CN102445279B - Device and method for measuring wave lengths of interferometer - Google Patents
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Abstract
The invention discloses a device for measuring wave lengths of an interferometer of a workpiece table, comprising a first interferometer and a second interferometer which are respectively arranged at two opposite sides of the workpiece table, first measurement light beams and second measurement light beams emitted from the first interferometer and the second interferometer respectively form a wave length measurement shaft, and a computing module for computing the theory length and practical length of the wave length measurement shaft and computing the practical wave length of the first measurement light beams and the second measurement light beams, so as to perform real-time computation to the wave length of the light beams measured by the interferometer by the first interferometer, the second interferometer and the computing module. The invention also discloses a method for measuring wave lengths of an interferometer of a workpiece table.
Description
Technical Field
The technical scheme relates to an interferometer, in particular to a device and a method for measuring laser interference wavelength in real time.
Background
The fringe counting interferometer performs length measurement based on wavelength, and the measurement principle can be simply expressed as:
where λ is the wavelength of the laser in the measurement environment, λ0Is the wavelength of the laser in vacuum and N is the number of fringes. The length to be measured can only be accurately calculated by measuring the air refractive index n or the wavelength lambda of the laser in the measuring environment in real time, otherwise, the interferometer can not be used for measuring the space length with sub-nanometer precision.
In current applications, there are two main methods to determine the laser wavelength.
The first is to calculate the current air refractive index by means of the Elden formula. The laser wavelength is mainly influenced by the atmospheric pressure and temperature of the environment, so that the air and the refractive index can be calculated by measuring the atmospheric pressure and the temperature of the environment
Wherein P isairAnd TairA, b, c are constants for the pressure and temperature in air.
Another is a Wavelength Tracker (Wavelength Tracker) that monitors the ambient Wavelength specifically, as provided by Agilent, inc, as shown in fig. 1. The method uses an optical cavity with fixed length as a reference, the length of the cavity is measured by an interferometer in real time, and the change of the current laser wavelength is known through the length change measured by the interferometer.
Due to the limitation of the testing principle, the position of the refractive index or the wavelength measured by the two methods is not in the same place as the actual working position of the interferometer, so that the measured wavelength is different from the wavelength of the actual working position of the interferometer. The measurement object due to the interferometer often requires movement within a certain range, such as translation in the direction X, Y, rotation about the Z-axis, or tilt about the Y-axis. The wavelet Tracker from Agilent is usually placed at a large distance from the measuring beam bundle. Moreover, the interferometer is a relative position measurement system, and at the beginning of the normal operation of the wavelength tracker, a more accurate calibration of the initial value of the wavelength is required, and the design of the measurement cavity makes it impossible to perform the function more satisfactorily. When the refractive index of air is calculated by adopting the Elden formula, the air refractive index is also easily influenced by factors such as measurement errors of air pressure and air temperature due to the fact that the wavelength of the light beam is indirectly measured.
Besides, chinese patent CN99814090.2 discloses a method for improving the measurement of an interferometer, in which the influence of the environment is determined by simultaneously measuring the speed of sound in the traveling direction along the measurement path, which undoubtedly increases the equipment cost; the structure of the air disturbance compensation dual-wavelength heterodyne interferometer disclosed in chinese patent CN99118742.3, in which the refractive index is obtained by measuring the optical path length of two or more wavelengths, requires two measurement wavelengths (usually in a multiple relation) that are far apart, and puts new requirements on the laser.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a device and a method for measuring the wavelength of a workpiece stage interferometer, which are used for measuring the wavelength of a measuring beam of the interferometer in real time.
To achieve the above and other objects, the present invention provides an apparatus for measuring a wavelength of a stage interferometer, comprising: the first interferometer and the second interferometer are respectively positioned at two opposite sides of the workpiece table, a first measuring beam emitted by the first interferometer and a second measuring beam emitted by the second interferometer form a wavelength measuring axis, the first interferometer and the second interferometer respectively obtain a first optical path and a second optical path of the first measuring beam and the second measuring beam, and the first interferometer and the second interferometer measure the cycle variation number of the optical waves of the first measuring beam and the second measuring beam relative to the initial moment of a measuring cycle; and the calculation module is used for calculating the theoretical length of the wavelength measuring shaft according to the first optical path and the second optical path obtained by the first interferometer and the second interferometer, calculating the actual length of the wavelength measuring shaft according to the theoretical length of the wavelength measuring shaft and the motion parameters of the workpiece table, and calculating the actual wavelengths of the first measuring beam and the second measuring beam according to the actual length of the wavelength measuring shaft, the periodic variation number of the optical waves of the first measuring beam and the second measuring beam relative to the initial time and the initial wavelengths of the first measuring beam and the second measuring beam at the initial time of the measuring period.
The motion parameters of the workpiece table comprise: the rotation angle of the workpiece table and/or the inclination angle of the workpiece table.
The first measuring beam and the second measuring beam are positioned on the same straight line.
The invention also provides a method for measuring the wavelength of the interferometer of the workpiece table, which comprises the steps of respectively obtaining a first optical path and a second optical path of a first measuring beam and a second measuring beam which are respectively emitted by the first interferometer and the second interferometer by utilizing the first interferometer and the second interferometer which are positioned at the two opposite sides of the workpiece table, wherein the first measuring beam and the second measuring beam form a wavelength measuring shaft; measuring the periodic variation number of the light waves of the first and second measuring beams relative to the initial moment of a measuring period by using the first and second interferometers; calculating the theoretical length of the wavelength measuring axis according to the first optical path and the second optical path; calculating the actual length of the wavelength measuring shaft according to the theoretical length of the wavelength measuring shaft and the motion parameters of the workpiece table; and calculating the actual wavelengths of the first and second measuring beams according to the actual length of the wavelength measuring axis, the number of periodic changes of the light waves of the first and second measuring beams relative to the initial time, and the initial wavelengths of the first and second measuring beams at the initial time of the measuring period.
The first measuring beam and the second measuring beam are positioned on the same straight line.
The initial wavelengths of the first and second measuring beams at the initial time of the measuring period are obtained by: when using a positioning device to align two marks, the first and second interferometers measure the average variation period along the wavelength measuring axis (please confirm the average variation period of which is); and calculating the initial wavelengths of the first and second measuring beams according to the distance between the two marks in the direction of the wavelength measuring axis and the average variation period.
The positioning means is an alignment system or a hall sensor.
Compared with the prior art, the invention has the following advantages:
according to the device and the method for measuring the laser interference wavelength of the workpiece table, disclosed by the invention, the measuring light beam is arranged in the interferometer measuring device, so that the wavelength is directly and effectively measured, and the measurement is more accurate; the light path and related devices for measuring by the interferometer do not need to be additionally provided with special measuring equipment, so that the structure is simpler and the cost is lower; with the help of the alignment system of the lithography machine, the measurement scheme can eliminate system errors by periodically correcting. The device and the method for measuring the laser interference wavelength of the workpiece table provided by the invention can be suitable for a double-frequency interferometer and a single-frequency interferometer.
Drawings
The advantages and spirit of the present invention can be further understood by the following detailed description of the invention and the accompanying drawings.
FIG. 1 is a prior art interferometer application using a wavelength tracker to monitor ambient wavelengths;
FIG. 2 is a schematic diagram of a prior art interferometer for measuring stage movement;
FIG. 3 is a schematic diagram of the structure of the disclosed apparatus for measuring interferometer wavelength;
FIG. 4 is a schematic view of the workpiece table in a rotated or tilted state;
Detailed Description
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
A schematic diagram of a prior art interferometer for measuring stage movement is shown in fig. 1. The figure shows a typical interferometric structure used in a lithography machine to measure the position of a workpiece stage. The interferometer is located in X and Y directions of the workpiece stage, and has several measuring beams set separately in the X and Y directions of the workpiece stage. The measuring beam is reflected by a plane square mirror arranged on the side surface of the workpiece table, and the interferometer measures the length change of the beam to obtain the position change of the workpiece table. According to the structural arrangement of the measuring beams of the interferometer, at most six degrees of freedom of the workpiece table can be measured in real time.
Fig. 2 is a schematic diagram of a prior art structure for measuring the movement of a workpiece stage by using an interferometer. As shown in fig. 2, three interferometers, including 101a and 101c arranged in the X direction and 101b arranged in the Y direction, are respectively placed on a reference frame (not shown) of the lithographic apparatus along the X direction and the Y direction of the workpiece stage 102 in fig. 2. A plurality of measuring beams are provided in the interferometer 101a and the interferometer 101b, respectively. The measuring beam is reflected by a plane square mirror (not shown) attached to the side surface of the stage 102, and the interferometer measures the change in the length of the beam to change the position of the stage. However, due to the change of the environmental parameters of the interferometer, such as the environmental temperature and the pressure, the wavelength of the measuring beam emitted by the interferometer also changes under the influence of the environmental parameters, and if the wavelength of the measuring beam cannot be effectively measured in real time, the motion state of the stage cannot be effectively measured through the interferometer, and the stage cannot be effectively positioned.
FIG. 3 is a schematic structural diagram of the device for measuring the wavelength of the interferometer of the workpiece stage according to the present invention. As shown in fig. 3, two measurement lights 1 and 2 are added to the interferometer 101a and the interferometer 101c, respectively, and the measurement lights 1 and 2 are referred to as wavelength measurement axes. As shown in the figure, the measuring light 1 and the measuring light 2 are located on the same straight line, that is, the interferometer 101a, the stage 102 and the interferometer 101c are located on the same straight line. In the present embodiment, the wavelength measuring axis is composed of the measuring beam emitted from the interferometer in the X direction, but in actual use, the wavelength measuring axis may be set to be composed of the measuring beam emitted from the interferometer arranged in the Y direction as well. The wavelength measuring axes (i.e. measuring beam 1 and measuring beam 2) can have one or two measuring beams in common with the other measuring axes, i.e. the wavelength measuring axis can be also the other measuring logical axis.
In the present invention, the interferometers 101a and 101c measure the optical paths (i.e., the lengths of the measuring beams 1 and 2) L1 and L2 of the measuring beams 1 and 2 emitted therefrom, respectively. And measuring the number of periodic variations δ i of the light wave of the measuring beam beams 1, 2 with respect to the initial time of a measuring period, for the calculating module (not shown) of the present invention to perform corresponding calculation according to the measurement result of the interferometer.
The calculation module calculates the theoretical length L0 of the wavelength measuring axis to be L1+ L2 according to the measuring beam distances L1 and L2 of the measuring beams 1 and 2. Then, the calculation module calculates the actual length L of the wavelength measurement axis according to the theoretical length of the wavelength measurement axis and the motion parameters of the stage 102 (e.g., stage rotation angle, stage tilt angle), and the calculation module calculates the actual wavelength of the measuring beam 1, 2 according to the actual length of the wavelength measurement axis, the number of periodic changes of the light wave of the measuring beam 1, 2 relative to the initial time of the measurement period, and the initial wavelength of the measuring beam 1, 2 at the initial time of the measurement period:
wherein,
the total number of light wave periods, lambda, of the optical paths traversed by the two measuring beams 1, 20The initial wavelength of the measuring beams 1, 2 at the initial moment of the measuring cycle.K is the length of the workpiece table in the direction of the wavelength measurement axis (i.e., in the X direction shown in fig. 3). Initial wavelength lambda0The manner of obtaining (a) is described in detail below.
In particular, in the apparatus of the present invention, since the wavelength measurement axes, i.e., the interferometers 101a and 101c emitting the measurement beams 1 and 2, are both disposed on the reference frame of the lithographic apparatus, the relative positions of the interferometers 101a and 101c are fixed. When the stage 102 is displaced in the X direction or the Y direction shown in fig. 3 during the operation of the lithography machine, the sum of the optical paths through which the measuring beams 1 and 2 pass is a fixed value because the size of the stage 102 does not change, and in this case, the actual length L of the wavelength measurement axis is L0. Thus, if there is a change in the sum of the fringe variations of the interferometers 101a and 101c, this indicates a change in the wavelength of the measuring beams 1, 2.
According to the number of the stripe changes, the current measuring beam wavelength can be measured:
however, in the actual operation of the lithography machine, the workpiece stage 102 needs to be rotated and tilted in time in addition to being moved horizontally. When the workpiece table rotates or tilts, the length of the measuring light composing the wavelength measuring axis changes, namely, the actual length L of the measuring axis is not equal to L0. As shown in FIG. 4, the actual length of the wavelength measurement axis when the stage is rotated and tilted by the angles Rx, Ry, Rz
K is the length of the work table in the direction of the wavelength measuring axis.
The following will describe in detail a specific embodiment of the disclosed method for measuring the wavelength of a stage interferometer.
First, in step 1, the optical lengths L1, L2 of the measuring beams 1, 2 and the number δ i of periodic changes of the optical waves of the measuring beams 1, 2 with respect to the initial time of a measuring period are obtained by the interferometer 101a and the interferometer 101c, respectively.
In step 2, the calculation module calculates the theoretical length L0 of the wavelength measuring axis composed of the measuring beams 1 and 2 to be L1+ L2 according to the optical lengths L1 and L2 of the measuring beams 1 and 2 obtained by the interferometers 101a and 101 c.
In step 3, the calculation module calculates the actual length of the wavelength measurement axis according to the theoretical length of the wavelength measurement axis and the motion parameters of the stage (the motion parameters include the rotation angle and the inclination angle of the stage)
In step 4, the calculating module measures the light according to the actual length L of the wavelength measuring axisThe number of periodic changes δ i of the light waves of the beams 1, 2 with respect to the initial instant, and the initial wavelength λ of the measuring beams 1, 2 at the initial instant of the measuring period0Calculating the actual wavelengths of the first and second measuring beams
In particular, in the method of the present invention, since the wavelength measurement axes, i.e. the interferometers 101a and 101c emitting the measuring beams 1 and 2, are both placed on the reference frame of the lithographic apparatus, the relative positions of the interferometers 101a and 101c are fixed. When the stage 102 is displaced in the X direction or the Y direction shown in fig. 3 during the operation of the lithography machine, the sum of the optical paths through which the measuring beams 1 and 2 pass is a fixed value because the size of the stage 102 does not change, and in this case, the actual length L of the wavelength measuring axis calculated in the above-described step 3 is L0. Thus, if there is a change in the sum of the fringe variations of the interferometers 101a and 101c, this indicates a change in the wavelength of the measuring beams 1, 2.
According to the number of the stripe changes, the current measuring beam wavelength can be measured:
however, in the actual operation of the lithography machine, the workpiece stage 102 needs to be rotated and tilted in time in addition to being moved horizontally. When there is rotation or tilt of the workpiece table, the length of the measurement light constituting the wavelength measurement axis changes, that is, when the actual length L ≠ L0 of the wavelength measurement axis calculated in step 3 above. For example, as shown in FIG. 4, when the stage has rotation and inclination angles Rx, Ry, Rz, the actual length of the wavelength measurement axis calculated in step 3 above
K is the length of the work table in the direction of the wavelength measuring axis.
The initial wavelength λ of the measuring beams 1, 2 at the beginning of the measuring cycle is explained below0The method for obtaining.
In the present technical solution, since the embodiment adopts the method of measuring the movement of the workpiece stage by using the interferometer in the lithography apparatus as an illustration, the movement can be realized by the alignment function in the lithography machine. The alignment function in the lithography machine is mainly realized by an alignment system, and the alignment function in the lithography machine mainly means that the accurate mask-silicon wafer coordinate position relation is realized by arranging a reference mark on a workpiece table or arranging an alignment mark on a silicon wafer. Since how to implement the alignment function and the composition of the alignment system is well known in the art of lithography machines, and the present invention does not relate to the improvement of the alignment function or the alignment system, it is omitted here.
Referring to FIG. 3, the initial wavelength λ0Is obtained by means of fiducial marks 103, 104 on the workpiece table 102 or alignment marks 105, 106 on a fiducial silicon wafer 106. When the stage 102 is moved under the control of the interferometer, assuming that the two reference marks 103 and 104 are separated by a distance Δ X along the wavelength measuring axis (i.e., the X direction shown in fig. 3) formed by the measuring beams 1 and 2, and the alignment system of the lithography machine sequentially aligns the two marks 103 and 104, the average variation period of the two measuring beams 1 and 2 along the wavelength measuring axis (i.e., the X direction shown in fig. 3) measured by the interferometers 101a and 101c at the time of alignment is Δ i, the initial wavelength of the measuring beams 1 and 2 is Δ i
Similarly, when the present invention is applied to lithography machines and other machine tools or instruments, other systems with positioning functions can be used to obtain the initial wavelength, such as a hall sensor mounted in a fixed position for positioning the workpiece table or machine tool.
When the embodiment is applied to the photoetching equipment, the alignment system of the photoetching machine can be used as the positioning device, and the accurate correction can be carried out on the wavelength measurement value automatically and periodically.
The invention can effectively calculate the wavelength of the measuring beam of the interferometer in real time, and further can effectively measure the motion condition of the workpiece table through the interferometer, thereby realizing the accurate positioning of the workpiece table.
The embodiments described in the specification are only preferred embodiments of the present invention, and the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit the present invention. Those skilled in the art can obtain technical solutions through logical analysis, reasoning or limited experiments according to the concepts of the present invention, and all such technical solutions are within the scope of the present invention.
Claims (4)
1. An apparatus for measuring a wavelength of a stage interferometer, comprising:
the first interferometer and the second interferometer are respectively positioned at two opposite sides of the workpiece table, a first measuring beam emitted by the first interferometer and a second measuring beam emitted by the second interferometer form a wavelength measuring axis, the first measuring beam and the second measuring beam are positioned on the same straight line, the first interferometer and the second interferometer respectively obtain a first optical path and a second optical path of the first measuring beam and the second measuring beam, and the first interferometer and the second interferometer measure the cycle variation number of the optical waves of the first measuring beam and the second measuring beam relative to the initial moment of a measuring cycle; and
a calculating module for calculating the theoretical length L of the wavelength measuring axis according to the first optical path L1 and the second optical path L2 obtained by the first and the second interferometers0＝L1+L2，
And measuring the theoretical length L of the axis according to the wavelength0Calculating the actual length of the wavelength measuring shaft according to the motion parameters of the workpiece table
Wherein Ry and Rz are the tilt and rotation angles in the motion parameters of the workpiece stage, i.e. the rotation angles with respect to the y-axis and the z-axis, respectively, the x-axis direction is the wavelength measurement axis direction, k is the length of the workpiece stage along the wavelength measurement axis direction,
and the number delta of periodic changes of the light waves of the first and second measuring beams relative to the initial moment of the measuring period according to the actual length L of the wavelength measuring axisiAnd the initial wavelength λ of the first and second measuring beams at the initial time of the measuring period0Calculating the actual wavelengths of the first and second measuring beams
2. A method of measuring a wavelength of a workpiece stage interferometer, comprising:
respectively obtaining a first optical path and a second optical path of a first measuring beam and a second measuring beam respectively emitted by the first interferometer and the second interferometer by using a first interferometer and a second interferometer which are positioned on two opposite sides of the workpiece table, wherein the first measuring beam and the second measuring beam form a wavelength measuring axis, and the first measuring beam and the second measuring beam are positioned on the same straight line;
measuring the periodic variation number of the light waves of the first and second measuring beams relative to the initial moment of a measuring period by using the first and second interferometers;
calculating the wavelength measurement axis according to the first and second optical paths L1 and L2Theoretical length L of0＝L1+L2；
The theoretical length L of the measuring axis according to the wavelength0Calculating the actual length of the wavelength measuring shaft according to the motion parameters of the workpiece table
Wherein Ry and Rz are the tilt and rotation angles in the motion parameters of the workpiece stage, i.e. the rotation angles with respect to the y-axis and the z-axis, respectively, the x-axis direction is the wavelength measurement axis direction, and k is the length of the workpiece stage along the wavelength measurement axis direction; and
according to the actual length L of the wavelength measuring axis and the periodic variation number delta of the light waves of the first and second measuring beams relative to the initial timeiAnd the initial wavelength λ of the first and second measuring beams at the initial time of the measuring period0Calculating the actual wavelengths of the first and second measuring beams
3. The method of claim 2, wherein the initial wavelengths of the first and second measuring beams at the initial time of the measurement cycle are obtained by:
when a positioning device is used for aligning two marks, the first interferometer and the second interferometer measure the average variation period of the first measuring beam and the second measuring beam along the wavelength measuring axis direction; and
calculating the initial wavelength of the first and second measuring beams according to the distance Δ x between the two marks and the average variation period Δ i of the first and second measuring beams along the wavelength measuring axis
4. The method of claim 3, wherein the positioning device is a Hall sensor.
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