CN102209432B - PCB (Printed Circuit Board), LED (Light Emitting Diode) light bar and liquid crystal display device - Google Patents
PCB (Printed Circuit Board), LED (Light Emitting Diode) light bar and liquid crystal display device Download PDFInfo
- Publication number
- CN102209432B CN102209432B CN2011101368549A CN201110136854A CN102209432B CN 102209432 B CN102209432 B CN 102209432B CN 2011101368549 A CN2011101368549 A CN 2011101368549A CN 201110136854 A CN201110136854 A CN 201110136854A CN 102209432 B CN102209432 B CN 102209432B
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- pcb
- installing hole
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- substrate layer
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000004888 barrier function Effects 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000009545 invasion Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000035939 shock Effects 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000011900 installation process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Abstract
The invention is applicable to the field of electronic technologies, and provides a PCB (Printed Circuit Board), an LED (Light Emitting Diode) light bar and a liquid crystal display device. The PCB comprises a substrate layer, an insulating layer and a circuit, wherein the insulating layer is overlapped on the substrate layer; the circuit is distributed on the insulating layer; the insulating layer and the substrate layer are penetrated by a mounting hole; a gasket which is covered by a solder mask layer is arranged around the mounting hole on the insulating layer; and the mounting hole penetrates through the solder mask layer and the gasket. In the invention, the gasket which is covered by the solder mask layer is arranged around the mounting hole, and an external force sequentially acts on the solder mask layer and the gasket when the PCB is fixed on a back panel by screwing a fastener; and even if the solder mask layer is scraped by the fastener, the external force acts on the gasket, so that the insulating layer is protected from being exposed in air to prevent moisture invasion and impact of shock cooling and shock heating, and the reliability of the PCB is greatly improved. The PCB is widely applied to various pieces of electronic equipment, such as the LED light bar, the liquid crystal display device and the like.
Description
Technical field
The invention belongs to electronic technology field, relate in particular to a kind of PCB, LED lamp bar and liquid crystal indicator.
Background technology
In the LED module there be usually the mode of fixed L ED lamp bar now: be screwed or both totally three kinds of modes that have both at the same time by directly pasting with the heat conductive pad of sticky glue or making.Fix by the heat conductive pad with stickiness, it is bad that LED lamp bar is produced, and follow-up doing over again is difficult to remove when producing, and also indirectly increased the cost of module.
Although it is for convenience detach to adopt screw to fix, when fixing the LED lamp bar of being made by existing PCB, destroy easily PCB, cause its reliability low, and then affect the stability of liquid crystal indicator.
Summary of the invention
The PCB that provides a kind of reliability high is provided the purpose of the embodiment of the invention, when being intended to solve fixing existing PCB, PCB is damaged, and causes the low problem of its reliability.
The embodiment of the invention is to realize like this, a kind of PCB, comprise substrate layer, be stacked and placed on the insulating barrier of described substrate layer and be distributed in the circuit of described insulating barrier, described insulating barrier and substrate layer are run through by installing hole, the installing hole border is provided with the pad that is covered by solder mask on the described insulating barrier, described installing hole runs through described solder mask and pad, and the installing hole border is provided with the silk-screen layer that is run through by described installing hole on the described solder mask.
Another purpose of the embodiment of the invention is to provide a kind of LED lamp bar, the above-mentioned PCB of described LED lamp strip adoption.
Another purpose of the embodiment of the invention is to provide a kind of liquid crystal indicator, and described liquid crystal indicator adopts above-mentioned LED lamp bar.
The embodiment of the invention is established the pad that is covered by solder mask in the installing hole border; when securing member screws PCB is fixedly arranged on backboard; external force successively acts on this solder mask and pad; even if the solder mask fastener has scratched; and External Force Acting is in pad, thereby the protection insulating barrier makes it can not be exposed in the air; avoid moisture invasion and attack and suddenly cold and hot impact, greatly promoted the reliability of PCB.This PCB is widely used in various electronic equipments, such as LED lamp bar, liquid crystal indicator etc.
Description of drawings
Fig. 1 is the profile of the PCB that provides of preferred embodiment of the present invention;
Fig. 2 is the profile (after being installed on backboard) of the LED lamp bar that provides of preferred embodiment of the present invention;
Fig. 3 is the schematic top plan view (pad is shown) of the LED lamp bar that provides of preferred embodiment of the present invention;
Fig. 4 is the schematic top plan view (pad and silk-screen layer are shown) of the LED lamp bar that provides of preferred embodiment of the present invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The embodiment of the invention is established the pad that is covered by solder mask in the installing hole border; when securing member screws PCB is fixedly arranged on backboard; external force successively acts on solder mask and pad; even the solder mask fastener has scratched; and pad will be protected insulating barrier; it can be exposed in the air, greatly promote the reliability of PCB.
The PCB that the embodiment of the invention provides comprises substrate layer, be stacked and placed on the insulating barrier of described substrate layer and be distributed in the circuit of described insulating barrier, described insulating barrier and substrate layer are run through by installing hole, the installing hole border is provided with the pad that is covered by solder mask on the described insulating barrier, and described installing hole runs through described solder mask and pad.
The above-mentioned PCB of LED lamp strip adoption that the embodiment of the invention provides.
The liquid crystal indicator that the embodiment of the invention provides adopts above-mentioned LED lamp bar.
Below in conjunction with specific embodiment realization of the present invention is described in detail.
Shown in Fig. 1～4, the PCB that the embodiment of the invention provides comprises substrate layer 1, be stacked and placed on the insulating barrier 2 of this substrate layer 1 and be distributed in the circuit 3 of this insulating barrier 2, and this insulating barrier 2 and substrate layer 1 are run through by installing hole 4.Installing hole 4 borders are provided with the pad 6 that is covered by solder mask 5 on this insulating barrier, and this installing hole 4 runs through this solder mask 5 and pad 6.When screwing securing member 7 PCB being fixedly arranged on backboard 8; external force successively acts on this solder mask 5 and pad 6; even if solder mask 5 fasteners 7 have scratched; make External Force Acting in pad 6; thereby protection insulating barrier 2; it can be exposed in the air, avoid moisture invasion and attack and suddenly cold and hot impact, greatly promoted the reliability of PCB.
For guaranteeing that solder mask 5 is not scratched, installing hole 4 borders are provided with silk-screen layer 9 on solder mask.Above-mentioned installing hole 4 runs through this silk-screen layer 9 simultaneously.When PCB was mounted on backboard 8, securing member 7 at first acted on silk-screen layer 9, and silk-screen layer 9 is wear-resistant, and the PCB endothecium structure is not destroyed, and made PCB more stable, reliable.
Usually, silk-screen layer 9 is latticed, and concentric with installing hole 4.Even silk-screen layer 9 is subject to larger twisting force and makes its generation chip like this, and chip will fall in the grid and by securing member 7 sealings, reduce the pollution of installation process.
Above-mentioned pad 6 is preferably annular copper sheet.The minimum distance of this annular copper sheet and circuit 3 is no more than 2mm, to avoid short circuit.And securing member 7 is preferably and passes installing hole 4 PCB is fixedly arranged on the metallic screw of backboard 8, and makes the external diameter of annular copper sheet greater than the head diameter of this metallic screw, with protection insulating barrier 2.
Should be appreciated that this annular copper sheet can be the annular copper sheet of making simultaneously with circuit.
In addition, substrate layer 1 and insulating barrier 2 adopt respectively metal substrate layer and heat conductive insulating layer.Add the conductive force of metallic screw, so that whole PCB has good heat dispersion, range of application is more extensive.
Shown in Fig. 2,3 and 4, the LED lamp strip adoption paster LED 10 that the embodiment of the invention provides is welded in above-mentioned PCB through backflow and makes.
The embodiment of the invention is established the pad that is covered by solder mask in the installing hole border; when securing member screws PCB is fixedly arranged on backboard; external force successively acts on this solder mask and pad; even if the solder mask fastener has scratched; and External Force Acting is in pad, thereby the protection insulating barrier makes it can not be exposed in the air; avoid moisture invasion and attack and suddenly cold and hot impact, greatly promoted the reliability of PCB.Simultaneously, do not scratched for guaranteeing solder mask, the installing hole border is provided with silk-screen layer on solder mask, makes PCB more stable, reliable.In addition, silk-screen layer is made latticed, and concentric with installing hole, even silk-screen layer is subject to larger twisting force and makes it produce chip like this, and chip will fall in the grid and by the securing member sealing, reduce the pollution of installation process.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. PCB, it passes installing hole by securing member and installs and fixes, comprise substrate layer, be stacked and placed on the insulating barrier of described substrate layer and be distributed in the circuit of described insulating barrier, described insulating barrier and substrate layer are run through by described installing hole, it is characterized in that, the installing hole border is provided with the pad that is covered by solder mask on the described insulating barrier, and described installing hole runs through described solder mask and pad, and the installing hole border is provided with the silk-screen layer that is run through by described installing hole on the described solder mask.
2. PCB as claimed in claim 1 is characterized in that, described silk-screen layer is latticed, is the annulus concentric with described installing hole.
3. PCB as claimed in claim 1 or 2 is characterized in that, described pad is annular copper sheet.
4. PCB as claimed in claim 3 is characterized in that, the minimum distance of described annular copper sheet and described circuit is no more than 2mm.
5. PCB as claimed in claim 3 is characterized in that, described securing member is to pass described installing hole PCB is fixedly arranged on the metallic screw of backboard, and the external diameter of described annular copper sheet is greater than the head diameter of described metallic screw.
6. PCB as claimed in claim 4 is characterized in that, described securing member is to pass described installing hole PCB is fixedly arranged on the metallic screw of backboard, and the external diameter of described annular copper sheet is greater than the head diameter of described metallic screw.
7. PCB as claimed in claim 1 is characterized in that, described substrate layer is metal substrate layer, and described insulating barrier is the heat conductive insulating layer.
8. a LED lamp bar is characterized in that, described LED lamp strip adoption such as the described PCB of claim 1～7.
9. a liquid crystal indicator is characterized in that, described liquid crystal indicator adopts LED lamp bar as claimed in claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101368549A CN102209432B (en) | 2011-05-25 | 2011-05-25 | PCB (Printed Circuit Board), LED (Light Emitting Diode) light bar and liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101368549A CN102209432B (en) | 2011-05-25 | 2011-05-25 | PCB (Printed Circuit Board), LED (Light Emitting Diode) light bar and liquid crystal display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102209432A CN102209432A (en) | 2011-10-05 |
| CN102209432B true CN102209432B (en) | 2013-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101368549A Expired - Fee Related CN102209432B (en) | 2011-05-25 | 2011-05-25 | PCB (Printed Circuit Board), LED (Light Emitting Diode) light bar and liquid crystal display device |
Country Status (1)
| Country | Link |
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| CN (1) | CN102209432B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11083087B2 (en) | 2019-01-10 | 2021-08-03 | Jentech Precision Industrial Co., Ltd. | Insulated metal substrate and manufacturing method thereof |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103188874B (en) * | 2011-12-28 | 2016-01-13 | 北大方正集团有限公司 | The dark milling localization method of a kind of control and printed circuit board (PCB) |
| CN104914620B (en) * | 2015-06-02 | 2019-01-15 | 武汉华星光电技术有限公司 | Lamp bar and backlight module |
| CN106102416B (en) * | 2016-06-28 | 2020-01-10 | Oppo广东移动通信有限公司 | Mobile terminal |
| CN106163084A (en) * | 2016-06-28 | 2016-11-23 | 广东欧珀移动通信有限公司 | PCB board and mobile terminal |
| CN106231864A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Mobile terminal |
| TWI708232B (en) * | 2018-12-05 | 2020-10-21 | 陳冠宇 | Package carrier and light emitting device |
| CN110189626B (en) * | 2019-05-27 | 2021-11-02 | Oppo广东移动通信有限公司 | Display components and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2569525Y (en) * | 2002-08-30 | 2003-08-27 | 技嘉科技股份有限公司 | Circuit board fixing structure |
| CN101193512A (en) * | 2006-11-23 | 2008-06-04 | 英业达股份有限公司 | fixed structure |
| CN201479455U (en) * | 2009-04-16 | 2010-05-19 | 惠州国展电子有限公司 | Metal base flexible circuit copper-clad plate and metal base flexible circuit board |
| CN201504360U (en) * | 2009-07-31 | 2010-06-09 | 宁波三星电气股份有限公司 | pcb |
| CN201797684U (en) * | 2010-08-26 | 2011-04-13 | 张方荣 | Circuit board fixing structure |
| CN102011952A (en) * | 2009-09-04 | 2011-04-13 | 佛山市国星光电股份有限公司 | Method for making LED (Light Emitting Diode) light resource module and product made by the method |
-
2011
- 2011-05-25 CN CN2011101368549A patent/CN102209432B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2569525Y (en) * | 2002-08-30 | 2003-08-27 | 技嘉科技股份有限公司 | Circuit board fixing structure |
| CN101193512A (en) * | 2006-11-23 | 2008-06-04 | 英业达股份有限公司 | fixed structure |
| CN201479455U (en) * | 2009-04-16 | 2010-05-19 | 惠州国展电子有限公司 | Metal base flexible circuit copper-clad plate and metal base flexible circuit board |
| CN201504360U (en) * | 2009-07-31 | 2010-06-09 | 宁波三星电气股份有限公司 | pcb |
| CN102011952A (en) * | 2009-09-04 | 2011-04-13 | 佛山市国星光电股份有限公司 | Method for making LED (Light Emitting Diode) light resource module and product made by the method |
| CN201797684U (en) * | 2010-08-26 | 2011-04-13 | 张方荣 | Circuit board fixing structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11083087B2 (en) | 2019-01-10 | 2021-08-03 | Jentech Precision Industrial Co., Ltd. | Insulated metal substrate and manufacturing method thereof |
| US11388823B2 (en) | 2019-01-10 | 2022-07-12 | Jentech Precision Industrial Co., Ltd. | Insulated metal substrate |
| US12096569B2 (en) | 2019-01-10 | 2024-09-17 | Jentech Precision Industrial Co., Ltd. | Manufacturing method of insulated metal substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102209432A (en) | 2011-10-05 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20200525 |