CN102234776A - Magnetron sputtering apparatus - Google Patents
Magnetron sputtering apparatus Download PDFInfo
- Publication number
- CN102234776A CN102234776A CN201010152918XA CN201010152918A CN102234776A CN 102234776 A CN102234776 A CN 102234776A CN 201010152918X A CN201010152918X A CN 201010152918XA CN 201010152918 A CN201010152918 A CN 201010152918A CN 102234776 A CN102234776 A CN 102234776A
- Authority
- CN
- China
- Prior art keywords
- fixedly arranged
- target
- anode
- sputter
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001755 magnetron sputter deposition Methods 0.000 title abstract 2
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 238000004544 sputter deposition Methods 0.000 claims abstract description 28
- 230000004308 accommodation Effects 0.000 claims abstract description 15
- 230000000712 assembly Effects 0.000 claims abstract description 8
- 238000000429 assembly Methods 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 10
- 230000008676 import Effects 0.000 claims description 4
- 239000000376 reactant Substances 0.000 claims description 4
- 239000013077 target material Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Images
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a magnetron sputtering apparatus which comprises a housing body, a target source, a bearing pedestal and a drive unit. The housing comprises an outer shell and an inner shell in the outer shell. The target source is fixedly arranged between the outer shell and the inner shell, and the target source and the inner shell separate the outer shell as sputtering space and accommodation space. The target source is close to a top of the sputtering space. The target source comprises two cooling substrates, two magnetic assemblies and target material. The magnetic assemblies are arranged between the two cooling substrates. The target material is fixedly arranged on the cooling substrates under the magnetic assemblies. Each magnetic assembly comprises a support arm and a plurality of magnets which are fixedly arranged on the support arm. The bearing pedestal is fixedly arranged at a bottom of the sputtering space. The drive unit comprises a linear motor which includes a stator and a rotor, wherein the stator is fixedly arranged in the accommodation space. The two support arms of the magnetic assemblies are fixedly arranged at two ends of the rotor. The magnets above the target material rotate around the support arms and move along extension directions of the support arms simultaneously, thus magnetic field loaded on the target material becomes more uniform.
Description
Technical field
The present invention relates to a kind of sputter technology, relate in particular to a kind of anode for sputter coating.
Background technology
The column type anode for sputter coating generally comprises cylinder-like shell, a cylindrical tube shape target and a magnet set that places in this cylindrical tube shape target that places in this cylinder-like shell.This magnet set generally is made up of a plurality of independently magnet, and this magnet set forms a stack magnetic field.Because independently of one another between a plurality of magnet, this stack magnetic field is generally all inhomogeneous in the distribution of this target material surface.During sputter, the regional electronics concentration degree that the target material surface magneticstrength is high is higher, and the frequency that this part target is bombarded is therefore also higher.After using repeatedly, this part target consumes more with respect to the target of other magneticstrength lower part.Clean when this part target consumption, when needing to change target, other parts are but also surplus target, and target utilization is low.
Summary of the invention
In view of this, be necessary the anode for sputter coating that provides a kind of target utilization high.
A kind of anode for sputter coating, it comprises a housing, a target source, a bearing base and a drive unit; Described housing comprises shell and is fixedly arranged on the interior inner casing of shell; Described target source is fixedly arranged between described shell and the inner casing, and target source and inner casing will be divided into a sputter space and an accommodation space in the shell; Described target source is close to sputter spatial top and is provided with, and this target source comprises two cooling bases, two magnet assemblies and a target, and described magnet assembly is between two cooling bases, and target is fixedly arranged on the cooling base of magnet assembly below; Described each magnet assembly comprises a sway brace and a plurality of magnet that is fixedly arranged on the sway brace; Described bearing base is fixedly arranged on bottom, sputter space, and relative with described target; Described drive unit comprises a linear motor, and described linear motor comprises a stator and a rotor, and described stator is fixedly arranged in the accommodation space, and two sway braces of described magnet assembly are fixedly arranged on two ends of rotor.
Anode for sputter coating provided by the invention not only can rotate around sway brace by the magnet that linear motor control is positioned at the target top, can also move along the sway brace bearing of trend, thereby the magnetic field that magnet is carried on target becomes even, target is consumed in the sputter process evenly, and then improve the utilization ratio of target.
Description of drawings
Fig. 1 is the sectional view of the anode for sputter coating that provides of first embodiment of the invention.
Fig. 2 is the sectional view of the anode for sputter coating that provides of second embodiment of the invention.The main element nomenclature
Anode for sputter coating 100
Shell 10a
Sputter space 11
Reactant gases import system 13
Sway brace 221
CD-ROM drive motor 41
Embodiment
Below with reference to the drawings, the present invention is described in further detail.
As shown in Figure 1, be a kind of anode for sputter coating 100 that first embodiment of the invention provides, plated film is carried out on its surface that is used to treat sputter workpiece 200; Described anode for sputter coating 100 comprises a housing 10, a target source 20, a bearing base 30 and a drive unit 40.
Described housing 10 comprises that a shell 10a and is fixedly arranged on the inner casing 10b of shell 10a center, described target source 20 is fixedly arranged between described shell 10a and the inner casing 10b, and this target source 20 and inner casing 10b are divided into a sputter space 11 and an accommodation space 12 with the internal space of shell 10a.Described shell 10a outer setting one a reactant gases import system 13 and a vacuum evacuating system 14, and described reactant gases import system 13 and vacuum evacuating system 14 all are connected with described sputter space 11.
Described target source 20 comprises two cooling bases 21, two magnet assemblies 22 and targets 23, and described two magnet assemblies 22 are suspended between two cooling bases 21.Described two cooling bases 21 all are circular ring, and be connected between inner casing 10b and the shell 10a at the cooling base 21 above the described magnet assembly 22 and in the compartment of terrain that is parallel to each other of the cooling base 21 below the described magnet assembly 22, described shell 10a, inner casing 10b and two cooling bases 21 form described accommodation spaces 12.All be provided with the cooling channel in described two cooling bases 21 and two cooling channels 211 are interconnected.Each magnet assembly 22 comprises a sway brace 221 and a plurality of magnet 222 that is fixedly arranged on the sway brace 221, and described magnet 222 is co-axial ring-shaped magnet, and the polarity of adjacent two magnet 222 is opposite.Described target 23 is fixedly arranged on the cooling base 21 of described magnet assembly 22 belows, and is loaded with a plate supply Vcc+ on this cooling base 21.
Described bearing base 30 is structure in the form of a ring, its be fixedly arranged on the bottom side of described shell 10a and be positioned at sputter space 11 the bottom and with described target 23 corresponding settings, this bearing base 30 is used to carry the described sputter workpiece 200 for the treatment of.Be loaded with a cathode power Vcc-on the described bearing base 30.
Described drive unit 40 is arranged in the described accommodation space 12, and it comprises a CD-ROM drive motor 41, a transmission rod 42, a linear motor 43 and a bearing 44.Described CD-ROM drive motor 41 comprises a drive source 411 and a driving stem 412, and described drive source 411 is fixedly arranged on the shell 10a of bottom of described accommodation space 12.Described linear motor 43 comprises a stator 431 and a rotor 432.Described driving stem 412 is fixedly arranged on an end of described transmission rod 42, and the axis of driving stem 412 and transmission rod 42 is on same straight line, and described stator 431 is fixedly arranged on the other end of transmission rod 42, and the axis of rotor 432 is vertical mutually with the axis of transmission rod 42.The sway brace 221 of described magnet assembly 22 is fixedly arranged on the two ends of rotor 432.Described transmission rod 42 is sheathed in the bearing 44, and described bearing 44 is installed between the inner casing 10b.
As shown in Figure 2, the anode for sputter coating 100a of second kind of embodiment provided by the invention, anode for sputter coating 100 different being that it provides with first embodiment: described cooling base 21 above magnet assembly 22 be circular and be fixedly arranged on inner casing 10b and shell 10a between, described cooling base 21 below magnet assembly 22 is in the form of annular discs and be fixedly arranged between the shell 10a; Described drive source 411 is fixedly arranged on the shell 10a at top of described accommodation space 12.The anode for sputter coating 100a that present embodiment provides makes that the shared space of accommodation space 12 is less, and makes the cooling base 21 near sputter space 11 can be designed as circle, thereby can place more target 23; Simultaneously, described bearing base 30 also can be designed to circle, thereby can place the more or bigger sputter workpiece 200 for the treatment of.
Before sputter began, described vacuum evacuating system 14 had been pumped into 1.3 * 10 with sputter space 11
-3Behind the vacuum state of Pa, charge into rare gas element argon gas (Ar) to sputter space 11 again.Then, unlatching is carried in cooling base 21 plate supply Vcc+ and is carried in cathode power Vcc-on the bearing base 30, thereby between cooling base 21 and bearing base 30, form high-voltage potential, because the electron excitation rare gas element that glow discharge (glowdischarge) produces, produce plasma gas, described plasma gas is driven the atom of metal targets out of under the effect in the magnetic field of described magnet 222, is deposited on to treat on the sputter workpiece 200.
Described CD-ROM drive motor 41 drives the axis rotation of described magnet assembly 22 around described driving stem 412, thereby makes whole target 23 surfaces can both be loaded into magnetic field.Described linear motor 43 drives the bearing of trend to-and-fro movement of magnet assembly 22 along sway brace 221, also and then moves in the magnetic field that makes a plurality of magnet 222 produce.Thereby make that the magnetic field that is carried in target 23 surfaces is alternately strong and weak, the magnetic field that is carried in target 23 surfaces during with these a plurality of magnet 222 transfixions is compared, the magnetic field that be carried in target 23 surfaces this moment become relative evenly, and then make the surface of target 23 be bombarded uniformly by plasma gas, improved the utilization ratio of target 23.
The anode for sputter coating that embodiment of the present invention provides not only can rotate around sway brace by the magnet that linear motor control is positioned at the target top, can also move along the sway brace bearing of trend, thereby the magnetic field that magnet is carried on target becomes even, target is consumed in the sputter process evenly, and then improve the utilization ratio of target.
Be understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (8)
1. anode for sputter coating, it comprises a housing, a target source, a bearing base and a drive unit; Described housing comprises shell and is fixedly arranged on the interior inner casing of shell; Described target source is fixedly arranged between described shell and the inner casing, and target source and inner casing will be divided into a sputter space and an accommodation space in the shell; Described target source is close to sputter spatial top and is provided with, and this target source comprises two cooling bases, two magnet assemblies and a target, and described magnet assembly is between two cooling bases, and described target is fixedly arranged on the cooling base of magnet assembly below; Described each magnet assembly comprises a sway brace and a plurality of magnet that is fixedly arranged on the sway brace; Described bearing base is fixedly arranged on bottom, sputter space, and relative with described target; Described drive unit comprises a linear motor, and described linear motor comprises a stator and a rotor, and described stator is fixedly arranged in the accommodation space, and two sway braces of described magnet assembly are fixedly arranged on two ends of rotor.
2. anode for sputter coating as claimed in claim 1 is characterized in that: described drive unit also comprises a transmission rod and a CD-ROM drive motor, and an end of described transmission rod and the stator of described linear motor fix, and the other end and described CD-ROM drive motor fix.
3. anode for sputter coating as claimed in claim 2 is characterized in that: described CD-ROM drive motor comprises a drive source and a driving stem, and described drive source is fixedly arranged on the shell of accommodation space bottom, and described driving stem and transmission rod are fixedly connected.
4. anode for sputter coating as claimed in claim 2 is characterized in that: described CD-ROM drive motor comprises a drive source and a driving stem, and described drive source is fixedly arranged on the shell at accommodation space top, and described driving stem and transmission rod are fixedly connected.
5. anode for sputter coating as claimed in claim 1 is characterized in that: described anode for sputter coating comprises a cathode power and a plate supply, and described cathode power is connected with the cooling base that sets firmly target, and described plate supply is connected with bearing base.
6. anode for sputter coating as claimed in claim 1 is characterized in that: described anode for sputter coating comprises a reactant gases import system and a vacuum evacuating system that is connected with the sputter space.
7. anode for sputter coating as claimed in claim 1 is characterized in that: described target source in the form of a ring, described magnet is a plurality of co-axial ring-shaped magnets, and the polarity of adjacent two magnet is opposite.
8. anode for sputter coating as claimed in claim 1 is characterized in that: described sputter space is an annulated column shape structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010152918XA CN102234776A (en) | 2010-04-22 | 2010-04-22 | Magnetron sputtering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010152918XA CN102234776A (en) | 2010-04-22 | 2010-04-22 | Magnetron sputtering apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102234776A true CN102234776A (en) | 2011-11-09 |
Family
ID=44885889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010152918XA Pending CN102234776A (en) | 2010-04-22 | 2010-04-22 | Magnetron sputtering apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102234776A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108920032A (en) * | 2018-08-28 | 2018-11-30 | 余泽军 | A kind of production technology of touch screen |
| CN108977785A (en) * | 2018-08-28 | 2018-12-11 | 余泽军 | A kind of anode for sputter coating |
| CN109055909A (en) * | 2018-08-28 | 2018-12-21 | 余泽军 | A kind of equipment bombarded workpiece surface using energetic plasma and form smooth plating layer |
| CN109055907A (en) * | 2018-08-28 | 2018-12-21 | 杨胜 | A kind of magnetic control sputtering plating equipment |
| CN109055908A (en) * | 2018-08-28 | 2018-12-21 | 杨胜 | A kind of electronics surface of shell plating process |
| CN109182988A (en) * | 2018-08-28 | 2019-01-11 | 余泽军 | A kind of plastic casing process of surface treatment |
| CN110344009A (en) * | 2018-04-04 | 2019-10-18 | 长鑫存储技术有限公司 | Magnetron sputtering system with magnetized cooling water device and magnetron sputtering equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0525626A (en) * | 1990-01-26 | 1993-02-02 | Varian Assoc Inc | Rotational sputtering device for selected corrosion |
| CN1107523A (en) * | 1993-11-24 | 1995-08-30 | 应用材料有限公司 | Integrated sputter target assembly |
| CN1130215A (en) * | 1994-11-30 | 1996-09-04 | 美国电报电话公司 | Method and equipment for plane magnetic control sputtering plating |
| US6086730A (en) * | 1999-04-22 | 2000-07-11 | Komag, Incorporated | Method of sputtering a carbon protective film on a magnetic disk with high sp3 content |
| US6132565A (en) * | 1999-10-01 | 2000-10-17 | Taiwan Semiconductor Manufacturing Company, Ltd | Magnetron assembly equipped with traversing magnets and method of using |
| JP2000309867A (en) * | 1999-02-22 | 2000-11-07 | Tadahiro Omi | Magnet rotating sputtering system |
| US6641701B1 (en) * | 2000-06-14 | 2003-11-04 | Applied Materials, Inc. | Cooling system for magnetron sputtering apparatus |
| JP2005232554A (en) * | 2004-02-20 | 2005-09-02 | Tokyo Electron Ltd | Sputtering system |
| CN1776002A (en) * | 2004-11-19 | 2006-05-24 | 应用菲林股份有限两合公司 | Cooling backing plate for one sputtering target and sputtering target consisting of several backing plates |
-
2010
- 2010-04-22 CN CN201010152918XA patent/CN102234776A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0525626A (en) * | 1990-01-26 | 1993-02-02 | Varian Assoc Inc | Rotational sputtering device for selected corrosion |
| CN1107523A (en) * | 1993-11-24 | 1995-08-30 | 应用材料有限公司 | Integrated sputter target assembly |
| CN1130215A (en) * | 1994-11-30 | 1996-09-04 | 美国电报电话公司 | Method and equipment for plane magnetic control sputtering plating |
| JP2000309867A (en) * | 1999-02-22 | 2000-11-07 | Tadahiro Omi | Magnet rotating sputtering system |
| US6086730A (en) * | 1999-04-22 | 2000-07-11 | Komag, Incorporated | Method of sputtering a carbon protective film on a magnetic disk with high sp3 content |
| US6132565A (en) * | 1999-10-01 | 2000-10-17 | Taiwan Semiconductor Manufacturing Company, Ltd | Magnetron assembly equipped with traversing magnets and method of using |
| US6641701B1 (en) * | 2000-06-14 | 2003-11-04 | Applied Materials, Inc. | Cooling system for magnetron sputtering apparatus |
| JP2005232554A (en) * | 2004-02-20 | 2005-09-02 | Tokyo Electron Ltd | Sputtering system |
| CN1776002A (en) * | 2004-11-19 | 2006-05-24 | 应用菲林股份有限两合公司 | Cooling backing plate for one sputtering target and sputtering target consisting of several backing plates |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110344009A (en) * | 2018-04-04 | 2019-10-18 | 长鑫存储技术有限公司 | Magnetron sputtering system with magnetized cooling water device and magnetron sputtering equipment |
| CN108920032A (en) * | 2018-08-28 | 2018-11-30 | 余泽军 | A kind of production technology of touch screen |
| CN108977785A (en) * | 2018-08-28 | 2018-12-11 | 余泽军 | A kind of anode for sputter coating |
| CN109055909A (en) * | 2018-08-28 | 2018-12-21 | 余泽军 | A kind of equipment bombarded workpiece surface using energetic plasma and form smooth plating layer |
| CN109055907A (en) * | 2018-08-28 | 2018-12-21 | 杨胜 | A kind of magnetic control sputtering plating equipment |
| CN109055908A (en) * | 2018-08-28 | 2018-12-21 | 杨胜 | A kind of electronics surface of shell plating process |
| CN109182988A (en) * | 2018-08-28 | 2019-01-11 | 余泽军 | A kind of plastic casing process of surface treatment |
| CN109055909B (en) * | 2018-08-28 | 2020-08-07 | 广东腾胜真空技术工程有限公司 | Equipment for bombarding surface of workpiece by using high-energy plasma and forming smooth coating |
| CN109055907B (en) * | 2018-08-28 | 2020-11-06 | 安徽豪鼎金属制品有限公司 | Magnetron sputtering equipment |
| CN109055908B (en) * | 2018-08-28 | 2020-11-10 | 淮北中易光电科技有限公司 | Surface coating process for electronic equipment shell |
| CN109182988B (en) * | 2018-08-28 | 2020-12-08 | 陈光贡 | Plastic shell surface treatment process |
| CN108920032B (en) * | 2018-08-28 | 2021-04-30 | 湖南裕宁电子有限公司 | Production process of touch screen |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102234776A (en) | Magnetron sputtering apparatus | |
| KR102188022B1 (en) | Configurable variable position closed track magnetron | |
| JP6055013B2 (en) | Composite plating method for neodymium iron boron rare earth permanent magnet parts | |
| KR101725431B1 (en) | Pvd rf dc open/closed loop selectable magnetron | |
| US8580094B2 (en) | Magnetron design for RF/DC physical vapor deposition | |
| JP2006083408A (en) | Vacuum deposition system | |
| CN103789736A (en) | Apparatus and method for sputtering a target using a magnet unit | |
| CN108374154A (en) | Diamond-like coating preparation facilities with resultant field and its application | |
| US9028659B2 (en) | Magnetron design for extended target life in radio frequency (RF) plasmas | |
| CN213203180U (en) | Sputtering coating equipment | |
| US20110056829A1 (en) | Cathode unit and sputtering apparatus provided with the same | |
| CN114875358A (en) | A kind of composite vacuum coating equipment and using method thereof | |
| CN110093589B (en) | Vacuum magnetron sputtering coating device for preparing graded neutral density filter | |
| KR20130136856A (en) | Sputtering source and cylindrical sputtering apparatus including the same | |
| CN101646799B (en) | Magnetron source for deposition on large substrates | |
| CN106591783A (en) | Magnetic confinement vacuum ion film plating device | |
| CN105671509A (en) | Spherical target cathode mechanism and sputter coating device | |
| JP2000319780A (en) | Sputtering cathode and magnetron type sputtering device equipped with the same | |
| KR20130136858A (en) | Sputtering apparatus | |
| JP2014141724A (en) | Plasma cvd device with arc evaporation source | |
| JP2005232554A (en) | Sputtering system | |
| CN102064076A (en) | Eccentricity-variable magnetron | |
| JP2006037127A (en) | Sputter electrode structure | |
| CN114645255A (en) | Magnetized electron series resonance method and device thereof | |
| JP2005272948A (en) | Plasma enhanced chemical vapor deposition system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111109 |