CN102348335A - Plugging device and circuit substrate plugging method - Google Patents
Plugging device and circuit substrate plugging method Download PDFInfo
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- CN102348335A CN102348335A CN2010102450673A CN201010245067A CN102348335A CN 102348335 A CN102348335 A CN 102348335A CN 2010102450673 A CN2010102450673 A CN 2010102450673A CN 201010245067 A CN201010245067 A CN 201010245067A CN 102348335 A CN102348335 A CN 102348335A
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Abstract
一种塞孔装置,用于对电路基板内的通孔进行塞孔。电路基板具有相对的上表面和下表面,通孔贯穿上表面和下表面。塞孔装置包括传送装置、涂布装置、吸气导墨装置及除墨装置。传送装置用于传送电路基板,以使得电路基板依次通过涂布装置、吸气导墨装置及除墨装置。涂布装置位于传送装置上方,用于向传送装置传送的电路基板的上表面涂布塞孔材料。吸气导墨装置位于传送装置传送的电路基板的下方,与电路基板的下表面接触,用于通过吸气而使得电路基板上表面的塞孔材料进入通孔内。除墨装置靠近所述传送装置传送的电路基板,用于将塞孔后电路基板上表面的塞孔材料去除。本发明还涉及一种采用塞孔装置进行电路基板塞孔的方法。
A plugging device is used for plugging a through hole in a circuit substrate. The circuit substrate has an upper surface and a lower surface opposite to each other, and the through hole runs through the upper surface and the lower surface. The plugging device includes a conveying device, a coating device, an ink suction device and an ink removing device. The conveying device is used for conveying the circuit substrate, so that the circuit substrate passes through the coating device, the suction ink guiding device and the ink removing device in sequence. The coating device is located above the conveying device, and is used to coat the upper surface of the circuit substrate conveyed by the conveying device with a plugging material. The air suction ink guiding device is located below the circuit substrate conveyed by the conveying device, contacts with the lower surface of the circuit substrate, and is used to make the plugging material on the upper surface of the circuit substrate enter the through hole through suction. The ink removing device is close to the circuit substrate conveyed by the conveying device, and is used for removing the plugging material on the upper surface of the circuit substrate after plugging the hole. The invention also relates to a method for plugging a circuit substrate using a plugging device.
Description
技术领域 technical field
本发明涉及电路板制作技术领域,尤其涉及一种在电路板制作过程中采用的塞孔装置及采用其进行电路基板塞孔的方法。The invention relates to the technical field of circuit board production, in particular to a plugging device used in the circuit board production process and a method for plugging holes in a circuit substrate using the same.
背景技术 Background technique
随着科学技术的进步,印刷电路板在电子领域得到的广泛的应用。关于电路板的应用请参见文献Takahashi,A.Ooki,N.Nagai,A.Akahoshi,H.Mukoh,A.Wajima,M.Res.Lab,High densitymultilayer printed circuit board for HITAC M-880,IEEE Trans.onComponents,Packaging,and Manufacturing Technology,1992,14(4):418-425。With the advancement of science and technology, printed circuit boards have been widely used in the electronic field. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 14(4): 418-425.
在电路板实际生产过程中,需要在电路板的需要导通的两层导电层之间形成导通孔,以使得后续形成的两层导电线路之间相互电连通。所述导通孔的形成通常采用如下方法:采用机械钻孔或激光成孔的方式在电路基板内形成通孔。然后采用通孔的内壁形成金属镀层,已将两导电层相互电导通。最后在通孔内进行塞孔处理,即将通孔填满材料,以免后续处理过程中的药水流入通孔内不易流出,从而最终残留在电路板产品内影响电路板产品的质量。现有技术中,通常采用印刷机台采用丝网印刷的方式对电路基板进行塞孔处理。但在印刷过程中,采用刮刀将油墨从网版的一侧印刷至网版另一侧的电路基板上。由于电路基板的通孔内具有空气,在印刷过程中,通孔内的气体不能全部排除,造成通孔中塞孔材料内有气泡或者塞空材料填充不完全,从而造成塞孔处理的可靠度较差。另外,因在塞孔过程中采用网版,造成了网版损耗,增加了电路板的生产成本。In the actual production process of the circuit board, a via hole needs to be formed between the two conductive layers of the circuit board, so that the subsequently formed two-layer conductive lines are electrically connected to each other. The via hole is usually formed by the following method: a via hole is formed in the circuit substrate by means of mechanical drilling or laser hole forming. Then, the inner wall of the through hole is used to form a metal plating layer, and the two conductive layers are electrically connected to each other. Finally, plugging treatment is carried out in the through hole, that is, the through hole is filled with materials, so as to prevent the medicine in the subsequent processing process from flowing into the through hole and not easy to flow out, so that it will eventually remain in the circuit board product and affect the quality of the circuit board product. In the prior art, a printing machine is usually used to perform plugging processing on the circuit substrate by means of screen printing. However, in the printing process, ink is printed from one side of the screen to the circuit substrate on the other side of the screen using a doctor blade. Because there is air in the through hole of the circuit substrate, the gas in the through hole cannot be completely removed during the printing process, resulting in bubbles in the plugging material in the through hole or incomplete filling of the plugging material, resulting in the reliability of the plugging process. poor. In addition, because the screen plate is used in the plugging process, the loss of the screen plate is caused, which increases the production cost of the circuit board.
发明内容 Contents of the invention
因此,有必要提供一种电路板塞孔装置,能够有效地提高导通孔塞孔的可靠度。Therefore, it is necessary to provide a circuit board plugging device, which can effectively improve the reliability of the via hole plugging.
以下将以实施例说明一种塞孔装置及一种电路基板的塞孔方法。A plugging device and a method for plugging a circuit substrate will be described below with examples.
一种塞孔装置,用于对电路基板内的通孔进行塞孔。所述电路基板具有相对的上表面和下表面,所述通孔贯穿所述上表面和下表面。所述塞孔装置包括传送装置、涂布装置、吸气导墨装置及除墨装置。所述传送装置用于传送电路基板,以使得电路基板依次通过涂布装置、吸气导墨装置及除墨装置。所述涂布装置位于传送装置上方,用于向传送装置传送的电路基板的上表面涂布塞孔材料。所述吸气导墨装置位于传送装置传送的电路基板的下方,与电路基板的下表面接触,用于通过吸气而使得电路基板上表面的塞孔材料进入通孔内。所述除墨装置靠近所述传送装置传送的电路基板,用于将塞孔后电路基板上表面的塞孔材料去除。一种电路基板塞孔方法,包括步骤:提供一个电路基板及一个所述的塞孔装置,所述电路基板具有上表面、与上表面相对的下表面及贯穿所述上表面和下表面的通孔;将电路基板固定于传送装置,使得电路基板的下表面与传送装置相接触,驱动传送装置传送电路基板;当电路基板传送至涂布装置下方时,所述涂布装置在电路基板的上表面涂布塞孔材料,当电路基板传送至吸气导墨装置上方时,所述吸气导墨装置与所述电路基板的通孔相连通,并将电路基板的上表面的塞孔材料导入所述通孔中,当电路基板传送至靠近除墨装置时,所述除墨装置将电路基板上表面的塞孔材料去除。A plugging device is used for plugging a through hole in a circuit substrate. The circuit substrate has opposite upper and lower surfaces, and the through hole penetrates the upper and lower surfaces. The plugging device includes a conveying device, a coating device, an ink suction device and an ink removing device. The conveying device is used for conveying the circuit substrate, so that the circuit substrate passes through the coating device, the suction ink guiding device and the ink removing device in sequence. The coating device is located above the conveying device, and is used for coating the plugging material on the upper surface of the circuit substrate conveyed by the conveying device. The air suction ink guiding device is located below the circuit substrate conveyed by the conveying device and is in contact with the lower surface of the circuit substrate, and is used to make the plugging material on the upper surface of the circuit substrate enter the through hole through suction. The ink removing device is close to the circuit substrate conveyed by the conveying device, and is used for removing the plugging material on the upper surface of the circuit substrate after plugging the hole. A circuit substrate plugging method, comprising the steps of: providing a circuit substrate and the plugging device, the circuit substrate has an upper surface, a lower surface opposite to the upper surface, and a through hole penetrating through the upper surface and the lower surface. hole; the circuit substrate is fixed on the conveying device so that the lower surface of the circuit substrate is in contact with the conveying device, and the conveying device is driven to convey the circuit substrate; when the circuit substrate is conveyed below the coating device, the coating device is placed on the circuit substrate The surface is coated with a plug hole material, and when the circuit substrate is conveyed above the air suction ink guide device, the air suction ink guide device communicates with the through hole of the circuit substrate, and guides the plug hole material on the upper surface of the circuit substrate In the through hole, when the circuit substrate is transported close to the ink removing device, the ink removing device removes the plug hole material on the upper surface of the circuit substrate.
与现有技术相比,本技术方案提供的塞孔装置不需要使用网版,可以直接将塞孔材料涂布于电路基板的表面,吸气导墨装置直接与进行塞孔的电路基板相互接触,从而能够有效地将电路基板中通孔内的气体排出并能够保证塞孔材料可以完全填充于通孔内,保证了塞孔可靠度。另外,由于塞孔装置具有传送装置,从而整个塞孔过程可以连续进行,提高了电路基板进行塞孔的效率。Compared with the prior art, the plugging device provided by this technical solution does not need to use a screen, and the plugging material can be directly coated on the surface of the circuit substrate, and the suction ink-guiding device directly contacts the circuit substrate for plugging the hole , so that the gas in the through hole in the circuit substrate can be effectively discharged and the plug hole material can be completely filled in the through hole, thereby ensuring the reliability of the plug hole. In addition, since the plugging device has a conveying device, the whole plugging process can be carried out continuously, which improves the efficiency of plugging the circuit substrate.
附图说明Description of drawings
图1是本技术方案实施例提供的塞孔装置的俯视示意图。Fig. 1 is a schematic top view of a plugging device provided by an embodiment of the technical solution.
图2是图1沿线II-II线的剖视图。Fig. 2 is a sectional view along line II-II of Fig. 1 .
图3是本技术方案实施例提供采用塞孔装置在电路基板表面形成塞孔材料的示意图。FIG. 3 is a schematic diagram of forming a plug hole material on the surface of a circuit substrate by using a plug hole device according to an embodiment of the technical solution.
图4是本技术方案实施例提供的采用塞孔装置将塞孔材料导入于电路基板的通孔内的示意图。Fig. 4 is a schematic diagram of introducing a plugging material into a through hole of a circuit substrate by using a plugging device provided by an embodiment of the technical solution.
图5是本技术方案实施例提供的采用塞孔装置将多余的塞孔材料从电路基板表面去除的示意图。Fig. 5 is a schematic diagram of removing excess plugging material from the surface of a circuit substrate by using a plugging device provided by an embodiment of the technical solution.
主要元件符号说明Description of main component symbols
电路基板 20
上表面 21
下表面 22
通孔 23Through
塞孔材料 30
塞孔装置 100
机台 110Machine 110
第一承载体 111
第二承载体 112Second carrier 112
传送装置 120
传动轴 121
传送带 122
外表面 1221
内表面 1222
夹持件 123Clamping
涂布装置 130Coating device 130
旋转轴 131Rotation axis 131
涂布滚轮 132Coating Roller 132
吸气导墨装置 140Suction
吸附腔体 141
第一端面 1411
第二端面 1412
吸附孔 1413
连接杆 1414Connecting rod 1414
收容腔体 142
第三端面 1421The third end face 1421
第四端面 1422
收容孔 1423
第一侧壁 1424
第二侧壁 1425
连接管 143
抽气泵 144
除墨装置 150Ink removal device 150
第一刮刀 151
第二刮刀 152
第一固定杆 153The first fixed rod 153
具体实施方式 Detailed ways
下面结合多个附图及实施例对本技术方案提供的塞孔装置作进一步说明。The plugging device provided by the technical solution will be further described below in conjunction with multiple drawings and embodiments.
请一并参阅图1和图2,本技术方案实施例提供一种塞孔装置100,用于对电路基板内的导通孔进行塞孔。塞孔装置100包括机台110、传送装置120、涂布装置130、吸气导墨装置140及除墨装置150。Please refer to FIG. 1 and FIG. 2 together. The embodiment of the technical solution provides a plugging
机台110用于承载传送装置120、涂布装置130、吸气导墨装置140及除墨装置150。本实施例中,机台110包括第一承载体111和第二承载体112。第一承载体111和第二承载体112均大致为长方形板状,且相互平行设置。第一承载体111和第二承载体112均沿着电路基板的传送方向设置(即图1中箭头所示方向)。The machine platform 110 is used for carrying the conveying
传送装置120用于传送待塞孔的电路基板。传送装置120包括两根传动轴121、两条传送带122及多个夹持件123。每根传动轴121均连接于第一承载体111和第二承载体112之间,其中一根靠近第一承载体111的一端和第二承载体112的一端,另一根靠近第一承载体111的另一端和第二承载体112的另一端。两根传动轴121相互平行且间隔设置,两个传动轴121的延伸方向垂直于电路基板的传送方向。两根传动轴121可以在驱动装置(图未示)的驱动下,相对于第一承载体111和第二承载体112转动。The conveying
两根传传送带122均为环形,且均套设于两根传动轴121,并可以在两根传动轴121的带动下转动。两根传送带122相互平行且相互间隔设置,两根传送带122的延伸方向平行于电路基板的传送方向。每根传送带122具有相对的外表面1221和内表面1222,内表面1222与两根传动轴121相互配合接触,外表面1221用于承载进行传送的电路基板。为了使得两根传动轴121与传送带122的内表面1222能够更好的配合,可以在传动轴121与内表面1222相接触的区域设置第一啮合齿,在传送带122的内表面1222设置多个与所述第一啮合齿配合的第二啮合齿,两个传动轴121带动两个传送带122运动时,第一啮合齿和第二啮合齿相互配合。The two
多个夹持件123分别安装于两根传送带122上,用于将传送的电路基板相对于传送带122固定。本实施例中,多个夹持件123设置于每根传送带122的外表面1221,并沿着传送带122等间距设置。两根传送带122上设置的夹持件123一一对应,相互对应的夹持件123用于固定一个电路基板。也可以为了使得电路基板固定的更加稳定,采用相互对应的两对夹持件123固定一个电路基板。相邻的两个夹持件123的间距可以根据进行塞孔的电路基板的宽度及一个电路基板固定于传送带122时采用的夹持件123的个数进行设定。夹持件123可以为两块相互配合的磁铁,其中一块固定于传送带122,可以将电路基板放置于两块磁铁之间,两块磁铁之间的磁力相互吸引,从而使得电路基板固定于传送带122。当传送带122的外表面具有粘性材料时,也可以将电路基板粘附于两传送带122上,此时传送带122上可以不设置夹持件123。A plurality of clamping
涂布装置130、吸气导墨装置140及除墨装置150沿电路基板的传送方向依次设置,并均与两根传送带122传送的电路基板相对。本实施例中,涂布装置130包括旋转轴131和涂布滚轮132。旋转轴131大致为圆柱形,其两端分别安装于第一承载体111和第二承载体112并位于两传送带122的上方,并可相对于第一承载体111和第二承载体112转动。旋转轴131沿垂直于电路基板的传送方向设置。涂布滚轮132为圆筒状,其固定套设于旋转轴131的中间部分,涂布滚轮132与两传送带122中间的区域相对应,涂布滚轮132可在旋转轴131的带动下转动与传送带122传送的电路基板的表面相接触,从而用于将涂布滚轮132上的油墨等塞孔材料涂布至传送装置120传送的电路基板表面。The coating device 130 , the
可以理解的是,涂布装置130不限于本实施例中提供的涂布滚轮,其可以可以为喷涂装置,塞孔材料通过所述喷涂装置喷于电路板的表面。It can be understood that the coating device 130 is not limited to the coating roller provided in this embodiment, and it may be a spraying device through which the plug hole material is sprayed on the surface of the circuit board.
吸气导墨装置140用于将电路基板表面涂布的油墨吸入至电路基板内的导通孔内。吸气导墨装置140设置于两传送带122之间。包括依次连通的吸附腔体141、收容腔体142、连接管143及抽气泵144。The
吸附腔体141用于将传送带122传送的电路基板的导通孔内的气体吸出,并将电路基板表面的塞孔材料导入至导通孔内。本实施例中,吸附腔体141大致为长方体形,其具有相对的第一端面1411和第二端面1412。第一端面1411垂直于电路基板的传送方向设置。第一端面1411与传送带122上侧的外表面1221大致位于同一平面内,其大致为长方形,垂直于电路基板传送方向,第一端面1411的长度略小于两传送带122之间的间距。自第一端面1411向第二端面1412开设有一个沿垂直于电路基板传送方向的吸附孔1413,吸附孔1413贯穿第一端面1411和第二端面1412。本实施例中,为了使得吸附腔体141能够相对于机台110固定,将吸附腔体141平行于电路基板传送方向的两端通过两个连接杆1414分别固定于第一承载体111和第二承载体112。The
收容腔体142与吸附腔体141的吸附孔1413相互连通,用于收容由吸附腔体141吸入的过多的塞孔材料。收容腔体142配合连接于吸附腔体141的第二端面1412的一侧。收容腔体142具有相对的第三端面1421和第四端面1422。自第三端面1421向第四端面1422形成有收容孔1423。本实施例中,吸附腔体141靠近第二端面1412的一端可拆卸地配合连接于收容腔体142。收容孔1423自所述吸附孔1413向平行于电路基板的传送方向弯曲,即其沿平行于电路基板传送方向的剖面的形状为向远离吸附腔体141方向弯曲的弧状。具体为,收容腔体142具有相对的且相互平行的第一侧壁1424和第二侧壁1425。第一侧壁1424沿平行于电路基板传送方向的剖面均为向远离吸附腔体141方向弯曲的弧状,从而收容孔1423在此方向上的横截面的形状也为弧状。这样,当吸附孔1413吸入收容腔体142内的塞孔材料可以存留在收容孔1423内,可以避免被吸入抽气泵144中而造成抽气泵144堵塞。并且,吸附腔体141与收容腔体142并非为一体结构,当收容腔体142存留的塞孔材料较多时,可以将收容腔体142从吸附腔体141上分离,再对收容腔体142进行处理。The
连接管143用于将收容腔体142连接抽气泵144。抽气泵144用于将连接管143、收容腔体142及吸附腔体141内的气体抽出,从而将与吸附孔1413相连通的电路基板的导通孔内的气体吸出,从而将电路基板表面涂布的塞孔材料导入导通孔内。根据待进行塞孔处理的导通孔的深度及传送装置120传送电路基板的速度,控制抽气泵144的抽气的速率,使得塞孔材料可以填满导通孔,并且没有或者仅有少量的塞孔材料通过导通孔至电路基板的另一面或者进入收容腔体142内。The connecting
除墨装置150用于将电路基板表面剩余的塞孔材料去除。除墨装置150包括相对设置的第一刮刀151和第二刮刀152。本实施例中,第一刮刀151经过第一固定杆153固定于第一承载体111和第二承载体112之间。第一刮刀151位于两传送带122之间的区域的上方,第一刮刀151的延伸方向垂直于电路基板的传送方向。第一刮刀151的刀刃部分与传送带122传送的电路板的上表面相对,用于将该上表面的塞孔材料刮去。第二刮刀152位于第一刮刀151的下方,与第一刮刀151相对应。具体的,第二刮刀152位于传送带122传送的电路基板的下侧,其与电路基板的下表面相对,用于将从电路基板下表面凸出的塞孔材料去除。第二刮刀152通过第二固定杆(图未示)固定于第一承载体111和第二承载体112之间。第二刮刀152的延伸方向垂直于电路基板的传送方向。第一刮刀151和第二刮刀152可以采用橡胶等具有弹性的材料制成。The ink removing device 150 is used for removing the remaining plug hole material on the surface of the circuit substrate. The ink removing device 150 includes a
可以理解的是,当吸气导墨装置140设定的抽气速率与电路基板的传送速率相配合时,能够保证塞孔材料仅将电路基板的导通孔塞满而没有通过导通孔到电路基板的另一表面,除墨装置150可以仅包括设置于电路基板涂布有塞孔材料一侧的第一刮刀151,即可将电路基板表面涂布的塞孔材料去除。It can be understood that when the suction rate set by the air suction
另外,除墨装置150也可以为其他能够去除电路基板表面的塞孔材料的装置。例如,除墨装置150可为设置传送的电路基板相对两侧的两个风刀,通过向电路基板的表面喷射高压气体,使得电路基板表面的多余塞孔材料从电路基板表面除去。除墨装置150也可设置传送的电路基板相对两侧的两个磨刷滚轮,通过对电路基板表面的多余的塞孔材料进行磨刷将多余的塞孔材料从电路基板表面除去。In addition, the ink removing device 150 may also be other devices capable of removing the plugging material on the surface of the circuit substrate. For example, the ink removing device 150 can be two air knives arranged on opposite sides of the conveyed circuit substrate, and the excess plugging material on the surface of the circuit substrate is removed from the surface of the circuit substrate by spraying high-pressure gas on the surface of the circuit substrate. The ink removing device 150 can also be provided with two grinding rollers on opposite sides of the conveyed circuit substrate, and the excess plugging material on the surface of the circuit substrate can be removed from the surface of the circuit substrate by brushing the excess plugging material.
由于电路板制作过程中,在进行塞孔之后还可能包括磨刷等后续处理,电路基板表面的塞孔材料也可以不用去除,即塞孔装置100也可以不包括除墨装置150。Since the circuit board manufacturing process may include post-processing such as brushing after plugging, the plugging material on the surface of the circuit substrate may not be removed, that is, the plugging
采用提供的塞孔装置进行电路基板塞孔,可包括如下步骤:Using the provided plugging device to plug holes in the circuit board may include the following steps:
第一步,请参阅图3,提供塞孔装置100及电路基板20。The first step, please refer to FIG. 3 , provides the
电路基板20具有相对的上表面21和下表面22,在电路基板20内具有自上表面21向下表面22延伸的多个通孔23。The
第二步,将电路基板20固定于传送装置120,使得电路基板20的下表面22与传送装置120相接触,驱动传送装置120传送电路基板20。In the second step, the
第三步,请一并参阅图3、图4及图5,当电路基板20传送至涂布装置130下方时,所述涂布装置130在电路基板20的上表面21涂布塞孔材料30,当电路基板20传送至吸气导墨装置140上方时,所述吸气导墨装置140与所述电路基板20的通孔23相连通,并将电路基板20的上表面21的塞孔材料30导入所述通孔23中,当电路基板20传送至靠近除墨装置150时,所述除墨装置150将电路基板20的上表面21的塞孔材料30去除。In the third step, please refer to FIG. 3 , FIG. 4 and FIG. 5 together. When the
通过将涂布装置130与电路基板20的上表面21相互接触,使得涂布装置130表面沾附的塞孔材料30涂布至电路基板20的上表面21。涂布装置130在上表面21的涂布塞孔材料的位置可以根据多个通孔23分布的区域进行设定。当多个通孔23分布在相对集中的区域时,可以只在上表面21内通孔23分布的区域涂布塞孔材料。当多个通孔23分散的分布在电路基板20时,可以使得涂布装置130在整个上表面21涂布塞孔材料30。By bringing the coating device 130 into contact with the
当电路基板20传送至与吸气导墨装置140相对应时,电路基板20的下表面22与吸附腔体141的第一端面1411相接触,从而在电路基板20移动过程中,吸附孔1413与电路基板20内的通孔23相连通。由于抽气泵144的抽气作用,从而使得电路基板20的上表面21上覆盖通孔23的塞孔材料被导入通孔23内,使得通孔23被塞满。随着电路基板20在传送装置120上传送,当电路基板20完全通过吸气导墨装置140时,电路基板20内的通孔23全部被塞孔材料填充。在实际操作中,可以根据不同的电路基板20和电路基板20的传送速度不同,控制抽气泵144抽气的速率,以保证每个通孔23能够被完全填充并有较少的塞孔材料透过至下表面22。When the
当电路基板20传送至与除墨装置150相对应时,第一刮刀151与电路基板20的上表面21相接触,第二刮刀152与电路基板20的下表面22相接触。在电路基板20的传送过程中,电路基板20上多余的塞孔材料从电路基板20的上表面21和下表面22去除,从而得到完成塞孔的电路基板20。When the
本技术方案提供的塞孔装置不需要使用网版,可以直接将塞孔材料涂布于电路基板的表面,吸气导墨装置140直接与进行塞孔的电路基板相互接触,从而能够有效地将电路基板中通孔内的气体排出并能够保证塞孔材料可以完全填充于通孔内,保证了塞孔可靠度。另外,由于塞孔装置具有传送装置,从而整个塞孔过程可以连续进行,提高了电路基板进行塞孔的效率。The plugging device provided by this technical solution does not need to use a screen, and the plugging material can be directly coated on the surface of the circuit substrate. The suction
可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.
Claims (10)
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CN108419367A (en) * | 2018-03-06 | 2018-08-17 | 梅州金时裕科技有限公司 | A kind of method for plugging of printed wiring board |
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CN108419367A (en) * | 2018-03-06 | 2018-08-17 | 梅州金时裕科技有限公司 | A kind of method for plugging of printed wiring board |
CN112449509A (en) * | 2020-10-16 | 2021-03-05 | 浙江展邦电子科技有限公司 | Painting and hole plugging synchronous system applied to circuit board |
CN112449509B (en) * | 2020-10-16 | 2022-04-22 | 浙江展邦电子科技有限公司 | Painting and hole plugging synchronous system applied to circuit board |
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