CN102398314B - Diamond cutting line slicing machine - Google Patents
Diamond cutting line slicing machine Download PDFInfo
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- CN102398314B CN102398314B CN201010286077.1A CN201010286077A CN102398314B CN 102398314 B CN102398314 B CN 102398314B CN 201010286077 A CN201010286077 A CN 201010286077A CN 102398314 B CN102398314 B CN 102398314B
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Abstract
The invention provides a diamond cutting line slicing machine which at least comprises a frame, first and second cutting rollers, third and fourth cutting rollers and a diamond cutting line, wherein the frame is provided with a workpiece cutting region; the first and second cutting rollers are respectively arranged at both sides of the workpiece cutting region; the third and fourth cutting rollers are arranged between the first and second cutting rollers; the third and fourth cutting rollers are positioned in parallel relatively at the upper side of the same horizontal planes of the first and second cutting rollers; and for the diamond cutting line, three sections of cutting lines with the equal lengths are respectively formed between the first and third cutting rollers, between the third and fourth cutting rollers and between the fourth and second cutting rollers. When the diamond cutting line operates at high speed, three crystal silicon rods are simultaneously subjected to cutting operation by the three sections of cutting lines, so that the problems of poor cutting, low amount of cut workpieces and the like caused by excessively high deflection degree of a steel wire due to the arrangement mode of the cutting rollers in the prior art are solved.
Description
Technical field
The present invention relates to a kind of multi-wire saw technology, particularly relate to a kind of for multiple crystal silicon rods are carried out the diamond cutting line slicing machine of cutting operation simultaneously.
Background technology
Multi-wire saw technology is current more advanced silicon chip process technology in the world, and its principle is to drive the cutting blade material being attached on steel wire to rub to hard brittle materials such as semiconductors by the steel wire of a high-speed motion, thereby reaches cutting object.Line cutting technology has compared with traditional knife saw sheet, grinding wheel and inner circle cutting that to have efficiency high, and production capacity is high, precision advantages of higher.
Such as crystalline silicon bar slicer of existing multi-wire saw equipment etc. at least includes conventionally: frame, for the workbench of fixation workpiece, for receiving, put the wire storage tube of steel wire, multiplely be used to the guide roller that steel wire leads and be crossed on the relative both sides of workbench and cutting roller that can lift work etc., in to the actual cutting process of crystal silicon rod, described steel wire is by the guiding of tens guide rollers, on the cutting roller of the relative both sides of workbench, form a bracing cable net, in the time that workpiece is fixed on described workbench, the cutting roller of the relative both sides of workbench is lowered, and compression pump effect under, be assemblied in the cutting position that grinding agent automatic spraying device on equipment is sprayed to grinding agent steel wire and workpiece, drive grinding agent back and forth to tell motion by steel wire, utilize abrasive sand to produce cutting to workpiece, so that workpiece is once cut into many simultaneously.Hence one can see that, the set-up mode of the cutting roller of the relative both sides of workbench be related to cutting operation whether smoothly, whether accurately especially important of a ring of cutting accuracy.
On crystalline silicon bar slicer in the prior art, the cutting roller that is positioned at the relative both sides of workbench is arranged on relative two heel posts of frame, thereby left, span between right cutting roller is very large, so the steel wire cable run distance between the cutting roller of both sides is also very long, in actual section operation, when the cutting roller of the relative both sides of workbench is lowered, when steel wire between the cutting roller of both sides is urged to workpiece, can make steel wire form very large flexing degree, thereby steel wire is also just subject to maximum running resistance all the time, because often having very high hardness, workpiece itself is difficult for cutting, add for the requirement of workpiece section precision very strict again, so causing steel wire flexing to be spent, the above-mentioned set-up mode because of cutting roller is easy to greatly impact cutting precision, and above-mentioned crystalline silicon bar slicer is due to single between cutting area, so quantity that once can sliced crystal silicon rod is also little, efficiency is very low.
So, how a kind of cutting technique being applied on slicer is provided, to avoid above-described shortcoming, real is the current problem demanding prompt solution of dealer of association area.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of diamond cutting line slicing machine, to solve in prior art because the set-up mode of cutting roller causes steel wire span large, and then steel wire flexing is spent greatly while causing cutting, easily causes the bad problem of cutting.
A further object of the present invention is to provide a kind of diamond cutting line slicing machine, can carry out cutting operation to multiple crystal silicon rods, to improve the operational efficiency of equipment simultaneously.
For achieving the above object and other relevant objects, the invention provides a kind of diamond cutting line slicing machine, for multiple crystal silicon rods are carried out to cutting operation simultaneously, it is characterized in that, described diamond cutting line slicing machine at least comprises: frame, the first cutting roller, the second cutting roller, the 3rd cutting roller, the 4th cutting roller, and diamond wire.Wherein, described frame has a work piece cut district; Described the first cutting roller is arranged on a side in described work piece cut district; Described the second cutting roller is arranged on the opposite side in described work piece cut district, with described the first cutting roller opposing parallel and be positioned in same level; Described the 3rd cutting roller is arranged between described the first cutting roller and the second cutting roller, be positioned at the upside of described the first cutting roller and the second cutting roller same level, and the spacing of described the 3rd cutting roller to the first cutting roller is less than the spacing of the 3rd cutting roller to the second cutting roller; Described the 4th cutting roller is arranged between described the first cutting roller and the second cutting roller, with described the 3rd cutting roller opposing parallel and be positioned in same level, the spacing of described the 4th cutting roller to the three cutting rollers equals the spacing of described the 3rd cutting roller to the first cutting roller, and the spacing of described the 4th cutting roller to the three cutting rollers equals the spacing of described the 4th cutting roller to the second cutting roller; Described diamond wire is wound on described the first cutting roller, the 3rd cutting roller, the 4th cutting roller and the second cutting roller successively, and between described the first cutting roller and the 3rd cutting roller, between described the 3rd cutting roller and the 4th cutting roller, and between described the 4th cutting roller and the second cutting roller, form respectively three sections of isometric lines of cut, in the time of described diamond wire high-speed cruising, three crystal silicon rods are carried out to cutting operation by these three sections of lines of cut simultaneously.
In the present invention's diamond cutting line slicing machine, the angle that the diamond wire between described the 3rd cutting roller and the first cutting roller becomes with the diamond wire between described the first cutting roller and the second cutting roller equals the angle that the diamond wire between described the 4th cutting roller and the second cutting roller becomes with the diamond wire between described the first cutting roller and the second cutting roller.Concrete, described angle is the angle between 10 ° to 30 °.
The present invention's diamond cutting line slicing machine also comprises multiple part tools that send, be separately positioned in described frame, for transporting, described crystal silicon rod is oppressed between described the first cutting roller and the 3rd cutting roller, three sections of lines of cut between described the 3rd cutting roller and the 4th cutting roller and between described the 4th cutting roller and the second cutting roller to be to cut three crystal silicon rods simultaneously.
As mentioned above, the present invention is laying respectively at first of relative both sides, work piece cut district, two opposing parallel are set between the second cutting roller again and are positioned at the 3rd of same level, the 4th cutting roller, form the isometric line of cut of multistage with upside between first and second cutting roller, reach the once object to multiple crystal silicon rod cuttings, so design, not only solve in prior art because the setting space of both sides cutting roller is large, cause steel wire span large, and then cause steel wire flexing while cutting to spend greatly, easily cause the bad problem of cutting, improve product percent of pass, and can carry out cutting operation to multiple crystal silicon rods simultaneously, also improved the operational efficiency of equipment, effectively overcome various shortcoming of the prior art.
Accompanying drawing explanation
Fig. 1 is shown as the simplified structure schematic diagram of diamond cutting line slicing machine of the present invention.
Fig. 2 is shown as the incision principle schematic diagram of diamond cutting line slicing machine of the present invention.
The specific embodiment
Below, by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantages of the present invention and effect easily by content disclosed in the present specification.The present invention can also be implemented or be applied by other different concrete real mode, and the every details in this description also can be based on different viewpoints and application, carries out various modifications or change not deviating under spirit of the present invention.
Refer to Fig. 1 and Fig. 2, Fig. 1 is shown as the simplified structure schematic diagram of diamond cutting line slicing machine of the present invention; Fig. 2 is shown as the incision principle schematic diagram of diamond cutting line slicing machine of the present invention.It should be noted that, the diagram providing in the present embodiment only illustrates basic conception of the present invention in a schematic way, satisfy and only show the assembly relevant with the present invention in graphic but not component count, shape and size drafting while implementing according to reality, when its actual enforcement, kenel, quantity and the ratio of each assembly can be a kind of random change, and its assembly layout kenel also may be more complicated.
As shown in the figure, the invention provides a kind of diamond cutting line slicing machine 1, for multiple crystal silicon rods 16 are carried out to cutting operation simultaneously, in the present embodiment, described crystal silicon rod 15 is silicon single crystal rod, polycrystalline silicon rod or sapphire silicon rod, in the present embodiment, described diamond cutting line slicing machine 1 at least comprises: frame 10, the first cutting rollers 11, the second cutting roller 12, the 3rd cutting roller 13, the four cutting rollers 13, diamond wire 15 and send part tool 17.
Described frame 10 has a work piece cut district 100; Described the first cutting roller 11 is arranged on a side in described work piece cut district 100; Described the second cutting 12 rollers are arranged on the opposite side in described work piece cut district 100, and described second cuts 12 with described the first cutting roller 11 opposing parallel and be positioned in same level; In the present embodiment, described the first cutting roller 11 is positioned at same level height with described the second cutting roller 12.
Described the 3rd cutting roller 13 is arranged between described the first cutting roller 11 and the second cutting roller 12, and, described the 3rd cutting roller 13 is positioned at the upside of described the first cutting roller 11 and the second cutting roller 12 same levels, and the spacing of described the 3rd cutting roller 13 to first cutting rollers 11 is less than the spacing of the 3rd cutting roller 13 to second cutting rollers 12, and, in the present embodiment, the spacing of described the 3rd cutting roller 13 to first cutting rollers 11 is less than the spacing of the first cutting roller 11 to second cutting rollers 12.
Described the 4th cutting roller 14 is arranged between described the first cutting roller 11 and the second cutting roller 12, and described the 4th cutting roller 14 is with described the 3rd cutting roller 13 opposing parallel and be positioned in same level, described the 4th cutting roller 14 equals the spacing of described the 3rd cutting roller 13 to first cutting rollers 11 to the spacing of the 3rd cutting roller 13, and described the 4th cutting roller 14 equals the spacing of described the 4th cutting roller 14 to second cutting rollers 12 to the spacing of the 3rd cutting roller 13; In other words, described the 4th cutting roller 14 to the spacing of the spacing of the 3rd cutting roller 13, described the 3rd cutting roller 13 to first cutting rollers 11 and the spacing of described the 4th cutting roller 14 to second cutting rollers 12 is identical.
Described diamond wire 15 is wound on described the first cutting roller 11, the 3rd cutting roller 13, the 4th cutting roller 14 and the second cutting roller 12 successively, and between described the first cutting roller 11 and the 3rd cutting roller 13, between described the 3rd cutting roller 13 and the 4th cutting roller 14, and between described the 4th cutting roller 14 and the second cutting roller 12, form respectively three sections of isometric lines of cut, in the time of described diamond wire 15 high-speed cruising, three crystal silicon rods 16 are carried out to cutting operation by these three sections of lines of cut simultaneously.
In the present embodiment, the angle of 15 one-tenth of diamond wires between diamond wire 15 extended lines between described the 3rd cutting roller 13 and the first cutting roller 11 and described the first cutting roller 11 and the second cutting roller 12 equals the angle that the diamond wire 15 between described the 4th cutting roller 14 and the second cutting roller 12 becomes with the diamond wire between described the first cutting roller 11 and the second cutting roller 12.In the present embodiment, described angle (being α angle as shown in phantom in Figure 2) is that the angle that the extended line (being the dotted line shown in Fig. 2) that has each section of diamond wire 15 forms draws.Concrete, described angle is the angle between 10 ° to 30 °.I.e. 30 ° of 10 ° of < α <, like this described in guarantee three sections of isometric lines of cut be less than the first cutting roller 11 to second cutting rollers 12 between diamond wire 15 length.
In the present embodiment, described diamond wire 15 is wound in and between described the first cutting roller 11, the 3rd cutting roller 13, the 4th cutting roller 14 and the second cutting roller 12, forms respectively three sections of isometric lines of cut, in the time of high-speed cruising, can carry out cutting operation to crystal silicon rod 16, in more detail, on actual diamond cutting line slicing machine 1, also have wire storage tube (not shown) and drive the motor (not shown) of described wire storage tube, by wire storage tube rotation described in this driven by motor, and then make its take-up or unwrapping wire and make described diamond wire 14 high-speed cruisings.
As shown in Figure 1, the present invention's diamond cutting line slicing machine 1 also comprises that three are sent part tool 17, be separately positioned in described frame 10, for transporting, described crystal silicon rod 16 is oppressed between described the first cutting roller 11 and the 3rd cutting roller 13, three sections of lines of cut between described the 3rd cutting roller 13 and the 4th cutting roller 14 and between described the 4th cutting roller 14 and the second cutting roller 12 to be to cut three crystal silicon rods 16 simultaneously.In the present embodiment, send part tool 17 to there is to bind the bonding medium of described crystal silicon rod 16 1 sides, particularly, the described bonding medium of part tool 17 that send is for binding glue, this bonding glue together binds a glass (not indicating) on crystal silicon rod 16 1 sides, after slice completes, dissolve and bind glue and separate silicon chip and glass with hot water.
Refer to Fig. 2, Fig. 2 is shown as the incision principle schematic diagram of diamond cutting line slicing machine of the present invention.In actual cutting process, described in send that part tool 17 transports that described crystal silicon rod 16 is oppressed between described the first cutting roller 11 and the 3rd cutting roller 13, three sections of lines of cut between described the 3rd cutting roller 13 and the 4th cutting roller 14 and between described the 4th cutting roller 14 and the second cutting roller 12 to be to cut three crystal silicon rods 16 simultaneously.Due to above-mentioned three sections of isometric lines of cut be all less than the first cutting roller 11 to second cutting rollers 12 between diamond wire 15 length, so, in the time that described crystal silicon rod 16 is also oppressed the line of cut that makes this section shorter, the flexing degree that line of cut produces will be very little, just can not be because the flexing of steel wire is spent the problem that greatly easily causes cutting bad as in prior art; Moreover, because walking in wire system of a diamond wire 15 is just provided with four cutting rollers, form three sections of lines of cut, thereby, can disposable three crystal silicon rods 16 be cut simultaneously, compared with prior art also increased the quantity of cut workpiece, improved the operating efficiency of equipment.
In sum, the present invention is laying respectively at first of relative both sides, work piece cut district, two opposing parallel are set between the second cutting roller again and are positioned at the 3rd of same level, the 4th cutting roller, form the isometric line of cut of multistage with upside between first and second cutting roller, reach the once object to multiple crystal silicon rod cuttings, so design, not only solve in prior art because the setting space of both sides cutting roller is large, cause steel wire span large, and then cause steel wire flexing while cutting to spend greatly, easily cause the bad problem of cutting, improve product percent of pass, and can carry out cutting operation to multiple crystal silicon rods simultaneously, also improved the operational efficiency of equipment, effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any personage who has the knack of this technology all can, under spirit of the present invention and category, modify or change above-described embodiment.Therefore, such as in affiliated technical field, have and conventionally know that the knowledgeable, not departing from all equivalence modifications that complete under disclosed spirit and technological thought or changing, must be contained by claim described later.
Claims (4)
1. a diamond cutting line slicing machine, for multiple crystal silicon rods are carried out to cutting operation simultaneously, is characterized in that, described diamond cutting line slicing machine at least comprises:
Frame, has a work piece cut district;
The first cutting roller, is arranged on the side in described work piece cut district;
The second cutting roller, is arranged on the opposite side in described work piece cut district, with described the first cutting roller opposing parallel and be positioned in same level;
The 3rd cutting roller, be arranged between described the first cutting roller and the second cutting roller, be positioned at the upside of described the first cutting roller and the second cutting roller same level, and the spacing of described the 3rd cutting roller to the first cutting roller is less than the spacing of the 3rd cutting roller to the second cutting roller;
The 4th cutting roller, be arranged between described the first cutting roller and the second cutting roller, with described the 3rd cutting roller opposing parallel and be positioned in same level, the spacing of described the 4th cutting roller to the three cutting rollers equals the spacing of described the 3rd cutting roller to the first cutting roller, and the spacing of described the 4th cutting roller to the three cutting rollers equals the spacing of described the 4th cutting roller to the second cutting roller; And
Diamond wire, be wound in successively on described the first cutting roller, the 3rd cutting roller, the 4th cutting roller and the second cutting roller, and between described the first cutting roller and the 3rd cutting roller, between described the 3rd cutting roller and the 4th cutting roller, and between described the 4th cutting roller and the second cutting roller, form respectively three sections of isometric lines of cut, in the time of described diamond wire high-speed cruising, three crystal silicon rods are carried out to cutting operation by these three sections of lines of cut simultaneously.
2. diamond cutting line slicing machine according to claim 1, is characterized in that: the angle that the diamond wire between described the 3rd cutting roller and the first cutting roller becomes with the diamond wire between described the first cutting roller and the second cutting roller equals the angle that the diamond wire between described the 4th cutting roller and the second cutting roller becomes with the diamond wire between described the first cutting roller and the second cutting roller.
3. diamond cutting line slicing machine according to claim 2, is characterized in that: described angle is the angle between 10 ° to 30 °.
4. diamond cutting line slicing machine according to claim 1, it is characterized in that: also comprise multiple part tools that send, be separately positioned in described frame, for transporting, described crystal silicon rod is oppressed between described the first cutting roller and the 3rd cutting roller, three sections of lines of cut between described the 3rd cutting roller and the 4th cutting roller and between described the 4th cutting roller and the second cutting roller to be to cut three crystal silicon rods simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010286077.1A CN102398314B (en) | 2010-09-17 | 2010-09-17 | Diamond cutting line slicing machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010286077.1A CN102398314B (en) | 2010-09-17 | 2010-09-17 | Diamond cutting line slicing machine |
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| CN102398314A CN102398314A (en) | 2012-04-04 |
| CN102398314B true CN102398314B (en) | 2014-05-21 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102717446B (en) * | 2012-07-13 | 2014-10-15 | 上海日进机床有限公司 | Four-roller sapphire slicing machine |
| CN102962904B (en) * | 2012-11-28 | 2015-08-05 | 天津市环欧半导体材料技术有限公司 | A kind of three station multi-wire saw workbench |
| CN103407009B (en) * | 2013-08-21 | 2015-11-18 | 常州贝斯塔德机械股份有限公司 | Diamond wire multi-line cutting machine |
| CN113306031A (en) * | 2021-05-24 | 2021-08-27 | 福州天瑞线锯科技有限公司 | Silicon rod bidirectional cutting mechanism |
| CN113370406A (en) * | 2021-05-24 | 2021-09-10 | 福州天瑞线锯科技有限公司 | Bidirectional cutting method for silicon crystal bar |
| CN114227960A (en) * | 2021-11-17 | 2022-03-25 | 青岛高测科技股份有限公司 | Discharging four-roller mechanism for diamond wire multi-wire cutting machine |
| CN114953230A (en) * | 2022-06-30 | 2022-08-30 | 青岛高测科技股份有限公司 | A multi-wire cutting machine |
| CN115946250A (en) * | 2022-11-23 | 2023-04-11 | 常州时创能源股份有限公司 | Cutting process of a half silicon block |
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| US5964210A (en) * | 1997-07-07 | 1999-10-12 | Laser Technology West Limited | Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire |
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Effective date of registration: 20180529 Address after: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Patentee after: Haining Dijin science and Technology Co., Ltd. Address before: No. 1358, nine dry road, Si Jing Town, Songjiang District, Shanghai Patentee before: Shanghai Nissin Machine Tool Co., Ltd. |