CN102223762A - High-precision jacquard glass fiber fabric - Google Patents
High-precision jacquard glass fiber fabric Download PDFInfo
- Publication number
- CN102223762A CN102223762A CN 201010145425 CN201010145425A CN102223762A CN 102223762 A CN102223762 A CN 102223762A CN 201010145425 CN201010145425 CN 201010145425 CN 201010145425 A CN201010145425 A CN 201010145425A CN 102223762 A CN102223762 A CN 102223762A
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- CN
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- Prior art keywords
- circuit board
- printed circuit
- jacquard
- high accuracy
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004744 fabric Substances 0.000 title claims abstract description 26
- 239000003365 glass fiber Substances 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims description 16
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 8
- 239000007767 bonding agent Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000012752 auxiliary agent Substances 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 239000012766 organic filler Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 238000009941 weaving Methods 0.000 claims description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000004640 Melamine resin Substances 0.000 claims description 3
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- -1 benzo diaminourea triazine Chemical compound 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 3
- 239000003085 diluting agent Substances 0.000 claims description 3
- 150000002118 epoxides Chemical class 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 claims description 3
- 239000003999 initiator Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- 229910003465 moissanite Inorganic materials 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910052682 stishovite Inorganic materials 0.000 claims description 3
- 229910052905 tridymite Inorganic materials 0.000 claims description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 230000008602 contraction Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
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- Woven Fabrics (AREA)
Abstract
本发明提供一种高精度印刷电路板的制作方法，采用提花公知织造高精度提花玻璃纤维布基材，将基材预裁剪后浸渍粘合剂并烘干，冷却后根据实际电路进行精确裁剪，并对其进行表面处理、电镀和蚀刻从而获得本发明的高精度印刷电路板。本发明的高精度印刷电路板可以满足小型化、高精度、大批量、高效率生产的需求，具有十分广阔的市场前景。
The invention provides a method for manufacturing a high-precision printed circuit board. The known jacquard weaves a high-precision jacquard glass fiber cloth base material, pre-cuts the base material, impregnates the adhesive and dries it, and then performs precise cutting according to the actual circuit after cooling. And it is subjected to surface treatment, electroplating and etching to obtain the high-precision printed circuit board of the present invention. The high-precision printed circuit board of the invention can meet the requirements of miniaturization, high precision, large batch and high efficiency production, and has very broad market prospects.
Description
Technical field
The present invention relates to a kind of manufacture method of printed circuit board (PCB), it relates more specifically to a kind of is the method that base material is made printed circuit board (PCB) with the jacquard weave glass fabric, and it can be applicable to high density, the installation of high-precision electronic component.
Background technology
In recent years, along with the continuous development of electronic product to miniaturization, slimming, lightweight, high performance, printed circuit board (PCB) wherein but need be installed more electronic component on littler area when size constantly diminishes, and in the production method of present formation scale, consideration for production efficiency, generally adopt the method for the automatic inserting electronic components of streamline, for so automatic plug-in mounting technology, require the electronic component of each plug-in mounting to be accurately positioned on the printed circuit board (PCB).
Printed circuit board (PCB) of the prior art adopts the glass fabric of being made by glass fibre as base material usually, a large amount of plain weave glass fabrics that are made into by air-jet loom that use in the prior art, because warp thread and weft yarn can form the interlacing point of projection on its surface, therefore its surface smoothness is relatively poor can't satisfy high accuracy usually, the making demand of high density circuit board, simultaneously, because can producing in the follow-up resin-bonding and the pressing technology of heating, glass fibre expands and/or contraction, and the diagonal angle edge warping that the pilotaxitic texture of warp thread weft yarn can show as base material with this trickle expansion and/or contraction in the plain cloth, this especially is not suitable for high accuracy, high density circuit board.
Also use the glass mat of making by nonwovens process in the prior art, but for this non-woven fiberglass felt, though can guarantee its surface smoothness to a certain extent by laminating technology, but because process requirements, the thickness of this fibrofelt is thicker usually, this does not obviously meet the demand of miniaturization, high accuracy, high density circuit board, simultaneously, certain warpage also can take place in this fibrofelt after subsequent treatment, this can't satisfy the demand of high accuracy, high density inserting electronic components equally.
Therefore, along with the continuous development of circuit microminiaturization and circuit board component densification, the demand that solves high accuracy inserting electronic components on the printed circuit board (PCB) also becomes more urgent.
Summary of the invention
Defective at printed circuit board (PCB) in the prior art, the technical problem to be solved in the present invention is the problem of glass fabric substrate surface out-of-flatness in the prior art, easy warpage, and surfacing of a kind of electronic component plug-in mounting and the difficult print circuit plates making method that warpage takes place are provided.
For solving this technical problem, the present invention realizes by the following technical solutions:
A kind of manufacture method of high accuracy printed circuit board (PCB), comprise the steps: that jacquard process weaves high accuracy jacquard weave glass fabric base material: choose the individual glass fibers or the twist 1.4～2.0 low twist glass fibre between changeing/50 millimeters and carry out jacquard weaving as warp thread and weft yarn, wherein said warp thread and weft yarn form the roughly figured pattern of circuitry shapes; Pre-cut: carry out cutting according to default figured pattern; Dip bonding agent: with the glass fabric dip bonding agent after the cutting, adhesive comprises the raw material of following weight portion: 45～55 parts phenolic resins, 35～45 parts epoxy resin, 20～40 parts solvent, and 5～35 parts auxiliary agent, described solvent is selected from one or more in dimethyl formamide, glycol monoethyl ether, butanone, acetone, cyclohexanone, propylene glycol monomethyl ether, 1-Methoxy-2-propyl acetate and the toluene, and described auxiliary agent comprises epoxide diluent, silicon dioxide, fire retardant, curing initiator and crosslinking coagent; Add particulate filler in the adhesive in addition, described particulate filler comprises inorganic filler and/or organic filler, inorganic filler is selected from one or more among SiC, SiO2, TiO2, Al2O3, MgO and the AlN, and organic filler is selected from one or more in benzo diaminourea triazine, polyamide, polyimides, melamine resin, the epoxy resin; Oven dry: dried 0.5～1.5 hour for 180～250 ℃; Carry out accurate cutting according to side circuit plate size more after cooling, and after it is carried out surface treatment, plating and etching, promptly can obtain high accuracy printed circuit board (PCB) of the present invention.
By in the zone of glass fabric surface, forming figured pattern corresponding to circuit, and warp thread and weft yarn be made into roughly circuitry shapes, can be so that even trickle expansion and/or contraction take place in glass fibre, also can guarantee basicly stable at the entire circuit relative position, thereby guarantee that the relative position between each plug-in mounting position uncertain variation can not take place; Adopt the combination of adhesive and filler as described in the present invention, can guarantee that the dielectric constant of printed circuit board (PCB) is lower, dielectric loss is less.
According to the manufacture method of high accuracy printed circuit board (PCB) as described in the present invention, it is higher to obtain surface smoothness, and work tolerable temperature is higher, frequency is higher, dielectric constant is lower, dielectric loss is less printed circuit board (PCB) has satisfied the demand of industry well.
Description of drawings
Fig. 1 is the partial schematic diagram of high-accuracy glass fiber cloth first embodiment of the present invention;
Fig. 2 is the partial schematic diagram of high-accuracy glass fiber cloth second embodiment of the present invention;
Specific embodiments
Describe concrete technical scheme of the present invention in detail below by several preferred embodiments
Embodiment 1
Jacquard weaving: the glass fibre of choosing diameter 0.009～0.05mm, be made into as shown in Figure 1 circuit region by loop selection technology, because the jacquard fabric width is usually about 190～350 centimetres, therefore on the width of whole glass fabric, can form a plurality of identical circuit regions as shown in Figure 1 as required, to satisfy the demand that modernization is produced in batches, Fig. 1 central circuit zone is exactly the zone that default needs form circuit, in this embodiment, warp thread 1 only can be seen in the front of this fabric, and the one side of carrying electronic component only has warp thread 1 or weft yarn 2 when promptly forming printed circuit board (PCB) at last.Other parts beyond the middle section are transitional regions on every side, warp thread 1 and the weft yarn 2 formation plain weave that normally interweaves, thus form firm braiding structure.
Pre-cut: according to the jacquard weave shape that forms the central circuit zone, carry out cutting, transitional region around the reserve part can keep basic shape to guarantee the glass fabric that cutting obtains.
The dip bonding agent: the high-accuracy glass fiber cloth that cutting is obtained is immersed in the adhesive, described adhesive comprises the raw material of following weight portion: 45～55 parts phenolic resins, 35～45 parts epoxy resin, 20～40 parts solvent, and 5～35 parts auxiliary agent, described solvent is selected from one or more in dimethyl formamide, glycol monoethyl ether, butanone, acetone, cyclohexanone, propylene glycol monomethyl ether, 1-Methoxy-2-propyl acetate and the toluene, and described auxiliary agent comprises epoxide diluent, silicon dioxide, fire retardant, curing initiator and crosslinking coagent.Add particulate filler in the adhesive in addition, described particulate filler comprises inorganic filler and/or organic filler, inorganic filler is selected from one or more among SiC, SiO2, TiO2, Al2O3, MgO and the AlN, and organic filler is selected from one or more in benzo diaminourea triazine, polyamide, polyimides, melamine resin, the epoxy resin
As preferred implementation of the present invention, the solvent in the adhesive that printed circuit board (PCB) uses is preferably dimethyl formamide and butanone, also can comprise other one or more mixed solvents, can mix by arbitrary proportion.
Oven dry: the glass fabric of dip bonding agent is taken out, 180～250 ℃ of oven dry of temperature 1 hour.
Carry out accurate cutting according to side circuit plate size again after the cooling, and after it is carried out surface treatment, plating and etching, promptly can obtain high accuracy printed circuit board (PCB) of the present invention.
In addition, according to the application scenario difference of printed circuit board (PCB), can select the stacked dipping again of the high-accuracy glass fiber cloth of polylith dip bonding agent, the multilayer high accuracy substrate for printed circuit board of satisfying the demand by stacked acquisition thickness, hardness etc.
Compare with embodiment 1, the central circuit zone had the zone that several warp thread 1 and weft yarn 2 interweave when difference was that jacquard is weaved, this woven areas can design according to the needs of wiring, the Stability Analysis of Structures that it not only can guarantee circuit region in the whole glass fabric in early stage can also be used for last circuit boring etc.
Other steps are with embodiment 1.
In addition, only show the situation that middle section has several point-like woven areas in the present embodiment 2, in fact can design continuous woven areas according to the wiring needs, thereby make the shape of non-woven areas corresponding with the circuitry shapes that needs at last to form, by such design high-accuracy glass fiber cloth, even because glass fibre shrinks in processing procedure or stretches, in the entire circuit zone, the amount basically identical that shrinks or stretch, and its deformation direction is also identical, even therefore certain buckling deformation takes place in the entire circuit plate, uncertain variation can't take place in the relative position relation of entire circuit, and design and the plug-in mounting for high-precision circuit also is very favorable like this.
Embodiment 3
Compare with 2 with embodiment 1, difference is that jacquard weaves the base cloth surface and have a plurality of different circuit regions, i.e. circuitry shapes that can be different according to design on the continuous woven glass fabric of not coexisting of customer demand quantity.
Other steps are with embodiment 1 and 2.
By different circuit regions is set on Width, can satisfy the demand that some small lots can be permitted, can reduce the whole cost of weaving simultaneously.
Claims (1)
1. the manufacture method of a high accuracy printed circuit board (PCB) comprises the steps:
Jacquard process is weaved high accuracy jacquard weave glass fabric base material: choose the low twist glass fibre of individual glass fibers or the twist 1.4～2.0 between changeing/50 millimeters and carry out jacquard weaving as warp thread and weft yarn, wherein said warp thread and weft yarn form the roughly figured pattern of circuitry shapes;
Pre-cut: carry out cutting according to default figured pattern;
Dip bonding agent: with the glass fabric dip bonding agent after the cutting, adhesive comprises the raw material of following weight portion: 45～55 parts phenolic resins, 35～45 parts epoxy resin, 20～40 parts solvent, and 5～35 parts auxiliary agent, described solvent is selected from one or more in dimethyl formamide, glycol monoethyl ether, butanone, acetone, cyclohexanone, propylene glycol monomethyl ether, 1-Methoxy-2-propyl acetate and the toluene, and described auxiliary agent comprises epoxide diluent, silicon dioxide, fire retardant, curing initiator and crosslinking coagent; Add particulate filler in the adhesive in addition, described particulate filler comprises inorganic filler and/or organic filler, inorganic filler is selected from one or more among SiC, SiO2, TiO2, Al2O3, MgO and the AlN, and organic filler is selected from one or more in benzo diaminourea triazine, polyamide, polyimides, melamine resin, the epoxy resin;
Oven dry: dried 0.5～1.5 hour for 180～250 ℃;
Carry out accurate cutting according to side circuit plate size more after cooling, and after it is carried out surface treatment, plating and etching, promptly obtain the high accuracy printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101454253A CN102223762B (en) | 2010-04-13 | 2010-04-13 | High-precision jacquard glass fiber fabric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101454253A CN102223762B (en) | 2010-04-13 | 2010-04-13 | High-precision jacquard glass fiber fabric |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102223762A true CN102223762A (en) | 2011-10-19 |
| CN102223762B CN102223762B (en) | 2012-09-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101454253A Expired - Fee Related CN102223762B (en) | 2010-04-13 | 2010-04-13 | High-precision jacquard glass fiber fabric |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102223762B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104762726A (en) * | 2015-03-30 | 2015-07-08 | 安徽丹凤电子材料股份有限公司 | Production technology for combined glass fiber cloth |
| CN104761139A (en) * | 2015-03-30 | 2015-07-08 | 安徽丹凤电子材料股份有限公司 | Manufacturing method of alkali-free glass cloth |
| CN108978224A (en) * | 2018-06-30 | 2018-12-11 | 江南大学 | A kind of preparation method and method for sorting assigning the multi-functional finishing agent of textile |
| CN116288947A (en) * | 2023-03-21 | 2023-06-23 | 无锡爱勒普科技有限公司 | Composite non-woven fabric for screen printing and preparation method thereof |
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|---|---|---|---|---|
| US6599561B2 (en) * | 2001-11-30 | 2003-07-29 | Kulicke & Soffa Investments, Inc. | Method for manufacturing a printed circuit board substrate |
| US20040012937A1 (en) * | 2002-07-18 | 2004-01-22 | Kulicke & Soffa Investments, Inc. | Method for manufacturing a printed circuit board substrate with passive electrical components |
| CN1498421A (en) * | 2002-01-25 | 2004-05-19 | ���ṫ˾ | Circuit boards for high-frequency modules and high-frequency modules |
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
| CN101147432A (en) * | 2003-08-15 | 2008-03-19 | 英特尔公司 | Circuit board design |
-
2010
- 2010-04-13 CN CN2010101454253A patent/CN102223762B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6599561B2 (en) * | 2001-11-30 | 2003-07-29 | Kulicke & Soffa Investments, Inc. | Method for manufacturing a printed circuit board substrate |
| CN1498421A (en) * | 2002-01-25 | 2004-05-19 | ���ṫ˾ | Circuit boards for high-frequency modules and high-frequency modules |
| US20040012937A1 (en) * | 2002-07-18 | 2004-01-22 | Kulicke & Soffa Investments, Inc. | Method for manufacturing a printed circuit board substrate with passive electrical components |
| CN101147432A (en) * | 2003-08-15 | 2008-03-19 | 英特尔公司 | Circuit board design |
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104762726A (en) * | 2015-03-30 | 2015-07-08 | 安徽丹凤电子材料股份有限公司 | Production technology for combined glass fiber cloth |
| CN104761139A (en) * | 2015-03-30 | 2015-07-08 | 安徽丹凤电子材料股份有限公司 | Manufacturing method of alkali-free glass cloth |
| CN108978224A (en) * | 2018-06-30 | 2018-12-11 | 江南大学 | A kind of preparation method and method for sorting assigning the multi-functional finishing agent of textile |
| CN116288947A (en) * | 2023-03-21 | 2023-06-23 | 无锡爱勒普科技有限公司 | Composite non-woven fabric for screen printing and preparation method thereof |
| CN116288947B (en) * | 2023-03-21 | 2024-01-19 | 无锡爱勒普科技有限公司 | Composite non-woven fabric for screen printing and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN102223762B (en) | 2012-09-12 |
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Granted publication date: 20120912 Termination date: 20140413 |