CN102622064A - Mobile arithmetic device - Google Patents
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 69
- 238000010438 heat treatment Methods 0.000 claims abstract description 37
- 238000001816 cooling Methods 0.000 claims description 27
- 230000000694 effects Effects 0.000 abstract description 10
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 230000020169 heat generation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
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Abstract
Description
技术领域 technical field
本发明涉及一种移动运算装置,特别涉及一种具有多散热风扇的移动运算装置。The invention relates to a mobile computing device, in particular to a mobile computing device with multiple cooling fans.
背景技术 Background technique
随着科技的不断进步,现代人的日常生活用品,皆朝着数字化及信息化发展。以移动运算装置为例,如笔记型计算机、平板型计算机等,具有方便使用者携带的优点,以令使用者能够不限场合的自由使用。With the continuous advancement of science and technology, the daily necessities of modern people are all developing towards digitization and informationization. Take mobile computing devices as an example, such as notebook computers, tablet computers, etc., which are convenient for users to carry, so that users can freely use them in any occasion.
然而,在科技发展的趋势下,研发人员致力于使移动运算装置不断朝着高效能以及轻薄短小的体积的目标前进。因此,移动运算装置的散热结构就显得格外的重要。请参照图1A及图1B,图1A是为现有移动运算装置的结构示意图,图1B是为现有移动运算装置的结构透视图。However, under the trend of technological development, researchers are committed to making mobile computing devices continuously move towards the goal of high performance and small size. Therefore, the heat dissipation structure of the mobile computing device is particularly important. Please refer to FIG. 1A and FIG. 1B , FIG. 1A is a schematic structural diagram of a conventional mobile computing device, and FIG. 1B is a perspective view of a conventional mobile computing device.
现有移动运算装置具有一壳体100′、一电路板200′、一第一散热模块300′、一第二散热模块400′、一第一离心式风扇500′及一第二离心式风扇600′,其中壳体100′包含彼此相对的一顶板110′、一底板120′以及将底板120′连接于顶板110′的一侧板130′。侧板130′具有一第一贯通孔131′及一第二贯通孔132′,底板120′具有多个通气孔121′。The existing mobile computing device has a casing 100', a circuit board 200', a first cooling module 300', a second cooling module 400', a first centrifugal fan 500' and a second centrifugal fan 600 ', wherein the casing 100' includes a top plate 110', a bottom plate 120' opposite to each other, and a side plate 130' connecting the bottom plate 120' to the top plate 110'. The side plate 130' has a first through hole 131' and a second through hole 132', and the bottom plate 120' has a plurality of ventilation holes 121'.
电路板200′设置于壳体100′内,电路板200′具有一中央处理单元11′、一绘图芯片12′及一记忆体13′。此外,第一离心式风扇500′与第二离心式风扇600′设置于电路板200′上,其中第一离心式风扇500′邻近第一贯通孔131′,第二离心式风扇600′邻近第二贯通孔132′。第一散热模块300′的一端与中央处理单元11′热接触(thermal contact),第一散热模块300′的另一端介于第一离心式风扇500′与第一贯通孔131′之间。第一散热模块300′吸收中央处理单元11′所产生的热能,并通过第一离心式风扇500′所产生的气流以将第一散热模块300′所吸收的热能经由第一贯通孔131′排出壳体100′外。The circuit board 200' is disposed in the casing 100', and the circuit board 200' has a central processing unit 11', a graphics chip 12' and a memory 13'. In addition, the first centrifugal fan 500' and the second centrifugal fan 600' are disposed on the circuit board 200', wherein the first centrifugal fan 500' is adjacent to the first through hole 131', and the second centrifugal fan 600' is adjacent to the second through hole 131'. Two through holes 132'. One end of the first heat dissipation module 300' is in thermal contact with the central processing unit 11', and the other end of the first heat dissipation module 300' is interposed between the first centrifugal fan 500' and the first through hole 131'. The first heat dissipation module 300' absorbs the heat energy generated by the central processing unit 11', and discharges the heat energy absorbed by the first heat dissipation module 300' through the first through hole 131' through the airflow generated by the first centrifugal fan 500' Out of the housing 100'.
第二散热模块400′的一端同时与中央处理单元11′及绘图芯片12′热接触,第二散热模块400′的另一端介于第二离心式风扇600′与第二贯通孔132′之间。第二散热模块400′吸收中央处理单元11′及绘图芯片12′所产生的热能,并通过第二离心式风扇600′所产生的气流以将第二散热模块400′所吸收的热能经由第二贯通孔132′排出壳体100′外。One end of the second heat dissipation module 400' is in thermal contact with the central processing unit 11' and the graphics chip 12' at the same time, and the other end of the second heat dissipation module 400' is interposed between the second centrifugal fan 600' and the second through hole 132' . The second heat dissipation module 400' absorbs the heat energy generated by the central processing unit 11' and the graphics chip 12', and passes the airflow generated by the second centrifugal fan 600' to pass the heat energy absorbed by the second heat dissipation module 400' through the second heat dissipation module 400'. The through hole 132' discharges out of the casing 100'.
上述第一离心式风扇500′与第二离心式风扇600′所产生的气流路径,是由多个通气孔121′将外界空气吸入壳体100′内,之后朝第一离心式风扇500′与第二离心式风扇600′移动,接着被第一离心式风扇500′与第二离心式风扇600′所排出的空气经由第一贯通孔131′及第二贯通孔132′流出壳体100′外。The air flow path generated by the first centrifugal fan 500' and the second centrifugal fan 600' is that the air from the outside is sucked into the housing 100' by a plurality of ventilation holes 121', and then flows toward the first centrifugal fan 500' and the first centrifugal fan 500'. The second centrifugal fan 600' moves, and then the air discharged by the first centrifugal fan 500' and the second centrifugal fan 600' flows out of the casing 100' through the first through hole 131' and the second through hole 132' .
然而,此现有移动运算装置的散热结构仅能针对中央处理单元11′及绘图芯片12′进行散热。至于介于第一离心式风扇500′与第二离心式风扇600′之间的记忆体13′则散热效果不佳,而这是由于记忆体13′所处的位置缺乏甚至没有气流路径通过,因此记忆体13′的热能将不易散除。如此一来,将使得记忆体13′以及记忆体13′周围的空气的温度不断上升,造成移动运算装置的系统容易死机,甚至造成记忆体13′的毁损。However, the heat dissipation structure of the existing mobile computing device can only dissipate heat for the central processing unit 11' and the graphics chip 12'. As for the memory 13' between the first centrifugal fan 500' and the second centrifugal fan 600', the heat dissipation effect is not good, and this is because the position of the memory 13' lacks or even has no airflow path to pass through, Therefore, the thermal energy of the memory 13' will not be easily dissipated. In this way, the temperature of the
此外,第一离心式风扇500′与第二离心式风扇600′是分别独立与这些通气孔121′形成气流路径,因此未在这些气流路径上的发热元件便容易累积热量于邻近的底板,使得局部的底板温度过高。In addition, the first centrifugal fan 500' and the second centrifugal fan 600' independently form airflow paths with the vent holes 121', so the heat-generating elements that are not on these airflow paths tend to accumulate heat on the adjacent bottom plate, making Local base plate temperature is too high.
发明内容 Contents of the invention
鉴于以上的问题,本发明的目的在于提供一种移动运算装置,藉以解决现有移动运算装置的双风扇配置型态的散热效果不显著,造成移动运算装置的系统容易过热而造成死机的问题。In view of the above problems, the object of the present invention is to provide a mobile computing device, so as to solve the problem that the cooling effect of the dual-fan configuration of the existing mobile computing device is not significant, causing the system of the mobile computing device to easily overheat and cause the system to crash.
本发明所揭露的移动运算装置,其包括一壳体、一电路板、一第一散热模块、一排气用离心式风扇及一对流用离心式风扇。其中,壳体包括彼此相对的一顶板、一底板以及连接底板与顶板的一侧板,侧板具有一第一贯通孔。电路板位于顶板、底板以及侧板之间,电路板具有一第一发热装置。第一散热模块具有一第一吸热端以及一第一散热端,第一吸热端与第一发热装置热接触。排气用离心式风扇具有一第一排气口,第一散热端介于第一排气口与第一贯通孔之间,以使排气用离心式风扇排气至壳体外部。此外,对流用离心式风扇配置于壳体内,并朝向一第一方向排气,以使对流用离心式风扇排气至壳体内部。The mobile computing device disclosed in the present invention includes a casing, a circuit board, a first heat dissipation module, a centrifugal fan for exhaust and a centrifugal fan for convection. Wherein, the housing includes a top plate, a bottom plate and a side plate connecting the bottom plate and the top plate opposite to each other, and the side plate has a first through hole. The circuit board is located between the top board, the bottom board and the side boards, and the circuit board has a first heating device. The first heat dissipation module has a first heat absorption end and a first heat dissipation end, and the first heat absorption end is in thermal contact with the first heat generating device. The exhaust centrifugal fan has a first exhaust port, and the first cooling end is located between the first exhaust port and the first through hole, so that the exhaust centrifugal fan exhausts to the outside of the casing. In addition, the centrifugal fan for convection is disposed in the housing and exhausts air toward a first direction, so that the centrifugal fan for convection exhausts air into the housing.
本发明所揭露的移动运算装置,其包括一壳体、一电路板、一第一散热模块、一有罩体离心式风扇及一无罩体离心式风扇。其中,壳体包括彼此相对的一顶板、一底板以及连接底板与顶板的一侧板,侧板具有一第一贯通孔。电路板位于顶板、底板以及侧板之间,电路板具有一第一发热装置。第一散热模块具有一第一吸热端以及一第一散热端,第一吸热端与第一发热装置热接触(thermal contact)。有罩体离心式风扇具有一第一排气口,第一散热端介于第一排气口与第一贯通孔之间,以使有罩体离心式风扇排气至该壳体外部。无罩体离心式风扇配置于壳体内,无罩体离心式风扇包括一第二底座、一第二离心式扇叶及一第二马达。其中,第二离心式扇叶位于第二底座上。第二马达连接第二离心式扇叶,并且位于第二离心式扇叶与第二底座之间。其中第二离心式扇叶所产生的部分气流是朝向一第一方向流动,以使无罩体离心式风扇排气至壳体内部。The mobile computing device disclosed in the present invention includes a shell, a circuit board, a first heat dissipation module, a centrifugal fan with a cover and a centrifugal fan without a cover. Wherein, the housing includes a top plate, a bottom plate and a side plate connecting the bottom plate and the top plate opposite to each other, and the side plate has a first through hole. The circuit board is located between the top board, the bottom board and the side boards, and the circuit board has a first heating device. The first heat dissipation module has a first heat-absorbing end and a first heat-dissipating end, and the first heat-absorbing end is in thermal contact with the first heat generating device. The centrifugal fan with a cover body has a first exhaust port, and the first cooling end is interposed between the first exhaust port and the first through hole, so that the centrifugal fan with a cover body exhausts air to the outside of the casing. The centrifugal fan without a cover body is arranged in the casing, and the centrifugal fan without a cover body includes a second base, a second centrifugal fan blade and a second motor. Wherein, the second centrifugal fan blade is located on the second base. The second motor is connected to the second centrifugal fan blade and is located between the second centrifugal fan blade and the second base. Part of the airflow generated by the second centrifugal fan blade flows toward a first direction, so that the centrifugal fan without a cover body exhausts air into the casing.
本发明所揭露的移动运算装置,其包括一壳体、一电路板、一第一散热模块、一有罩体离心式风扇及一无罩体离心式风扇。壳体包括彼此相对的一顶板、一底板以及连接底板与顶板的一侧板,侧板具有一第一贯通孔。电路板位于顶板、底板以及侧板之间,电路板具有一第一发热装置。第一散热模块具有一第一吸热端以及一第一散热端,第一吸热端与第一发热装置热接触。有罩体离心式风扇具有一第一排气口,第一散热端介于第一排气口与第一贯通孔之间,以使有罩体离心式风扇排气至壳体外部。无罩体离心式风扇配置于壳体内,无罩体离心式风扇基本上由一第二底座、一第二离心式扇叶及一第二马达所组成。其中,第二离心式扇叶位于第二底座上。第二马达连接第二离心式扇叶,并且位于第二离心式扇叶与第二底座之间。其中,第二离心式扇叶所产生的部分气流是朝向一第一方向流动,以使无罩体离心式风扇排气至壳体内部。The mobile computing device disclosed in the present invention includes a shell, a circuit board, a first heat dissipation module, a centrifugal fan with a cover and a centrifugal fan without a cover. The casing includes a top plate, a bottom plate and a side plate connecting the bottom plate and the top plate opposite to each other, and the side plate has a first through hole. The circuit board is located between the top board, the bottom board and the side boards, and the circuit board has a first heating device. The first heat dissipation module has a first heat absorption end and a first heat dissipation end, and the first heat absorption end is in thermal contact with the first heat generating device. The centrifugal fan with a cover body has a first exhaust port, and the first cooling end is located between the first exhaust port and the first through hole, so that the centrifugal fan with a cover body exhausts air to the outside of the casing. The centrifugal fan without a cover is arranged in the shell, and the centrifugal fan without a cover is basically composed of a second base, a second centrifugal blade and a second motor. Wherein, the second centrifugal fan blade is located on the second base. The second motor is connected to the second centrifugal fan blade and is located between the second centrifugal fan blade and the second base. Wherein, part of the airflow generated by the second centrifugal fan blade flows toward a first direction, so that the centrifugal fan without a cover body exhausts air into the casing.
根据上述本发明所揭露的移动运算装置,本发明是通过对流用离心式风扇朝向壳体内排气,使移动运算装置内部产生强制对流,进而使移动运算装置内的热空气不会停滞于一特定区域。如此一来,由于位于此特定区域的热空气持续地被来自于其它区域的冷空气取代,因此相较于现有技术而言,位于此特定区域的电子元件能够在较低的工作温度下运作。所以这样的移动运算装置,具有较现有移动运算装置更好的散热功效,使移动运算装置的整体系统稳定度更佳提升。According to the above-mentioned mobile computing device disclosed in the present invention, the present invention uses a centrifugal fan for convection to exhaust air toward the casing, so that forced convection is generated inside the mobile computing device, so that the hot air in the mobile computing device will not stagnate at a certain point. area. In this way, the electronic components located in this specific area can operate at a lower operating temperature compared to the prior art, since the hot air located in this specific area is continuously replaced by cooler air from other areas . Therefore, such a mobile computing device has a better heat dissipation effect than the existing mobile computing device, so that the overall system stability of the mobile computing device is better improved.
以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
附图说明 Description of drawings
图1A是为现有移动运算装置的结构示意图;FIG. 1A is a schematic structural diagram of an existing mobile computing device;
图1B是为现有移动运算装置的结构透视图;FIG. 1B is a structural perspective view of an existing mobile computing device;
图2A是为根据本发明一实施例的移动运算装置的结构示意图;FIG. 2A is a schematic structural diagram of a mobile computing device according to an embodiment of the present invention;
图2B是为根据本发明一实施例的移动运算装置的结构透视图;2B is a structural perspective view of a mobile computing device according to an embodiment of the present invention;
图2C是为根据本发明一实施例的排气用离心式风扇与对流用离心式风扇的结构示意图;2C is a schematic structural view of a centrifugal fan for exhaust and a centrifugal fan for convection according to an embodiment of the present invention;
图3A是为根据本发明另一实施例的移动运算装置的结构示意图;FIG. 3A is a schematic structural diagram of a mobile computing device according to another embodiment of the present invention;
图3B是为根据本发明另一实施例的移动运算装置的结构透视图;3B is a structural perspective view of a mobile computing device according to another embodiment of the present invention;
图3C是为根据本发明另一实施例的对流用离心式风扇的结构示意图。FIG. 3C is a schematic structural view of a centrifugal fan for convection according to another embodiment of the present invention.
其中,附图标记Among them, reference signs
10移动运算装置10 Mobile Computing Devices
11第一发热装置11 The first heating device
11′中央处理单元11' central processing unit
12第二发热装置12 second heating device
12′绘图芯片12' graphics chip
13发热模块13 heating module
13′记忆体13' memory
100、100′壳体100, 100' housing
110、110′顶板110, 110' top plate
120、120′底板120, 120' base plate
121、121′通气孔121, 121' air vent
122第三贯通孔122 The third through hole
130、130′侧板130, 130' side panels
131、131′第一贯通孔131, 131' the first through hole
132、132′第二贯通孔132, 132' the second through hole
200、200′电路板200, 200' circuit board
300、300′第一散热模块300, 300' the first cooling module
310第一吸热端310 first heat sink end
320第一散热端320 first cooling end
400、400′第二散热模块400, 400' second cooling module
410第二吸热端410 second heat sink end
420第二散热端420 second cooling end
500排气用离心式风扇500 centrifugal fan for exhaust
500′第一离心式风扇500′ first centrifugal fan
510第一底座510 first base
511第一表面511 first surface
512第一罩体512 first cover body
513第一排气口513 first exhaust port
515第一进气口515 first air intake
520第一离心式扇叶520 first centrifugal fan blade
530第一马达530 first motor
600对流用离心式风扇600 centrifugal fan for convection
600′第二离心式风扇600′ second centrifugal fan
610第二底座610 second base
611第二表面611 second surface
612第二罩体612 second cover body
613第二排气口613 second exhaust port
614第三排气口614 third exhaust port
615第二进气口615 second air inlet
620第二离心式扇叶620 second centrifugal fan blade
630第二马达630 second motor
700导流板700 deflector
具体实施方式 Detailed ways
下面结合附图对本发明的结构原理和工作原理作具体的描述:Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:
请参照图2A至图2C,图2A是为根据本发明一实施例的移动运算装置的结构示意图,图2B是为根据本发明一实施例的移动运算装置的结构透视图,图2C是为根据本发明一实施例的排气用离心式风扇与对流用离心式风扇的结构示意图。Please refer to FIG. 2A to FIG. 2C, FIG. 2A is a schematic structural diagram of a mobile computing device according to an embodiment of the present invention, FIG. 2B is a perspective view of the structure of a mobile computing device according to an embodiment of the present invention, and FIG. Structural schematic diagrams of a centrifugal fan for exhaust and a centrifugal fan for convection according to an embodiment of the present invention.
本实施例的移动运算装置10,其可为一般的笔记型计算机或平板型计算机等。移动运算装置10包括一壳体100、一电路板200、一第一散热模块300、一排气用离心式风扇500及一对流用离心式风扇600。The
本实施例的壳体100包括有彼此相对的一顶板110、一底板120以及连接底板120与顶板110的一侧板130,侧板130具有一第一贯通孔131。此外,底板120上还可具有多个通气孔121。The
电路板200设置于壳体100内,意即电路板200位于顶板110、底板120以及侧板130之间。其中,电路板200上可具有一第一发热装置11,第一发热装置11可是移动运算装置10的一中央处理器(CPU)。需注意的是,虽然在本实施例中,第一发热装置11是以中央处理器作为举例说明,但是本实施例并非用以限定本发明的第一发热装置11的种类。在依据本发明的其它实施例中,第一发热装置11亦可以是任何位于电路板200上具有发热现象的电子单元。The
请继续参照图2B,本实施例的第一散热模块300具有一第一吸热端310以及一第一散热端320。其中,第一散热模块300可以是但不局限于热管与散热鳍片的组成。第一散热模块300的第一吸热端310与第一发热装置11热接触(thermal contact)。更进一步来说,通过第一吸热端310与第一发热装置11的热接触,第一发热装置11所产生的热能可传递至第一散热模块300。Please continue to refer to FIG. 2B , the first
请同时参照图2A至图2C,排气用离心式风扇500设置于电路板200上,本实施例的排气用离心式风扇500是一有罩体离心式风扇。排气用离心式风扇500包含一第一底座510、一第一离心式扇叶520及一第一马达530。其中,第一底座510具有一第一表面511以及竖立于第一表面511的一第一罩体512。第一离心式扇叶520则位于第一表面511上,第一马达530连接第一离心式扇叶520,第一马达530并且位于该第一离心式扇叶520与第一表面511之间。Please refer to FIG. 2A to FIG. 2C at the same time. The
此外,第一罩体512将第一离心式扇叶520以及第一马达530容纳于第一罩体512与第一底座510所共同形成的容置空间中。第一罩体512具有一第一排气口513以及一第一进气口515。其中,第一排气口513对应第一贯通孔131,使得经由第一排气口513所排出的气流可通过第一贯通孔131排出壳体100外。In addition, the
另外,第一进气口515朝向底板120并且被底板120所遮蔽,并且底板120与第一进气口515之间保持有一间隙。如此一来,当排气用离心式风扇500运作时,排气用离心式风扇500便能够将经由此间将移动运算装置10内部的气体吸入排气用离心式风扇500内。In addition, the
再者,第一散热模块300的第一散热端320是介于排气用离心式风扇500的第一排气口513与第一贯通孔131之间。换句话说,第一散热端320位于由排气用离心式风扇500所产生的朝第一贯通孔131方向流动的气体的流动路径上。Moreover, the first
当排气用离心式风扇500运转时,壳体100外的气流是经由底板120的多个通气孔121流入壳体100内。壳体100内的气流经由排气用离心式风扇500的第一进气口515及第一排气口513而进出排气用离心式风扇500,排气用离心式风扇500将气流由第一排气口513排出而吹送至第一散热端320,以对第一散热端320进行散热。When the exhaust
由第一排气口513排出的气流与第一散热端320进行热交换后,便再经由第一贯通孔131排出至壳体100外部。因此,通过第一散热模块300与排气用离心式风扇500的设置,可将第一发热装置11所产生的热能排出壳体100外部。After the airflow discharged from the
本实施例的对流用离心式风扇600配置于壳体100内,且位于电路板200上。更进一步来说,对流用离心式风扇600包含一第二底座610、一第二离心式扇叶620及一第二马达630。其中,第二底座610具有一第二表面611以及竖立于第二表面611的一第二罩体612。第二离心式扇叶620则位于第二表面611上,第二马达630连接第二离心式扇叶620,第二马达630并且位于第二离心式扇叶620与第二表面611之间。The convection
此外,第二罩体612将第二离心式扇叶620与第二马达630容纳于第二罩体612与第二底座610所共同形成的容置空间内。第二罩体612具有一第二排气口613以及一第二进气口615。其中,第二排气口513朝向移动运算装置10内部。In addition, the
在本实施例中,第二排气口513朝向一第一方向D1,其中第一方向D1为由对流用离心式风扇600朝向排气用离心式风扇500的方向,意即第二排气口613朝向排气用离心式风扇500,以使对流用离心式风扇600朝第一方向D1排气并且使对流用离心式风扇600所排出的部分气体能够经由第一进气口515而被吸入排气用离心式风扇500。In this embodiment, the
第二进气口615朝向底板120并且被底板120所遮蔽,底板120与第二进气口615之间保持有一间隙。如此一来,可确保第二进气口615不会被底板120所封闭,使得气流可顺利的经由第二进气口615进入对流用离心式风扇600。The
此外,本实施例还可以将一发热模块13配置于排气用离心式风扇500与对流用离心式风扇600之间,以使发热模块13位于由对流用离心式风扇600流至排气用离心式风扇500的气流的流动路径上,其中发热模块13例如是一记忆体插卡。In addition, in this embodiment, a
如此一来,本实施例便能够经由这股由对流用离心式风扇600流至排气用离心式风扇500的气流来移除发热模块13所产生的热量。所以,本实施例可以避免被发热模块13所加热的热空气累积在发热模块13的周围,进而避免发热模块13的温度持续地增加。之后,与发热模块13进行热交换后的热空气,则经由第一进气口515流入排气用离心式风扇500,并通过排气用离心式风扇500的运转而排出壳体100外。In this way, in this embodiment, the heat generated by the
再者,本实施例的移动运算装置10还能够包括一第二散热模块400、第二罩体612还可具有一第三排气口614并且侧板130还可以具有一第二贯通孔132。第二散热模块400具有一第二吸热端410以及一第二散热端420。其中,第二散热模块400可以是但不局限于导热管与散热鳍片的组成。第二散热模块400的第二吸热端410除与第一发热装置11热接触外,还能够与电路板200的一第二发热装置12热接触,其中第二发热装置12例如是一绘图芯片(Graphics processing unit,GPU)。Furthermore, the
第二罩体612的第三排气口614朝向一第二方向D2。第二方向D2为由对流用离心式风扇600朝向第二贯通孔132的方向,意即第三排气口614朝向第二贯通孔132,以使对流用离心式风扇600朝第二方向D2排气。第二散热模块400的第二散热端420介于第二贯通孔132与第三排气口614之间。The
更进一步来说,通过第二吸热端410同时与第二发热装置12及第一发热装置11的热接触,第一发热装置11及第二发热装置12所产生的热能可因热传导而传递至第二散热模块400。第二散热端420位于由对流用离心式风扇600所产生的朝第二方向D2流动的气体的流动路径上。Furthermore, through the thermal contact between the second heat-absorbing
因此,当对流用离心式风扇600运转时,壳体100内的气流经由对流用离心式风扇600的第二进气口615进入对流用离心式风扇600。之后,对流用离心式风扇600除了将气流由第二排气口613排出外,对流用离心式风扇600也会由第三排气口614将气体排出。由第三排气口614所排出的气流朝第二方向D2流动,并且通过第二散热端420,以对第二散热端420进行热交换。由第三排气口614排出的气流与第二散热端420进行热交换后,便再经由第二贯通孔132排出至壳体100外部。Therefore, when the
需注意的是,在本实施例当中,第二吸热端410是同时与第二发热装置12及第一发热装置11热接触,然而此第二吸热端410的配置方式非用以限定本发明。举例来说,在本发明另一实施例当中,第二吸热端410也可只与第二发热装置12热接触,而不与第一发热装置11热接触。It should be noted that, in this embodiment, the second heat-absorbing
因此,通过第二散热模块300与对流用离心式风扇600的设置,除可将第一发热装置11与第二发热装置12所产生的热能排出壳体100外部,还可同时对发热模块13进行散热。所以这样的移动运算装置10,可于壳体100内产生气流而达到热对流的功效,因此可兼顾移动运算装置10内部多个发热单元的散热效果。Therefore, through the setting of the second
接着请参照图3A至图3C,图3A是为根据本发明另一实施例的移动运算装置的结构示意图,图3B是为根据本发明另一实施例的移动运算装置的结构透视图,图3C是为根据本发明另一实施例的对流用离心式风扇的结构示意图。3A to 3C, FIG. 3A is a schematic structural diagram of a mobile computing device according to another embodiment of the present invention, FIG. 3B is a perspective view of the structure of a mobile computing device according to another embodiment of the present invention, and FIG. 3C is a schematic structural view of a centrifugal fan for convection according to another embodiment of the present invention.
本发明另一实施例的移动运算装置10的结构,由于与图2A至图2C的实施例相似,因此对于相同的结构便不再详细描述。其中,图3A至图3C与图2A至图2C的相同标号代表相似的对象。The structure of the
移动运算装置10包括一壳体100、一电路板200、一第一散热模块300、一排气用离心式风扇500及一对流用离心式风扇600。此外,移动运算装置10还可包括一第二散热模块400。The
本实施例的壳体100包括有彼此相对的一顶板110、一底板120以及连接底板120与顶板110的一侧板130。底板120除了具有多个通气孔121外,还具有一第三贯通孔122。The
电路板200设置于壳体100内,意即电路板200位于顶板110、底板120以及侧板130之间。其中,电路板200上可具有一第一发热装置11、一第二发热装置12及一发热模块13。The
本实施例的第一散热模块300具有一第一吸热端310以及一第一散热端320,第一散热模块300的第一吸热端310与第一发热装置11热接触。The first
排气用离心式风扇500设置于电路板200上,本实施例的排气用离心式风扇500是为一有罩体离心式风扇,其结构与图2C的排气用离心式风扇500概略相同。The
此外,第一散热模块300的第一散热端320是介于排气用离心式风扇500的第一排气口513与第一贯通孔131之间。换句话说,第一散热端320位于由排气用离心式风扇500所产生的朝该第一贯通孔131方向流动的气体的流动路径上。In addition, the first
本实施例的对流用离心式风扇600配置于壳体100内,且位于电路板200上,而发热模块13即位于对流用离心式风扇600与排气用离心式风扇500之间。更进一步来说,本实施例的对流用离心式风扇600为一无罩体离心式风扇。对流用离心式风扇600基本上由一第二底座610、一第二离心式扇叶620及一第二马达630所组成。其中,第二底座610具有一第二表面611。另外,第二离心式扇叶620则位于第二表面611上,第三贯通孔122暴露出部分的第二离心式扇叶620。第二马达630连接第二离心式扇叶620,第二马达630并且位于第二离心式扇叶620与第二表面611之间。详细而言,第二底座610不具有竖立于其上的罩体结构,因此第二离心式扇叶620并未被第二底座610所包覆。由于第二离心式扇叶620并未被第二底座610所包覆,因此对流用离心式风扇600至少可朝向排气用离心式风扇500的一第一方向D1,以及朝向第二贯通孔132的一第二方向D2排气。此外,对流用离心式风扇600还能够朝其它壳体100内部方向排气,如图3B所示的一第三方向D3、一第四方向D4及一第五方向D5。The convection
本实施例的第二散热模块400具有一第二吸热端410以及一第二散热端420,第二散热模块400的第二吸热端410同时与第二发热装置12及第一发热装置11热接触。The second
此外,第二散热模块400的第二散热端420位于第三排气口614与第二贯通孔132之间。换句话说,第二散热端420位于由对流用离心式风扇600所产生的朝第二方向D2流动的气体的流动路径上。当对流用离心式风扇600运转时,壳体100外的气流是可经由底板120的第三贯通孔122而直接流入对流用离心式风扇600。对流用离心式风扇600将气流朝壳体100内部的四面八方排出,如图3B所示的第一方向D1、第二方向D2、第三方向D3、第四方向D4及第五方向D5。In addition, the second
其中,朝第一方向D1流动的气流则流经发热模块13而与发热模块13进行热交换,藉此以将发热模块13所产生的热能移除。与发热模块13进行热交换后的气流,则经由第一进气口515流入排气用离心式风扇500,并通过排气用离心式风扇500的运转而排出壳体100外。Wherein, the airflow flowing in the first direction D1 flows through the
其中,朝第二方向D2流动的气流则通过第二散热端420,以对第二散热端420进行热交换后,便再经由第二贯通孔132排出至壳体100外部。Wherein, the airflow flowing in the second direction D2 passes through the second
此外,朝第三方向D3、第四方向D4及第五方向D5流动的气流则通过壳体100内部的其它发热单元,以对其它发热单元进行热交换。与其它发热单元进行热交换后的气流,则经由第一进气口515流入排气用离心式风扇500,并通过排气用离心式风扇500的运转而排出壳体100外。In addition, the airflow flowing in the third direction D3 , the fourth direction D4 and the fifth direction D5 passes through other heat generating units inside the
需注意的是,本实施例的移动运算装置10是具有第二散热模块400,然而此特征非用以限定本发明。举例来说,在本发明另一实施例当中,移动运算装置10可不具有第二散热模块400,第二发热装置12与发热模块13可通过对流用离心式风扇600于壳体100内所产生的强制对流以进行热交换,并通过排气用离心式风扇500将吸收热能后的气流排出壳体100外。It should be noted that the
再者,为了让对流用离心式风扇600所产生的部分气流能够顺利地沿着第一方向D1流向排气用离心式风扇500,本实施例还可以在排气用离心式风扇500与对流用离心式风扇600之间配置多条由排气用离心式风扇500朝向对流用离心式风扇600延伸的导流板700。在本实施例中,导流板700是配置于移动运算装置10内,并且竖立于底板120上。由于对流用离心式风扇600所排出的气体是经过导流板700的引导后先吹过发热模块13后,再流向排气用离心式风扇500,因此本实施例的导流板700除了具有让对流用离心式风扇600所排出的气体更顺利地流向排气用离心式风扇500的优点外,更能够加强对发热模块13的散热效果。Furthermore, in order to allow the partial airflow generated by the
值得一提的,上表是为本发明所提供的现有移动运算装置与本实施例移动运算装置的温度测试比较数据。由上表可知,本实施例的移动运算装置10的发热模块13的温度相较于现有移动运算装置而言,温度大幅降低了6.2℃。而由第三排气口614所排放至第二贯通孔132处的气流温度也由39.8℃下降至29.2℃。由此可知,本实施例的移动运算装置10确实较现有移动运算装置而言,具有较低的整体系统温度。换句话说,本实施例的移动运算装置10具有较佳的散热效果。It is worth mentioning that the above table is the temperature test comparison data of the existing mobile computing device provided by the present invention and the mobile computing device of this embodiment. It can be seen from the above table that the temperature of the
根据上述实施例的移动运算装置,是通过对流用离心式风扇的排风方向朝向壳体内,使移动运算装置内部因气流循环而产生热对流。通过移动运算装置内部的热对流,使移动运算装置内部的所有发热元件所产生的热能皆能够排出壳体外。所以这样的移动运算装置,具有较现有移动运算装置更好的散热功效,使移动运算装置的整体系统稳定度更佳提升。According to the mobile computing device of the above-mentioned embodiments, the exhaust direction of the centrifugal fan for convection is toward the inside of the casing, so that the inside of the mobile computing device generates heat convection due to air circulation. Through heat convection inside the mobile computing device, heat energy generated by all heating elements inside the mobile computing device can be discharged out of the casing. Therefore, such a mobile computing device has a better heat dissipation effect than the existing mobile computing device, so that the overall system stability of the mobile computing device is better improved.
并且,对流用离心式风扇因可为一无罩体离心式风扇,因此对流用离心式风扇的扇叶于运转的过程中,可避面罩体对扇叶所产生的气流产生扰流,因此也相对降低扇叶运转所产生的噪音。如此一来,在一定的噪音规范下,无罩体离心式风扇便可较有罩体离心式风扇具有较高的转速,以提供更佳的散热效果。And, because the centrifugal fan for convection can be a centrifugal fan without a cover body, the fan blade of the centrifugal fan for convection can avoid the disturbance of the airflow produced by the fan blade by the cover body during operation. Relatively reduce the noise generated by the operation of the fan blades. In this way, under a certain noise standard, the centrifugal fan without a cover can have a higher speed than the centrifugal fan with a cover, so as to provide better heat dissipation effect.
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.
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CN2383112Y (en) * | 1999-03-11 | 2000-06-14 | 富金精密工业(深圳)有限公司 | Computer configuration structure |
CN2416711Y (en) * | 2000-03-14 | 2001-01-24 | 林浩正 | cooling device |
CN2441166Y (en) * | 2000-07-20 | 2001-08-01 | 新巨企业股份有限公司 | Electric power supplier with suction style fan seat |
CN2483754Y (en) * | 2001-02-07 | 2002-03-27 | 神基科技股份有限公司 | Laptop cooling device |
CN101231547A (en) * | 2008-02-21 | 2008-07-30 | 四川大学 | Diffluence orientation air supply type computer cabinet |
CN201336789Y (en) * | 2008-12-16 | 2009-10-28 | 深圳市研祥通讯终端技术有限公司 | Electronic device radiator and electronic device provided with same |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN2383112Y (en) * | 1999-03-11 | 2000-06-14 | 富金精密工业(深圳)有限公司 | Computer configuration structure |
CN2416711Y (en) * | 2000-03-14 | 2001-01-24 | 林浩正 | cooling device |
CN2441166Y (en) * | 2000-07-20 | 2001-08-01 | 新巨企业股份有限公司 | Electric power supplier with suction style fan seat |
CN2483754Y (en) * | 2001-02-07 | 2002-03-27 | 神基科技股份有限公司 | Laptop cooling device |
CN101231547A (en) * | 2008-02-21 | 2008-07-30 | 四川大学 | Diffluence orientation air supply type computer cabinet |
CN201336789Y (en) * | 2008-12-16 | 2009-10-28 | 深圳市研祥通讯终端技术有限公司 | Electronic device radiator and electronic device provided with same |
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