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CN102238802B - 电路板组件 - Google Patents

电路板组件 Download PDF

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Publication number
CN102238802B
CN102238802B CN201010154333.1A CN201010154333A CN102238802B CN 102238802 B CN102238802 B CN 102238802B CN 201010154333 A CN201010154333 A CN 201010154333A CN 102238802 B CN102238802 B CN 102238802B
Authority
CN
China
Prior art keywords
circuit board
module
stiffener
board assemblies
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010154333.1A
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English (en)
Other versions
CN102238802A (zh
Inventor
刘全益
杨波
胡晓舟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Futaihong Precision Industry Co Ltd
Original Assignee
Shenzhen Futaihong Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Futaihong Precision Industry Co Ltd filed Critical Shenzhen Futaihong Precision Industry Co Ltd
Priority to CN201010154333.1A priority Critical patent/CN102238802B/zh
Priority to US12/868,826 priority patent/US20110261281A1/en
Publication of CN102238802A publication Critical patent/CN102238802A/zh
Application granted granted Critical
Publication of CN102238802B publication Critical patent/CN102238802B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display
    • H05K2201/10136Liquid Crystal display [LCD]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018Presence of a frame in a printed circuit or printed circuit assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Telephone Set Structure (AREA)
  • Liquid Crystal (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

本发明涉及一种电路板组件,其包括电路板、显示模组和加强板,该电路板设有一表面,该显示模组装设于该表面上,所述加强板相对于该显示模组的位置装设于所述电路板另一表面上。

Description

电路板组件
技术领域
本发明涉及一种电路板组件,尤其涉及一种应用于便携式电子装置中的电路板组件。
背景技术
随着科技的迅速发展,手机等便携式电子装置趋向美观轻薄化,如作为标准件的显示面板、电路板等也越来越薄,但是,在减小电路板厚度的同时减小了电路板的强度,在外界的撞击或跌落时容易发生变形,进而损坏装设于电路板的LCD等组件,影响电子装置的使用寿命。
发明内容
有鉴于此,有必要提供一种具有较强强度的电路板组件。
一种电路板组件,其包括电路板、显示模组和加强板,该电路板设有一表面,该显示模组装设于该表面上,所述加强板相对于该显示模组的位置装设于所述电路板另一表面上。
与现有技术相比,所述电路板组件在不改变标准电路板自身结构的情况下,通过装设于电路板上的加强板,有效防止因冲击力使电路板形变,进而保护了显示模组,增加了便携式电子装置的使用寿命。
附图说明
图1为本发明的电路板组件较佳实施例的立体示意图。
图2为图1所示的电路板组件的立体分解示意图。
图3为本发明电路板组件的另一较佳实施例的分解示意图。
主要元件符号说明
  电路板   10
  表面   11
  背面   12
  容置槽   13
  加强板   20、40
  显示模组   30
  液晶显示面板   31
  电路模块   32
  端部   41
  侧肋   42
具体实施方式
本发明电路板组件适于装设于移动电话、个人数位助理(personal digital assistant,PDA)等便携式电子装置(图未示)上。请参阅图1及图2,本发明实施例电路板组件包括一电路板10、一加强板20和一显示模组30。所述显示模组30包括液晶显示面板31和设于液晶显示面板31一端的电路模块32。
所述电路板10大致为一厚度很薄的长方形板,其设有一表面11和一与表面11相对的背面12。所述表面11上一端处设有一矩形容置槽13,用以固定所述显示模组30,所述电路模块32位于容置槽13的一端。
图2所示实施例中,所述加强板20为矩形薄板,具有较强的强度,其通过粘贴、热熔等方式固定于所述电路板10的背面12上,并与设有容置槽13的位置上相对准。
所述加强板20装设于电路板10上,当便携式电子装置受到冲击时,该加强板20能有效地对抗冲击对电路板10及显示模组30的形变,从而避免损坏的产生。
图3所示本发明另一实施例中的电路板组件,与前述实施例不同的地方在于所述加强板40为“∏”形薄板,具有较强的强度。所述加强板40包括一端部41和由端部41两侧平行端部41延伸的侧肋42。所述加强板40通过黏贴、热熔等方式固定于所述电路板10的背面12上,所述端部41与电路模块32位置上相对准,所述侧肋42与所述容置槽13内液晶显示面板31两侧位置上相对准。所述端部41及所述侧肋42可以达到局部补强作用。
可以理解,所述加强板的形状不限于上述两种实施例,只要可以对电路板上的显示模组及显示模组重要元件达到保护作用即可。
所述电路板组件在不改变标准电路板自身结构的情况下,通过装设于电路板上的加强板,有效防止因冲击力使电路板形变,进而保护了显示模组,增加了便携式电子装置的使用寿命。
另外,本领域技术人员还可在本发明权利要求公开的范围和精神内做其它形式和细节上的各种修改、添加和替换。当然,这些依据本发明精神所做的各种修改、添加和替换等变化,都应包含在本发明所要求保护的范围之内。

Claims (2)

1.一种电路板组件,其包括电路板和显示模组,该电路板设有一表面,该显示模组装设于该表面上,其特征在于:该电路板组件还包括加强板,所述加强板相对于该显示模组的位置装设于所述电路板另一表面上,所述加强板包括一端部和由端部相对两侧分别平行延伸的侧肋,所述显示模组包括液晶显示面板和设于液晶面板一端的电路模组,所述端部与所述电路模组位置相对,所述二侧肋与所述液晶显示面板两侧位置相对。
2.如权利要求1所述的电路板组件,其特征在于:所述表面上设有一容置槽,所述显示模组装设于所述容置槽内。
CN201010154333.1A 2010-04-23 2010-04-23 电路板组件 Expired - Fee Related CN102238802B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201010154333.1A CN102238802B (zh) 2010-04-23 2010-04-23 电路板组件
US12/868,826 US20110261281A1 (en) 2010-04-23 2010-08-26 Lcd assembly and portable electronic device utilizing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010154333.1A CN102238802B (zh) 2010-04-23 2010-04-23 电路板组件

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CN102238802A CN102238802A (zh) 2011-11-09
CN102238802B true CN102238802B (zh) 2014-04-30

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150105569A (ko) 2014-03-07 2015-09-17 삼성디스플레이 주식회사 표시 장치
CN107205666A (zh) 2014-11-07 2017-09-26 伟伦公司 医疗设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2768390Y (zh) * 2005-01-07 2006-03-29 倚天资讯股份有限公司 电磁遮蔽装置
CN1922850A (zh) * 2004-02-27 2007-02-28 日本电气株式会社 卡式移动电话机
CN201251662Y (zh) * 2008-09-01 2009-06-03 胜华科技股份有限公司 液晶模块结构
CN101477274A (zh) * 2007-12-07 2009-07-08 三星电子株式会社 液晶显示器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100281537B1 (ko) * 1998-04-03 2001-03-02 윤종용 다수 개의 디바이스들을 장착 할 수 있는 프레임을 갖는 휴대형컴퓨터
JP3659810B2 (ja) * 1998-08-05 2005-06-15 パイオニア株式会社 二次元表示装置の駆動モジュール取付構造
JP4185678B2 (ja) * 2001-06-08 2008-11-26 株式会社日立製作所 液晶表示装置
GB2404072B (en) * 2003-07-15 2006-08-30 Research In Motion Ltd Foam support for mobile electronic device display
US7697275B2 (en) * 2004-09-03 2010-04-13 Research In Motion Limited Shock resistant mounting for small display screen
TWI354155B (en) * 2005-07-22 2011-12-11 Sony Corp Display
TWM352223U (en) * 2008-07-17 2009-03-01 Wintek Corp Flexible printed circuit and liquid crystal module using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1922850A (zh) * 2004-02-27 2007-02-28 日本电气株式会社 卡式移动电话机
CN2768390Y (zh) * 2005-01-07 2006-03-29 倚天资讯股份有限公司 电磁遮蔽装置
CN101477274A (zh) * 2007-12-07 2009-07-08 三星电子株式会社 液晶显示器
CN201251662Y (zh) * 2008-09-01 2009-06-03 胜华科技股份有限公司 液晶模块结构

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