CN102252297A - Assembly of heating component and heat-dissipation structure and LED (light emitting diode) lamp - Google Patents
Assembly of heating component and heat-dissipation structure and LED (light emitting diode) lamp Download PDFInfo
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- CN102252297A CN102252297A CN2011101098677A CN201110109867A CN102252297A CN 102252297 A CN102252297 A CN 102252297A CN 2011101098677 A CN2011101098677 A CN 2011101098677A CN 201110109867 A CN201110109867 A CN 201110109867A CN 102252297 A CN102252297 A CN 102252297A
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- lamp
- substrate
- installing plate
- light source
- lamp body
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 title abstract description 9
- 239000012530 fluid Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 61
- 239000012774 insulation material Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000011810 insulating material Substances 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides an assembly of a heating component and a heat-dissipation structure and an LED (light emitting diode) lamp containing the assembly. In the assembly, the heating component is arranged on a baseplate, the heat-dissipation structure is made of a moldable heat-conducting insulating material, the baseplate provided with the heating component is used as an embedded component of a die when the heat-dissipation structure is manufactured, the moldable heat-conducting insulating material in a fluid state can be injected into the die or injected into the die under pressure, and when the heat-dissipation structure is integrally manufactured, the baseplate and the heat-dissipation structure can be directly fixed and jointed. The light emitting diode of the LED lamp is the heating component in the assembly, the lamp body of the LED lamp is the heat-dissipation structure in the assembly. The assembly and the LED lamp have the advantages of good heat-dissipating performance, light weight, simple manufacturing process, low cost and the like.
Description
Technical field
The assembly of components and parts and radiator structure and the LED light lamp that constitutes with this assembly the present invention relates to generate heat.
Background technology
In the assembly of existing heating components and parts and radiator structure, normally the substrate that has the components and parts that generate heat that will make by heat-conducting glue or mechanical means is fixably attached on the radiator structure of having made, so that radiator structure dispels the heat to the heating components and parts.In existing LED light lamp, the substrate that will have light emitting diode usually by one deck thermal paste (can be a kind of commercial goods, it has good thermal conductivity and non-conductive) be adhered to that metal constitutes not only as on lamp body but also the structure as radiator (radiator structure).A part of manufacturing process of this lamp is, the metal lamp body of common pre-processed double as radiator and light emitting diode is welded on the substrate is adhered to the back side opposite with light emitting diode place face of substrate the front of the light source installing plate of metal lamp body again by thermal paste.There is following shortcoming in above-mentioned preparation method: processed complex, the radiator structure of metal or lamp body Heavy Weight, and owing to base plate bonding on radiator structure or lamp body thereby cause easily between the one side of the front of radiator structure or light source installing plate and thermal paste and between the back side of the another side of thermal paste and substrate and exist air gap to cause radiating effect to descend easily.
Summary of the invention
The present invention is in order to address the above problem, and its purpose is to provide in light weight, technology simple, the assembly of the heating components and parts of good heat dissipation effect and radiator structure and comprise the LED light lamp of this assembly.
The assembly of heating components and parts of the present invention and radiator structure.In this assembly, the heating components and parts are arranged on the substrate, the material of radiator structure be can be molded and shaped heat-conducting insulation material, be provided with the insert of the substrate of heating components and parts when making radiator structure as mould, by will be in fluid state can be molded and shaped heat-conducting insulation material inject or mould is injected in pressurization, when radiator structure is made into integration, realize the direct fixed engagement of substrate and radiator structure.
LED light lamp of the present invention, comprise the combinations thereof body, heating components and parts in the assembly are the light emitting diodes in the LED light lamp, radiator structure in the assembly is the lamp body of LED light lamp, light emitting diode is arranged on the substrate, lamp body comprises the light source installing plate with front and back, light emitting diode is arranged on the front of substrate, when making lamp body as the reverse side of the substrate of lamp body mould insert in the face of in the lamp body mould with the positive corresponding position of light source installing plate, after making that lamp body is molded and finishing, the direct fixed engagement of the reverse side of substrate is in the front of light source installing plate.
As above the assembly of heating components and parts of Gou Chenging and radiator structure and led lamp have that in light weight, technology is simple, advantages such as low cost of manufacture and good heat dissipation effect.
Description of drawings
Fig. 1 is the positive view of the structural principle of the LED light lamp of demonstration one embodiment of the invention.
Fig. 2 is the zoomed-in view of local A among Fig. 1.
The state diagram that Fig. 3 separates with light source installing plate 31 imaginations for substrate 2 among Fig. 2.
The local diagrammatic sketch that Fig. 4 analyses and observe for B-B among Fig. 1.
Fig. 5 is the top view of the structural principle of the LED light lamp of demonstration Fig. 1 embodiment.
The specific embodiment
The invention provides a kind of assembly of generate heat components and parts and radiator structure, its improvement shows that mainly radiator structure is to form by molded, and as the substrate of mounting heating components and parts by molding process and the direct fixed engagement of radiator structure.In this assembly, radiator structure, heating components and parts and substrate are not had the given shape requirement and improve mainly to show on the technology, therefore omitted structural diagrams.As this assembly, its heating components and parts are arranged on the substrate, the material of radiator structure be can be molded and shaped heat-conducting insulation material, be provided with the insert of the substrate of heating components and parts when making radiator structure as mould, can inject described mould by molded and shaped heat-conducting insulation material by what will be in fluid state, when radiator structure is made into integration, realize the direct fixed engagement of substrate and radiator structure.As preferably, the injection of can pressurizeing when molded can further strengthen the adaptation that engages of heating components and parts and radiator structure like this.So-called pressurization is exactly to the pressure greater than atmosphere of can molded and shaped heat-conducting insulation material imposing of the fluid state that will inject.Wherein, the substrate that is provided with the heating components and parts also refer to generate heat (promptly not being to add in addition) that this body structure of components and parts has be used for the faying face that combines with radiator structure.
Can molded and shaped heat-conducting insulation material be meant can inject mould under a kind of condition and under another kind of condition by mould inside shape curing molding can heat conduction and nonconducting nonmetallic materials.As this material low temperature heat-conducting plastic, thermal paste (heat-conducting glue), heat-conducting resin or the like arranged for example.Wherein, the low temperature heat-conducting plastic is meant that melt temperature is lower than the low temperature heat-conducting plastic of scolding tin fusing point.
The application of combinations thereof body in LED light lamp is described below.
Fig. 1 is the positive view of the structural principle of the LED light lamp of demonstration one embodiment of the invention.
LED light lamp of the present invention comprises substrate 2 that is welded with light emitting diode 1 and the lamp body 3 that joins with substrate 2, wherein lamp body 3 double as radiators.Improvements of the present invention are: as the material of the lamp body 3 of radiator structure be can be molded and shaped heat-conducting insulation material, for example a kind of melt temperature is lower than the low temperature heat-conducting plastic of scolding tin fusing point, be welded with the insert of the substrate 2 of light emitting diode 1 when making lamp body 3 as lamp body mould (not shown), by heat-conducting insulation material that can be molded and shaped, for example after the fusion of low temperature heat-conducting plastic, inject or pressurization injection lamp body mould, the direct fixed engagement that realizes substrate 2 and lamp body 3 when lamp body 3 is made into integration is not (promptly by other member, the fixed engagement of thermal paste and/or screw etc. for example).
In a specific embodiment shown in Figure 1, referring to Fig. 2 and Fig. 3, lamp body 3 preferably but be not defined as shell construction, it comprises the light source installing plate 31 integrally molded with lamp body with front 311 and back side 312, light emitting diode 1 is arranged on the substrate 2, its luminous main body is positioned at front 21 1 sides of substrate 2, one or more vertical structure type low power LEDs can be installed on the substrate 2, this moment, substrate 2 was a printed circuit board (PCB), its reverse side is the solder side 22 (wherein, pad 12 is made of the scolding tin of welding pin 11) that is welded with led pins 11.Also one or more large-power light-emitting diodes can be installed on the substrate 2, this moment, substrate 2 for example can be metallic plates such as aluminium.When making lamp body 3, as the reverse side 22 (corresponding) of the substrate 2 of lamp body mould (not shown) insert with solder side 22 in the face of position corresponding in the lamp body mould with light source installing plate positive 311, make can be molded and shaped heat-conducting insulation material, the fusion of for example low temperature heat-conducting plastic inject or after pressurization injected lamp body mould and cooling, reverse side 22 fixed engagement were in the front 311 of light source installing plate 31.Pin one 1 can be between the front 311 and the back side 312 of light source installing plate 31.
As above-mentioned variation example, led pins 11 can run through light source installing plate 31 (not shown) on the thickness direction of light source installing plate 31, and promptly the front 311 from light source installing plate 31 penetrates the back side 312, thereby reaches further radiating effect.
In above each embodiment (comprise and change example), referring to Fig. 3, can be formed with recess 313 in the front 311 of light source installing plate 31, the reverse side 22 of substrate 2 engages with the bottom surface 3131 of recess 313, the side face 23 of substrate 2 engages with the side face 3132 of recess 313, thereby reaches the effect of further reinforcement fixed engagement.
Variation example as above-mentioned recess 313, can do the recess among Fig. 3 313 more deeply, make the height of side face 3132 of recess 313 greater than the thickness (being the height of the side face 23 of substrate 2) of substrate 2, in conjunction with Fig. 4 as seen, exceed at side face 3132 on the side face of thickness of substrate 2 with lamp body 3 is integrally molded and be formed with outstanding protrusions (referring to Fig. 4), be used for substrate 2 is fastened on the recess 313 of light source installing plate 31 from side face 3132 pointing lamp axis m.This protrusion can be a plurality of discrete prominent pawls 315 (Fig. 4 is structurally to show prominent pawl, shown in solid line), also can be prominent 314 (Fig. 4 is auxilliary, shown in dotted line to show that annular is dashed forward) of an annular.Substrate 2 further can be combined on the light source installing plate 31 firmly admittedly by this protrusion, and when substrate 2 is metal material, more help the heat radiation of substrate 2.As further variation example, above-mentioned prominent pawl 315 and annular prominent 314 can not form under the situation of recess 313 on the front 311 of light source installing plate 31 yet, the height that is formed on lamp cover 34 apart from the front 311 of light source installing plate 31 exceed substrate 2 thickness, promptly near the front 21 corresponding to substrate 2, internal face on (not shown).Protrusion in protrusion that forms in this variation example (for example prominent pawl 315 and annular prominent 314) and the above-mentioned variation example has effects equivalent, thereby both should be considered as equivalent.
As the variation example (not shown) of substrate 2 with the further fixed engagement means of light source installing plate 31, can be in the various embodiments described above (comprising that each changes example), before not molded lamp body 3, on substrate 2, form the front 21 of one or more connection substrates 2 and the through hole (not shown) of reverse side (corresponding solder side) 22, after lamp body 3 molded the finishing, grow the rivet-like structure (not shown) of head from light source installing plate 31 by each through hole attached to the front of substrate 2, so as with substrate 2 riveteds on light source installing plate 31.
Be formed with on the light source installing plate 31 under the situation of recess 313, the thickness of light source installing plate is meant the thickness between bottom surface 3131 to the back side 312 of light source installing plate 31 of recess 313.
In above each embodiment, referring to Fig. 1, lamp body 3 also can comprise: from the cylindrical shell 32 that extend to the rear side of light source installing plate at the back side 312 of light source installing plate 31, cylindrical shell 32 is integrally molded with lamp body 3; And between the back side 312 of cylindrical shell 32 outer surfaces 321 and light source installing plate 31 and with both, join, 3 integrally molded with lamp body, from the top orientation C of cylindrical shell 32, be that a plurality of fin 33 of (referring to Fig. 5) are seen radially at the back side 312 of light source installing plate 31.
In above each embodiment, member is further slim in order to make, lightweight, the thickness of light source installing plate 31, promptly forms thickness before the recess 313, and is desirable more than or equal to 2mm, smaller or equal to 5mm, the thickness of arbitrary fin is smaller or equal to the thickness of light source installing plate 2 in a plurality of fin 33.
In above each embodiment, referring to Fig. 1, Fig. 2 and Fig. 3, that lamp body 3 also can comprise is 3 integrally molded with lamp body, be formed with the lamp cover 34 that extends to the opposite side opposite with cylindrical shell 32 places one side from the periphery in the front of light source installing plate 31, is used to install lampshade 4, and lamp cover 34 is integral with lamp body 3.As preferably, the thickness of lamp cover 34 is also smaller or equal to the thickness of light source installing plate 2.Light emitting diode 1 can be a plurality of, is arranged on the front 21 of substrate 2.LED light lamp can comprise further also that an end is connected with the end away from light source installing plate 2 of cylindrical shell 32 is cylinder-shaped bulb socket 5 substantially, with the lamp holder 6 that is connected with bulb socket 5 other ends.In the space of cylindrical shell 32 and bulb socket 5 formation, can be provided with the drive circuit that drives light emitting diode 1 work usefulness.
Among each embodiment of this paper, lamp body 3 all can adopt shell construction, and the thickness that so-called shell construction is meant various piece in all the other outer component parts of the light source installing plate 2 of lamp body 3 (comprising lamp cover 34) is all smaller or equal to the thickness of light source installing plate 2.
Below in conjunction with the embodiments the present invention is had been described in detail, but the details of describing among the embodiment should not constitute limitation of the invention.The present invention should be as the criterion with the marrow that appended claims was limited.
Claims (10)
1. the assembly of heating components and parts and radiator structure, described heating components and parts are arranged on the substrate, it is characterized in that, the material of described radiator structure be can be molded and shaped heat-conducting insulation material, be provided with the insert of the substrate of heating components and parts when making described radiator structure as mould, inject or the described mould of pressurization injection by the described heat-conducting insulation material that can be molded and shaped that will be in fluid state, when radiator structure is made into integration, realize the direct fixed engagement of described substrate and radiator structure.
2. assembly as claimed in claim 1 is characterized in that, described can molded and shaped heat-conducting insulation material be the low temperature heat-conducting plastic that melt temperature is lower than the scolding tin fusing point.
3. LED light lamp comprises claim 1 or 2 described assemblys, and the heating components and parts in the assembly are the light emitting diodes in the LED light lamp, radiator structure in the assembly is the lamp body of LED light lamp, light emitting diode is arranged on the substrate, it is characterized in that
Described lamp body comprises the light source installing plate with front and back, described light emitting diode is arranged on the front of described substrate, when making described lamp body as the reverse side of the described substrate of lamp body mould insert in the face of in the lamp body mould with the positive corresponding position of described light source installing plate, after making that lamp body is molded and finishing, the direct fixed engagement of the reverse side of described substrate is in the front of light source installing plate.
4. LED light lamp as claimed in claim 3 is characterized in that, is formed with recess in the front of light source installing plate, and the reverse side of described substrate engages with the bottom surface of described recess, and the side face of described substrate engages with the side face of described recess.
5. LED light lamp as claimed in claim 4 is characterized in that, the height of the side face of described recess is greater than the thickness of substrate, exceeds at the side face of described recess on the side face of thickness of substrate to be formed with from the outstanding protrusion of this side face pointing lamp axis.
6. LED light lamp as claimed in claim 5 is characterized in that, described protrusion is the prominent or a plurality of discrete prominent pawls of an annular.
7. LED light lamp as claimed in claim 3, it is characterized in that, before the not molded lamp body, on described substrate, form the through hole of one or more connection substrate front side and reverse side, lamp body is molded finish after, grow the rivet-like structure of head from described light source installing plate by each described through hole attached to described substrate front side.
8. as the described LED light lamp of the arbitrary claim of claim 3-7, it is characterized in that described lamp body also comprises: the cylindrical shell that extends to the rear side of light source installing plate from the back side of light source installing plate; And between the described barrel outer surface and the light source installing plate back side and with both, join, from the top orientation of cylindrical shell, be that a plurality of fin are radially seen at the back side of light source installing plate.
9. LED light lamp as claimed in claim 8 is characterized in that, is formed with the lamp cover that extends to the opposite side opposite with described cylindrical shell place one side from the periphery in the front of described light source installing plate.
10. LED light lamp as claimed in claim 9 is characterized in that, the thickness of described light source installing plate is more than or equal to 2mm, and smaller or equal to 5mm, described lamp body is a shell construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110109867.7A CN102252297B (en) | 2011-04-29 | 2011-04-29 | The assembly of heating element and radiator structure and LED light lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110109867.7A CN102252297B (en) | 2011-04-29 | 2011-04-29 | The assembly of heating element and radiator structure and LED light lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102252297A true CN102252297A (en) | 2011-11-23 |
| CN102252297B CN102252297B (en) | 2016-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110109867.7A Active CN102252297B (en) | 2011-04-29 | 2011-04-29 | The assembly of heating element and radiator structure and LED light lamp |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206625A (en) * | 2012-01-16 | 2013-07-17 | 欧司朗股份有限公司 | Lighting device and manufacturing method thereof |
| CN105003892A (en) * | 2014-04-15 | 2015-10-28 | 陈权霈 | Heat dissipation structure, manufacturing method thereof and lamp with heat dissipation structure |
| CN106523945A (en) * | 2016-11-09 | 2017-03-22 | 宁波亚茂光电股份有限公司 | LED lamp adopting glass shell |
| CN108343854A (en) * | 2018-03-30 | 2018-07-31 | 广东德豪润达照明电气有限公司 | LED frame lamp, the manufacturing method of LED frame lamp and its automatic production line |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2849445Y (en) * | 2005-08-15 | 2006-12-20 | 冯海 | LED lighting lamp with heat radiation function |
| CN201145247Y (en) * | 2007-08-06 | 2008-11-05 | 李建胜 | Integrated type LED semiconductor lamp fitting |
| CN101418947A (en) * | 2008-11-26 | 2009-04-29 | 埃迪科技（苏州）有限公司 | Heat radiation structure and light emitting diode lamp |
-
2011
- 2011-04-29 CN CN201110109867.7A patent/CN102252297B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2849445Y (en) * | 2005-08-15 | 2006-12-20 | 冯海 | LED lighting lamp with heat radiation function |
| CN201145247Y (en) * | 2007-08-06 | 2008-11-05 | 李建胜 | Integrated type LED semiconductor lamp fitting |
| CN101418947A (en) * | 2008-11-26 | 2009-04-29 | 埃迪科技（苏州）有限公司 | Heat radiation structure and light emitting diode lamp |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206625A (en) * | 2012-01-16 | 2013-07-17 | 欧司朗股份有限公司 | Lighting device and manufacturing method thereof |
| CN105003892A (en) * | 2014-04-15 | 2015-10-28 | 陈权霈 | Heat dissipation structure, manufacturing method thereof and lamp with heat dissipation structure |
| CN106523945A (en) * | 2016-11-09 | 2017-03-22 | 宁波亚茂光电股份有限公司 | LED lamp adopting glass shell |
| CN108343854A (en) * | 2018-03-30 | 2018-07-31 | 广东德豪润达照明电气有限公司 | LED frame lamp, the manufacturing method of LED frame lamp and its automatic production line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102252297B (en) | 2016-03-02 |
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