CN102208375B - Circulation radiator, and manufacturing method and components thereof - Google Patents
Circulation radiator, and manufacturing method and components thereof Download PDFInfo
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- CN102208375B CN102208375B CN2011100897390A CN201110089739A CN102208375B CN 102208375 B CN102208375 B CN 102208375B CN 2011100897390 A CN2011100897390 A CN 2011100897390A CN 201110089739 A CN201110089739 A CN 201110089739A CN 102208375 B CN102208375 B CN 102208375B
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- capillary structure
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- liquid
- vapour
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- 238000004519 manufacturing process Methods 0.000 title claims abstract 3
- 239000007788 liquid Substances 0.000 claims abstract 24
- 238000001704 evaporation Methods 0.000 claims abstract 12
- 230000008020 evaporation Effects 0.000 claims abstract 12
- 239000012530 fluid Substances 0.000 claims abstract 4
- 230000005855 radiation Effects 0.000 claims 9
- 238000001816 cooling Methods 0.000 claims 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- 239000002250 absorbent Substances 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 2
- 239000000428 dust Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910021392 nanocarbon Inorganic materials 0.000 claims 2
- 238000009833 condensation Methods 0.000 claims 1
- 230000005494 condensation Effects 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000003350 kerosene Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract 4
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Abstract
The invention discloses a circulation radiator, and a manufacturing method and components thereof. The components of the circulation radiator comprise a pipeline, a heat dissipation mechanism and a vapor-liquid cavity; the heat dissipation mechanism is contacted with the pipeline, a capillary structure is arranged in the vapor-liquid cavity; the vapor-liquid cavity is divided into a liquid storage cavity and an evaporation cavity by the capillary structure; one end of the pipeline is connected with the evaporation cavity; the other end of the pipeline is connected with the liquid storage cavity or the capillary structure; the evaporation cavity comprises at least one steam channel; and the pipeline and the vapor-liquid cavity provide a low-pressure hermetic sealed channel. Compared with the prior art which employs one evaporation cavity, the invention has the advantages that: the whole capillary structure has stronger supporting force, so that the whole vapor-liquid cavity is difficult to deform and damage under the conditions of high temperature and high pressure; the evaporation cavity consisting of a plurality of the steam channels facilitates the evaporation of liquid in the evaporation cavity, so that vapor can reach a longer distance, heat dissipation of the long distance can be realized, a heat transfer limit based on the single-way circular flow of working fluid is greatly increased; and under the condition of the same heat dissipation and transfer capability, the vapor-liquid cavity provided by the scheme has lesser thickness, so that the volume of the radiator is reduced.
Description
Technical field
The present invention relates to cycle heat radiation device, its manufacture method and assembly thereof.
Background technology
Along with the develop rapidly of electronic technology, transistorized integrated level is increasingly high, and the caloric value of chip all increases more day, and the electronic radiation technology receives publicity gradually.The electronic heating problem has following trend at present, and density of heat flow rate is big, and the narrow compactness of heat-dissipating space requires the span discrete heat, like great power LED, and the heat dissipation problem of CPU, GPU, NOTEBOOK.These all require to develop the heat dissipation problem of the electronics technology of heat conducting element reply efficiently high speed development.The mode of tradition enhance heat is in heat abstractor, to increase heat pipe; Adopt powerful fan forced convection, welding more radiating fin increases heat exchange area, but such way can't realize in the field of compact heat radiation or span discrete heat; Because the adopting heat pipes for heat transfer distance is limited; And conducting heat exists the limit, and the way of many heat pipe parallel connections only can make that heat abstractor becomes huge, and cost increases.The device that efficiently can realize remotely transferring becomes active demand.
Summary of the invention
In order to solve the prior art problem, the cycle heat radiation device assembly that the invention provides a kind of compact conformation and can dispel the heat at a distance.
A kind of cycle heat radiation device assembly; Comprise pipeline, cooling mechanism and vapour-liquid chamber, said cooling mechanism contacts with pipeline, it is characterized in that: said vapour-liquid has capillary structure in the chamber; Said capillary structure is separated into liquid storage cylinder and evaporation cavity with said vapour-liquid chamber; One end of said pipeline connects said evaporation cavity, and the other end connects said liquid storage cylinder or capillary structure, and said evaporation cavity comprises at least one steam conduit; Said pipeline and vapour-liquid chamber provide the low pressure gas seal channel.
Because evaporation cavity is made up of the steam conduit of at least one; Such as 2,3,4 steam conduits or the like; Be provided with capillary structure between alternate steam conduit; Compare an evaporation cavity of prior art, make that the support force of whole capillary structure is stronger, thereby make not yielding and damage under the HTHP of whole vapour-liquid chamber; Simultaneously; Owing to form evaporation cavity by a plurality of steam conduits, when the cycle heat radiation device adopts this kind assembly, be more conducive to the evaporation of liquid at evaporation cavity; And make steam toward the direction operation that has the steam conduit; Form the one-way flow of working fluid, thereby make gas can arrive farther distance, make remote heat radiation become possibility; Improve greatly based on the unidirectional heat transport limitation that circulates of working fluid, and under equal heat radiation transmittability, the thickness in the vapour-liquid chamber of this programme is littler, has reduced the volume of cooling equipment component.
Preferably, said capillary structure respectively with the heat-absorbent surface in said vapour-liquid chamber, and the opposite face of said heat-absorbent surface contact.
Preferably, said steam conduit in said capillary structure, perhaps on the heat-absorbent surface in said vapour-liquid chamber, perhaps a part in said capillary structure another part on the heat-absorbent surface in said vapour-liquid chamber.
Under the situation of the given volume of steam conduit and since the steam conduit some or all on the vapour-liquid cavity wall, the volume in the capillary structure the inside reduces with regard to corresponding, thereby the support force of capillary structure is stronger, the compressive resistance in whole vapour-liquid chamber is bigger; Simultaneously, the steam conduit is owing to the heat-absorbent surface contact of directly following vapor chamber, when the cycle heat radiation device adopts this kind assembly; Be more conducive to the evaporation of liquid at evaporation cavity; Thereby make gas can arrive farther distance, and, under equal heat radiation transmittability; The thickness in the vapour-liquid chamber of this programme is littler, has reduced the volume of cooling equipment component.
Preferably, the part pipeline inwall that connects said liquid storage cylinder or capillary structure has capillary structure.
As remote cooling equipment component, the length of pipeline is longer, is unfavorable for getting back to fast in the vapour-liquid chamber through the liquid of condensation; Pass through such scheme; Through the suction force of capillary structure, improved the speed of liquid return greatly, and then strengthened the heat dispersion of heat abstractor.
Preferably, said capillary structure is by metal dust and/or nano-carbon powder, and sintering or extruding form.
Preferably, the cross section of said steam conduit is square, circle or triangle.
Preferably, be vacuum in the said low pressure gas seal channel.
To achieve these goals, the present invention also provides a kind of cycle heat radiation device, adopts described cycle heat radiation device assembly, in the said low pressure gas seal channel working fluid is arranged.
Preferably, said working fluid comprises water, kerosene, ethanol, methyl alcohol or acetone.
To achieve these goals, the present invention also provides a kind of cycle heat radiation device manufacture method, comprises the steps:
Make the capillary structure step; In the cavity of both ends open, insert the demoulding mould that has a raised line at least; Fill the raised line that said cavity also covers said demoulding mould fully with metal dust and/or nano-carbon powder; Metal dust and/or nano-carbon powder are carried out sintering and extruding, form capillary structure;
Demoulding step is extracted demoulding mould out, thereby capillary structure is separated into liquid storage cylinder with cavity and has the evaporation cavity of a steam conduit at least;
Installation steps; Pipeline one end is connected with liquid storage cylinder or capillary structure, and the other end is connected with evaporation cavity, and cooling mechanism is installed in pipeline surface; And inject working fluid in the liquid storage cylinder and seal through liquid injection port, make pipeline and liquid storage cylinder that the low pressure gas seal channel is provided.
Preferably, also comprise: before making the capillary structure step, said cavity is made into inwall and has fluting; In the said making capillary structure step; The raised line of demoulding mould contacts with said fluting, makes that fluting becomes the part of steam conduit through after the demoulding step.
Preferably, before making the capillary structure step, said cavity is made into inwall and has the fluting that adapts with said raised line; When said making capillary structure step, said raised line is put into said fluting, make that fluting becomes the steam conduit through after the demoulding step.
Description of drawings
Fig. 1 is the broken section vertical view of a kind of specific embodiment of cycle heat radiation device of the present invention;
Fig. 2 is the A-A cutaway view of the embodiment of Fig. 1;
Fig. 3 is the A-A cutaway view of the another kind of specific embodiment of cycle heat radiation device of the present invention;
Fig. 4 is the A-A partial sectional view of the another kind of specific embodiment of cycle heat radiation device of the present invention;
Fig. 5 is the A-A partial sectional view of the another kind of specific embodiment of cycle heat radiation device of the present invention;
Fig. 6 is the B-B cross sectional view of the embodiment of Fig. 1;
Fig. 7 is the B-B cross sectional view of the another kind of specific embodiment of cycle heat radiation device of the present invention;
Fig. 8 is the flow chart of a kind of specific embodiment of cycle heat radiation device manufacture method of the present invention;
Fig. 9 is a kind of specific embodiment of cycle heat radiation device of the present invention and the explosive view of its demoulding mould;
Figure 10 is the stereogram of a kind of specific embodiment of cycle heat radiation device of the present invention.
Embodiment
Below will combine accompanying drawing, specific embodiments of the invention is done further explain.
Shown in Fig. 1-2, a kind of specific embodiment of cycle heat radiation device assembly, it comprises vapour-liquid chamber 100, pipeline 200 and cooling mechanism 300; Wherein, vapour-liquid chamber 100 is separated into liquid storage cylinder 110 and evaporation cavity 130 by capillary structure 120; Pipeline 200 can be divided into three sections: vapour line segment 201, condensation segment 202 and 203 draws of liquidus section; Vapour line segment 201 connects evaporation cavity 130; Liquidus section 203 connects liquid storage cylinder 110, and 202 of condensation segments are between vapour line segment 201 and the liquidus section 203, and cooling mechanism 300 is installed in condensation segment 202 surfaces; Evaporation cavity 130 comprises a plurality of steam conduits 131 that are in strip that stretch into capillary structure 120; Wherein the number of steam conduit can be 2,3,4 or the like; Preferably; As shown in Figure 2, steam conduit 131 is close to the chamber wall in the vapour-liquid chamber 100 that contacts with heating face 400, the i.e. heat-absorbent surface in vapour-liquid chamber 100; Said pipeline 200 provides the low pressure gas seal channel with vapour-liquid chamber 100, is preferably vacuum passage.
Wherein, cooling mechanism can be the composite module of fins set and fan, also can be water-cooling radiating module.
A kind of specific embodiment of cycle heat radiation device adopts the cycle heat radiation device assembly shown in Fig. 1-2, and liquid storage cylinder 110 is equipped with working fluid; For example, water, kerosene, ethanol, methyl alcohol or acetone etc., preferably; The loop structure of whole circulation heat abstractor is under the vacuum condition; Working fluid is evaporation at low temperatures easily, and usually, this low temperature is lower than the temperature of heating face.
When the cycle heat radiation device is worked, heating face 400 heat transferred to vapour-liquid chamber 100, under vacuum; The working fluid low-temperature evaporation that is heated owing to have steam conduit 131 in the capillary structure 120 of porous, forms the temperature difference, the pressure reduction of cavity; Make working fluid steam toward 201 operations of the vapour line segment of pipeline 200, working fluid steam moves to the heat exchange of catching a cold behind the condensation segment 202, and regelation becomes liquid; Because the inertia of fluid, the working fluid of condensation is back to liquid storage cylinder 110 through liquidus section 203.Whole heat transfer heat transfer process is to rely on the unidirectional evaporative condenser of working fluid to realize that need not to add actuating force, simple in structure, heat transfer property is good.
As shown in Figure 3, in the another kind of specific embodiment of cycle heat radiation device, liquidus section 203 can be directly connected in the capillary structure, because its capillary suction force can make the back-flow velocity of working fluid faster, has improved the performance of entire heat dissipation device.Whole section of liquidus section 203 or part inwall are provided with capillary structure, and the capillary structure that fills up for example shown in Figure 4 perhaps as shown in Figure 5ly only is provided with capillary structure on the wall within it, with the suction force that improves liquidus section 203 more.
As shown in Figure 6, in the another kind of specific embodiment of cycle heat radiation device, steam conduit 131 is made up of part that stretches into capillary structure 120 and the part that stretches into vapour-liquid chamber 100 inwalls, and this inwall contacts with heating face 400 at the outer wall in the vapour-liquid chamber 100 at place.In another kind of specific embodiment, steam conduit 131 all stretches in 100 inwalls of vapour-liquid chamber.
As shown in Figure 7, in the another kind of specific embodiment of cycle heat radiation device, steam conduit 131 can also be arranged on the inside of capillary structure, for example in centre or other positions of capillary structure, can contact with the direct inwall of cavity.Except square-section as shown in the figure, in other specific embodiment, steam conduit 131 can also adopt circular cross-section, thereby is more helping the demoulding through the mould molding capillary structure.In addition, steam conduit 131 also can adopt the triangular-section.The cross-sectional sizes of steam conduit 131 also can be incomplete same, and the spacing between the conduit also can be incomplete same.Usually, the quantity of steam conduit 131 is many more, and its radiating effect is good more.
The steam conduit is to comprise in the cavity wall being provided with in any position of capillary structure (on the cross-wise direction of Fig. 6 Fig. 7) in fact.
In above-mentioned specific embodiment, copper can be adopted in vapour-liquid chamber 100, copper alloy, and aluminium, aluminium alloy, nickel, stainless steel etc. has the metal material of high-termal conductivity.
As shown in Figure 8, a kind of embodiment of cycle heat radiation device manufacture method comprises:
Make the capillary structure step; In the cavity of both ends open, insert the demoulding mould that has a raised line at least; Fill the raised line that said cavity also covers said demoulding mould fully with metal dust and/or nano-carbon powder; Metal dust and/or nano-carbon powder are carried out sintering and extruding, form capillary structure;
Demoulding step is extracted demoulding mould out, thereby capillary structure is separated into liquid storage cylinder with cavity and has the evaporation cavity of a steam conduit at least;
Installation steps; Pipeline one end is connected with liquid storage cylinder or capillary structure, and the other end is connected with evaporation cavity, and cooling mechanism is installed in pipeline surface; And inject working fluid in the liquid storage cylinder and seal through liquid injection port, make pipeline and liquid storage cylinder that the low pressure gas seal channel is provided.
In another kind of specific embodiment, before making the capillary structure step, said cavity is made into inwall and has fluting; In the said making capillary structure step; The raised line of demoulding mould contacts with said fluting, makes that fluting becomes the part of steam conduit through after the demoulding step.
In another kind of specific embodiment, before making the capillary structure step, said cavity is made into inwall and has the fluting that adapts with said raised line; When said making capillary structure step, said raised line is put into said fluting, make that fluting becomes the steam conduit through after the demoulding step.
In a kind of more concrete embodiment,, produce the cavity of both ends open at first according to the demand size; Then the raised line 501 with demoulding mould 500 inserts in the cavity, with metal dust or nano-carbon powder raised line zone of living in is filled up, and raised line is covered fully, and make an other side of cavity leave the space, simultaneously, reserves the required space of lower wall surface on the pressing cavity; Carry out then this cavity is carried out sintering; After sintering is accomplished, from cavity, detach demoulding mould, as shown in Figure 9, at this moment, the vapour-liquid chamber 100 that comprises liquid storage cylinder 110 and evaporation cavity 130 has formed; Then the last lower wall surface of reserving is linked together through pressing; And reserve to intert interface at two ends, the two ends of pipeline are respectively welded to two interspersed interfaces, simultaneously; In cavity, reserve and fill liquid injection port and pipeline, be used to fill working fluid and cavity is carried out the vacuum test processing.Fluid injection, vacuum detecting is sealed, shaping is last, with pipeline on weld cooling mechanism, promptly accomplish the making of steam cavity radiating device, shown in figure 10.
The capillary structure of porous can be by copper powder, aluminium powder, and sintering such as nickel powder, nano-carbon powder or extruding form, and also can be to carry out sintering or extruding after above-mentioned one or more powder.
Above content is to combine concrete preferred embodiment to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (8)
1. cycle heat radiation device assembly; Comprise pipeline, cooling mechanism and vapour-liquid chamber, said cooling mechanism contacts with pipeline, it is characterized in that: said vapour-liquid has capillary structure in the chamber; Said capillary structure is separated into liquid storage cylinder and evaporation cavity with said vapour-liquid chamber; One end of said pipeline connects said evaporation cavity, and the other end connects said liquid storage cylinder or capillary structure, and said evaporation cavity comprises at least one steam conduit; Said pipeline and vapour-liquid chamber provide the low pressure gas seal channel;
Said pipeline comprises vapour line segment, condensation segment and liquidus section;
Said steam conduit all stretches on the inwall in said vapour-liquid chamber, perhaps a part in said capillary structure another part on the inwall in said vapour-liquid chamber; Said cooling mechanism is the composite module of fins set and fan, perhaps water-cooling radiating module.
2. cycle heat radiation device assembly as claimed in claim 1 is characterized in that: said capillary structure respectively with the heat-absorbent surface in said vapour-liquid chamber, and the opposite face of said heat-absorbent surface contact.
3. cycle heat radiation device assembly as claimed in claim 1 is characterized in that: the inwall of the part of said liquid storage cylinder of the connection of said pipeline or said capillary structure has capillary structure.
4. cycle heat radiation device assembly as claimed in claim 3 is characterized in that: the cross section of said steam conduit is rectangle, circle or triangle.
5. like the arbitrary described cycle heat radiation device assembly of claim 1-4, it is characterized in that: be vacuum in the said low pressure gas seal channel.
6. a cycle heat radiation device is characterized in that: adopt like the arbitrary described cycle heat radiation device assembly of claim 1 to 4, in the said low pressure gas seal channel working fluid is arranged.
7. cycle heat radiation device as claimed in claim 6 is characterized in that: said working fluid comprises water, kerosene, ethanol, methyl alcohol or acetone.
8. a cycle heat radiation device manufacture method is characterized in that, comprises the steps:
Make the capillary structure step; In the cavity of both ends open, insert the demoulding mould that has a raised line at least; Fill the raised line that said cavity also covers said demoulding mould fully with metal dust and/or nano-carbon powder; Metal dust and/or nano-carbon powder are carried out sintering and extruding, form capillary structure;
Demoulding step is extracted demoulding mould out, thereby capillary structure is separated into liquid storage cylinder with cavity and has the evaporation cavity of a steam conduit at least;
Installation steps; Pipeline one end is connected with liquid storage cylinder or capillary structure, and the other end is connected with evaporation cavity, and cooling mechanism is installed in pipeline surface; And inject working fluid in the liquid storage cylinder and seal through liquid injection port, make pipeline and liquid storage cylinder that the low pressure gas seal channel is provided;
Before making the capillary structure step, said cavity is made into inwall and has fluting, and in the said making capillary structure step, the raised line of demoulding mould contacts with said fluting, makes that fluting becomes the part of steam conduit through after the demoulding step;
Perhaps before making the capillary structure step, said cavity is made into inwall and has the fluting that adapts with said raised line; When said making capillary structure step, said raised line is put into said fluting, make that fluting becomes the steam conduit through after the demoulding step;
Said cooling mechanism is the composite module of fins set and fan, perhaps water-cooling radiating module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100897390A CN102208375B (en) | 2011-04-11 | 2011-04-11 | Circulation radiator, and manufacturing method and components thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100897390A CN102208375B (en) | 2011-04-11 | 2011-04-11 | Circulation radiator, and manufacturing method and components thereof |
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| CN102208375A CN102208375A (en) | 2011-10-05 |
| CN102208375B true CN102208375B (en) | 2012-11-21 |
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| CN2011100897390A Active CN102208375B (en) | 2011-04-11 | 2011-04-11 | Circulation radiator, and manufacturing method and components thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107145205A (en) * | 2017-04-19 | 2017-09-08 | 北京空间飞行器总体设计部 | Laptop radiating system based on flat board loop circuit heat pipe |
| CN108278916B (en) * | 2018-01-12 | 2020-04-10 | 中国科学院长春光学精密机械与物理研究所 | Plate type loop heat pipe evaporator |
| CN111615290B (en) * | 2019-02-25 | 2022-07-26 | 龙大昌精密工业有限公司 | Cooling structure of condenser |
| CN111354693A (en) * | 2020-03-12 | 2020-06-30 | 苏州永腾电子制品有限公司 | Thin plate-shaped structure heat dissipation module |
| CN112484554B (en) * | 2020-11-27 | 2022-09-09 | 中车大连机车研究所有限公司 | Rail transit vehicle traveling wind phase change heat exchange system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101311662A (en) * | 2007-05-23 | 2008-11-26 | 财团法人工业技术研究院 | Flat plate type evaporator heat dissipation system |
| CN101453859A (en) * | 2007-11-29 | 2009-06-10 | 中山伟强科技有限公司 | Loop type heat pipe heat dissipation device and manufacturing method thereof |
| CN201306960Y (en) * | 2008-10-21 | 2009-09-09 | 中山伟强科技有限公司 | High-power loop type heat pipe heat dissipation device |
| CN101598512A (en) * | 2008-06-03 | 2009-12-09 | 超众科技股份有限公司 | Heat pipe with double capillary structure and manufacturing method thereof |
| CN202103040U (en) * | 2011-04-11 | 2012-01-04 | 锘威科技(深圳)有限公司 | Circulation heat radiation device and assembly thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1832156A (en) * | 2005-03-09 | 2006-09-13 | 台达电子工业股份有限公司 | Structure of heat sink and manufacturing method thereof |
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2011
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101311662A (en) * | 2007-05-23 | 2008-11-26 | 财团法人工业技术研究院 | Flat plate type evaporator heat dissipation system |
| CN101453859A (en) * | 2007-11-29 | 2009-06-10 | 中山伟强科技有限公司 | Loop type heat pipe heat dissipation device and manufacturing method thereof |
| CN101598512A (en) * | 2008-06-03 | 2009-12-09 | 超众科技股份有限公司 | Heat pipe with double capillary structure and manufacturing method thereof |
| CN201306960Y (en) * | 2008-10-21 | 2009-09-09 | 中山伟强科技有限公司 | High-power loop type heat pipe heat dissipation device |
| CN202103040U (en) * | 2011-04-11 | 2012-01-04 | 锘威科技(深圳)有限公司 | Circulation heat radiation device and assembly thereof |
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