiating metal part is electrically connected to the first microstrip line. The second microstrip line is electrically connected to form a multi-band multi-frequency antenna module.

2 . The surface mount type multi-frequency antenna module according to claim 1 , wherein the second surface has a second ground metal plane. 3 .

3. The surface mount type multi-frequency antenna module according to claim 2, wherein the carrier is made of a high dielectric constant ceramic material into a cuboid.

4. The surface mount type multi-frequency antenna module according to claim 3, characterized in that, the first radiating metal part, the second radiating metal part and the third radiating metal part respectively use a rectangular metal pattern and The linear metal pattern is formed and arranged on the carrier.

5 . The surface mount type multi-frequency antenna module according to claim 4 , wherein the rectangular metal pattern and the linear metal pattern are disposed on at least one surface of the carrier.

6. The multi-frequency antenna module of surface mount type according to claim 5, characterized in that, it also has a connector, the connector has a housing, a signal feed-in probe is arranged in the housing, the signal feed-in probe The input probe passes through the through hole of the first microstrip line and is electrically connected with the first microstrip line.