CN102454969B - LED replaceable universal platform with super heat pipe - Google Patents
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Abstract
本发明提供一种具有超热导管的发光二极管可替换通用平台。大功率LED正或负极经双面印刷电路底板或铝基板被连接至散热灯具外壳,其中进行无缝的全接触导热。超大功率LED经侧部或底部直接经超导热管导热至灯具外空间。本发明的优点是将LED结点无间断地导热传送至灯外空气间。本发明的具有超热导管的发光二极管可替换通用平台比现有的超热LED灯热阻更低,效率更高。
The present invention provides a replaceable universal platform for light emitting diodes with super heat pipes. The positive or negative pole of a high-power LED is connected to a heat dissipation lamp housing via a double-sided printed circuit board or an aluminum substrate, wherein seamless full-contact heat conduction is performed. The ultra-high-power LED is directly heat-conducted to the space outside the lamp via the side or bottom through the super heat pipe. The advantage of the present invention is that the heat of the LED node is transferred to the air space outside the lamp without interruption. The replaceable universal platform for light emitting diodes with super heat pipes of the present invention has lower thermal resistance and higher efficiency than the existing super heat LED lamp.
Description
技术领域 technical field
本发明涉及发光二极管LED的照明系统。具体地说,本发明涉及具有一维超热导管的发光二极管LED可替换通用平台,具有二维及超二维超热导管的LED可替换通用平台。本发明还涉及一种扁平式超热导管及二维平面式/平板式超导热装置,该超导热装置结构提供一种LED可替换平台。 The invention relates to a lighting system of light-emitting diodes (LEDs). Specifically, the present invention relates to a general-purpose platform for replacing LEDs with one-dimensional superheat pipes, and a general-purpose platform for replacing LEDs with two-dimensional and ultra-two-dimensional superheat pipes. The invention also relates to a flat superheat pipe and a two-dimensional planar/flat superconducting heat device. The structure of the superconducting heat device provides an LED replaceable platform.
背景技术 Background technique
中国专利公报CN 201093433Y 公开了一种用以提高散热效果LED灯具结构。这种灯具结构包括:灯具主体,具有投光面以及背面,投光面设有容置槽;电控构件,设于灯具主体的预定部位;多面向灯座板,具有正面以及背面,设于灯具主体的容置槽中,面向灯座板为阶状曲折形状,在其正面形成具有阶梯差异的至少两个阶面,不同阶面的面向具有角度差异变化,LED配置于各阶面;U形导热管,设于多面向灯座板的背面,U形导热管的受热段抵靠于多面向灯座板的背面,U形导热管的二凸伸状散热段则穿出灯具的背面;外置式散热座,设于灯具主体的背面外部,该外置式散热座与U形导热管相结合。这种灯具结构适用于各种场合的照明。 Chinese Patent Publication CN 201093433Y discloses a LED lamp structure for improving heat dissipation effect. The lamp structure includes: a lamp main body with a light-projecting surface and a back surface, the light-projecting surface is provided with an accommodating groove; an electric control component is arranged at a predetermined position of the lamp main body; In the accommodating groove of the main body of the lamp, facing the lamp base plate is a step-like zigzag shape, and at least two step surfaces with step differences are formed on the front side, and the faces of different step surfaces have angular differences, and the LEDs are arranged on each step surface; U The heat-conducting pipe is arranged on the back of the multi-facing lamp holder plate, the heating section of the U-shaped heat-conducting pipe is against the back of the multi-facing lamp holder plate, and the two protruding heat-dissipating sections of the U-shaped heat-conducting pipe pass through the back of the lamp; The external heat sink is arranged outside the back of the main body of the lamp, and the external heat sink is combined with the U-shaped heat pipe. This lamp structure is suitable for lighting in various occasions.
通常,发光二极管LED灯具依赖于优良的散热设计。只有令LED结点温度低于约70℃才可能使发光二极管LED有超过五万小时70%光寿命。 Generally, light-emitting diode LED lamps rely on excellent heat dissipation design. Only by keeping the LED junction temperature below about 70°C is it possible to make the light-emitting diode LED have a 70% light life of more than 50,000 hours.
发明内容 Contents of the invention
本发明的目的在于提供一种可增大应用和负载范围的一维、二维和超二维超热导管LED的可替换通用平台。 The purpose of the present invention is to provide an alternative general platform for one-dimensional, two-dimensional and ultra-two-dimensional superheat pipe LEDs that can increase the application and load range.
根据本发明的第一方面,通过一种具有一维超导热管的LED可替换通用平台,具有特定的最大LED使用输出功率范围、驱动器数值、热阻值及使用方式,其特征在于所述可替换平台是一种COD (器件上芯片) LED光源可替换平台,兼容于今后LED光效提升的灯具,且适用于任何品牌的LED; According to the first aspect of the present invention, an LED replaceable universal platform with a one-dimensional superconducting heat pipe has a specific maximum LED use output power range, driver value, thermal resistance value and use method, which is characterized in that the The replacement platform is a COD (chip on device) LED light source replacement platform, which is compatible with lamps with improved LED light efficiency in the future, and is suitable for any brand of LED;
所述平台包括双面底板的印刷电路板 PCB,电路板的底部通过焊点连接至大功率LED阳/阴极的散热片,用导热有机硅加压连接铝轨壳或反光板导热,在铝轨壳上的LED灯或其它COD LED组件经铝基板直接接触至散热器,或经反光板连接到散热器,所述铝基板或反光板或铝轨壳经高效能超导热管与 所述散热器接触导热,其中在散热器与所述铝基板或反光板或铝轨壳之间用环氧树脂固定或使用回流焊金属全接触,以便导热和排热至灯外壳,所述超导热管为一真空密封薄壁金属管,管内采用低热阻低潜热混合物流体使能利用毛细结构快速回流。 The platform includes a printed circuit board PCB with a double-sided bottom plate. The bottom of the circuit board is connected to the heat sink of the anode/cathode of the high-power LED through solder joints, and the heat conduction silicone is used to pressurize and connect the aluminum rail shell or the reflector to conduct heat. The LED lights or other COD LED components on the shell are directly connected to the radiator through the aluminum substrate, or connected to the radiator through the reflector, and the aluminum substrate or reflector or the aluminum rail shell is connected to the radiator through a high-efficiency superconducting heat pipe Contact heat conduction, where the heat sink is fixed with epoxy resin or reflowed metal full contact between the aluminum substrate or reflector or aluminum rail shell, so as to conduct heat and discharge heat to the lamp shell, and the superconducting heat pipe is a Vacuum-sealed thin-walled metal tube, using low thermal resistance and low latent heat mixture fluid in the tube to enable rapid reflow using capillary structure.
所述通用平台还可以配置超导热管热板,平衡地在所述平台两侧将两支以上超导热管夹置在灯壳散热器及反光板之间,以增强散热功能。 The general platform can also be equipped with superconducting heat pipe hot plates, and more than two superconducting heat pipes are sandwiched between the lamp housing radiator and the reflector in a balanced manner on both sides of the platform to enhance the heat dissipation function.
所述通用平台还可以设有类同的多枚垂直热管或热柱,其底部可直接接触灯壳以进行散热,或超导热管需伸延长些,其中扁平或其它几何形状的超导热管冷端用扁平或其它相应的几何形状的固定件进行固定以便用于灯壳的导热。 The general platform can also be provided with a plurality of similar vertical heat pipes or heat columns, the bottom of which can directly contact the lamp housing for heat dissipation, or the superconducting heat pipes need to be extended longer, wherein the superconducting heat pipes of flat or other geometric shapes are cold. The end is fixed with a flat or other corresponding geometric shape of the fixture for the heat conduction of the lamp housing.
根据本发明的第二方面,所述具有一维超导热管的LED可替换通用平台还包括一真空密封薄壁金属管,管内采用低热阻低潜热过氧化氢( H2O2 )及壬醛nonanal ( C9H18O )混合物流体,以能与毛细结构密切接触。所述混合物流体的粘滞系数低,毛细回流的速度快,能更快完成循环,从而提升散热效率。另外,所述混合物流体的表面张力大,进而增加毛细作用力,有助于快速回流。所述混合物流体与其它常用工作液相比,在35℃至50℃的温度下具有更大热传输效率。 According to the second aspect of the present invention, the LED replaceable universal platform with a one-dimensional superconducting heat pipe also includes a vacuum-sealed thin-walled metal tube, and hydrogen peroxide (H 2 O 2 ) and nonanal with low thermal resistance and low latent heat are used in the tube. nonanal ( C 9 H 18 O ) mixture fluid, in order to be in close contact with the capillary structure. The viscosity coefficient of the mixture fluid is low, the capillary return speed is fast, and the cycle can be completed faster, thereby improving the heat dissipation efficiency. In addition, the mixture fluid has high surface tension, which increases capillary force and facilitates rapid reflow. Compared with other commonly used working fluids, the mixed fluid has a greater heat transfer efficiency at a temperature of 35°C to 50°C.
根据本发明的第三方面,所述具有一维超导热管的LED可替换通用平台中,其带超导热管的反光板添加了纳米涂层,以增加光效,及COD在其双面线路板至SUPERFLUX LED条型灯以及至SMD LED灯条进行直接导热,在其上方加置条状金字塔或棱柱状透镜( prism lens stick )二次光学器件。这里,散热器反光板增加三成以上光输出,而照明角度相若,令其类似T5日光灯等光源及具有更高光亮度,LED导热至散热器反光板。 According to a third aspect of the present invention, in the replaceable universal platform for LEDs with one-dimensional superconducting heat pipes, the reflective plate with superconducting heat pipes is added with a nano-coating to increase light efficiency, and COD is added to its double-sided circuit. Board to SUPERFLUX LED strip light and to SMD LED light strip for direct heat conduction, and a strip-shaped pyramid or prism lens stick (prism lens stick) secondary optical device is added above it. Here, the radiator reflector increases the light output by more than 30%, and the lighting angle is similar, making it similar to T5 fluorescent lamps and other light sources with higher brightness. The LED heat conducts to the radiator reflector.
根据本发明的第四方面,在所述具有一维超导热管的LED可替换通用平台中,包括卤素灯泡MR16、AR111、PAR20,以及其灯泡连灯座种类如GU10等。一般LED垂直超导热管设置,灯座E14,E26,E27等则垂直及水平于超导热管设置。 According to the fourth aspect of the present invention, the LED replaceable universal platform with one-dimensional superconducting heat pipes includes halogen bulbs MR16, AR111, PAR20, and bulbs with sockets such as GU10. Generally, LED vertical superconducting heat pipes are installed, and lamp holders E14, E26, E27, etc. are vertically and horizontally arranged on superconducting heat pipes.
根据本发明的第五方面,提供一种具有二维超导热管的LED可替换通用平台,其特征在于,除了平面式微流导热管导热至反光板及散热器或带鳍片灯壳外,还可以放置真空均温袋于直接导热COD原型及或反光板底部,和/或夹藏放灯壳或散热器中,提高性能及效率。另有一枚以上Z-轴复合式毛细结构的微热管超导热管加置散热器,其中LED 热源或超导热管顶部用回流焊至LED平台,以及在冷端加黑色导热环氧树脂以及用固定件固定底部至灯壳,以增强输出功率及减少灯具体积。平板式微流导热管散热效能的优点是可以降低舆热源的接触热阻,且平面式热管在内部工作流体的使用上,不仅可以增加内部流体的填充量,并应用多条流道增加流体回流量。热源中的辐射状结构的平板式热管,利用蒸汽流将热量从中央横散至两侧,达到热扩散的效果。而平行通道的热管,是由一端加热汽化后将热量带至另一端进行冷却,进而提升散热面积;在冷热端分开的状况下,皆有沸腾的现象产生,且不受热管的摆放角度的限制;Z-轴热柱或顶部加大垂直热管,增大直接接触超大功率LED单元面积,导热至灯底壳及或反光板,加大输出功率,LED光源的二次光学元件,加纳米涂层增加光效,用作角度反射器。 According to the fifth aspect of the present invention, there is provided an LED replaceable universal platform with a two-dimensional superconducting heat pipe, which is characterized in that, in addition to the planar microfluidic heat pipe conducting heat to the reflector and radiator or the lamp housing with fins, there is also The vacuum temperature equalization bag can be placed on the direct heat conduction COD prototype and or the bottom of the reflector, and/or placed in the lamp housing or radiator to improve performance and efficiency. There is also more than one Z-axis composite capillary structure micro heat pipe superconducting heat pipe with heat sink, in which the LED heat source or the top of the superconducting heat pipe is reflow soldered to the LED platform, and black thermal epoxy resin is added to the cold end and fixed with Fix the bottom to the lamp housing to enhance the output power and reduce the volume of the lamp. The advantage of the heat dissipation performance of the flat-plate microfluidic heat pipe is that it can reduce the contact thermal resistance with the heat source, and the use of the internal working fluid of the planar heat pipe can not only increase the filling amount of the internal fluid, but also increase the fluid return flow by using multiple flow channels . The flat-plate heat pipe with radial structure in the heat source uses steam flow to spread heat from the center to both sides to achieve the effect of heat diffusion. The heat pipes with parallel channels are heated and vaporized at one end and then brought to the other end for cooling, thereby increasing the heat dissipation area; when the hot and cold ends are separated, there will be boiling phenomenon, and it is not affected by the placement angle of the heat pipe. The limitation of the Z-axis heat column or the top of the vertical heat pipe is increased to increase the direct contact with the ultra-high-power LED unit area, heat conduction to the lamp bottom shell and or reflector, increase the output power, and the secondary optical components of the LED light source, plus nanometer Coating increases light effect and acts as an angled reflector.
根据本发明的第六方面,在所述具有二维超导热管的LED可替换通用平台中,可替换的发光二极管灯泡(retrofit LED lamp bulb)具有一枚以上Z轴超导热管及一枚以上平板式超导热管,其底部接上灯座,外壳用多鳍片散热,以便减少体积及重量,而超导热管顶部则增大面积。 According to the sixth aspect of the present invention, in the LED replaceable universal platform with two-dimensional superconducting heat pipes, the replaceable light-emitting diode bulb (retrofit LED lamp bulb) has more than one Z-axis superconducting heat pipe and more than one The bottom of the flat-plate superconducting heat pipe is connected to the lamp holder, and the shell uses multi-fins to dissipate heat, so as to reduce the volume and weight, while the top of the superconducting heat pipe increases the area.
根据本发明的第七方面,在所述具有二维超导热管的LED可替换通用平台中,在外或内壳再加条状或其它几何形状LED灯附上超导热管等。 According to the seventh aspect of the present invention, in the LED replaceable universal platform with two-dimensional superconducting heat pipes, strip-shaped or other geometrically shaped LED lamps are attached to the outer or inner shell, and superconducting heat pipes are added.
根据本发明的第八方面,关于具有二维超导热管的LED可替换通用平台,可以采用卤素灯泡MR16、AR111、PAR20,以及其灯泡连灯座种类如GU10等。一般LED垂直于超导热管设置,灯座E14,E26,E27等则垂直及水平于超导热管设置。 According to the eighth aspect of the present invention, regarding the LED replaceable universal platform with two-dimensional superconducting heat pipes, halogen bulbs MR16, AR111, PAR20, and bulbs with lamp holders such as GU10 can be used. Generally, LEDs are arranged vertically to the superconducting heat pipe, and lamp holders E14, E26, E27, etc. are arranged vertically and horizontally to the superconducting heat pipe.
根据本发明的第九方面,提供一种具有超二维超导热管的LED可替换通用平台,采用了上述超导热管LED可替换通用平台的一维水平式加垂直式设计,在灯壳内接近超导热管及热源加多孔流道,让空气或水流通过降温及导热,适用于室内灯具或经防水设计用于水底或潜水灯具,其多孔道水或气流流经平台。 According to the ninth aspect of the present invention, there is provided an LED replaceable universal platform with ultra-two-dimensional superconducting heat pipes, which adopts the one-dimensional horizontal and vertical design of the above-mentioned superconducting heat pipe LED replaceable universal platform, and in the lamp housing It is close to the superconducting heat pipe and the heat source and adds multi-hole flow channels to allow air or water flow to cool down and conduct heat. It is suitable for indoor lighting or waterproof design for underwater or diving lighting. The multi-channel water or air flows through the platform.
根据本发明的第十方面,提供一种灯具,其在于采用了上述具有一维超导热管或二维超导热管的可替换通用平台。 According to a tenth aspect of the present invention, a lamp is provided, which adopts the above-mentioned replaceable universal platform with one-dimensional superconducting heat pipe or two-dimensional superconducting heat pipe.
根据本发明的第十一方面,提供一种冷阴极管( CCFL )或感应灯,其在于采用了上述具有一维超导热管或二维超导热管的可替换通用平台。 According to an eleventh aspect of the present invention, there is provided a cold cathode tube ( CCFL ) or an induction lamp, which adopts the above-mentioned replaceable universal platform with a one-dimensional superconducting heat pipe or a two-dimensional superconducting heat pipe.
根据本发明的第十二方面,提供一种感应灯,其在于采用了上述具有一维超导热管或二维超导热管的可替换通用平台。 According to a twelfth aspect of the present invention, an induction lamp is provided, which adopts the above-mentioned replaceable universal platform with one-dimensional superconducting heat pipe or two-dimensional superconducting heat pipe.
本发明的一维超热导管LED可替换通用平台采用发光二极管原型导热法,利用线路板(双面印刷线路板或铝基板)经过超热导管导热。使用二维及二维以上超热导管导热发光二极管可替换平台原型,从而增大超热导管LED可替换通用平台的应用及负载范围。 The one-dimensional superheat pipe LED replaceable universal platform of the present invention adopts the light-emitting diode prototype heat conduction method, and uses a circuit board (double-sided printed circuit board or aluminum substrate) to conduct heat through the superheat pipe. Using two-dimensional and more than two-dimensional superheat pipe heat conduction light-emitting diode replaceable platform prototypes, thereby increasing the application and load range of the superheat pipe LED replaceable universal platform.
发光二极管LED灯具依赖于优良的散热设计。只有令LED结点温度低于约70℃才可能使发光二极管LED有超过五万小时70%光寿命,因而发明人把LED正/负极焊点经双面线路板或铝基板直接连接铝散热器至灯壳,超热导管夹置其中,将LED结点高温排出至空间,用超热导管及流体力学设计,在结构及设计上解决LED热散问题。 Light-emitting diode LED lamps rely on excellent heat dissipation design. Only when the LED junction temperature is lower than about 70°C can the light-emitting diode LED have a 70% light life of more than 50,000 hours, so the inventor directly connects the LED positive/negative solder joints to the aluminum radiator through a double-sided circuit board or an aluminum substrate. To the lamp housing, the superheat pipe is sandwiched in it to discharge the high temperature of the LED node into the space. The superheat pipe and fluid mechanics design are used to solve the problem of LED heat dissipation in terms of structure and design.
本发明用途广泛。通常本发明应用于大功率LED及超大功率LED,可作普通照明灯具,代替卤素、充气光源、节能光管等传统灯具。 The invention is widely used. Usually the present invention is applied to high-power LEDs and ultra-high-power LEDs, and can be used as general lighting fixtures to replace traditional lighting fixtures such as halogens, gas-filled light sources, and energy-saving light pipes.
本发明的发光二极管LED照明系统在应用范围上可代替绝大部分普通照明灯具。 The light-emitting diode LED lighting system of the present invention can replace most common lighting fixtures in the scope of application.
COD (chips on device) 器件上芯片LED晶片组件极片直接导热原型是指食人鱼大型高亮度LED,带导热片晶片组件,带导热片smd组件及OLED组件(superflux,cob,smd,以及OLED LED modules),经双面纤维线路底板或铝质印刷线路底板的光源组件直接导热至带散热片反光板,或带散热片灯壳或灯具。 COD (chips on device) chip-on-device LED chip component polar piece direct heat conduction prototype refers to piranha large high-brightness LED, chip component with heat conduction sheet, smd assembly with heat conduction sheet and OLED assembly (superflux, cob, smd, and OLED LED modules), through the double-sided fiber circuit base plate or the light source component of the aluminum printed circuit base plate, the heat is directly conducted to the reflector with heat sink, or the lamp housing or lamp with heat sink.
本发明是一种一维以上超导热管设计发光二极管可替换通用( universal )平台,适用于任何品牌的一枚单元或多枚单元、一枚条状或多枚条状或其它不同几何形状 COD 发光二极管,方便用家使用及保养。 The present invention is a replaceable universal platform for light-emitting diodes designed with superconducting heat pipes above one dimension, applicable to one unit or multiple units, one strip or multiple strips or other CODs of different geometric shapes Light-emitting diodes are convenient for users to use and maintain.
一维导热管原型:当发光二极管功率较低时,可采用最少一支超导热管,利用固定元件或其它紧密接触方法置于散热器灯具或用开发模具的或现有的灯具连接及 COD LED 原型。 One-dimensional heat pipe prototype: when the power of the light-emitting diode is low, at least one superconducting heat pipe can be used, and it can be placed on the radiator lamp by using fixed components or other close contact methods, or connected with the developed mold or the existing lamp and COD LED prototype.
当需要较高发光二极管功率输出或其它需求,加置真空均温袋于直接导热COD原型及反光板底部,夹藏于灯壳或散热器中,提高性能及效率。一枚以上Z-轴竖直超导热管加置于散热器或反光板至热源,其冷端至灯内底部,用固定元件固定,再加黑色环氧树脂或其它紧密接触的粘结材料固定于灯壳。 When higher LED power output or other requirements are required, add a vacuum equalizing bag to the bottom of the direct heat conduction COD prototype and reflector, and hide it in the lamp housing or radiator to improve performance and efficiency. More than one Z-axis vertical superconducting heat pipe is added to the radiator or reflector to the heat source, and its cold end is to the bottom of the lamp, fixed with a fixing element, and then fixed with black epoxy resin or other close-contact adhesive materials in the lamp housing.
新的直接导热发光二极管原型,采用两维铜质真空超导热管导热原理,最少一支导热管垂直置放Z-轴至铝质灯壳及散热器,用两支以上扁平或平板式导热管水平埋置于灯具反光板或光源组件及带散热片灯壳中,管内工作流体采用低热阻低潜热过氧化氢( H2O2 )及壬醛 nonanal ( C9H18O )混合物,相比纯水或其它混合物流体超导热管性能更高。 The new prototype of direct heat conduction light-emitting diodes adopts the heat conduction principle of two-dimensional copper vacuum superconducting heat pipes. At least one heat pipe is placed vertically on the Z-axis to the aluminum lamp housing and radiator, and more than two flat or flat heat pipes are used. It is horizontally embedded in the lamp reflector or light source assembly and the lamp housing with heat sink. The working fluid in the tube is a mixture of hydrogen peroxide ( H 2 O 2 ) and nonanal ( C 9 H 18 O ) with low thermal resistance and low latent heat. Pure water or other mixed fluid superconducting heat pipes have higher performance.
此外,还可利用水冷法,冷水流动于灯具管道带走热量,适用于潜水或水底灯。利用超二维导热管设计,可提高发光二极管的功率。 In addition, the water cooling method can also be used, cold water flows in the lamp pipe to take away heat, suitable for diving or underwater lamps. Utilizing the ultra-two-dimensional heat pipe design, the power of light-emitting diodes can be increased.
本发明还提供一种超导热装置,其被构造为扁平式超热导管或平面式/平板式超导热装置,其中该超导热装置有石墨片或石墨片连薄金属片在LED与热管之间作传热介质,使热流无阻导热。 The present invention also provides a superconducting thermal device, which is configured as a flat superheat pipe or a planar/flat superconducting thermal device, wherein the superthermal thermal device has a graphite sheet or a graphite sheet connected with a thin metal sheet between the LED and The heat transfer medium is used between the heat pipes, so that the heat flow is unimpeded and conducts heat.
优选地,该平面式/平板式超导热装置结构可作真空超导热板,或实芯超导热金属体作可替换LED或太电平台。在所述超导热装置可替换LED平台上, 或实芯超导热金属体开设有数个通孔。 Preferably, the planar/flat superconducting thermal device structure can be used as a vacuum superconducting thermal plate, or a solid superconducting thermal metal body can be used as a replaceable LED or solar platform. Several through holes are opened on the replaceable LED platform of the superconducting thermal device, or on the solid core superconducting thermal metal body.
本发明还提供一种一体化二维平面式/平板式超导热装置, 其中平面式/平板式实芯超导热体底部回流焊至另一超导热体装置, 其尾端超导热管导热经灯壳至灯外。替换地,平板式超导热管也可以不需回流焊至另一超导热体, 制作时全真空。 The present invention also provides an integrated two-dimensional planar/flat superconducting device, wherein the bottom of the planar/flat solid superconducting body is reflow soldered to another superconducting device, and the superconducting heat pipe at the tail end The heat is conducted through the lamp housing to the outside of the lamp. Alternatively, the flat-plate superconducting heat pipe can also be soldered to another superconducting body without reflow, and it can be produced in full vacuum.
附图说明 Description of drawings
图1示出了水平式一维导热管LED可替换通用平台的剖面图。 Figure 1 shows a cross-sectional view of a horizontal one-dimensional heat pipe LED alternative general platform.
图2示出了垂直式一维导热管LED可替换通用平台的剖面图以及顶视图。 Fig. 2 shows a sectional view and a top view of a vertical one-dimensional heat pipe LED replaceable universal platform.
图3示出了二维导热管LED可替换通用平台的剖面图。 Fig. 3 shows a cross-sectional view of a two-dimensional heat pipe LED alternative general platform.
图4示出了超过二维导热管LED可替换通用平台的剖面图。 Figure 4 shows a cross-sectional view of an alternative generic platform for LEDs over two-dimensional heat pipes.
图5、图6是本发明实施例超导热装置的结构示意图。 Fig. 5 and Fig. 6 are structural schematic diagrams of a superconducting thermal device according to an embodiment of the present invention.
具体实施方式 Detailed ways
现在参照附图描述本发明的最佳实施例。 Preferred embodiments of the present invention will now be described with reference to the accompanying drawings.
图1是水平式一维导热管LED可替换通用平台的示意图。制作上利用双面底板的印刷电路板 PCB 1的底部通过焊点连接至大功率LED阳/阴极的散热片,用导热有机硅加压连接铝轨壳5或反光板实现导热。结构上,平台也可包括灯罩6,在铝轨壳5上的LED灯或其它COD LED组件经PCB 1的铝基板直接接触而接至散热器 10, 和/或通过反光板经高效能超导热管7与散热器10进行全接触而导热。在铝轨壳5或反光板与散热器10之间用环氧树脂8固定或使用回流焊金属全接触,以便导热和排热至灯外壳。超导热管7为一真空密封薄壁金属管,管内采用低热阻低潜热混合物流体9,使能利用毛细结构快速回流,由此可解决LED不容易散热的问题。如图1所示,该平台还可以设有二次光学元件4用于增加光输出效率。 Figure 1 is a schematic diagram of a horizontal one-dimensional heat pipe LED replaceable general platform. In production, the bottom of the printed circuit board PCB 1 using a double-sided bottom plate is connected to the heat sink of the anode/cathode of the high-power LED through solder joints, and the heat conduction silicone is used to pressurize and connect the aluminum rail shell 5 or the reflector to realize heat conduction. Structurally, the platform can also include a lampshade 6, and the LED lamp or other COD LED components on the aluminum rail shell 5 are connected to the radiator 10 through direct contact with the aluminum substrate of the PCB 1, and/or through a reflector through a high-efficiency superconducting The heat pipe 7 is in full contact with the heat sink 10 to conduct heat. Fix with epoxy resin 8 or use reflow soldering metal full contact between the aluminum rail shell 5 or the reflector and the radiator 10, so as to conduct heat and discharge heat to the lamp shell. The superconducting heat pipe 7 is a vacuum-sealed thin-walled metal tube, and the low thermal resistance and low latent heat mixture fluid 9 is used in the tube to enable rapid reflow by using the capillary structure, thereby solving the problem that the LED is not easy to dissipate heat. As shown in FIG. 1 , the platform can also be provided with a secondary optical element 4 for increasing light output efficiency.
图2表示垂直式一维超导热管LED可替换通用平台。 Figure 2 shows a vertical one-dimensional superconducting heat pipe LED alternative general platform.
在图2所示的垂直式一维超导热管LED可替换通用平台中,可另加超导热管热板或平板式超导热管2,平衡地在两侧设置两支以上超导热管2。这种超导热管热板或平板式超导热管2被夹置在新或旧的灯壳散热器及反光板之间,以增强光源3的散热功能。这样,对于在 40℃室温下的 10瓦LED,设计上可达到热阻< 0.23℃/ W。图2中,11代表黑色环氧树脂连结和/或扁平超热导管延伸连接到灯壳。 In the vertical one-dimensional superconducting heat pipe LED replaceable universal platform shown in FIG. 2 , an additional superconducting heat pipe hot plate or flat superconducting heat pipe 2 can be added, and two or more superconducting heat pipes 2 can be arranged on both sides in a balanced manner. The superconducting heat pipe heat plate or flat superconducting heat pipe 2 is sandwiched between the new or old lamp housing radiator and reflector to enhance the heat dissipation function of the light source 3 . Thus, for a 10W LED at a room temperature of 40°C, a thermal resistance < 0.23°C/W can be achieved by design. In Fig. 2, 11 represents the black epoxy resin connection and/or the extension of the flat superheat pipe connected to the lamp housing.
图3示出了二维导热管LED可替换通用平台的剖面图。在图3的垂直热管或热柱2的底部,可经灯壳导热。 Fig. 3 shows a cross-sectional view of a two-dimensional heat pipe LED alternative general platform. At the bottom of the vertical heat pipe or heat column 2 in FIG. 3 , heat can be conducted through the lamp housing.
图3的二维超导热管LED可替换平台,除了微流道热管12导热至反光板及散热器或带鳍片15的灯壳,另有一枚以上 Z-轴复台式毛细结构的微热管超导热管2加置散热器。图3 的LED光源3或图2 中的顶部光源3 如图2中所示的那样用回流焊直接或间接连接至图2和3的 LED 反光板或平台1。在超热导管2的冷端加黑色导热环氧树脂,然后用固定件固定底部至图2中的灯壳5,以便增强输出功率及减少灯具体积。LED光源另加图3中所示的二次光学元件4,用作角度反射器。可利用纳米技术提升光效,例如在光源3上涂覆纳米涂层。 The two-dimensional superconducting heat pipe LED replaceable platform in Figure 3, in addition to the heat conduction of the micro-channel heat pipe 12 to the reflector and the radiator or the lamp housing with fins 15, there is also more than one micro-heat pipe with a complex capillary structure on the Z-axis. The heat pipe 2 is provided with a radiator. The LED light source 3 in FIG. 3 or the top light source 3 in FIG. 2 is directly or indirectly connected to the LED reflector or platform 1 in FIGS. 2 and 3 by reflow soldering as shown in FIG. 2 . Add black heat-conducting epoxy resin to the cold end of the superheat pipe 2, and then fix the bottom to the lamp housing 5 in FIG. 2 with a fixing piece, so as to enhance the output power and reduce the volume of the lamp. The LED light source plus the secondary optical element 4 shown in Fig. 3 acts as an angular reflector. Nanotechnology can be used to improve light efficiency, for example, coating a nanocoating on the light source 3 .
图4示出了超过二维的超导热管LED可替换平台,其基本上是一维水平式加一维垂直式设计,其中在灯壳内接近超导热管2及热源另加图4中的孔道14,让水流通过降温及导热,这样就宜用作水底或潜水灯具。如图4所示,在两侧还设有平板式超导热管12,并在光源LED 3上方设有光学折射器形式的二次光学元件4。 Figure 4 shows an alternative platform for superconducting heat pipe LEDs beyond two dimensions, which is basically a one-dimensional horizontal plus one-dimensional vertical design, where the superconducting heat pipe 2 and the heat source in the lamp housing are close to the superconducting heat pipe 2 and the heat source in Figure 4 Hole 14 allows water flow to pass through for cooling and heat conduction, so that it is suitable for use as underwater or diving lamps. As shown in Figure 4, a flat superconducting heat pipe 12 is also provided on both sides, and a secondary optical element 4 in the form of an optical refractor is provided above the light source LED 3.
在图5和6中分别示出了本发明的扁平超热导管和平面式/平板式超热导管的示意图。 Schematic diagrams of the flat superheat pipe and the planar/flat superheat pipe of the present invention are shown in FIGS. 5 and 6, respectively.
如图所示,于所述超导热装置上开设有数个通孔。其作用是增加空气对流性,从而提高散热性能。 As shown in the figure, several through holes are opened on the superconducting thermal device. Its function is to increase air convection, thereby improving heat dissipation performance.
本发明的所示超导热装置的导热性能主要体现在以下几方面: The thermal conductivity of the shown superconducting thermal device of the present invention is mainly reflected in the following aspects:
1、石墨片( 图5的2及图6的2 ) 热阻小,铝反光板( 图5的6及图6的1 )的传热速度也快,该超导热装置有石墨片或石墨片连薄金属片 ( 图6的4 ) 在LED ( 图5的3及图6的3 )与热管之间作传热介质,使热流无阻, 辐射导热速度快。 1. Graphite sheets (2 in Figure 5 and 2 in Figure 6) have small thermal resistance, and the heat transfer rate of aluminum reflectors (6 in Figure 5 and 1 in Figure 6) is also fast. The superconducting thermal device has graphite sheets or graphite A thin metal sheet (4 in Figure 6) is used as a heat transfer medium between the LED (3 in Figure 5 and 3 in Figure 6) and the heat pipe, so that the heat flow is unimpeded and the radiation heat conduction speed is fast.
2、一种扁平式超热导管 ( 图5的5 ) 最后经散热片铝壳 ( 图5的1 ) 将LED热导至户内或户外灯具以外散热。 2. A flat superheat pipe (5 in Figure 5) finally passes through the aluminum shell of the heat sink (1 in Figure 5) to conduct the heat of the LED to the indoor or outdoor lamps to dissipate heat.
3、平面式超导热体( 图6右的1 )底部回流焊至另一超导热体装置, 其尾端导热灯具至灯外。 3. The bottom of the planar superheater (1 on the right in Figure 6) is reflow soldered to another superheater device, and its tail end conducts heat to the lamp to the outside of the lamp.
4、一体化二维平面式超导热装置, 平板式超导热管不需回流焊至另一超导热体, 制作时全真空 (图6的右中间,也即1与5之间无缝, 一体化) 。替代地,1与5之间也可以通过石墨片连接。 4. Integrated two-dimensional planar superconducting heat device, the flat superconducting heat pipe does not need to be reflow soldered to another superconducting body, and it is fully vacuumed during production (the right middle of Figure 6, that is, seamless between 1 and 5 , integrated). Alternatively, 1 and 5 can also be connected through a graphite sheet.
当然,图中只是本发明的较佳实施例,超导热装置及其通孔可以根据需要设计成其它规格、形状。 Certainly, the figure is only a preferred embodiment of the present invention, and the superconducting thermal device and its through holes can be designed into other specifications and shapes as required.
本发明超导热装置的制作工艺十分简单,因此其生产效率高而制作成本低,使用也及其方便。 The manufacturing process of the superconducting thermal device of the present invention is very simple, so the manufacturing efficiency is high, the manufacturing cost is low, and the use is extremely convenient.
尽管上文描述了本发明的最佳实施例,但是这些实施例仅是例示性的,而不是实质性的。本领域的技术人员根据本申请所公开的内容是可以对本申请作出改进和改型的。然而,这些改进和改型都属于本发明的保护范围,只要这些改进和改型不脱离本发明的精神实质。本发明的保护范围由所附的权利要求书予以限定。 While the preferred embodiments of the invention have been described above, these embodiments are illustrative only, not substantive. Those skilled in the art can make improvements and modifications to this application based on the contents disclosed in this application. However, these improvements and modifications all belong to the protection scope of the present invention, as long as these improvements and modifications do not deviate from the spirit of the present invention. The protection scope of the present invention is defined by the appended claims.
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CN108916692A (en) * | 2018-10-08 | 2018-11-30 | 广东奥普特科技股份有限公司 | A kind of linear light emitting device of water cooling |
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Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6287882B1 (en) * | 1999-10-04 | 2001-09-11 | Visual Photonics Epitaxy Co., Ltd. | Light emitting diode with a metal-coated reflective permanent substrate and the method for manufacturing the same |
TW550834B (en) * | 2002-02-15 | 2003-09-01 | United Epitaxy Co Ltd | Light emitting diode and its manufacturing method |
US6501103B1 (en) * | 2001-10-23 | 2002-12-31 | Lite-On Electronics, Inc. | Light emitting diode assembly with low thermal resistance |
JP2004207367A (en) * | 2002-12-24 | 2004-07-22 | Toyoda Gosei Co Ltd | Light emitting diode and light emitting diode arrangement plate |
TWI231613B (en) * | 2004-03-16 | 2005-04-21 | Solidlite Corp | Package structure of enhanced power light emitting diode |
US7878232B2 (en) * | 2004-07-09 | 2011-02-01 | GE Lighting Solutions, LLC | Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management |
JP2006185963A (en) * | 2004-12-24 | 2006-07-13 | Harison Toshiba Lighting Corp | Heat dissipation device |
TWI285969B (en) * | 2005-06-22 | 2007-08-21 | Epistar Corp | Light emitting diode and method of the same |
JP4575248B2 (en) * | 2005-07-20 | 2010-11-04 | 株式会社 日立ディスプレイズ | Liquid crystal display |
TWI288979B (en) * | 2006-02-23 | 2007-10-21 | Arima Optoelectronics Corp | Light emitting diode bonded with metal diffusion and manufacturing method thereof |
CN200953714Y (en) * | 2006-05-23 | 2007-09-26 | 吴长欣 | Heat conduction plate |
KR20070091590A (en) * | 2007-08-13 | 2007-09-11 | 이영섭 | Turbo-cooled LED lamp street light. |
CN101408302A (en) * | 2007-10-11 | 2009-04-15 | 富士迈半导体精密工业(上海)有限公司 | Light source module group with good heat radiating performance |
CN101430081B (en) * | 2007-11-06 | 2011-11-09 | 金松山 | Fence type LED lighting device |
TWI370558B (en) * | 2007-11-07 | 2012-08-11 | Ind Tech Res Inst | Light emitting diode and process for fabricating the same |
TW200943580A (en) * | 2008-04-03 | 2009-10-16 | jia-jie Liu | Method and structure for conducting heat away from LED |
TWM350674U (en) * | 2008-08-22 | 2009-02-11 | Li-Wen Chen | Light emitting diode lamp case |
CN101776248B (en) * | 2009-01-09 | 2014-06-25 | 台达电子工业股份有限公司 | Lamps and lighting devices |
JP2010205579A (en) * | 2009-03-04 | 2010-09-16 | Chugai:Kk | Light-emitting diode small bulb |
JP5465898B2 (en) * | 2009-03-11 | 2014-04-09 | 日本航空電子工業株式会社 | Optical semiconductor device, socket and optical semiconductor unit |
CN101737663B (en) * | 2010-01-22 | 2012-05-16 | 深圳市世纪安耐光电科技有限公司 | LED lamp |
CN201606762U (en) * | 2010-03-04 | 2010-10-13 | 刘木清 | LED lamp module with dimming inner surface |
-
2010
- 2010-10-21 HK HK10109977.6A patent/HK1144647A2/en not_active IP Right Cessation
-
2011
- 2011-10-20 TW TW100133200A patent/TWI491083B/en not_active IP Right Cessation
- 2011-10-21 CN CN201110322426.5A patent/CN102454969B/en not_active Expired - Fee Related
- 2011-10-21 CN CN2011204038974U patent/CN202392744U/en not_active Expired - Fee Related
Non-Patent Citations (2)
Title |
---|
石墨片;yufeng 5202006;《百度百科》;20101012;http://baike.baidu.com/history/id=15450762 * |
赖怡州.高效能石墨导热片.《CPU超频》.青岛出版社,1999,(第1版),第40-41页. * |
Also Published As
Publication number | Publication date |
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CN202392744U (en) | 2012-08-22 |
TWI491083B (en) | 2015-07-01 |
HK1144647A2 (en) | 2011-02-25 |
CN102454969A (en) | 2012-05-16 |
TW201251152A (en) | 2012-12-16 |
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