CN102484662B - Cover comprising a flexible connecting element for an electronic device - Google Patents
Cover comprising a flexible connecting element for an electronic device Download PDFInfo
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- CN102484662B CN102484662B CN201080036722.2A CN201080036722A CN102484662B CN 102484662 B CN102484662 B CN 102484662B CN 201080036722 A CN201080036722 A CN 201080036722A CN 102484662 B CN102484662 B CN 102484662B
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- film
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/105—Mechanically attached to another device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
电子设备的覆盖部件及电子设备。覆盖部件具有框架(1),该框架具有第一表面(8)和与第一表面相对的第二表面(9)。覆盖部件(25)还包括第一组件(4),其被安排为发送并/或接收信号,以及连接元件(5),其具有连接到所述第一组件(4)的信号发送总线。连接元件(5)包括挠性部件(27),其被安排为从覆盖部件(25)分岔开。Covering parts for electronic equipment and electronic equipment. The covering part has a frame (1) with a first surface (8) and a second surface (9) opposite the first surface. The cover part (25) also comprises a first component (4) arranged to transmit and/or receive signals, and a connection element (5) having a signal transmission bus connected to said first component (4). The connecting element (5) comprises a flexible part (27) arranged to diverge from the covering part (25).
Description
技术领域 technical field
本发明涉及电子设备的覆盖部件,该覆盖部件具有带有第一表面和与第一表面相对的第二表面的框架,该覆盖部件还包括被安排为发送和/接收信号的第一组件,以及具有连接到所述第一组件的信号发送总线的连接元件。The invention relates to a cover part for an electronic device, the cover part having a frame with a first surface and a second surface opposite the first surface, the cover part further comprising a first component arranged to transmit and/or receive signals, and There is a connection element connected to the signaling bus of the first component.
本发明还涉及电子设备。The invention also relates to electronic equipment.
背景技术 Background technique
电子设备(特别是便携式电子设备,例如移动电话、通信器(communicator)、掌上计算机、便携式计算机、游戏控制台或控制器、用于听觉和/或视觉材料的回放设备等)的覆盖结构典型地包括固定地或可开启地连接在一起和/或连接到设备框架的一个或多个覆盖部件。由覆盖结构形成的密闭空间容纳了电子设备的功能所需的电组件,并且该覆盖结构使组件免受例如灰尘、污垢和机械应力。覆盖部件典型地是通常由塑料、金属、塑料复合材料制造的薄壁产品。在覆盖部件中形成用于显示器、键盘、开关、电连接器等的必要的开口和通孔。Covering structures for electronic devices (particularly portable electronic devices such as mobile phones, communicators, palmtop computers, portable computers, game consoles or controllers, playback devices for audio and/or visual material, etc.) typically Comprising one or more cover members fixedly or releasably connected together and/or to the device frame. The enclosed space formed by the covering structure accommodates the electrical components required for the functioning of the electronic device and protects the components from, for example, dust, dirt and mechanical stress. Covering parts are typically thin walled products usually manufactured from plastic, metal, plastic composite materials. Necessary openings and through-holes for displays, keyboards, switches, electrical connectors, etc. are formed in the cover member.
已知具有一个或更多个固定到覆盖结构的电子组件的电子设备。例如,电子组件可以是天线。Electronic devices are known which have one or more electronic components secured to a cover structure. For example, an electronic component may be an antenna.
已知在覆盖结构中安排的这样的电子组件通过使用典型地在覆盖部件中安排的金属引脚或插头例如“pogo”引脚连接到在覆盖结构内部的密闭空间中安排的电组件。Such electronic components arranged in a cover structure are known to be connected to electrical components arranged in a closed space inside the cover structure by using metal pins or plugs such as "pogo" pins typically arranged in the cover part.
若干问题与这种类型的解决方案关联。首先,在覆盖部件的制造阶段处理小引脚或插头是困难的。覆盖部件是通过注模(injection moulding)来制造的,并且引脚或插头需要被安排并固定到模具从而在注入时它们保持在适当位置。这需要昂贵的特殊安排来获取想要的尺寸准确性。Several problems are associated with this type of solution. First, it is difficult to handle small pins or plugs at the manufacturing stage of the covering part. The covering part is manufactured by injection moulding, and the pins or pins need to be arranged and fixed to the mold so that they stay in place when injected. This requires expensive special arrangements to obtain the desired dimensional accuracy.
但是,引脚和插头如此大从而创建互相绝缘的多条电总线需要很大的空间。因为没有可用的空间,不可能在覆盖结构中安排这样的电子组件,其为了操作需要通过若干个电总线连接到电路板。However, having pins and plugs that large to create multiple electrical buses that are isolated from each other requires a lot of space. Since there is no space available, it is not possible to arrange electronic components in the cover structure, which for operation need to be connected to the circuit board by several electrical busses.
另一个问题是如果连接的电子组件被安排在覆盖部件的外表面一侧,则要将清楚可见的引脚和插头不可见地安排到覆盖部件是很困难的。因此,引脚和插头确实不会改进覆盖部件的外观。Another problem is that it is difficult to arrange the clearly visible pins and plugs invisibly to the cover part if the connected electronic components are arranged on the side of the outer surface of the cover part. So the pins and plugs really do not improve the appearance of the covered part.
发明内容 Contents of the invention
本发明的目标是提供一种新颖和改进的电子设备覆盖部件和电子设备。It is an object of the present invention to provide a novel and improved electronic device cover and electronic device.
本发明的覆盖部件和电子设备由独立权利要求的特征部分所阐述的内容来表征。本发明的其他实施例由其他权利要求中阐述的内容来表征。The cover part and the electronic device of the invention are characterized by what is stated in the characterizing parts of the independent claims. Other embodiments of the invention are characterized by what is set forth in the other claims.
发明性实施例还在本专利申请的说明书和附图中公开。本专利申请的发明性内容还可以以与所附权利要求书所定义的不同的其他方式来定义。发明性内容还可以由若干个单独的发明来构成,特别是如果本发明根据显式的或隐含的子任务或根据得到的益处或益处集而被检查的话。在这样的情形下,考虑到单独的发明性思想,在下列权利要求中包含的一些定义可能不是必要的。本发明的不同实施例的特征可以在基本发明性思想的范围内被应用到其他实施例。在下面,以随机顺序列举了本发明的一些实施例的特征:Inventive embodiments are also disclosed in the description and drawings of this patent application. The inventive content of this patent application can also be defined in other ways than that defined in the appended claims. The inventive content may also consist of several separate inventions, especially if the invention is examined in terms of explicit or implicit sub-tasks or in terms of benefits or sets of benefits obtained. In such cases, some definitions contained in the following claims may not be necessary in view of separate inventive concepts. The features of the different embodiments of the invention can be applied to other embodiments within the scope of the basic inventive idea. In the following, features of some embodiments of the invention are listed in random order:
-第一组件是发送和/或接收电信号的组件,并且信号发送总线是发送电信号的总线,- the first component is a component that transmits and/or receives electrical signals, and the signaling bus is a bus that transmits electrical signals,
-第一组件是发送和/或接收光信号的组件,并且信号发送总线是发送光信号的总线,- the first component is a component that transmits and/or receives optical signals, and the signaling bus is a bus that transmits optical signals,
-第一组件被安排在第一表面侧,并且信号发送总线被安排为从第一表面侧延伸到第二表面侧,从而挠性(flexible)部件被安排为分岔(diverge)到第二表面侧,- the first component is arranged on the first surface side, and the signaling bus is arranged to extend from the first surface side to the second surface side, whereby the flexible part is arranged to diverge to the second surface side,
-信号发送总线被安排为延伸经过框架的边缘,从而它从所述覆盖的框架的第一表面侧延伸到其第二表面侧,- the signaling bus is arranged to extend past the edge of the frame so that it extends from the first surface side of the covered frame to its second surface side,
-框架的边缘是穿过框架的开口,- the edge of the frame is the opening through the frame,
-开口是照相机开口,- the opening is the camera opening,
-开口是为设备或其保护窗口的显示而形成的开口,- the opening is an opening formed for the display of the device or its protective window,
-开口是为设备的操作按钮而形成的开口,- the opening is the opening formed for the operating buttons of the device,
-框架的边缘是构成覆盖部件的外部边缘的边缘,- the edge of the frame is the edge forming the outer edge of the covering part,
-覆盖部件包括在框架的第一表面侧安排的薄膜,并且导电总线的部分被安排在框架和所述薄膜的外部表面之间,- the covering part comprises a film arranged on the first surface side of the frame, and the part of the conductive bus is arranged between the frame and the outer surface of said film,
-薄膜是嵌入薄膜(insert film),- the film is an insert film,
-薄膜是标签薄膜(labelling film),- the film is a labeling film,
-薄膜是转移薄膜(transfer film),- the film is a transfer film,
-薄膜是多层薄膜,- the film is a multilayer film,
-第一组件被安排在第二表面侧,并且挠性部件被安排为分岔到第二表面侧,- the first component is arranged on the second surface side and the flexible part is arranged to branch to the second surface side,
-第一组件被安排在覆盖部件的第一和第二表面之间,并且信号发送总线被安排为延伸到第二表面侧,从而挠性部件被安排为分岔到第二表面侧,- the first assembly is arranged between the first and second surfaces of the cover part, and the signaling bus is arranged to extend to the second surface side, whereby the flexible part is arranged to branch to the second surface side,
-该信号发送总线是单独组件,其包含导体和将它们互相分离的绝缘基底,- the signaling bus is a separate component comprising conductors and an insulating substrate separating them from each other,
-信号发送总线是类似薄膜的元件,其包含在绝缘基底中并排安排的导体,- the signaling bus is a film-like element comprising conductors arranged side by side in an insulating substrate,
-信号发送总线是挠性电路板,- The signaling bus is a flexible circuit board,
-信号发送总线是类似薄膜的光电导体,- the signaling bus is a film-like photoconductor,
-信号发送总线被集成到覆盖部件的第二结构部件,- the signaling bus is integrated into the second structural part of the covering part,
-信号发送总线被集成到薄膜,-Signaling bus is integrated into the film,
-信号发送总线被集成到覆盖的框架,- signaling bus is integrated into the overlay frame,
-第一组件包含一个组件,- the first component contains a component,
-第一组件是若干个组件的组合,- the first component is a combination of several components,
-第一组件包含天线,- the first component contains the antenna,
-第一组件包含电路板,- the first assembly contains the circuit board,
-第一表面在覆盖部件的外部表面侧上,- the first surface is on the outer surface side of the covering part,
-第一表面在覆盖部件的内部表面侧上。- the first surface is on the inner surface side of the covering part.
本发明的思想是,在覆盖部件中安排的信号发送和/或接收组件通过发送所述信号并包含从覆盖部件分岔的挠性部件的总线连接到不属于覆盖部件的第二组件。本发明提供的优势在于,由于从覆盖部件分岔的挠性总线部件,该组件很容易连接到第二组件。The idea of the invention is that a signal transmitting and/or receiving component arranged in the cover part is connected to a second component not belonging to the cover part via a bus that transmits said signal and contains a flexible part branching off from the cover part. The invention provides the advantage that the assembly is easily connected to the second assembly due to the flexible bus part branching off from the cover part.
本发明的优选实施例的思想是,信号发送总线被安排在覆盖部件的框架的外表面和固定到该覆盖部件的薄膜之间。优势在于,总线很容易固定到覆盖部件,总线的数量可以很大,并且总线不需要改变覆盖部件的外观。The idea of a preferred embodiment of the invention is that the signaling bus is arranged between the outer surface of the frame of the cover part and the film fixed to the cover part. The advantage is that the busses are easily fixed to the covering part, the number of buses can be large, and the buses do not need to change the appearance of the covering part.
本发明的优选实施例的思想是,信号发送总线被安排为延伸经过框架的边缘,从而其从所述覆盖的框架的第一表面侧延伸到其第二表面侧。The idea of a preferred embodiment of the invention is that the signaling bus is arranged to extend past the edge of the frame such that it extends from the first surface side of the covered frame to its second surface side.
优势在于,在覆盖部件的不同侧面上安排的组件可以互相连接。The advantage is that components arranged on different sides of the cover part can be connected to each other.
附图说明 Description of drawings
将在附图中更详细地描述本发明的一些实施例,在附图中:Some embodiments of the invention will be described in more detail in the accompanying drawings, in which:
图1a是部分截面中的本发明的覆盖部件的示意性分解侧视图;Figure 1a is a schematic exploded side view of a covering part of the invention in partial section;
图1b是图1a中的导电总线的示意性俯视图;Figure 1b is a schematic top view of the conductive bus in Figure 1a;
图1c是在部分截面中、并包含由图1a中的部件构成的覆盖部件的本发明的组装的电子设备的示意性侧视图;Figure 1c is a schematic side view of an assembled electronic device of the invention in partial section and comprising a cover part made up of the parts in Figure 1a;
图2是本发明的第二覆盖部件的示意性透视图;Figure 2 is a schematic perspective view of a second covering member of the present invention;
图3a和图3b是部分截面中的本发明的第三覆盖部件的示意性侧视图和俯视图;Figures 3a and 3b are schematic side and top views of a third covering part of the invention in partial section;
图4是部分截面中的本发明的第四覆盖部件的示意性侧视图;Fig. 4 is a schematic side view of a fourth covering member of the present invention in partial section;
图5是部分截面中的本发明的第五覆盖部件的示意性侧视图;Fig. 5 is a schematic side view of a fifth covering member of the present invention in partial section;
图6是部分截面中的本发明的第六覆盖部件的示意性侧视图;Fig. 6 is a schematic side view of a sixth covering member of the present invention in partial section;
图7是部分截面中的本发明的第七覆盖部件的示意性侧视图;Fig. 7 is a schematic side view of a seventh covering member of the present invention in partial section;
图8a到图8c是用于制造本发明的覆盖部件的方法的示意性部分截面侧视图;8a to 8c are schematic partial cross-sectional side views of the method for manufacturing the covering member of the present invention;
图9是部分截面中的本发明的第八覆盖部件的示意性侧视图;Fig. 9 is a schematic side view of an eighth covering member of the present invention in partial section;
图10是部分截面中的本发明的第九覆盖部件的示意性侧视图。Fig. 10 is a schematic side view of a ninth covering member of the present invention in partial section.
在附图中,为了清楚起见,本发明的一些实施例被简化示出。在图中相同的部件用相同的标号来标记。In the drawings, some embodiments of the invention are shown simplified for the sake of clarity. Like parts are marked with like reference numerals in the figures.
最佳实施方式best practice
图1是部分截面中的本发明的覆盖部件的示意性分解侧视图,图1b是在覆盖部件中安排的导电总线的示意性俯视图,且图1c是在部分截面中的、包含由图1a中的部件构成的覆盖部件的本发明的组装的电子设备的示意性侧视图。Figure 1 is a schematic exploded side view of a cover part of the invention in partial section, Figure 1b is a schematic top view of a conductive bus line arranged in the cover part, and Figure 1c is in partial section, comprised of the components shown in Figure 1a A schematic side view of an assembled electronic device of the present invention composed of covering components.
覆盖部件包括注模的框架1。制造材料是本身已知的聚合体材料,其可以不仅包含热塑性基体材料,也可以包含强化材料、填充剂等。框架可以是对可见光透明的、部分透明的,或不透明的。The covering part consists of an injection molded frame 1 . The production materials are polymer materials known per se, which may contain not only thermoplastic matrix materials, but also reinforcing materials, fillers and the like. The frame can be visible light transparent, partially transparent, or opaque.
在注模阶段,构成覆盖部件的外表面的薄膜2固定到框架1的外表面。在该情形下,薄膜2是嵌入薄膜,其在这里是指在将其安排到注模模具前至少已经基本上被构建为模具和最终产品的形状的薄膜。该构建典型地通过热成形来实现。这类技术被称为“模具内标签”(in-mould labelling)或“嵌入模具装饰”(insert mould decoration)。薄膜2的制造材料和方法本身是已知的,因此不会在本说明书中更详细地描述。The film 2 constituting the outer surface of the covering part is fixed to the outer surface of the frame 1 during the injection molding stage. In this case, the film 2 is an embedded film, which here means a film that has been at least substantially built into the shape of the mold and the final product before it is arranged in the injection mold. This construction is typically achieved by thermoforming. This type of technique is known as "in-mould labelling" or "insert mold decoration". The materials and methods of manufacture of the film 2 are known per se and will therefore not be described in more detail in this description.
薄膜2也可以是多层的,并且甚至如此它是主动组件(activecomponent),包含层压到一层表面或多层之间的电子部件。薄膜如此可以用作表面薄膜或被喷漆、涂层、或以某种其他方式表面处理。The film 2 can also be multilayered, and even then it is an active component, containing electronic components laminated to one surface or between layers. The film may thus be used as a surface film or be painted, coated, or surface treated in some other way.
或者,薄膜2可以是标签薄膜,即,部分“模具内标签”薄膜。这是仅覆盖覆盖部件的外表面的一小部分的平面标签或类似标签。Alternatively, the film 2 may be a label film, ie part of an "in-mold label" film. This is a flat label or similar that covers only a small portion of the outer surface of the covering part.
薄膜2还可以是转移薄膜,即,“模具内装饰”(in-mould decoration)薄膜,在被安排到模具内时,它基本上是平面的,并且通过使用在半模(mould half)之间以连续带状馈送的转移薄膜或底膜(carrier film)而被安排在注模模具中。The film 2 may also be a transfer film, i.e. an "in-mould decoration" film which, when arranged in the mould, is substantially planar and is placed between the mold halves by using A transfer film or carrier film fed in a continuous strip is arranged in an injection mold.
薄膜可以是单色的或多色的,并且它可以具有装饰,例如外观随着光照条件改变而改变的那些薄膜,例如“隐藏直至点亮”(hidden till lit)的装饰。薄膜2可以是对可见光透明、部分透明或非透明的。其表面中的任一个或两个都可以被印刷、压制、喷漆或以某些其他本身已知的方式处理。薄膜可以是单层薄膜或多层薄膜,每层薄膜具有其自身的操作和装饰任务。The film can be monochromatic or multi-colored, and it can have decorations, such as those that change in appearance as lighting conditions change, such as "hidden till lit" decorations. Film 2 may be transparent to visible light, partially transparent or non-transparent. Either or both of its surfaces may be printed, pressed, painted or treated in some other manner known per se. The film can be a single-layer film or a multi-layer film, each layer having its own handling and decoration tasks.
薄膜2在注模过程中被固定到框架1,该过程将结合图8a到8c来更具体地描述。但是,我们希望在本上下文中说明,框架1在它被固定到薄膜2的后表面7的同时形成为其在图1a和1c中示出的形状。The film 2 is fixed to the frame 1 in an injection molding process which will be described in more detail in connection with Figures 8a to 8c. However, we wish to state in this context that the frame 1 is formed into its shape shown in FIGS. 1a and 1c at the same time as it is secured to the rear surface 7 of the membrane 2 .
我们还希望说明,通过在薄膜2的外表面6上安排第二薄膜或者通过喷漆、印刷或其他一些相应的方式,薄膜2还可以进一步被涂层。此外,我们希望说明,附加的部件可以被安排到覆盖部件中,以更改其外观、感觉、功能或某些其他属性。另外,我们希望说明,覆盖部件的部件尺寸—主要是框架1和薄膜2的厚度的比例—在图中被示出为不同于实际,以便更好地表现本发明的特征以被理解。We also wish to state that the film 2 can be further coated by arranging a second film on the outer surface 6 of the film 2 or by painting, printing or some other corresponding means. Furthermore, we wish to illustrate that additional components can be arranged into overlay components to change their appearance, feel, function or some other properties. In addition, we wish to state that the part dimensions of the covering part - mainly the ratio of the thicknesses of the frame 1 and the membrane 2 - are shown in the figures differently than they actually are, in order to better characterize the invention to be understood.
框架的第一表面8在薄膜2的侧面上,并且表面9构成覆盖部件的内表面。可以添加元件到第二表面9,例如薄膜、导体、电子或光组件等。The first surface 8 of the frame is on the side of the membrane 2 and the surface 9 constitutes the inner surface of the covering part. Components may be added to the second surface 9, such as films, conductors, electronic or optical components, etc.
第一组件4被安排在第一表面8侧,或者在该情形下框架1的外表面上,并且由此它在由覆盖部件构成的密闭空间之外。这里,第一组件4是发送或接收或即发送也接收电信号的组件。The first component 4 is arranged on the side of the first surface 8 , or in this case the outer surface of the frame 1 , and thus it is outside the closed space formed by the covering part. Here, the first component 4 is a component that sends or receives or both sends and receives electrical signals.
在图1a到1c示出的本发明的实施例中,第一组件4被安排在薄膜2中的开口中。第一组件4还可以被安排在薄膜的外表面6上,或在薄膜2和框架1之间,或在薄膜2内部。In the embodiment of the invention shown in FIGS. 1 a to 1 c , the first component 4 is arranged in an opening in the membrane 2 . The first component 4 can also be arranged on the outer surface 6 of the membrane, or between the membrane 2 and the frame 1 , or inside the membrane 2 .
为了工作,第一组件4需要若干条适于发送电信号的总线,其将它连接到覆盖结构内部安排的第二组件。In order to work, the first assembly 4 requires several bus lines suitable for sending electrical signals, which connect it to the second assembly arranged inside the covering structure.
需要的总线使用挠性的类似薄膜的连接元件5来实现。这可以例如是被称为挠线(flex)的电导体。这是挠性电路板,其基本上沿着其整个长度都是挠性的,或者是刚挠(rigid flex)电路板,其同时具有刚性和挠性部件。它具有在由非导电塑料构成的绝缘基底12中并排安排的导电总线11。在挠线的一端或两端,可以有适配器来将总线11连接到在可连接组件中安排的相对部件(counter-piece)。该连接也可以自然地通过焊接、通过导电胶水胶合、或以本身已知的其他方式来实现。The required bus is implemented using flexible membrane-like connection elements 5 . This may for example be an electrical conductor known as a flex. This is a flex circuit board, which is flexible along essentially its entire length, or a rigid flex circuit board, which has both rigid and flexible components. It has conductive bus lines 11 arranged side by side in an insulating base 12 made of non-conductive plastic. At one or both ends of the flex, there may be adapters to connect the bus 11 to counter-pieces arranged in connectable assemblies. The connection can naturally also be realized by soldering, gluing with conductive glue, or in other ways known per se.
现在导电总线11在连接元件5的第一端13处,该连接元件直接固定到第一组件4,或者间接地,即,连接到在框架1或薄膜2中形成的连接头并连接到第一组件4。The conductive bus 11 is now at the first end 13 of the connecting element 5, which is fixed directly to the first component 4, or indirectly, ie connected to a connection head formed in the frame 1 or film 2 and connected to the first Component 4.
连接元件5被安排隐藏在框架1和薄膜2之间,并在框架1的注模阶段在适当的位置固定到覆盖部件。这将结合图8a到8c来更详细地描述。The connecting element 5 is arranged hidden between the frame 1 and the membrane 2 and fixed in place to the cover part during the injection molding stage of the frame 1 . This will be described in more detail in connection with Figures 8a to 8c.
连接元件5的第二端14被安排于在覆盖部件中构建的开口3处,从而其延伸经过在开口3中形成的薄膜2和框架1的边缘15。因为连接元件5整个是挠性的,延伸经过边缘15的部分构成挠性的可弯曲的部件27。这可以被自由地弯曲到框架的第二表面9侧;这里,弯曲到覆盖部件的内部。The second end 14 of the connecting element 5 is arranged at the opening 3 formed in the cover part so that it extends past the membrane 2 formed in the opening 3 and the edge 15 of the frame 1 . Since the connecting element 5 is flexible throughout, the part extending past the edge 15 forms a flexible bendable part 27 . This can be freely bent to the second surface 9 side of the frame; here, to the inside of the covering part.
所述开口3是摄像头开口,这在这里是指它被构建主要用于移动电话的摄像头的保护窗口或镜头,并延伸经过框架1和薄膜2两者。开口3可以自然地是摄像头所需的某个其他开口;它可以是为显示器或其保护窗口构建的开口、为操作按钮构建的开口、为麦克风、耳机、充电适配器或为某个其他适配器构建的开口等。Said opening 3 is a camera opening, which here means that it is constructed mainly for the protective window or lens of the camera of a mobile phone, and extends through both the frame 1 and the membrane 2 . Opening 3 could naturally be some other opening required for the camera; it could be an opening built for a display or its protective window, an opening built for an action button, an opening built for a microphone, a headset, a charging adapter, or for some other adapter Open your mouth and wait.
开口3还可以是特别为导电总线11构建的。需要注意薄膜2不是必须具有开口3;换句话说,为了实现图1a到1c中示出的实施例,框架1具有穿过它的开口就够了。取决于开口的目的,薄膜延伸经过开口3的部分可以是透明的或不透明的。The opening 3 can also be specially constructed for the conductive bus 11 . It is to be noted that the membrane 2 does not have to have the opening 3; in other words, in order to realize the embodiment shown in Figs. 1a to 1c, it is sufficient that the frame 1 has the opening through it. The portion of the film extending through the opening 3 may be transparent or opaque depending on the purpose of the opening.
第一组件4还可以是发送或接收或既发送也接收光信号的组件,并且相应地,连接元件5可以是发送光信号的总线,例如类似薄膜或类似薄板的光电导体或光纤。此外,第一组件4可以是发送或接收或既发送也接收电和光信号的组件,例如LED、激光、光电二极管、探测器、光电池、光传感器、运动探测器、显示元件或对光有反应的某个其他表面或组件。The first component 4 can also be a component that transmits or receives or both optical signals, and correspondingly the connection element 5 can be a bus that transmits optical signals, eg a film-like or sheet-like photoconductor or an optical fiber. Furthermore, the first component 4 can be a component that transmits or receives or both electrical and optical signals, such as LEDs, lasers, photodiodes, detectors, photocells, light sensors, motion detectors, display elements or light-reactive some other surface or component.
这里需要注意,第一组件可以是传感器、天线、开关、属于设备的用户接口的装置,例如键、显示器、麦克风、扬声器、触敏元件等。该组件可以是单独的组件,或者是集成到薄膜2或框架1的组件,例如印刷或压制的组件。It should be noted here that the first component may be a sensor, an antenna, a switch, a device belonging to the user interface of the device, such as a key, a display, a microphone, a loudspeaker, a touch-sensitive element, and the like. This component can be a separate component, or a component integrated into the membrane 2 or the frame 1, for example a printed or pressed component.
图1c示出了组装的电子设备,其中连接元件5的挠性部件27被弯曲并经开口3被推进到覆盖部件的内部,在此其第二端14连接到第二组件。封闭所述设备的第二覆盖部件以虚线示出。Figure 1c shows the assembled electronic device in which the flexible part 27 of the connection element 5 is bent and pushed through the opening 3 into the interior of the cover part where its second end 14 is connected to the second component. A second cover part enclosing the device is shown in dashed lines.
这里,第二组件是设备的主板10。因为连接元件5的自由的第二端14基本从边缘15分岔开,当设备被组装时,它可以快速并可靠地连接到第二组件。连接元件5的被保留为自由的一端自然可能被连接到覆盖部件内部的某个其他组件,例如辅助电路板、为键盘安排的用户接口板、电池或其他电源、控制模块等。连接元件5还可以连接到属于另一覆盖部件的组件或连接到覆盖部件1自己内部的组件。Here, the second component is the motherboard 10 of the device. Since the free second end 14 of the connection element 5 diverges substantially from the edge 15, it can be quickly and reliably connected to the second component when the device is assembled. The end of the connection element 5 left free may naturally be connected to some other component inside the cover, such as an auxiliary circuit board, a user interface board arranged for a keyboard, a battery or other power supply, a control module, etc. The connecting element 5 can also be connected to a component belonging to another covering part or to a component inside the covering part 1 itself.
得益于上述通过开口3和信号发送总线构成的安排,可以在框架1的外部安排甚至需要复杂连接的组件。同时,避免了在制造覆盖部件时处理小引脚和插头。不需要在覆盖部件25中构建额外的孔,这种孔可能对设备的外观有不利的影响。连接元件5如此之薄,从而不会视觉上改变覆盖部件25的外观。自然地,如果需要它可以是可见的。如果需要,可以以不形成对覆盖部件25的审美印象有不利影响的形状的方式来互相重叠地安排两个或更多个连接元件5。Thanks to the above-described arrangement of openings 3 and signaling busses, even components requiring complex connections can be arranged outside the frame 1 . At the same time, it avoids dealing with small pins and plugs when manufacturing the covering part. There is no need to build additional holes in the cover part 25, which might have a detrimental effect on the appearance of the device. The connecting element 5 is so thin that it does not visually change the appearance of the covering part 25 . Naturally, it can be visible if desired. If desired, two or more connecting elements 5 can be arranged on top of each other in such a way that they do not form a shape that adversely affects the aesthetic impression of the cover part 25 .
还可以通过首先将框架1和薄膜2两者都基本塑造为其最终形式并在这之后将它们互相固定,来制造覆盖部件25。框架1然后可以通过注模来制造,而不用将薄膜2作为进入模具的嵌入物。It is also possible to manufacture the covering part 25 by first shaping both the frame 1 and the membrane 2 substantially into their final form and thereafter fixing them to each other. The frame 1 can then be produced by injection moulding, without the film 2 as an insert into the mould.
我们希望说明,框架1不仅可以由塑料或塑料复合材料来制造,也可以由其他材料例如金属来制造,或者它可以是由属于若干个不同材料组的材料制造的部件(例如塑料和金属部件)的组合。金属的一个好处是允许制造更薄的框架1并由此更薄的覆盖部件25。We wish to state that the frame 1 can be manufactured not only from plastic or a plastic composite, but also from other materials such as metal, or it can be a part manufactured from materials belonging to several different material groups (e.g. plastic and metal parts) The combination. One benefit of metal is that it allows the manufacture of a thinner frame 1 and thus a thinner cover part 25 .
其他本身已知的方法,例如压制方法和机械加工,也是框架1的可能的制造方法。Other methods known per se, such as pressing methods and machining, are also possible manufacturing methods for the frame 1 .
例如,可以使用粘合剂、热力、焊接和机械固定装置来将框架1固定到薄膜2。该固定可以是永久性的,换句话说,如果不破坏它们,框架1不能从薄膜2分离。该固定也可以是可分离的,换句话说,框架1可以从薄膜2分离,而不用破坏它们。For example, adhesives, heat, welding and mechanical fixing means can be used to fix the frame 1 to the membrane 2 . This fixation can be permanent, in other words the frame 1 cannot be detached from the membrane 2 without destroying them. The fixation can also be detachable, in other words the frame 1 can be detached from the membrane 2 without destroying them.
覆盖部件25的配置然后可以包含图1a中描述的步骤,且连接元件5可以是单独的元件或集成到薄膜2中,从而薄膜2构成将总线互相绝缘的绝缘基底的至少一部分。The configuration of the covering part 25 can then comprise the steps described in Figure 1a, and the connecting element 5 can be a separate element or integrated into the film 2, so that the film 2 constitutes at least part of an insulating substrate insulating the bus lines from each other.
发送光信号的总线和/或导电总线在被固定到框架1之前可以被层压到薄膜2。薄膜2优选地为嵌入薄膜,所述总线优选地甚至在该薄膜被构建成其三围形式之前固定到该薄膜。总线可以被直接固定到薄膜,或者它们可以首先被固定到层压到薄膜2的辅助薄膜。The busses transmitting optical signals and/or the conductive busses may be laminated to the film 2 before being fixed to the frame 1 . The membrane 2 is preferably an embedded membrane, to which the bus lines are preferably fixed even before the membrane is constructed in its three-dimensional form. The busses can be fixed directly to the film, or they can be fixed first to an auxiliary film laminated to the film 2 .
连接元件的挠性部件27可以被制造为从薄膜2的最远边缘分岔开,或者它可以是总线或包含总线的辅助薄膜的一部分,其从薄膜2分离,或者在由薄膜或光电导体构成的层压结构被固定到框架1之前从薄膜分离。如果薄膜2包括若干层,连接元件的挠性部件27可以由这种类型的一层或更多层或其部分构成。电子组件可以被安排在多层薄膜2的层中和/或其间。The flexible part 27 connecting the elements can be made to diverge from the farthest edge of the film 2, or it can be part of the bus or an auxiliary film containing the bus, which is separated from the film 2, or it can be made of a film or a photoconductor The laminated structure is separated from the film before being fixed to the frame 1. If the membrane 2 comprises several layers, the flexible part 27 of the connecting element may consist of one or more layers of this type or parts thereof. Electronic components may be arranged in and/or between the layers of the multilayer film 2 .
图2是本发明的第二覆盖部件的一部分的示意性透视图。覆盖部件1包括至少构成其外表面的主要部分的薄膜2,并且在薄膜的后表面7上框架3被注模。Fig. 2 is a schematic perspective view of a part of a second covering member of the present invention. The covering part 1 comprises a film 2 constituting at least the main part of its outer surface, and on the rear surface 7 of the film the frame 3 is injection molded.
第一组件4被安排在覆盖部件1的外表面侧上。为了工作,这需要位于连接元件5中的电导体。这被安排进入覆盖部件,从而其一端延伸经过薄膜2和框架的边缘15—现在边缘15是构成覆盖部件的外部边缘的边缘,并且其在组装期间被固定到第二覆盖部件或设备的框架。这种类型的实施例提供了额外的好处,即它不需要开口3。The first assembly 4 is arranged on the outer surface side of the cover member 1 . To work, this requires electrical conductors located in the connecting element 5 . This is arranged into the cover part so that one end thereof extends past the membrane 2 and the edge 15 of the frame - edge 15 is now the edge which constitutes the outer edge of the cover part and which is secured to a second cover part or the frame of the device during assembly. This type of embodiment offers the added benefit that it does not require openings 3 .
图3a和3b是部分截面中的本发明的第三覆盖部件的示意性侧视图。该图仅示出了作为嵌入薄膜的薄膜2。在制造期间,电导体11以及连接导体11和安排在覆盖部件的外表面上的第一组件所需的接触表面16被集成到薄膜2。突出部分或凸起物17也被构建在薄膜2上,导体11被安排到该突出部分或凸起物上。凸起物17由和薄膜2的其他部分相同的材料制造。薄膜2构成将导体互相分离的绝缘基底,并构成在所有侧面保护导体11的外套(casing)。需要注意,凸起物17不是本实施例的绝对必须的特征。Figures 3a and 3b are schematic side views of a third covering part of the invention in partial section. The figure only shows the membrane 2 as an embedded membrane. During manufacture, the electrical conductors 11 as well as the connecting conductors 11 and the contact surfaces 16 required for the first assembly arranged on the outer surface of the cover part are integrated into the film 2 . Protrusions or protrusions 17 are also formed on the membrane 2, onto which protrusions or protrusions the conductors 11 are arranged. The protrusions 17 are made of the same material as the rest of the membrane 2 . The film 2 constitutes an insulating base separating the conductors from each other and constitutes a casing protecting the conductor 11 on all sides. It should be noted that the protrusion 17 is not an absolutely necessary feature of this embodiment.
图中示出的凸起物17比薄膜2的其他部分更薄,尽管这不是绝对必须的。关键的事情是,带有其导体11的凸起物17是挠性的,从而它和其导体可在覆盖结构内部被弯曲。替代导电性导体或作为它们的附加,自然可以使用光导总线。The projections 17 are shown to be thinner than the rest of the membrane 2, although this is not absolutely necessary. The crucial thing is that the protrusion 17 with its conductor 11 is flexible so that it and its conductor can be bent inside the covering structure. Instead of or in addition to electrically conductive conductors, optically conductive buses can of course be used.
本实施例还提供了额外的优势,即避免了在覆盖部件的装备期间(例如框架1的注模阶段期间)处理单独的连接元件5。This embodiment also offers the additional advantage of avoiding the handling of separate connecting elements 5 during the equipping of the covering part, for example during the injection molding phase of the frame 1 .
模仿图2中示出的实施例,集成到薄膜2的导电性导体11自然地还可以被安排为经过构成覆盖部件的外边缘的边。Mimicking the embodiment shown in FIG. 2 , the electrically conductive conductors 11 integrated into the film 2 can naturally also be arranged past the sides constituting the outer edge of the covering part.
图4是在部分截面中的本发明的第四覆盖部件的示意性侧视图。它示出了由塑料和薄膜2例如嵌入薄膜构成的框架1,该薄膜被安排在其第一表面8上,并且由透明或至少部分透明的材料构成。类似薄膜的光电导体28被安排在薄膜2的后表面上。Fig. 4 is a schematic side view of a fourth covering member of the present invention in partial section. It shows a frame 1 made of plastic and a film 2 , for example an embedded film, which is arranged on its first surface 8 and consists of a transparent or at least partially transparent material. A film-like photoconductor 28 is arranged on the rear surface of the film 2 .
薄膜2包括掩模29,其至少基本上对光不透明,并通过例如压制或印刷来构建。掩模29在薄膜中定义了活动区域30,来自光电导体的光线经过它传递到薄膜2并继续传递出覆盖部件。The film 2 comprises a mask 29 which is at least substantially opaque to light and which is constructed by pressing or printing, for example. The mask 29 defines an active area 30 in the film through which the light from the photoconductor passes to the film 2 and on out of the cover member.
覆盖部件25还具有光源,在该情形中是LED 31,以及连接部件5所连接到的耦合器34。LED 31和耦合器34被固定到电路板32,该电路板包括导体和将它们互相连接的导电总线。LED被包封在保护带(protectivetape)中,保护带防止来自LED的光线传播到除了光电导体28以外的其他地方。电路板32可以是挠性的挠性电路板或部分挠性的刚挠电路板,由此电路板32可以从覆盖部件25弯曲离开,从而它构成连接元件5及其挠性部件27。The cover part 25 also has a light source, in this case an LED 31, and a coupler 34 to which the connection part 5 is connected. The LED 31 and the coupler 34 are secured to a circuit board 32 that includes conductors and conductive busses interconnecting them. The LEDs are enclosed in a protective tape that prevents the light from the LEDs from traveling anywhere other than the photoconductor 28 . The circuit board 32 can be a flexible flex circuit board or a partially flexible rigid-flex circuit board, whereby the circuit board 32 can be bent away from the cover part 25 so that it forms the connecting element 5 and its flexible part 27 .
我们希望单独说明,使连接元件5经过覆盖部件不需要可见的孔或开口。这一类型的解决方法可以被应用到本说明书中描述的所有连接元件5。We would like to separately state that no visible holes or openings are required to pass the connecting element 5 through the cover part. This type of solution can be applied to all connection elements 5 described in this description.
上面列出的组件和部件28到34构成第一组件4。第一组件连接到连接元件5,其一端包含可以连接到第二组件的挠性部件27。框架1构成将连接部件5中的总线互相分离的绝缘基底的一部分。还需要注意,第二组件没有在图中示出。The components and components 28 to 34 listed above constitute the first component 4 . The first component is connected to the connecting element 5, one end of which contains a flexible part 27 which can be connected to the second component. The frame 1 forms part of an insulating base separating the bus lines in the connection part 5 from each other. Note also that the second component is not shown in the figure.
在组装的设备中,第二组件可以位于覆盖部件25内部或覆盖部件25外部。在后一种解决方案中,第一组件4典型地被安排在框架1的内表面侧上,但在本发明的一个实施例中,它被安排在框架1的外表面侧上。在优选的实施例中,第一组件4被安排在游戏控制台中,且第二组件在游戏控制器中,或反之亦然。连接元件从覆盖部件25分岔到其外表面侧,并用作连接游戏控制台和控制器的总线或其一部分。In the assembled device, the second component may be located inside the cover part 25 or outside the cover part 25 . In the latter solution, the first component 4 is typically arranged on the inner surface side of the frame 1 , but in one embodiment of the invention it is arranged on the outer surface side of the frame 1 . In a preferred embodiment, the first component 4 is arranged in a game console and the second component in a game controller, or vice versa. The connection member is branched from the cover member 25 to its outer surface side, and serves as a bus or a part thereof that connects the game console and the controller.
框架1由例如在薄膜2的后表面上注模来制造,由此第一组件4很好地免受环境引起的压力。The frame 1 is manufactured, for example, by injection molding on the rear surface of the membrane 2, whereby the first component 4 is well protected from the stresses caused by the environment.
LED 31可以被安排在框架1的第二表面9侧上,由此光电导体28延伸经过框架1到第一表面8侧。The LED 31 may be arranged on the second surface 9 side of the frame 1, whereby the photoconductor 28 extends through the frame 1 to the first surface 8 side.
图5是部分截面中的本发明的第五覆盖部件的示意性侧视图。需要注意,框架1没有在图5中示出,以简化事物的展示。这是对图4中示出的实施例的一个替代。Fig. 5 is a schematic side view of a fifth covering member of the present invention in partial section. It should be noted that frame 1 is not shown in Fig. 5 to simplify the presentation of things. This is an alternative to the embodiment shown in FIG. 4 .
第一组件包括两个LED 31作为光源。我们希望说明,在该上下文中,光源的数量也可以多于两个。The first assembly includes two LEDs 31 as light sources. We wish to illustrate that in this context the number of light sources can also be greater than two.
包含LED 31、导电总线和耦合器的第一组件4被直接构建进入薄膜2,在其上所需的电路被印刷或压制,或以本身已知的例如来自电路板技术或电子工业的某种其他方式来制造。The first assembly 4, comprising the LED 31, the conductive bus and the coupler, is built directly into the film 2, on which the required circuitry is printed or pressed, or in some form known per se, e.g. from circuit board technology or the electronics industry. other ways to manufacture.
本实施例的一个优势是,单独的电路板32变得不必要,由此可获得更简单和更薄的结构。An advantage of this embodiment is that a separate circuit board 32 becomes unnecessary, whereby a simpler and thinner structure can be obtained.
连接元件5以这样的方式连接到第一组件4,使得它与薄膜2的表面成直角;但是,这种安排不是绝对必须的,且连接元件相对于薄膜2的位置及其到框架的相对侧的路径在每种情况中被合适地选择。The connecting element 5 is connected to the first component 4 in such a way that it is at right angles to the surface of the membrane 2; however, this arrangement is not absolutely necessary and the position of the connecting element relative to the membrane 2 and its opposite side to the frame The path of is chosen appropriately in each case.
图6是部分截面中的本发明的第六覆盖部件的示意性侧视图。大体来说,这跟图5中示出的覆盖部件25类似,但是现在LED 31、光电导体28、导电总线、耦合器34等,即,第一组件4,被构建或固定到单独的辅助薄膜35上。Fig. 6 is a schematic side view of a sixth covering member of the present invention in partial section. In general, this is similar to the cover part 25 shown in Figure 5, but now the LEDs 31, photoconductors 28, conductive busses, couplers 34, etc., i.e. the first component 4, are constructed or fixed to a separate auxiliary film 35 on.
应当注意,辅助薄膜35被示为从薄膜2分离,以简单化事物的展示。It should be noted that the auxiliary membrane 35 is shown separated from the membrane 2 to simplify the presentation of things.
辅助薄膜35可被层压到薄膜2,此后覆盖部件25以这样的方式被构建,使得辅助薄膜35保留在框架和薄膜2之间。辅助薄膜35及其组件由此形成可作为实体被安装在覆盖部件25或其半成品中的安装模块。The auxiliary film 35 can be laminated to the film 2 , after which the cover part 25 is constructed in such a way that the auxiliary film 35 remains between the frame and the film 2 . The auxiliary film 35 and its assembly thus form a mounting module which can be mounted as a solid body in the cover part 25 or its semi-finished product.
与图5一起提供的说明也适用于连接元件5的位置。The description provided together with FIG. 5 also applies to the position of the connecting element 5 .
图7是部分截面中的本发明的第七覆盖部件的示意性侧视图。这里,第一元件4整个被安排在第二表面9上,该第二表面构成框架1的内表面并同时构成整个覆盖部件。Fig. 7 is a schematic side view of a seventh covering member of the present invention in partial section. Here, the first element 4 is arranged entirely on the second surface 9, which constitutes the inner surface of the frame 1 and at the same time constitutes the entire covering part.
在本发明的另一实施例中,薄膜2,例如嵌入薄膜,被安排在覆盖部件25的内表面上,且与它一起的还有第一元件4;换句话说,该实施例类似于图5中示出的实施例。根据图6的辅助薄膜35与其第一元件4也可以被固定到覆盖部件25的内表面上。In another embodiment of the invention, the film 2, for example an embedded film, is arranged on the inner surface of the covering part 25, and together with it the first element 4; Example shown in 5. The auxiliary film 35 according to FIG. 6 with its first element 4 can also be fastened to the inner surface of the cover part 25 .
框架1和薄膜2由至少部分透明的材料制造,由此LED 31发射的并被引导到光电导体28的光线经过它们。薄膜2还可以被省去。The frame 1 and the film 2 are made of an at least partially transparent material, whereby the light emitted by the LED 31 and guided to the photoconductor 28 passes through them. The film 2 can also be omitted.
通常,可以说明框架1可以通过喷漆、印刷、压制、涂层、使用第二塑料层、或以某个其他本身已知的其他相应的方式来处理。In general, it can be stated that the frame 1 can be treated by painting, printing, pressing, coating, using a second plastic layer, or in some other corresponding manner known per se.
第一元件4包含安排在光电导体28和电路板32之间的反射元件36,其将引向它的光线朝覆盖部件的外表面反射。The first element 4 comprises a reflective element 36 arranged between the photoconductor 28 and the circuit board 32, which reflects light directed towards it towards the outer surface of the cover part.
电路板32可以是挠线,例如,来自它的一部分以这样的方式保持不固定到框架1,使得该不固定的部分构成连接元件5和最重要的东西,即其挠性部件,第一元件4通过该挠性部件连接到第二元件。这里需要重复,连接元件5包括至少一条信号发送总线。The circuit board 32 can be a flex wire, for example, from a part of it that remains unfixed to the frame 1 in such a way that this unfixed part constitutes the connecting element 5 and the most important thing, its flexible part, the first element 4 is connected to the second element through this flexible part. It needs to be repeated here that the connection element 5 comprises at least one signal transmission bus.
图8a到8c是用于制造本发明的覆盖部件的方法的示意性部分截面侧视图。例如,该方法可以被用来制造根据图1c的覆盖部件。8a to 8c are schematic partial cross-sectional side views of the method for manufacturing the covering member of the present invention. For example, the method can be used to manufacture a cover part according to FIG. 1c.
图8a示出了连接元件5如何首先被固定到薄膜2的后表面7。该固定可以例如通过焊接、通过使用机械连接例如粘胶带“维可牢”(Velcro)、通过胶合例如层压或胶带(taping)来进行。FIG. 8 a shows how the connection element 5 is first fixed to the rear surface 7 of the membrane 2 . The fixation can be performed, for example, by welding, by using a mechanical connection such as adhesive tape "Velcro", by gluing such as lamination or taping.
在图3中示出的本发明的另一实施例中,连接元件5被集成到薄膜2。当使用这类解决方案时,连接元件5自然不需要被单独固定到薄膜2。In another embodiment of the invention shown in FIG. 3 , the connecting element 5 is integrated into the membrane 2 . When using this type of solution, the connecting element 5 naturally does not need to be fixed to the membrane 2 alone.
图8a还示出了下列步骤,其中,由薄膜2和连接元件5构成的安装模块21被带到开口的模具,或者更精确地,被带到置入第一半模18中的接收部件20。该模具还包括第二半模19。FIG. 8 a also shows the following steps, wherein the mounting module 21 consisting of the film 2 and the connecting element 5 is brought to the open mold or, more precisely, to the receiving part 20 inserted into the first half-mould 18 . The mold also includes a second mold half 19 .
所述接收部件20可以包括主动的辅助安排,以确保安装模块21保持在合适的位置,例如真空吸引器(vacuum suction)或某个其他的本身已知的相应的安排。但是,主动的辅助安排不是绝对必须的,因为在大多数情况下,仅仅模具和安装模块21之间的过盈配合就足以确保安装模块保持在模具中的合适位置。Said receiving means 20 may comprise active auxiliary arrangements to ensure that the mounting module 21 remains in place, such as a vacuum suction or some other corresponding arrangement known per se. However, an active assisting arrangement is not absolutely necessary, since in most cases the mere interference fit between the mold and the mounting module 21 is sufficient to ensure that the mounting module remains in place in the mould.
当安装模块21在第一半模18中的合适位置时,可以通过接合半模18、19来闭合模具。图4b中示出的闭合模具空腔22由此被构建入模具中。模具空腔22通过要制造的覆盖部件的形状所需的方式来定形。When the module 21 is installed in place in the first mold half 18, the mold can be closed by engaging the mold halves 18,19. The closed mold cavity 22 shown in Figure 4b is thus built into the mould. The mold cavity 22 is shaped in a manner required by the shape of the covering part to be produced.
要被固定到覆盖部件25的第一组件4也可以在模具闭合前被安排到模具中,并被连接到薄膜2。最为优选地,这在薄膜2被加到模具中之前完成。The first component 4 to be fixed to the cover part 25 can also be arranged into the mold and connected to the membrane 2 before the mold is closed. Most preferably, this is done before the film 2 is added to the mould.
图8a到8c中示出的第二半模19包括嵌入物23,其压迫第一半模18并防止注入到模具的塑性材料进入薄膜2中的开口3并在延伸到开口3的连接元件5的第二端14附近扩散。图8b的部分放大图示出了嵌入物23是如何通过将连接元件5弯曲为折叠来迫使它远离其路径的。连接元件5得益于其挠性结构不会被这损坏。嵌入物23可以包括在模具闭合时连接元件5最迟被安置进入的形状—凹陷或凹槽。The second mold half 19 shown in Figures 8a to 8c comprises an insert 23 which presses the first mold half 18 and prevents the plastic material injected into the mold from entering the opening 3 in the membrane 2 and at the connecting element 5 extending to the opening 3 Diffusion near the second end 14 of the The partially enlarged view of Fig. 8b shows how the insert 23 forces the connecting element 5 out of its path by bending it into a fold. The connecting element 5 is not damaged by this thanks to its flexible structure. The insert 23 may comprise a shape—a depression or groove—into which the connecting element 5 is seated at the latest when the mold is closed.
在图8b中,塑性材料26通过馈送通道(feed channel)24被注入到模具中。熔化的塑性材料26已进入模具并填充模具空腔22中的空余空间,并与薄膜2的后表面7接触。塑性材料26和薄膜材料2被选择为匹配,从而塑性材料通过化学键粘附到薄膜2上。该粘附还可以仅基于物理固定,例如形状锁定(form locking),或化学和物理固定的组合。如果需要,可以将辅助材料层加到薄膜2的内表面,从而通过在其上刷、喷或安排辅助材料薄膜来改善粘附。In FIG. 8b plastic material 26 is injected into the mold through a feed channel 24 . The molten plastic material 26 has entered the mold and fills the empty space in the mold cavity 22 and is in contact with the rear surface 7 of the film 2 . The plastic material 26 and the film material 2 are selected to match so that the plastic material adheres to the film 2 by chemical bonds. The adhesion can also be based solely on physical fixation, such as form locking, or a combination of chemical and physical fixation. If desired, a layer of auxiliary material can be added to the inner surface of the film 2 in order to improve adhesion by brushing, spraying or arranging a thin film of auxiliary material thereon.
注入到模具空腔22的塑性材料26以通过模具的冷却装置来冷却的本身已知的方式在模具空腔22中冷却下来,固化为不能流动的形式,并构成覆盖部分的框架1。在塑性材料26已足够冷却之后,模具被打开,且覆盖部件25从模具中移除。该步骤在图8c中示出。覆盖部件25包括注模的框架1、薄膜2和在它们之间固定的连接元件5。The plastic material 26 injected into the mold cavity 22 cools down in the mold cavity 22 in a manner known per se by means of cooling means of the mold, solidifies in a non-flowable form and constitutes the frame 1 of the covering part. After the plastic material 26 has cooled sufficiently, the mold is opened and the covering part 25 is removed from the mould. This step is illustrated in Figure 8c. The cover part 25 comprises an injection-molded frame 1 , a film 2 and a connecting element 5 fastened between them.
覆盖部件25可以进一步被处理和完成,例如,通过移除可能的毛刺、喷漆、给它安排附加的部件等,之后覆盖部件25已准备好安装到电子设备中。The cover part 25 can be further processed and finished, eg by removing possible burrs, painting, arranging it with additional parts etc., after which the cover part 25 is ready to be installed in the electronic device.
在本发明的实施例中,安装模块21还包括第一组件4,其如前所述转而包括一个或多个组件。第一组件4可以通过使用上述的固定方法来固定到薄膜2。In an embodiment of the invention, the mounting module 21 also comprises a first component 4 which in turn comprises one or more components as previously described. The first component 4 can be fixed to the film 2 by using the above-mentioned fixing method.
但是,包含第一组件4的安装模块21不是必须包括薄膜2。第一组件4和连接元件5可以被固定到塑料基底,其由此构成将安装模块21保持在一起的主体或基础。例如可以通过与图8a中示出安装模块21类似的方式来将安装模块21安排到注模模具或压缩模具中,这一类型的安装模块21可以被安排为覆盖部件25的一部分,或者它可以以本身已知的某个其他方式来粘贴或焊接或固定到预制的框架1。However, the mounting module 21 containing the first component 4 does not have to include the membrane 2 . The first component 4 and the connecting element 5 may be fixed to a plastic base, which thus constitutes the body or foundation holding the mounting module 21 together. For example, the mounting module 21 can be arranged into an injection mold or a compression mold in a similar manner to the mounting module 21 shown in FIG. Glued or welded or fixed to the prefabricated frame 1 in some other way known per se.
在本发明的实施例中,覆盖部件25或至少其框架1通过使用多组件注模方法来制造。第一组件4和连接元件5然后被安排在第一模具中,在其中它们通过将第一塑性材料注入到模具而被固定到第一塑性材料部件。第一模具以这样的方式被制造,使得第一组件4和/或连接元件5中被选择的部分保持被第一塑性材料暴露。之后,第一模具被打开,由此第一塑性材料部件以及固定到该部件的第一组件4和连接元件5保持在第一半模中。在第一模具的第二半模的位置上,第三半模被安排为接近该模具。该模具然后在其中具有空余空间,第二塑性材料被注入其中。第二塑性材料形成第二塑性材料部件,它封装第一组件4和/或它自己与第一塑性材料部件之间的连接元件5,但是以这样的方式,使得连接元件的挠性部件27保持为从覆盖部件分岔和可弯曲的部件。In an embodiment of the invention, the covering part 25 or at least the frame 1 thereof is manufactured by using a multi-component injection molding method. The first component 4 and the connecting element 5 are then arranged in a first mold, where they are fixed to the first plastic material part by injecting the first plastic material into the mould. The first mold is manufactured in such a way that selected parts of the first component 4 and/or connecting element 5 remain exposed by the first plastic material. Afterwards, the first mold is opened, whereby the first plastic material part and the first component 4 and the connecting element 5 fixed to this part remain in the first half-mould. At the position of the second mold half of the first mold, a third mold half is arranged close to the mold. The mold then has a free space therein into which the second plastic material is injected. The second plastic material forms a second plastic material part which encapsulates the first component 4 and/or the connecting element 5 between itself and the first plastic material part, but in such a way that the flexible part 27 of the connecting element remains For bifurcated and bendable parts from the covering part.
图9是部分截面中的本发明的第八覆盖部件的示意性侧视图。Fig. 9 is a schematic side view of an eighth covering member of the present invention in partial section.
覆盖部件25包括在与框架1关联的覆盖部件的内表面侧上(优选地在注模模具中)安排的薄膜2。框架1由至少部分透明的塑料制造。薄膜2还可以被安排在覆盖部件25的外表面侧上。The covering part 25 comprises a film 2 arranged on the inner surface side of the covering part associated with the frame 1 , preferably in an injection mould. The frame 1 is made of at least partially transparent plastic. The film 2 may also be arranged on the outer surface side of the covering member 25 .
例如,薄膜2是嵌入薄膜,并且太阳能电池37被集成其中。在该实施例中,太阳能电池37是被称为薄膜太阳能电池的太阳能电池,其通过印刷例如喷墨印刷或丝网印刷(stencil printing)、喷漆或使用某种其他覆盖方法而被制入薄膜2中。薄膜太阳能电池的操作本身是已知的,并基于在电池的电极之间安排的有机材料。薄膜太阳能电池的优点的例子是可以将它安排在直的表面和弯曲的表面两者上。得益于此,覆盖部件的形状不会限制太阳能电池37的表面区域。For example, the thin film 2 is an embedded thin film, and the solar cell 37 is integrated therein. In this embodiment, the solar cells 37 are so-called thin film solar cells, which are made into the thin film 2 by printing, for example inkjet printing or stencil printing, painting or using some other covering method. middle. The operation of thin-film solar cells is known per se and is based on organic materials arranged between the electrodes of the cell. An example of the advantage of a thin film solar cell is that it can be arranged on both straight and curved surfaces. Thanks to this, the shape of the covering member does not limit the surface area of the solar cells 37 .
太阳能电池37自然还可以是另一种类型,例如基于硅的太阳能电池。The solar cells 37 can naturally also be of another type, eg silicon-based solar cells.
太阳辐射穿过框架1并到达太阳能电池37,由此这产生电能。根据本说明书中之前描述的原理,太阳能电池37通过挠性部件27连接到设备的电路。Solar radiation passes through the frame 1 and reaches the solar cells 37, whereby this generates electrical energy. The solar cell 37 is connected via the flexible member 27 to the electrical circuit of the device according to the principles described earlier in this specification.
保护层38被安排在薄膜2上太阳能电池37的前侧。保护层38是指至少部分使太阳能电池37不可见的一层。保护层38现在是光漫射层。它允许大多数光线到达太阳能电池37,但它至少大体上隐藏该太阳能电池,从而在检查设备时不能很容易地看到太阳能电池。光漫射层可以具有图案或其他装饰特征。A protective layer 38 is arranged on the film 2 on the front side of the solar cells 37 . The protective layer 38 refers to a layer which at least partially renders the solar cell 37 invisible. The protective layer 38 is now a light diffusing layer. It allows most of the light to reach the solar cell 37, but it at least substantially hides the solar cell so that it cannot be easily seen when inspecting the device. The light diffusing layer can have patterns or other decorative features.
光漫射层还可以被安排在框架1上,由此它可以在太阳能电池37的前侧与框架1厚度相等,或者仅构成框架的部分厚度。保护层38的某些其他实施例是用半透明的漆、清漆等着色、涂层或添加图案(patterned)的框架1。The light diffusing layer can also be arranged on the frame 1, whereby it can be as thick as the frame 1 on the front side of the solar cells 37, or only constitute part of the thickness of the frame. Certain other embodiments of the protective layer 38 are the frame 1 colored, coated or patterned with a translucent lacquer, varnish or the like.
在本发明的另一实施例中,保护层38包括改变其颜色或其外观的某个其他属性的一层或多层。这一类型的保护层38可以例如被实现为本身已知的电致变色(electrochromic)层。在充电施加到电致变色层时,它可逆地改变其颜色。必要的充电可以由设备的用户激活或自动激活而不用用户干预。该层改变其颜色或其外观的其他属性的操作还可以基于温度改变等。In another embodiment of the invention, protective layer 38 includes one or more layers that alter its color or some other property of its appearance. A protective layer 38 of this type can be realized, for example, as an electrochromic layer known per se. When a charge is applied to the electrochromic layer, it reversibly changes its color. The necessary charging can be activated by the user of the device or automatically without user intervention. The action of the layer changing its color or other properties of its appearance could also be based on temperature changes and the like.
在本发明的实施例中,保护层38被安排为用作显示设备,优选地为触摸屏,例如键盘可以被施加于此。触摸屏所需到导体可以使用透明的或非常细的导体来实现。保护层38的操作所需的对设备的电路的接触可以通过例如挠性部件27来实现。In an embodiment of the invention, the protective layer 38 is arranged to function as a display device, preferably a touch screen, to which eg a keyboard may be applied. The conductors required for the touch screen can be implemented using transparent or very thin conductors. The access to the electrical circuits of the device required for the operation of the protective layer 38 can be achieved through the flexible member 27, for example.
图10是部分截面中的本发明的第九覆盖部件的示意性侧视图。该实施例不同于图9中示出的,主要在于薄膜2在两个塑料层1a、1b之间安排。这些塑料层1a、1b构成覆盖部件25的框架1。该类型的结构例如可以通过使用两阶段注模或多组件注模来构建。在图10示出的结构中,操作层依附于其上的薄膜2被很好地保护以免受外部负荷等。Fig. 10 is a schematic side view of a ninth covering member of the present invention in partial section. This embodiment differs from that shown in FIG. 9 mainly in that the film 2 is arranged between two plastic layers 1a, 1b. These plastic layers 1 a , 1 b form the frame 1 of the cover part 25 . Structures of this type can be built, for example, by using two-stage injection molding or multi-component injection molding. In the structure shown in FIG. 10, the film 2 to which the operating layer is attached is well protected from external loads and the like.
图9和图10中示出的实施例的另一区别是后者没有保护层38。保护层38自然地可以被加到图10中的覆盖部件25,并且它可以从图9中的覆盖部件省去。Another difference between the embodiments shown in FIGS. 9 and 10 is that the latter does not have a protective layer 38 . The protective layer 38 can naturally be added to the cover part 25 in FIG. 10 and it can be omitted from the cover part in FIG. 9 .
在某些情形下,本申请中描述的特征可以按所述的那样使用,而不管其他特征。另一方面,本申请中描述的特征还可以被组合,以在必要时提供不同的组合。In some instances, features described in this application may be used as described regardless of other features. On the other hand, the features described in this application can also be combined to provide different combinations as necessary.
总之,可以说明,根据本发明的电子设备的覆盖部件的特征在于信号发送总线包含挠性部件,其被安排为从覆盖部件分岔开。此外,可以说明,本发明的电子设备的特征在于它具有如权利要求1到37中任一项所请求保护的覆盖部件。In conclusion, it can be stated that the cover part of an electronic device according to the invention is characterized in that the signal transmission bus comprises a flexible part arranged to branch off from the cover part. Furthermore, it can be stated that the electronic equipment of the present invention is characterized in that it has a cover member as claimed in any one of claims 1 to 37.
附图和相关描述仅为了示出本发明的思想。对于本领域技术人员来说很明显,本发明不限于上述实施例,其中本发明以示例的方式被描述,并且在下列权利要求书中定义的发明思想的范围内,本发明可以有很多修改和不同的实施例。The drawings and the related description are only intended to illustrate the idea of the invention. It will be obvious to a person skilled in the art that the invention is not limited to the above-described embodiments, in which the invention has been described by way of example, and that the invention is susceptible to many modifications and variations within the scope of the inventive idea defined in the following claims. different examples.
Claims (31)
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FI20095860A FI122621B (en) | 2009-08-20 | 2009-08-20 | Electronic device and shell |
FI20095860 | 2009-08-20 | ||
PCT/FI2010/050633 WO2011020946A2 (en) | 2009-08-20 | 2010-08-16 | Electronic device |
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CN102484662A CN102484662A (en) | 2012-05-30 |
CN102484662B true CN102484662B (en) | 2015-05-13 |
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CN201080036722.2A Expired - Fee Related CN102484662B (en) | 2009-08-20 | 2010-08-16 | Cover comprising a flexible connecting element for an electronic device |
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CN (1) | CN102484662B (en) |
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CN102104640A (en) * | 2009-12-18 | 2011-06-22 | 索尼爱立信移动通讯股份有限公司 | Illumination housing cover for mobile communication equipment |
JP5314773B2 (en) * | 2012-02-10 | 2013-10-16 | ホシデン株式会社 | Component module |
US9297675B2 (en) | 2013-10-04 | 2016-03-29 | Tactotek Oy | Illuminated indicator structures for electronic devices |
DE102014106585A1 (en) * | 2014-05-09 | 2015-11-12 | Leonhard Kurz Stiftung & Co. Kg | Multilayer body and method for its production |
EP3124197B1 (en) | 2015-07-31 | 2017-12-20 | C.R.F. Società Consortile per Azioni | Method for manufacturing a component for a motor-vehicle interior |
DE102015222190B4 (en) * | 2015-11-11 | 2019-03-28 | Itt Manufacturing Enterprises Llc | Connector and motor or valve cover member comprising a connector |
WO2017219260A1 (en) * | 2016-06-22 | 2017-12-28 | 广东欧珀移动通信有限公司 | Camera assembly and mobile terminal |
CN108048794B (en) * | 2017-12-26 | 2019-12-03 | 昆山英利悦电子有限公司 | It is a kind of for covering the PVD jig of mobile phone TYPE-C charging interface pin |
DE102019126232B4 (en) * | 2019-09-30 | 2024-11-14 | Lisa Dräxlmaier GmbH | METHOD FOR PRODUCING A CURRENT-CARRYING VEHICLE COMPONENT AND VEHICLE COMPONENT |
CN114979319B (en) * | 2021-02-24 | 2023-04-14 | Oppo广东移动通信有限公司 | Electronic equipment and shell assembly thereof |
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EP0927949A2 (en) * | 1997-12-29 | 1999-07-07 | SAMSUNG ELECTRONICS Co. Ltd. | Character-recognition system for a mobile radio communication terminal and method thereof |
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CN102484662A (en) | 2012-05-30 |
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FI20095860L (en) | 2011-02-21 |
FI20095860A0 (en) | 2009-08-20 |
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