CN102398123A - Layered composite brazing filler metal - Google Patents
Layered composite brazing filler metal Download PDFInfo
- Publication number
- CN102398123A CN102398123A CN2011103905168A CN201110390516A CN102398123A CN 102398123 A CN102398123 A CN 102398123A CN 2011103905168 A CN2011103905168 A CN 2011103905168A CN 201110390516 A CN201110390516 A CN 201110390516A CN 102398123 A CN102398123 A CN 102398123A
- Authority
- CN
- China
- Prior art keywords
- agcu
- layer
- metal
- composite soldering
- lower layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000002131 composite material Substances 0.000 title claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 title abstract description 25
- 239000002184 metal Substances 0.000 title abstract description 25
- 238000005219 brazing Methods 0.000 title abstract description 4
- 239000000945 filler Substances 0.000 title abstract 2
- 239000000956 alloy Substances 0.000 claims abstract description 30
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 238000005476 soldering Methods 0.000 claims description 27
- 239000010970 precious metal Substances 0.000 claims description 13
- 239000000470 constituent Substances 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 229910000510 noble metal Inorganic materials 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 5
- 229910001316 Ag alloy Inorganic materials 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 abstract 3
- 239000010953 base metal Substances 0.000 abstract 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 13
- 239000010959 steel Substances 0.000 description 13
- 238000000137 annealing Methods 0.000 description 11
- 238000009792 diffusion process Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000005096 rolling process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 240000006409 Acacia auriculiformis Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The present invention relates to a layered composite brazing filler metal for welding base metals of metal and metal, metal and ceramic, ceramic and ceramic, etc. The composite solder comprises an upper layer, a middle layer and a lower layer, wherein the upper layer and the lower layer are one or both of noble metal base alloys, the middle layer is oxygen-free copper or copper-silver alloy, and the layer thickness ratio of the upper layer, the middle layer and the lower layer is 0.5-2: 0.5-4: 0.5-2; the noble metal base alloy of the upper and lower layers is Ag or AgCu10 ～ 50、AgCu10 ～ 50Ni0.1 ～ 0.45、AgCu23 ～ 28In9 ～ 16、AgCu20 ～ 32Pd5 ～ 20、Au79 ～ 81Cu19 ～ 21、Au82 ～ 83Ni17 ～ 18、AuAg2 ～ 20Cu10 ～ 55One or two of them, and the layers are in metallurgical bonding state. The composite solder has good welding performance and can meet the performance requirements of vacuum electronic industry on brazing materials.
Description
Technical field
The present invention relates to technical field of welding materials, specifically a kind of stratiform composite soldering of welding between mother metals such as metal and metal, metal and pottery, pottery and pottery of being used for.
Background technology
At present, the vacuum electronic industry has the part solder to adopt money base or auri solder, carries out the welding between the materials such as copper, pottery, expansion alloy.This type of solder, because of containing noble metal, thereby price is higher and the noble metal resource-constrained; For reducing the noble metal dosage in the solder; Some solders adopt formation new alloys such as adding Cd, Zn; But can not be used for the vacuum electronic industry because of elements such as the Cd that contains high-vapor-pressure, Zn exist, some solders adopt the mode of adding Sn, Si to form alloy, but because added elements such as Sn, Si; Cause material too crisp and be difficult for being shaped to strip or silk ribbon, thus big limitations their use.
Summary of the invention
The object of the present invention is to provide that a kind of to contain noble metal amount low, have low melting point, low-steam pressure, can satisfy the vacuum electronic industry requirement, and can be shaped to the stratiform composite soldering of strip or silk ribbon shape.
Composite soldering of the present invention is to be made up of upper, middle and lower-ranking, and upper and lower layer be that the intermediate layer is oxygen-free copper or Kufil with a kind of or be a kind of precious metal-based alloy respectively, and the bed thickness ratio of upper, middle and lower-ranking is 0.5～2:0.5～4:0.5～2; The precious metal-based alloy of upper and lower layer is Ag, AgCu
10～50, AgCu
10～50Ni
0.1～0.45, AgCu
23～28In
9～16, AgCu
20～32Pd
5～20, Au
79～81Cu
19～21, Au
82～83Ni
17～18, AuAg
2～20Cu
10～55In one or both.
Described upper and lower layer precious metal-based alloy is: AgCu
20～40, AgCu
20～40Ni
0.2～0.4, AgCu
25～28Pd
10～15, AuAg
8～15Cu
20～40In one or both.
Described upper and lower layer precious metal-based alloy is: AgCu
30～35, AgCu
30～35Ni
0.3～0.35, AuAg
10～12Cu
25～30In one or both.
The intermediate layer is that oxygen-free copper or oxygen content are not more than 0. 01% Kufil CuAg
0.1～10
Stratiform composite soldering of the present invention; Be that the bilevel precious metal-based alloy band that width is suitable and the oxygen-free copper stripe or the Kufil band in intermediate layer carry out surface treatment (cleaning up); Be rolled compound (metallurgical binding) after descending three-layer metal superimposed in will going up then, obtain the stratiform composite soldering through diffusion annealing and precision rolling.Employing metallurgical binding of the present invention is meant atom phase counterdiffusion between the interface of two metals and the combination that forms.This combination or connection status are to form in (perhaps under the effect of the common precious metal-based alloy of temperature and pressure) under the effect of temperature or pressure.After the interface of composite forms metallurgical binding, the favorable manufacturability ability is arranged.Can carry out various hot and cold pressure machine-shapings, can weld and machining.
The present invention adopts the composite that the belt method can the production rolling, has realized serialization production, has higher production efficiency.This composite soldering has good welding performance, can satisfy the performance requirement of vacuum electronic industry to brazing material.
The invention has the beneficial effects as follows:
1, the intermediate layer of stratiform composite soldering can effectively absorb the thermal stress after the welding, further prevents mother metal (metal that is soldered is called mother metal) hot tearing.
2, the throat depth fluctuation is little, helps the dimensional accuracy control of workpiece.
3, the thermal shock load that workpiece receives can be effectively carried in the intermediate layer of stratiform composite soldering, and workpiece will obtain increase to a certain degree service life.
4, scolder has been practiced thrift noble metal dosage, and cost is lower.
Description of drawings
Fig. 1 is a stratiform composite soldering structural representation of the present invention.
Among the figure, the 1-upper strata is the precious metal-based alloy, and the 2-intermediate layer is copper or Kufil, and 3-lower floor is the precious metal-based alloy.
The specific embodiment
As shown in Figure 1, stratiform composite soldering of the present invention comprises upper, middle and lower-ranking, and upper and lower layer is Ag, AgCu
10～50, AgCu
10～50Ni
0.1～0.45, AgCu
23～28In
9～16, AgCu
20～32Pd
5～20, Au
79～81Cu
19～21, Au
82～83Ni
17～18, AuAg
2～20Cu
10～55Same a kind of or different two kinds, the intermediate layer is that oxygen-free copper or oxygen content are not more than 0. 01% Kufil CuAg
0.1～10The bed thickness ratio of upper, middle and lower-ranking is 0.5～2:0.5～4:0.5～2, and three-layer metal is superimposed after the rolling compound composite band that makes is prepared into the stratiform composite soldering behind process diffusion annealing and the precision rolling again.
Embodiment 1:
Metallic intermediate layer is the oxygen-free copper band, and upper and lower layer metal is AgCu
28(perhaps AgCu
10, AgCu
15, AgCu
50Deng) alloy strip steel rolled stock.To equal wide, clean the band sub-cut with water the processing strip surface, superimposedly be rolled compoundly, after diffusion annealing, be rolled down to 0.1mm thickness again, the upper, middle and lower-ranking bed thickness is than being 1:4:1 (or 1:3:1,1:2:1), the stratiform composite soldering.
Embodiment 2:
Metallic intermediate layer is the oxygen-free copper band, and upper and lower layer metal is AgCu
50Ni
0.4Alloy strip steel rolled stock.To equal wide, clean the band sub-cut with water the processing strip surface, superimposedly be rolled compoundly, after diffusion annealing, be rolled down to 0.1mm thickness again, the upper, middle and lower-ranking bed thickness is than being 1:2.5:1, the stratiform composite soldering.
Embodiment 3:
Metallic intermediate layer is CuAg
7Alloy strip steel rolled stock, upper and lower layer metal is AgCu
27In
10Alloy strip steel rolled stock.To equal wide, clean the band sub-cut with water the processing strip surface, superimposedly be rolled compoundly, after diffusion annealing, be rolled down to 0.1mm thickness again, the upper, middle and lower-ranking bed thickness is than being 1:5:1, the stratiform composite soldering.
Embodiment 4:
Metallic intermediate layer is the oxygen-free copper band, and upper and lower layer metal is AgCu
20Pd
6Alloy strip steel rolled stock.To equal wide, clean the band sub-cut with water the processing strip surface, superimposedly be rolled compoundly, after diffusion annealing, be rolled down to 0.1mm thickness again, the upper, middle and lower-ranking bed thickness is than being 1:0.5:1, the stratiform composite soldering.
Embodiment 5:
Metallic intermediate layer is the oxygen-free copper band, and upper and lower layer metal is Au
80Cu
20Alloy strip steel rolled stock.To equal wide, clean the band sub-cut with water the processing strip surface, superimposedly be rolled compoundly, after diffusion annealing, be rolled down to 0.1mm thickness again, the upper, middle and lower-ranking bed thickness is than being 1:3.5:1, the stratiform composite soldering.
Embodiment 6:
Metallic intermediate layer is the oxygen-free copper band, and upper and lower layer metal is Au
82.5Ni
17.5Alloy strip steel rolled stock.To equal wide, clean the band sub-cut with water the processing strip surface, superimposedly be rolled compoundly, after diffusion annealing, be rolled down to 0.1mm thickness again, the upper, middle and lower-ranking bed thickness is than being 1:2:1, the stratiform composite soldering.
Embodiment 7:
Metallic intermediate layer is CuAg
0.5Alloy strip steel rolled stock, upper and lower layer metal is AuAg
10Cu
15Alloy strip steel rolled stock.To equal wide, clean the band sub-cut with water the processing strip surface, superimposedly be rolled compoundly, after diffusion annealing, be rolled down to 0.1mm thickness again, the upper, middle and lower-ranking bed thickness is than being 1:4.5:1, the stratiform composite soldering.
Embodiment 8:
Metallic intermediate layer is CuAg
3Alloy strip steel rolled stock, upper and lower layer metal is the Ag alloy strip steel rolled stock.To equal wide, clean the band sub-cut with water the processing strip surface, superimposedly be rolled compoundly, after diffusion annealing, be rolled down to 0.1mm thickness again, the upper, middle and lower-ranking bed thickness is than being 1:4.5:1, the stratiform composite soldering.
Embodiment 9:
Metallic intermediate layer is the oxygen-free copper band, and the upper strata metal is AgCu
28Ni
0.2Alloy strip steel rolled stock, lower metal are AgCu
28Alloy strip steel rolled stock.To equal wide, clean the band sub-cut with water the processing strip surface, superimposedly be rolled compoundly, after diffusion annealing, be rolled down to 0.1mm thickness again, the upper, middle and lower-ranking bed thickness is than being 1:4:1, the stratiform composite soldering.
Claims (5)
1. stratiform composite soldering; It is characterized in that this composite soldering is to be made up of upper, middle and lower-ranking; Upper and lower layer be that the intermediate layer is oxygen-free copper or Kufil with a kind of or be a kind of precious metal-based alloy respectively, and the bed thickness ratio of upper, middle and lower-ranking is 0.5～2:0.5～4:0.5～2; The precious metal-based alloy of upper and lower layer is Ag, AgCu
10～50, AgCu
10～50Ni
0.1～0.45, AgCu
23～28In
9～16, AgCu
20～32Pd
5～20, Au
79～81Cu
19～21, Au
82～83Ni
17～18, AuAg
2～20Cu
10～55In one or both; AgCu
10～50Copper content is weight percentage 10～50% in the expression Kufil, and all the other constituent contents are silver and unavoidable impurities, and other several kinds of precious metal-based alloy expression formulas are identical therewith.
2. stratiform composite soldering according to claim 1 is characterized in that described upper and lower layer precious metal-based alloy is AgCu
20～40, AgCu
20～40Ni
0.2～0.4, AgCu
25～28Pd
10～15, AuAg
8～15Cu
20～40In one or both.
3. stratiform composite soldering according to claim 1 is characterized in that described upper and lower layer precious metal-based alloy is AgCu
30～35, AgCu
30～35Ni
0.3～0.35, AuAg
10～12Cu
25～30In one or both.
4. stratiform composite soldering according to claim 1 is characterized in that described intermediate layer Kufil is CuAg
0.1～10
5. stratiform composite soldering according to claim 1 is characterized in that being between described upper, middle and lower-ranking the metallurgical binding state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103905168A CN102398123A (en) | 2011-09-08 | 2011-12-01 | Layered composite brazing filler metal |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110265683 | 2011-09-08 | ||
| CN201110265683.X | 2011-09-08 | ||
| CN2011103905168A CN102398123A (en) | 2011-09-08 | 2011-12-01 | Layered composite brazing filler metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102398123A true CN102398123A (en) | 2012-04-04 |
Family
ID=45880995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103905168A Pending CN102398123A (en) | 2011-09-08 | 2011-12-01 | Layered composite brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102398123A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104822486A (en) * | 2012-11-30 | 2015-08-05 | 千住金属工业株式会社 | Layered solder material for bonding dissimilar electrodes, and method for bonding dissimilar electrodes to electronic components |
| CN106271202A (en) * | 2016-08-30 | 2017-01-04 | 北京有色金属与稀土应用研究所 | A kind of composite brazing material and preparation method thereof |
| CN108581269A (en) * | 2018-05-02 | 2018-09-28 | 重庆金荣金属有限公司 | A kind of copper-based medium temperature composite solder |
| CN110317969A (en) * | 2018-03-28 | 2019-10-11 | 住友金属矿山株式会社 | The overlay film of solder bonding electrodes and solder bonding electrodes, which is formed, uses copper alloy target |
| CN115041863A (en) * | 2022-06-22 | 2022-09-13 | 浙江亚通焊材有限公司 | Composite brazing filler metal for automobile glass and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1586789A (en) * | 2004-07-05 | 2005-03-02 | 西北有色金属研究院 | Silver-based alloy/copper/silver-based alloy layered composite brazing material |
| CN101475395A (en) * | 2009-01-20 | 2009-07-08 | 贵研铂业股份有限公司 | Stainless steel / alumina ceramic low stress hermetic seal solder |
| JP2009190080A (en) * | 2008-02-18 | 2009-08-27 | Neomax Material:Kk | Copper-silver brazing filler metal and cladding material for lid of package for electronic component |
-
2011
- 2011-12-01 CN CN2011103905168A patent/CN102398123A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1586789A (en) * | 2004-07-05 | 2005-03-02 | 西北有色金属研究院 | Silver-based alloy/copper/silver-based alloy layered composite brazing material |
| JP2009190080A (en) * | 2008-02-18 | 2009-08-27 | Neomax Material:Kk | Copper-silver brazing filler metal and cladding material for lid of package for electronic component |
| CN101475395A (en) * | 2009-01-20 | 2009-07-08 | 贵研铂业股份有限公司 | Stainless steel / alumina ceramic low stress hermetic seal solder |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104822486A (en) * | 2012-11-30 | 2015-08-05 | 千住金属工业株式会社 | Layered solder material for bonding dissimilar electrodes, and method for bonding dissimilar electrodes to electronic components |
| CN104822486B (en) * | 2012-11-30 | 2019-04-19 | 千住金属工业株式会社 | Dissimilar electrode engagement stacking soft solder and the joint method of the dissimilar electrode of electronic component |
| CN106271202A (en) * | 2016-08-30 | 2017-01-04 | 北京有色金属与稀土应用研究所 | A kind of composite brazing material and preparation method thereof |
| CN110317969A (en) * | 2018-03-28 | 2019-10-11 | 住友金属矿山株式会社 | The overlay film of solder bonding electrodes and solder bonding electrodes, which is formed, uses copper alloy target |
| CN110317969B (en) * | 2018-03-28 | 2022-01-14 | 住友金属矿山株式会社 | Solder bonding electrode and copper alloy target for forming coating film of solder bonding electrode |
| CN108581269A (en) * | 2018-05-02 | 2018-09-28 | 重庆金荣金属有限公司 | A kind of copper-based medium temperature composite solder |
| CN115041863A (en) * | 2022-06-22 | 2022-09-13 | 浙江亚通焊材有限公司 | Composite brazing filler metal for automobile glass and preparation method and application thereof |
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Application publication date: 20120404 |