CN102242875A - Lamp structure - Google Patents
Lamp structure Download PDFInfo
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- CN102242875A CN102242875A CN2010101780322A CN201010178032A CN102242875A CN 102242875 A CN102242875 A CN 102242875A CN 2010101780322 A CN2010101780322 A CN 2010101780322A CN 201010178032 A CN201010178032 A CN 201010178032A CN 102242875 A CN102242875 A CN 102242875A
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- heat
- lamp structure
- fins
- heat conduction
- emitting element
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 25
- 238000004512 die casting Methods 0.000 claims abstract description 14
- 238000001125 extrusion Methods 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000013021 overheating Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明公开一种灯具结构,其包括一发光元件、一散热模块、一连接构件以及一电性接头,其中电性接头与发光元件电连接。前述散热模块包括以压铸成型方式制作的一第一导热元件以及一第二导热元件,前述第一、第二导热元件分别具有多个第一、第二鳍片,其中第一、第二鳍片以交错方式间隔配置。前述发光元件设置于第二导热元件上,前述连接构件以金属挤型方式制作并且穿过第一导热元件,用以连接第二导热元件以及电性接头。
The present invention discloses a lamp structure, which includes a light-emitting element, a heat dissipation module, a connecting member and an electrical connector, wherein the electrical connector is electrically connected to the light-emitting element. The heat dissipation module includes a first heat-conducting element and a second heat-conducting element made by die-casting, wherein the first and second heat-conducting elements respectively have a plurality of first and second fins, wherein the first and second fins are arranged in a staggered manner. The light-emitting element is arranged on the second heat-conducting element, and the connecting member is made by metal extrusion and passes through the first heat-conducting element to connect the second heat-conducting element and the electrical connector.
Description
技术领域 technical field
本发明涉及一种灯具结构,特别是涉及一种发光二极管灯具结构。The invention relates to a lamp structure, in particular to a light emitting diode lamp structure.
背景技术 Background technique
由于发光二极管(Light-Emitting Diode,LED)具有寿命长以及省电的优点,近年来已逐渐被应用在照明灯具等相关领域。一般而言,在使用发光二极管作为光源的灯具上通常会设有多个金属材质的鳍片,由此可将发光二极管所产生的热能排出,以避免发光二极管因过热而损坏。Since Light-Emitting Diodes (LEDs) have the advantages of long life and power saving, they have been gradually applied in related fields such as lighting fixtures in recent years. Generally speaking, a plurality of metal fins are usually provided on the lamps using LEDs as light sources, so as to dissipate the heat energy generated by the LEDs so as to prevent the LEDs from being damaged due to overheating.
传统的鳍片结构大多是通过金属挤型(die extrusion)或压铸成型(diecasing)两种方式加以制作,但金属挤型技术具有成本较高以及不易制作复杂形状等缺点,而压铸成型技术则具有结构强度较弱以及鳍片间距过大等缺点。有鉴于此,如何设计出一种能兼顾散热且成本低廉的灯具结构始成为一重要的课题。Traditional fin structures are mostly produced by die extrusion or die-casting, but metal extrusion technology has disadvantages such as high cost and difficulty in making complex shapes, while die-casting technology has The structural strength is weak and the fin spacing is too large. In view of this, how to design a lamp structure that can take into account heat dissipation and low cost has become an important issue.
发明内容 Contents of the invention
为解决上述问题,本发明的一实施例提供一种灯具结构,包括一散热模块、一发光元件、一电性接头以及一连接构件,前述散热模块包括以压铸成型方式制作的一第一导热元件以及一第二导热元件,其中前述第一、第二导热元件分别具有多个第一、第二鳍片,其中第一、第二鳍片以交错方式间隔配置。前述发光元件设置于第二导热元件上,前述电性接头电连接发光元件,前述连接构件以金属挤型方式制作并且穿过第一导热元件,用以连接第二导热元件以及电性接头。In order to solve the above problems, an embodiment of the present invention provides a lamp structure, including a heat dissipation module, a light-emitting element, an electrical connector, and a connecting member. The heat dissipation module includes a first heat conduction element made by die-casting And a second heat conduction element, wherein the aforementioned first and second heat conduction elements respectively have a plurality of first and second fins, wherein the first and second fins are arranged at intervals in a staggered manner. The light-emitting element is disposed on the second heat-conducting element, the electrical connector is electrically connected to the light-emitting element, and the connecting member is made of metal extrusion and passes through the first heat-conducting element to connect the second heat-conducting element and the electrical connector.
在一实施例中,前述第二导热元件更具有一基板以及一底座,其中第二鳍片以及底座分别位于基板的相反侧,且发光元件设置于底座上。In one embodiment, the aforementioned second heat conduction element further has a substrate and a base, wherein the second fins and the base are respectively located on opposite sides of the substrate, and the light emitting element is disposed on the base.
在一实施例中,前述基板具有多个通孔。In one embodiment, the aforementioned substrate has a plurality of through holes.
在一实施例中,前述通孔分布于底座周围。In one embodiment, the aforementioned through holes are distributed around the base.
在一实施例中,前述第一、第二导热元件以铝压铸成型方式制作。In one embodiment, the aforementioned first and second heat conducting elements are made by aluminum die-casting.
在一实施例中,前述连接构件以铝挤型方式制作。In one embodiment, the aforementioned connecting member is made by aluminum extrusion.
在一实施例中,前述第一、第二鳍片分别以放射状的方式排列于第一、第二导热元件上。In one embodiment, the aforementioned first and second fins are respectively arranged on the first and second heat conduction elements in a radial manner.
在一实施例中,前述发光元件为发光二极管。In one embodiment, the aforementioned light emitting element is a light emitting diode.
在一实施例中,前述电性接头为E27接头。In one embodiment, the aforementioned electrical connector is an E27 connector.
为使本发明的上述目的、特征、和优点能更明显易懂,下文特举较佳实施例并配合所附附图做详细说明。In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, preferred embodiments are specifically cited below and described in detail with the accompanying drawings.
附图说明 Description of drawings
图1为本发明一实施例的灯具结构分解图;Fig. 1 is an exploded view of the structure of a lamp according to an embodiment of the present invention;
图2为图1的灯具结构在组装后的示意图;Fig. 2 is a schematic diagram of the lamp structure in Fig. 1 after assembly;
图3为本发明一实施例的连接构件示意图;Fig. 3 is a schematic diagram of a connecting member according to an embodiment of the present invention;
图4、图5为本发明一实施例的第一导热元件示意图;以及Fig. 4 and Fig. 5 are schematic diagrams of the first heat conduction element according to an embodiment of the present invention; and
图6、图7为本发明一实施例的第二导热元件示意图。6 and 7 are schematic diagrams of the second heat conduction element according to an embodiment of the present invention.
主要元件符号说明Description of main component symbols
电性接头10;
连接构件20;connecting
散热鳍片201;Radiating fins 201;
穿孔202;
散热模块30;
第一导热元件31;a first
第一鳍片311;
开孔312;opening 312;
第二导热元件32;second
第二鳍片321;
基板322;
结合部323;Combined
底座324;
灯罩40;
发光元件50;
通孔H。Through hole H.
具体实施方式 Detailed ways
首先请一并参阅图1、图2,本发明一实施例的灯具结构由一电性接头10、一连接构件20、一散热模块30、一灯罩40以及至少一发光元件50所组成,前述电性接头10例如为E27接头,前述发光元件50例如为发光二极管,前述连接构件20以及散热模块30则可包含铝或其他具高导热系数的金属材质。需特别说明的是,本实施例中的散热模块30主要由一第一导热元件31以及一第二导热元件32所组成,其中第一、第二导热元件31、32皆是以压铸成型的方式制作,前述连接构件20则是采取金属挤型的方式制作。First, please refer to Fig. 1 and Fig. 2 together. The structure of a lamp according to an embodiment of the present invention is composed of an
如图1、图2所示,在本实施例中的第一导热元件31上形成有多个第一鳍片311,第二导热元件32上则形成有多个第二鳍片321,其中第一、第二导热元件31、32分别以压铸成型的方式制作(例如铝压铸成型),组装时可将第一、第二导热元件31、32相互嵌合,并使第一、第二鳍片311、321以交错方式间隔配置。由图1中可以看出,前述发光元件50设置于第二导热元件32底侧,前述灯罩40则是与第二导热元件32结合,用以包覆前述发光元件50。As shown in Fig. 1 and Fig. 2, a plurality of
需特别说明的是,由于压铸成型技术在制作导热元件上的鳍片结构时,对于散热鳍片的间距有其尺寸上的限制,故在实际制作上难以达到缩短间距以及增加鳍片数量的目的。为了克服传统制作工艺上的缺点,本发明通过使第一、第二导热元件31、32以相互嵌合的方式组装,并使第一、第二鳍片311、321以交错的方式间隔配置,由此能使散热模块30上的鳍片数量倍增,进而可大幅增加散热模块30的散热面积并提高散热效率。It should be noted that since the die-casting technology has a size limit on the spacing of the cooling fins when manufacturing the fin structure on the heat-conducting element, it is difficult to achieve the purpose of shortening the spacing and increasing the number of fins in actual production. . In order to overcome the shortcomings of the traditional manufacturing process, the present invention assembles the first and second heat-conducting
接着请参阅图3,在本实施例中的连接构件20主要以金属挤型的方式制作(例如铝挤型),其中连接构件20中央形成有一穿孔202,可用以容置电路板或其他电子元件,进而使前述电性接头10和发光元件50电连接。如图3所示,在连接构件20周围另形成有多个散热鳍片201,由此可增加连接构件20的散热面积以提高散热效率。Next, please refer to FIG. 3 , the
请一并参阅图4、图5,前述第一导热元件31具有一圆形的开孔312,其中开孔312的尺寸大致对应于连接构件20,此外在第一导热元件31周围则形成有多个呈放射状排列的第一鳍片311。再请参阅图6,在本实施例中的第二导热元件32具有一基板322以及多个第二鳍片321,其中第二鳍片321设置于基板322上,并且以放射状的方式排列,组装时可使第一、第二鳍片311、321以交错方式间隔配置(如图2所示),其中连接构件20穿过第一导热元件31的开孔312,并且固定于前述基板322中央的一结合部323。Please refer to FIG. 4 and FIG. 5 together. The aforementioned first
请参阅图7,前述第二导热元件32更具有一底座324,其中第二鳍片321和底座324分别位于基板322的相反侧,发光元件50则设置于底座324上。需特别说明的是,在本实施例中的基板322另形成有多个通孔H,前述通孔H分布于底座324周围,其中发光元件50所产生的热能可以气体对流的方式经由通孔H迅速排出,用于避免发光元件50因过热而损坏。Please refer to FIG. 7 , the aforementioned second
综上所述,本发明提供一种灯具结构,其主要包括一散热模块、一发光元件、一电性接头以及一连接构件,其中发光元件设置于散热模块上。应了解的是,前述散热模块包括以压铸成型方式制作(例如铝压铸成型)的第一导热元件以及第二导热元件,其中第一、第二导热元件上的第一、第二鳍片则是以交错方式间隔配置,由此能使散热模块上的鳍片数量倍增,进而可大幅增加散热面积并提高散热效率;另一方面,前述连接构件以金属挤型方式制作(例如铝挤型),用以连接第二导热元件和电性接头。To sum up, the present invention provides a lamp structure, which mainly includes a heat dissipation module, a light emitting element, an electrical connector and a connecting member, wherein the light emitting element is disposed on the heat dissipation module. It should be understood that the aforementioned heat dissipation module includes a first heat conduction element and a second heat conduction element made by die-casting (for example, aluminum die-casting), wherein the first and second fins on the first and second heat conduction elements are Arranged at intervals in a staggered manner, thereby doubling the number of fins on the heat dissipation module, thereby greatly increasing the heat dissipation area and improving heat dissipation efficiency; on the other hand, the aforementioned connecting members are made of metal extrusion (such as aluminum extrusion), Used to connect the second heat conduction element and electrical connector.
由于金属挤型制作工艺可达到细间距与高结构强度的优点,压铸成型技术则可制作出较为复杂的形状且成本低廉,因此本发明通过将灯具结构中的连接构件以及散热模块分别以前述两种方式加以制作,不仅能大幅提高灯具的散热效率,且可有效节省制造成本。Since the metal extrusion manufacturing process can achieve the advantages of fine pitch and high structural strength, and the die-casting molding technology can produce more complex shapes with low cost, the present invention uses the aforementioned two Manufactured in this way, not only can greatly improve the heat dissipation efficiency of the lamp, but also can effectively save the manufacturing cost.
虽然结合以上前述的实施例揭露了本发明,然而其并非用以限定本发明。本发明所属技术领域中熟悉此技术者,在不脱离本发明的精神和范围内,可做些许的更动与润饰。因此本发明的保护范围应以附上的权利要求所界定的为准。Although the present invention is disclosed in combination with the aforementioned embodiments, they are not intended to limit the present invention. Those skilled in the art to which the present invention belongs can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims.
Claims (10)
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CN2010101780322A CN102242875A (en) | 2010-05-11 | 2010-05-11 | Lamp structure |
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CN2010101780322A CN102242875A (en) | 2010-05-11 | 2010-05-11 | Lamp structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104654255A (en) * | 2013-11-22 | 2015-05-27 | 苏州承源光电科技有限公司 | Radiator for LEDs |
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CN101566285A (en) * | 2009-04-16 | 2009-10-28 | 卢汉雄 | Large power yellow light emitting diode lamp |
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2010
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Patent Citations (5)
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CN201059525Y (en) * | 2007-06-12 | 2008-05-14 | 浩然科技股份有限公司 | Heat radiating device of LED light-emitting module |
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