CN101280891B - Light source module - Google Patents

Abstract

A light source module comprises a circuit board, a light emitting element and a heat dissipation plate. The circuit board is provided with a through hole, and the light-emitting element is arranged on the first side of the circuit board, wherein the position of the light-emitting element corresponds to the through hole. The heat dissipation plate is arranged on the second side of the circuit board and provided with a protruding part corresponding to the through hole and the light-emitting element, wherein the protruding part extends into the through hole towards the direction of the circuit board and is contacted with the light-emitting element.

Description

Light source module

technical field

The invention relates to a light source module, in particular to a light source module with high heat dissipation efficiency.

Background technique

With the advancement of semiconductor and electronic technology, traditional cathode ray tube (CRT) displays have been gradually replaced by flat-panel displays with small size and low radiation. Generally speaking, most of the traditional flat panel displays use fluorescent tubes as backlights. However, the fluorescent tubes often have the problems of large size and short service life.

In order to improve the service efficiency and lifespan of the light source module, light-emitting diodes with smaller volume and lighter weight are also used as the backlight source of flat-panel displays. The heat dissipation of the module has become an important issue.

Contents of the invention

The invention provides a light source module, which includes a circuit board, a light emitting element and a first heat dissipation plate. The aforementioned circuit board has a through hole, and the aforementioned light emitting element is disposed on the first side of the circuit board, wherein the position of the light emitting element corresponds to the aforementioned through hole. The aforementioned first heat dissipation plate is disposed on the second side of the circuit board and has a first protrusion corresponding to the aforementioned through hole and the light emitting element, wherein the first protrusion extends into the through hole toward the circuit board and contacts the light emitting element. The back side of the first protrusion of the first heat dissipation plate is a depression. For example, the aforementioned first heat dissipation plate can be an aluminum plate with high thermal conductivity, the aforementioned light emitting element can be a light emitting diode, and the aforementioned circuit board can be an epoxy resin substrate (FR-4) printed circuit board.

In one embodiment, the aforementioned light source module further includes a second heat dissipation plate, and the second heat dissipation plate has a second protrusion protruding toward the circuit board and connected to the first heat dissipation plate. In particular, the position of the second protruding portion can deviate from the first protruding portion, so that a gap is formed between the first and second heat dissipation plates, so as to improve their heat dissipation performance.

In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, preferred embodiments are specifically cited below and described in detail with accompanying drawings.

Description of drawings

Fig. 1 is a schematic diagram showing a light source module of the present invention;

Figure 2 is a schematic diagram showing a circuit board; and

Fig. 3 is a schematic diagram showing another embodiment of the present invention.

Explanation of reference signs

10 circuit board 11 first side

12 second side 13 perforation

20 light-emitting elements 30 first cooling plate

31 first protruding part 40 second cooling plate

41 second protrusion 50, 60 cooling plate

Detailed ways

Please refer to FIG. 1 first. The light source module in this embodiment is suitable for electronic devices. 10 is, for example, an FR-4 printed circuit board, the light-emitting element 20 is, for example, a light-emitting diode, and the heat dissipation plate 30 can be made of a material with higher thermal conductivity than the circuit board 10 , for example, an aluminum plate can be used as the heat dissipation plate 30 .

As shown in FIG. 1, the light-emitting element 20 is located on the first side 11 of the circuit board 10 and is electrically connected to the circuit board 10, and the first heat dissipation plate 30 is arranged on the second side 12 of the circuit board 10, wherein the second side 12 Contrary to the first side 11 , the heat energy generated by the light emitting element 20 can be dissipated rapidly downward through the first heat dissipation plate 30 , so as to prevent the circuit board 10 or the light emitting element 20 from being damaged due to overheating. The connection method between the aforementioned circuit board 10 and the first heat dissipation plate 30 can be, for example, screw or mechanical fit, or an adhesive insulating heat conduction pad (not shown) can also be provided between the circuit board 10 and the first heat dissipation plate 30. , so as to make the two firmly bonded.

In this embodiment, the above-mentioned circuit board 10 is provided with a plurality of through holes 13 , the above-mentioned through holes 13 pass through the circuit board 10 and connect the first and second sides 11 , 12 , and the positions of the through holes 13 correspond to each light emitting element 20 respectively. In addition, a plurality of first protruding portions 31 are formed on the aforementioned first heat dissipation plate 30 , the positions of which correspond to each through hole 13 and the light emitting element 20 respectively. In particular, the aforementioned first protruding portion 31 protrudes toward the circuit board 10, and protrudes into the corresponding through hole 13 to be in contact with the light-emitting element 20, so that the heat energy generated by the light-emitting element 20 can directly pass through the first The heat dissipation plate 30 is quickly transferred downward, thereby greatly improving the heat dissipation effect. Wherein, in order to ensure an effective connection between the first protruding portion 31 and the light-emitting element 20, an insulating heat conduction pad (not shown) may also be provided between the light-emitting element 20 and the first protruding portion 31, so that the light-emitting element 20 The generated heat energy can be quickly transferred to the first heat dissipation plate 30 . In particular, the above-mentioned light emitting elements 20 and through holes 13 can be arranged in a matrix, for example (as shown in FIG. 2 ), but the light emitting elements 20 and through holes 13 can also be arranged in other specific ways depending on the required light field design.

In addition, the above-mentioned light source module can also be provided with a plurality of heat dissipation plates to improve its heat dissipation performance. Next, please refer to FIG. 3 . In another embodiment, the light source module further includes a second heat dissipation plate 40 in addition to the first heat dissipation plate 30 . As mentioned above, the first heat dissipation plate 30 is disposed on the second side 12 of the circuit board 10 , wherein the first protrusion 31 on the first heat dissipation plate 30 passes through the through hole 13 of the circuit board 10 and contacts the light emitting element 20 . On the other hand, the aforementioned second heat sink 40 is connected to the lower surface of the first heat sink 30 and has a plurality of second protrusions 41 , wherein the second protrusions 41 protrude toward the circuit board 10 and abut against the first heat sink. The position of the plate 30 deviates from the first protruding portion 31 , so that a gap can be formed between the first and second heat dissipation plates 30 , 40 to increase the heat dissipation area and enhance the heat dissipation efficiency. Similarly, several cooling plates (such as cooling plates 50 and 60 shown in FIG. 3 ) may be added under the first and second cooling plates 30 and 40 to enhance the heat dissipation performance of the light source module.

To sum up, the present invention provides a light source module, wherein the heat dissipation performance of the light source module can be improved by forming a perforation on the circuit board and using the protrusion on the heat dissipation plate to pass through the above-mentioned perforation to contact the light emitting element. Avoid damage to circuit boards or light-emitting components due to high temperatures.

Although the present invention is disclosed above with the foregoing preferred embodiments, it is not intended to limit the present invention. Those skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall prevail as defined by the appended claims.

Claims (10)

1. light source module comprises:

Circuit board has first side, second side and perforation, and wherein this second side is in contrast to this first side, and this perforation runs through this circuit board and connects this first, second side;

Light-emitting component is arranged at this first side and electrically connects this circuit board, and wherein bore a hole corresponding to this in the position of this light-emitting component; And

First heat sink is arranged at this second side and has first protuberance, and corresponding to this perforation and this light-emitting component, wherein this first protuberance stretches in this perforation and contacts with this light-emitting component, is a depression at the dorsal part of this first protuberance of first heat sink.

2. light source module as claimed in claim 1, it is made than the material of this circuit plate hight that wherein this first heat sink adopts thermal conductivity.

3. light source module as claimed in claim 1, wherein this light-emitting component is a light emitting diode.

4. light source module as claimed in claim 1, wherein this circuit board comprises epoxy resin base material printed circuit board (PCB).

5. light source module as claimed in claim 1, wherein this light source module also comprises a plurality of light-emitting components, this circuit board also comprises a plurality of perforation, and this first heat sink also comprises a plurality of first protuberances, the position of these a plurality of light-emitting components corresponds respectively to this a plurality of perforation, and these a plurality of first protuberances stretch into respectively in these a plurality of perforation.

6. light source module as claimed in claim 5, wherein these a plurality of light-emitting components are the matrix-style arrangement with these a plurality of perforation.

7. light source module as claimed in claim 1, wherein this light source module also comprises second heat sink, this second heat sink connects this first heat sink.

8. light source module as claimed in claim 7, wherein this second heat sink has second protuberance, and this second protuberance is towards this circuit board direction protrusion and connect this first heat sink.

9. light source module as claimed in claim 8, wherein this first protuberance of the position deviation of this second protuberance.

10. light source module as claimed in claim 9 wherein has the gap between this first, second heat sink.

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