CN102131340A - Flexible printed wiring board, method of manufacturing the same, and electronic equipment with the same - Google Patents
Flexible printed wiring board, method of manufacturing the same, and electronic equipment with the same Download PDFInfo
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- CN102131340A CN102131340A CN2011100206284A CN201110020628A CN102131340A CN 102131340 A CN102131340 A CN 102131340A CN 2011100206284 A CN2011100206284 A CN 2011100206284A CN 201110020628 A CN201110020628 A CN 201110020628A CN 102131340 A CN102131340 A CN 102131340A
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- flexible printing
- printing distributing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 87
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
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- 238000005755 formation reaction Methods 0.000 description 5
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- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
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- 239000007767 bonding agent Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
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- 238000000576 coating method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
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- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
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- 238000007650 screen-printing Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
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- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
An aim of the invention is to provide a flexible printed wiring board, a method of manufacturing the same, and a set of electronic equipment with the same. In a double-surface wiring part, required wiring circuits can be sufficiently constructed on a front surface and a back surface of a substrate in a double-surface wiring part, and furthermore electric connection can be sufficiently performed for the wiring circuits formed on the front surface and the back surface of the substrate. The bending performance of a bending part can be furthermore improved, and the durability which aims at repeated bending can be improved. The flexible printed wiring board (200) is provided with an area which is provided with the double-surface wiring part (210) of the wiring circuit and an area with the bending part (220) for bending repeatedly. The double-surface wiring part (210) is provided with a welding ring through hole (21) therefore the wiring circuits at the front surface and the back surface of the substrate of the double-surface wiring part (210) are electrically connected. In the bending part (220), only one surface selected from the front surface and the back surface of the substrate is provided with a wiring circuit.
Description
Technical field
The present invention relates to the manufacture method of a kind of flexible printing distributing board, this flexible printing distributing board and electronic equipment with described flexible printing distributing board.
Background technology
The employed flexible printing distributing board of electronic equipments such as mobile phone is owing to be configured in the narrow space, so require to improve distribution density, improve bendability and flexibility and at the durability of alternating bending etc.
Current, as the employed flexible printing distributing board of electronic equipments such as mobile phone, there is following flexible printing distributing board, it forms through hole on substrate, and forms the electrolytic copper plating layer on substrate two-sided, promptly implements so-called through hole plating.
On this flexible printing distributing board that has applied through hole plating, owing to form the Copper Foil thickening of wiring circuit, so lower at the durability of alternating bending.
In order to remedy this shortcoming, use the flexible printing distributing board be formed with the weld-ring through hole in electronic equipments such as mobile phone, this weld-ring through hole waits so that it does not carry out through hole plating, only forms at the zone enforcement plating (so-called salient point plating) with through hole by bend being sheltered or being covered.
As above-mentioned flexible printing distributing board, for example there is Japanese kokai publication hei 11-195849 communique (below be called patent documentation 1).
In patent documentation 1, disclose and the relevant prior art of flexible printing distributing board that is formed with the weld-ring through hole.
In recent years, be accompanied by miniaturization, the multifunction of the electronic equipment with flexible printing distributing board, the space that holds the flexible printing distributing board obviously narrows down.
Especially, in the mobile phone of so-called slidingtype, because lightening (slim) of mobile phone makes the remarkable stricturization in gap between side frame body and the following side frame body.
The employed flexible printing distributing board of this sliding mobile telephone, in the gap between last side frame body and following side frame body, bend with U word shape configuration flexible printing distributing board, but because the stricturization in the gap between last side frame body and the following side frame body, make the flexible printing distributing board diminish with the radius of curvature of U word sigmoid, it is harsh that bending condition obviously becomes.
Disclosed flexible printing distributing board in the above-mentioned patent documentation 1 adopts the structure that forms wiring circuit on substrate two-sided.This flexible printing distributing board is being used for having following problems under the situation of sliding mobile telephone, that is, can't satisfying in recent years bending condition, particularly can't satisfy durability at alternating bending.Thus, the problem in the flexible printing distributing board is, exploitation particularly with bend in the durability at alternating bending improve relevant technology.
Therefore, problem of the present invention is to solve above-mentioned the problems of the prior art point, the manufacture method of a kind of flexible printing distributing board, this flexible printing distributing board is provided and has the electronic equipment of described flexible printing distributing board, this flexible printing distributing board is in double sided wired portion, can on the substrate positive and negative, construct required wiring circuit fully, and, can the wiring circuit that be formed on the substrate positive and negative be electrically connected fully, for bend, bendability can be further improved, and durability can be improved at alternating bending.
Summary of the invention
Flexible printing distributing board of the present invention has: the zone that is formed with the double sided wired portion of wiring circuit at the substrate positive and negative; And the zone that is used for carrying out repeatedly crooked bend, the 1st of this flexible printing distributing board is characterised in that, in described double sided wired, form the weld-ring through hole, this weld-ring through hole is by carrying out plating on the whole surface of the endoporus of the through hole that runs through substrate, and only the peripheral edge margin of the positive and negative peristome of through hole is carried out plating as weld-ring and constitute, thus, the positive and negative wiring circuit that constitutes described double sided wired portion is electrically connected, in described bend, only on a face of substrate positive and negative, be formed with wiring circuit.
According to the 1st feature of the invention described above, the flexible printing distributing board has: the zone that is formed with the double sided wired portion of wiring circuit at the substrate positive and negative; And the zone that is used for carrying out repeatedly crooked bend, in described double sided wired, form the weld-ring through hole, this weld-ring through hole is by carrying out plating on the whole surface of the endoporus of the through hole that runs through substrate, and only the peripheral edge margin of the positive and negative peristome of through hole is carried out plating as weld-ring and constitute, thus, the positive and negative wiring circuit that constitutes described double sided wired portion is electrically connected, in described bend, only on a face of substrate positive and negative, be formed with wiring circuit, therefore, in double sided wired, can on the substrate positive and negative, construct required wiring circuit fully, and, can the wiring circuit that be formed on the substrate positive and negative be electrically connected fully.
In addition, in bend,, can make the thinner thickness of bend by only on a face of substrate positive and negative, forming wiring circuit.Thus, the bendability of bend can be further improved, and durability can be improved at alternating bending.
The 2nd of flexible printing distributing board of the present invention is characterized as, and on the basis of the 1st feature of the invention described above, the wiring circuit layer of described bend is coated by electromagnetic wave shielding.
The 2nd feature according to the invention described above, because on the basis of the action effect that the 1st feature of the invention described above is produced, the wiring circuit layer of the described bend of flexible printing distributing board is coated by electromagnetic wave shielding, is subjected to harmful effects such as the caused malfunction of electromagnetic wave noise so can prevent the wiring circuit that is formed at the bend place.
In addition, the flexible printing distributing board of the manufacture method manufacturing of flexible printing distributing board of the present invention has: the zone that is formed with the double sided wired portion of wiring circuit on the conductive layer of substrate positive and negative; And the zone that is used for carrying out repeatedly crooked bend, the 3rd of the manufacture method of this flexible printing distributing board is characterised in that to have following operation: through hole forms operation, in this operation, forms the through hole that runs through described substrate in described double sided wired; Corrosion-resisting pattern forms operation, in this operation, except the peristome neighboring area of this through hole, forms corrosion-resisting pattern on substrate two-sided; Weld-ring through hole plating operation in this operation, is carried out plating with the whole surface of the endoporus of described through hole and peristome peripheral edge margin and is coated as weld-ring; And wiring circuit formation operation, in this operation, in described double sided wired, on the conductive layer of substrate positive and negative, form wiring circuit, and in described bend, remove the conductive layer of a face in the substrate positive and negative, and only on remaining another face, form wiring circuit.
According to the 3rd feature of the present invention, for zone and the flexible printing distributing board that is used for carrying out repeatedly the zone of crooked bend with the double sided wired portion that on the conductive layer of substrate positive and negative, is formed with wiring circuit, the manufacture method of this flexible printing distributing board has following operation: through hole forms operation, in this operation, in described double sided wired, form the through hole that runs through described substrate; Corrosion-resisting pattern forms operation, in this operation, except the peristome neighboring area of this through hole, forms corrosion-resisting pattern on substrate two-sided; Weld-ring through hole plating operation in this operation, is carried out plating with the whole surface of the endoporus of described through hole and peristome peripheral edge margin and is coated as weld-ring; And wiring circuit forms operation, in this operation, in described double sided wired, on the conductive layer of substrate positive and negative, form wiring circuit, and in described bend, remove the conductive layer of a face in the substrate positive and negative, and only on remaining another face, form wiring circuit, therefore, utilize through hole to form operation, can in double sided wired, form the through hole that runs through substrate.In addition, utilize corrosion-resisting pattern to form operation, can be except the peristome neighboring area of through hole, on substrate two-sided, form corrosion-resisting pattern.In addition, utilize weld-ring through hole plating operation, can form the weld-ring through hole, this weld-ring through hole forms in the following manner, that is, the whole surface of the endoporus of through hole and peristome peripheral edge margin are carried out plating as weld-ring and coat.In addition, utilize wiring circuit to form operation, can be in double sided wired, on the conductive layer of substrate positive and negative, form wiring circuit, and in described bend, can remove the conductive layer of a face of substrate positive and negative, and only on remaining another face, form wiring circuit.
In addition, the of the present invention the 4th is characterized as, and electronic equipment of the present invention has the described flexible printing distributing board of the 1st or the 2nd feature.
The 4th feature according to the invention described above, because electronic equipment has the described flexible printing distributing board of the 1st or the 2nd feature, so can form electronic equipment with following flexible printing distributing board, this flexible printing distributing board is in double sided wired, can on the substrate positive and negative, construct required wiring circuit fully, and, can the wiring circuit that be formed on the substrate positive and negative be electrically connected fully, for bend, bendability can be further improved, and durability can be improved at alternating bending.
In addition, can form the electronic equipment with following flexible printing distributing board, this flexible printing distributing board can prevent that the wiring circuit that is formed at the bend place is subjected to harmful effects such as the caused malfunction of electromagnetic wave noise.
According to flexible printing distributing board of the present invention, the manufacture method of this flexible printing distributing board and have the electronic equipment of described flexible printing distributing board, a kind of flexible printing distributing board can be provided, the manufacture method of this flexible printing distributing board and have the electronic equipment of described flexible printing distributing board, this flexible printing distributing board is in double sided wired, can on the substrate positive and negative, construct required wiring circuit fully, and, can the wiring circuit that be formed on the substrate positive and negative be electrically connected fully, for bend, bendability can be further improved, and durability can be improved at alternating bending.
Description of drawings
Fig. 1 is the figure of the related mobile phone of expression the 1st execution mode of the present invention, (a) is whole oblique view, (b) is that the right side view of wanting portion is shown.
Fig. 2 is the figure of the related flexible printing distributing board of expression the 1st execution mode of the present invention, (a) is vertical view, (b) be in (a) A-A line direction want portion's profile, (c) be the amplification plan view of wanting portion of the dotted portion in (a).
Fig. 3 is the profile of the manufacture method of the related flexible printing distributing board of expression the 1st execution mode of the present invention.
Fig. 4 is the profile of the manufacture method of the related flexible printing distributing board of expression the 1st execution mode of the present invention.
Fig. 5 is the profile of the manufacture method of the related flexible printing distributing board of expression the 1st execution mode of the present invention.
Fig. 6 is the profile of the manufacture method of the related flexible printing distributing board of expression the 1st execution mode of the present invention.
Fig. 7 be the related flexible printing distributing board of expression the 2nd execution mode of the present invention want portion's profile.
Fig. 8 be the related flexible printing distributing board of expression the 2nd execution mode of the present invention variation want portion's profile.
Embodiment
With reference to following accompanying drawing, enumerate the employed flexible printing distributing board of so-called sliding mobile telephone, describe as the example of electronic equipment involved in the present invention and flexible printing distributing board, be used for the present invention is understood.But the invention that claims of the present invention are put down in writing is not limited by following explanation.
At first, with reference to Fig. 1, Fig. 2, the 1st execution mode involved in the present invention is described.
As shown in Figure 1, mobile phone 1 is so-called sliding mobile telephone.
This mobile phone 1 mainly is made of framework 100 and flexible printing distributing board 200.
Described framework 100 forms the main part of mobile phone 1, as shown in Figure 1, forms by a pair of framework that is made of the 1st framework 110 and the 2nd framework 120.
In addition, shown in Fig. 1 (a), the 1st framework 110 has display part 111, the 2 frameworks 120 such as liquid crystal display screen and has the operating portion 121 that is made of action button etc.
In addition, the inside in the 1st framework 110 and the 2nd framework 120 is built-in with the various inscapes that not shown mobile phones such as LED have usually.
Described flexible printing distributing board 200 is between 1 pair of framework and connects the flexible printing distributing board of the circuit of two frameworks shown in Fig. 1 (b).
More particularly, be the flexible printing distributing board that is electrically connected between the circuit substrate that inside had 122 that is used for the circuit substrate that inside had 112 of the 1st framework 110 of a pair of framework and the 2nd framework 120, with the state configuration of bending between the 1st framework 110 and the 2nd framework 120.
In addition, in Fig. 1 (b), though at length do not illustrate, but by being arranged on the connector portion in circuit substrate 112 and the circuit substrate 122, be connected with the connector portion in being arranged on flexible printing distributing board 200, thereby circuit substrate 112 and circuit substrate 122 are electrically connected via flexible printing distributing board 200.
This flexible printing distributing board 200 has double sided wired 210 the zone and the zone of bend 220 as its zone as shown in Figure 2.
Described double sided wired 210 zone is in flexible printing distributing board 200, is formed with the zone of wiring circuit at the substrate positive and negative.
This double sided wired 210 shown in Fig. 2 (b), by substrate 20, weld-ring through hole (1andthrough hole) 21 and cover layer 22 formations.
Described substrate 20 forms the circuit part of flexible printing distributing boards 200, shown in Fig. 2 (b), forms by stacked conductive layer 20b on insulating barrier 20a two-sided.
In addition, as insulating barrier 20a,, can be any materials so long as the material that polyimides etc. usually use as the insulating barrier of the substrate that constitutes the flexible printing distributing board gets final product.
In addition, as conductive layer 20b,, can be any materials so long as the material that Copper Foil etc. usually use as the conductive layer of the substrate that constitutes the flexible printing distributing board gets final product.
Described weld-ring through hole 21 applies so-called salient point plating and forms on through hole 21a, the wiring circuit that is used for being formed on the conductive layer 20b of positive and negative of substrate 20 is electrically connected.
This weld-ring through hole 21 is shown in Fig. 2 (b), has the through hole 21a that runs through substrate 20 and form, by on the whole surface of the endoporus P of through hole 21a, carrying out plating, and only the peripheral edge margin of the positive and negative peristome Q of through hole 21a is carried out plating as weld-ring R and form.The part that constitutes by this plating forms electric conductor 21b.
Here, so-called " weld-ring " is meant in weld-ring through hole 21, the part of protruding with convex dot shape on the surface of substrate 20.
By above-mentioned double sided wired 210 structure is formed, utilize weld-ring through hole 21 will be formed on the structure that the wiring circuit on the conductive layer 20b of positive and negative of substrate 20 is electrically connected, thereby double sided wired 210 can guarantee fully on the one face with circuit substrate 112 and circuit substrate 122 between be electrically connected, simultaneously on another face that is electrically connected via weld-ring through hole 21, construct required wiring circuit fully.
Described cover layer 22 is used to protect the wiring circuit that is formed on the conductive layer 20b, shown in Fig. 2 (b), is made of coverlay film 22a and cover layer bonding agent 22b.
As coverlay film 22a, so long as having the film of insulating properties, polyimides etc. get final product, can be any film.
In addition, as cover layer bonding agent 22b, so long as thermosetting resin etc. can be any materials usually for coverlay film 22a being fitted on the substrate 20 and the material that uses gets final product.
In addition, shown in Fig. 2 (c), the diameter S of preferred through hole 21a is about 0.1mm, and the diameter T of weld-ring R is about 0.3mm, in the wiring circuit on being formed at conductive layer 20b, the diameter U that is formed on the wiring circuit of the circular on the weld-ring R part is about 0.5mm.
The zone of described bend 220 is in flexible printing distributing board 200 shown in Fig. 1 (b), exposing state configuration, and carries out crooked zone repeatedly in the space that produces between a pair of framework 100 that is made of the 1st framework 110 and the 2nd framework 120.
This bend 220 is made of substrate 20 and cover layer 22 shown in Fig. 2 (b).
In addition, for substrate 20 and cover layer 22, owing to be the parts identical with the substrate 20 of double sided wired 210 of described formation and cover layer 22, so the mark same numeral omits further instruction.
In addition, in the present embodiment, bend 220 only constitutes and forms wiring circuit in the front of substrate 20 shown in Fig. 2 (b), and removes the state of the conductive layer 20b of remaining reverse side.
By forming said structure, the wiring circuit that is used to circuit substrate 112 and circuit substrate 122 are electrically connected only can be concentrated on the front of substrate 20, can make the thickness attenuation of bend 220.Thus, can further improve the bendability of bend 220.
Thus, can form following bend 220, that is, it can tackle the pathization of radius of curvature of the bend that narrow and smallization caused in last side frame body in the sliding mobile telephone and the gap between the following side frame body, and can improve the durability at alternating bending.
In addition, in the present embodiment, bend 220 adopts the structure that only forms wiring circuit in the front of substrate 20, but might not be limited to this structure, also can be the structure that only forms wiring circuit at reverse side.
Below, with reference to Fig. 3～Fig. 6, the manufacture method of the flexible printing distributing board 200 that the 1st execution mode of the present invention is related is described.
The flexible printing distributing board 200 that embodiments of the present invention are related forms operation 300, corrosion-resisting pattern via through hole and forms operation 400, weld-ring through hole plating operation 500, wiring circuit and form operation 600 and the stacked operation 700 of cover layer and make.
At first, through hole forms the operation that operation 300 is formation through holes on substrate 20.
Specifically, shown in Fig. 3 top, the substrate 20 that forms at stacked conductive layer 20b on insulating barrier 20a two-sided utilizes boring processing to wait and forms through hole 21a.
In addition, the diameter of preferred through hole 21a is about 0.1mm.
It is to be used to utilize corrosion-resisting pattern to coat the operation of substrate 20 that ensuing corrosion-resisting pattern forms operation 400, wishes that only to make the part that forms weld-ring through hole 21 contacts with plating solution.
Specifically, shown in Fig. 3 middle part, stacked film 410 against corrosion on the substrate 20 that is formed with through hole 21a two-sided.Then, shown in the black arrow of Fig. 3 bottom, expose, develop at the front and the reverse side of substrate 20 by utilize ultraviolet ray across pattern mask 420, thereby remove the unwanted part of film 410 against corrosion.Thus, shown in Fig. 4 topmost, except hope formed the part of weld-ring through hole 21, the positive and negative of substrate 20 was coated by corrosion-resisting pattern 430.
Ensuing weld-ring through hole plating operation 500 is the operations of only peripheral edge margin of the whole surface of the endoporus P of through hole 21a and positive and negative peristome Q being carried out plating and coating as weld-ring R.
Specifically, though at length do not illustrate at Fig. 4 middle part, only with the peripheral edge margin of the whole surface of the endoporus P of through hole 21a and positive and negative peristome Q as weld-ring R, carrying out the 1st plating operation is electroless plating.By this operation, only in the peripheral edge margin of the whole surface of the endoporus P of through hole 21a and positive and negative peristome Q, form not shown conductive film covering.
Then, only with the peripheral edge margin of the whole surface of the endoporus P of through hole 21a and positive and negative peristome Q as weld-ring R, carrying out the 2nd plating operation is electrolytic copper plating.
In addition, in the present embodiment, form and utilize electroless plating to carry out the structure of the 1st plating operation, but might not be defined as this structure.For example, can form the structure of using the carbonaceous conductive processing.
Then, shown in Fig. 4 middle part, peel off corrosion-resisting pattern 430.Thus, form following weld-ring through hole 21, it is by carrying out plating on the whole surface of the endoporus P of through hole 21a, and only the peripheral edge margin of the positive and negative peristome Q of through hole 21a is carried out plating as weld-ring R and constitute.
In addition, in weld-ring R, preferably the length V of the part of protruding on the surface of substrate 20 is 5 μ m～20 μ m.
Ensuing wiring circuit forms operation 600, be in double sided wired 210, on the conductive layer 20b of substrate positive and negative, form wiring circuit, simultaneously in bend 220, remove the conductive layer 20b of the reverse side of substrate 20, and only in the remaining positive operation that forms wiring circuit.
Specifically, shown in Fig. 4 foot, under the state that has formed weld-ring through hole 21, stacked film 610 against corrosion on substrate 20 two-sided.
Then, shown in the black arrow at Fig. 5 top and middle part, by utilizing ultraviolet ray that the front and the reverse side of substrate 20 exposed, develops across pattern mask 620, thereby, only remove the film against corrosion 610 on the reverse side that is layered in the bend 220 as shown in the middle part of Fig. 5.Thus, the positive and negative of substrate 20 is coated by corrosion-resisting pattern 630.
Then, shown in Fig. 5 foot, by etching, in double sided wired 210, on the conductive layer 20b of substrate positive and negative, form wiring circuit, and in bend 220, remove the conductive layer 20b of the reverse side of substrate 20, and only on remaining front, form wiring circuit.
In addition, in the present embodiment, become following structure, that is, in bend 220, only form wiring circuit, but might not be defined as this structure in the front of substrate 20, also can be for only forming the structure of wiring circuit at reverse side.
Then, shown in Fig. 6 top, peel off corrosion-resisting pattern 630.
The stacked operation 700 of ensuing cover layer is the operations that are used for coating cover layer 22 on the positive and negative of substrate 20, so that the wiring circuit that is formed on the conductive layer 20b is insulated, protects.
Specifically, shown in Fig. 6 bottom, via cover layer bonding agent 22b, applying coverlay film 22a on the positive and negative of substrate 20.
Via above-mentioned operation, make flexible printing distributing board 200.
Below, with reference to Fig. 7, the flexible printing distributing board 200 that the 2nd execution mode of the present invention is related is described.
The 2nd execution mode of the present invention constitutes, and utilizes electromagnetic wave shielding to coat on the wiring circuit layer of bend 220.Other structures are identical with described the 1st execution mode of the present invention.Part for identical parts, realization identical function marks identical label, omits further instruction.
As shown in Figure 7, electromagnetic wave shielding 800 coats the layer of the formation wiring circuit in the bend 220, is made of bond layer 810, screen 820 and insulating barrier 830.
Described bond layer 810 is to be used for the layer of electromagnetic wave shielding 800 with cover layer 22 applyings.
This bond layer 810 is formed by conductive adhesive, and as shown in Figure 7, its part connects and uses hole 22c via being formed on circuit on the cover layer 22, is connected with not shown earthed circuit on being formed on conductive layer 20b.
In addition, the thickness of preferred bond layer 810 is about 5 μ m～25 μ m.
In addition, as conductive adhesive,, can be any materials so long as the material that epoxy resin etc. use as conductive adhesive usually gets final product.
Described screen 820 is the layers that are made of conductive material.
In addition, in the present embodiment, use silver, utilize physical vapor deposition to form screen 820 as conductive material.
In addition, the thickness of preferable mask layer 820 is about 0.1 μ m.
In addition,, be not limited to silver, also can use other conductive metal such as gold, copper, aluminium, nickel or electroconductive particle, conducting fibre, electroconductive resin etc. and constitute as conductive material, but the preferred silver that uses.
In addition, as the physical vapor deposition of conductivity,, can be any means so long as the method that sputtering method, ion beam vapour deposition method etc. use as physical vapor deposition usually gets final product.
Described insulating barrier 830 is formed by insulation film as the insulating barrier of electromagnetic wave shielding 800.
As insulation film,, can be any film so long as the film that polyimides etc. use as insulation film usually gets final product.
In addition, the thickness of preferred insulating barrier 830 is about 3 μ m～10 μ m.
By described bond layer 810, screen 820 and insulating barrier 830 is integrated, and in bend 220, fit with the cover layer 22 in the front that is formed with wiring circuit, thereby form electromagnetic wave shielding 800.
By as mentioned above the wiring circuit layer of bend 220 being utilized electromagnetic wave shielding 800 to coat, thereby the wiring circuit that can prevent to be formed on the bend 220 is subjected to harmful effects such as the caused malfunction of electromagnetic wave noise.
And at bend 220 places, by only forming wiring circuit in face side, and to make the thickness of the electromagnetic wave shielding 800 that coats the wiring circuit layer be about 8 μ m～35 μ m, thereby can make the thickness attenuation of bend 220.Thus, can form following bend 220, that is, it can tackle the pathization of radius of curvature of the bend that narrow and smallization caused in last side frame body in the sliding mobile telephone and the gap between the following side frame body, and can improve the durability at alternating bending.
Below, with reference to Fig. 8, the variation of the related flexible printing distributing board 200 of the 2nd execution mode of the present invention is described.
This variation forms the structural change of electromagnetic wave shielding.Other structures are identical with described the 2nd execution mode of the present invention.Part for identical parts, realization identical function marks identical label, omits further instruction.
As shown in Figure 8, the layer that is formed with wiring circuit that electromagnetic wave shielding 800 coats in the bend 220 is made of screen 820 and insulating barrier 830.
Described screen 820 is the layers that are made of conductive material.
In the present embodiment, use silver paste, utilize silk screen printing on cover layer 22, to form screen 820 as conductive material.
In addition, as shown in Figure 8, the part of screen 820 connects and to use hole 22c via being formed on circuit on the cover layer 22, is connected with not shown earthed circuit on being formed on conductive layer 20b.
In addition, the thickness of preferable mask layer 820 is about 15 μ m～20 μ m.
In addition,, be not limited to silver paste, also can use other conductive metal cream such as gold, copper, aluminium, nickel and constitute, but preferably use silver paste as conductive material.
Described insulating barrier 830 is to use the insulation coating agent as the insulating barrier of electromagnetic wave shielding 800, utilizes silk screen printing to be formed on the screen 820.
In addition, as the insulation coating agent,, can be any coating agent so long as the coating agent that silicon class, ceramic-like etc. are used as the insulation coating agent usually gets final product.
In addition, the thickness of preferred insulating barrier 830 is about 15 μ m～20 μ m.
By after being formed on described screen 820 on the cover layer 22, insulating barrier 830 is formed on the screen 820, thereby forms electromagnetic wave shielding 800.
By as mentioned above the wiring circuit layer of bend 220 being utilized electromagnetic wave shielding 800 to coat, thereby the wiring circuit that can prevent to be formed on the bend 220 is subjected to harmful effects such as the caused malfunction of electromagnetic wave noise.
And at bend 220 places, by only forming wiring circuit in the front, and to make the thickness of the electromagnetic wave shielding 800 that coats the wiring circuit layer be about 30 μ m～40 μ m, thereby can make the thickness attenuation of bend 220.Thus, can form following bend 220, that is, it can tackle the pathization of radius of curvature of the bend that narrow and smallization caused in last side frame body in the sliding mobile telephone and the gap between the following side frame body, and can improve the durability at alternating bending.
The present invention can be used as the manufacture method of the employed flexible printing distributing boards of electronic equipment such as mobile phone or hard disk unit and this flexible printing distributing board.
Claims (4)
1. flexible printing distributing board, it has: the zone that is formed with the double sided wired portion of wiring circuit at the substrate positive and negative; And the zone that is used for carrying out repeatedly crooked bend,
This flexible printing distributing board is characterised in that,
Form the weld-ring through hole in described double sided wired, this weld-ring through hole is by carrying out plating on the whole surface of the endoporus of the through hole that runs through substrate, and only the peripheral edge margin of the positive and negative peristome of through hole carried out plating as weld-ring and constitute,
Thus, the positive and negative wiring circuit that constitutes described double sided wired portion is electrically connected,
In described bend, only on a face of substrate positive and negative, be formed with wiring circuit.
2. flexible printing distributing board according to claim 1 is characterized in that,
The wiring circuit layer of described bend is coated by electromagnetic wave shielding.
3. the manufacture method of a flexible printing distributing board, this flexible printing distributing board has: the zone that is formed with the double sided wired portion of wiring circuit on the conductive layer of substrate positive and negative; And the zone that is used for carrying out repeatedly crooked bend,
The manufacture method of this flexible printing distributing board is characterised in that,
Have following operation:
Through hole forms operation, in this operation, forms the through hole that runs through described substrate in described double sided wired;
Corrosion-resisting pattern forms operation, in this operation, except the peristome neighboring area of this through hole, forms corrosion-resisting pattern on substrate two-sided;
Weld-ring through hole plating operation in this operation, is carried out plating with the whole surface of the endoporus of described through hole and peristome peripheral edge margin and is coated as weld-ring; And
Wiring circuit forms operation, in this operation, in described double sided wired, on the conductive layer of substrate positive and negative, form wiring circuit, and in described bend, remove the conductive layer of a face in the substrate positive and negative, and only on remaining another face, form wiring circuit.
4. an electronic equipment is characterized in that,
Have claim 1 or 2 described flexible printing distributing boards.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-003943 | 2010-01-12 | ||
| JP2010003943A JP2011146427A (en) | 2010-01-12 | 2010-01-12 | Flexible printed wiring board, method of manufacturing flexible printed wiring board, and electronic equipment with flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102131340A true CN102131340A (en) | 2011-07-20 |
| CN102131340B CN102131340B (en) | 2016-03-16 |
Family
ID=44269204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110020628.4A Active CN102131340B (en) | 2010-01-12 | 2011-01-12 | The manufacture method of flexible printed wiring board, flexible printed wiring board, there is the electronic equipment of flexible printed wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2011146427A (en) |
| CN (1) | CN102131340B (en) |
| TW (1) | TW201136467A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636334A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN110970729A (en) * | 2019-09-06 | 2020-04-07 | 深圳科诺桥科技股份有限公司 | An omnidirectional shielded antenna structure and antenna |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015038908A (en) * | 2012-03-06 | 2015-02-26 | イビデン株式会社 | Flex-rigid wiring board |
| JP2015038907A (en) * | 2012-03-06 | 2015-02-26 | イビデン株式会社 | Flex-rigid wiring board |
| KR20230019836A (en) | 2020-06-04 | 2023-02-09 | 스미토모 덴코 프린트 써키트 가부시키가이샤 | printed wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11195849A (en) * | 1997-12-26 | 1999-07-21 | Fujikura Ltd | Flexible printed wiring board and method for manufacturing it |
| JP2007157777A (en) * | 2005-11-30 | 2007-06-21 | Toshiba Corp | Wiring board and its manufacturing method, and electronic apparatus having the same |
| CN201282594Y (en) * | 2008-07-03 | 2009-07-29 | 比亚迪股份有限公司 | Flexible circuit board |
-
2010
- 2010-01-12 JP JP2010003943A patent/JP2011146427A/en active Pending
-
2011
- 2011-01-10 TW TW100100800A patent/TW201136467A/en unknown
- 2011-01-12 CN CN201110020628.4A patent/CN102131340B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11195849A (en) * | 1997-12-26 | 1999-07-21 | Fujikura Ltd | Flexible printed wiring board and method for manufacturing it |
| JP2007157777A (en) * | 2005-11-30 | 2007-06-21 | Toshiba Corp | Wiring board and its manufacturing method, and electronic apparatus having the same |
| CN201282594Y (en) * | 2008-07-03 | 2009-07-29 | 比亚迪股份有限公司 | Flexible circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636334A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN110970729A (en) * | 2019-09-06 | 2020-04-07 | 深圳科诺桥科技股份有限公司 | An omnidirectional shielded antenna structure and antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102131340B (en) | 2016-03-16 |
| JP2011146427A (en) | 2011-07-28 |
| TW201136467A (en) | 2011-10-16 |
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