CN102316681A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN102316681A CN102316681A CN2010102138200A CN201010213820A CN102316681A CN 102316681 A CN102316681 A CN 102316681A CN 2010102138200 A CN2010102138200 A CN 2010102138200A CN 201010213820 A CN201010213820 A CN 201010213820A CN 102316681 A CN102316681 A CN 102316681A
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- circuit
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- conductive
- conductive column
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- 239000011241 protective layer Substances 0.000 claims abstract description 16
- 238000007639 printing Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract 4
- 238000000034 method Methods 0.000 description 11
- 239000006071 cream Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019157 thiamine Nutrition 0.000 description 1
- 150000003544 thiamines Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
本发明提供一种电路板制作方法，包括步骤：提供一个覆铜基板，所述覆铜基板包括基底层及铜箔层；将所述铜箔层形成线路图形，所述线路图形包括第一线路和第二线路；在线路图形上形成覆盖层，所述覆盖层具有第一通孔和第二通孔，部分第一线路暴露于第一通孔中，部分第二线路暴露于第二通孔中；在所述覆盖层上印刷导电膏，以使导电膏形成填充于第一通孔中的第一导电柱、填充于第二通孔中的第二导电柱以及连接第一导电柱和第二导电柱的第一连接线路，以使第一线路通过第一导电柱、第一连接线路与第二导电柱与第二线路电连接；在所述第一连接线路表面形成保护层。本发明还提供一种采用上述电路板制作方法制成的电路板，该电路板较为轻薄。
The invention provides a circuit board manufacturing method, comprising the steps of: providing a copper-clad substrate, the copper-clad substrate includes a base layer and a copper foil layer; forming a circuit pattern on the copper foil layer, and the circuit pattern includes a first circuit and a second circuit; forming a covering layer on the circuit pattern, the covering layer has a first through hole and a second through hole, part of the first circuit is exposed in the first through hole, and part of the second circuit is exposed in the second through hole in; printing conductive paste on the covering layer, so that the conductive paste forms a first conductive column filled in the first through hole, a second conductive column filled in the second through hole, and connects the first conductive column and the second conductive column The first connection line of the two conductive columns, so that the first line is electrically connected to the second line through the first conductive column, the first connection line and the second conductive column; a protective layer is formed on the surface of the first connection line. The present invention also provides a circuit board manufactured by the above-mentioned circuit board manufacturing method, which is relatively light and thin.
Description
Technical field
The present invention relates to the circuit board technology field, relate in particular to a kind of more frivolous circuit board and preparation method thereof.
Background technology
In information, communication and consumer electronics industry, circuit board is the indispensable basic comprising important documents of all electronics and IT products.And in portable electric appts, for example in the mobile phone, need to use comparatively frivolous circuit board with light, thin, short, little requirement, connect in narrow space, to realize circuit.Along with people's is to the improve of portable electronic device processes information requirements, and the circuit of circuit board is more and more intensive, and, need circuit across transmission and the processing of interconnection with the realization electrical information.At this moment, need circuit board be made double-sided PCB or multilayer circuit board usually, to realize the connection request of circuit.Yet,, therefore be difficult to meet the requirement of portable electric appts lightness, miniaturization because double-sided PCB or multilayer circuit board have bigger thickness and weight.
Therefore, be necessary to provide a kind of more frivolous circuit board and preparation method thereof.
Summary of the invention
Below will a kind of circuit board and preparation method thereof be described with embodiment.
A kind of circuit board manufacturing method comprises step: a copper-clad base plate is provided, and said copper-clad base plate comprises basalis and fits in the copper foil layer of basalis; Said copper foil layer is formed line pattern, and said line pattern comprises first circuit and second circuit; On line pattern, form cover layer, said cover layer has first through hole and second through hole, and part first circuit is exposed in first through hole, and part second circuit is exposed in second through hole; Printing conductive cream on said cover layer; So that conductive paste forms first conductive pole be filled in first through hole, is filled in second conductive pole in second through hole and connects first conductive pole and first connection line of second conductive pole, so that first link tester is crossed first conductive pole, first connection line is connected with second line electricity with second conductive pole; Form protective layer on said first connection line surface, to protect first connection line.
A kind of circuit board; Comprise basalis, be formed at basalis surface line pattern, cover the cover layer of line pattern, the syndeton that forms by conductive paste and the protective layer of insulation; Said cover layer has first through hole and second through hole; Said syndeton comprises first conductive pole that is filled in first through hole, is filled in second conductive pole in second through hole and connects first conductive pole and first connection line of second conductive pole; Said first conductive pole contacts with first line electricity, and said second conductive pole contacts with second line electricity, thereby the circuit of winning is connected with second line electricity; Said protective layer coats said first connection line, is used to protect first connection line.
In the circuit board manufacturing method of present technique scheme,, can so, can process the circuit board that thickness is less, volume is less so that the circuit of line pattern is realized intersecting across connection through mode at cover layer perforate and filled conductive cream.And, when the circuit board of processing is soft board, can have destroy or force to yield preferably performance and useful life.
Description of drawings
The schematic flow sheet of the circuit board manufacturing method that Fig. 1 provides for present technique scheme implementation example.
The cross-sectional schematic of the copper-clad base plate that Fig. 2 provides for present technique scheme implementation example.
Fig. 3 is the schematic top plan view that the copper foil layer of the copper-clad base plate of Fig. 2 is formed line pattern.
Fig. 4 is the cross-sectional schematic along the IV-IV line of Fig. 2.
Fig. 5 forms tectal sketch map on the line pattern of Fig. 3.
Fig. 6 is the cross-sectional schematic along the VI-VI line of Fig. 5.
Fig. 7 is the sketch map that on the cover layer of Fig. 5, forms syndeton.
Fig. 8 is the cross-sectional schematic along the VIII-VIII line of Fig. 7.
Thereby Fig. 9 is for forming the sketch map that protective layer is processed circuit board on the syndeton of Fig. 7.
The main element symbol description
Copper-clad base plate 10
Basalis 11
The 4th circuit 124
The 5th circuit 125
Second terminal pad 1220
The 3rd terminal pad 1230
The 4th terminal pad 1240
First through hole 131
Second through hole 132
Third through-hole 133
Fourth hole 134
First conductive pole 141
Second conductive pole 142
The 3rd conductive pole 143
The 4th conductive pole 144
Protective layer 15
Circuit board 100
Embodiment
To combine accompanying drawing and embodiment below, circuit board that the present technique scheme is provided and preparation method thereof is done further to specify.
See also Fig. 1, the circuit board manufacturing method that present technique scheme implementation example provides comprises step:
The first step sees also Fig. 2, and a copper-clad base plate 10 is provided, and said copper-clad base plate 10 comprises basalis 11 and fits in the copper foil layer 12 of basalis 11.
In the present embodiment, said copper-clad base plate 10 is the individual layer copper clad laminate, that is, it only comprises one deck copper foil layer 12.The material of said basalis 11 can be hard material; Like epoxy resin, glass cloth etc.; Also can be flexible material; Like polyimides (Polyimide; PI), polyethylene terephthalate glycol (Polyethylene Terephthalate, PET), polytetrafluoroethylene (Teflon), gather thiamines (Polyamide), polymethyl methacrylate (Polymethylmethacrylate), Merlon (Polycarbonate) or polyimides-polyethylene-terephthaldehyde's ester copolymer (Polyamide polyethylene-terephthalatecopolymer) etc.Said copper foil layer 12 can be rolled copper foil, also can be electrolytic copper foil.In the present embodiment, the material of basalis 11 is a polyimides, and copper foil layer 12 is a rolled copper foil.
Second step saw also Fig. 3 and Fig. 4, and said copper foil layer 12 is processed line pattern 120.The method of copper foil layer 12 being processed line pattern 120 can be chemical etching, also can be laser ablation.When adopting method for chemially etching to make line pattern 120, can be earlier through not needing etched part in the image transfer protection copper foil layer 12, thereby behind chemical etching copper foil layer 12, can obtain the line pattern 120 that constitutes by the part that stays.
In the present embodiment, line pattern 120 comprises each interval and substantially parallel first circuit 121, second circuit 122, tertiary circuit 123, the 4th circuit 124 and the 5th circuit 125.Said first circuit 121 is between tertiary circuit 123 and the 5th circuit 125, and said the 5th circuit 125 is between first circuit 121 and second circuit 122, and said second circuit is between the 5th circuit 125 and the 4th circuit 124.That is to say that tertiary circuit 123, first circuit 121, the 5th circuit 125, second circuit 122 and the 4th circuit 124 are arranged in order.
Said first circuit 121 comprises first terminal pad 1210 and is connected first lead 1211 of first terminal pad, 1210 at least one sides, and said first terminal pad 1210 is used for being electrically connected with other element, and said first lead 1211 is used for transmission of electric signals.Said second circuit 122 comprises second terminal pad 1220 and is connected second lead 1221 of second terminal pad, 1220 at least one sides, and said second terminal pad 1220 is used for being electrically connected with other element, and said second lead 1221 is used for transmission of electric signals.Said tertiary circuit 123 comprises the 3rd terminal pad 1230 and is connected the privates 1231 of the 3rd terminal pad 1230 at least one sides, and said the 3rd terminal pad 1230 is used for being electrically connected with other element, and said privates 1231 is used for transmission of electric signals.Said the 4th circuit 124 comprises the 4th terminal pad 1240 and is connected the privates 1241 of the 4th terminal pad 1240 at least one sides, and said the 4th terminal pad 1240 is used for being electrically connected with other element, and said privates 1241 are used for transmission of electric signals.In the present embodiment, first lead 1211 is connected the relative both sides of first terminal pad 1210, and the diameter of first terminal pad 1210 is greater than the live width of first lead 1211.Second lead 1221 is connected the relative both sides of second terminal pad 1220, and the diameter of second terminal pad 1220 is greater than the live width of second circuit 122.Privates 1231 is connected the relative both sides of the 3rd terminal pad 1230, and the diameter of the 3rd terminal pad 1230 is greater than the live width of privates 1231.Privates 1241 also are connected the relative both sides of the 4th terminal pad 1240, and the diameter of the 4th terminal pad 1240 is greater than the live width of privates 1241.And said first terminal pad 1210 is corresponding with second terminal pad 1220, and the 3rd terminal pad 1230 is corresponding with the 4th terminal pad 1240.
In the present embodiment, a part that only shows five circuits among Fig. 3 is as signal.Certainly, it will be understood by those skilled in the art that in the circuit board of actual production, line pattern 120 can comprise the circuit more than five, and the shape of the circuit more than five and distribution can design according to actual needs.
The 3rd step, please consult Fig. 4 to 6 in the lump, on line pattern 120, form cover layer 13.Said cover layer 13 can form through the mode of press mold, also can form through the mode that applies.
Said cover layer 13 has first through hole 131, second through hole 132, third through-hole 133 and fourth hole 134; Said first terminal pad, 1210 all or part of first through holes 131 that are exposed to; Said second terminal pad, 1220 all or part of second through holes 132 that are exposed to; Said the 3rd terminal pad 1230 all or part of third through-holes 133 that are exposed to, said the 4th terminal pad 1240 all or part of fourth holes 134 that are exposed to.In the present embodiment; First terminal pad 1210 of middle body is exposed to first through hole 131; Second terminal pad 1220 of middle body is exposed to second through hole 132; The 3rd terminal pad 1230 of middle body is exposed to third through-hole 133, and the 4th terminal pad 1240 of middle body is exposed to fourth hole 134.The aperture of first through hole 131, second through hole 132, third through-hole 133 and fourth hole 134 is respectively less than the diameter of first terminal pad 1210, second terminal pad 1220, the 3rd terminal pad 1230 and the 4th terminal pad 1240.That is to say; Except the 4th terminal pad 1240 of the 3rd terminal pad 1230 of second terminal pad 1220 of first terminal pad 1210 of middle body, middle body, middle body and middle body, cover layer 13 has covered the part that from line pattern 120, exposes in the surface of remaining line pattern 120 and the surface that basalis 11 is fitted with copper foil layer 12 these sides.
The 4th step saw also Fig. 7 and Fig. 8, and printing conductive cream on said cover layer 13 is so that conductive paste forms syndeton 14, to be electrically connected with line pattern 120.
Said conductive paste can perhaps other has the paste electric conducting material of low-resistivity for copper conductive paste, silver-colored conductive paste, generally comprises resin, curing agent and is mixed in the conductive powder in the resin.Because conductive paste is thickness comparatively, has certain fluidity, therefore can conductive paste be printed on predetermined place, thereby can form solid-state electric conducting material through curing conductive cream through screen painting.In the present embodiment; On said cover layer 13 during printing conductive cream; Conductive paste fully is filled in first through hole 131, second through hole 132, third through-hole 133 and the fourth hole 134; And be printed between first through hole 131 and second through hole 132 on cover layer 13 surfaces, also be printed between the third through-hole 133 and fourth hole 134 on cover layer 13 surfaces.That is to say; In the present embodiment; Syndeton 14 comprises that formation is filled in first conductive pole 141 in first through hole 131; Be filled in second conductive pole 142 in second through hole 132, be filled in the 3rd conductive pole 143 in the third through-hole 133, be filled in the 4th conductive pole 144 in the fourth hole 134; On cover layer 13 surface and connect first connection line 145 of first conductive pole 141 and second conductive pole 142, and surperficial and connect second connection line 146 of the 3rd conductive pole 143 and the 4th conductive pole 144 at cover layer 13.Said first connection line 145 is substantially parallel with second connection line 146, and first connection line 145 is vertical basically with first circuit 121.So; Then first circuit 121 is electrically connected with second circuit 122 with second conductive pole 142 through first conductive pole 141, first connection line 145, and tertiary circuit 123 passes through the 3rd conductive pole 143, second connection line 146 is electrically connected with the 4th circuit 124 with the 4th conductive pole 144.
In the present embodiment; For guaranteeing the connection reliability of first conductive pole 141 and second conductive pole 142; The surface that first conductive pole 141 exposes cover layer 13 is all covered by first connection line 145, and the surface that second conductive pole 142 exposes cover layer 13 is also all covered by first connection line 145.That is to say that the length of first connection line 145 is more than or equal to the ultimate range between first conductive pole 141 and second conductive pole 142.For guaranteeing the connection reliability of the 3rd conductive pole 143 and the 4th conductive pole 144; The surface that the 3rd conductive pole 143 exposes cover layer 13 is all covered by second connection line 146, and the surface that the 4th conductive pole 144 exposes cover layer 13 is also all covered by second connection line 146.That is to say that the length of second connection line 146 is more than or equal to the ultimate range between the 3rd conductive pole 143 and the 4th conductive pole 144.
The 5th step saw also Fig. 9, formed protective layer 15 on the surface of first connection line 145 and the surface of second connection line 146, to protect first connection line 145 and second connection line 146, so can obtain circuit board 100.The material of said protective layer 15 can for epoxy resin, PI, PET, Teflon, etc.In the present embodiment, protective layer 15 is a dielectric ink, is formed on the surface of first connection line 145 and second connection line 146 through printing.Said protective layer 15 fully coats first connection line 145 and second connection line 146, that is to say that first connection line 145 and second connection line 146 all are not exposed to the external world.
Please consult Fig. 1 to Fig. 9 in the lump, the circuit board 100 that makes through above step comprises basalis 11, be formed at basalis 11 surfaces line pattern 120, cover the cover layer 13 of line pattern 120, the syndeton 14 that forms by conductive paste and the protective layer 15 of coating syndeton 14.Said line pattern 120 comprises first circuit 121, second circuit 122, tertiary circuit 123, the 4th circuit 124 and the 5th circuit 125 of each interval.Said first circuit 121 has first terminal pad 1210 that is used for being electrically connected with other element; Said second circuit 122 has second terminal pad 1220; Second terminal pad 1220 also is used for being electrically connected with other element; Said tertiary circuit 123 has the 3rd terminal pad 1230 that is used for being electrically connected with other element, and said the 4th circuit 124 has the 4th terminal pad 1240 that is used for being electrically connected with other element.Said cover layer 13 have with corresponding first through hole 131 of first terminal pad 1210, with corresponding second through hole 132 of second terminal pad 1220, with the 3rd terminal pad 1230 corresponding third through-holes 133 and with the 4th terminal pad 1240 corresponding fourth holes 134.Said syndeton 14 comprises first conductive pole 141 that is filled in first through hole 131; Be filled in second conductive pole 142 in second through hole 132; Be filled in the 3rd conductive pole 143 in the third through-hole 133; Be filled in the 4th conductive pole 144 in the fourth hole 134, on cover layer 13 surface and connect first connection line 145 of first conductive pole 141 and second conductive pole 142, and surperficial and connect second connection line 146 of the 3rd conductive pole 143 and the 4th conductive pole 144 at cover layer 13.Thereby the circuit 121 of winning is electrically connected with second circuit 122 with second conductive pole 142 through first conductive pole 141, first connection line 145, and make tertiary circuit 123 pass through the 3rd conductive pole 143, second connection line 146 is electrically connected with the 4th circuit 124 with the 4th conductive pole 144.Said protective layer 15 is coated on the surface of first connection line 145 and second connection line 146; Be used to protect first connection line 145 and second connection line 146; Avoid its oxidation and influence the connection status of first circuit 121 and second circuit 122, and the connection status of tertiary circuit 123 and the 4th circuit 124.
Certainly, it will be understood by those skilled in the art that syndeton 14 can change according to actual needs when the circuit in the line pattern 120 has other shape and distributes.When having more circuit to connect in the line pattern 120; Syndeton 14 can comprise six and above conductive pole and three and above connection line; And these connection lines can be parallel to each other, vertical or acutangulate, only need not to be in contact with one another between these connection lines and get final product.
In the circuit board manufacturing method of present technique scheme; Through mode at cover layer 13 perforates and filled conductive cream; Formed syndeton 14; Thereby make the circuit of line pattern 120 to have realized intersecting, so, processed the circuit board 100 of the less and better performances of thickness with simple effective method across connection.Particularly, generally speaking, the thickness of basalis 11 is 25 microns; The thickness of copper foil layer 12 is 18 microns, and tectal thickness is 60 microns, and the thickness of first connection line 145 is 18 microns; The thickness of protective layer 15 is 12 microns, that is to say, the maximum ga(u)ge of circuit board 100 probably is 133 microns.Circuit board 100 has frivolous advantage, can be used in the electronic equipment of miniaturization.And, when circuit board 100 is soft board, can have the performance of destroying or force to yield preferably.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010213820.0A CN102316681B (en) | 2010-06-30 | 2010-06-30 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010213820.0A CN102316681B (en) | 2010-06-30 | 2010-06-30 | Circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102316681A true CN102316681A (en) | 2012-01-11 |
| CN102316681B CN102316681B (en) | 2014-04-09 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010213820.0A Expired - Fee Related CN102316681B (en) | 2010-06-30 | 2010-06-30 | Circuit board and manufacturing method thereof |
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| CN (1) | CN102316681B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711371A (en) * | 2012-06-08 | 2012-10-03 | 王定锋 | Double-sided lead wire circuit board with mutually-crossed lead wire circuits on two sides |
| CN103582321A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN108076581A (en) * | 2016-11-17 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| CN110797183A (en) * | 2018-08-01 | 2020-02-14 | 宏启胜精密电子(秦皇岛)有限公司 | Wireless charging coil and manufacturing method thereof |
| CN113054087A (en) * | 2021-03-19 | 2021-06-29 | 幂光新材料科技（上海）有限公司 | LED lamp bead packaging mode and circuit structure for improving electro-optic conversion efficiency |
| CN113225924A (en) * | 2021-05-10 | 2021-08-06 | 幂光新材料科技（上海）有限公司 | Manufacturing method of high-luminous-efficiency LED lamp |
| CN115226304A (en) * | 2021-04-20 | 2022-10-21 | 庆鼎精密电子（淮安）有限公司 | Circuit board and method for manufacturing the same |
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| CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | A kind of manufacturing method of flexible printed circuit board with PET as base material |
| CN101466205A (en) * | 2007-12-19 | 2009-06-24 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
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| CN101031982A (en) * | 2005-05-30 | 2007-09-05 | 住友电气工业株式会社 | Conductive paste and multilayer printed wiring board using same |
| CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | A kind of manufacturing method of flexible printed circuit board with PET as base material |
| CN101466205A (en) * | 2007-12-19 | 2009-06-24 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711371A (en) * | 2012-06-08 | 2012-10-03 | 王定锋 | Double-sided lead wire circuit board with mutually-crossed lead wire circuits on two sides |
| CN103582321A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN103582321B (en) * | 2012-07-19 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and preparation method thereof |
| CN108076581A (en) * | 2016-11-17 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| CN110797183A (en) * | 2018-08-01 | 2020-02-14 | 宏启胜精密电子(秦皇岛)有限公司 | Wireless charging coil and manufacturing method thereof |
| CN110797183B (en) * | 2018-08-01 | 2021-10-19 | 宏启胜精密电子(秦皇岛)有限公司 | Wireless charging coil and manufacturing method thereof |
| CN113054087A (en) * | 2021-03-19 | 2021-06-29 | 幂光新材料科技（上海）有限公司 | LED lamp bead packaging mode and circuit structure for improving electro-optic conversion efficiency |
| CN115226304A (en) * | 2021-04-20 | 2022-10-21 | 庆鼎精密电子（淮安）有限公司 | Circuit board and method for manufacturing the same |
| CN113225924A (en) * | 2021-05-10 | 2021-08-06 | 幂光新材料科技（上海）有限公司 | Manufacturing method of high-luminous-efficiency LED lamp |
| WO2022236880A1 (en) * | 2021-05-10 | 2022-11-17 | 幂光新材料科技（上海）有限公司 | Manufacturing method for high-light efficiency led lamp |
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| CN102316681B (en) | 2014-04-09 |
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