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CN102348335A - Plugging device and circuit substrate plugging method - Google Patents

Plugging device and circuit substrate plugging method Download PDF

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Publication number
CN102348335A
CN102348335A CN2010102450673A CN201010245067A CN102348335A CN 102348335 A CN102348335 A CN 102348335A CN 2010102450673 A CN2010102450673 A CN 2010102450673A CN 201010245067 A CN201010245067 A CN 201010245067A CN 102348335 A CN102348335 A CN 102348335A
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circuit substrate
hole
plugging
carrier
conveying
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林钊文
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Honsentech Co Ltd
Avary Holding Shenzhen Co Ltd
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Honsentech Co Ltd
Fukui Precision Component Shenzhen Co Ltd
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Abstract

一种塞孔装置,用于对电路基板内的通孔进行塞孔。电路基板具有相对的上表面和下表面,通孔贯穿上表面和下表面。塞孔装置包括传送装置、涂布装置、吸气导墨装置及除墨装置。传送装置用于传送电路基板,以使得电路基板依次通过涂布装置、吸气导墨装置及除墨装置。涂布装置位于传送装置上方,用于向传送装置传送的电路基板的上表面涂布塞孔材料。吸气导墨装置位于传送装置传送的电路基板的下方,与电路基板的下表面接触,用于通过吸气而使得电路基板上表面的塞孔材料进入通孔内。除墨装置靠近所述传送装置传送的电路基板,用于将塞孔后电路基板上表面的塞孔材料去除。本发明还涉及一种采用塞孔装置进行电路基板塞孔的方法。

Figure 201010245067

A plugging device is used for plugging a through hole in a circuit substrate. The circuit substrate has an upper surface and a lower surface opposite to each other, and the through hole runs through the upper surface and the lower surface. The plugging device includes a conveying device, a coating device, an ink suction device and an ink removing device. The conveying device is used for conveying the circuit substrate, so that the circuit substrate passes through the coating device, the suction ink guiding device and the ink removing device in sequence. The coating device is located above the conveying device, and is used to coat the upper surface of the circuit substrate conveyed by the conveying device with a plugging material. The air suction ink guiding device is located below the circuit substrate conveyed by the conveying device, contacts with the lower surface of the circuit substrate, and is used to make the plugging material on the upper surface of the circuit substrate enter the through hole through suction. The ink removing device is close to the circuit substrate conveyed by the conveying device, and is used for removing the plugging material on the upper surface of the circuit substrate after plugging the hole. The invention also relates to a method for plugging a circuit substrate using a plugging device.

Figure 201010245067

Description

塞孔装置及电路基板塞孔方法Plugging device and circuit substrate plugging method

技术领域 technical field

本发明涉及电路板制作技术领域,尤其涉及一种在电路板制作过程中采用的塞孔装置及采用其进行电路基板塞孔的方法。The invention relates to the technical field of circuit board production, in particular to a plugging device used in the circuit board production process and a method for plugging holes in a circuit substrate using the same.

背景技术 Background technique

随着科学技术的进步,印刷电路板在电子领域得到的广泛的应用。关于电路板的应用请参见文献Takahashi,A.Ooki,N.Nagai,A.Akahoshi,H.Mukoh,A.Wajima,M.Res.Lab,High densitymultilayer printed circuit board for HITAC M-880,IEEE Trans.onComponents,Packaging,and Manufacturing Technology,1992,14(4):418-425。With the advancement of science and technology, printed circuit boards have been widely used in the electronic field. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 14(4): 418-425.

在电路板实际生产过程中,需要在电路板的需要导通的两层导电层之间形成导通孔,以使得后续形成的两层导电线路之间相互电连通。所述导通孔的形成通常采用如下方法:采用机械钻孔或激光成孔的方式在电路基板内形成通孔。然后采用通孔的内壁形成金属镀层,已将两导电层相互电导通。最后在通孔内进行塞孔处理,即将通孔填满材料,以免后续处理过程中的药水流入通孔内不易流出,从而最终残留在电路板产品内影响电路板产品的质量。现有技术中,通常采用印刷机台采用丝网印刷的方式对电路基板进行塞孔处理。但在印刷过程中,采用刮刀将油墨从网版的一侧印刷至网版另一侧的电路基板上。由于电路基板的通孔内具有空气,在印刷过程中,通孔内的气体不能全部排除,造成通孔中塞孔材料内有气泡或者塞空材料填充不完全,从而造成塞孔处理的可靠度较差。另外,因在塞孔过程中采用网版,造成了网版损耗,增加了电路板的生产成本。In the actual production process of the circuit board, a via hole needs to be formed between the two conductive layers of the circuit board, so that the subsequently formed two-layer conductive lines are electrically connected to each other. The via hole is usually formed by the following method: a via hole is formed in the circuit substrate by means of mechanical drilling or laser hole forming. Then, the inner wall of the through hole is used to form a metal plating layer, and the two conductive layers are electrically connected to each other. Finally, plugging treatment is carried out in the through hole, that is, the through hole is filled with materials, so as to prevent the medicine in the subsequent processing process from flowing into the through hole and not easy to flow out, so that it will eventually remain in the circuit board product and affect the quality of the circuit board product. In the prior art, a printing machine is usually used to perform plugging processing on the circuit substrate by means of screen printing. However, in the printing process, ink is printed from one side of the screen to the circuit substrate on the other side of the screen using a doctor blade. Because there is air in the through hole of the circuit substrate, the gas in the through hole cannot be completely removed during the printing process, resulting in bubbles in the plugging material in the through hole or incomplete filling of the plugging material, resulting in the reliability of the plugging process. poor. In addition, because the screen plate is used in the plugging process, the loss of the screen plate is caused, which increases the production cost of the circuit board.

发明内容 Contents of the invention

因此,有必要提供一种电路板塞孔装置,能够有效地提高导通孔塞孔的可靠度。Therefore, it is necessary to provide a circuit board plugging device, which can effectively improve the reliability of the via hole plugging.

以下将以实施例说明一种塞孔装置及一种电路基板的塞孔方法。A plugging device and a method for plugging a circuit substrate will be described below with examples.

一种塞孔装置,用于对电路基板内的通孔进行塞孔。所述电路基板具有相对的上表面和下表面,所述通孔贯穿所述上表面和下表面。所述塞孔装置包括传送装置、涂布装置、吸气导墨装置及除墨装置。所述传送装置用于传送电路基板,以使得电路基板依次通过涂布装置、吸气导墨装置及除墨装置。所述涂布装置位于传送装置上方,用于向传送装置传送的电路基板的上表面涂布塞孔材料。所述吸气导墨装置位于传送装置传送的电路基板的下方,与电路基板的下表面接触,用于通过吸气而使得电路基板上表面的塞孔材料进入通孔内。所述除墨装置靠近所述传送装置传送的电路基板,用于将塞孔后电路基板上表面的塞孔材料去除。一种电路基板塞孔方法,包括步骤:提供一个电路基板及一个所述的塞孔装置,所述电路基板具有上表面、与上表面相对的下表面及贯穿所述上表面和下表面的通孔;将电路基板固定于传送装置,使得电路基板的下表面与传送装置相接触,驱动传送装置传送电路基板;当电路基板传送至涂布装置下方时,所述涂布装置在电路基板的上表面涂布塞孔材料,当电路基板传送至吸气导墨装置上方时,所述吸气导墨装置与所述电路基板的通孔相连通,并将电路基板的上表面的塞孔材料导入所述通孔中,当电路基板传送至靠近除墨装置时,所述除墨装置将电路基板上表面的塞孔材料去除。A plugging device is used for plugging a through hole in a circuit substrate. The circuit substrate has opposite upper and lower surfaces, and the through hole penetrates the upper and lower surfaces. The plugging device includes a conveying device, a coating device, an ink suction device and an ink removing device. The conveying device is used for conveying the circuit substrate, so that the circuit substrate passes through the coating device, the suction ink guiding device and the ink removing device in sequence. The coating device is located above the conveying device, and is used for coating the plugging material on the upper surface of the circuit substrate conveyed by the conveying device. The air suction ink guiding device is located below the circuit substrate conveyed by the conveying device and is in contact with the lower surface of the circuit substrate, and is used to make the plugging material on the upper surface of the circuit substrate enter the through hole through suction. The ink removing device is close to the circuit substrate conveyed by the conveying device, and is used for removing the plugging material on the upper surface of the circuit substrate after plugging the hole. A circuit substrate plugging method, comprising the steps of: providing a circuit substrate and the plugging device, the circuit substrate has an upper surface, a lower surface opposite to the upper surface, and a through hole penetrating through the upper surface and the lower surface. hole; the circuit substrate is fixed on the conveying device so that the lower surface of the circuit substrate is in contact with the conveying device, and the conveying device is driven to convey the circuit substrate; when the circuit substrate is conveyed below the coating device, the coating device is placed on the circuit substrate The surface is coated with a plug hole material, and when the circuit substrate is conveyed above the air suction ink guide device, the air suction ink guide device communicates with the through hole of the circuit substrate, and guides the plug hole material on the upper surface of the circuit substrate In the through hole, when the circuit substrate is transported close to the ink removing device, the ink removing device removes the plug hole material on the upper surface of the circuit substrate.

与现有技术相比,本技术方案提供的塞孔装置不需要使用网版,可以直接将塞孔材料涂布于电路基板的表面,吸气导墨装置直接与进行塞孔的电路基板相互接触,从而能够有效地将电路基板中通孔内的气体排出并能够保证塞孔材料可以完全填充于通孔内,保证了塞孔可靠度。另外,由于塞孔装置具有传送装置,从而整个塞孔过程可以连续进行,提高了电路基板进行塞孔的效率。Compared with the prior art, the plugging device provided by this technical solution does not need to use a screen, and the plugging material can be directly coated on the surface of the circuit substrate, and the suction ink-guiding device directly contacts the circuit substrate for plugging the hole , so that the gas in the through hole in the circuit substrate can be effectively discharged and the plug hole material can be completely filled in the through hole, thereby ensuring the reliability of the plug hole. In addition, since the plugging device has a conveying device, the whole plugging process can be carried out continuously, which improves the efficiency of plugging the circuit substrate.

附图说明Description of drawings

图1是本技术方案实施例提供的塞孔装置的俯视示意图。Fig. 1 is a schematic top view of a plugging device provided by an embodiment of the technical solution.

图2是图1沿线II-II线的剖视图。Fig. 2 is a sectional view along line II-II of Fig. 1 .

图3是本技术方案实施例提供采用塞孔装置在电路基板表面形成塞孔材料的示意图。FIG. 3 is a schematic diagram of forming a plug hole material on the surface of a circuit substrate by using a plug hole device according to an embodiment of the technical solution.

图4是本技术方案实施例提供的采用塞孔装置将塞孔材料导入于电路基板的通孔内的示意图。Fig. 4 is a schematic diagram of introducing a plugging material into a through hole of a circuit substrate by using a plugging device provided by an embodiment of the technical solution.

图5是本技术方案实施例提供的采用塞孔装置将多余的塞孔材料从电路基板表面去除的示意图。Fig. 5 is a schematic diagram of removing excess plugging material from the surface of a circuit substrate by using a plugging device provided by an embodiment of the technical solution.

主要元件符号说明Description of main component symbols

电路基板    20Circuit board 20

上表面      21Upper surface 21

下表面      22lower surface 22

通孔        23Through hole 23

塞孔材料    30Plug material 30

塞孔装置    100Plug device 100

机台        110Machine 110

第一承载体  111First carrier 111

第二承载体  112Second carrier 112

传送装置    120Teleporter 120

传动轴      121Drive shaft 121

传送带      122conveyor belt 122

外表面      1221External surface 1221

内表面      1222Inner surface 1222

夹持件      123Clamping piece 123

涂布装置        130Coating device 130

旋转轴          131Rotation axis 131

涂布滚轮        132Coating Roller 132

吸气导墨装置    140Suction ink guide device 140

吸附腔体        141Adsorption chamber 141

第一端面        1411First end face 1411

第二端面        1412Second end face 1412

吸附孔          1413Adsorption hole 1413

连接杆          1414Connecting rod 1414

收容腔体        142Containment Chamber 142

第三端面        1421The third end face 1421

第四端面        1422Fourth end face 1422

收容孔          1423Containment Hole 1423

第一侧壁        1424First side wall 1424

第二侧壁        1425Second side wall 1425

连接管          143Connecting pipe 143

抽气泵          144Aspirator 144

除墨装置        150Ink removal device 150

第一刮刀        151First scraper 151

第二刮刀        152Second scraper 152

第一固定杆      153The first fixed rod 153

具体实施方式 Detailed ways

下面结合多个附图及实施例对本技术方案提供的塞孔装置作进一步说明。The plugging device provided by the technical solution will be further described below in conjunction with multiple drawings and embodiments.

请一并参阅图1和图2,本技术方案实施例提供一种塞孔装置100,用于对电路基板内的导通孔进行塞孔。塞孔装置100包括机台110、传送装置120、涂布装置130、吸气导墨装置140及除墨装置150。Please refer to FIG. 1 and FIG. 2 together. The embodiment of the technical solution provides a plugging device 100 for plugging via holes in a circuit substrate. The plugging device 100 includes a machine 110 , a conveying device 120 , a coating device 130 , an ink suction device 140 and an ink removing device 150 .

机台110用于承载传送装置120、涂布装置130、吸气导墨装置140及除墨装置150。本实施例中,机台110包括第一承载体111和第二承载体112。第一承载体111和第二承载体112均大致为长方形板状,且相互平行设置。第一承载体111和第二承载体112均沿着电路基板的传送方向设置(即图1中箭头所示方向)。The machine platform 110 is used for carrying the conveying device 120 , the coating device 130 , the suction ink guiding device 140 and the ink removing device 150 . In this embodiment, the machine table 110 includes a first carrier 111 and a second carrier 112 . Both the first carrier 111 and the second carrier 112 are substantially rectangular plate-shaped and arranged parallel to each other. Both the first carrier 111 and the second carrier 112 are arranged along the conveying direction of the circuit substrate (ie, the direction indicated by the arrow in FIG. 1 ).

传送装置120用于传送待塞孔的电路基板。传送装置120包括两根传动轴121、两条传送带122及多个夹持件123。每根传动轴121均连接于第一承载体111和第二承载体112之间,其中一根靠近第一承载体111的一端和第二承载体112的一端,另一根靠近第一承载体111的另一端和第二承载体112的另一端。两根传动轴121相互平行且间隔设置,两个传动轴121的延伸方向垂直于电路基板的传送方向。两根传动轴121可以在驱动装置(图未示)的驱动下,相对于第一承载体111和第二承载体112转动。The conveying device 120 is used for conveying the circuit substrate to be plugged. The transmission device 120 includes two transmission shafts 121 , two transmission belts 122 and a plurality of clamping parts 123 . Each transmission shaft 121 is connected between the first carrier 111 and the second carrier 112, one of which is close to one end of the first carrier 111 and one end of the second carrier 112, and the other is close to the first carrier 111 and the other end of the second carrier 112 . The two transmission shafts 121 are arranged parallel to each other and spaced apart, and the extending direction of the two transmission shafts 121 is perpendicular to the conveying direction of the circuit substrate. The two transmission shafts 121 can rotate relative to the first carrier 111 and the second carrier 112 under the drive of a driving device (not shown in the figure).

两根传传送带122均为环形,且均套设于两根传动轴121,并可以在两根传动轴121的带动下转动。两根传送带122相互平行且相互间隔设置,两根传送带122的延伸方向平行于电路基板的传送方向。每根传送带122具有相对的外表面1221和内表面1222,内表面1222与两根传动轴121相互配合接触,外表面1221用于承载进行传送的电路基板。为了使得两根传动轴121与传送带122的内表面1222能够更好的配合,可以在传动轴121与内表面1222相接触的区域设置第一啮合齿,在传送带122的内表面1222设置多个与所述第一啮合齿配合的第二啮合齿,两个传动轴121带动两个传送带122运动时,第一啮合齿和第二啮合齿相互配合。The two transmission belts 122 are both ring-shaped, and both are sheathed on the two transmission shafts 121 , and can rotate under the drive of the two transmission shafts 121 . The two conveyor belts 122 are arranged parallel to each other and spaced apart from each other, and the extending direction of the two conveyor belts 122 is parallel to the conveying direction of the circuit substrate. Each conveyor belt 122 has an opposite outer surface 1221 and an inner surface 1222 , the inner surface 1222 is in contact with the two transmission shafts 121 , and the outer surface 1221 is used to carry the circuit substrate for transmission. In order to make the two transmission shafts 121 and the inner surface 1222 of the conveyor belt 122 can cooperate better, the first meshing teeth can be arranged in the area where the transmission shaft 121 contacts the inner surface 1222, and a plurality of meshing teeth can be arranged on the inner surface 1222 of the conveyor belt 122. The first meshing teeth cooperate with the second meshing teeth. When the two transmission shafts 121 drive the two conveyor belts 122 to move, the first meshing teeth and the second meshing teeth cooperate with each other.

多个夹持件123分别安装于两根传送带122上,用于将传送的电路基板相对于传送带122固定。本实施例中,多个夹持件123设置于每根传送带122的外表面1221,并沿着传送带122等间距设置。两根传送带122上设置的夹持件123一一对应,相互对应的夹持件123用于固定一个电路基板。也可以为了使得电路基板固定的更加稳定,采用相互对应的两对夹持件123固定一个电路基板。相邻的两个夹持件123的间距可以根据进行塞孔的电路基板的宽度及一个电路基板固定于传送带122时采用的夹持件123的个数进行设定。夹持件123可以为两块相互配合的磁铁,其中一块固定于传送带122,可以将电路基板放置于两块磁铁之间,两块磁铁之间的磁力相互吸引,从而使得电路基板固定于传送带122。当传送带122的外表面具有粘性材料时,也可以将电路基板粘附于两传送带122上,此时传送带122上可以不设置夹持件123。A plurality of clamping parts 123 are respectively installed on the two conveyor belts 122 for fixing the transmitted circuit substrate relative to the conveyor belts 122 . In this embodiment, a plurality of clamping components 123 are disposed on the outer surface 1221 of each conveyor belt 122 and arranged at equal intervals along the conveyor belt 122 . The clamping pieces 123 provided on the two conveyor belts 122 correspond to one another, and the clamping pieces 123 corresponding to each other are used to fix a circuit substrate. In order to make the fixing of the circuit substrate more stable, two pairs of clamping parts 123 corresponding to each other can also be used to fix a circuit substrate. The distance between two adjacent clamping pieces 123 can be set according to the width of the circuit substrate to be plugged and the number of clamping pieces 123 used when one circuit substrate is fixed on the conveyor belt 122 . The clamping part 123 can be two magnets that cooperate with each other, one of which is fixed on the conveyor belt 122, and the circuit substrate can be placed between the two magnets, and the magnetic force between the two magnets attracts each other, so that the circuit substrate is fixed on the conveyor belt 122 . When the outer surface of the conveyor belts 122 has an adhesive material, the circuit board can also be adhered to the two conveyor belts 122 , and at this time, the clamping member 123 may not be provided on the conveyor belts 122 .

涂布装置130、吸气导墨装置140及除墨装置150沿电路基板的传送方向依次设置,并均与两根传送带122传送的电路基板相对。本实施例中,涂布装置130包括旋转轴131和涂布滚轮132。旋转轴131大致为圆柱形,其两端分别安装于第一承载体111和第二承载体112并位于两传送带122的上方,并可相对于第一承载体111和第二承载体112转动。旋转轴131沿垂直于电路基板的传送方向设置。涂布滚轮132为圆筒状,其固定套设于旋转轴131的中间部分,涂布滚轮132与两传送带122中间的区域相对应,涂布滚轮132可在旋转轴131的带动下转动与传送带122传送的电路基板的表面相接触,从而用于将涂布滚轮132上的油墨等塞孔材料涂布至传送装置120传送的电路基板表面。The coating device 130 , the ink suction device 140 and the ink removing device 150 are arranged in sequence along the conveying direction of the circuit substrate, and are all opposite to the circuit substrate conveyed by the two conveyor belts 122 . In this embodiment, the coating device 130 includes a rotating shaft 131 and a coating roller 132 . The rotating shaft 131 is roughly cylindrical, and its two ends are respectively installed on the first carrier 111 and the second carrier 112 and located above the two conveyor belts 122 , and can rotate relative to the first carrier 111 and the second carrier 112 . The rotation shaft 131 is arranged perpendicular to the conveying direction of the circuit substrate. The coating roller 132 is cylindrical, and it is fixedly sleeved on the middle part of the rotating shaft 131. The coating roller 132 corresponds to the area between the two conveyor belts 122. The coating roller 132 can rotate with the conveyor belt under the drive of the rotating shaft 131. The surface of the circuit substrate conveyed by the conveying device 122 is in contact with each other, so as to apply the plugging material such as ink on the coating roller 132 to the surface of the circuit substrate conveyed by the conveying device 120 .

可以理解的是,涂布装置130不限于本实施例中提供的涂布滚轮,其可以可以为喷涂装置,塞孔材料通过所述喷涂装置喷于电路板的表面。It can be understood that the coating device 130 is not limited to the coating roller provided in this embodiment, and it may be a spraying device through which the plug hole material is sprayed on the surface of the circuit board.

吸气导墨装置140用于将电路基板表面涂布的油墨吸入至电路基板内的导通孔内。吸气导墨装置140设置于两传送带122之间。包括依次连通的吸附腔体141、收容腔体142、连接管143及抽气泵144。The ink suction device 140 is used to suck the ink coated on the surface of the circuit substrate into the via hole in the circuit substrate. The suction ink guiding device 140 is disposed between the two conveyor belts 122 . It includes an adsorption cavity 141 , a storage cavity 142 , a connecting pipe 143 and an air pump 144 which are connected in sequence.

吸附腔体141用于将传送带122传送的电路基板的导通孔内的气体吸出,并将电路基板表面的塞孔材料导入至导通孔内。本实施例中,吸附腔体141大致为长方体形,其具有相对的第一端面1411和第二端面1412。第一端面1411垂直于电路基板的传送方向设置。第一端面1411与传送带122上侧的外表面1221大致位于同一平面内,其大致为长方形,垂直于电路基板传送方向,第一端面1411的长度略小于两传送带122之间的间距。自第一端面1411向第二端面1412开设有一个沿垂直于电路基板传送方向的吸附孔1413,吸附孔1413贯穿第一端面1411和第二端面1412。本实施例中,为了使得吸附腔体141能够相对于机台110固定,将吸附腔体141平行于电路基板传送方向的两端通过两个连接杆1414分别固定于第一承载体111和第二承载体112。The suction cavity 141 is used to suck out the gas in the via hole of the circuit substrate conveyed by the conveyor belt 122 , and introduce the plug hole material on the surface of the circuit substrate into the via hole. In this embodiment, the adsorption chamber 141 is approximately rectangular parallelepiped and has opposite first end surfaces 1411 and second end surfaces 1412 . The first end surface 1411 is arranged perpendicular to the conveying direction of the circuit substrate. The first end surface 1411 and the outer surface 1221 on the upper side of the conveyor belt 122 are roughly located in the same plane, which is roughly rectangular and perpendicular to the conveying direction of the circuit board. The length of the first end surface 1411 is slightly smaller than the distance between the two conveyor belts 122 . A suction hole 1413 is formed from the first end surface 1411 to the second end surface 1412 along the direction perpendicular to the conveying direction of the circuit substrate, and the suction hole 1413 runs through the first end surface 1411 and the second end surface 1412 . In this embodiment, in order to fix the adsorption chamber 141 relative to the machine table 110, the two ends of the adsorption chamber 141 parallel to the conveying direction of the circuit board are respectively fixed to the first carrier 111 and the second carrier 111 through two connecting rods 1414. Carrier 112 .

收容腔体142与吸附腔体141的吸附孔1413相互连通,用于收容由吸附腔体141吸入的过多的塞孔材料。收容腔体142配合连接于吸附腔体141的第二端面1412的一侧。收容腔体142具有相对的第三端面1421和第四端面1422。自第三端面1421向第四端面1422形成有收容孔1423。本实施例中,吸附腔体141靠近第二端面1412的一端可拆卸地配合连接于收容腔体142。收容孔1423自所述吸附孔1413向平行于电路基板的传送方向弯曲,即其沿平行于电路基板传送方向的剖面的形状为向远离吸附腔体141方向弯曲的弧状。具体为,收容腔体142具有相对的且相互平行的第一侧壁1424和第二侧壁1425。第一侧壁1424沿平行于电路基板传送方向的剖面均为向远离吸附腔体141方向弯曲的弧状,从而收容孔1423在此方向上的横截面的形状也为弧状。这样,当吸附孔1413吸入收容腔体142内的塞孔材料可以存留在收容孔1423内,可以避免被吸入抽气泵144中而造成抽气泵144堵塞。并且,吸附腔体141与收容腔体142并非为一体结构,当收容腔体142存留的塞孔材料较多时,可以将收容腔体142从吸附腔体141上分离,再对收容腔体142进行处理。The storage cavity 142 communicates with the adsorption hole 1413 of the adsorption cavity 141 , and is used for storing excessive plugging material sucked by the adsorption cavity 141 . The receiving cavity 142 is matedly connected to one side of the second end surface 1412 of the adsorption cavity 141 . The receiving cavity 142 has a third end surface 1421 and a fourth end surface 1422 opposite to each other. A receiving hole 1423 is formed from the third end surface 1421 to the fourth end surface 1422 . In this embodiment, one end of the adsorption cavity 141 close to the second end surface 1412 is detachably connected to the receiving cavity 142 . The receiving hole 1423 bends from the suction hole 1413 parallel to the conveying direction of the circuit substrate, that is, its cross-section along the conveying direction of the circuit substrate is curved in an arc shape away from the suction cavity 141 . Specifically, the receiving cavity 142 has a first side wall 1424 and a second side wall 1425 opposite and parallel to each other. The cross section of the first side wall 1424 parallel to the conveying direction of the circuit board is arc-shaped, and the cross-section of the receiving hole 1423 in this direction is also arc-shaped. In this way, when the adsorption hole 1413 sucks the plugging material into the receiving cavity 142 , it can stay in the receiving hole 1423 , which can avoid being sucked into the air pump 144 and causing the air pump 144 to be blocked. Moreover, the adsorption cavity 141 and the storage cavity 142 are not integral structures. When the storage cavity 142 retains more plugging materials, the storage cavity 142 can be separated from the adsorption cavity 141, and then the storage cavity 142 can be removed. deal with.

连接管143用于将收容腔体142连接抽气泵144。抽气泵144用于将连接管143、收容腔体142及吸附腔体141内的气体抽出,从而将与吸附孔1413相连通的电路基板的导通孔内的气体吸出,从而将电路基板表面涂布的塞孔材料导入导通孔内。根据待进行塞孔处理的导通孔的深度及传送装置120传送电路基板的速度,控制抽气泵144的抽气的速率,使得塞孔材料可以填满导通孔,并且没有或者仅有少量的塞孔材料通过导通孔至电路基板的另一面或者进入收容腔体142内。The connecting pipe 143 is used to connect the storage chamber 142 to the air pump 144 . The air pump 144 is used to extract the gas in the connecting pipe 143, the receiving cavity 142 and the adsorption cavity 141, thereby sucking out the gas in the conduction hole of the circuit substrate connected with the adsorption hole 1413, thereby coating the surface of the circuit substrate. The plug hole material of the cloth is introduced into the via hole. According to the depth of the via hole to be processed by the plug hole and the speed at which the conveying device 120 conveys the circuit substrate, the rate of air extraction of the air pump 144 is controlled so that the plug hole material can fill the via hole, and there is no or only a small amount of The plug hole material passes through the via hole to the other side of the circuit substrate or enters the receiving cavity 142 .

除墨装置150用于将电路基板表面剩余的塞孔材料去除。除墨装置150包括相对设置的第一刮刀151和第二刮刀152。本实施例中,第一刮刀151经过第一固定杆153固定于第一承载体111和第二承载体112之间。第一刮刀151位于两传送带122之间的区域的上方,第一刮刀151的延伸方向垂直于电路基板的传送方向。第一刮刀151的刀刃部分与传送带122传送的电路板的上表面相对,用于将该上表面的塞孔材料刮去。第二刮刀152位于第一刮刀151的下方,与第一刮刀151相对应。具体的,第二刮刀152位于传送带122传送的电路基板的下侧,其与电路基板的下表面相对,用于将从电路基板下表面凸出的塞孔材料去除。第二刮刀152通过第二固定杆(图未示)固定于第一承载体111和第二承载体112之间。第二刮刀152的延伸方向垂直于电路基板的传送方向。第一刮刀151和第二刮刀152可以采用橡胶等具有弹性的材料制成。The ink removing device 150 is used for removing the remaining plug hole material on the surface of the circuit substrate. The ink removing device 150 includes a first scraper 151 and a second scraper 152 oppositely arranged. In this embodiment, the first scraper 151 is fixed between the first carrier 111 and the second carrier 112 through the first fixing rod 153 . The first scraper 151 is located above the area between the two conveyor belts 122 , and the extending direction of the first scraper 151 is perpendicular to the conveying direction of the circuit substrate. The blade portion of the first scraper 151 is opposite to the upper surface of the circuit board conveyed by the conveyor belt 122 for scraping off the plugging material on the upper surface. The second scraper 152 is located below the first scraper 151 and corresponds to the first scraper 151 . Specifically, the second scraper 152 is located on the lower side of the circuit substrate conveyed by the conveyor belt 122 , opposite to the lower surface of the circuit substrate, and is used for removing the plug hole material protruding from the lower surface of the circuit substrate. The second scraper 152 is fixed between the first carrier 111 and the second carrier 112 through a second fixing rod (not shown). The extending direction of the second scraper 152 is perpendicular to the conveying direction of the circuit substrate. The first scraper 151 and the second scraper 152 can be made of elastic materials such as rubber.

可以理解的是,当吸气导墨装置140设定的抽气速率与电路基板的传送速率相配合时,能够保证塞孔材料仅将电路基板的导通孔塞满而没有通过导通孔到电路基板的另一表面,除墨装置150可以仅包括设置于电路基板涂布有塞孔材料一侧的第一刮刀151,即可将电路基板表面涂布的塞孔材料去除。It can be understood that when the suction rate set by the air suction ink guiding device 140 matches the transmission rate of the circuit substrate, it can be ensured that the plug hole material only fills the via hole of the circuit substrate without passing through the via hole to On the other surface of the circuit substrate, the ink removing device 150 may only include the first scraper 151 disposed on the side of the circuit substrate coated with the plugging material, so as to remove the plugging material coated on the surface of the circuit substrate.

另外,除墨装置150也可以为其他能够去除电路基板表面的塞孔材料的装置。例如,除墨装置150可为设置传送的电路基板相对两侧的两个风刀,通过向电路基板的表面喷射高压气体,使得电路基板表面的多余塞孔材料从电路基板表面除去。除墨装置150也可设置传送的电路基板相对两侧的两个磨刷滚轮,通过对电路基板表面的多余的塞孔材料进行磨刷将多余的塞孔材料从电路基板表面除去。In addition, the ink removing device 150 may also be other devices capable of removing the plugging material on the surface of the circuit substrate. For example, the ink removing device 150 can be two air knives arranged on opposite sides of the conveyed circuit substrate, and the excess plugging material on the surface of the circuit substrate is removed from the surface of the circuit substrate by spraying high-pressure gas on the surface of the circuit substrate. The ink removing device 150 can also be provided with two grinding rollers on opposite sides of the conveyed circuit substrate, and the excess plugging material on the surface of the circuit substrate can be removed from the surface of the circuit substrate by brushing the excess plugging material.

由于电路板制作过程中,在进行塞孔之后还可能包括磨刷等后续处理,电路基板表面的塞孔材料也可以不用去除,即塞孔装置100也可以不包括除墨装置150。Since the circuit board manufacturing process may include post-processing such as brushing after plugging, the plugging material on the surface of the circuit substrate may not be removed, that is, the plugging device 100 may not include the ink removing device 150 .

采用提供的塞孔装置进行电路基板塞孔,可包括如下步骤:Using the provided plugging device to plug holes in the circuit board may include the following steps:

第一步,请参阅图3,提供塞孔装置100及电路基板20。The first step, please refer to FIG. 3 , provides the plug device 100 and the circuit substrate 20 .

电路基板20具有相对的上表面21和下表面22,在电路基板20内具有自上表面21向下表面22延伸的多个通孔23。The circuit substrate 20 has an upper surface 21 and a lower surface 22 opposite to each other, and a plurality of through holes 23 extending from the upper surface 21 to the lower surface 22 in the circuit substrate 20 .

第二步,将电路基板20固定于传送装置120,使得电路基板20的下表面22与传送装置120相接触,驱动传送装置120传送电路基板20。In the second step, the circuit substrate 20 is fixed on the conveying device 120 so that the lower surface 22 of the circuit substrate 20 is in contact with the conveying device 120 , and the conveying device 120 is driven to convey the circuit substrate 20 .

第三步,请一并参阅图3、图4及图5,当电路基板20传送至涂布装置130下方时,所述涂布装置130在电路基板20的上表面21涂布塞孔材料30,当电路基板20传送至吸气导墨装置140上方时,所述吸气导墨装置140与所述电路基板20的通孔23相连通,并将电路基板20的上表面21的塞孔材料30导入所述通孔23中,当电路基板20传送至靠近除墨装置150时,所述除墨装置150将电路基板20的上表面21的塞孔材料30去除。In the third step, please refer to FIG. 3 , FIG. 4 and FIG. 5 together. When the circuit substrate 20 is conveyed under the coating device 130 , the coating device 130 coats the plugging material 30 on the upper surface 21 of the circuit substrate 20 , when the circuit substrate 20 is conveyed to the top of the air suction ink guide device 140, the air suction ink guide device 140 communicates with the through hole 23 of the circuit substrate 20, and the plug hole material on the upper surface 21 of the circuit substrate 20 30 is introduced into the through hole 23 , and when the circuit substrate 20 is conveyed close to the ink removing device 150 , the ink removing device 150 removes the plugging material 30 on the upper surface 21 of the circuit substrate 20 .

通过将涂布装置130与电路基板20的上表面21相互接触,使得涂布装置130表面沾附的塞孔材料30涂布至电路基板20的上表面21。涂布装置130在上表面21的涂布塞孔材料的位置可以根据多个通孔23分布的区域进行设定。当多个通孔23分布在相对集中的区域时,可以只在上表面21内通孔23分布的区域涂布塞孔材料。当多个通孔23分散的分布在电路基板20时,可以使得涂布装置130在整个上表面21涂布塞孔材料30。By bringing the coating device 130 into contact with the upper surface 21 of the circuit substrate 20 , the plugging material 30 adhered to the surface of the coating device 130 is coated on the upper surface 21 of the circuit substrate 20 . The position where the coating device 130 coats the plugging material on the upper surface 21 can be set according to the distribution area of the plurality of through holes 23 . When a plurality of through holes 23 are distributed in a relatively concentrated area, the plugging material can be coated only on the area where the through holes 23 are distributed in the upper surface 21 . When a plurality of through holes 23 are dispersedly distributed on the circuit substrate 20 , the coating device 130 can be used to coat the plugging material 30 on the entire upper surface 21 .

当电路基板20传送至与吸气导墨装置140相对应时,电路基板20的下表面22与吸附腔体141的第一端面1411相接触,从而在电路基板20移动过程中,吸附孔1413与电路基板20内的通孔23相连通。由于抽气泵144的抽气作用,从而使得电路基板20的上表面21上覆盖通孔23的塞孔材料被导入通孔23内,使得通孔23被塞满。随着电路基板20在传送装置120上传送,当电路基板20完全通过吸气导墨装置140时,电路基板20内的通孔23全部被塞孔材料填充。在实际操作中,可以根据不同的电路基板20和电路基板20的传送速度不同,控制抽气泵144抽气的速率,以保证每个通孔23能够被完全填充并有较少的塞孔材料透过至下表面22。When the circuit substrate 20 is transported to correspond to the suction ink guide device 140, the lower surface 22 of the circuit substrate 20 is in contact with the first end surface 1411 of the adsorption cavity 141, so that during the movement of the circuit substrate 20, the adsorption holes 1413 and The through holes 23 in the circuit substrate 20 are connected. Due to the suction effect of the pump 144 , the plugging material covering the through hole 23 on the upper surface 21 of the circuit substrate 20 is introduced into the through hole 23 , so that the through hole 23 is filled. As the circuit substrate 20 is conveyed on the conveying device 120 , when the circuit substrate 20 completely passes through the ink suction device 140 , the through holes 23 in the circuit substrate 20 are all filled with the plugging material. In actual operation, according to different circuit substrates 20 and different conveying speeds of the circuit substrates 20, the rate of air extraction of the air pump 144 can be controlled to ensure that each through hole 23 can be completely filled and less plug hole material is penetrated. over to the lower surface 22 .

当电路基板20传送至与除墨装置150相对应时,第一刮刀151与电路基板20的上表面21相接触,第二刮刀152与电路基板20的下表面22相接触。在电路基板20的传送过程中,电路基板20上多余的塞孔材料从电路基板20的上表面21和下表面22去除,从而得到完成塞孔的电路基板20。When the circuit substrate 20 is transported to correspond to the ink removing device 150 , the first scraper 151 contacts the upper surface 21 of the circuit substrate 20 , and the second scraper 152 contacts the lower surface 22 of the circuit substrate 20 . During the conveying process of the circuit substrate 20 , the excess plugging material on the circuit substrate 20 is removed from the upper surface 21 and the lower surface 22 of the circuit substrate 20 , so as to obtain the circuit substrate 20 with the plugged holes.

本技术方案提供的塞孔装置不需要使用网版,可以直接将塞孔材料涂布于电路基板的表面,吸气导墨装置140直接与进行塞孔的电路基板相互接触,从而能够有效地将电路基板中通孔内的气体排出并能够保证塞孔材料可以完全填充于通孔内,保证了塞孔可靠度。另外,由于塞孔装置具有传送装置,从而整个塞孔过程可以连续进行,提高了电路基板进行塞孔的效率。The plugging device provided by this technical solution does not need to use a screen, and the plugging material can be directly coated on the surface of the circuit substrate. The suction ink guiding device 140 directly contacts the circuit substrate for plugging, so that the The gas in the through hole in the circuit substrate is discharged and can ensure that the plug hole material can be completely filled in the through hole, thereby ensuring the reliability of the plug hole. In addition, since the plugging device has a conveying device, the whole plugging process can be carried out continuously, which improves the efficiency of plugging the circuit substrate.

可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (10)

1.一种塞孔装置,用于对电路基板内的通孔进行塞孔,所述电路基板具有相对的上表面和下表面,所述通孔贯穿所述上表面和下表面,所述塞孔装置包括传送装置、涂布装置、吸气导墨装置及除墨装置,所述传送装置用于传送电路基板,以使得电路基板依次通过涂布装置、吸气导墨装置及除墨装置,所述涂布装置位于传送装置上方,用于向传送装置传送的电路基板的上表面涂布塞孔材料,所述吸气导墨装置位于传送装置传送的电路基板的下方,与电路基板的下表面接触,用于通过吸气而使得电路基板上表面的塞孔材料进入通孔内,所述除墨装置靠近所述传送装置传送的电路基板,用于将塞孔后电路基板上表面的塞孔材料去除。1. A plugging device for plugging a through hole in a circuit substrate, the circuit substrate has opposite upper and lower surfaces, the through hole runs through the upper and lower surfaces, the plug The hole device includes a conveying device, a coating device, an air suction ink guiding device and an ink removing device, and the conveying device is used to convey the circuit substrate, so that the circuit substrate passes through the coating device, the suction ink guiding device and the ink removing device in sequence, The coating device is located above the conveying device, and is used for coating the plugging material on the upper surface of the circuit substrate conveyed by the conveying device. The surface contact is used to make the plug hole material on the upper surface of the circuit substrate enter into the through hole by suction, and the ink removal device is close to the circuit substrate conveyed by the conveying device, and is used to plug the plug hole on the upper surface of the circuit substrate Porous material removal. 2.如权利要求1所述的塞孔装置,其特征在于,所述吸气导墨装置装置包括依次相互连接的吸附腔体、收容腔体及抽气泵,所述收容腔体内设置有吸附孔,所述收容腔体内形成有收容孔,所述吸附孔连通于收容孔与电路基板的通孔之间,所述抽气泵用于通过收容孔及吸附孔将所述电路基板内的气体抽出,并将电路基板上的塞孔材料导入所述通孔内,所述收容腔体用于收容从电路基板的通孔漏出的塞孔材料。2. The plugging device according to claim 1, wherein the air suction ink guiding device comprises an adsorption cavity, a storage cavity and an air pump connected to each other in sequence, and an adsorption hole is arranged in the storage cavity , a storage hole is formed in the storage cavity, the adsorption hole is connected between the storage hole and the through hole of the circuit substrate, and the air pump is used to extract the gas in the circuit substrate through the storage hole and the adsorption hole, The plug hole material on the circuit substrate is introduced into the through hole, and the accommodating cavity is used for containing the plug hole material leaked from the through hole of the circuit substrate. 3.如权利要求2所述的塞孔装置,其特征在于,所述收容腔体可拆卸地连接于所述收容腔体,所述吸附孔的延伸方向垂直于电路基板的传送方向,所述收容孔自吸附孔向平行于电路基板的传送方向弯曲。3. The plugging device according to claim 2, wherein the receiving cavity is detachably connected to the receiving cavity, the extending direction of the suction hole is perpendicular to the conveying direction of the circuit substrate, and the The receiving hole bends from the suction hole to a direction parallel to the conveying direction of the circuit substrate. 4.如权利要求1所述的塞孔装置,其特征在于,所述塞孔装置还包括机台,所述机台包括相对设置的第一承载体和第二承载体,所述传送装置设置于第一承载体和第二承载体之间,所述传送装置、涂布装置、吸气导墨装置及除墨装置均安装于第一承载体和第二承载体之间。4. The plug hole device according to claim 1, characterized in that, the plug hole device also includes a machine platform, the machine platform includes a first carrier and a second carrier oppositely arranged, and the transfer device is set Between the first carrier and the second carrier, the conveying device, the coating device, the ink suction device and the ink removing device are installed between the first carrier and the second carrier. 5.如权利要求4所述的塞孔装置,其特征在于,所述传送装置包括两个垂直于电路基板传送方向设置的传动轴,两个相互平行且相互间隔设置的传送带,及安装于每个传送带上多个夹持件,每个传动轴均安装在第一承载体和第二承载体之间,两个所述传送带配合套设于两个传动轴上,所述多个夹持件用于夹持电路基板以将电路基板固定于两根传送带之间。5. The plug hole device according to claim 4, wherein the conveying device comprises two transmission shafts arranged perpendicular to the conveying direction of the circuit substrate, two conveying belts arranged parallel to each other and spaced from each other, and installed on each A plurality of clamping parts on a conveyor belt, each transmission shaft is installed between the first carrier and the second carrier, the two conveyor belts are fitted on the two transmission shafts, the plurality of clamping parts Used to clamp the circuit board to fix the circuit board between two conveyor belts. 6.如权利要求4所述的塞孔装置,其特征在于,所述涂布装置包括涂布滚轮,所述涂布滚轮安装在第一承载体和第二承载体之间,其延伸方向垂直于电路基板的传送方向。6. The plug hole device according to claim 4, wherein the coating device comprises a coating roller, and the coating roller is installed between the first carrier and the second carrier, and its extending direction is vertical in the conveying direction of the circuit substrate. 7.如权利要求4所述的塞孔装置,其特征在于,所述除墨装置包括第一刮刀,所述第一刮刀安装在第一承载体和第二承载体之间,且靠近传送的电路基板的上表面。7. The plug hole device according to claim 4, wherein the ink removal device comprises a first scraper, and the first scraper is installed between the first carrier and the second carrier, and is close to the conveying the upper surface of the circuit substrate. 8.如权利要求7所述的塞孔装置,其特征在于,所述除墨装置还包括第二刮刀,所述第二刮刀也安装在第一承载体和第二承载体之间,所述第二刮刀靠近传送的电路基板的下表面,且与第一刮刀相对,用于将从电路基板通孔漏出至下表面的塞孔材料刮除。8. The plug hole device according to claim 7, wherein the ink removal device further comprises a second scraper, and the second scraper is also installed between the first carrier and the second carrier, the The second scraper is close to the lower surface of the conveyed circuit substrate and is opposite to the first scraper, and is used for scraping off the plug hole material leaked from the through hole of the circuit substrate to the lower surface. 9.如权利要求1所述的塞孔装置,其特征在于,所述除墨装置包括第一风刀,所述第一风刀安装在第一承载体和第二承载体之间,且靠近传送的电路基板的上表面,用于通过喷射气体而将电路基板上表面的塞孔材料去除。9. The plug hole device according to claim 1, wherein the ink removal device comprises a first air knife, and the first air knife is installed between the first carrier and the second carrier, and is close to The upper surface of the conveyed circuit substrate is used to remove the plug hole material on the upper surface of the circuit substrate by injecting gas. 10.一种电路基板塞孔方法,包括步骤:10. A circuit substrate plugging method, comprising the steps of: 提供一个电路基板及一个如权利要求1所述的塞孔装置,所述电路基板具有上表面、与上表面相对的下表面及贯穿所述上表面和下表面的通孔;Provide a circuit substrate and a plug hole device as claimed in claim 1, the circuit substrate has an upper surface, a lower surface opposite to the upper surface, and a through hole passing through the upper surface and the lower surface; 将电路基板固定于传送装置,使得电路基板的下表面与传送装置相接触,驱动传送装置传送电路基板;fixing the circuit substrate to the conveying device, so that the lower surface of the circuit substrate is in contact with the conveying device, and driving the conveying device to convey the circuit substrate; 当电路基板传送至涂布装置下方时,所述涂布装置在电路基板的上表面涂布塞孔材料,当电路基板传送至吸气导墨装置上方时,所述吸气导墨装置与所述电路基板的通孔相连通,并将电路基板的上表面的塞孔材料导入所述通孔中,当电路基板传送至靠近除墨装置时,所述除墨装置将电路基板上表面的塞孔材料去除。When the circuit substrate is conveyed under the coating device, the coating device coats the plugging material on the upper surface of the circuit substrate; The through hole of the above-mentioned circuit substrate is connected, and the plug hole material on the upper surface of the circuit substrate is introduced into the through hole. Porous material removal.
CN2010102450673A 2010-08-04 2010-08-04 Plugging device and circuit substrate plugging method Pending CN102348335A (en)

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CN112449509A (en) * 2020-10-16 2021-03-05 浙江展邦电子科技有限公司 Painting and hole plugging synchronous system applied to circuit board
CN112449509B (en) * 2020-10-16 2022-04-22 浙江展邦电子科技有限公司 Painting and hole plugging synchronous system applied to circuit board

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